Asus Z170-PRO User’s Manual

Motherboard
Z170-PRO
ii
E10417
First Edition
September 2015
Copyright© 2015 ASUSTeK COMPUTER INC. All Rights Reserved.
No part of this manual, including the products and software described in it, may be reproduced,
means, except documentation kept by the purchaser for backup purposes, without the express written
permission of ASUSTeK COMPUTER INC. (“ASUS”).
Product warranty or service will not be extended if: (1) the product is repaired, modied or altered, unless
such repair, modication of alteration is authorized in writing by ASUS; or (2) the serial number of the
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Where the applicable license entitles you to the source code of such software and/or other additional data,
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iii
Contents
Safety information ...................................................................................................... vi
About this guide ........................................................................................................ vii
Z170-PRO specifications summary .......................................................................... ix
Package contents ..................................................................................................... xvi
Installation tools and components ........................................................................ xvii
Chapter 1: Product Introduction
1.1 Special features..........................................................................................1-1
1.1.1 Product highlights........................................................................1-1
1.1.2 Other special features .................................................................1-2
1.2 Motherboard overview ............................................................................... 1-3
1.2.1 Before you proceed .....................................................................1-3
1.2.2 Motherboard layout .....................................................................1-4
1.2.3 Central Processing Unit (CPU) ...................................................1-6
1.2.4 System memory ..........................................................................1-7
1.2.5 Expansion slots .........................................................................1-17
1.2.6 Onboard buttons and switches..................................................1-19
1.2.7 Jumpers .................................................................................... 1-20
1.2.8 Onboard LEDs ..........................................................................1-22
1.2.9 Internal connectors....................................................................1-23
Chapter 2: Basic Installation
2.1 Building your PC system ...........................................................................2-1
2.1.1 Motherboard installation ..............................................................2-1
2.1.2 CPU installation...........................................................................2-3
2.1.3 CPU heatsink and fan assembly installation ............................... 2-5
2.1.4 DIMM installation.........................................................................2-7
2.1.5 ATX Power connection................................................................2-8
2.1.6 SATA device connection .............................................................2-9
2.1.7 Front I/O Connector ..................................................................2-10
2.1.8 Expansion Card installation.......................................................2-11
2.2 Motherboard rear and audio connections ............................................. 2-12
2.2.1 Rear I/O connection ..................................................................2-12
2.2.2 Audio I/O connections ...............................................................2-14
2.3 Starting up for the first time .................................................................... 2-16
2.4 Turning off the computer ........................................................................2-16
iv
Chapter 3: BIOS Setup
3.1 Knowing BIOS ............................................................................................ 3-1
3.2 BIOS setup program .................................................................................. 3-2
3.2.1 EZ Mode......................................................................................3-3
3.2.2 Advanced Mode ..........................................................................3-4
3.2.3 QFan Control...............................................................................3-7
3.2.4 EZ Tuning Wizard .......................................................................3-9
3.3 My Favorites ............................................................................................. 3-12
3.4 Main menu ................................................................................................3-14
3.5 Ai Tweaker menu ......................................................................................3-16
3.6 Advanced menu .......................................................................................3-31
3.6.1 CPU Conguration ....................................................................3-32
3.6.2 Platform Misc Conguration ......................................................3-34
3.6.3 System Agent (SA) Conguration .............................................3-35
3.6.4 PCH Conguration ....................................................................3-36
3.6.5 PCH Storage Conguration.......................................................3-37
3.6.6 USB Conguration ....................................................................3-39
3.6.7 Network Stack Conguration.....................................................3-40
3.6.8 Onboard Devices Conguration ................................................3-40
3.6.9 APM Conguration ....................................................................3-42
3.6.10 HDD/SSD SMART Information ................................................. 3-43
3.6.11 Intel(R) Thunderbolt Conguration ............................................ 3-44
3.7 Monitor menu ...........................................................................................3-47
3.8 Boot menu ................................................................................................3-53
3.9 Tool menu ................................................................................................. 3-58
3.9.1 ASUS EZ Flash 3 Utility ............................................................3-58
3.9.2 Secure Erase ............................................................................3-58
3.9.3 ASUS Overclocking Prole .......................................................3-60
3.9.4 ASUS SPD Information .............................................................3-61
3.9.5 Graphics Card Information ........................................................3-61
3.10 Exit menu .................................................................................................. 3-62
3.11 Updating BIOS .......................................................................................... 3-63
3.11.1 EZ Update ................................................................................. 3-63
3.11.2 ASUS EZ Flash 3 ...................................................................... 3-64
3.11.3 ASUS CrashFree BIOS 3 .......................................................... 3-66
v
Chapter 4: Software Support
4.1 Installing an operating system .................................................................4-1
4.1.1 Windows
®
7 and USB 3.0 driver for 100 Series .......................... 4-1
4.2 Support DVD information .......................................................................... 4-8
4.2.1 Running the support DVD ...........................................................4-8
4.2.2 Obtaining the software manuals..................................................4-9
4.3 Software information ............................................................................... 4-10
4.4 AI Suite 3 ................................................................................................... 4-10
4.4.1 Ai Charger .................................................................................4-14
4.4.2 USB 3.1 Boost...........................................................................4-15
4.4.3 EZ Update .................................................................................4-16
4.4.4 Push Notice ...............................................................................4-18
4.4.5 System Information ...................................................................4-21
4.5 Audio configurations ............................................................................... 4-23
Chapter 5: RAID Support
5.1 RAID configurations ..................................................................................5-1
5.1.1 RAID denitions ..........................................................................5-1
5.1.2 Installing Serial ATA hard disks ..................................................5-2
5.1.3 Setting the RAID item in BIOS ....................................................5-2
5.1.4 Intel
®
Rapid Storage Technology Option ROM utility .................. 5-3
5.2 Creating a RAID driver disk ......................................................................5-7
5.2.1 Creating a RAID driver disk in Windows
®
.................................... 5-7
5.2.2 Installing the RAID driver during Windows
®
OS installation ........ 5-8
Appendix
Notices .................................................................................................................... A-1
ASUS contact information ...................................................................................... A-5
vi

