Compaq dc5850 - Microtower PC, 5850 - Deskjet Color Inkjet Printer, dc5850 MiniTower, dc5850 Small Form Factor Technical Reference Manual

Technical Reference Guide

HP Compaq dc5850 Series
Business Desktop Computers

Document Part Number: 512751-001

October 2008

This document provides information on the design, architecture, function,
and capabilities of the HP Compaq dc5850 Series Business Desktop
Computers. This information may be used by engineers, technicians,
administrators, or anyone needing detailed information on the products
covered.

© Copyright 2008 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice.

Microsoft, MS-DOS, Windows, and Windows NT are trademarks of Microsoft Corporation in the U.S. and other
countries.

AMD, AMD Sempron, AMD Athlon, AMD Phenom, are trademarks of AMD Corporation in the U.S. and other
countries.

Adobe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated.

The only warranties for HP products and services are set forth in the express warranty statements accompanying
such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.

This document contains proprietary information that is protected by copyright. No part of this document may be
photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard
Company.

Technical Reference Guide

HP Compaq dc5850 Series Business Desktop Computers

First Edition (October 2008)
Document Part Number: 512751-001

Contents

1Introduction

1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.2 Additional Information Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.3 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

1.4 Notational Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

1.5.1 Special Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

1.5.2 Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

1.5.2 Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

1.5 Common Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

2 System Overview

2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1

2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2

2.3 System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4

2.3.1 AMD Processor Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6

2.3.2 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6

2.3.3 Support Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7

2.3.4 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7

2.3.5 Mass Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

2.3.6 Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

2.3.7 Universal Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

2.3.8 Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

2.3.9 Integrated Graphics Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9

2.3.10 Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9

2.4 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10

3 Processor/Memory Subsystem

3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1

3.2 AMD Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2

3.2.1 AMD Processor Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2

3.2.2 Processor Changing/Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2

3.3 Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3

3.3.1 Memory Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4

3.3.2 Memory Mapping and Pre-allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4

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Contents

4 System Support

4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2 PCI Bus Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2.1 PCI 2.3 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2.2 PCI Express Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2

4.2.3 Option ROM Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3

4.2.4 PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3

4.2.5 PCI Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3

4.2.6 PCI Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4

4.3 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6

4.3.1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6

4.3.2 Direct Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7

4.4 Real-Time Clock and Configuration Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8

4.4.1 Clearing CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8

4.4.2 Standard CMOS Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9

4.5 System Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9

4.5.1 Security Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9

4.5.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–11

4.5.3 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12

4.5.4 Thermal Sensing and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12

4.6 Register Map and Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13

4.6.1 System I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14

4.6.2 GPIO Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15

5 Input/Output Interfaces

5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

5.2 SATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2

5.2.1 SATA Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2

5.2.2 AHCI/RAID Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2

5.3 Diskette Drive Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3

5.4 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6

5.5 Parallel Interface Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.1 Standard Parallel Port Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.2 Enhanced Parallel Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.3 Extended Capabilities Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.4 Parallel Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8

5.6 Keyboard/Pointing Device Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9

5.6.1 Keyboard Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9

5.6.2 Pointing Device Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10

5.6.3 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10

5.7 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11

5.7.1 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11

5.7.2 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12

5.8 Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13

5.8.1 HD Audio Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14

5.8.2 HD Audio Link Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14

5.8.3 Audio Multistreaming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14

5.8.4 Audio Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15

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5.9 Network Interface Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16

5.9.1 Wake-On-LAN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.9.2 Alert Standard Format Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.9.3 Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.9.4 NIC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18

5.9.5 NIC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18

6 Integrated Graphics Subsystem

6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1

6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2

6.3 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–3

6.4 Monitor Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4

6.5.1 Analog Monitor Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4

6.5.2 DVI-D Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5

7 Power and Signal Distribution

7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1

7.2 Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1

7.2.1 SFF Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2

7.2.2 MT Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–3

7.2.3 Optional Energy Star Compliant PSUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4

7.3 Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4

7.3.1 Power Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4

7.3.2 Wake Up Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–5

7.3.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–7

7.4 Signal Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–8

Contents

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Contents

8SYSTEM BIOS

8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1

8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.2.2 Changeable Splash Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.3 Boot Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.1 Boot Device Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.2 Network Boot (F12) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.3 Memory Detection and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.4 Boot Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4

