2. PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO ELECTROSTATICALLY
SENSITIVE(ES)DEVICES
3. CONTROL BUTTON LOCATIONS AND EXPLANATIONS
4. PREVERTION OF STATIC ELECTRICITY DISCHARGE
5. ASSEMBLING AND DISASSEMBLING THE MECHANISM UNIT
5.1 OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST
5.2 MISCELLANEOUS
6. ELECTRICAL CONFIRMATION
6.1 VIDEO OUTPUT (LUMINANCE SIGNAL) CONFIRMATION
6.2 VIDEO OUTPUT(CHROMINANCE SIGNAL) CONFIRMATION
7. MPEG BOARD CHECK WAVEFORM
1
1
2
3
4
4
6
7
7
8
9
8.2 MT1389
8.3 AM29LV160D13
8.4 HY57V641620HG
9. SCHEMATIC & PCB WIRING DIAGRAM
10. SPARE PARTS LIST39
10
18
21
Page 3
1.1 GENERAL GUIDELINES
1. SAFETY PREAUTIONS
2.PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO
ELECTROSTATICALLY SENSITIVE(ES)DEVICES
1
1. When servicing, observe the original lead dress. if a short circuit is found, replace all parts which have
been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barrier, insulation papers
shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed
to shock hazards.
Some semiconductor(solid state)devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive(ES)Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques
should be used to help reduce the incidence of component damage caused by electro static discharge(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain
off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially
availabel discharging ESD wrist strap, which should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive
surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static
(ESD protected)can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are
ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity(ESD).
notice (1885x323x2 tiff)
Page 4
2
Front panel illustration
Control Panel Illustration
Display window
2
IR sensor window
3
Volume adjustment knob
Tone adjustment knob
4
Direction indicator to place disc
5
Door
Rear panel Illustration
POWER button
TUNING+ button
NEXT button
TUNING- button
PREV button
WAVE BAND button
FUNCTION button
PLAY/STOP button
OPEN/CLOSE button
Power cord socket
AM antenna input terminal
MIC terminal
FM antenna input terminal
SCART output terminal
I-Link output terminal
AUX IN 2 terminal
Front amplifying audio output terminal
Optical output terminal of digital audio
Coaxial output terminal of digital audio
Component video/Y Pb Pr output terminal
Video output terminal
S-video
Page 5
The laser diode in the traverse unit (optical pickup)may brake down due to static electricity of clothes or human
body. Use due caution to electrostatic breakdown when servicing and handling the laser diode.
Some devices such as the DVD player use the optical pickup(laser diode)and the optical pickup will be damaged
by static electricity in the working environment.Proceed servicing works under the working environment where
1. Put a conductive material(sheet)or iron sheet on the area where the optical pickup is placed,and ground the
3. The flexible cable may be cut off if an excessive force is applied to it.Use caution when handling the cable.
3
4.PREVENTION OF STATIC ELECTRICITY DISCHARGE
4.1.Grounding for electrostatic breakdown prevention
grounding works is completed.
4.1.1. Worktable grounding
sheet.
4.1.2.Human body grounding
1 Use the anti-static wrist strap to discharge the static electricity from your body.
safety_3 (1577x409x2 tiff)
4.1.3.Handling of optical pickup
1. To keep the good quality of the optical pickup maintenance parts during transportation and before
installation, the both ends of the laser diode are short-circuited.After replacing the parts with new ones,
remove the short circuit according to the correct procedure. (See this Technical Guide).
2. Do not use a tester to check the laser diode for the optical pickup .Failure to do so willdamage the laser
diode due to the power supply in the tester.
4.2. Handling precautions for Traverse Unit (Optical Pickup)
1. Do not give a considerable shock to the traverse unit(optical pickup)as it has an extremely high-precise
structure.
2. When replacing the optical pickup, install the flexible cable and cut is short land with a nipper. See the
optical pickup replacement procedure in this Technical Guide. Before replacing the traverse unit, remove
the short pin for preventingstatic electricity and install a new unit.Connect the connector as short times as
possible.
