300,000,000 MAC/S (multiply accumulates per second)
Dual MAC cycles per clock
72-bit accumulators are the highest precision in the
industry
32K x 32-bit SRAM with three 2K blocks assignable to
either Y data or program memory
Integrated DAC and ADC Functionality
†
8
Channels of 24-bit DAC output: 108dB DR, –98 dB
THD+N
†
4
Channels of 24-bit ADC input: 105dB DR, –98 dB
THD+N
Integrated 5:1 analog mux feeds one stereo ADC
Configurable Serial Audio Inputs and Outputs
Integrated 192 kHz S/PDIF Rx
Integrated 192 kHz S/PDIF Tx
Supports 32-bit serial data @ 192 kHz
Supports 32-bit audio sample I/O between DSP chips
TDM I/O modes
Supports Different Sample Rates (Fs)
Three integrated hardware SRC blocks
Output can be master or slave
Supports dual-domain Fs on S/PDIF vs. I²S inputs
DSP Tool Set with Private Keys Protect Customer IP
Integrated Clock Manager/PLL
Flexibility to operate from internal PLL, external crystal,
external oscillator
Input Fs Auto Detection w/ µC Acknowledgement
The CS470xx family is a new generation of audio
system-on-a-chip (ASOC) processors targeted at high
fidelity, cost sensitive designs. Derived from the highly
successful CS48500 32-bit fixed-point audio enhancement
processor family, the CS470xx further simplifies system
design and reduces total system cost by integrating the S/
PDIF Rx, S/PDIF Tx, analog inputs, analog outputs, and
SRCs. For example, a hardware SRC can down-sample a
192 kHz S/PDIF stream to a lower Fs to reduce memory
and MIPS requirements for processing. This integration
effectively reduces the chip count from 3 to 1, which allows
smaller, less expensive board designs.
Target applications include:
Automotive head units and outboard amplifiers
Automotive processors and automotive integration hubs
The CS470xx is programmed using the simple yet powerful
Cirrus proprietary DSP Composer™ GUI development and
pre-production tuning tool. Processing chains can be
designed using a drag-and-drop interface to place/utilize
functional macro audio DSP primitives and custom audio
filtering blocks. The end result is a software image that is
downloaded to the DSP via serial control port.
The Cirrus Framework™ programming environment offers
Assembly and C language compilers and other software
development tools for porting existing code to the CS470xx
family platform.
The CS470xx is available in a 100-pin LQFP package with
exposed pad for better thermal characteristics. Both
Commercial (0°C to +70°C) and Automotive (–40°C to
+85°C) temperature grades.
Host Control and Boot via I²C™ or SPI™ Serial Interface
Configurable GPIOs and External Interrupt Input
1.8V Core and a 3.3V I/O that is tolerant to 5V input
Low-power Mode
†”
“
features differ on CS47024, CS47028, or CS47048.
See Table 3-1.
Copyright Cirrus Logic, Inc. 2012
http://www.cirrus.com
(All Rights Reserved)
Ordering Information:
See Section 6 for ordering information.
DS787PP9
JUL '12
x8
x4
x2
x2
DAC0
text
Coyote 32-bit Core
in the CS47048 DSP
DMA
SPI / I2C
Control
I2S
ADC0/1
I2S
I2S / S/PDIF
PLL
ROM
S
R
C
2
Peripheral Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC1
DAC2
DAC3
DAC4
DAC5
DAC6
DAC7
MUX
S
R
C
1
ROM
RAM
ROM
RAM
P
Y
32K x 32-bit SRAM with three 2K blocks
Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs
On Analog in
ADC2/3
DBC
(I2C Slave)
PIC
ADC’s & DAC’s operate
in Single ended or
Differential mode
S
R
C
3
8ch
8ch
SRC3 has 8
independent Channels
for In or Out
4ch
DS787PP92
CS47048 Block Diagram
Contacting Cirrus Logic Support
For all product questions and inquiries, contact a Cirrus Logic Sales Representative.
To find the one nearest you, go to www.cirrus.com.
IMPORTANT NOTICE
Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) believe that the information contained in this document is accurate and reliable. However, the information is subject to change
without notice and is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify,
before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order
acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus for the use of this information,
including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document is the property
of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other
intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for
use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent does not extend to other copying such as copying for general
distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR
ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN PRODUCTS
SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS.
INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK AND CIRRUS DISCLAIMS AND MAKES
NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR
PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER’S CUSTOMER USES OR PERMITS
THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS,
EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT FROM OR
ARISE IN CONNECTION WITH THESE USES.
Cirrus Logic, Cirrus, the Cirrus Logic logo designs, Framerwork, and DSP Composer are trademarks of Cirrus Logic, Inc. All other brand and product names in this document
may be trademarks or service marks of their respective owners.
SPI is a trademark of Motorola, Inc.
I²C is a trademark of Philips Semiconductor.
Dolby, Pro Logic, Dolby Headphone, Virtual Speaker and the double-D symbol are registered trademarks of Dolby Laboratories, Inc. Supply of an implementation of Dolby
Technology does not convey a license nor imply a right under any patent, or any other industrial or Intellectual Property Right of Dolby Laboratories, to use the Implementation
in any finished end-user or ready-to-use final product. It is hereby notified that a license for such use is required from Dolby Laboratories.
SRS CircleSurround II technology is incorporated under license from SRS Labs, Inc. The SRS Circle Surround II technology/solution rights incorporated in the Cirrus Logic
CS470xx products are owned by SRS Labs, a U.S. Corporation and licensed to Cirrus Logic, Inc. Purchaser of the Cirrus Logic CS470xx products must sign a license for use
of the chip and display of the SRS Labs trademarks. Any products incorporating the Cirrus Logic CS470xx products must be sent to SRS Labs for review. SRS CircleSurround
II is protected under US and foreign patents issued and/or pending. SRS Circle Surround II, SRS and (O) symbol are trademarks of SRS Labs, Inc. in the United States and
selected foreign countries. Neither the purchase of the Cirrus Logic CS470xx products, nor the corresponding sale of audio enhancement equipment conveys the right to sell
commercialized recordings made with any SRS technology/solution. SRS Labs requires all set makers to comply with all rules and regulations as outlined in the SRS
Trademark Usage Manual.
3DS787PP9
1 Documentation Strategy
1Documentation Strategy
The CS470xx Data Sheet describes the CS47048, CS47028, and CS47024 audio processors. This document should be
used in conjunction with the following documents when evaluating or designing a system around the CS470xx processors.