Safety information

Electrical safety
To prevent electrical shock hazard, disconnect the power cable from the electrical outlet
before relocating the system.
When adding or removing devices to or from the system, ensure that the power cables
for the devices are unplugged before the signal cables are connected. If possible,
disconnect all power cables from the existing system before you add a device.
Before connecting or removing signal cables from the motherboard, ensure that all
power cables are unplugged.
Seek professional assistance before using an adapter or extension cord. These devices
could interrupt the grounding circuit.
Ensure that your power supply is set to the correct voltage in your area. If you are not
sure about the voltage of the electrical outlet you are using, contact your local power
company.
If the power supply is broken, do not try to x it by yourself. Contact a qualied service
technician or your retailer.
Operation safety
Before installing the motherboard and adding devices on it, carefully read all the manuals
that came with the package.
Before using the product, ensure all cables are correctly connected and the power
cables are not damaged. If you detect any damage, contact your dealer immediately.
To avoid short circuits, keep paper clips, screws, and staples away from connectors,
slots, sockets and circuitry.
Avoid dust, humidity, and temperature extremes. Do not place the product in any area
where it may become wet.
Place the product on a stable surface.
If you encounter technical problems with the product, contact a qualied service
technician or your retailer.
vii

About this guide

This user guide contains the information you need when installing and conguring the
motherboard.
How this guide is organized
This guide contains the following parts:
1. Chapter 1: Product Introduction
This chapter describes the features of the motherboard and the new technology it
supports. It includes description of the switches, jumpers, and connectors on the
motherboard.
2. Chapter 2: Basic Installation
This chapter lists the hardware setup procedures that you have to perform when
installing system components.
3. Chapter 3: BIOS Setup
This chapter tells how to change system settings through the BIOS Setup menus.
Detailed descriptions of the BIOS parameters are also provided.
4. Chapter 4: Software Support
This chapter describes the contents of the support DVD that comes with the
motherboard package and the software.
5. Chapter 5: RAID Support
This chapter describes the RAID congurations.
Where to find more information
Refer to the following sources for additional information and for product and software
updates.
1. ASUS website
The ASUS website (www.asus.com) provides updated information on ASUS hardware
and software products.
2. Optional documentation
Your product package may include optional documentation, such as warranty yers,
that may have been added by your dealer. These documents are not part of the
standard package.
viii
Conventions used in this guide
To ensure that you perform certain tasks properly, take note of the following symbols used
throughout this manual.
DANGER/WARNING: Information to prevent injury to yourself when trying to
complete a task.
CAUTION: Information to prevent damage to the components when trying to
complete a task.
IMPORTANT: Instructions that you MUST follow to complete a task.
NOTE: Tips and additional information to help you complete a task.
Typography
Bold text
Indicates a menu or an item to select.
Italics
Used to emphasize a word or a phrase.
<Key>
Keys enclosed in the less-than and greater-than sign
means that you must press the enclosed key.
Example: <Enter> means that you must press the Enter or
Return key.
<Key1> + <Key2> + <Key3>
If you must press two or more keys simultaneously, the key
names are linked with a plus sign (+).
ix
CPU
LGA1151 socket for 6th Generation Intel
®
Core™ i7/ i5/ i3/Pentium
®
/Celeron
®
Processors
Supports 14nm CPU
Supports Intel
®
Turbo Boost Technology 2.0*
* The Intel
®
Turbo Boost Technology 2.0 support depends on the CPU types.
Chipset
Intel
®
Z170 Express Chipset
Memory
4 x DIMM, max. 64GB, DDR4 3866(O.C.)* / 3800(O.C.)* / 3733(O.C)* /
3600(O.C)* / 3466(O.C.)* / 3400(O.C.)* / 3333(O.C.)* / 3300(O.C.)* /
3200(O.C.)* / 3000(O.C.)* / 2800(O.C.)* / 2666(O.C.)* / 2400(O.C.)* /
2133 MHz, non-ECC, un-buffered memory
Dual channel memory architecture
Supports Intel
®
Extreme Memory Prole (XMP)
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
Please refer to Memory QVL(Qualified Vendors List) for details.
Expansion slots
2 x PCI Express 3.0/2.0 x16 slots (single at x16 or dual at x8/x8 mode)
1 x PCI Express 3.0/2.0 x16 slot* (max. at x4 mode, compatible with PCIe x1,
x2 and x4 devices)
4 x PCI Express 2.0 x1 slots
* The PCIe x16_3 slot shares bandwidth with SATA6G_56. The PCIe x16_3 is
default set at x2 mode.
VGA
Integrated Graphics Processor- Intel
®
HD Graphics support
Multi-VGA output support: DisplayPort/HDMI/DVI-D ports
Supports DisplayPort 1.2* with max. resolution 4096 x 2160@24Hz / 3840 x
2160@60Hz
Supports HDMI 1.4b with max. resolution 4096 x 2160@24Hz / 2560 x
1600@60Hz
Supports DVI-D with max. resolution 1920 x 1200@60Hz
Supports Intel
®
InTru™ 3D/Quick Sync Video/Clear Video HD Technology/
Insider™
Supports up to 3 displays simultaneously
Maximum shared memory of 512MB
* DP 1.2 Multi-Stream Transport compliant, supports DP 1.2 monitor daisy chain up
to 3 displays
Multi-GPU
support
Supports NVIDIA
®
2-Way/Quad-GPU SLI™ Technology (with 2 PCIex16
graphics card)
Supports AMD
®
3-Way/Quad-GPU CrossFireX™ Technology
(continued on the next page)