4. The half-fixed resistor for laser power adjustment cannot be adjusted. Do not turn the resistor.
Page 6
5. Assembling and disassembling the mechanism unit
4
Page 7
5.1 OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST
Page 8
Page 9
Page 10
2 MISCELLANEOUS
8
5.
5.2.1 Protection of the LD(Laser diode)
Short the parts of LD circuit pattern by soldering.
5.2.2 Cautions on assembly and adjustment
Make sure that the workbenches,jigs,tips,tips of soldering irons and measuring instruments are
grounded,and that personnel wear wrist straps for ground.
Open the LD short lands quickly with a soldering iron after a circuit is connected.
Keep the power source of the pick-up protected from internal and external sources of electrical
noise.
Refrain from operation and storage in atmospheres containing corrosive gases (such as H2S,SO2,
NO2 and Cl2)or toxic gases or in locations containing substances(especially from the organic silicon,cyan,
formalin and phenol groups)which emit toxic gases.It is particularly important to ensure that none of the
above substances are present inside the unit.Otherwise,the motor may no longer run.
Page 11
6.1. Video Output (Luminance Signal) Confirmation
6.Electrical Confirmation
9
DO this confirmation after replacing a P.C.B.
Measurement point
Video output terminal
Measuring equipment,tools
200mV/dir,10sec/dir
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohms.
2.Confirm that luminance signal(Y+S)level is 1000mVp-p±30mV
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
ModeDisc
Color bar 75%
Confirmation value
1000mVp-p±30mV
DVDT-S15
or
DVDT-S01
Page 12
Do the confirmation after replacing P.C.B.
Screwdriver,Oscilloscope
6.2 Video Output(Chrominance Signal) Confirmation
10
Measurement point
Video output terminal
Measuring equipment,toolsConfirmation value
200mV/dir,10sec/dir
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohme.
2.Confirm that the chrominance signal(C)level is 621 mVp-p±30mV
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
ModeDisc
Color bar 75%
621mVp-p±30mV
DVDT-S15
or
DVDT-S01
Page 13
7.MPEG BOARD CHECK WAVEFORM
7.1 27MHz WAVEFORM
7.2 IC TEA1523 PIN.8 WAVEFORM DIAGRAM
11
Page 14
8.2 MT1389
12
MT1389
Specifications are subject to change without notice
Progressive-Scan DVD Player SOC
MediaTek MT1389 is a DVD player system-on-chip (SOC) which incorporates advanced features like high
quality TV encoder and state-of-art de-interlace processing. The MT1389 enables consumer electronics
manufacturers to build high quality, cost-effective DVD players, portable DVD players or any other home
entertainment audio/video devices.
rd
Based on MediaTek’s world-leading DVD player SOC architecture, the MT1389 is the 3
player SOC. It integrates the MediaTek 2
decoder.
The progressive scan of the MT1389 utilized a proprietary advanced motion-adaptive de-interlace algorithm to
achieve the best movie/video playback. It can easily detect 3:2/2:2 pull down source and restore the correct
original pictures. It also supports a patent-pending edge-preserving algorithm to remove the saw-tooth effect.