Table 1-1. CS470xx Related Documentation
Document NameDescription
CS470xx Data SheetThis document
CS470xx Hardware User’s Manual GuideIncludes detailed system design information such as typical connection diagrams, boot-proce-
AN333 - CS470xx Firmware User’s Manual Includes a list of firmware modules available on the CS470xx family platform and detailed firm-
DSP Composer User’s ManualIncludes detailed configuration and usage information for the GUI development tool
CDB470xx User’s ManualIncludes detailed instructions on the use of the CDB470xx development board
dures, and pin descriptions
ware design information including signal processing flow diagrams and control API information
The scope of the CS470xx Data Sheet is primarily the hardware specifications of the CS470xx family of devices. This
includes hardware functionality, characteristic data, pinout, and packaging information.
The intended audience for the CS470xx Data Sheet is the system PCB designer, MCU programmer, and the quality control
engineer.
2Overview
The CS470xx DSP is designed to provide high-performance post-processing and mixing of analog and digital audio. Dual
clock domains are supported when the DAI and SPDIF RX inputs are used together. Integrated sample rate converters
(SRCs) allow audio streams with different sample rates to be mixed. The low-power standby preserves battery life for
applications that are always on, but not necessarily processing audio, such as automotive audio systems.
The CS470xx uses voltage-out DACs and is capable of supporting dual input clock domains through the use of the internal
SRCs. The CS470xx is available in a 100-pin LQFP package. Refer to Table 3-1 and Table 3-2 for the input, output, and
firmware configurations for the CS470xx DSP.
2.1 Licensing
Licenses are required for any third-party audio processing algorithms provided for the CS470xx. Contact your local Cirrus
Logic Sales representative for more information.
DS787PP94
3 Code Overlays
3Code Overlays
The suite of software available for the CS470xx family consists of an operating system (OS) and a library of overlays. The
software components for the CS470xx family include:
1. OS/Kernel—Encompasses all non-audio processing tasks, including loading data from external serial memory,
processing host messages, calling audio-processing subroutines, error concealment, etc.
2. Decoder—Any module that performs a compressed audio decode on IEC61937-packed data delivered via S/PDIF
Rx or I²S input, such as Dolby Digital (AC3).
3. Matrix-processor—Any Module that performs a matrix decode on PCM data to produce more output channels than
input channels (2Æn channels). Examples are Dolby
speaking, these modules increase the number of valid channels in the audio I/O buffer.
4. Virtualizer-processor—Any module that encodes PCM data into fewer output channels than input channels (nÆ2
channels) with the effect of providing “phantom” speakers to represent the physical audio channels that were
eliminated. Examples are Dolby Headphone
modules reduce the number of valid channels in the audio I/O buffer.
5. Post-processors—Any module that processes audio I/O buffer PCM data. Examples are bass management, audio
manager, tone control, EQ, delay, customer-specific effects, and any post-processing algorithms available for the
CS470xx DSP.
The bulk of standard overlays are stored in ROM within the CS470xx, but a small image is required to configure the
overlays and boot the DSP. This small image can either be stored in an external serial flash/EEPROM, or downloaded via
a host controller through the SPI/I²C serial port.
®
2 and Dolby® Virtual Speaker® 2. Generally speaking, these
®
Pro Logic® IIx and SRS Circle Surround II®. Generally
The overlay structure reduces the time required to reconfigure the DSP when a processing change is requested. Each
overlay can be reloaded independently without disturbing the other overlays. For example, when a different post-processor
is selected, the OS, does not need to be reloaded—only the new post-processor.
Table 3-1 lists the different configuration options available. Refer to the CS470xx Firmware User’s Manual for the latest
listing of application codes and Cirrus Framework™ modules available. See Table 3-2, which provides a summary of the
available channels for each type of input and output communication mode for members of the CS470xx family of DSPs.
5DS787PP9
Table 3-1. CS470xx Device Selection Guide
3 Code Overlays
Features
Primary Applications • 4-In/8-Out Car Audio
Package100-pin LQFP with Exposed Pad
DSP CoreCirrus Logic 32-bit Core
SRAM32K x 32-bit SRAM with three 2K blocks x 32-bit SRAM, assignable to either Y data or program memory
Integrated DAC and ADC • 2 Channels of ADC input: with inte-
Configurable Serial Audio
Inputs/Outputs
Supports Different Fs
Sample Rates
Other Features • Integrated Clock Manager/PLL with flexibility to operate from internal PLL, external crystal, external oscillator
• Integrated hardware SRC blocks for all ADC and DAC channels
• Additional 8-channel hardware SRC block
• Dual-domain Fs on inputs (I2S and S/PDIF Rx)
• Output can be master or slave
• Host Control and Boot via SPI/I²C Serial Interface
• DSP Tool Set w/ Private Keys Protect Customer IP
• Configurable GPIOs and External Interrupts
• Hardware Watchdog Timer
CS47048-CQZ
CS47048-DQZ
• 2-In/8-Out Car Audio
• Sound Bar
•DVD Receiver
• 2 channels of ADC input: with inte-
grated 5:1 analog mux
• 8 channels of DAC output
put: without mux
CS47028-CQZ
CS47028-DQZ
grated 5:1 analog mux
CS47024-CQZ
CS47024-DQZ
• 2-In/4-Out Car Audio
• Digital TV
• Portable Audio Docking Station
• Portable DVD
• DVD Mini / Receiver
• Multimedia PC Speakers
• 2 channels of ADC input: with integrated 5:1 analog mux
• 4 channels of DAC output
T able 3-2. CS470xx Channel Count
Product
CS47048 • Up to 5 I2S lines, 2 channels per
line or
• 1 TDM line, up to 8 channels per
line.
CS47028 • Up to 5 I2S lines, 2 channels per
line or
• 1 TDM line, up to 8 channels per
line.
CS47024 • Up to 5 I2S lines, 2 channels per
line or
• 1 TDM line, up to 8 channels per
line.
1. Contact your Cirrus Logic representative to determine the TDM modes that are supported. The CS470xx can support up to 8 channels per line, but
the DSP software provided for the IC can restrict this capability.
