Cirrus Logic CS470xx User Manual

CS470xx Data Sheet
CS470xx
Features
Cost-effective, High-performance 32-bit DSP
Dual MAC cycles per clock
72-bit accumulators are the highest precision in the
industry
32K x 32-bit SRAM with three 2K blocks assignable to
either Y data or program memory
Integrated DAC and ADC Functionality
8
Channels of 24-bit DAC output: 108dB DR, –98 dB
THD+N
4
Channels of 24-bit ADC input: 105dB DR, –98 dB
THD+N
Integrated 5:1 analog mux feeds one stereo ADC
Configurable Serial Audio Inputs and Outputs
Integrated 192 kHz S/PDIF Rx
Integrated 192 kHz S/PDIF Tx
Supports 32-bit serial data @ 192 kHz
Supports 32-bit audio sample I/O between DSP chips
TDM I/O modes
Supports Different Sample Rates (Fs)
Three integrated hardware SRC blocks
Output can be master or slave
Supports dual-domain Fs on S/PDIF vs. I²S inputs
DSP Tool Set with Private Keys Protect Customer IP
Integrated Clock Manager/PLL
Flexibility to operate from internal PLL, external crystal,
external oscillator
Input Fs Auto Detection w/ µC Acknowledgement
The CS470xx family is a new generation of audio system-on-a-chip (ASOC) processors targeted at high fidelity, cost sensitive designs. Derived from the highly successful CS48500 32-bit fixed-point audio enhancement processor family, the CS470xx further simplifies system design and reduces total system cost by integrating the S/ PDIF Rx, S/PDIF Tx, analog inputs, analog outputs, and SRCs. For example, a hardware SRC can down-sample a 192 kHz S/PDIF stream to a lower Fs to reduce memory and MIPS requirements for processing. This integration effectively reduces the chip count from 3 to 1, which allows smaller, less expensive board designs.
Target applications include:
Automotive head units and outboard amplifiers
Automotive processors and automotive integration hubs
Digital TV
MP3 docking stations
AVR and DVD RX
DSP controlled speakers (subwoofers, sound bars)
The CS470xx is programmed using the simple yet powerful Cirrus proprietary DSP Composer™ GUI development and pre-production tuning tool. Processing chains can be designed using a drag-and-drop interface to place/utilize functional macro audio DSP primitives and custom audio filtering blocks. The end result is a software image that is downloaded to the DSP via serial control port.
The Cirrus Framework™ programming environment offers Assembly and C language compilers and other software development tools for porting existing code to the CS470xx family platform.
The CS470xx is available in a 100-pin LQFP package with exposed pad for better thermal characteristics. Both Commercial (0°C to +70°C) and Automotive (–40°C to +85°C) temperature grades.
Host Control and Boot via I²C™ or SPI™ Serial Interface
Configurable GPIOs and External Interrupt Input
1.8V Core and a 3.3V I/O that is tolerant to 5V input
Low-power Mode
†”
features differ on CS47024, CS47028, or CS47048.
See Table 3-1.
Copyright Cirrus Logic, Inc. 2012
http://www.cirrus.com
(All Rights Reserved)
Ordering Information:
See Section 6 for ordering information.
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x8
x4
x2
x2
DAC0
text
Coyote 32-bit Core
in the CS47048 DSP
DMA
SPI / I2C
Control
I2S
ADC0/1
I2S
I2S / S/PDIF
PLL
ROM
S R C 2
Peripheral Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC1 DAC2 DAC3
DAC4
DAC5
DAC6 DAC7
MUX
S R C 1
ROM
RAM
ROM RAM
P
Y
32K x 32-bit SRAM with three 2K blocks
Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs On Analog in
ADC2/3
DBC
(I2C Slave)
PIC
ADC’s & DAC’s operate
in Single ended or
Differential mode
S R C
3
8ch
8ch
SRC3 has 8
independent Channels
for In or Out
4ch
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CS47048 Block Diagram
Contacting Cirrus Logic Support
For all product questions and inquiries, contact a Cirrus Logic Sales Representative. To find the one nearest you, go to www.cirrus.com.
IMPORTANT NOTICE
Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES.
Cirrus Logic, Cirrus, the Cirrus Logic logo designs, Framerwork, and DSP Composer are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be trademarks or service marks of their respective owners.
SPI is a trademark of Motorola, Inc.
I²C is a trademark of Philips Semiconductor.
Dolby, Pro Logic, Dolby Headphone, Virtual Speaker and the double-D symbol are registered trademarks of Dolby Laboratories, Inc. Supply of an implementation of Dolby Technology does not convey a license nor imply a right under any patent, or any other industrial or Intellectual Property Right of Dolby Laboratories, to use the Implementation in any finished end-user or ready-to-use final product. It is hereby notified that a license for such use is required from Dolby Laboratories.
SRS CircleSurround II technology is incorporated under license from SRS Labs, Inc. The SRS Circle Surround II technology/solution rights incorporated in the Cirrus Logic CS470xx products are owned by SRS Labs, a U.S. Corporation and licensed to Cirrus Logic, Inc. Purchaser of the Cirrus Logic CS470xx products must sign a license for use of the chip and display of the SRS Labs trademarks. Any products incorporating the Cirrus Logic CS470xx products must be sent to SRS Labs for review. SRS CircleSurround II is protected under US and foreign patents issued and/or pending. SRS Circle Surround II, SRS and (O) symbol are trademarks of SRS Labs, Inc. in the United States and selected foreign countries. Neither the purchase of the Cirrus Logic CS470xx products, nor the corresponding sale of audio enhancement equipment conveys the right to sell commercialized recordings made with any SRS technology/solution. SRS Labs requires all set makers to comply with all rules and regulations as outlined in the SRS Trademark Usage Manual.
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1 Documentation Strategy

1 Documentation Strategy
The CS470xx Data Sheet describes the CS47048, CS47028, and CS47024 audio processors. This document should be used in conjunction with the following documents when evaluating or designing a system around the CS470xx processors.
Table 1-1. CS470xx Related Documentation
Document Name Description
CS470xx Data Sheet This document
CS470xx Hardware User’s Manual Guide Includes detailed system design information such as typical connection diagrams, boot-proce-
AN333 - CS470xx Firmware User’s Manual Includes a list of firmware modules available on the CS470xx family platform and detailed firm-
DSP Composer User’s Manual Includes detailed configuration and usage information for the GUI development tool
CDB470xx User’s Manual Includes detailed instructions on the use of the CDB470xx development board
dures, and pin descriptions
ware design information including signal processing flow diagrams and control API information
The scope of the CS470xx Data Sheet is primarily the hardware specifications of the CS470xx family of devices. This includes hardware functionality, characteristic data, pinout, and packaging information.
The intended audience for the CS470xx Data Sheet is the system PCB designer, MCU programmer, and the quality control engineer.

2 Overview

The CS470xx DSP is designed to provide high-performance post-processing and mixing of analog and digital audio. Dual clock domains are supported when the DAI and SPDIF RX inputs are used together. Integrated sample rate converters (SRCs) allow audio streams with different sample rates to be mixed. The low-power standby preserves battery life for applications that are always on, but not necessarily processing audio, such as automotive audio systems.
The CS470xx uses voltage-out DACs and is capable of supporting dual input clock domains through the use of the internal SRCs. The CS470xx is available in a 100-pin LQFP package. Refer to Table 3-1 and Table 3-2 for the input, output, and firmware configurations for the CS470xx DSP.

