No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidenta l, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Page 3
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
Page 4
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
Chapter 2 Installation 11
2.1 Installing the CPU 12
2.2 Installing the CPU Fan and Heatsink 15
2.3 Installing Memory Modules (DIMM) 16
2.4 Expansion Slots (PCI and PCI Express Slots) 18
2.5 Jumpers Setup 19
2.6 Onboard Headers and Connectors 20
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide 25
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards 25
2.7.2 Driver Installation and Setup 27
2.8 M.2_SSD (NGFF) Module Installation Guide 28
Chapter 3 Software and Utilities Operation 32
3.1 Installing Drivers 32
3.2 A-Tuning 33
3.2.1 Installing A-Tuning 33
3.2.2 Using A-Tuning 33
3.3 ASRock Live Update & APP Shop 36
Page 5
3.3.1 UI Overview 36
3.3.2 Apps 37
3.3.3 BIOS & Drivers 40
3.3.4 Setting 41
Chapter 4 UEFI SETUP UTILITY 42
4.1 Introduction 42
4.2 EZ Mode 43
4.3 Advanced Mode 44
4.3.1 UEFI Menu Bar 44
4.3.2 Navigation Keys 45
4.4 Main Screen 46
4.5 OC Tweaker Screen 47
4.6 Advanced Screen 57
4.6.1 CPU Conguration 58
4.6.2 Chipset Conguration 60
4.6.3 Storage Conguration 63
4.6.4 Intel® Thunderbolt 65
4.6.5 Super IO Conguration 66
4.6.6 ACPI Conguration 67
4.6.7 USB Conguration 69
4.6.8 Trusted Computing 70
4.7 Tools 71
4.8 Hardware Health Event Monitoring Screen 74
4.9 Security Screen 77
Page 6
4.10 Boot Screen 78
4.11 Exit Screen 81
Page 7
Chapter 1 Introduction
ank you for purchasing ASRock Z370 Pro4 motherboard, a reliable motherboard
produced under ASRock ’s consistently stringent quality control. It delivers excellent
performance with robust design conforming to ASRock’s commitment to quality
and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specication s and the BIOS soware might be updated, the
content of this doc umentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version w ill be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, plea se visit our website for spec ic infor mation about the model
you are using. You may nd the latest VGA cards and CPU support li st on ASRock’s
website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock Z370 Pro4 Motherboard (ATX Form Factor)
•
ASRock Z370 Pro4 Quick Installation Guide
•
ASRock Z370 Pro4 Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
1 x I/O Panel Shield
•
3 x Screws for M.2 Sockets (Optiona l)
•
Z370 Pro4
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1
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1.2 Specications
Platform
CPU
Chipset
Memory
* Please refer to Memory Support List on ASRock's website for
Please realize that there is a certain risk involved with overcl ocking, including
adjusting the setting in the BIOS, applying Untie d Overclocking Technology, or using
third-party overclocking tools. Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system . It should be done
at your own risk and expen se. We are not responsible for possible damage caused by
overclocking.