PCM/TDM In
1
TDM Out
Up to 8 channels
Up to 8 channels
Up to 8 channels
PCM
1
Out
ADC with 5:1
Input Mux
822812
820812
820412
ADC with-
out Mux
DAC
Out
S/PDIF In
(Stereo
Pairs)
S/PDIF
Out (Ste-
reo Pairs)
DS787PP96
x8
x4
x2
x2
DAC0
text
32-bit Core
in the CS47048 DSP
DMA
SPI / I2C
Control
I2S
ADC0 /1
I2S
I2S / S/PDIF
PLL
ROM
S
R
C
2
Periphe r al Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC1
DAC2
DAC3
DAC4
DAC5
DAC6
DAC7
MUX
S
R
C
1
ROM
RAM
ROM
RAM
P
Y
32K x 32-b i t S RA M wi th thr ee 2K blo cks
Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs
On Analog in
ADC2/ 3
DBC
(I2C Slave )
PIC
ADC’s & DA C’s ope r at e
in Single ended or
Di fferen ti al mo d e
S
R
C
3
8ch
8ch
SRC3 h as 8
independent Channels
for In or Out
4ch
4 Hardware Functional Description
4Hardware Functional Description
The CS470xx family, which includes the CS47048, CS47028, and CS47024 DSPs, is a true system-on-a-chip that
combines a powerful 32-bit DSP engine with analog/digital audio inputs and analog/digital audio outputs. It can be
integrated into a complex multi-DSP processing system, or stand alone in an audio product that requires analog-in and
analog-out. A top level block diagram for the CS47048, CS47028, and CS47024 products are shown in Fig. 4-1, Fig. 4-2,
and Fig. 4-3 respectively.
7DS787PP9
Figure 4-1. CS47048 Top-level Block Diagram
x8
x4
x2
x2
DAC0
text
32-bit Core
in the CS47028 DSP
DMA
SPI / I2C
Control
I2S
I2S
I2S / S/PDIF
PLL
ROM
S
R
C
2
Peripheral Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC1
DAC2
DAC3
DAC4
DAC5
DAC6
DAC7
MUX
S
R
C
1
ROM
RAM
ROM
RAM
P
Y
32K x 32-b i t S RA M wi th thr ee 2K blo cks
Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs
On Analog in
ADC2/ 3
DBC
(I2C Slave )
PIC
ADC’s & DA C’s ope r at e
in Single ended or
Di fferen ti al mo d e
S
R
C
3
8ch
8ch
SRC3 h as 8
independent Channels
for In or Out
4ch
x8
x4
x2
x2
text
32-bit Core
in the CS47024 DSP
DMA
SPI / I2C
Control
I2S
I2S
I2S / S/PDIF
PLL
ROM
S
R
C
2
Peripheral Bus
Clock
Manager
Timers
RAM
X
GPIO
DAC0
DAC1
DAC2
DAC3
MUX
S
R
C
1
ROM
RAM
ROM
RAM
P
Y
32K x 32-b i t S RA M wi th thr ee 2K blo cks
Assignable to Program or Y Data memory
Memory Bus
I2S /
S/PDIF
Stereo Inputs
On Analog in
ADC2/ 3
DBC
(I2C Slave )
PIC
ADC’s & DA C’s ope r at e
in Single ended or
Di fferen ti al mo d e
S
R
C
3
8ch
8ch
SRC3 h as 8
independent Channels
for In or Out
4ch
4 Hardware Functional Description
DS787PP98
Figure 4-2. CS47028 Top-level Block Diagram
Figure 4-3. CS47024 Top-level Block Diagram
4.1 Cirrus Logic 32-bit DSP Core
4.1 Cirrus Logic 32-bit DSP Core
The CS470xx comes with a Cirrus Logic 32-bit core with separate X and Y data and P code memory spaces. The DSP
core is a high-performance, 32-bit, user-programmable, fixed-point DSP that is capable of performing two
multiply-and-accumulate (MAC) operations per clock cycle. The DSP core has eight 72-bit accumulators, four X-data and
four Y-data registers, and 12 index registers.
The DSP core is coupled to a flexible 8-channel DMA engine. The DMA engine can move data between peripherals such
as the serial control port (SCP), digital audio input (DAI) and digital audio output (DAO), sample rate converters (SRC),
analog-to-digital converters (ADC), digital-to-analog converters (DAC), or any DSP core memory, all without the
intervention of the DSP. The DMA engine off-loads data move instructions from the DSP core, leaving more MIPS
available for signal processing instructions.
CS470xx functionality is controlled by application codes that are stored in on-chip ROM or downloaded to the CS470xx
from a host controller or external serial flash/EEPROM.
Users can develop applications using the DSP Composer™ tool to create the processing chain and then compile the
image into a series of commands that are sent to the CS470xx through the SCP. The processing application can either
load modules (post-processors) from the DSPs on-chip ROM, or custom firmware can be downloaded through the SCP.
The CS470xx is suitable for a variety of audio post-processing applications where sound quality via sound enhancement
and speaker/cabinet tuning is required to achieve the sound quality consumers expect. Examples of such applications
include automotive head-ends, automotive amplifiers, docking stations, sound bars, subwoofers, and boom boxes.
4.2 DSP Memory
The DSP core has its own on-chip data and program RAM and ROM and does not require external memory for
post-processing applications.
The Y-RAM and P-RAM share a single block of memory that includes three 2K word blocks (32 bits/word) that are
assignable to either Y-RAM or P-RAM as shown in Table 4.
Table 4-1. Memory Configurations for the C470xx
P-RAMX-RAMY-RAM
14K words 10K words8K words
12K words 10K words10K words
10K words 10K words12K words
8K words 10K words14K words
4.2.1DMA Controller
The powerful 8-channel DMA controller can move data between 8 on-chip resources. Each resource has its own arbiter:
X, Y, and P RAMs/ROMs and the peripheral bus. Modulo and linear addressing modes are supported, with flexible start
address and increment controls. The service intervals for each DMA channel, as well as up to 6 interrupt events, are
programmable.
4.3 On-chip DSP Peripherals
4.3.1Analog to Digital Converter Port (ADC)
The ADCs in the CS470xx devices feature dynamic range performance in excess of 100 dB. See Section 5.16 for more
details on CS470xx ADC performance. The CS47024 and CS47028 devices support up to 2 simultaneous channels of
analog-to-digital conversion with the input source selectable using an integrated 5:1 stereo analog mux (analog inputs
AIN_2A/B through AIN_6A/B). The CS47048 device adds a second pair of ADCs that are directly connected to input pins
AIN_1A/B providing a total of 4 simultaneous channels of analog-to-digital conversion. This feature gives the CS47048 the
ability to select from a total of six stereo pairs of analog input. A single programmable bit selects single-ended or differential
mode signals for all inputs. The conversions are performed with Fs=96 kHz.
9DS787PP9
4.3 On-chip DSP Peripherals
4.3.2Digital to Analog Converter Port (DAC)
The DACs in the CS470xx devices feature dynamic range performance in excess of 100 dB. See Section 5.17 for more
details on CS470xx DAC performance. The CS47024 device supports four simultaneous channels of digital-to-analog
conversion. The CS47028 and CS47048 devices provide eight simultaneous channels of digital-to-analog conversion. The
DACs have voltage mode outputs that can be connected either as single-ended or differential signals. The conversions
are performed with Fs=96 kHz.