2.1 Licensing

Licenses are required for any third-party audio processing algorithms provided for the CS470xx. Contact your local Cirrus Logic Sales representative for more information.
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3 Code Overlays

3 Code Overlays
The suite of software available for the CS470xx family consists of an operating system (OS) and a library of overlays. The software components for the CS470xx family include:
1. OS/Kernel—Encompasses all non-audio processing tasks, including loading data from external serial memory,
processing host messages, calling audio-processing subroutines, error concealment, etc.
2. Decoder—Any module that performs a compressed audio decode on IEC61937-packed data delivered via S/PDIF
Rx or I²S input, such as Dolby Digital (AC3).
3. Matrix-processor—Any Module that performs a matrix decode on PCM data to produce more output channels than
input channels (2Æn channels). Examples are Dolby speaking, these modules increase the number of valid channels in the audio I/O buffer.
4. Virtualizer-processor—Any module that encodes PCM data into fewer output channels than input channels (nÆ2
channels) with the effect of providing “phantom” speakers to represent the physical audio channels that were eliminated. Examples are Dolby Headphone modules reduce the number of valid channels in the audio I/O buffer.
5. Post-processors—Any module that processes audio I/O buffer PCM data. Examples are bass management, audio
manager, tone control, EQ, delay, customer-specific effects, and any post-processing algorithms available for the CS470xx DSP.
The bulk of standard overlays are stored in ROM within the CS470xx, but a small image is required to configure the overlays and boot the DSP. This small image can either be stored in an external serial flash/EEPROM, or downloaded via a host controller through the SPI/I²C serial port.
®
2 and Dolby® Virtual Speaker® 2. Generally speaking, these
®
Pro Logic® IIx and SRS Circle Surround II®. Generally
The overlay structure reduces the time required to reconfigure the DSP when a processing change is requested. Each overlay can be reloaded independently without disturbing the other overlays. For example, when a different post-processor is selected, the OS, does not need to be reloaded—only the new post-processor.
Table 3-1 lists the different configuration options available. Refer to the CS470xx Firmware User’s Manual for the latest
listing of application codes and Cirrus Framework™ modules available. See Table 3-2, which provides a summary of the available channels for each type of input and output communication mode for members of the CS470xx family of DSPs.
5 DS787PP9
Table 3-1. CS470xx Device Selection Guide
3 Code Overlays
Features
Primary Applications • 4-In/8-Out Car Audio
Package 100-pin LQFP with Exposed Pad
DSP Core Cirrus Logic 32-bit Core
SRAM 32K x 32-bit SRAM with three 2K blocks x 32-bit SRAM, assignable to either Y data or program memory
Integrated DAC and ADC • 2 Channels of ADC input: with inte-
Configurable Serial Audio Inputs/Outputs
Supports Different Fs Sample Rates
Other Features • Integrated Clock Manager/PLL with flexibility to operate from internal PLL, external crystal, external oscillator
• High-end Digital TV
• Dual Source/Dual Zone
• 2 additional channels of ADC in-
• 8 channels of DAC output
• Integrated 192 kHz S/PDIF Rx, 2 Integrated 192 kHz S/PDIF Tx
• I2S support for 32-bit Samples @ 192 kHz
• TDM Input modes (Up to 8 channels)
• TDM Output modes (Up to 8 channels)
• Integrated hardware SRC blocks for all ADC and DAC channels
• Additional 8-channel hardware SRC block
• Dual-domain Fs on inputs (I2S and S/PDIF Rx)
• Output can be master or slave
• Host Control and Boot via SPI/I²C Serial Interface
• DSP Tool Set w/ Private Keys Protect Customer IP
• Configurable GPIOs and External Interrupts
• Hardware Watchdog Timer
CS47048-CQZ CS47048-DQZ
• 2-In/8-Out Car Audio
• Sound Bar
•DVD Receiver
• 2 channels of ADC input: with inte-
grated 5:1 analog mux
• 8 channels of DAC output
put: without mux
CS47028-CQZ CS47028-DQZ
grated 5:1 analog mux
CS47024-CQZ CS47024-DQZ
• 2-In/4-Out Car Audio
• Digital TV
• Portable Audio Docking Station
• Portable DVD
• DVD Mini / Receiver
• Multimedia PC Speakers
• 2 channels of ADC input: with inte­grated 5:1 analog mux
• 4 channels of DAC output
T able 3-2. CS470xx Channel Count
Product
CS47048 • Up to 5 I2S lines, 2 channels per
line or
• 1 TDM line, up to 8 channels per line.
CS47028 • Up to 5 I2S lines, 2 channels per
line or
• 1 TDM line, up to 8 channels per line.
CS47024 • Up to 5 I2S lines, 2 channels per
line or
• 1 TDM line, up to 8 channels per line.
1. Contact your Cirrus Logic representative to determine the TDM modes that are supported. The CS470xx can support up to 8 channels per line, but
the DSP software provided for the IC can restrict this capability.
PCM/TDM In
1
TDM Out
Up to 8 chan­nels
Up to 8 chan­nels
Up to 8 chan­nels
PCM
1
Out
ADC with 5:1
Input Mux
82 2812
82 0812
82 0412
ADC with-
out Mux
DAC
Out
S/PDIF In
(Stereo
Pairs)
S/PDIF
Out (Ste-
reo Pairs)
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x8
x4
x2
x2
DAC0
text
32-bit Core
in the CS47048 DSP
DMA
SPI / I2C
Control
I2S
ADC0 /1
I2S
I2S / S/PDIF
PLL
ROM
S R C
2
Periphe r al Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC1 DAC2 DAC3
DAC4
DAC5
DAC6 DAC7
MUX
S R C 1
ROM
RAM
ROM RAM
P
Y
32K x 32-b i t S RA M wi th thr ee 2K blo cks Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs On Analog in
ADC2/ 3
DBC
(I2C Slave )
PIC
ADC’s & DA C’s ope r at e
in Single ended or
Di fferen ti al mo d e
S R C
3
8ch
8ch
SRC3 h as 8
independent Channels
for In or Out
4ch

4 Hardware Functional Description

4 Hardware Functional Description
The CS470xx family, which includes the CS47048, CS47028, and CS47024 DSPs, is a true system-on-a-chip that combines a powerful 32-bit DSP engine with analog/digital audio inputs and analog/digital audio outputs. It can be integrated into a complex multi-DSP processing system, or stand alone in an audio product that requires analog-in and analog-out. A top level block diagram for the CS47048, CS47028, and CS47024 products are shown in Fig. 4-1, Fig. 4-2, and Fig. 4-3 respectively.
7 DS787PP9
Figure 4-1. CS47048 Top-level Block Diagram
x8
x4
x2
x2
DAC0
text
32-bit Core
in the CS47028 DSP
DMA
SPI / I2C
Control
I2S
I2S
I2S / S/PDIF
PLL
ROM
S R C
2
Peripheral Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC1 DAC2 DAC3
DAC4
DAC5
DAC6 DAC7
MUX
S R C 1
ROM
RAM
ROM RAM
P
Y
32K x 32-b i t S RA M wi th thr ee 2K blo cks Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs On Analog in
ADC2/ 3
DBC
(I2C Slave )
PIC
ADC’s & DA C’s ope r at e
in Single ended or
Di fferen ti al mo d e
S R C
3
8ch
8ch
SRC3 h as 8
independent Channels
for In or Out
4ch
x8
x4
x2
x2
text
32-bit Core
in the CS47024 DSP
DMA
SPI / I2C
Control
I2S
I2S
I2S / S/PDIF
PLL
ROM
S R C
2
Peripheral Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC0 DAC1
DAC2 DAC3
MUX
S R C 1
ROM
RAM
ROM RAM
P
Y
32K x 32-b i t S RA M wi th thr ee 2K blo cks Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs On Analog in
ADC2/ 3
DBC
(I2C Slave )
PIC
ADC’s & DA C’s ope r at e
in Single ended or
Di fferen ti al mo d e
S R C
3
8ch
8ch
SRC3 h as 8
independent Channels
for In or Out
4ch
4 Hardware Functional Description
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Figure 4-2. CS47028 Top-level Block Diagram
Figure 4-3. CS47024 Top-level Block Diagram

4.1 Cirrus Logic 32-bit DSP Core

4.1 Cirrus Logic 32-bit DSP Core
The CS470xx comes with a Cirrus Logic 32-bit core with separate X and Y data and P code memory spaces. The DSP core is a high-performance, 32-bit, user-programmable, fixed-point DSP that is capable of performing two multiply-and-accumulate (MAC) operations per clock cycle. The DSP core has eight 72-bit accumulators, four X-data and four Y-data registers, and 12 index registers.
The DSP core is coupled to a flexible 8-channel DMA engine. The DMA engine can move data between peripherals such as the serial control port (SCP), digital audio input (DAI) and digital audio output (DAO), sample rate converters (SRC), analog-to-digital converters (ADC), digital-to-analog converters (DAC), or any DSP core memory, all without the intervention of the DSP. The DMA engine off-loads data move instructions from the DSP core, leaving more MIPS available for signal processing instructions.
CS470xx functionality is controlled by application codes that are stored in on-chip ROM or downloaded to the CS470xx from a host controller or external serial flash/EEPROM.
Users can develop applications using the DSP Composer™ tool to create the processing chain and then compile the image into a series of commands that are sent to the CS470xx through the SCP. The processing application can either load modules (post-processors) from the DSPs on-chip ROM, or custom firmware can be downloaded through the SCP.
The CS470xx is suitable for a variety of audio post-processing applications where sound quality via sound enhancement and speaker/cabinet tuning is required to achieve the sound quality consumers expect. Examples of such applications include automotive head-ends, automotive amplifiers, docking stations, sound bars, subwoofers, and boom boxes.