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
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1.3 Motherboard Layout
Intel
Z370
DDR 4_A2 (6 4 bit, 28 8-pin m odule )
DDR 4_A1 (6 4 bit, 28 8-pin m odule )
DDR 4_B2 (6 4 bit, 28 8-pin m odule )
DDR 4_B1 (6 4 bit, 28 8-pin m odule )
ATX12V1
USB 3.1 G en1
T: USB3_ 1
B: USB 3_2
ATXP WR 1
PCIE2
Top:
RJ-45
USB 3.1 Gen1
T: USB3_3
B: USB3_4
PCIE4
HDLED RESET
PLED PWRBTN
PANEL1
1
USB_3_4
1
1
SPK_PLED1
COM1
1
1
HD_AUDIO1
Z370 Pro4
PCIE1
RoHS
10
8
9
13
14
15
16
17
1819
20
23
1
4
3
21
Ultra M.2
PCIe Gen3 x4
PS2
Keybo ard
/Mous e
CMOS
Battery
PCIE3
25
12
6
USB3_ 5_6
1
22
CHA_FAN2
11
USB_1_2
1
24
1
TPMS1
M2_ 1
C 3C 2C 1C 4
7
Front USB 3.0
CHA_FAN3/W_PUMP
BIOS
ROM
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
SATA_4
SATA_5
CHA_FAN1
CI1
1
26
PCI Express 3.0
SATA_2
SATA_3
SATA_0
SATA_1
CLRMOS1
1
USB_5
1
CPU_FAN1
M2_ 3
NUT1
M2_ 2
C 7C 6C 5C 8
HDMI1
DVI 1
VGA 1
USB 3.1 Gen1
T:USB3_TA_1
B: USB3_TC_1
T B2
1
5
2
PCIE5
PCI1
Antenna Port
T
T
T
T
T
T
T
T
AUDIO
CODEC
LAN
SUPER
I/O
Z370 Pro4
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No. Description
1ATX 12V Power Connector (ATX12V1)
2Chassis Fan Connector (CHA_FAN2)
32 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
42 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)
5CPU Fan Connector (CPU_FAN1)
6ATX Power Connector (ATXPWR1)
7USB 3.1 Gen1 Header (USB3_5_6)
8SATA3 Connector (SATA_5)
9SATA3 C onnector (SATA _4)
10 SATA3 Connector (SATA_3)
11 SATA3 Connector (SATA_2)
12 SATA3 Connector (SATA_1)
13 SATA3 Connector (SATA_0)
14 System Panel Header (PANEL1)
15 Power LED and Speaker Header (SPK_PLED1)
16 Chassis Fan / Waterpump Fan Connector (CHA_FAN3/W_PUMP)
** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multichannel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker” in the Realtek HD Audio Man ager.
Function of the Audio Ports in 7.1-channel Conguration:
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10
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
Page 17
Chapter 2 Installation
is is an ATX form factor motherboard. Before you install the motherboard, study
the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
Z370 Pro4
11
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Page 18
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket , please check if the PnP cap
is on the socket, if the CPU surface is unclean, or if there are any bent pins in the
socket. Do not force to insert the CPU into the socket if above situation i s found.
Other wise, the CPU wil l be seriously damaged.
2. Unplug all power cables before installing the CPU.
1
2
A
B
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Z370 Pro4
3
4
5
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13
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Please save and replace the cover if the processor is removed. e cover mus t be
placed if you wish to return the motherboard for aer service.
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Page 21
2.2 Installing the CPU Fan and Heatsink
12
Z370 Pro4
FAN
CPU_
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15
Page 22
2.3 Installing Memory Modules (DIMM)
is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same
brand, speed, size and chip-ty pe) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one or three
memory module installed.
3. It is not allowed to in stall a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwi se, this motherboard and DIMM may be damaged .
e DIMM only ts in one correct orientation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incorrect
orientation.
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Z370 Pro4
1
2
3
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2.4 Expansion Slots (PCI and PCI Express Slots)
ere is 1 PCI slot and 5 PCI Express slots on the motherboard.
Before installing an expansion c ard, ple ase make sure that the power supply is
switched o or the power cord is unplug ged. Please read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you star t
the installation.
PCI slot:
e PCI1 is used to install expansion cards that have 32-bit PCI interface.
PCIe slots:
PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE4 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
PCIE5 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
*If PCIE5 slot or PCI slot is occupied, PCIE4 slot will run at x2 mode.
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PCIe Slot Congurations
PCIE2PCIE4
Single Graphics Cardx16N/A
Two Graphics Cards in
CrossFireXTM Mode
For a better ther mal environment , please connect a chassis fan to the motherboard’s
chassis fan connector (CHA_FAN1, CHA_FAN2 or CH A_FAN3) when using multiple graphics cards.
x16x4
Page 25
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
Z370 Pro4
Clear CMOS Jumper
(CLR CMOS1)
(see p.7, No. 21)
CLRCMOS1 allows you to clear the data in CMOS. e data in CMOS includes
system setup information such as system password, date, time, and system setup
parameters. To clear and reset the system parameters to default setup, please
turn o the computer and unplug the power cord, then use a jumper cap to short
the pins on CLRCMOS1 for 3 seconds. Please remember to remove the jumper
cap aer clearing the CMOS. If you need to clear the CMOS when you just nish
updating the BIOS, you must boot up the system rst, and then shut it down
before you do the clear-CMOS action.