Z170-PRO specifications summary

x
(continued on the next page)
Z170-PRO specifications summary
Storage
Intel
®
Z170 Express Chipset with RAID 0, 1, 5, 10 and Intel Rapid
Storage Technology 14 support*
- 1 x SATA Express port (compatible with 2 x SATA 6.0 Gb/s ports)
- 1 x M.2 Socket 3 with M Key, type 2242/2260/2280/22110 storage
devices support (both SATA & PCIE mode)**
- 6 x SATA 6.0 Gb/s ports (gray, 2 from SATA Express)
- Supports Intel
®
Smart Response Technology***
* Supports PCIE RAID configurations via onboard M.2 and PCIEX16_3 slot
storages.
**
The M.2 socket shares SATA ports with SATA Express. Adjust BIOS settings
to use an M.2 SATA device.
***
These functions will work depending on the CPU installed.
LAN
Gigabit Intel LAN connection - 802.3az Energy Efcient Ethernet (EEE)
appliance
Intel
®
I219-V Gigabit LAN- Dual interconnect between the integrated
Media Access Controller (MAC) and physical layer (PHY)
ASUS Turbo LAN Utility
Audio
Realtek
®
ALC1150 8-channel high denition audio CODEC featuring
Crystal Sound 3
- Power pre-regulator reduces power input noise to ensure consistent
performance
- Separate layer for left and right track, ensuring both sound deliver
equal quality
- Top notch audio sensation delivers according to the audio
conguration
- Audio shielding ensures precise analog/digital separation and greatly
reduced multi-lateral interference
- Unique de-pop circuit to reduce start-up popping noise to audio outputs
- EMI protection cover to prevent electrical noise from affecting the
amplier quality
- Audio Amplier to enhance the highest quality sound for heasphones
and speakers
- Premium Japan-made audio capacitors provides warm, natural, and
immersive sound with exceptional clarity and delity
- High quality 112dB SNR stereo playback output (Line-out@back) &
104dB SNR recording input (Line-in) support
- Absolute Pitch 192khz/24bit true BD lossless sound
- BD audio layer content protection
- DTS
®
Studio Sound
- DTS
®
Connect
- Supports jack-detection, multi-streaming, front panel jack-retasking
(MIC)
- Optical S/PDIF out port at back I/O
xi
USB
Intel
®
Z170 Express Chipset- supports ASUS USB 3.1 Boost
- 6 x USB 3.0/2.0 ports (4 ports @mid-board, 2 ports @back panel, blue)
- 6 x USB 2.0/1.1 ports (4 ports @mid-board, 2 ports @back panel, black)
Intel
®
USB 3.1 controller - supports ASUS USB 3.1 Boost and 3A power
output
- 1 x USB 3.1/3.0/2.0 port @back panel (teal blue, Type A)
- 1 x USB 3.1/3.0/2.0 port @back panel (Type C)
ASUS Exclusive
Features
Superb Performance
OC Design: ASUS PRO Clock Technology
- Full BCLK range for extreme overclocking performance
5-Way Optimization
- Whole system optimization with a single click! Perfectly consolidates better
CPU performance, power saving, digital power control, system cooling and
app usages.
DIGI+ Power Control
- CPU Power: Digital 8-phase power design
- iGPU Power: Digital 2-phase power design
TPU
- Auto Tuning, GPU Boost
EPU
- EPU
Fan Xpert 3 featuring Fan Auto Tuning function and multiple thermistors
selection for optimized system cooling control
Turbo App featuring system performance tuning, network priority, and
audio scene conguration for selected applications
UEFI BIOS
- Most advanced options with fast response time
Special Memory O.C. Design
- Superb memory O.C. capability under full load by minimizing the coupling
noise and signal reection effect
PC Cleaner
- Fast and easy way to get rid of unnecessary junk les
Remote Entertainment
Remote GO!
- Remote GO! Function: Cloud GO!, Remote Desktop, Remote Keyboard &
Mouse, File Transfer
- Wi-Fi GO! & NFC Remote app for portable smartphone/tablet, supporting
iOS 7 & Android 4.0 systems
(continued on the next page)
Z170-PRO specifications summary
xii
ASUS Exclusive
Features
Media Streamer
- Pipe music or movies from your PC to a smart TV, your
entertainment goes wherever you go!
- Media Streamer app for portable smartphone/tablet, supporting
iOS 7 & Android 4.0 systems
HyStream
- Stream Android/iOS/Windows devices’ screen on your PC screen*
* Contact your device vendor for supporting information.
eSports Champions
Turbo LAN
- Fast and smooth online gaming with lower pings and less lags
Crystal Sound 3