4.2 DSP Memory

The DSP core has its own on-chip data and program RAM and ROM and does not require external memory for post-processing applications.
The Y-RAM and P-RAM share a single block of memory that includes three 2K word blocks (32 bits/word) that are assignable to either Y-RAM or P-RAM as shown in Table 4.
Table 4-1. Memory Configurations for the C470xx
P-RAM X-RAM Y-RAM
14K words 10K words 8K words
12K words 10K words 10K words
10K words 10K words 12K words
8K words 10K words 14K words

4.2.1 DMA Controller

The powerful 8-channel DMA controller can move data between 8 on-chip resources. Each resource has its own arbiter: X, Y, and P RAMs/ROMs and the peripheral bus. Modulo and linear addressing modes are supported, with flexible start address and increment controls. The service intervals for each DMA channel, as well as up to 6 interrupt events, are programmable.

4.3 On-chip DSP Peripherals

4.3.1 Analog to Digital Converter Port (ADC)

The ADCs in the CS470xx devices feature dynamic range performance in excess of 100 dB. See Section 5.16 for more details on CS470xx ADC performance. The CS47024 and CS47028 devices support up to 2 simultaneous channels of analog-to-digital conversion with the input source selectable using an integrated 5:1 stereo analog mux (analog inputs AIN_2A/B through AIN_6A/B). The CS47048 device adds a second pair of ADCs that are directly connected to input pins AIN_1A/B providing a total of 4 simultaneous channels of analog-to-digital conversion. This feature gives the CS47048 the ability to select from a total of six stereo pairs of analog input. A single programmable bit selects single-ended or differential mode signals for all inputs. The conversions are performed with Fs=96 kHz.
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4.3 On-chip DSP Peripherals

4.3.2 Digital to Analog Converter Port (DAC)

The DACs in the CS470xx devices feature dynamic range performance in excess of 100 dB. See Section 5.17 for more details on CS470xx DAC performance. The CS47024 device supports four simultaneous channels of digital-to-analog conversion. The CS47028 and CS47048 devices provide eight simultaneous channels of digital-to-analog conversion. The DACs have voltage mode outputs that can be connected either as single-ended or differential signals. The conversions are performed with Fs=96 kHz.

4.3.3 Digital Audio Input Port (DAI)

The input capabilities for each version of the CS470xx are summarized in Table 3-1 and Table 3-2.
Up to five DAI ports are available. Two of the DAI ports can be programmed to implement other functions. If the SPI mode is used, the DAI_DATA4 pin becomes the SCP_CS input. The integrated S/PDIF receiver can be used to take over the DAI_DATA3 pin.
The DAI port PCM inputs have a single slave-only clock domain. The S/PDIF receiver, if used, is a separate clock domain. The output of the S/PDIF Rx can then be converted through one of the internal SRC blocks to synchronize with the PCM input. The sample rate of the input clock domains can be determined automatically by the DSP, off-loading the task of monitoring the S/PDIF Rx from the host. A time-stamping feature provides the ability to also sample-rate convert the input data via software.The DAI port supports PCM format with word lengths up to 32 bits and sample rates as high as 192 kHz.
The DAI also supports a time division multiplexed (TDM) mode that packs up to 10 PCM audio channels on a single data line.

4.3.4 S/PDIF RX Input Port (DAI)

One of the PCM pins of the DAI can also be used as a DC-coupled, TTL-level S/PDIF Rx input capable of receiving and demodulating bi-phase encoded S/PDIF signals with Fs <
192 kHz.

4.3.5 Digital Audio Output Port (DAO)

DAO port supports PCM resolutions of up to 32-bits. The port supports sample rates (Fs) as high as 192 kHz. The port can be configured as an independent clock domain mastered by the DSP, or as a clock slave if an external MCLK or SCLK/ LRCLK source is available.
The DAO also supports a time division multiplexed (TDM) mode, that packs up to 8 channels of PCM audio on a single data line.

4.3.6 S/PDIF TX Output Port (DAO)

Two of the serial audio pins can be re-configured as S/PDIF TX pins that drive a bi-phase encoded S/PDIF signal (data with embedded clock on a single line).

4.3.7 Sample Rate Converters (SRC)

All CS470xx devices have at least two internal hardware SRC modules. One is directly associated with the ADCs and normally serves to convert data from the 96 kHz sampling rate of the ADCs to another Fs appropriate for mixing with other audio in the system.
The other SRC module is directly associated with the DACs and normally serves to convert data from the DSP into the 96 kHz sample rate needed by the DACs.
The CS47024, CS47028, and CS47048 devices have an additional stand-alone 8-channel SRC module. This SRC module can be used to make independent input clock domains synchronous (different Fs on PCM input and S/PDIF Rx).
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4.4 DSP I/O Description

4.3.8 Serial Control Port (I2C or SPI)

The on-chip serial control port is capable of operating as master or slave in either SPI or I2C modes. Master/Slave operation is chosen by mode select pins when the CS470xx comes out of reset. The serial clock pin can support frequencies as high as 25 MHz in SPI mode (SPI clock speed must always be < serial control port also includes a pin for flow control of the communications interface (SCP_BSY) and a pin to indicate when the DSP has a message for the host (SCP_IRQ).
(DSP Core Frequency/2)). The CS470xx

4.3.9 GPIO

Many of the CS470xx peripheral pins are multiplexed with GPIO. Each GPIO can be configured as an output, an input, or an input with interrupt. Each input-pin interrupt can be configured as rising edge, falling edge, active-low, or active-high.

4.3.10 PLL-based Clock Generator

The low-jitter PLL generates integer or fractional multiples of a reference frequency, which is used to clock the DSP core and peripherals. Through a second PLL divider chain, a dependent clock domain can be output on the DAO port for driving audio converters. The CS470xx defaults to running from the external reference frequency and is switched to use the PLL output after overlays have been loaded and configured, either through master boot from an external flash or through host control. A built-in crystal oscillator circuit with a buffered output is provided. The buffered output frequency ratio is selectable between 1:1 (default) or 2:1.

4.3.11 Hardware Watchdog Timer

The CS470xx has an integrated watchdog timer that acts as a “health” monitor for the DSP. The watchdog timer must be reset by the DSP before the counter expires, or the entire chip is reset. This peripheral ensures that the CS470xx resets itself in the event of a temporary system failure. In stand-alone mode (where there is no host MCU), the DSP reboots from external flash. In slave mode (where the host MCU is present), a GPIO is used to signal the host that the watchdog has expired and the DSP should be rebooted and re-configured.
4.4 DSP I/O Description

4.4.1 Multiplexed Pins

Many of the CS470xx pins are multifunctional. For details on pin functionality, see Section 10.5, “Pin Assignments”, in the
CS470xx Hardware User’s Manual.

4.4.2 Termination Requirements

Open-drain pins on the CS470xx must be pulled high for proper operation. See the CS470xx Hardware User’s Manual to
identify which pins are open-drain and what value of pull-up resistor is required for proper operation.
Mode select pins on CS470xx are used to select the boot mode on the rising edge from reset. A detailed explanation of
termination requirements for each communication mode select pin can be found in the CS470xx Hardware User’s Manual.

4.4.3 Pads

The CS470xx Digital I/Os operate from the 3.3 V supply and are 5 V tolerant.

4.5 Application Code Security

The external program code can be encrypted by the programmer to protect any intellectual property it contains. A secret, customer-specific key is used to encrypt the program code that is to be stored external to the device. Contact your local Cirrus representative for details.
11 DS787PP9

5 Characteristics and Specification s

5 Characteristics and Specifications
Note: All data sheet minimum and maximum timing parameters are guaranteed over the rated voltage and temperature.
All data sheet typical parameters are measured under the following conditions: T = 25°C, VDD = 1.8 V, VDDIO = VDDA = 3.3 V, GND = GNDIO = GNDA = 0 V.

5.1 Absolute Maximum Ratings

(GND = GNDIO = GNDA = 0V; all voltages with respect to 0V)
Parameter Symbol Min Max Unit
DC power supplies: Core supply Analog supply I/O supply |VDDA–VDDIO|
Input pin current, any pin except supplies I
Input voltage on PLL_REF_RES V
Input voltage on digital I/O pins V
Analog Input Voltage V
Storage temperature T
WARNING: Operation at or beyond these limits can result in permanent damage to the device. Normal operation is not
guaranteed at these extremes.
VDD VDDA VDDIO
in
filt
inio
in
stg
–0.3 –0.3 –0.3
— — ±10 mA
–0.3 3.6 V
–0.3 5.0 V
AGND–0.7 VA+0.7 V
–65 150 °C
2.0
3.6
3.6
0.3
V V V V

5.2 Recommended Operating Conditions

(GND = GNDIO = GNDA = 0V; all voltages with respect to 0V)
Parameter Symbol Min Typ Max Unit
DC power supplies: Core supply Analog supply I/O supply |VDDA – VDDIO|
Ambient operating temperature Commercial—CQZ (147 MHz) Automotive—DQZ (131 MHz) Automotive—DQZ (113 MHz)
VDD VDDA VDDIO
T
A
1.71
3.13
3.13
0 –40 –40
1.8
1.89
3.3
3.46
3.3
3.46
0
—+70
+85
+105
V V V V
°C
Note: It is recommended that the 3.3 V IO supply come up ahead of or simultaneously with the 1.8 V core supply.