nd
generation front-end analog RF amplifier and the Servo/MPEG AV
generation of the DVD
Key Features
RF/Servo/MPEG Integration
High Performance Audio Processor
Motion-Adaptive, Edge-Preserving De-interlace
108MHz/12-bit, 6 CH TV Encoder
DVD
PUH
Module
CVBS, Y/C,
Component
SDPIF
MT1389L
Applications
FLASH
Front-panel
Remote
DRAM
Audio DAC
Standard DVD Players
Portable DVD Players
DVD Player System Diagram Using MT1389
Page 15
13
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE
MT1389
General Feature List
1024-bytes on-chip RAM
Super Integration DVD player single chip
High performance analog RF amplifier
Servo controller and data channel processing
MPEG-1/MPEG-2/JPEG video
Dolby AC-3/DTS/DVD-Audio
Unified memory architecture
Versatile video scaling & quality
enhancement
OSD & Sub-picture
2-D graphic engine
Built-in clock generator
Built-in high quality TV encoder
Built-in progressive video processor
Audio effect post-processor
Audio input port
Up to 4M bytes FLASH-programming
interface
Supports 5/3.3-Volt. FLASH interface
Supports power-down mode
Supports additional serial port
DVD-ROM/CD-ROM Decoding Logic
High-speed ECC logic capable of correcting
one error per each P-codeword or
Q-codeword
Automatic sector Mode and Form detection
Automatic sector Header verification
Decoder Error Notification Interrupt that
signals various decoder errors
Provide error correction acceleration
High Performance Analog RF Amplifier
Programmable fc
Dual automatic laser power control
Defect and blank detection
RF level signal generator
Speed Performance on Servo/Channel Decoding
DVD-ROM up to 4XS
CD-ROM up to 24XS
Channel Data Processor
Digital data slicer for small jitter capability
Built-in high performance data PLL for
channel data demodulation
EFM/EFM+ data demodulation
Enhanced channel data frame sync protection
& DVD-ROM sector sync protection
Servo Control and Spindle Motor Control
Programmable frequency error gain and
phase error gain of spindle PLL to control
spindle motor on CLV and CAV mode
Built-in ADCs and DACs for digital servo
control
Provide 2 general PWM
Tray control can be PWM output or digital
Supports 16Mb/32Mb/64Mb/128Mb SDRAM
Supports 16-bit SDRAM data bus
Provide the self-refresh mode SDRAM
Block-based sector addressing
Support 3.3 Volt. DRAM Interface
Video Decode
Decodes MPEG1 video and MPEG2 main level,
main profile video (720/480 and 720x576)
Smooth digest view function with I, P and B
picture decoding
Baseline, extended-sequential and
progressive JPEG image decoding
Support CD-G titles
Video/OSD/SPU/HLI Processor
Arbitrary ratio vertical/horizontal scaling of
video, from 0.25X to 256X
65535/256/16/4/2-color bitmap format OSD,
256/16 color RLC format OSD
Automatic scrolling of OSD image
Slide show transition as DVD-Audio
Specification
2-D Graphic Engine
Support decode Text and Bitmap
Support line, rectangle and gradient fill
Support bitblt
Chroma key copy operation
Clip mask
Page 16
14
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE
MT1389
Audio Effect Processing
Dolby Digital (AC-3)/EX decoding
DTS/DTS-ES decoding
MLP decoding for DVD-Audio
MPEG-1 layer 1/layer 2 audio decoding
MPEG-2 layer1/layer2 2-channel audio
High Definition Compatible Digital (HDCD)
Windows Media Audio (WMA)
Advanced Audio Coding (AAC)
Dolby ProLogic II
Concurrent multi-channel and downmix out
IEC 60958/61937 output
- PCM / bit stream / mute mode
- Custom IEC latency up to 2 frames
Pink noise and white noise generator
Karaoke functions
- Microphone echo
- Microphone tone control
- Vocal mute/vocal assistant
- Key shift up to +/- 8 keys
- Chorus/Flanger/Harmony/Reverb
Channel equalizer
3D surround processing include virtual
surround and speaker separation
TV Encoder
Six 108MHz/12bit DACs
Support NTSC, PAL-BDGHINM, PAL-60
Support 525p, 625p progressive TV format
Automatically turn off unconnected channels
Support PC monitor (VGA)
Support Macrovision 7.1 L1, Macrovision
525P and 625P
CGMS-A/WSS
Closed Caption
Progressive Output
Automatic detect film or video source
3:2 pull down source detection
Advanced Motion adaptive de-interlace
Edge Preserving
Minimum external memory requirement
Audio Input
Line-in/SPDIF-in for versatile audio
any program or erase operations within that sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect featur e allows code
changes in previously locked sectors
■ Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
■ Top or bottom boot block configurations
available
■ Minimum 1,000,000 write cycle guarantee
per sector
■ 20-year data retention at 125°C
— Reliable operation for the life of the system
■ Package option
— 48-ball FBGA
— 48-pin TSOP
— 44-pin SO
■ CFI (Common Flash Interface) compliant
— Provides device-specific information to the
system, allowing host software to easily
reconfigure for different Flash devices
■ Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
■ Data# Polling and toggle bits
— Provides a software method of detecting program
or erase operation completion
■ Ready/Busy# pin (RY/ BY#)
— Provides a hardware method of detecting
program or erase cycle completi on (not av ailable
on 44-pin SO)
■ Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modificat ions due to changes in technical specif ic ations.