2-pin Jumper
Short: Clear CMOS
Open: Default
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2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
System Panel Header
(9-p in PA NE L1)
(see p.7, No. 14)
PWRBTN (Power But ton):
Connec t to the power button on the cha ssis front panel. You may congure the way to
turn o your system using the power button.
RESET (Reset Button):
Connec t to the reset button on the chassis f ront panel. Pre ss the reset button to
restar t the computer if the computer freezes and fails to per form a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassi s front panel. e LED is on when
the system is operating. e LED keeps blinking whe n the system is in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powe red o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis f ront panel. e LED is on
when the hard drive is reading or writing data.
e front panel design may dier by chassis . A front panel module mainly consists
of power button, reset but ton, power LED, h ard drive activity LED, speaker and etc.
When connecting your cha ssis front panel module to this header, make sure the wire
assig nments and the pin assignments are matched correctly.
1
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
button, reset button and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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Z370 Pro4
PLED-
SPEAKER
Power LED and Speaker
Header
(7-pin SPK_PLED1)
(see p.7, No. 15)
Serial ATA3 Connectors
(SATA_0 :
see p.7, No. 13)
(SATA_1:
see p.7, No. 12)
(SATA_2:
see p.7, No. 11)
(SATA_3:
see p.7, No. 10)
(SATA_4:
see p.7, No. 9)
(SATA_5:
see p.7, No. 8)
USB 2.0 Headers
(9-pin USB_1_2)
(see p.7, No. 18)
(9-pin USB_3_4)
(see p.7, No. 19)
DUMMY
+5V
1
USB_PWR
1
USB_PWR
DUMMY
PLED+
PLED+
SATA_4
SATA_2
SATA_0
P-
P+
P+
P-
GND
GND
DUMMY
Please connect the
chassis power LED and
the chassis speaker to this
header.
ese six SATA3
connectors support SATA
data cables for internal
SATA_5
storage devices with up to
6.0 Gb/s data transfer rate.
SATA_3
* If M2_1 is occupied by
a SATA-type M.2 device,
SATA_5 will be disabled.
SATA_1
* If M2_2 is occupied by
a SATA-type M.2 device,
SATA_0 will be disabled.
ere are two USB
2.0 headers on this
motherboard. Each USB
2.0 header can support
two ports.
USB 2.0 Header
(4-pin USB_5)
(see p.7, No. 20)
1
USB_PWR
ere is one USB
2.0 header on this
GND
P+
P-
motherboard. Each header
can support one port.
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USB 3.1 Gen1 Header
1 2 3 4
(19-pin USB3_5_6)
(see p.7, No. 7)
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.7, No. 25)
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis
must support HDA to function corre ctly. Plea se follow the instructions in our
manual and chas sis manual to install your system.
2. If you use an AC’97 audio panel, please in stall it to the front panel au dio header by
the steps below:
A. Connect Mic_ IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2 _R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
GND
1
MIC2_L
1
PRESENCE#
MIC_RET
J_SENSE
OUT2_R
MIC2_R
VbusVbus
IntA_PB_SSRX-
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
IntA_PB_SSTX+
GND
IntA_PB_D-
IntA_PB_D+
Dummy
OUT_RET
OUT2_L
ere is one header on
this motherboard. Each
USB 3.1 Gen1 header can
support two ports.
is header is for
connecting audio devices
to the front audio panel.
