Asrock H510M-HVS R2.0 User Manual

Version 1.0
Published March 2021
Copyright©2021 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/ perchlorate”
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Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel
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e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
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IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
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Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 6
1.4 I/O Panel 9
Chapter 2 Installation 11
2.1 Installing the CPU 12
2.2 Installing the CPU Fan and Heatsink 15
2.3 Installing Memory Modules (DIMM) 16
2.4 Expansion Slots (PCI Express Slots) 18
2.5 Jumpers Setup 19
2.6 Onboard Headers and Connectors 20
Chapter 3 Software and Utilities Operation 24
3.1 Installing Drivers 24
3.2 ASRock Motherboard Utility (A-Tuning) 25
3.2.1 Installing ASRock Motherboard Utility (A-Tuning) 25
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 25
3.3 ASRock Live Update & APP Shop 28
3.3.1 UI Overview 28
3.3.2 Apps 29
3.3.3 BIOS & Drivers 32
3.3.4 Setting 33
Chapter 4 UEFI SETUP UTILITY 34
4.1 Introduction 34
4.2 EZ Mode 35
4.3 Advanced Mode 36
4.3.1 UEFI Menu Bar 36
4.3.2 Navigation Keys 37
4.4 Main Screen 38
4.5 OC Tweaker Screen 39
4.6 Advanced Screen 49
4.6.1 CPU Conguration 50
4.6.2 Chipset Conguration 52
4.6.3 Storage Conguration 55
4.6.4 ACPI Conguration 56
4.6.5 USB Conguration 57
4.6.6 Trusted Computing 58
4.7 Tools 59
4.8 Hardware Health Event Monitoring Screen 61
4.9 Security Screen 63
4.10 Boot Screen 64
4.11 Exit Screen 67
H510M-HDV R2.0 H510M-HVS R2.0
Chapter 1 Introduction
ank you for purchasing ASRock H510M-HDV R2.0 / H510M-HVS R2.0
motherboard, a reliable motherboard produced under ASRock’s consistently
stringent quality control. It delivers excellent performance with robust design
conforming to ASRock’s commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website w ithout f urther notice. If you require technical support relate d to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website ht tp://www.a srock.com.

1.1 Package Contents

ASRock H510M-HDV R2.0 / H510M-HVS R2.0 Motherboard (Micro ATX Form
•
Factor)
ASRock H510M-HDV R2.0 / H510M-HVS R2.0 Quick Installation Guide
•
ASRock H510M-HDV R2.0 / H510M-HVS R2.0 Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
1 x I/O Panel Shield
•
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1.2 Specications
Platform
CPU
Chipset
Memory
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•
•
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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 3200;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
•
Micro ATX Form Factor
Solid Capacitor design
Supports 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
5 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® H510
Dual Channel DDR4 Memory Technology
2 x DDR4 DIMM Slots
Supports DDR4 3200/2933/2800/2666/2400/2133 non-ECC,
un-buered memory
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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Expansion Slot
Graphics
11th Gen Intel® CoreTM Processors
1 x PCI Express 4.0 x16 Slot*
•
10th Gen Intel® CoreTM Processors
1 x PCI Express 3.0 x16 Slot*
•
* Supports NVMe SSD as boot disks
1 x PCI Express 3.0 x1 Slot
•
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
•
Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
H510M-HDV R2.0 H510M-HVS R2.0
Graphics, Media & Compute: Microso DirectX 12, OpenGL
•
4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
•
Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
H510M-HDV R2.0:
ree graphics output options: D-Sub, DVI-D and HDMI
•
* Supports up to 2 displays simultaneously
Supports HDMI 2.0 with ma x. resolution up to 4K x 2K
•
(4096x2160) @ 60Hz
Supports DVI-D with ma x. resolution up to 1920x1200 @
•
60Hz
Supports D-Sub with max. resolution up to 1920x1200 @
•
60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with DVI-D and HDMI 2.0 Ports
•
H510M-HVS R2.0:
Dual graphics output: support HDMI and D-Sub ports by
•
independent display controllers
Supports HDMI 2.0 with ma x. resolution up to 4K x 2K
•
(4096x2160) @ 60Hz
Supports D-Sub with max. resolution up to 1920x1200 @
•
60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 Port
•
Audio
LAN
7.1 CH HD Audio (Realtek ALC887/897 Audio Codec)
•
Supports Surge Protection
•
PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•
1 x Realtek RTL8111H
•
Supports Wake-On-LAN
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English
Rear Panel I/O
Storage
Connector
Supports Lightning/ESD Protection
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Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
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1 x PS/2 Keyboard Port
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1 x PS/2 Mouse Port
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2 x USB 3.2 Gen1 Ports (Supports ESD Protection)
•
4 x USB 2.0 Ports (Supports ESD Protection)
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1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
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H510M-HDV R2.0:
1 x D-Sub Port
•
1 x DVI-D Port
•
1 x HDMI Port
•
H510M-HVS R2.0:
1 x D-Sub Port
•
1 x HDMI Port
•
4 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
•
Technology 18, NCQ, AHCI and Hot Plug
1 x SPI TPM Header
•
1 x Chassis Intrusion and Speaker Header
•
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of ma ximum
1A (12W) fan power.
1 x Chassis/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CHA_FAN1/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector
•
1 x Front Panel Audio Connector
•
1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
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BIOS Feature
Hardware Monitor
OS
Certica­tions
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU Core/Cache, CPU GT, VCCSA, DRAM, VCCIO, CPU
•
Standby, VCCIN AUX Voltage Multi-adjustment
Fan Tachometer: CPU, Chassis/Water Pump Fans
•
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
•
ture): CPU, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, Chassis/Water Pump Fans
•
CASE OPEN detection
•
Voltage monitoring: CPU Vcore, +12V, +5V, +3.3V
•
Microso® Windows® 10 64-bit
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
H510M-HDV R2.0 H510M-HVS R2.0
* For detailed product information, please visit our website: http://ww w.asrock.com
Please realize that the re is a certain r isk involved with overclo cking, including adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause dam age to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for poss ible damage caused by overclocking.
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1.3 Motherboard Layout