4.3.3Digital Audio Input Port (DAI)
The input capabilities for each version of the CS470xx are summarized in Table 3-1 and Table 3-2.
Up to five DAI ports are available. Two of the DAI ports can be programmed to implement other functions. If the SPI mode
is used, the DAI_DATA4 pin becomes the SCP_CS input. The integrated S/PDIF receiver can be used to take over the
DAI_DATA3 pin.
The DAI port PCM inputs have a single slave-only clock domain. The S/PDIF receiver, if used, is a separate clock domain.
The output of the S/PDIF Rx can then be converted through one of the internal SRC blocks to synchronize with the PCM
input. The sample rate of the input clock domains can be determined automatically by the DSP, off-loading the task of
monitoring the S/PDIF Rx from the host. A time-stamping feature provides the ability to also sample-rate convert the input
data via software.The DAI port supports PCM format with word lengths up to 32 bits and sample rates as high as 192 kHz.
The DAI also supports a time division multiplexed (TDM) mode that packs up to 10 PCM audio channels on a single data
line.
4.3.4S/PDIF RX Input Port (DAI)
One of the PCM pins of the DAI can also be used as a DC-coupled, TTL-level S/PDIF Rx input capable of receiving and
demodulating bi-phase encoded S/PDIF signals with Fs <
192 kHz.
4.3.5Digital Audio Output Port (DAO)
DAO port supports PCM resolutions of up to 32-bits. The port supports sample rates (Fs) as high as 192 kHz. The port
can be configured as an independent clock domain mastered by the DSP, or as a clock slave if an external MCLK or SCLK/
LRCLK source is available.
The DAO also supports a time division multiplexed (TDM) mode, that packs up to 8 channels of PCM audio on a single
data line.
4.3.6S/PDIF TX Output Port (DAO)
Two of the serial audio pins can be re-configured as S/PDIF TX pins that drive a bi-phase encoded S/PDIF signal (data
with embedded clock on a single line).
4.3.7Sample Rate Converters (SRC)
All CS470xx devices have at least two internal hardware SRC modules. One is directly associated with the ADCs and
normally serves to convert data from the 96 kHz sampling rate of the ADCs to another Fs appropriate for mixing with other
audio in the system.
The other SRC module is directly associated with the DACs and normally serves to convert data from the DSP into the 96
kHz sample rate needed by the DACs.
The CS47024, CS47028, and CS47048 devices have an additional stand-alone 8-channel SRC module. This SRC module
can be used to make independent input clock domains synchronous (different Fs on PCM input and S/PDIF Rx).
DS787PP910
4.4 DSP I/O Description
4.3.8Serial Control Port (I2C or SPI)
The on-chip serial control port is capable of operating as master or slave in either SPI or I2C modes. Master/Slave
operation is chosen by mode select pins when the CS470xx comes out of reset. The serial clock pin can support
frequencies as high as 25 MHz in SPI mode (SPI clock speed must always be <
serial control port also includes a pin for flow control of the communications interface (SCP_BSY) and a pin to indicate
when the DSP has a message for the host (SCP_IRQ).
(DSP Core Frequency/2)). The CS470xx
4.3.9GPIO
Many of the CS470xx peripheral pins are multiplexed with GPIO. Each GPIO can be configured as an output, an input, or
an input with interrupt. Each input-pin interrupt can be configured as rising edge, falling edge, active-low, or active-high.
4.3.10PLL-based Clock Generator
The low-jitter PLL generates integer or fractional multiples of a reference frequency, which is used to clock the DSP core
and peripherals. Through a second PLL divider chain, a dependent clock domain can be output on the DAO port for driving
audio converters. The CS470xx defaults to running from the external reference frequency and is switched to use the PLL
output after overlays have been loaded and configured, either through master boot from an external flash or through host
control. A built-in crystal oscillator circuit with a buffered output is provided. The buffered output frequency ratio is
selectable between 1:1 (default) or 2:1.
4.3.11Hardware Watchdog Timer
The CS470xx has an integrated watchdog timer that acts as a “health” monitor for the DSP. The watchdog timer must be
reset by the DSP before the counter expires, or the entire chip is reset. This peripheral ensures that the CS470xx resets
itself in the event of a temporary system failure. In stand-alone mode (where there is no host MCU), the DSP reboots from
external flash. In slave mode (where the host MCU is present), a GPIO is used to signal the host that the watchdog has
expired and the DSP should be rebooted and re-configured.
4.4 DSP I/O Description
4.4.1Multiplexed Pins
Many of the CS470xx pins are multifunctional. For details on pin functionality, see Section 10.5, “Pin Assignments”, in the
CS470xx Hardware User’s Manual.
4.4.2Termination Requirements
Open-drain pins on the CS470xx must be pulled high for proper operation. See the CS470xx Hardware User’s Manual to
identify which pins are open-drain and what value of pull-up resistor is required for proper operation.
Mode select pins on CS470xx are used to select the boot mode on the rising edge from reset. A detailed explanation of
termination requirements for each communication mode select pin can be found in the CS470xx Hardware User’s Manual.
4.4.3Pads
The CS470xx Digital I/Os operate from the 3.3 V supply and are 5 V tolerant.
4.5 Application Code Security
The external program code can be encrypted by the programmer to protect any intellectual property it contains. A secret,
customer-specific key is used to encrypt the program code that is to be stored external to the device. Contact your local
Cirrus representative for details.
11DS787PP9
5 Characteristics and Specification s
5Characteristics and Specifications
Note:All data sheet minimum and maximum timing parameters are guaranteed over the rated voltage and temperature.
All data sheet typical parameters are measured under the following conditions: T = 25°C, VDD = 1.8 V, VDDIO =
VDDA = 3.3 V, GND = GNDIO = GNDA = 0 V.
5.1 Absolute Maximum Ratings
(GND = GNDIO = GNDA = 0V; all voltages with respect to 0V)
ParameterSymbolMinMaxUnit
DC power supplies:
Core supply
Analog supply
I/O supply
|VDDA–VDDIO|
Input pin current, any pin except supplies I
Input voltage on PLL_REF_RESV
Input voltage on digital I/O pinsV
Analog Input VoltageV
Storage temperatureT
WARNING: Operation at or beyond these limits can result in permanent damage to the device. Normal operation is not
guaranteed at these extremes.