- Hear the cleanest sound with dedicated audio design onboard!
Turbo APP
- Tailored app performance, network priority and audio
conguration for your needs
EZ DIY
Push Notice
- Monitor your PC status with smart devices in real time
UEFI BIOS EZ Mode featuring friendly graphics user interface
- CrashFree BIOS 3
- EZ Flash 3
Q-Design
- ASUS Q-Shield
- ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED)
- ASUS Q-Slot
- ASUS Q-DIMM
- ASUS Q-Connector
Z170-PRO specifications summary
(continued on the next page)
xiii
Z170-PRO specifications summary
(continued on the next page)
ASUS Special Features
ASUS 5X Protection II:
- ASUS LANGuard - Protects against LAN surges, lightning strikes
and static-electricity discharges!
- ASUS Overvoltage Protection - World-class circuit-protecting
power design
- ASUS DIGI+ VRM - 8+2 Phase digital power design
- ASUS DRAM Overcurrent Protection: Enhanced DRAM
overcurrent protection
- ASUS Stainless-Steel Back I/O: 3X corrosion-resistance for
greater durability!
AI suite 3
Mobo Connect
USB 3.1 Boost
Ai Charger
MemOK!
ASUS Quiet Thermal
Solution
Quiet Thermal Design
- ASUS Fan Xpert 3
- ASUS Fanless Design: Heat-sink solution
ASUS Exclusive
Overclocking Features
Precision Tweaker 2
- CPU Core/Cache Voltage: Adjustable CPU Core/Cache Voltage at
0.005V increment
- CPU Graphics Voltage: Adjustable CPU Graphics voltage at
0.005V increment
- CPU VCCIO Voltage: Adjustable CPU VCCIO Voltage at 0.0125V
increment
- CPU System Agent Voltage: Adjustable CPU System Agent
Voltage at 0.0125V increment
- DRAM Voltage: 200-step Memory voltage control
- PCH Core Voltage: 88-step Chipset voltage control
SFS (Stepless Frequency Selection)
- BCLK/PCIE frequency tuning from 40MHz up to 500MHz at
0.01MHz increment
Overclocking Protection:
- ASUS C.P.R.(CPU Parameter Recall)
xiv
Z170-PRO specifications summary
(continued on the next page)
Rear Panel I/O Ports
1 x DisplayPort
1 x HDMI port
1 x DVI-D
1 x Optical S/PDIF out
1 x Intel LAN (RJ45) port
1 x USB 3.1/3.0/2.0 port (teal blue, Type A)
1 x USB 3.1/3.0/2.0 port (Type C)
2 x USB 3.0/2.0 ports (blue)
2 x USB 2.0 ports
8-channel Audio I/O ports
Internal I/O connectors
2 x USB 3.0/2.0 connectors support additional 4 USB ports (19-pin)
2 x USB 2.0/1.1 connectors support additional 4 USB ports
1 x M.2 Socket 3 (for M Key, type 2242/2260/2280/22110 devices)
1 x SATA Express connector
4 x SATA 6.0Gb/s connectors (gray)
1 x CPU Fan connector (4-pin) for both 3-pin(DC mode) and
4-pin(PWM mode) CPU coolers control with auto detection
support
1 x CPU OPT Fan connector (4-pin)
1 x Water Pump header (4-pin)
2 x Chassis Fan connectors (4-pin) for both 3-pin(DC mode) and
4-pin(PWM mode) coolers control
1 x Front panel audio connector (AAFP)
1 x S/PDIF out header
1 x Thunderbolt header (5-pin) for ASUS ThunderboltEX series
support
1 x TPM connector
1 x 24-pin EATX Power connector
1 x 8-pin EATX 12V Power connector
1 x System Panel(Q-Connector)
1 x MemOK! button
1 x CPU OV jumper
1 x Clear CMOS header
1 x DRCT(Direct Key) header
1 x 5-pin EXT_FAN(Extension Fan) connector
BIOS Features
128 Mb Flash ROM, UEFI AMI BIOS, PnP, DMI3.0, WfM2.0, SM
BIOS 3.0, ACPI 5.0, Multi-language BIOS, ASUS EZ Flash 3,
CrashFree BIOS 3, F11 EZ Tuning Wizard, F6 Qfan Control, F3
My Favorites, Quick Note, Last Modied log, F12 PrintScreen and
ASUS DRAM SPD (Serial Presence Detect) memory information
xv
Z170-PRO specifications summary
Specications are subject to change without notice.
Manageability
WfM 2.0, DMI 3.0, WOL by PME, PXE
Accessories
4 x Serial ATA 6.0Gb/s cables
1 x ASUS SLI bridge connector
1 x ASUS Q-Shield
1 x Q-connector
1 x M.2 screw package
1 x CPU Installation Tool
1 x User’s Manual
1 x Z170 Series Exclusive Feature manual
Support DVD contents
Drivers
ASUS Utilities
EZ Update
Anti-virus software (OEM version)
Operating system
support
Windows
®
10*
Windows
®
8.1*
Windows
®
7
* 64-bit supported only.
Form factor
ATX Form Factor, 12” x 9.6” (30.5 cm x 24.4 cm)
xvi
If any of the above items is damaged or missing, contact your retailer.
The illustrated items above are for reference only. Actual product specications may
vary with different models.
CPU Installation Tool & Q-Connector are in the color box package only.