5.3 Digital DC Characteristics

(Measurements performed under static conditions.)
Parameter Symbol Min Typ Max Unit
High-level input voltage V
Low-level input voltage, except XTI V
Low-level input voltage, XTI V
Input Hysteresis V
High-level output voltage (I
Low-level output voltage (I
Input leakage XTI I
Input leakage current (all digital pins with internal pull-up resistors enabled)
= –2mA), except XTO V
O
= 2mA), except XTO V
O
I
IH
IL
ILKXTI
hys
OH
OL
LXTI
LEAK
2.0 V
——0.8V
——0.6V
—0.4— V
VDDIO*0.9 — V
— VDDIO*0.1 V
—— 5 μA
——70μA
DS787PP9 12

5.4 Power Supply Characteristics

Note: Measurements performed under operating conditions
Parameter Min Typ Max Unit
Operational Power Supply Current: VDD: Core and I/O operating VDDA: PLL operating current VDDA: DAC operating current (all 8 channels enabled) VDDA: ADC operating current (all 4 channels enabled) VDDIO: With most ports operating
1
5.4 Power Supply Characteristics
325
— — — — —
16 56 34 27
mA mA mA mA mA
Total Operational Power Dissipation:
Standby Power Supply Current: VDD: Core and I/O not clocked VDDA: PLLs halted VDDA: DAC disabled VDDA: ADC disabled VDDIO: All connected I/O pins 3-stated by other ICs in system
Total Standby Power Dissipation:
1. Dependent on application firmware and DSP clock speed.