VDD
VDDA
VDDIO
in
filt
inio
in
stg
–0.3
–0.3
–0.3
—
—±10mA
–0.33.6V
–0.35.0V
AGND–0.7 VA+0.7V
–65150°C
2.0
3.6
3.6
0.3
V
V
V
V
5.2 Recommended Operating Conditions
(GND = GNDIO = GNDA = 0V; all voltages with respect to 0V)
ParameterSymbol Min Typ Max Unit
DC power supplies:
Core supply
Analog supply
I/O supply
|VDDA – VDDIO|
Note:It is recommended that the 3.3 V IO supply come up ahead of or simultaneously with the 1.8 V core supply.
5.3 Digital DC Characteristics
(Measurements performed under static conditions.)
ParameterSymbolMinTypMaxUnit
High-level input voltageV
Low-level input voltage, except XTIV
Low-level input voltage, XTIV
Input HysteresisV
High-level output voltage (I
Low-level output voltage (I
Input leakage XTII
Input leakage current (all digital pins with internal
pull-up resistors enabled)
= –2mA), except XTOV
O
= 2mA), except XTOV
O
I
IH
IL
ILKXTI
hys
OH
OL
LXTI
LEAK
2.0——V
——0.8V
——0.6V
—0.4— V
VDDIO*0.9 ——V
—— VDDIO*0.1V
—— 5 μA
——70μA
DS787PP912
5.4 Power Supply Characteristics
Note:Measurements performed under operating conditions
ParameterMin Typ Max Unit
Operational Power Supply Current:
VDD: Core and I/O operating
VDDA: PLL operating current
VDDA: DAC operating current (all 8 channels enabled)
VDDA: ADC operating current (all 4 channels enabled)
VDDIO: With most ports operating
1
5.4 Power Supply Characteristics
—
325
—
—
—
—
—
16
56
34
27
—
—
—
—
mA
mA
mA
mA
mA
Total Operational Power Dissipation:
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLLs halted
VDDA: DAC disabled
VDDA: ADC disabled
VDDIO: All connected I/O pins 3-stated by other ICs in system
Total Standby Power Dissipation:
1. Dependent on application firmware and DSP clock speed.
5.5 Thermal Data (100-pin LQFP with Exposed Pad)
ParameterSymbol Min Typ MaxUnit
Thermal Resistance (Junction to Ambient)
Two-layer Board
Four-layer Board
Thermal Resistance (Junction to Top of Package)
Two-layer Board
Four-layer Board
1
2
1
2
1. To calculate the die temperature for a given power dissipation:
= Ambient temperature + [ (Power Dissipation in Watts) * ja ]
j
2. To calculate the case temperature for a given power dissipation:
= j - [ (Power Dissipation in Watts) * jt ]
c
ja
jt
1025
—
410
—
26
—
40
—
24
—
215
1745
——3418—
——0.54
—
.28——
—
—
—
—
—
mW
μA
μA
μA
μA
μA
μW
°C/Watt
°C/Watt
Note:Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top and bottom layers.
Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the
top and bottom layers and 0.5-oz. copper covering 90% of the internal power plane and ground plane layers.
5.6 Digital Switching Characteristics–RESET
ParameterSymbol Min Max Unit
RESET minimum pulse width low
All bidirectional pins high-Z after RESET
Configuration pins setup before RESET
Configuration pins hold after RESET
1. The rising edge of RESET must not occur before the power supplies are stable at the recommended operating values as described in Section 5.2. In
addition, for the configuration pins to be read correctly, the RESET
Test Conditions (unless otherwise specified): TA = 0–+70°C; VDD = 1.8V±5%, VDDA (VA) = 3.3V±5%, 1kHz sine wave
driven through the passive input filter (R
Bandwidth is 10–20kHz.
Fs = 96 kHz
Dynamic Range
A-weighted
Unweighted
40 kHz bandwidth unweighted
Total Harmonic Distortion + Noise
–1 dB
–20 dB
–60 dB
40 kHz bandwidth –1 dB
7. Common mode input current should be kept to less than ±160uA to avoid performance degradation: |(I
=10 k in the differential case.
for R
i
8. This number was measured using perfectly matched external resistors (R
(|
R
|/Ri + 0.001).
i
represents the parasitic load capacitance between Ri on the input circuit and the input pin of the CS47048 package.
9. C
L
10. This measurement is not applicable to the CS47028 and CS47024 devices.
= 10 k) in Fig. 5-13 or Fig. 5-14; DSP running test application; Measurement
i
DifferentialSingle-ended
ParameterMinTypMax MinTypMaxUnit
1,6,7
99
105
—
96
96
102
102
—
—
99
6,7
—
–98
—
–82
—
–42
—
–90
10
—95 —— 95 — dB
—
–92
—
—
—
93
—
—
—
—
—
–95
–79
–39
–90
99
96
—
—
—
–89
—
—
—
dB
dB
dB
dB
dB
dB
dB
±120—— ±120— ppm/°C
2,3
4
5
9
)
L
=10k for both the single-ended and differential mode input circuits.
i
.
i
causes the noise floor to increase.
i
3.3 3.7•VA 3.9 1.65 1.85•VA 1.95V
PP
—400————
————200—
——20——20pF
)/2| < 160uA. This corresponds to ±1.6V
ip+Iin
). Mismatch in the external resistors typically reduces CMRR by 20 log
i
21DS787PP9
10µF
C
L
R
i
AIN
100K
AIN_xA+
AIN_xB+
or
+
5.16 ADC Characteristics
5.16.2Analog Input Characteristics (Automotive)
Test Conditions (unless otherwise specified): TA = –40–85°C; VDD = 1.8V±5%, VDDA (VA) = 3.3V±5%; kHz sine wave
driven through the passive input filter (R
Bandwidth is 10 Hz–20 kHz.
Fs = 96 kHz
Dynamic Range
A-weighted
Unweighted
40 kHz bandwidth unweighted
Total Harmonic Distortion + Noise
–1 dB
–20 dB
–60 dB
40 kHz bandwidth –1 dB
7. Common mode input current should be kept to less than ±160uA to avoid performance degradation: |(I
=10 k in the differential case.
for R
i
8. This number was measured using perfectly matched external resistors (R
(|
R
|/Ri + 0.001).
i
represents the parasitic load capacitance between Ri on the input circuit and the input pin of the CS47048 package.