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Chassis Fan Connectors
(4-pin CHA_FAN1)
(see p.7, No. 17)
(4-pin CHA_FAN2)
(see p.7, No. 2)
FAN_SPEED_CONTROL
CHA_FAN_SPEED
FAN_VOLTAGE
Please connect fan cables
to the fan connectors and
match the black wire to
the ground pin.
GND
Page 29
Z370 Pro4
1 2 3 4
Chassis Fan / Waterpump
Fan Connector
(4-pin CHA_FAN3/W_
PUM P)
(see p.7, No. 16)
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.7, No. 5)
ATX Power Connector
(24-pin AT XPWR 1)
(see p.7, No. 6)
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.7, No. 1)
FAN_SPEED_CONTROL
CHA_FAN_SPEED
FAN_VOLTAGE
FAN_VOLTAGE
CPU_FAN_SPEED
GND
FAN_SPEED_CONTROL
4 3 2 1
12
1
8
4
Please connect fan cables
to the fan connectors and
match the black wire to
the ground pin.
GND
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
24
is motherboard pro-
vides a 24-pin ATX power
connector. To use a 20-pin
ATX power supply, please
plug it along Pin 1 and Pin
13
5
1
13.
is motherboard pro-
vides an 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
Serial Port Header
(9-pin C OM 1)
(see p.7, No. 24)
1
RRXD1
DDTR#1
TTXD1
DDCD#1
DDSR#1
CCTS#1
RRTS#1
GND
RRI#1
is COM1 header
supports a serial port
module.
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23
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Chassis Intrusion Header
(2-pin C I1)
(see p.7, No. 22)
1
Signal
GND
is motherboard supports
CASE OPEN detect ion feat ure
th at detec ts if t he c ha ssis cove
has been removed. This feature
requires a cha ssis with c ha ssis
intrusion detection design.
TPM Header
(17-pi n TPMS1)
(see p.7, No. 23)
underbolt AIC
Connector
(5-pin TB2)
(see p.7, No. 26)
is connector supports Trusted
Platform Module (TPM) system,
which can securely store keys,
SMB _CLK _MA IN
GND
SMB _DAT A_M AIN
LAD 2
GND
LAD 1
S_P WRDW N#
SER IRQ#
GND
digital certicates, passwords,
1
+3V
LAD 3
LAD 0
FRA ME
PCI CLK
PCI RST#
1
and data. A TPM system also
helps enhance network security,
GND
protects digital identities, and
+3V SB
ensures platform integrity.
Please connect a underbolt™
add-in card (AIC) to this
connector via the GPIO cable.
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2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide
is motherboard supports CrossFireXTM and Quad CrossFireXTM that allows you
to install up to three identical PCI Express x16 graphics cards.
1. You should only use identical CrossFireXTM-ready g raphics cards that are AMD
certied.
2. Make sure that your graphics c ard drive r suppor ts AMD CrossFireXTM technology.
Download the dr ivers from the AMD’s website: www.amd .com
3. Make sure that your power supply unit (PSU) can provide at least the minimum
power your system requires . It is recommended to use a AMD certied PSU. Ple ase
refer to the AMD’s website for details.
4. If you pair a 12-pipe CrossFireXTM Edition card with a 16-pipe card , both cards will
operate a s 12-pipe cards while in CrossFireXTM mode.
5. Dierent CrossFireXTM cards may require dierent methods to enable CrossFireXTM. Please refer to AMD graphics card manuals for detail ed installation guid e.
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards
Step 1
Insert one graphics card into PCIE2 slot
and the other graphics card to PCIE4 slot.
Make sure that the cards are properly
seated on the slots.
Z370 Pro4
CrossFire Bridge
Step 2
Connect two graphics cards by installing
a CrossFire Bridge on the CrossFire Bridge
Interconnects on the top of the graphics
cards. (e CrossFire Bridge is provided
with the graphics card you purchase, not
bundled with this motherboard. Please
refer to your graphics card vendor for
deta ils.)
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Page 32
Step 3
Connect a VGA cable or a DVI cable to the
monitor connector or the DVI connec-
tor of the graphics card that is inserted to
PCIE2 slot.