5.5 Thermal Data (100-pin LQFP with Exposed Pad)

Parameter Symbol Min Typ Max Unit
Thermal Resistance (Junction to Ambient) Two-layer Board Four-layer Board
Thermal Resistance (Junction to Top of Package) Two-layer Board Four-layer Board
1
2
1
2
1. To calculate the die temperature for a given power dissipation:
= Ambient temperature + [ (Power Dissipation in Watts) * ja ]
j
2. To calculate the case temperature for a given power dissipation:
= j - [ (Power Dissipation in Watts) * jt ]
c
ja
jt
1025
410
26
40
24
215
1745
——3418—
——0.54
.28——
mW
μA μA μA μA μA
μW
°C/Watt
°C/Watt
Note: Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top and bottom layers.
Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the top and bottom layers and 0.5-oz. copper covering 90% of the internal power plane and ground plane layers.
5.6 Digital Switching Characteristics–RESET
Parameter Symbol Min Max Unit
RESET minimum pulse width low
All bidirectional pins high-Z after RESET
Configuration pins setup before RESET
Configuration pins hold after RESET
1. The rising edge of RESET must not occur before the power supplies are stable at the recommended operating values as described in Section 5.2. In addition, for the configuration pins to be read correctly, the RESET
T
13 DS787PP9
1
high T
high T
requirement must be met.
rstl
low T
T
rstl
rst2z
rstsu
rsthld
1—s
— 200 ns
50 ns
20 ns
T
rstl
T
rstsu
T
rsthld
HS[3:0]
All supplies at recommended operating values.
VDD
1
1
Refers to all power supplies.
RESET
RESET
T
rst2z
T
rstl
T
rstsu
T
rsthld
HS[3:0]
All Bidirectional
Pins
t
clkih
t
clkil
T
clki
XTI
5.7 Digital Switching Characteristics–XTI
Figure 5-1. RESET Timing at Power-on
Figure 5-2. RESET
Timing after Power is Stable
5.7 Digital Switching Characteristics–XTI
Parameter Symbol Min Max Unit
External Crystal operating frequency
XTI period T
XTI high time T
XTI low time T
External Crystal Load Capacitance (parallel resonant)
External Crystal Equivalent Series Resistance ESR 50
1. Part characterized with the following crystal frequency values: 12.288 and 24.576 MHz.
2. C
refers to the total load capacitance as specified by the crystal manufacturer. Crystals that require a CL outside this range should be avoided. The
L
crystal oscillator circuit design should follow the crystal manufacturer’s recommendation for load capacitor selection.
1
Figure 5-3. XTI Timing
F
12.288 24.576 MHz
xtal
clki
clkih
clkil
2
C
41 81 ns
13.3 ns
13.3 ns
10 18 pF
L
DS787PP9 14
5.8 Digital Switching Characteristics–Internal Clock
5.8 Digital Switching Characteristics–Internal Clock
Parameter Symbol
Internal DSP_CLK frequency
1
CS47048-CQZ CS47048-DQZ CS47028-CQZ CS47028-DQZ CS47024-CQZ CS47024-DQZ
Internal DSP_CLK period
1
CS47048-CQZ CS47048-DQZ CS47028-CQZ CS47028-DQZ CS47024-CQZ CS47024-DQZ
1. After initial power-on reset, F reset.
2. See Section 5.7. for all references to F
dclk
= F
xtal
Min (2-
layer Boards)
F
dclk
(See Footnote 2)
F F F F F F
DCLKP
6.8
7.6
6.8
7.6
6.8
7.6
. After initial kick-start commands, the PLL is locked to max F
.
xtal
Min (4-
layer Boards)
xtal xtal xtal xtal xtal xtal
6.8
6.8
6.8
6.8
6.8
6.8
Max (2-
layer Boards)
147 131 147 131 147 131
1/F 1/F 1/F 1/F 1/F 1/F
and remains locked until the next power-on
dclk
Max (4-
layer Boards)
147 147 147 147 147 147
xtal xtal xtal xtal xtal xtal
5.9 Digital Switching Characteristics–Serial Control Port–SPI Slave Mode
Parameter Symbol Min Typical Max Unit
xtal
/3.
1
rising t
rising t
falling t
f
spisck
spicss
spickl
spickh
spidsu
spidh
spidov
spiirqh
spiirql
spicsh
spicsdz
spicbsyl
——25MHz
24 ns
20 ns
20 ns
5——ns
5——ns
——11ns
27 ns
0——ns
24 ns
—20—ns
3*DCLKP+20 ns
pin should be implemented to prevent overflow of the input data
SCP_CLK frequency
SCP_CS
falling to SCP_CLK rising t
SCP_CLK low time t
SCP_CLK high time t
Setup time SCP_MOSI input t
Hold time SCP_MOSI input t
SCP_CLK low to SCP_MISO output valid t
SCP_CLK falling to SCP_IRQ
SCP_CS
rising to SCP_IRQ falling t
SCP_CLK low to SCP_CS
SCP_CS
rising to SCP_MISO output high-Z t
SCP_CLK rising to SCP_BSY
1. f
indicates the maximum speed of the hardware. The system designer should be aware that the actual maximum speed of the communication
spisck
port can be limited by the firmware application. Flow control using the SCP_BSY buffer. At boot the maximum speed is F
Unit
MHz
ns
15 DS787PP9
SCP_BSY
SCP_CS
SCP_CLK
SCP_MOSI
SCP_MISO
SCP_IRQ
0
12670
56
7
t
spicss
t
spickl
t
spickh
t
spidsu
t
spidh
t
spidov
A6 A5 A0 R/W MSB LSB
MSB
LSB
t
spicsh
t
spibsyl
t
spiirql
t
spiirqh
f
spisck
t
spicsdz
1/
5.10 Digital Switching Characteristics–Serial Control Port–SPI Master
5.10 Digital Switching Characteristics–Serial Control Port–SPI Master Mode
1. f port can be limited by the firmware application.
2. See Section 5.7.
3. SCP_CLK PERIOD refers to the period of SCP_CLK as being used in a given application. It does not refer to a tested parameter.
Figure 5-4. Serial Control Port–SPI Slave Mode Timing
Parameter Symbol Min Typical Max Units
SCP_CLK frequency
EE_CS
falling to SCP_CLK rising
SCP_CLK low time t
SCP_CLK high time t
Setup time SCP_MISO input t
Hold time SCP_MISO input t
SCP_CLK low to SCP_MOSI output valid t
SCP_CLK low to EE_CS
SCP_CLK low to EE_CS
Bus free time between active EE_CS
SCP_CLK falling to SCP_MOSI output high-Z t
indicates the maximum speed of the hardware. The system designer should be aware that the actual maximum speed of the communication
spisck
1,2
3
falling t
rising t
f
spisck
t
spicss
spickl
spickh
spidsu
spidh
spidov
spicsl
spicsh
t
spicsx
spidz
——F
11*DCLKP+(SCP_CLK PERIOD)/2 ns
18 ns
18 ns
9— —ns
5— —ns
—— 8ns
7— —ns
11*DCLKP+(SCP_CLK PERIOD)/2 ns
3*DCLKP ns
20 ns
/2 MHz
xtal
DS787PP9 16
EE_CS
SCP_CLK
SCP_MISO
SCP_MOSI
0
12670
56
7
t
spicss
t
spickl
t
spickh
t
spidsu
t
spidh
t
spidov
A6 A5 A0 R/W MSB LSB
MSB
LSB
t
spicsh
t
spicsx
f
spisck
t
spidz
t
spicsl
1/
5.11 Digital Switching Characteristics–Serial Control Port I2C Slave Mode
Figure 5-5. Serial Control Port–SPI Master Mode Timing
5.11 Digital Switching Characteristics–Serial Control Port I2C Slave Mode
Parameter Symbol Min Typical Max Units
SCP_CLK frequency
SCP_CLK rise time t
SCP_CLK fall time t
SCP_CLK low time t
SCP_CLK high time t
SCP_CLK rising to SCP_SDA rising or falling for START or STOP condition t
START condition to SCP_CLK falling t
SCP_CLK falling to STOP condition t
Bus free time between STOP and START conditions t
Setup time SCP_SDA input valid to SCP_CLK rising t
Hold time SCP_SDA input after SCP_CLK falling t
SCP_CLK low to SCP_SDA out valid t
SCP_CLK falling to SCP_IRQ
NAK condition to SCP_IRQ
SCP_CLK rising to SCB_BSY
1. f
indicates the maximum speed of the hardware. The system designer should be aware that the actual maximum speed of the communication
iicck
port can be limited by the firmware application. Flow control using the SCP_BSY buffer.
I2C Slave Address = 0x82
1
rising t
low t
low t
f
iicck
iicckl
iicckh
iicckcmd
iicstscl
iicstp
iicbft
iicsu
iicdov
iicirqh
iicirql
iicbsyl
pin should be implemented to prevent overflow of the input data
—— 400kHz
—— 150ns
iicr
—— 150ns
iicf
1.25 µs
1.25 µs
1.25 µs
1.25 µs
2.5 µs
3— —µs
110 ns
100 ns
iich
—— 18 ns
3*DCLKP+40 ns
—3*DCLKP+20 ns
—3*DCLKP+20 ns
17 DS787PP9
SCP_BSY
SCP_CLK
SCP_SDA
SCP_IRQ
01 67801 7
t
iicckl
t
iicckh
t
iicsutiich
A6 A0 R/W ACK
LSB
t
iicirqh
t
iicirql
8
ACK
MSB
t
iicstp
6
t
iiccbsyl
t
iicdov
t
iicbft
t
iicstscl
t
iicckcmd
f
iicck
t
iicckcmd
t
iicf
t
iicr
Start Condition
1/
Stop Condition
SCP_CLK
SCP_SDA
01 67801 7
t
iicckl
t
iicckh
t
iicsutiich
A6 A0 R/W ACK
LSB
8
ACK
MSB
t
iicstp
6
t
iicdov
t
iicbft
t
iicstscl
t
iicckcmd
f
iicck
t
iicckcmd
t
iicf
t
iicr
1/
5.12 Digital Switching Characteristics–Serial Control Port–I2C Master
Figure 5-6. Serial Control Port–I2C Slave Mode Timing
5.12 Digital Switching Characteristics–Serial Control Port–I2C Master Mode
1. f
iicck
port can be limited by the firmware application.
Parameter Symbol Min Max Units
1
f
iicck
iicr
iicf
iicckl
iicckh
iicckcmd
iicstscl
iicstp
iicbft
iicsu
iich
iicdov
—400kHz
150 ns
150 ns
1.25 — µs
1.25 — µs
1.25 — µs
1.25 — µs
2.5 µs
3—µs
110 ns
100 ns
—36 ns
SCP_CLK frequency
SCP_CLK rise time t
SCP_CLK fall time t
SCP_CLK low time t
SCP_CLK high time t
SCP_CLK rising to SCP_SDA rising or falling for START or STOP condition t
START condition to SCP_CLK falling t
SCP_CLK falling to STOP condition t
Bus free time between STOP and START conditions t
Setup time SCP_SDA input valid to SCP_CLK rising t
Hold time SCP_SDA input after SCP_CLK falling t
SCP_CLK low to SCP_SDA out valid t
indicates the maximum speed of the hardware. The system designer should be aware that the actual maximum speed of the communication
DS787PP9 18
Figure 5-7. Serial Control Port–I2C Master Mode Timing
DAI_SCLK
DAI_DATAn
t
daidh
t
daidsu
DAO_MCLK
DAO_SCLK
DAO_LRCLK
DAO_DATAn
t
daomsck
t
daomlrts
t
daomdv
t
daomclk
5.13 Digital Switching Characteristics–Digital Audio Slave Input Port
5.13 Digital Switching Characteristics–Digital Audio Slave Input Port
Parameter Symbol Min Max Unit
DAI_SCLK period T
daiclkp
20 ns
DAI_SCLK duty cycle 45 55 %
Setup time DAI_DATAn t
Hold time DAI_DATAn t
daidsu
daidh
8—ns
5—ns
Figure 5-8. Digital Audio Input (DAI) Port Timing Diagram
5.14 Digital Switching Characteristics–Digital Audio Output Port
Parameter Symbol Min Max Unit
DAO_MCLK period T
daomclk
DAO_MCLK duty cycle 45 55 %
DAO_SCLK period for Master or Slave mode
DAO_SCLK duty cycle for Master or Slave mode
Master Mode (Output A1 Mode)
1,2
DAO_SCLK delay from DAO_MCLK rising edge, DAO MCLK as an input t
DAO_LRCLK to DAO_SCLK inactive edge
DAO_SCLK inactive edge
3
to DAO_LRCLK. See Fig. 5-10.t
DAO_DATA[3:0] delay from DAO_SCLK inactive edge
Slave Mode (Output A0 Mode)
4
DAO_SCLK active edge to DAO_LRCLK transition. See Fig. 5-11.t
DAO_LRCLK transition to DAO_SCLK active edge. See Fig. 5-12.t
DAO_Dx delay from DAO_SCLK inactive edge t
1. Master mode timing specifications are characterized, not production tested.
2. Master mode is defined as the CS47048 driving both DAO_SCLK, DAO_LRCLK. When MCLK is an input, it is divided to produce DAO_SCLK, DAO_ LRCLK.
3. The DAO_LRCLK transition can occur on either side of the edge of DAO_SCLK. The active edge of DAO_SCLK is the point at which the data is valid.
4. Slave mode is defined as DAO_SCLK, DAO_LRCLK driven by an external source.
1
1
3
. See Fig. 5-9.t
3
T
daosclk
—4060%
daomsck
daomlrts
daomstlr
t
daomdy
daosstlr
daoslrts
daosdv
20 ns
20 ns
—19ns
—8 ns
—8 ns
—8 ns
10 ns
10 ns
—11ns
19 DS787PP9
Figure 5-9. DAO_LRCLK Transition before DAO_SCLK Inactive Edge
DAO_MCLK
DAO_SCLK
DAO_LRCLK
DAO_DATAn
t
daomclk
t
daomstlr
t
daomdv
t
daomsck
DAO_SCLK
DAO_LRCLK
DAO_Dx
t
daoslrts
t
daosclk
DAO_SCLK
DAO_LRCLK
t
daosstlr
t
daosdv
t
daosclk
DAO_Dx
5.14 Digital Switching Characteristics–Digital Audio Output Port
Figure 5-10. DAO_LRCLK Transition after DAO_SCLK Inactive Edge
Figure 5-11. DAO_LRCLK Transition before DAO_SCLK Inactive Edge
Figure 5-12. DAO_LRCLK Transition after DAO_SCLK Inactive Edge
DS787PP9 20
5.15 Digital Switching Characteristics–S/PDIF RX Port
5.15 Digital Switching Characteristics–S/PDIF RX Port
(Inputs: Logic 0 = VIL, Logic 1 = VIH, CL = 20 pF)
Parameter Symbol Min Typ Max Units
PLL Clock Recovery Sample Rate Range 30 200 kHz