Publication# 22358Rev: B Amendment/+3
Issue Date: November 10, 2000
Page 18
PRODUCT SELECTOR GUIDE
16
Family Part NumberAm29LV160D
Speed OptionVoltage Range: V
Max access time, ns (t
Max CE# access time, ns (t
Max OE# access time, ns (t
)7090120
ACC
)7090120
CE
)303550
OE
= 2.7–3.6 V-70-90-120
CC
Note: See “AC Characteristics” for full specifications.
Special handling is required for Flash Memory products
in FBGA packages.
BYTE#A16A15A14A12A13
DQ15/A-1V
SS
DQ13DQ6DQ14DQ7A11A10A8A9
V
CC
DQ4DQ12DQ5A19NCRESET#WE#
DQ11DQ3DQ10DQ2NCA18NCRY/BY#
DQ9DQ1DQ8DQ0A5A6A17A7
CE#A0A1A2A4A3
OE#V
SS
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
A
Page 21
PIN CONFIGURATION
19
A0–A19= 20 addresses
DQ0–DQ14 = 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/output, word mode),
The Hyundai HY57V641620HG is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the main memory applications which
require large memory density and high bandwidth. HY57V641620HG is organized as 4banks of 1,048,576x16.
HY57V641620HG is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output
voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated
by a single control command (Burst length of 1,2,4,8 or Full page), and the burst count sequence(sequential or interleave). A burst of
read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst
read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)
FEATURES
•Single 3.3±0.3V power supply
•All device pins are compatible with LVTTL interface
•JEDEC standard 400mil 54pin TSOP-II with 0.8mm
of pin pitch
•All inputs and outputs referenced to positive edge of
system clock
171CARBON FILM RESISTOR1/4W68Ω±5%PCS1R703
0390095SMD MAGNETIC BEADSFCM1608K-221T05PCS3L720,L721,L722
0700004SMD VOLTAGE REGULATOR DIODE 5.1V ±5% 1/2WPCS4ZD701~ZD704
7. POWER INDICATOR LIGHT BOARD 2
MATERIAL CODEMATERIAL NAMESPECIFICATIONSUNI
0620076LIGHT RADIATION DIODE 23B3HC COLORLESS WITH BLUEPCS1VD01
1563717PCBASW600-1PCS1
8. LIGHT BOARD OF MAIN SPEAKER
MATERIAL CODEMATERIAL NAMESPECIFICATIONSUNI
126CARBON FILM RESISTOR
0620076LIGHT RADIATION DIODE3B3HC COLORLESS WITH BLUEPCS2VD01,VD02
1563796PCBMP600-1PCS1
3P500 2.5 2PLUG WITH L NEEDLE
REVERSE
2P130 2.5 2PLUG WITH DUAL L
NEEDLE THE SAME DIRECTION
3P500 2.5 2PLUG 2P SCREEN-SHIELDED
WITH L NEEDLE THE SAME
DIRECTION
1/6W560Ω±5% SHAPED 7.5
1/6W750Ω±5% SHAPED 7.5
Φ0.6 SHAPED 12.5mm
1/6W560Ω±5% SHAPED 7.5
UANTI
PCS1XS600
PCS1XS601
PCS1XS602
PCS1R600
PCS1R601
PCS2W1,W2
UANTI
UANTI
PCS1R01
LOCATION
LOCATION
LOCATION
9. POWER AMPLIFIER BOARD
MATERIAL CODEMATERIAL NAMESPECIFICATIONSUNI