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26
Page 33
2.7.2 Driver Installation and Setup
Step 1
Power on your computer and boot into OS.
Step 2
Remove the AMD drivers if you have any VGA drivers installed in your system.
e Catalyst Uninstaller i s an optional download. We recommend using thi s utility
to uninstall any previously installed Catalyst dr ivers pr ior to installation. Please
check A MD’s website for AMD driver upd ates.
Step 3
Install the required drivers and CATALYST Control Center then restart your
computer. Please check AMD’s website for details.
Step 4
Double-click the AMD Catalyst Control
AMD Catalyst Control Center
Center icon in the Windows® sy st em tr ay.
Z370 Pro4
Step 5
In the le pane, click Performance and
then AMD CrossFireXTM. en select
Enable AMD CrossFireX and click Apply.
Select the GPU number according to your
graphics card and click Apply.
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Page 34
2.8 M.2_SSD (NGFF) Module Installation Guide
e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and
versatile card edge connector that aims to replace mPCIe and mSATA. e Ultra M.2
Sockets (M2_1 and M2_2) support SATA3 6.0 Gb/s module and M.2 PCI Express module
up to Gen3 x4 (32 Gb/s).
* If M2_1 is occupied by a SATA-type M.2 device, SATA_5 will be disabled.
* If M2_2 is occupied by a SATA-type M.2 device, SATA_0 will be disabled.
TEAMPCIe3 x4TM8FP2240G0C101
TEAMPCIe3 x4TM8FP2480GC110
Tra ns ce ndSATA3TS256GMTS400
Tra ns ce ndSATA3TS512GMTS600
Tra ns ce ndSATA3TS512GMTS800
V-Co lorSATA3VLM100-120G-2280B-RD
V-Co lorSATA3VLM10 0-240G-2280RGB
V-Co lorSATA3VSM100 -240G-2280
V-Co lorSATA3VLM10 0-240G-2280B-R D
WDSATA3WDS100T1B0B-00AS40
WDSATA3WDS240G1G0B-00RC30
WDPCIe3 x4WDS256G1X0C-00ENX0 (NVME)
WDPCIe3 x4WDS512G1X0C-00EN X0 (NVME)
For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for
details: http://www.asrock.com
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Chapter 3 Software and Utilities Operation
3.1 Installing Drivers
e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard ’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Install All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to install it.
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3.2 A-Tuning
A-Tuning is ASRock’s multi purpose soware suite with a new interface, more new
features and improved utilities.
3.2.1 Installing A-Tuning
A-Tu ni ng can be downloaded from ASRock Live Update & APP Shop. Aer the
installation, you will nd the icon “A-Tuni ng“ on your desktop. Double-click the
“A-Tu ni ng“ icon, A-Tu ni ng main menu will pop up.
3.2.2 Using A-Tuning
ere are ve sections in A-Tuning main menu: Operation Mode, OC Tweaker,
System Info, FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
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OC Tweaker
Congurations for overclocking the system.
System Info
View information about the system.
*e System Browser tab may not appear for certain models.
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FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
Settings
Congure ASRock A-Tuning. Click to select "Auto run at Windows Startup" if you
want A-Tuning to be launched when you start up the Windows operating system.
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3.3 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quickly
and easily install various apps and support utilities. With ASRock APP Shop, you
can optimize your system and keep your motherboard up to date simply with a few
clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop
utility.
*You need to be connected to the Internet to download ap ps from the ASRock Live Update & APP Shop.
3.3.1 UI Overview
Category Panel
Hot News
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Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
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3.3.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
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e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Step 3
If you want to install the app, click on the red icon
Step 4
When installation completes, you can nd the green "Insta lled " icon appears on the
upper right corner.
to start downloading.
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To uninstall it, simply click on the trash can icon .
* e trash icon may not appear for certain apps.
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Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
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Step 2
Click on the yellow icon
to start upgrading.
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3.3.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
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Please check the item information before update. Click on
Step 2
Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
to see more details.