9. C
L
10. This measurement is not applicable to the CS47028 and CS47024 devices.
= 10 k) in Fig. 5-13 or Fig. 5-14; DSP running test application; Measurement
i
DifferentialSingle-ended
ParameterMinTypMax MinTypMaxUnit
1,6,7
97
105
—
94
94
102
102
—
—
99
6,7
—
–98
—
–82
—
–42
—
–90
10
—95 —— 95 — dB
—
–90
—
—
—
91
—
—
—
—
—
–95
–79
–39
–90
99
96
—
—
—
–87
—
—
—
dB
dB
dB
dB
dB
dB
dB
±120— ppm/°C
2,3
4
5
9
)
L
=10k for both the single-ended and differential mode input circuits.
i
.
i
causes the noise floor to increase.
i
3.3 3.7•VA 3.9 1.65 1.85•VA 1.95V
PP
—400————
————200—
——20——20pF
)/2| < 160uA. This corresponds to ±1.6V
ip+Iin
). Mismatch in the external resistors typically reduces CMRR by 20 log
i
Figure 5-13. ADC Single-ended Input Test Circuit
DS787PP922
Figure 5-14. ADC Differential Input Test Circuit
10µF
C
L
R
i
AIN+
100K
10µF
C
L
R
i
AIN-
100K
AIN_xA-
AIN_xB-
or
AIN_xA+
AIN_xB+
or
+
+
5.16.3ADC Digital Filter Characteristics
5.17 DAC Characteristics
Parameter
1,2
MinTypMax Unit
Fs = 96 kHz
Passband (Frequency Response) to –0.1 dB corner0—0.4896 Fs
Passband Ripple——0.08dB
Stopband0.5688——Fs
Stopband Attenuation70——dB
Total Group Delay—12/Fs—s
High-pass Filter Characteristics
Frequency Response:
–3.0 dB
–0.13 dB
—
—
20
1
——Hz
Hz
Phase Deviation @ 20 Hz—10—Deg
Passband Ripple——0dB
Filter Settling Time—10
1. Filter response is guaranteed by design.
2. Response is clock-dependent and scales with Fs.
5
/Fs0s
5.17 DAC Characteristics
5.17.1Analog Output Characteristics (Commercial)
Test Conditions (unless otherwise specified): TA = 0–+70°C; VDD = 1.8V±5%, VDDA(VA) = 3.3V±5%; 1 kHz sine wave
driven through a filter shown in Fig. 5-15 or Fig. 5-16; DSP running test application; Measurement Bandwidth is 20 Hz–20
kHz.
DifferentialSingle-ended
ParameterMinTypMax MinTypMaxUnit
23DS787PP9
Fs = 96 kHz
Dynamic Range
A-weighted
Unweighted
Total Harmonic Distortion + Noise
0 dB
–20 dB
–60 dB
Interchannel Isolation (1 kHz)—95——95—dB
10299108
105——9996
—
–98
—
–88
—
–48
–90
—
—
105
102——dBdB
—
–95
—
–85
—
–45
–87
—
—
dB
dB
dB
AOUT_x+
3.3 µF
C
L
R
L
AOUT
2200 pF
560
10 k
+
5.17 DAC Characteristics
DifferentialSingle-ended
ParameterMinTypMax MinTypMaxUnit
Analog Input
Full-scale Output1.20 1.40
Interchannel Gain Mismatch—0.1——0.1—dB
Gain Drift—
Output Impedance—100——100—
DC Current Draw from an AOUT Pin1——10——10A
AC-load Resistance (R
Load Capacitance (CL)
2
)
L
2
3——3——k
——100——100pF
•VA 1.60 0.60 0.70•VA 0.80V
PP
±120——±120— ppm/°C
5.17.2Analog Output Characteristics (Automotive)
Test Conditions (unless otherwise specified): TA= –40 to +85C; VDD = 1.8V±5%, VDDA(VA) = 3.3V±5%; 1 kHz sine
wave driven through a filter shown in Fig. 5-15 or Fig. 5-16; DSP running test application; Measurement Bandwidth is
20 Hz–20 kHz.
DifferentialSingle-ended
ParameterMinTypMax MinTypMaxUnit
Fs = 96 kHz
Dynamic Range
A-weighted
Unweighted
Total Harmonic Distortion + Noise
0 dB
–20 dB
–60 dB
Interchannel Isolation (1 kHz)—95——95—dB
Analog Input
Full-scale Output1.20 1.40
Interchannel Gain Mismatch—0.1——0.1—dB
Gain Drift—
Output Impedance—100——100—
DC Current Draw from an AOUT Pin1——10——10A
AC-load Resistance (R
Load Capacitance (CL)
1. Guaranteed by design. The DC current draw represents the allowed current draw from the AOUT pin due to typical leakage through the electrolytic
DC-blocking capacitors.
2. Guaranteed by design. R
stability and signal integrity. In this circuit topology, C
parasitic), and effectively moves the dominant pole of the two-pole amp in the output stage. Increasing this value beyond the recommended 100 pF
can cause the internal op-amp to become unstable.
and CL reflect the recommended minimum resistance and maximum capacitance required for the internal op-amp’s
L
2
)
L
2
represents any capacitive loading that appears before the 560 series resistor (typically
5.17.3Combined DAC Interpolation and On-chip Analog Filter Response
Passband (Frequency Response)
25DS787PP9
to 0.22 dB corner
to –3 dB corner
Frequency Response 10 Hz–20 kHz –0.02—+0.02dB
StopBand0.5465——Fs
StopBand Attenuation100——dB
Group Delay—10/Fs—s
ParameterMinTypMax Unit
0
0
——0.4125
0.4979FsFs
6Ordering Information
The CS470xx DSP part numbers are described as follows:
Example:
CS47048I-XYZR
where
I–ROM ID Letter
X–Product Grade
Y–Package Type
Z–Lead (Pb) Free
R–Tape and Reel Packaging
Table 6-1. Ordering Information
Part No.GradeTemp. RangePackage
CS47048C-CQZ Commercial0–+70°C100-pin LQFP
CS47048C-DQZ Automotive–40–+85°C
CS47048C-EQZ Extended Automotive –40–+105°C
CS47028C-CQZ Commercial0–+70°C
CS47028C-DQZ Automotive–40–+85°C
CS47028C-EQZ Extended Automotive –40–+105°C
CS47024C-CQZ Commercial0–+70°C
CS47024C-DQZ Automotive–40–+85°C
CS47024C-EQZ Extended Automotive –40–+105°C
Note: Contact the factory for availability of the –D (automotive grade) package.
6 Ordering Information
7Environmental, Manufacturing, and Handling Information
Table 7-1. Environmental, Manufacturing, and Handling Information
Model Number Peak Reflow Temp.