H510M-HDV R2.0:
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H510M-HVS R2.0:
H510M-HDV R2.0 H510M-HVS R2.0
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No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4 Chassis/Waterpump Fan Connector (CHA_FAN1/WP)
5 ATX Power Connector (ATXPWR1)
6 USB 3.2 Gen1 Header (USB3_ 3_4)
7 USB 2.0 Header (USB_5_6)
8 SATA3 Connector (SATA3_3) (Upper), SATA3 Connector (SATA3_2) (Lower)
9 SATA3 Connector (SATA3_1)
10 SATA3 Connector (SATA3_0)
11 System Panel Header (PANEL1)
12 SPI TPM Header (SPI_TPM_J1)
13 Chassis Intrusion and Speaker Header (SPK_CI1)
14 Clear CMOS Jumper (CLRMOS1)
15 Front Panel Audio Header (HD_AUDIO1)
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1.4 I/O Panel

H510M-HDV R2.0:
H510M-HDV R2.0 H510M-HVS R2.0
1
12 67
No. Description No. Description
1 D-Sub Port 7 USB 2.0 Ports (USB_3_4)
2 PS/2 Mouse Port 8 USB 3.2 Gen1 Ports (USB3_1_2)
3 LAN RJ-45 Port* 9 USB 2.0 Ports (USB_1_2)
4 Line In (Light Blue)** 10 PS/2 Keyboard Port
5 Front Speaker (Lime)** 11 DVI-D Port
6 Microphone (Pink)** 12 HDMI Port
11
2
10
9
8
3
H510M-HVS R2.0:
1
2
3
4
5
4
5
11 67
No. Description No. Description
1 D-Sub Port 7 USB 2.0 Ports (USB_3_4)
2 PS/2 Mouse Port 8 USB 3.2 Gen1 Ports (USB3_1_2)
3 LAN RJ-45 Port* 9 USB 2.0 Ports (USB_1_2)
4 Line In (Light Blue)** 10 PS/2 Keyboard Port
5 Front Speaker (Lime)** 11 HDMI Port
6 Microphone (Pink)**
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9
8
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* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .
ACT/LINK L ED
SPEED LE D
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
** Function of the Au dio Ports in 7.1-channel Con guration:
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
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H510M-HDV R2.0 H510M-HVS R2.0

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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English

2.1 Installing the CPU

1. Before you insert the 120 0-Pin CPU into the socket, please check if the PnP ca p is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the socket. Do not force to insert the CPU into the socket if above situ ation is found. Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
A
B
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2
H510M-HDV R2.0 H510M-HVS R2.0
3
5
4
13
English
Please save and replace the cover if the processor i s removed. e cover must be placed if you wish to return the motherboard for aer service.
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2.2 Installing the CPU Fan and Heatsink