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3.3.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, otherwise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is cons tantly being updated, the following UEFI setup screens
and descriptions are for reference purpo se only, and they may not exactly match what you
see on your screen.
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4.2 EZ Mode
e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
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No.Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
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4.3 Advanced Mode
e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.
4.3.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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4.3.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
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+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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4.4 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.5 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclocking features.
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Becau se the UEFI soware is cons tantly being updated, the following UEFI setup screens
and descriptions are for reference purpo se only, and they may not exactly match what you
see on your screen.
CPU Conguration
Multi Core Enhancement
Improve the system's performance by forcing the CPU to perform the highest
frequency on all CPU cores simultaneously. Disable to reduce power consumption .
CPU Ratio
e CPU speed is determined by the CPU Ratio multiplied with the BCLK.
Increasing the CPU Ratio will increase the internal CPU clock speed without
aecting the clock speed of other components.
CPU Cache Ratio
e CPU Interna l Bus Speed Ratio. e maximum should be the same as the CPU
Ratio.
Minimum CPU Cache Ratio
Set the minimum CPU Internal Bus Speed Ratio.
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BCLK Frequency
e CPU speed is determined by the CPU Ratio multiplied with the BCLK.
Increasing the BCLK will increase the internal CPU clock speed but also aect the
clock speed of other components.
BCLK Spread Spectrum
Enable Spread Spectrum to reduce electromagnetic interference for passing EMI
tests. Disable to achieve higher clock speeds when overclocking.
Boot Performance Mode
Default is Max Non-Turbo performance mode. It will keep cpu Flex-ratio till OS
hando. Max Battery mode will set CPU ratio as x8 till OS hando. is option is
suggested for BCLK overclocking.
Reliability Stress Restrictor
Disable or Enable Reliability Stress Restrictor feature.
FCLK Frequency
Congure the FCLK Frequency.
AVX Ratio Oset
AVX Ratio Oset species a negative oset from the CPU Ratio for AVX workloads.
AVX is a more stressful workload that lower the AVX ratio to ensure maximum
possible ratio for SSE workloads.
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BCLK Aware Adaptive Voltage
Enable or disable BCLK Aware Adaptive Voltage. When enabled, pcode will be
aware of the BCLK frequency when calculating the CPU V/F curves. is is idea l for
BCLK OC to avoid high voltage overrides.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same
frequenc y.
Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
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Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
CPU Core Current Limit
Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
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DRAM Conguration
DRAM Tweaker
Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to conrm and
apply your new settings.
DRAM Timing Conguration
Load XMP Setting
Load XMP settings to overclock the memory and perform beyond standard
specications.
BCLK Frequency
e CPU speed is determined by the CPU Ratio multiplied with the BCLK.
Increasing the BCLK will increase the internal CPU clock speed but also aect the
clock speed of other components.
DRAM Frequency Clock
Select Auto for optimized settings.
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DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP) O
RAS# to CAS# Delay : e number of clock cycles required between the opening of
a row of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the
precharge command and opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memory chip is selected and when the rst active command can
be issued.
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Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
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Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read command to
the same internal bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read command to
the same internal bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
tRDWR_sg
Congure between module read to write delay.
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tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
tWRWR_sg
Congure between module write to write delay.
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tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
Fourth Timing
twRPRE
Congure twRPRE.
Write_Early_ODT
Congure Write_Early_ODT.
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tAONPD
Congure tAONPD.
tXP
Congure tXP.
tXPDLL
Congure tXPDLL.
tPRPDEN
Congure tPRPDEN.
tRDPDEN
Congure tRDPDEN.
twRPDEN
Congure twRPDEN.
OREF_RI
Congure OREF_RI.
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tREFIx9
Congure tREFIx9.
txSDLL
Congure txSDLL.
txs_oset
Congure txs_oset.
tZQOPER
Congure tZQOPER.
tMOD
Congure tMOD.
ZQCS_period
Congure ZQCS_period.
tZQCS
Congure tZQCS.