CS47048C-CQZ 260° C37 days
CS47048C-DQZ
CS47048C-EQZ
CS47028C-CQZ 260° C37 days
CS47028C-DQZ
CS47028C-EQZ
CS47024C-CQZ 260° C37 days
CS47024C-DQZ
CS47024C-EQZ
1. Moisture Sensitivity Level as specified by IPC/JEDEC J-STD-020.
MSL
1
Rating
Max Floor Life
26DS787PP9
8Device Pinout Diagrams
VDD1
GND2
VDDIO1
GNDIO1
VDD2
GND1
GPIO1, DAI_DATA2, TM2
GPIO2, DAI_DATA3, TM3, SPDIF RX
GPIO16, DAI_DATA0, TM0
GPIO0, DAI_DATA1, TM1
10
15
20
25
GPIO5, DAO_DATA3, HS3, S/PDIF TXa
GPIO3, DAO_DATA1, HS1
GPIO6, DAO_DATA0, HS0
GPIO7, DAO_LRCLK
GPIO15, DAI_LRCLK
GPIO18, DAO_MCLK, HS4
GPIO17, DAI_SCLK
GPIO14, DAO_SCLK
GPIO4, DAO_DATA2, HS2, S/PDIF TXb
VDDIO2
GNDIO2
DBDA
DBCK
CS47048
100-Pin LQFP
(Thermal Pad Package )
5
1
GPIO10, SCP_MISO, SCP_SDA
GPIO9, SCP_MOSI
GPIO8, SCP_CS, DAI_DATA4
GPIO12, SCP_IRQ
GPIO13, SCP_BSY, EE_CS
GNDIO3
GND_SUB
XTAL_OUT, TEST
GND3
XTI
XTO
GNDA_PLL
PLL_REF_RES
AIN_6B-
AIN_6B+
AIN_5B-
AIN_5B+
26
GPIO11, SCP_CLK
30
VDDIO3
35VDD3
40
VDDA_PLL
45
AIN_4B-
AIN_4B+
AIN_3B-
AIN_3B+
AIN_2B-
50AIN_2B+
70
65
60
55
51
75
AIN_1B-
AIN_5A-
VQ
BIASREF_DAC
AIN_5A+
VDDA3
AIN_1A-
AIN_1B+
GNDA3
AIN_1A+
AIN_4A-
AIN_3A-
AIN_3A+
BIASREF_ADC
VDD_ADC_MON
AIN_2A-
REXT
VDDA2
AIN_4A+
AIN_2A+
GNDA2
GND_DAC
VDD_DAC
AIN_6A-
AIN_6A+
95
90
85
100
80
76
AOUT_1+
AOUT_1-
VDDA7
AOUT_2+
AOUT_2-
AOUT_3+
AOUT_3-
GNDA 6
AOUT_4+
AOUT_4-
AOUT_5+
VDDA5
GNDA 5
AOUT_6+
AOUT_6-
RESET
GNDA 7
VDDA6
AOUT_5-
AOUT_7+
AOUT_7-
VDDA4
GNDA 4
AOUT_8+
AOUT_8-
8.1 CS47048, 100-pin LQFP Pinout Diagram
8 Device Pinout Diagrams
27DS787PP9
Figure 8-1. CS47048 Pinout Diagram
8.2 CS47028, 100-pin LQFP Pinout Diagram
VDD1
GND2
VDDIO1
GNDIO1
VDD2
GND1
GPIO1, DAI_DATA2, TM2
GPIO2, DAI_DATA3, TM3, SPDIF RX
GPIO16, DAI_DATA0, TM0
GPIO0, DAI_DATA1, TM1
10
15
20
25
GPIO5, DAO_DATA3, HS3, S/PDIF TXa
GPIO3, DAO_DATA1, HS1
GPIO6, DAO_DATA0, HS0
GPIO7, DAO_LRCLK
GPIO15, DAI_LRCLK
GPIO18, DAO_MCLK, HS4
GPIO17, DAI_SCLK
GPIO14, DAO_SCLK
GPIO4, DAO_DATA2, HS2, S/PDIF TXb
VDDIO2
GNDIO2
DBDA
DBCK
CS47028
100-Pin LQFP
(Thermal Pad Package )
5
1
GPIO10, SCP_MISO, SCP_SDA
GPIO9, SCP_MOSI
GPIO8, SCP_CS, DAI_DATA4
GPIO12, SCP_IRQ
GPIO13, SCP_BSY, EE_CS
GNDIO3
GND_SUB
XTAL_OUT, TEST
GND3
XTI
XTO
GNDA_PLL
PLL_REF_RES
AIN_6B-
AIN_6B+
AIN_5B-
AIN_5B+
26
GPIO11, SCP_CLK
30
VDDIO3
35VDD3
40
VDDA_PLL
45
AIN_4B-
AIN_4B+
AIN_3B-
AIN_3B+
AIN_2B-
50AIN_2B+
70
65
60
55
51
75
NC
AIN_5A-
VQ
BIASREF_DAC
AIN_5A+
VDDA3
NC
NC
GNDA3
NC
AIN_4A-
AIN_3A-
AIN_3A+
BIASREF_ADC
VDD_ADC_MON
AIN_2A-
REXT
VDDA2
AIN_4A+
AIN_2A+
GNDA2
GND_DAC
VDD_DAC
AIN_6A-
AIN_6A+
95
90
85
100
80
76
AOUT_1+
AOUT_1-
VDDA7
AOUT_2+
AOUT_2-
AOUT_3+
AOUT_3-
GNDA 6
AOUT_4+
AOUT_4-
AOUT_5+
VDDA5
GNDA 5
AOUT_6+
AOUT_6-
RESET
GNDA 7
VDDA6
AOUT_5-
AOUT_7+
AOUT_7-
VDDA4
GNDA 4
AOUT_8+
AOUT_8-
8.2 CS47028, 100-pin LQFP Pinout Diagram
28DS787PP9
Figure 8-2. CS47028 Pinout Diagram
8.3 CS47024, 100-pin LQFP Pinout Diagram
VDD1
GND2
VDDIO1
GNDIO1
VDD2
GND1
GPIO1, DAI_DATA2, TM2
GPIO2, DAI_DATA3, TM3, SPDIF RX
GPIO16, DAI_DATA0, TM0
GPIO0, DAI_DATA1, TM1
10
15
20
25
GPIO5, DAO_DATA3, HS3, S/PDIF TXa
GPIO3, DAO_DATA1, HS1
GPIO6, DAO_DATA0, HS0
GPIO7, DAO_LRCLK
GPIO15, DAI_LRCLK
GPIO18, DAO_MCLK, HS4
GPIO17, DAI_SCLK
GPIO14, DAO_SCLK
GPIO4, DAO_DATA2, HS2, S/PDIF TXb
VDDIO2
GNDIO2
DBDA
DBCK
CS47024
100-Pin LQFP
(Thermal Pad Package )
5
1
GPIO10, SCP_MISO, SCP_SDA
GPIO9, SCP_MOSI
GPIO8, SCP_CS, DAI_DATA4
GPIO12, SCP_IRQ
GPIO13, SCP_BSY, EE_CS
GNDIO3
GND_SUB
XTAL_OUT, TEST
GND3
XTI
XTO
GNDA_PLL
PLL_REF_RES
AIN_6B-
AIN_6B+
AIN_5B-
AIN_5B+
26
GPIO11, SCP_CLK
30
VDDIO3
35VDD3
40
VDDA_PLL
45
AIN_4B-
AIN_4B+
AIN_3B-
AIN_3B+
AIN_2B-
50AIN_2B+
70
65
60
55
51
75
NC
AIN_5A-
VQ
BIASREF_DAC
AIN_5A+
VDDA3
NC
NC
GNDA3
NC
AIN_4A-
AIN_3A-
AIN_3A+
BIASREF_ADC
VDD_ADC_MON
AIN_2A-
REXT
VDDA2
AIN_4A+
AIN_2A+
GNDA2
GND_DAC
VDD_DAC
AIN_6A-
AIN_6A+
95
90
85
100
80
76
AOUT_1+
AOUT_1-
VDDA7
AOUT_2+
AOUT_2-
AOUT_3+
AOUT_3-
GNDA 6
AOUT_4+
AOUT_4-
NC
VDDA5
GNDA 5
NC
NC
RESET
GNDA 7
VDDA6
NC
NCNCVDDA4
GNDA 4
NC
NC
8.3 CS47024, 100-pin LQFP Pinout Diagram
29DS787PP9
Figure 8-3. CS47024 Pinout Diagram
DS787PP930
9100-pin LQFP with Exposed Pad Package Drawing
Fig. 9-1 shows the 100-pin LQFP package with exposed pad for the CS47048, CS47028, and CS47024.
Figure 9-1. 100-pin LQFP Package Drawing
10 Parameter Definitions
10Parameter Definitions