8.4 Client Management Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5

8.4.1 System ID and ROM Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6

8.4.2 Temperature Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6

8.5 SMBIOS support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7

8.6 USB Legacy Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8

8.7 Management Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8

A Error Messages and Codes

Index

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1.1 A b o u t t h i s G u i d e

This guide provides technical information about HP Compaq dc5850 Business PC personal
computers that feature AMD processors and the AMD 780V chipset. This document describes in
detail the system's design and operation for programmers, engineers, technicians, and system
administrators, as well as end-users wanting detailed information.

The chapters of this guide primarily describe the hardware and firmware elements and primarily
deal with the system board and the power supply assembly. The appendices contain general data
such as error codes and information about standard peripheral devices such as keyboards,
graphics cards, and communications adapters.

This guide can be used either as an online document or in hardcopy form.

1.1.1 O n l in e V i e w i n g

Online viewing allows for quick navigating and convenient searching through the document. A
color monitor will also allow the user to view the color shading used to highlight differential
data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format
at the following URL:

www.hp.com

1

Introduction

Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe
Systems, Inc. at the following URL:

www.adobe.com

1.1. 2 H a r d co p y

A hardcopy of this guide may be obtained by printing from the .pdf file. The document is
designed for printing in an 8 ½ x 11-inch format.

1.2 Additional Information Sources

For more information on components mentioned in this guide refer to the indicated
manufacturers' documentation, which may be available at the following online sources:

■ HP Corporation: www.hp.com

■

AMD Corporation: www.amd.com

■

Serial ATA International Organization (SATA-IO): www.serialATA.org.

■

USB user group: www.usb.org

Technical Reference Guide www.hp.com 1-1

Introduction

1. 3 S e r i al N um b e r

The serial number is located on a sticker placed on the exterior cabinet. The serial number is also
written into firmware and may be read with HP Diagnostics or Insight Manager utilities.

1.4 Notational Conventions

The notational guidelines used in this guide are described in the following subsections.

1.4.1 Special Notices

The usage of warnings, cautions, and notes is described as follows:

WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily
harm or loss of life.

!

CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to
equipment or loss of information.

Text set off in this manner provides information that may be helpful.

✎

1.4.2 Values

Differences between bytes and bits are indicated as follows:

MB = megabytes

Mb = megabits

1.4.3 Ranges

Ranges or limits for a parameter are shown using the following methods:

Example A: Bits <7..4> = bits 7, 6, 5, and 4.

Example B: IRQ3-7, 9 = IRQ signals 3 through 7, and IRQ signal 9

1-2 www.hp.com Technical Reference Guide

1.5 Common Acronyms and Abbreviations

Table 1-1 lists the acronyms and abbreviations used in this guide.

Table 1-1

Acronyms and Abbreviations

Acronym or
Abbreviation Description

Aampere

AC alternating current

ACPI Advanced Configuration and Power Interface

A/D analog-to-digital

ADC Analog-to-digital converter

ADD or ADD2 Advanced digital display (card)

AGP Accelerated graphics port

AHCI Advanced Host Controller Interface (SATA)

AMT Active Management Technology

Introduction

API application programming interface

APIC Advanced Programmable Interrupt Controller

APM advanced power management

AOL Alert- On-LAN™

ASIC application-specific integrated circuit

ASF Alert Standard Format

AT 1. attention (modem commands) 2. 286-based PC architecture

ATA AT attachment (IDE protocol)

ATAPI ATA w/packet interface extensions

AVI audio-video in terle ave d

AVGA Advanc ed VGA

AWG American Wire Gauge (specification)