5.16 ADC Characteristics

5.16.1 Analog Input Characteristics (Commercial)

Test Conditions (unless otherwise specified): TA = 0–+70°C; VDD = 1.8V±5%, VDDA (VA) = 3.3V±5%, 1kHz sine wave driven through the passive input filter (R Bandwidth is 10–20kHz.
Fs = 96 kHz
Dynamic Range A-weighted Unweighted 40 kHz bandwidth unweighted
Total Harmonic Distortion + Noise –1 dB –20 dB –60 dB 40 kHz bandwidth –1 dB
AIN_1A/B Interchannel Isolation
AID_[2.6]A/B MUX Interchannel Isolation — 95 95 dB
DC Accuracy
Interchannel Gain Mismatch 0.1 0.1 dB
Gain Drift
Analog Input
Full-scale Input Voltage
Differential Input Impedance
Single-ended Input Impedance
Common Mode Rejection Ratio (CMRR)8—60 —— — — dB
Parasitic Load Capacitance (C
1. dB units referred to the typical full-scale voltage.
2. These full-scale values were measured with R
3. The full-scale voltage can be changed by scaling R Differential Full-Scale (Vpp) = 3.7*VDDA*(Ri+200)/(10k+200)
Single-Ended Full-Scale (Vpp) = 1.85*VDDA*(Ri+200)/(10k+200)
4. Measured between AIN_xx+ and AN_xx–.
5. Measured between AIN_xx+ and AGND.
6. Decreasing full-scale voltage by reducing R
7. Common mode input current should be kept to less than ±160uA to avoid performance degradation: |(I
=10 k in the differential case.
for R
i
8. This number was measured using perfectly matched external resistors (R
(|
R
|/Ri + 0.001).
i
represents the parasitic load capacitance between Ri on the input circuit and the input pin of the CS47048 package.
9. C
L
10. This measurement is not applicable to the CS47028 and CS47024 devices.
= 10 k) in Fig. 5-13 or Fig. 5-14; DSP running test application; Measurement
i
Differential Single-ended
Parameter Min Typ Max Min Typ Max Unit
1,6,7
99
105
96
96
102
102
99
6,7
–98
–82
–42
–90
10
—95 —— 95 — dB
–92
— — —
93
— — — —
–95 –79 –39 –90
99 96
— — —
–89
— — —
dB dB dB
dB dB dB dB
±120 —— ±120 — ppm/°C
2,3
4
5
9
)
L
=10k for both the single-ended and differential mode input circuits.
i
.
i
causes the noise floor to increase.
i
3.3 3.7VA 3.9 1.65 1.85VA 1.95 V
PP
400 200
20 20 pF
)/2| < 160uA. This corresponds to ±1.6V
ip+Iin
). Mismatch in the external resistors typically reduces CMRR by 20 log
i
21 DS787PP9
10µF
C
L
R
i
AIN
100K
AIN_xA+
AIN_xB+
or
+
5.16 ADC Characteristics

5.16.2 Analog Input Characteristics (Automotive)

Test Conditions (unless otherwise specified): TA = –40–85°C; VDD = 1.8V±5%, VDDA (VA) = 3.3V±5%; kHz sine wave driven through the passive input filter (R Bandwidth is 10 Hz–20 kHz.
Fs = 96 kHz
Dynamic Range A-weighted Unweighted 40 kHz bandwidth unweighted
Total Harmonic Distortion + Noise –1 dB –20 dB –60 dB 40 kHz bandwidth –1 dB
AIN_1A/B Interchannel Isolation
AID_[2.6]A/B MUX Interchannel Isolation — 95 95 dB
DC Accuracy
Interchannel Gain Mismatch 0.1 0.1 dB
Gain Drift ±120
Analog Input
Full-scale Input Voltage
Differential Input Impedance
Single-ended Input Impedance
Common Mode Rejection Ratio (CMRR)8—60 —— — — dB
Parasitic Load Capacitance (C
1. dB units referred to the typical full-scale voltage.
2. These full-scale values were measured with R
3. The full-scale voltage can be changed by scaling R Differential Full-Scale (Vpp) = 3.7*VDDA*(Ri+200)/(10k+200)
Single-Ended Full-Scale (Vpp) = 1.85*VDDA*(Ri+200)/(10k+200)
4. Measured between AIN_xx+ and AN_xx–.
5. Measured between AIN_xx+ and AGND.
6. Decreasing full-scale voltage by reducing R
7. Common mode input current should be kept to less than ±160uA to avoid performance degradation: |(I
=10 k in the differential case.
for R
i
8. This number was measured using perfectly matched external resistors (R
(|
R
|/Ri + 0.001).
i
represents the parasitic load capacitance between Ri on the input circuit and the input pin of the CS47048 package.
9. C
L
10. This measurement is not applicable to the CS47028 and CS47024 devices.
= 10 k) in Fig. 5-13 or Fig. 5-14; DSP running test application; Measurement
i
Differential Single-ended
Parameter Min Typ Max Min Typ Max Unit
1,6,7
97
105
94
94
102
102
99
6,7
–98
–82
–42
–90
10
—95 —— 95 — dB
–90
— — —
91
— — — —
–95 –79 –39 –90
99 96
— — —
–87
— — —
dB dB dB
dB dB dB dB
±120 — ppm/°C
2,3
4
5
9
)
L
=10k for both the single-ended and differential mode input circuits.
i
.
i
causes the noise floor to increase.
i
3.3 3.7VA 3.9 1.65 1.85VA 1.95 V
PP
400 200
20 20 pF
)/2| < 160uA. This corresponds to ±1.6V
ip+Iin
). Mismatch in the external resistors typically reduces CMRR by 20 log
i
Figure 5-13. ADC Single-ended Input Test Circuit
DS787PP9 22
Figure 5-14. ADC Differential Input Test Circuit
10µF
C
L
R
i
AIN+
100K
10µF
C
L
R
i
AIN-
100K
AIN_xA-
AIN_xB-
or
AIN_xA+
AIN_xB+
or
+
+

5.16.3 ADC Digital Filter Characteristics

5.17 DAC Characteristics

Parameter
1,2
Min Typ Max Unit
Fs = 96 kHz
Passband (Frequency Response) to –0.1 dB corner 0 0.4896 Fs
Passband Ripple 0.08 dB
Stopband 0.5688 Fs
Stopband Attenuation 70 dB
Total Group Delay 12/Fs s
High-pass Filter Characteristics
Frequency Response: –3.0 dB –0.13 dB
— —
20
1
——Hz
Hz
Phase Deviation @ 20 Hz 10 Deg
Passband Ripple 0 dB
Filter Settling Time 10
1. Filter response is guaranteed by design.
2. Response is clock-dependent and scales with Fs.
5
/Fs 0 s
5.17 DAC Characteristics

5.17.1 Analog Output Characteristics (Commercial)

Test Conditions (unless otherwise specified): TA = 0–+70°C; VDD = 1.8V±5%, VDDA(VA) = 3.3V±5%; 1 kHz sine wave driven through a filter shown in Fig. 5-15 or Fig. 5-16; DSP running test application; Measurement Bandwidth is 20 Hz–20 kHz.
Differential Single-ended
Parameter Min Typ Max Min Typ Max Unit
23 DS787PP9
Fs = 96 kHz
Dynamic Range A-weighted Unweighted
Total Harmonic Distortion + Noise 0 dB –20 dB –60 dB
Interchannel Isolation (1 kHz) 95 95 dB
10299108
105——9996
–98
–88
–48
–90
— —
105 102——dBdB
–95
–85
–45
–87
— —
dB dB dB
AOUT_x+
3.3 µF
C
L
R
L
AOUT
2200 pF
560
10 k
+
5.17 DAC Characteristics
Differential Single-ended
Parameter Min Typ Max Min Typ Max Unit
Analog Input
Full-scale Output 1.20 1.40
Interchannel Gain Mismatch 0.1 0.1 dB
Gain Drift
Output Impedance 100 100
DC Current Draw from an AOUT Pin1——10——10A
AC-load Resistance (R
Load Capacitance (CL)
2
)
L
2
3——3——k
100 100 pF
VA 1.60 0.60 0.70VA 0.80 V
PP
±120 ±120 — ppm/°C