Package contents

Check your motherboard package for the following items.
ASUS Z170-PRO Series motherboard
User manual
1 x CPU Installation Tool
Support DVD
4 x Serial ATA 6 Gb/s cables
1 x M.2 screws
1 x ASUS SLI™ bridge connector
1 x ASUS Q-Shield
User Manual
1 x ASUS Q-Connector kit
xvii

Installation tools and components

The tools and components above are not included in the motherboard package.
PC chassis
Power supply unit
Intel
®
LGA1151 compatible CPU Fan
Intel
®
LGA1151 CPU
DIMM
SATA hard disk drive
Graphics card
Phillips (cross) screwdriver
SATA optical disc drive (optional)
1 bag of screws
xviii
ASUS Z170-PRO Series
1-1
Chapter 1
Product Introduction
1

1.1 Special features

1.1.1 Product highlights

LGA1151 socket for the 6th Generation Intel
®
Core™ i7/Intel
®
Core™ i5/Intel
®
Core™ i3, Pentium
®
and Celeron
®
processors
This motherboard supports 6th generation Intel
®
Core™ i7/Intel
®
Core™ i5/Intel
®
Core™ i3,
Pentium
®
, and Celeron
®
processors in the LGA1151 package. It provides great graphics
and system performance with its GPU, dual-channel DDR4 memory slots and PCI Express
2.0/3.0 expansion slots.
Intel
®
Z170 Express Chipset
Intel
®
Z170 Express Chipset is a single chipset that supports the LGA1151 socket for the
6th generation Intel
®
Core™ i7/Intel
®
Core™ i5/Intel
®
Core™ i3, Pentium
®
, and Celeron
®
processors. It utilizes the serial point-to-point links, which increases bandwidth and enhances
the system’s performance. It natively supports up to ten USB 3.0 ports, six SATA 6 Gb/s
ports, and M.2 Gen 3 X4 support for faster data retrieval.
PCI Express
®
3.0
PCI Express
®
3.0 (PCIe 3.0) is the PCI Express bus standard that provides twice the
performance and speed of PCIe 2.0. It provides an optimal graphics performance,
unprecedented data speed and seamless transition with its complete backward compatibility
to PCIe 1.0/2.0 devices.
Quad-GPU SLI and 3-WAY CrossFireX™ Support
This motherboad features NVIDIA SLI and 3-Way AMD CrossreX support that enables
mulit-GPU setup, giving you the full power of the latest graphics technologies. It also features
native support for 4K/UHD (ultra high denition) resolution of up to 4096 x 2160 via HDMI or
DisplayPort, resulting to four times the number of pixels for incredible visual clarity, detail,
and realism.
SATA Express support
SATA Express provides faster data transfer speeds of up to 10 Gb/s, allowing your system to
catch up with the speed of the SSDs. It also features backward compatibility with up to two
SATA drives of the same speed.

Chapter 1: Product Introduction

1-2
Chapter 1: Product Introduction
Chapter 1
Dual-Channel DDR4 3866 MHz Support
The motherboard supports the dual-channel DDR4 memory that features data transfer rates
of DDR4 3866 MHz to boost the system’s performance, and to meet the higher bandwidth
requirements of 3D graphics, multimedia and Internet applications.
PCIe 3.0 x4 M.2 Support
With a 4x PCI Express 3.0/2.0 bandwidth, the M.2 can support up to 32 Gbit/s of data transfer
speed. It is a perfect choice for the operating system or application drive, making your system
and its installed apps work in a faster pace.
Complete USB 3.1 integration
This motherboard has the latest USB 3.1 connectivity built in for the very fastest USB data
transfers — that’s up to 10 Gb/s, or twice as fast as USB 3.0. The next-generation standard
is completely backward-compatible with your existing USB devices, and you’ll be all set for
USB 3.1’s breakneck speeds.

1.1.2 Other special features

DTS Connect
To get the most out of your audio entertainment across all formats and quality levels, DTS
Connect combines two enabling technologies, DTS Neo:PC™ upmixes stereo sources (CDs,
MP3s, WMAs, internet radio) into as many as 7.1 channels of incredible surround sound.
Consumers can connect their PC to a home theater system. DTS Interactive is capable of
performing mult-channel encoding of DTS bitstreams on personal computers, and sending
encoded bitstreams out of a digital audio connection (such as S/PDIF or HDMI) designed to
deliver audio to an external decoder.
ErP Ready
The motherboard is European Union’s Energy-related Products (ErP) ready, and ErP
requires products to meet certain energy efciency requirement in regards to energy
consumptions. This is in line with ASUS vision of creating environment-friendly and energy-
efcient products through product design and innovation to reduce carbon footprint of the
product and thus mitigate environmental impacts.
ASUS Z170-PRO Series
1-3
Chapter 1
Unplug the power cord from the wall socket before touching any component.
Before handling components, use a grounded wrist strap or touch a safely grounded
object or a metal object, such as the power supply case, to avoid damaging them due
to static electricity.
Hold components by the edges to avoid touching the ICs on them.
Whenever you uninstall any component, place it on a grounded antistatic pad or in the
bag that came with the component.
Before you install or remove any component, ensure that the ATX power supply is
switched off or the power cord is detached from the power supply. Failure to do so
may cause severe damage to the motherboard, peripherals, or components.

1.2 Motherboard overview

1.2.1 Before you proceed

Take note of the following precautions before you install motherboard components or change
any motherboard settings.
1-4
Chapter 1: Product Introduction
Chapter 1
Refer to 1.2.9 Internal Connectors and 2.2.1 Rear I/O connection for more information
about rear panel connectors and internal connectors.