BAT Basic assurance test

BCD binary-coded decimal

BIOS basic input/output system

bis second/new revision

BNC Bayonet Neill-Concelman (connector type)

bps or b/s bits per second

BSP Bootstrap processor

BTO Built to order

CAS column address strobe

CD compact disk

CD-ROM compact disk read-only memory

Technical Reference Guide www.hp.com 1-3

Introduction

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or
Abbreviation Description

CDS compact disk system

CGA color graphics adapter

Ch Channel, chapter

cm centimeter

CMC cache/memory controller

CMOS complimentary metal-oxide semiconductor (configuration memory)

Cntlr controller

Cntrl control

codec 1. coder/decoder 2. compressor/decompressor

CPQ Compaq

CPU central processing unit

CRIMM Continuity (blank) RIMM

CRT cathode ray tube

CSM 1. Compaq system management 2. Compaq server management

DAC digital-to-analog converter

DC direct current

DCH DOS compatibility hole

DDC Display Data Channel

DDR Double data rate (memory)

DIMM dual inline memory module

DIN Deutche IndustriNorm (connector type)

DIP dual inline package

DMA direct memory access

DMI Desktop management interface

dpi dots per inch

DRAM dynamic random access memory

DRQ data request

DVI Digital video interface

dword Double word (32 bits)

EDID extended display identification data

EDO extended data out (RAM type)

EEPROM electrically erasable PROM

EGA enhanced graphics adapter

EIA Electronic Industry Association

1-4 www.hp.com Technical Reference Guide

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or
Abbreviation Description

EISA extended ISA

EPP enhanced parallel port

EIDE enhanced IDE

ESCD Extended System Configuration Data (format)

EV Environmental Variable (data)

ExCA Exchangeable Card Architecture

FIFO first in/first out

FL flag (register)

FM frequency modulation

FPM fast page mode (RAM type)

FPU Floating point unit (numeric or math coprocessor)

FPS Frames per second

ft Foot/feet

Introduction

GB gigabyte

GND ground

GPIO general purpose I/O

GPOC general purpose open-collector

GART Graphics address re-mapping table

GUI graphic user interface

hhexadecimal

HDD hard disk drive

HW hardware

hex hexadecimal

Hz Hertz (cycles-per-second)

IDE integrated drive element

IEEE Institute of Electrical and Electronic Engineers

IF interrupt flag

I/F interface

IGC integrated graphics controller

in inch

INT interrupt

I/O input/output

IPL initial program loader

IrDA Infrared Data Association

IRQ interrupt request

Technical Reference Guide www.hp.com 1-5

Introduction

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or
Abbreviation Description

ISA industry standard architecture

Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes)

Kb/s kilobits per second

kg kilogram

KHz kilohertz

kV kilovolt

lb pound

LAN local area network

LCD liquid crystal display

LED light-emitting diode

LPC Low pin count

LSI large scale integration

LSb/LSB least significant bit/least significant byte

LUN logical unit (SCSI)

m Meter

MCH Memory controller hub

MMX multimedia extensions

MPEG Motion Picture Experts Group

ms millisecond

MSb/MSB most significant bit/most significant byte

mux multiplex

MVA motion video acceleration

MVW motion video window

n variable parameter/value

NIC network interface card/controller

NiMH nickel-metal hydride

NMI non-maskable interrupt

NRZI Non-return-to-zero inverted

ns nanosecond

NT nested task flag

NTSC National Television Standards Committee

NVRAM non-volatile random access memory

ODD optical disk drive

OS operating system

1-6 www.hp.com Technical Reference Guide

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or
Abbreviation Description

PAL 1. programmable array logic 2. phase alternating line

PATA Parallel ATA

PC Personal computer

PCA Printed circuit assembly

PCI peripheral component interconnect

PCI-E PCI Express

PCM pulse code modulation

PCMCIA Personal Computer Memory Card International Association

PEG PCI express graphics

PFC Power factor correction

PIN personal identification number

PIO Programmed I/O

PN Part number

Introduction

POST power-on self test

PROM programmable read-only memory

PTR pointer

PWM pulse width modulation

RAID Redundant array of inexpensive disks (drives)

RAM random access memory

RAS row address strobe

RBSU ROM-Based Setup Utility

rcvr receiver

RDRAM (Direct) Rambus DRAM

RGB red/green/blue (monitor input)