1 2
H510M-HDV R2.0 H510M-HVS R2.0
CPU_FAN
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2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identica l (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory module instal led.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4 slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orie ntation. It will cause permanent dam age to the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect orientation .
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H510M-HDV R2.0 H510M-HVS R2.0
1
2
3
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2.4 Expansion Slots (PCI Express Slots)

ere are 2 PCI Express slots slot on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o or the power cord is unplugged. Plea se read the documentation of the expan sion card and mak e necessary hardware settings for the card before you start the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE2 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
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H510M-HDV R2.0 H510M-HVS R2.0

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
Clear CMOS Jumper
(CLRMOS1)
(see p.6, 7, No. 14)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLR MOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option “Clear Status” to clear the record of previou s chassis intrusion status.
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2.6 Onboard Headers and Connectors

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these header s and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.
System Panel Header
(9-pin PANEL1)
(see p.6, 7, No. 11)
PWRBTN (Power Switch):
Connec t to the power switch on the chassi s front panel. You may congure the way to turn o your system using the power switch.
RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart the computer if the compute r freezes and fails to perform a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the hard drive i s reading or writing data.
e front panel de sign may dier by chassis. A front pane l module mainly consists of power switch , reset switch, power LED, hard dr ive activity LED, speak er and etc. When connecting your chassis front panel module to this head er, make sure the wire assig nments and the pin assig nments are matched correctly.
1
PLE D+
PLE D-
HDL ED-
HDL ED+
PWR BTN #
GND
GND
RES ET#
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.6, 7, No. 13)
DUM MY +5V
1
SIG NAL
SPE AKE R
DUM MY
GND
DUM MY
Please connect the
chassis intrusion and the
chassis speaker to this
header.
H510M-HDV R2.0 H510M-HVS R2.0
Serial ATA3 Connectors
Right Angle:
(SATA3_3:
see p.6, 7, No. 8) (Upper)
(SATA3_2:
see p.6, 7, No. 8) (Lower)
Vertical:
(SATA3_0:
see p.6, 7, No. 10)
(SATA3_1:
see p.6, 7, No. 9)
USB 2.0 Header
(9-pin USB_5_6)
(see p.6, 7, No. 7)
USB 3.2 Gen1 Header
(19-pin USB3_3_4)
(see p.6, 7, No. 6)
SATA3_3
SATA3_0
IntA _PA_S SRX-
IntA _PA_S SRX+
IntA _PA_S STX-
IntA _PA_S STX+
IntA _PA_D -
IntA _PA_D +
Vbus
GND
GND
VbusVbus
IntA _PB_ SSRX -
IntA _PB_ SSRX +
GND
IntA _PB_ SSTX -
IntA _PB_ SSTX +
GND
IntA _PB_ D-
IntA _PB_ D+
Dumm y
1
ese four SATA3
connectors support SATA
data cables for internal
SATA3_2
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_1
ere is one USB2.0
header on this
motherboard. is USB
2.0 header can support
two ports.
ere is one header on
this motherboard. is
USB 3.2 Gen1 header can
support two ports.
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.6, 7, No. 15)
PRE SE NCE # MIC _R ET
OUT _R ET
GN D
OUT 2_ L
J_S EN SE
OUT 2_ R
1
is header is for
connecting audio devices
to the front audio panel.
MIC 2_ R
MIC 2_ L
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21
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis must support HDA to function correctly. Please follow the instructions in our manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by the steps below: A. Connect Mic_IN (MIC) to MIC2_ L. B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L. C. Connect Ground (GND) to Ground (GND). D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connec t them for the AC’97 audio panel. E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adju st “Recording Volume”.
English
Chassis/Water Pump Fan
Connector
(4-pin CHA_FAN1/WP)
(see p.6, 7, No. 4)
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.6, 7, No. 2)
ATX Power Connector
(24-pin ATXPWR1)
(see p.6, 7, No. 5)
GND
FAN _VO LT AGE
CHA _FA N_S PE ED
FAN _SP EED _C ONT ROL
1 2 3 4
FAN_ SP EED _CO NT ROL
CPU _FA N_S PEE D
+12 V
GND
4 3 2 1
12
1
is motherboard
provides a 4-Pin water
cooling
chassis
fan
connector. If you plan to
connect a 3-Pin
chassis
water cooler fan, please
connect it to Pin 1-3.
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
24
is motherboard pro-
vides a 24-pin ATX power
connector.
13
22
H510M-HDV R2.0
8 5
H510M-HVS R2.0
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.6, 7, No. 1)
SPI TPM Header
(13-pin SPI_TPM_J1)
(see p.6, 7, No. 12)
4
SPI _ DQ3
+3. 3 V
Dum m y
1
SPI _ MIS O
SPI _ CS0
SPI _ DQ2
CLK
SPI _ MOS I
GND
RSM R ST#
1
RST #
TPM _ PIR Q
SPI _ TPM _CS #
is motherboard
provides a 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics
card. Do not plug the
PCIe power cable to this
connector.
is connector supports SPI
Trusted Platform Module (TPM)
system, which can securely store
keys, digital certicates, pass-
words, and data. A TPM system
also helps enhance network
security, protects digital
identities, and ensures platform
integrity.
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23