1.2.2 Motherboard layout

ASUS Z170-PRO Series
1-5
Chapter 1
Layout contents
Connectors/Jumpers/Buttons and switches/Slots Page
1. ATX power connectors (24-pin EATXPWR, 8-pin EATX12V) 1-29
2. LGA1151 CPU socket 1-6
3. CPU, water pump, CPU optional, extension, and chassis fan connectors
(4-pin CPU_FAN; 3-pin W_PUMP; 4-pin CPU_OPT; 5-pin EXT_FAN; 4-pin
CHA_FAN1-2)
1-28
4. DDR4 DIMM slots 1-7
5. MemOK! button 1-19
6. USB 3.0 connectors (20-1 pin USB3_12, USB3_34) 1-26
7. Intel
®
Serial ATA 6 Gb/s connectors (7-pin SATA 6G_34; SATA 6G_56;
SATAEXPRESS)
1-23
8. M.2 Socket 3 1-32
9. System panel connector (20-5 pin PANEL) 1-30
10. Clear RTC RAM (2-pin CLRTC) 1-20
11. DirectKey connector (2-pin DRCT) 1-31
12. USB 2.0 connectors (10-1 pin USB1112; USB1314) 1-27
13. Thunderbolt header (5-pin TB_HEADER) 1-25
14. TPM connector (14-1 pin TPM) 1-31
15. T_Sensor connector (2-pin T_SENSOR) 1-24
16. Front panel audio connector (10-1 pin AAFP) 1-25
17. Digital audio connector (4-1 pin SPDIF_OUT) 1-24
18. CPU Over Voltage jumper (3-pin CPU_OV) 1-21
1-6
Chapter 1: Product Introduction
Chapter 1

1.2.3 Central Processing Unit (CPU)

The motherboard comes with a surface mount LGA1151 socket designed for the 6th
Generation Intel
®
Core™ i7 / Intel
®
Core™ i5 / Intel
®
Core™ i3, Pentium
®
, and Celeron
®
processors.
Ensure that all power cables are unplugged before installing the CPU.
Upon purchase of the motherboard, ensure that the PnP cap is on the socket and
the socket contacts are not bent. Contact your retailer immediately if the PnP cap
is missing, or if you see any damage to the PnP cap/socket contacts/motherboard
components. ASUS will shoulder the cost of repair only if the damage is shipment/
transit-related.
Keep the cap after installing the motherboard. ASUS will process Return Merchandise
Authorization (RMA) requests only if the motherboard comes with the cap on the
LGA1151 socket.
The product warranty does not cover damage to the socket contacts resulting from
incorrect CPU installation/removal, or misplacement/loss/incorrect removal of the PnP
cap.
Ensure that you install the correct CPU designed for LGA1151 socket only. DO NOT install
a CPU designed for other sockets on the LGA1151 socket.
ASUS Z170-PRO Series
1-7
Chapter 1
Recommended memory configurations