RH Relative humidity

RMS root mean square

ROM read-only memory

RPM revolutions per minute

RTC real time clock

R/W Read/Write

SATA Serial ATA

SCSI small computer system interface

SDR Singles data rate (memory)

SDRAM Synchronous Dynamic RAM

Technical Reference Guide www.hp.com 1-7

Introduction

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or
Abbreviation Description

SDVO Serial digital video output

SEC Single Edge-Connector

SECAM sequential colour avec memoire (sequential color with memory)

SF sign flag

SGRAM Synchronous Graphics RAM

SIMD Single instruction multiple data

SIMM single in-line memory module

SMART Self Monitor Analysis Report Technology

SMI system management interrupt

SMM system management mode

SMRAM system management RAM

SPD serial presence detect

SPDIF Sony/Philips Digital Interface (IEC-958 specification)

SPN Spare part number

SPP standard parallel port

SRAM static RAM

SSD solid state disk (drive)

SSE Streaming SIMD extensions

STN super twist pneumatic

SVGA super VGA

SW software

TAD telephone answering device

TAFI Temperature-sensing And Fan control Integrated circuit

TCP tape carrier package, transmission control protocol

TF trap flag

TFT thin-film transistor

TIA Telecommunications Information Administration

TPE twisted pair ethernet

TPI track per inch

TTL transistor-transistor logic

TV television

TX transmit

UART universal asynchronous receiver/transmitter

UDMA Ultra DMA

1-8 www.hp.com Technical Reference Guide

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or
Abbreviation Description

URL Uniform resource locator
us/µs microsecond

USB Universal Serial Bus

UTP unshielded twisted pair

Vvolt

VAC Volts alternating current

VDC Volts direct current

VESA Video Electronic Standards Association

VGA video graphics adapter

VLSI very large scale integration

VRAM Video RAM

Wwatt

WOL Wake -On-LAN

Introduction

WRAM Windows RAM

ZF zero flag

ZIF zero insertion force (socket)

Technical Reference Guide www.hp.com 1-9

Introduction

1-10 www.hp.com Technical Reference Guide

2.1 Introduction

The HP Compaq dc5850 Business PC personal computers (Figure 2-1) deliver an outstanding
combination of manageability, serviceability, and compatibility for enterprise environments.
Based on an AMD processor with the AMD 780V chipset, these systems emphasize performance
along with industry compatibility. These models feature a similar architecture incorporating both
PCI 2.3 and PCIe 1.1 buses. All models are easily upgradeable and expandable to keep pace with
the needs of the office enterprise.

2

System Overview

Figure 2-1. HP Compaq dc5850 Business PCs

This chapter includes the following topics:

■ Features (2.2)

■ System architecture (2.3)

■ Specifications (2.4)

Technical Reference Guide www.hp.com 2-1

HP dc5850 Small Form Factor

HP dc5850 MiniTower

System Overview

2.2 Features

The following standard features are included on all models unless otherwise indicated:

■ Supports one of the following AMD processors installed in an AM2+ socket:

❏ AMD Phenom™ Quad-Core with HyperTransport Technology

❏ AMD Phenom Triple-Core with HyperTransport Technology

❏ AMD Athlon™ Dual-Core with HyperTransport Technology

❏ AMD Athlon Single-Core with HyperTransport Technology

❏ AMD Sempron™ with HyperTransport Technology

■ AMD 780V chipset

■ ATI Radeon 3100 integrated graphics processor with dual monitor support:

❏ One VGA connector

❏ One DVI-D connector

■ 667-, 800-, or 1066-MHz (DDR2) DIMM support

■ Eight externally-accessible USB 2.0-compliant ports

■ High definition (HD) audio processor with one headphone output, one microphone input,

one line output, and one line input

■ Network interface controller providing 10/100/1000Base T support

■ Plug 'n Play compatible (with ESCD support)

■ Intelligent Manageability support

■ Management/security features including:

❏ Flash ROM Boot Block

❏ Diskette drive disable, boot disable, write protect

❏ Power-on and Administrator passwords

❏ Serial and USB port disable

❏ HP Virtual Safe Browser

■ PS/2 enhanced keyboard and optical scroll mouse

2-2 www.hp.com Technical Reference Guide

System Overview

Table 2-1 shows the differences in features between the different PC series based on form factor:

Table 2-1

Feature Difference Matrix by Form Factor

SFF MT

Drive bays:

Externally accessible 3.5-inch bay
Externally accessible 5.25-inch bay
Internal 3.5-inch bay

Drive types supported:

HDD
ODD

PCIe slots:

x16 graphics (PCIe 2.0)
x1 connector

PCI 2.3 32-bit 5-V slots 1 low-profile [1] 1 full-height

1
1
1

2
1

1 low-profile [1]
2 low-profile [1]

1
2
2

4
1

1 full-height
2 full-hieght

Power Supply Unit (standard) 240-watt

active PFC [2]

NOTES:

[1] Low-profile card dimensions: height = 2.5 in., length = 6.6 in.
[2] Energy-Star 80-Plus Bronze-level compliant active-PFC unit of same wattage available as an

option.

300-watt

passive PFC [2]

Technical Reference Guide www.hp.com 2-3

System Overview

2.3 System Architecture

The systems covered in this guide feature an architecture based on an AMD processor and
chipset (Figure 2-2). All systems covered in this guide include the following key components:

■ AMD Phenom, Athlon, or Sempron processor.

■ AMD 780V chipset (includes RS780 north bridge and SB700 south bridge)

■ SCH5327 Super I/O (SIO) controller supporting PS/2 keyboard and mouse peripherals

■ AD1884A audio controller supporting line in, line out, microphone in, and headphones out

■ Broadcom BMC5754 GbE network interface controller

The AMD 780V chipset, consisting of the RS780C north bridge and the SB700 south bridge, is
designed to complement the latest AMD processors. The RS780 north bridge communicates with
the processor through a Hypertransport bus and with the SB700 south bridge component. The
integrated graphics controller of the RS780 north bridge can be upgraded through a PCI Express
(PCIe) x16 graphics slot. All systems include a serial ATA (SATA) hard drive in the standard
configuration.

2-4 www.hp.com Technical Reference Guide

System Overview

Analog Mon.

Digital Mon.

PCI Express

x16 slot (PEG)

SATA

Hard Drive

Additional

SATA

Devices

VGA

DVI-D

SATA 0

SATA 1-3

AD1884A

Audio

Subsystem

HyperTransport bus

ATI

Radeon

3100

IGP

SATA
I/F (4)

Audio I/F

AMD

Processor

RS780C

North

Bridge

SB700

South

Bridge

USB

I/F

Ch A DDR2

SDRAM

Ch B DDR2

SDRAM

BMC5754

NIC

PCIe x1 slots (2)

USB 2.0
Ports (10) [1]

Serial I/F [2]

SIO Controller

Kybd-Mouse I/F

Parallel I/F [3]

Diskette I/F

Notes:

[1] 2 front ports, 6 rear ports, 2 internal ports
[2] 2nd serial port requires optional bracket/cable assembly
[3] Parallel port functionality requires optional bracket/cable assembly

Figure 2-2. HP Compaq dc5850 Business PC Architecture, Block diagram

Technical Reference Guide www.hp.com 2-5

BIOS
ROM

Power Supply

PCI 2.3 slot

Keyboard

Diskette

Mouse

System Overview

2.3.1 AMD Processor Support

The models covered in this guide are designed to support the following processor types:

■ AMD Phenom X4 Quad-Core with HyperTransport Technology

■ AMD Phenom X3 Triple-Core with HyperTransport Technology

■ AMD Athlon X2 Dual-Core with HyperTransport Technology

■ AMD Athlon 64 Single-Core with HyperTransport Technology

■ AMD Sempron with HyperTransport Technology

All processors include an integrated DDR2 memory controller and support up to eight gigabytes
of memory. AMD processors are backward-compatible with software written for earlier x86
microprocessors. The processor mounts in a zero-insertion-force (ZIF) AMD AM2+ socket.