10.1 Dynamic Range
The ratio of the RMS value of the signal to the RMS sum of all other spectral components over the specified bandwidth.
Dynamic Range is a signal-to-noise ratio measurement over the specified bandwidth made with a -60 dBFS signal. 60 dB
is added to resulting measurement to refer the measurement to full-scale. This technique ensures that the distortion
components are below the noise level and do not affect the measurement. This measurement technique has been
accepted by the Audio Engineering Society, AES17-1991, and the Electronic Industries Association of Japan, EIAJ
CP-307. Expressed in decibels.
10.2 Total Harmonic Distortion + Noise
The ratio of the RMS value of the signal to the RMS sum of all other spectral components over the specified bandwidth
(typically 10 Hz–20 kHz), including distortion components. Expressed in decibels. Measured at –1 and –20 dBFS as
suggested in AES17-1991 Annex A.
10.3 Frequency Response
A measure of the amplitude response variation from 10 Hz–20 kHz relative to the amplitude response at 1 kHz. Units in
decibels.
10.4 Interchannel Isolation
A measure of crosstalk between the left and right channels. Measured for each channel at the converter’s output with no
signal to the input under test and a full-scale signal applied to the other channel. Units in decibels.
10.5 Interchannel Gain Mismatch
The gain difference between left and right channels. Units in decibels.
10.6 Gain Error
The deviation from the nominal full-scale analog output for a full-scale digital input.
10.7 Gain Drift
The change in gain value with temperature. Units in ppm/°C.
31DS787PP9
11 Revision History
11Revision History
RevisionDateChanges
PP1August, 2009Updated Characterization data in Section 5.4, Section 5.7, Section 5.9, Section 5.11, Section 5.12,
PP2January, 2010Updated TDM Feature description on page 1. Modified note at the bottom of the feature list on page 1.
PP3June, 2010Ta b le 3 -1 : Straddled all three columns in the “Supports Different Fs Sample Rates” row to indicate that
PP4February, 2011Added “Decoder” information to Section 3. Changed the name of the core to “Cirrus Logic 32-bit core”.
PP5February, 2011Added “SPDIF RX” to Fig. 5-17.
PP6June, 2011In Section 4.3.1 and Section 4.3.7, removed mention of 192 kHz sampling frequency. Updated temperature
PP7April, 2012Corrected peak reflow temperature in Ta bl e 7- 1 .
PP8June, 2012Added number of bits to Integrated DAC and ADC Functionality on the cover page.
PP9July, 2012Updated frequencies in Section 5.2. Added extended automotive grade information to Section 6 and
Section 5.16.1, Section 5.16.2, Section 5.16.3, Section 5.17.1, and Section 5.17.2. Modified Footnote 3 in
both Section 5.16.1 and Section 5.16.2. Added Footnote 5 to Section 5.14. Updated Section 2.1. Modified
Section 4.3.6 and Section 4.3.8. Modified references to TDM in various sections of the data sheet.
Updated table in Section 5.8, specifying performance data for 2- and 4-layer boards. Updated Tab l e 3 -1 and
Ta bl e 3 - 2 Updated block diagrams in Fig. 4-1, Fig. 4-2, and Fig. 4-3.
CS47024 devices have the same features as the CS47048 and CS47028.
Added “The CS47024 has the 8-channel SRC block” to Section 4.3.7.
Added text in the following places to indicate that the CS47024 implements the S/PDIF Rx functionality:
• Removed dagger from the S/PDIF Rx bullet on p. 1.
• Updated bullet in “Configurable Serial Audio Inputs/Outputs” row in Table 2 Integrated 192 kHz S/PDIF
Rx, 2 Integrated 192 kHz S/PDIF Tx.
• Changed entry in “S/PDIF In (Stereo Pairs)” column in Tab l e 3 -2 .
• Updated I2S block in Table 3-2.
• Removed text “On the CS47048 and CS47028...” from Section 4.3.4.
• Removed “(Not available on CS47024)” from the heading to Section 5.15.
• Described additional support for TDM 8-channel output mode on CS47024.
• Removed dagger from the TDM I/O bullet on p. 1.
• Straddled “Configurable Serial Audio Inputs/Outputs” row in Tab le 3- 1 .
• Changed cell in “TDM Out” column in Table 3-2.
• Removed text “On the CS47048 and CS47028...” from Section 4.3.5.
operating conditions in Section 5.2. Updated pin 33 to XTAL_OUT, TEST in Fig. 8-1, Fig. 8-2, and Fig. 8-3.
Section 7.
DS787PP932
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