1.2.4 System memory

The motherboard comes with four (4) Double Data Rate 4 (DDR4) Dual Inline Memory
Modules (DIMM) slots.
A DDR4 module is notched differently from a DDR, DDR2, or DDR3 module. DO NOT
install a DDR, DDR2, or DDR3 memory module to the DDR4 slot.
1-8
Chapter 1: Product Introduction
Chapter 1
You may install varying memory sizes in Channel A and Channel B. The system
maps the total size of the lower-sized channel for the dual-channel conguration. Any
excess memory from the higher-sized channel is then mapped for single-channel
operation.
According to Intel
®
CPU spec, DIMM voltage below 1.65 V is recommended to protect
the CPU.
Due to the memory address limitation on 32-bit Windows
®
OS, when you install 4GB
or more memory on the motherboard, the actual usable memory for the OS can be
about 3GB or less. For effective use of memory, we recommend that you do any of the
following:
a) Use a maximum of 3GB system memory if you are using a 32-bit Windows
®
OS.
b) Install a 64-bit Windows
®
OS when you want to install 4 GB or more on the
motherboard.
c) For more details, refer to the Microsoft
®
support site at http://support.microsoft.
com/kb/929605/en-us.
This motherboard does not support DIMMs made up of 512 Mb (64 MB) chips or less
(Memory chip capacity counts in Megabit, 8 Megabit/Mb = 1 Megabyte/MB).
The default memory operation frequency is dependent on its Serial Presence Detect
(SPD), which is the standard way of accessing information from a memory module.
Under the default state, some memory modules for overclocking may operate at a
lower frequency than the vendor-marked value. To operate at the vendor-marked
or at a higher frequency, refer to section 3.5 Ai Tweaker menu for manual memory
frequency adjustment.
For system stability, use a more efcient memory cooling system to support a full
memory load (4 DIMMs) or overclocking condition.
Always install the DIMMS with the same CAS Latency. For an optimum compatibility,
we recommend that you install memory modules of the same version or data code
(D/C) from the same vendor. Check with the vendor to get the correct memory
modules.
When running XMP at DDR4 3200 MHz or higher, the system’s stability depends on
the CPU’s capabilities.
Memory configurations
You may install 2 GB, 4 GB, 8 GB, and 16 GB unbuffered and non-ECC DDR4 DIMMs into
the DIMM sockets.
ASUS Z170-PRO Series
1-9
Chapter 1
Z170-PRO Motherboard Qualified Vendors Lists (QVL)
Vendors Part No. Size SS/DS Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
CORSAIR CMK8GX4M2B3866C19
ver. 4.23
16GB(4GB*4) SS Samsung K4A4G085WD 19-23-23-45 1.35V
Vendors Part No. Size SS/DS Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3800C18D-8GTZ 8GB(4GB*2) SS Samsung K4A4G085WD 18-20-20-38 1.35V
AVEXIR AVD4UZ138001804G-
2XXXX
8GB(4GB*2) SS Samsung K4A4G085WD 18-20-20-40 1.35V
Vendors Part No. Size SS/DS Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3600C17D-8GRK 8GB(4GB*2) SS Samsung K4A4G085WD 17-18-18-38 1.35V
G.SKILL F4-3600C17D-8GTZ 8GB(4GB*2) SS Samsung K4A4G085WD 17-18-18-38 1.35V
G.SKILL F4-3600C17D-8GVK 8GB(4GB*2) SS Samsung K4A4G085WD 17-18-18-38 1.35V
G.SKILL F4-3600C17Q-16GRK 16GB(4GB*4) SS Samsung K4A4G085WD 17-18-18-38 1.35V
G.SKILL F4-3600C17Q-16GTZ 16GB(4GB*4) SS Samsung K4A4G085WD 17-18-18-38 1.35V
G.SKILL F4-3600C17Q-16GVK 16GB(4GB*4) SS Samsung K4A4G085WD 17-18-18-38 1.35V
CORSAIR CMD8GX4M2B3600C18
ver. 4.23
16GB(4GB*4) SS Samsung K4A4G085WD 18-19-19-39 1.35V
CORSAIR CMD16GX4M4B3600C18
ver. 4.23
16GB(4GB*4) SS Samsung K4A4G085WD 18-19-19-39 1.35V
AVEXIR AVD4UZ136001804G-
2XXXX
8GB(4GB*2) SS Samsung K4A4G085WD 18-20-20-40 1.35V
AVEXIR AVD4UZ136001804G-
4XXXX
16GB(4GB*4) SS Samsung K4A4G085WD 18-20-20-40 1.35V
Vendors Part No. Size SS/DS Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3733C17D-8GRK 8GB(4GB*2) SS Samsung K4A4G085WD 17-19-19-39 1.35V
G.SKILL F4-3733C17D-8GTZ 8GB(4GB*2) SS Samsung K4A4G085WD 17-19-19-39 1.35V
G.SKILL F4-3733C17D-8GVK 8GB(4GB*2) SS Samsung K4A4G085WD 17-19-19-39 1.35V
G.SKILL F4-3733C17D-16GRK 16GB(4GB*4) SS Samsung K4A4G085WD 17-19-19-39 1.35V
G.SKILL F4-3733C17D-16GTZ 16GB(4GB*4) SS Samsung K4A4G085WD 17-19-19-39 1.35V
G.SKILL F4-3733C17D-16GVK 16GB(4GB*4) SS Samsung K4A4G085WD 17-19-19-39 1.35V
AVEXIR AVD4UZ137331804G-
2XXXX
8GB(4GB*2) SS Samsung K4A4G085WD 18-20-20-40 1.35V
DDR4 3866 (O.C.) MHz capability
DDR4 3800 (O.C.) MHz capability
DDR4 3600 (O.C.) MHz capability
DDR4 3733 (O.C.) MHz capability
1-10
Chapter 1: Product Introduction
Chapter 1
Vendors Part No. Size SS/DS Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3400C16D-16GRK 16GB(8GB*2) DS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16D-16GTZ 16GB(8GB*2) DS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16D-16GVK 16GB(8GB*2) DS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16D-32GRK 32GB(16GB*2) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3400C16D-32GTZ 32GB(16GB*2) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3400C16D-32GVK 32GB(16GB*2) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-16GRBD 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-16GRKD 16GB(4GB*4) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3400C16Q-16GRBD 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-32GRK 32GB(8GB*4) DS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-32GTZ 32GB(8GB*4) DS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-32GVK 32GB(8GB*4) DS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-64GRK 64GB(16GB*4) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-64GTZ 64GB(16GB*4) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3400C16Q-64GVK 64GB(16GB*4) DS Samsung 16-18-18-38 1.35V
CORSAIR CMD16GX4M4B3400C16
ver. 5.29
16GB(4GB*4) SS SK Hynix H5AN4G8NMFR 16-18-18-40 1.35V
CORSAIR CMK16GX4M4B3400C16
ver. 4.23
16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-36 1.35V
CORSAIR CMK16GX4M2B3400C16
ver. 4.23
16GB(8GB*2) DS Samsung K4A4G085WD 16-18-18-36 1.35V
CORSAIR CMK32GX4M4B3400C16
ver. 4.23
32GB(8GB*4) DS Samsung K4A4G085WD 16-18-18-36 1.35V
Vendors Part No. Size SS/DS Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3466C16D-8GRK 8GB(4GB*2) SS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3466C16D-8GTZ 8GB(4GB*2) SS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3466C16D-8GVK 8GB(4GB*2) SS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3466C16Q-16GRK 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3466C16Q-16GTZ 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-38 1.35V