CAUTION: These systems can support a processor rated up to 95 watts. Exceeding this limit can result
in system damage and loss of data.

Installation of the processor heatsink is critical in these systems. Refer to the applicable Service

✎

Reference Guide for detailed removal and replacement procedures of the heatsink/fan assembly
and the processor

2.3.2 Chipset

The AMD 780V chipset consists of a RS780C north bridge and an SB700 south bridge. Table 2-2
compares the functions provided by the chipsets.

Components Function

RS780C Integrated ATI Radeon 3100 graphics controller

SB700 PCI 2.3 bus I/F

Table 2-2

Chipset Components and Functionality

PCIe 2.0 x16 graphics interface
HyperTransport bus operating at 800-, 1066-, or 1333-MHz
PCI Express x1

SMBus I/F
SATA I/F
HD audio interface
RTC/CMOS
IRQ controller
Power management logic
USB 1.1/2.0 controllers supporting 12 ports

(these systems provide 8 external, 2 internal)

2-6 www.hp.com Technical Reference Guide

2.3.3 Support Components

Input/output functions not provided by the chipset are handled by other support components.
Some of these components also provide “housekeeping” and various other functions as well.
Table 2-3 shows the functions provided by the support components.

Support Component Functions

Component Name Function

SCH5327 SIO Controller Keyboard and pointing device I/F

Diskette I/F
Serial I/F (COM1and COM2) [1]
Parallel I/F (LPT1, LPT2, or LPT3) [2]
PCI reset generation
Interrupt (IRQ) serializer
Power button and front panel LED logic
GPIO ports
Processor over temperature monitoring
Fan control and monitoring
Power supply voltage monitoring
SMBus and Low Pin Count (LPC) bus I/F

System Overview

Table 2-3

Broadcom BMC5754
Network Interface Controller

AD1884A HD Audio Codec Audio mixer

NOTE:

[1] COM2 requires optional bracket/cable assembly.
[2] LPTn support requires optional bracket/cable assembly.

2.3.4 System Memory

These systems implement a dual-channel non-ECC Double Data Rate (DDR2) memory
architecture. All models support DDR2 800- and 667-MHz DIMMs, and are shipped with DDR2
800-MHz (PC2-6400) DIMMs. These systems provide four DIMM sockets and support a total of
8 gigabytes of memory.

DDR and DDR2 DIMMs are NOT interchangeable.

✎

10/100/1000 Fast Ethernet network interface controller.

Two digital-to-analog stereo converters
Two analog-to-digital stereo converters
Analog I/O
Supports stereo (two-channel) audio streams

Technical Reference Guide www.hp.com 2-7

System Overview

2.3.5 Mass Storage

These systems provide four SATA interfaces for mass storage devices. The SFF supports up to
two removeable media devices and one internal hard drive. The MT supports up to three
removeable media devices and two hard drives, and is available in factory-preconfigured RAID
configurations.

Supported SATA hard drives:

■ SMART IV, 3.0 Gb/s, 7200 RPM drive sizes (GB): 80, 160, 250, 500

■ SMART III, 3.0 Gb/s, 10000 RPM drive sizes (GB): 80, 160

Supported SATA removeable media drives:

■ DVD-ROM drive

■ SuperMulti LightScribe DVD Writer Drive (requires special label-etchable media)

2.3.6 Serial Interface

These systems include a serial port accessible at the rear of the chassis and support a second
serial port option. The serial interface is RS-232-C/16550-compatible and supports standard
baud rates up to 115,200 as well as two high-speed baud rates of 230K and 460K.

2.3.7 Universal Serial Bus Interface

All models provide ten Universal Serial Bus (USB) ports. Two ports are accessible at the front of
the unit, six ports are accessible on the rear panel, and two ports are accessible through a header
on the system board. These systems support a media card reader module that connects to the
internal header. These systems support USB 1.1 and 2.0 functionality on all ports.