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RTL Init Value
Congure round trip latency init value for round trip latency training.
IO-L Init Value
Congure IO latency init value for IO latency traning.
RTL (CH A)
Congure round trip latency for channel A.
RTL (CH B)
Congure round trip latency for channel B.
IO-L (CH A)
Congure IO latency for channel A.
IO-L (CH B)
Congure IO latency for channel B.
IO-L Oset (CH A)
Congure IO latency oset for channel A.
IO-L Oset (CH B)
Congure IO latency oset for channel B.
RFR Delay (CH A)
Congure RFR Delay for Channel A.
RFR Delay (CH B)
Congure RFR Delay for Channel B.
Advanced Setting
ODT WR (CH A)
Congure the memory on die termination resistors' WR for channel A.
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ODT WR (CH B)
Congure the memory on die termination resistors' WR for channel B.
ODT PARK (CH A)
Congure the memory on die termination resistors' PARK for channel A.
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ODT PARK (CH B)
Congure the memory on die termination resistors' PARK for channel B.
ODT NOM (CH A)
Use this to change ODT (CH A) Auto/Manual settings. e default is [Auto].
ODT NOM (CH B)
Use this to change ODT (CH B) Auto/Manual settings. e default is [Auto].
MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
CPU Vcore Voltage
Congure the voltage for the CPU Vcore.
CPU Load-Line Calibration
CPU Load-Line Calibration helps prevent CPU voltage droop when the system is
under heav y load.
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DRAM Voltage
Use this to congure DRAM Voltage. e default value is [Auto].
DRAM Activating Power Supply
Congure the voltage for the DRAM Activating Power Supply.
PCH +1.0 Voltage
Congure the chipset voltage (1.0V).
VCCIO Voltage
Congure the voltage for the VCCIO.
VCCST Voltage
Congure the voltage for the VCCST.
VCCSA Voltage
Congure the voltage for the VCCSA.
CPU Internal PLL Voltage
Default is 0.900V. Each step is 0.015V. Adding 9- 15 steps will helps CPU PLL to
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lock internal clock during High frequency under Ln2 cooling. For example: 1.020V
- 1.125V will be proper value. But the voltage level will be dierent on each proces-
sor. User has to nd the best value for your own processor. CPU Vcore Voltage must
higher than CPU Internal PLL Voltage, or your processor will hang.
GT PLL Voltage
Default is 0.900V. Each step is 0.015V. Adding 9 -15 steps will help CPU PLL to lock
internal clock during High frequency under Ln2 cooling. For example: 1.020V -
1.125V will be proper value. Bu the voltage level will be dierent on each processor.
User has to nd the best value for user’s own processor.
Ring PLL Voltage
Default is 0.900V. Each step is 0.015V. Adding 9 -15 steps will help CPU PLL to lock
internal clock during High frequency under Ln2 cooling. For example: 1.020V -
1.125V will be proper value. Bu the voltage level will be dierent on each processor.
User has to nd the best value for user’s own processor.
System Agent PLL Voltage
Default is 0.900V. Each step is 0.015V. Adding 9 -15 steps will help CPU PLL to lock
internal clock during High frequency under Ln2 cooling. For example: 1.020V -
1.125V will be proper value. Bu the voltage level will be dierent on each processor.
User has to nd the best value for user’s own processor.
Memory Controller PLL Voltage
Default is 0.900V. Each step is 0.015V. Adding 9 -15 steps will help CPU PLL to lock
internal clock during High frequency under Ln2 cooling. For example: 1.020V -
1.125V will be proper value. Bu the voltage level will be dierent on each processor.
User has to nd the best value for user’s own processor.
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Save User Default
Type a prole name and press enter to save your settings as user default.
Load User Default
Load previously saved user defaults.
Save User UEFI Setup Prole to Disk
Save current UEFI settings as an user default prole to disk.
Load User UEFI Setup Prole to Disk
Load previously saved user defaults from the disk.
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4.6 Advanced Screen
In this section, you may set the congurations for the following items: CPU