G.SKILL F4-3466C16Q-16GVK 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-38 1.35V
CORSAIR CMD16GX4M4B3466C18 16GB(4GB*4) SS Samsung K4A4G085WD 18-19-19-39 1.35V
AVEXIR AVD4UZ134661704G-
2XXXX
8GB(4GB*2) SS Samsung K4A4G085WD 17-18-18-38 1.35V
AVEXIR AVD4UZ134661704G-
4XXXX
16GB(4GB*4) SS Samsung K4A4G085WD 17-18-18-38 1.35V
DDR4 3466 (O.C.) MHz capability
DDR4 3400 (O.C.) MHz capability
ASUS Z170-PRO Series
1-11
Chapter 1
DDR4 3333 (O.C.) MHz capability
DDR4 3300 (O.C.) MHz capability
Vendors Part No. Size SS/
DS
Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3333C16Q-16GRKD 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-36 1.35V
CORSAIR CMD16GX4M4B3333C16
ver4.23
16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-36 1.35V
A-DATA AX4U3333W4G16 16GB(4GB*4) SS SK Hynix H5AN4G8NMFR 16-16-16-36 1.35V
AVEXIR AVD4UZ133331604G-
2XXXX
8GB(4GB*2) SS Samsung K4A4G085WD 16-18-18-38 1.35V
AVEXIR AVD4UZ133331604G-
4XXXX
16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-38 1.35V
Vendors Part No. Size SS/
DS
Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3300C16Q-16GRK 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-36 1.35V
G.SKILL F4-3300C16Q-16GRKD 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-36 1.35V
CORSAIR CMD16GX4M4B3300C16 16GB(4GB*4) SS Samsung K4A4G085WD 16-18-18-36 1.35V
DDR4 3200 (O.C.) MHz capability
Vendors Part No. Size SS/
DS
Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
G.SKILL F4-3200C16D-8GRK 8GB(4GB*2) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16D-8GTZ 8GB(4GB*2) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16D-8GVK 8GB(4GB*2) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16D-16GRK 16GB(8GB*2) DS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16D-16GTZ 16GB(8GB*2) DS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16D-16GVK 16GB(8GB*2) DS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C15D-32GRK 32GB(16GB*2) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3200C15D-32GTZ 32GB(16GB*2) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3200C15D-32GVK 32GB(16GB*2) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3200C16D-32GRK 32GB(16GB*2) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3200C16D-32GTZ 32GB(16GB*2) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3200C16D-32GVK 32GB(16GB*2) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3200C16Q-16GRR 16GB(4GB*4) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-16GRB 16GB(4GB*4) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-16GRKD 16GB(4GB*4) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-16GTZ 16GB(4GB*4) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-16GVK 16GB(4GB*4) SS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-32GRK 32GB(8GB*4) DS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-32GTZ 32GB(8GB*4) DS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-32GVK 32GB(8GB*4) DS Samsung K4A4G085WD 16-16-16-36 1.35V
G.SKILL F4-3200C16Q-64GRK 64GB(16GB*4) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3000C16Q-64GTZ 64GB(16GB*4) DS Samsung 16-18-18-38 1.35V
G.SKILL F4-3200C16Q-64GVK 64GB(16GB*4) DS Samsung 16-18-18-38 1.35V
AVEXIR AVD4U32001604G-4BZ1 16GB(4GB*4) SS SK Hynix H5AN4G8NMFR 16-18-18-36 1.35V
(continued on the next page)
1-12
Chapter 1: Product Introduction
Chapter 1
DDR4 3000 (O.C.) MHz capability
Vendors Part No. Size SS/
DS
Chip
Brand
Chip NO. Timing Voltage DIMM socket
support
(Optional)
1 2 4
G.SKILL F4-3000C15D-8GRK 8GB(4GB*2) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15D-8GTZ 8GB(4GB*2) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15D-8GVK 8GB(4GB*2) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15D-16GRK 16GB(8GB*2) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15D-16GTZ 16GB(8GB*2) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15D-16GVK 16GB(8GB*2) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15D-32GRK 32GB(16GB*2) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3000C15D-32GTZ 32GB(16GB*2) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3000C15D-32GVK 32GB(16GB*2) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-16GRR 16GB(4GB*4) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-16GRB 16GB(4GB*4) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-16GRK 16GB(4GB*4) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-16GTZ 16GB(4GB*4) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-16GVK 16GB(4GB*4) SS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-32GRR 32GB(8GB*4) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-32GRB 32GB(8GB*4) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-32GRK 32GB(8GB*4) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-32GTZ 32GB(8GB*4) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-32GVK 32GB(8GB*4) DS Samsung K4A4G085WD 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-64GRK 64GB(16GB*4) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-64GTZ 64GB(16GB*4) DS Samsung 15-15-15-35 1.35V
G.SKILL F4-3000C15Q-64GVK 64GB(16GB*4) DS Samsung 15-15-15-35 1.35V
AVEXIR AVD4U30001604G-4CI 16GB(4GB*4) SS SK Hynix H5AN4G8NMFR 16-18-18-36 1.35V
AVEXIR AVD4U30001504G-4BZ1 16GB(4GB*4) SS SK Hynix H5AN4G8NMFR 15-15-15-35 1.35V
AVEXIR AVD4U30001608G-4CI 32GB(8GB*4) DS SK Hynix H5AN4G8NMFR 16-18-18-36 1.35V
Kingston HX430C15PB2K4/16 16GB(4GB*4) SS 15-16-16-39 1.35V
CORSAIR CMD16GX4M4B3000C15 16GB(4GB*4) SS Samsung K4A4G085WD 15-17-17-35 1.35V
CORSAIR CMK16GX4M4B3000C15 16GB(4GB*4) SS Samsung K4A4G085WD 15-17-17-35 1.35V
Panram PUD43000C154G4NJW 16GB(4GB*4) SS 15-17-17-35 1.35V
Asint SLB404G08-EWWHMX 16GB(8GB*2) SS SK Hynix H5AN4G8NMFR 15-15-15-44 1.35V
AVEXIR AVD4U32001604G-4CIR 16GB(4GB*4) SS 16-18-18-36 1.35V
CORSAIR CMD16GX4M4B3200C16 16GB(4GB*4) SS 16-18-18-36 1.35V
CORSAIR CMK32GX4M2B3200C16 32GB(16GB*2) DS Samsung 16-18-18-36 1.35V
GEIL GPR416GB3200C15QC 16GB(4GB*4) SS 15-15-15-35 1.35V
Kingston HX432C16PB2K4/16 16GB(4GB*4) SS 16-16-16-39 1.35V
Panram PUD43200C164G4NJW 16GB(4GB*4) SS 16-18-18-39 1.35V
DDR4 3200 (O.C.) MHz capability
Vendors Part No. Size SS/
DS
Chip
Brand
Chip NO. Timing Voltage DIMM socket
support (Optional)
1 2 4
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