BIOS Setup allows for the disabling of USB ports individually or in groups. In order to secure
the system against a physical attack, ports may be disabled even if there is nothing physically
connected to them, such as the two front ports for the media card reader module when the
module is not present.

2.3.8 Network Interface Controller

All models feature a Broadcom gigabit Network Interface Controller (NIC) integrated on the
system board. The controller provides automatic selection of 10BASE-T, 100BASE-TX, or
1000BASE-T operation with a local area network and includes power-down, wake-up,
Alert-On-LAN (AOL), Alert Standard Format (ASF), and AMT features. An RJ-45 connector
with status LEDs is provided on the rear panel.

2-8 www.hp.com Technical Reference Guide

2.3.9 Integrated Graphics Processor

These systems use the AMD RS780 component, which uses an ATI Radeon 3100 integrated
graphics processor featuring DirectX 10 technology that can drive an analog VGA monitor and a
DVI-D monitor. Table 2-4 lists the key features of the integrated graphics processor.

Table 2-4

Integrated Graphics Subsystem Statistics

Integrated Graphics Controller

Recommended for Hi 2D, Entry 3D

Bus Type Int. PCI Express

Memory Amount 128 or 256 MB pre-allocated

Memory Type DVMT 3.0

DAC Speed 300 MHz

Maximum 2D Resolution 2048x1536 @ 85 Hz

System Overview

Hardware function DirectX 10,

Outputs 1 VGA, 1 DVI-D [see text]

These systems also include a PCIe x16 graphics slot to ensure full graphics upgrade capabilities.

2.3.10 Audio Subsystem

These systems use the integrated High Definition audio controller of the chipset and the ADI
AD1884A High Definition audio codec. HD audio provides enhanced audio performance with
higher sampling rates, refined signal interfaces, and audio processors with increased
signal-to-noise ratio. The audio line input jack can be re-configured as a microphone input, and
multi-streaming is supported. These systems include a 1.5-watt output amplifier driving an
internal speaker, which can be muted with the F10 BIOS control. All models include front
panel-accessible stereo microphone input and headphone output audio jacks.

Shader Model 4.0 geometry and pixel support
Anti-Alias filtering
Anisotropic filtering
Advanced texture compression
64b and 128b texture/surface support
Multi-level texture cache

Technical Reference Guide www.hp.com 2-9

System Overview

2.4 Specifications

This section includes the environmental, electrical, and physical specifications for the systems
covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications
are subject to change without notice.

Environmental Specifications (Factory Configuration)

Parameter Operating Non-operating

Table 2-5

Ambient Air Temperature 50

o

to 95o F (10o to 35o C, max.

rate of change <

10°C/Hr)

o

-22

to 140o F (-30o to 60o C, max.
rate of change <

Shock (w/o damage) 5 Gs [1] 20 Gs [1]

Vibration 0.000215 G

Humidity 10-90% Rh @ 28

wet bulb temperature

2

/Hz, 10-300 Hz 0.0005 G2/Hz, 10-500 Hz

o

C max.

5-95% Rh @ 38.7o C max.

wet bulb temperature

Maximum Altitude 10,000 ft (3048 m) [2] 30,000 ft (9144 m) [2]

NOTE:

[1] Peak input acceleration during an 11 ms half-sine shock pulse.
[2] Maximum rate of change: 1500 ft/min.

Table 2-6

Power Supply Electrical Specifications

Parameter Value

Input Line Voltage:
Nominal:
Maximum

100–240 VAC

90–264 VAC

20°C/Hr)

Input Line Frequency Range:
Nominal
Maximum

Energy Star 4.0 with 80Plus Bronze-level compliancy

SFF
MT

Maximum Continuous Power:

SFF
MT

NOTE:
Optional Energy Star 4.0 with 80-Plus Bronze-level compliant power supply unit available for both form factors.