5.17.2 Analog Output Characteristics (Automotive)

Test Conditions (unless otherwise specified): TA= –40 to +85C; VDD = 1.8V±5%, VDDA(VA) = 3.3V±5%; 1 kHz sine wave driven through a filter shown in Fig. 5-15 or Fig. 5-16; DSP running test application; Measurement Bandwidth is 20 Hz–20 kHz.
Differential Single-ended
Parameter Min Typ Max Min Typ Max Unit
Fs = 96 kHz
Dynamic Range A-weighted Unweighted
Total Harmonic Distortion + Noise 0 dB –20 dB –60 dB
Interchannel Isolation (1 kHz) 95 95 dB
Analog Input
Full-scale Output 1.20 1.40
Interchannel Gain Mismatch 0.1 0.1 dB
Gain Drift
Output Impedance 100 100
DC Current Draw from an AOUT Pin1——10——10A
AC-load Resistance (R
Load Capacitance (CL)
1. Guaranteed by design. The DC current draw represents the allowed current draw from the AOUT pin due to typical leakage through the electrolytic
DC-blocking capacitors.
2. Guaranteed by design. R
stability and signal integrity. In this circuit topology, C parasitic), and effectively moves the dominant pole of the two-pole amp in the output stage. Increasing this value beyond the recommended 100 pF
can cause the internal op-amp to become unstable.
and CL reflect the recommended minimum resistance and maximum capacitance required for the internal op-amp’s
L
2
)
L
2
represents any capacitive loading that appears before the 560 series resistor (typically
L
10097108
105——9794
–98
–88
–48
–90
— —
105 102——dBdB
–95
–85
–45
–87
— —
VA 1.60 0.60 0.70VA 0.80 V
±120 ±120 — ppm/°C
3——3——k
100 100 pF
dB dB dB
PP
DS787PP9 24
Figure 5-15. DAC Single-ended Output Test Circuit
N output: RL = 4.87k + ( [2F*1800pF]
-1
|| ((2.43k + [2F*470pF]-1 ) || 4.87k ))
AOUT
AOUT_x+
AOUT_x-
1.96 k
C
L
4700 pF 1200 pF
1.96k
22 µF
+
953
4.87 k 2.43 k
-
+
560
+
1800 pF
470 pF
4.87 k
22 µF
P output: R
L
= 1.96k + ( [2F*4700pF]
-1
|| (1.96k + [2F*22µF- ]-1 ) || (953 + [2F*1200pF ]-1 ))
C
L
10 k
100
50
75
25
2.5
51015
Safe Operating
Region
Capacitive Load -- C (pF)
L
Resistive Load -- R (k)
L
125
3
20
Figure 5-16. DAC Differential Output Test Circuit
5.17 DAC Characteristics
Figure 5-17. Maximum Loading

5.17.3 Combined DAC Interpolation and On-chip Analog Filter Response

Passband (Frequency Response)
25 DS787PP9
to 0.22 dB corner to –3 dB corner
Frequency Response 10 Hz–20 kHz –0.02 +0.02 dB
StopBand 0.5465 Fs
StopBand Attenuation 100 dB
Group Delay 10/Fs s
Parameter Min Typ Max Unit
0 0
——0.4125
0.4979FsFs
6 Ordering Information
The CS470xx DSP part numbers are described as follows:
Example:
CS47048I-XYZR
where
I–ROM ID Letter
X–Product Grade
Y–Package Type
Z–Lead (Pb) Free
R–Tape and Reel Packaging
Table 6-1. Ordering Information
Part No. Grade Temp. Range Package
CS47048C-CQZ Commercial 0–+70°C 100-pin LQFP
CS47048C-DQZ Automotive –40–+85°C
CS47048C-EQZ Extended Automotive –40–+105°C
CS47028C-CQZ Commercial 0–+70°C
CS47028C-DQZ Automotive –40–+85°C
CS47028C-EQZ Extended Automotive –40–+105°C
CS47024C-CQZ Commercial 0–+70°C
CS47024C-DQZ Automotive –40–+85°C
CS47024C-EQZ Extended Automotive –40–+105°C
Note: Contact the factory for availability of the –D (automotive grade) package.

6 Ordering Information

7 Environmental, Manufacturing, and Handling Information

Table 7-1. Environmental, Manufacturing, and Handling Information
Model Number Peak Reflow Temp.
CS47048C-CQZ 260° C 3 7 days
CS47048C-DQZ
CS47048C-EQZ
CS47028C-CQZ 260° C 3 7 days
CS47028C-DQZ
CS47028C-EQZ
CS47024C-CQZ 260° C 3 7 days
CS47024C-DQZ
CS47024C-EQZ
1. Moisture Sensitivity Level as specified by IPC/JEDEC J-STD-020.
MSL
1
Rating
Max Floor Life
26 DS787PP9
8 Device Pinout Diagrams
VDD1
GND2
VDDIO1
GNDIO1
VDD2
GND1
GPIO1, DAI_DATA2, TM2
GPIO2, DAI_DATA3, TM3, SPDIF RX
GPIO16, DAI_DATA0, TM0
GPIO0, DAI_DATA1, TM1
10
15
20
25
GPIO5, DAO_DATA3, HS3, S/PDIF TXa
GPIO3, DAO_DATA1, HS1
GPIO6, DAO_DATA0, HS0
GPIO7, DAO_LRCLK
GPIO15, DAI_LRCLK
GPIO18, DAO_MCLK, HS4
GPIO17, DAI_SCLK
GPIO14, DAO_SCLK
GPIO4, DAO_DATA2, HS2, S/PDIF TXb
VDDIO2
GNDIO2
DBDA
DBCK
CS47048
100-Pin LQFP
(Thermal Pad Package )
5
1
GPIO10, SCP_MISO, SCP_SDA
GPIO9, SCP_MOSI
GPIO8, SCP_CS, DAI_DATA4
GPIO12, SCP_IRQ
GPIO13, SCP_BSY, EE_CS
GNDIO3
GND_SUB
XTAL_OUT, TEST
GND3
XTI
XTO
GNDA_PLL
PLL_REF_RES
AIN_6B-
AIN_6B+
AIN_5B-
AIN_5B+
26
GPIO11, SCP_CLK
30
VDDIO3
35VDD3
40
VDDA_PLL
45
AIN_4B-
AIN_4B+
AIN_3B-
AIN_3B+
AIN_2B-
50AIN_2B+
70
65
60
55
51
75
AIN_1B-
AIN_5A-
VQ
BIASREF_DAC
AIN_5A+
VDDA3
AIN_1A-
AIN_1B+
GNDA3
AIN_1A+
AIN_4A-
AIN_3A-
AIN_3A+
BIASREF_ADC
VDD_ADC_MON
AIN_2A-
REXT
VDDA2
AIN_4A+
AIN_2A+
GNDA2
GND_DAC
VDD_DAC
AIN_6A-
AIN_6A+
95
90
85
100
80
76
AOUT_1+
AOUT_1-
VDDA7
AOUT_2+
AOUT_2-
AOUT_3+
AOUT_3-
GNDA 6
AOUT_4+
AOUT_4-
AOUT_5+
VDDA5
GNDA 5
AOUT_6+
AOUT_6-
RESET
GNDA 7
VDDA6
AOUT_5-
AOUT_7+
AOUT_7-
VDDA4
GNDA 4
AOUT_8+
AOUT_8-

8.1 CS47048, 100-pin LQFP Pinout Diagram

8 Device Pinout Diagrams

27 DS787PP9
Figure 8-1. CS47048 Pinout Diagram

8.2 CS47028, 100-pin LQFP Pinout Diagram

VDD1
GND2
VDDIO1
GNDIO1
VDD2
GND1
GPIO1, DAI_DATA2, TM2
GPIO2, DAI_DATA3, TM3, SPDIF RX
GPIO16, DAI_DATA0, TM0
GPIO0, DAI_DATA1, TM1
10
15
20
25
GPIO5, DAO_DATA3, HS3, S/PDIF TXa
GPIO3, DAO_DATA1, HS1
GPIO6, DAO_DATA0, HS0
GPIO7, DAO_LRCLK
GPIO15, DAI_LRCLK
GPIO18, DAO_MCLK, HS4
GPIO17, DAI_SCLK
GPIO14, DAO_SCLK
GPIO4, DAO_DATA2, HS2, S/PDIF TXb
VDDIO2
GNDIO2
DBDA
DBCK
CS47028
100-Pin LQFP
(Thermal Pad Package )
5
1
GPIO10, SCP_MISO, SCP_SDA
GPIO9, SCP_MOSI
GPIO8, SCP_CS, DAI_DATA4
GPIO12, SCP_IRQ
GPIO13, SCP_BSY, EE_CS
GNDIO3
GND_SUB
XTAL_OUT, TEST
GND3
XTI
XTO
GNDA_PLL
PLL_REF_RES
AIN_6B-
AIN_6B+
AIN_5B-
AIN_5B+
26
GPIO11, SCP_CLK
30
VDDIO3
35VDD3
40
VDDA_PLL
45
AIN_4B-
AIN_4B+
AIN_3B-
AIN_3B+
AIN_2B-
50AIN_2B+
70
65
60
55
51
75
NC
AIN_5A-
VQ
BIASREF_DAC
AIN_5A+
VDDA3
NC
NC
GNDA3
NC
AIN_4A-
AIN_3A-
AIN_3A+
BIASREF_ADC
VDD_ADC_MON
AIN_2A-
REXT
VDDA2
AIN_4A+
AIN_2A+
GNDA2
GND_DAC
VDD_DAC
AIN_6A-
AIN_6A+
95
90
85
100
80
76
AOUT_1+
AOUT_1-
VDDA7
AOUT_2+
AOUT_2-
AOUT_3+
AOUT_3-
GNDA 6
AOUT_4+
AOUT_4-
AOUT_5+
VDDA5
GNDA 5
AOUT_6+
AOUT_6-
RESET
GNDA 7
VDDA6
AOUT_5-
AOUT_7+
AOUT_7-
VDDA4
GNDA 4
AOUT_8+
AOUT_8-
8.2 CS47028, 100-pin LQFP Pinout Diagram
28 DS787PP9
Figure 8-2. CS47028 Pinout Diagram