2-10 www.hp.com Technical Reference Guide

50–60 Hz
47–63 Hz

Optional
Optional

240 watts

300 watts

Table 2-7

Physical Specifications

Parameter SFF [2] MT [3]

System Overview

Height 3.95 in

(10.03 c m)

Width 13.3 in

(33.78 cm)

Depth 14.9 in

(37.85 cm)

Weight [1] 17.86 lb

(8.10 kg)

Load-bearing ability of
chassis [3]

NOTES:

[1] System configured with 1 hard drive, 1 diskette drive, and no PCI cards.
[2] Desktop (horizontal) configuration.
[3] Applicable to unit in desktop orientation only and assumes reasonable type of load such as a monitor.

77.1 lb
(35 kg)

14 . 8 5 i n

(37.72 cm)

6.95 in

(17.65 c m)

16. 85 i n

(42.80 cm)

23.44 lb

(10. 6 3 kg )

77.1 lb

(35 kg)

Technical Reference Guide www.hp.com 2-11

System Overview

2-12 www.hp.com Technical Reference Guide

3.1 Introduction

This chapter describes the processor/memory subsystem. This systems support the AMD
Phenom, Athlon, and Sempron processor families. As shown in Figure 3-1, these processors use
an integrated DDR2 memory controller and communicate with the chipset through the
HyperTranport interface (I/F).

3

Processor/Memory Subsystem

AMD Processor

Core(s)

L2 Cache

HyperTransport I/F

North Bridge

Figure 3-1. Processor/Memory Subsystem Architecture

DDR2

Controller

Channel A

Channel B

This chapter includes the following topics:

■ AMD processors (3.2)

XMM1

DIMM

DIMM

XMM2

XMM3

DIMM

DIMM

XMM4

■ Memory subsystem (3.3)

Technical Reference Guide www.hp.com 3-1

Processor/Memory Subsystem

3.2 AMD Processors

These systems feature an AMD processor mounted with a heat sink in an AM2+ socket. The
mounting socket allows the processor to be easily changed for upgrading.

3.2.1 AMD Processor Overview

The systems covered in this guide support AMD Phenom, Athlon, and Sempron processors.

Key features of these AMD processors include:

■ Single-, dual-, triple-, or quad-core architecture

■ Dedicated L2 cache for each core

■ Integrated DDR2 memory controller

■ Direct-connect archtitecture for improved performance between the CPU, memory, and I/O

■ HyperTransport™ technology providing up to 4 GB/s (each direction) in mode 1.0 and up to

7.2 GB/s in mode 3.0

Table 3-1 provides a sample listing of processors supported by these systems.

Supported Processors (partial listing)

AMD
Processor

Phenom X4 quad 2.30 GHz 3.0 512 KB x4 2048 KB Std. set + SSE4a,

Phenom X3 triple 2.40 GHz 3.0 512 KB x3 2048 KB Std. set + SSE4a,

Athlon 64 X2 dual 2.80 GHz 2.0 1024 KB x2 n/a Std. set + AMD-V
Athlon 64 X2 dual 2.70 GHz 2.0 1024 KB x2 n/a Std. set + AMD-V
Athlon 64 single 2.40 GHz 2.0 1024 KB n/a Std. set
Sempron single 2.30 GHz 1.0 512 KB n/a Std. set

Core

design

Core

Speed

HT bus

Table 3-1

mode

L2

Cache

L3

Cache

Instruction set

support (see note)

Enhanced 3DNow!

Enhanced 3DNow!

NOTE: Standard (std.) instruction set support includes AMD64, MMX, SSE, SSE2, SSE3, 3DNow!, NX bit,
Cool’n’Quiet

3.2.2 Processor Changing/Upgrading

These systems use the AM2+ zero-insertion-force mounting socket. These systems require that
the processor use an integrated heatsink/fan assembly.

CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment
of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal
conditions and automatically shut down, such conditions could still result in damage to the processor
component. Refer to the applicable Service Reference Guide for processor installation instructions.

CAUTION: These systems can only support a processor with a maximum power consumption (also
known as thermal design power (TDP)) of 95 watts. Exceeding this limit can result in system damage and
lost data.

3-2 www.hp.com Technical Reference Guide