8.3 CS47024, 100-pin LQFP Pinout Diagram

VDD1
GND2
VDDIO1
GNDIO1
VDD2
GND1
GPIO1, DAI_DATA2, TM2
GPIO2, DAI_DATA3, TM3, SPDIF RX
GPIO16, DAI_DATA0, TM0
GPIO0, DAI_DATA1, TM1
10
15
20
25
GPIO5, DAO_DATA3, HS3, S/PDIF TXa
GPIO3, DAO_DATA1, HS1
GPIO6, DAO_DATA0, HS0
GPIO7, DAO_LRCLK
GPIO15, DAI_LRCLK
GPIO18, DAO_MCLK, HS4
GPIO17, DAI_SCLK
GPIO14, DAO_SCLK
GPIO4, DAO_DATA2, HS2, S/PDIF TXb
VDDIO2
GNDIO2
DBDA
DBCK
CS47024
100-Pin LQFP
(Thermal Pad Package )
5
1
GPIO10, SCP_MISO, SCP_SDA
GPIO9, SCP_MOSI
GPIO8, SCP_CS, DAI_DATA4
GPIO12, SCP_IRQ
GPIO13, SCP_BSY, EE_CS
GNDIO3
GND_SUB
XTAL_OUT, TEST
GND3
XTI
XTO
GNDA_PLL
PLL_REF_RES
AIN_6B-
AIN_6B+
AIN_5B-
AIN_5B+
26
GPIO11, SCP_CLK
30
VDDIO3
35VDD3
40
VDDA_PLL
45
AIN_4B-
AIN_4B+
AIN_3B-
AIN_3B+
AIN_2B-
50AIN_2B+
70
65
60
55
51
75
NC
AIN_5A-
VQ
BIASREF_DAC
AIN_5A+
VDDA3
NC
NC
GNDA3
NC
AIN_4A-
AIN_3A-
AIN_3A+
BIASREF_ADC
VDD_ADC_MON
AIN_2A-
REXT
VDDA2
AIN_4A+
AIN_2A+
GNDA2
GND_DAC
VDD_DAC
AIN_6A-
AIN_6A+
95
90
85
100
80
76
AOUT_1+
AOUT_1-
VDDA7
AOUT_2+
AOUT_2-
AOUT_3+
AOUT_3-
GNDA 6
AOUT_4+
AOUT_4-
NC
VDDA5
GNDA 5
NC
NC
RESET
GNDA 7
VDDA6
NC
NCNCVDDA4
GNDA 4
NC
NC
8.3 CS47024, 100-pin LQFP Pinout Diagram
29 DS787PP9
Figure 8-3. CS47024 Pinout Diagram
DS787PP9 30

9 100-pin LQFP with Exposed Pad Package Drawing

Fig. 9-1 shows the 100-pin LQFP package with exposed pad for the CS47048, CS47028, and CS47024.
Figure 9-1. 100-pin LQFP Package Drawing

10 Parameter Definitions

10Parameter Definitions

10.1 Dynamic Range

The ratio of the RMS value of the signal to the RMS sum of all other spectral components over the specified bandwidth. Dynamic Range is a signal-to-noise ratio measurement over the specified bandwidth made with a -60 dBFS signal. 60 dB is added to resulting measurement to refer the measurement to full-scale. This technique ensures that the distortion components are below the noise level and do not affect the measurement. This measurement technique has been accepted by the Audio Engineering Society, AES17-1991, and the Electronic Industries Association of Japan, EIAJ CP-307. Expressed in decibels.

10.2 Total Harmonic Distortion + Noise

The ratio of the RMS value of the signal to the RMS sum of all other spectral components over the specified bandwidth (typically 10 Hz–20 kHz), including distortion components. Expressed in decibels. Measured at –1 and –20 dBFS as suggested in AES17-1991 Annex A.

10.3 Frequency Response

A measure of the amplitude response variation from 10 Hz–20 kHz relative to the amplitude response at 1 kHz. Units in decibels.

10.4 Interchannel Isolation

A measure of crosstalk between the left and right channels. Measured for each channel at the converter’s output with no signal to the input under test and a full-scale signal applied to the other channel. Units in decibels.

10.5 Interchannel Gain Mismatch

The gain difference between left and right channels. Units in decibels.

10.6 Gain Error

The deviation from the nominal full-scale analog output for a full-scale digital input.

10.7 Gain Drift

The change in gain value with temperature. Units in ppm/°C.
31 DS787PP9

11 Revision History

11Revision History
Revision Date Changes
PP1 August, 2009 Updated Characterization data in Section 5.4, Section 5.7, Section 5.9, Section 5.11, Section 5.12,
PP2 January, 2010 Updated TDM Feature description on page 1. Modified note at the bottom of the feature list on page 1.
PP3 June, 2010 Ta b le 3 -1 : Straddled all three columns in the “Supports Different Fs Sample Rates” row to indicate that
PP4 February, 2011 Added “Decoder” information to Section 3. Changed the name of the core to “Cirrus Logic 32-bit core”.
PP5 February, 2011 Added “SPDIF RX” to Fig. 5-17.
PP6 June, 2011 In Section 4.3.1 and Section 4.3.7, removed mention of 192 kHz sampling frequency. Updated temperature
PP7 April, 2012 Corrected peak reflow temperature in Ta bl e 7- 1 .
PP8 June, 2012 Added number of bits to Integrated DAC and ADC Functionality on the cover page.
PP9 July, 2012 Updated frequencies in Section 5.2. Added extended automotive grade information to Section 6 and
Section 5.16.1, Section 5.16.2, Section 5.16.3, Section 5.17.1, and Section 5.17.2. Modified Footnote 3 in
both Section 5.16.1 and Section 5.16.2. Added Footnote 5 to Section 5.14. Updated Section 2.1. Modified
Section 4.3.6 and Section 4.3.8. Modified references to TDM in various sections of the data sheet.
Updated table in Section 5.8, specifying performance data for 2- and 4-layer boards. Updated Tab l e 3 -1 and
Ta bl e 3 - 2 Updated block diagrams in Fig. 4-1, Fig. 4-2, and Fig. 4-3.
CS47024 devices have the same features as the CS47048 and CS47028. Added “The CS47024 has the 8-channel SRC block” to Section 4.3.7. Added text in the following places to indicate that the CS47024 implements the S/PDIF Rx functionality:
• Removed dagger from the S/PDIF Rx bullet on p. 1.
• Updated bullet in “Configurable Serial Audio Inputs/Outputs” row in Table 2 Integrated 192 kHz S/PDIF Rx, 2 Integrated 192 kHz S/PDIF Tx.
• Changed entry in “S/PDIF In (Stereo Pairs)” column in Tab l e 3 -2 .
• Updated I2S block in Table 3-2.
• Removed text “On the CS47048 and CS47028...” from Section 4.3.4.
• Removed “(Not available on CS47024)” from the heading to Section 5.15.
• Described additional support for TDM 8-channel output mode on CS47024.
• Removed dagger from the TDM I/O bullet on p. 1.
• Straddled “Configurable Serial Audio Inputs/Outputs” row in Tab le 3- 1 .
• Changed cell in “TDM Out” column in Table 3-2.
• Removed text “On the CS47048 and CS47028...” from Section 4.3.5.
operating conditions in Section 5.2. Updated pin 33 to XTAL_OUT, TEST in Fig. 8-1, Fig. 8-2, and Fig. 8-3.
Section 7.
DS787PP9 32
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