Chapter 3 Software and Utilities Operation

3.1 Installing Drivers

e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Instal l All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to insta ll it.
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H510M-HDV R2.0 H510M-HVS R2.0

3.2 ASRock Motherboard Utility (A-Tuning)

ASRock Motherboard Utilit y (A-Tuning) is ASRock’s multi purpose soware suite
with a new interface, more new features and improved utilities.

3.2.1 Installing ASRock Motherboard Utility (A-Tuning)

ASRock Motherboard Utilit y (A-Tuning) can be downloaded from ASRock Live
Update & APP Shop. Aer the installation, you will nd the icon “ASRock Mother-
board Utility (A-Tuning)“ on your desktop. Double-click the
“ASRock Motherboard Utility (A-Tuning)“ icon, ASRock Motherboard Utility
(A-Tuning) main menu will pop up.

3.2.2 Using ASRock Motherboard Utility (A-Tuning)

ere are four sections in ASRock Motherboard Utility (A-Tuning) main menu:
Operation Mode, System Info, FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
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English
System Info
View information about the system.
*e System Browser tab may not appear for certain models.
FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
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Settings
Congure ASRock ASRock Motherboard Utility (A-Tuning). Click to select "Auto
run at Windows Startup" if you want ASRock Motherboard Utility (A-Tuning) to
be launched when you start up the Windows operating system.
H510M-HDV R2.0 H510M-HVS R2.0
27
English

3.3 ASRock Live Update & APP Shop

e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quick ly and
easily insta ll various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop utility.
*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.

3.3.1 UI Overview

Category Panel
Hot News
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28
Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
H510M-HDV R2.0 H510M-HVS R2.0

3.3.2 Apps

When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Step 3
If you want to install the app, click on the red icon to start downloading.
Step 4
When installation completes, you can nd the green "Installed " icon appears on the
upper right corner.
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30
To uninstall it, simply click on the trash can icon . *e trash icon may not appear for certain apps.
Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
H510M-HDV R2.0 H510M-HVS R2.0
Step 2
Click on the yellow icon to start upgrading.
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31

3.3.3 BIOS & Drivers

Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on to see more details.
Step 2
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Click to select one or more items you want to update.
Step 3
Click Update to start the update process.

3.3.4 Setting

In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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33
English

Chapter 4 UEFI SETUP UTILITY

4.1 Introduction

is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, other wise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens and de scriptions are for reference purpose only, and they may not exactly match what you see on your scre en.
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34
H510M-HDV R2.0 H510M-HVS R2.0

4.2 EZ Mode

e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
1 2 3 4 5 6
No. Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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35

4.3 Advanced Mode

e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.

4.3.1 UEFI Menu Bar

e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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36

4.3.2 Navigation Keys

Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
H510M-HDV R2.0 H510M-HVS R2.0
+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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English

4.4 Main Screen

When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
e availability and location of BIOS settings can be dierent for dierent models and BIOS versions .
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38
My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.

4.5 OC Tweaker Screen

In the OC Tweaker screen, you can set up overclocking features.
H510M-HDV R2.0 H510M-HVS R2.0
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens and de scriptions are for reference purpose only, and they may not exactly match what you see on your scre en.
CPU Conguration
CPU Ratio
e CPU speed is determined by the CPU Ratio multiplied with the BCLK.
Increasing the CPU Ratio will increase the internal CPU clock speed without
aecting the clock speed of other components.
AVX2 Ratio Oset
AVX2 Ratio Oset species a negative oset from the CPU Ratio for AVX
workloads. AVX is a more stressful workload that lower the AVX ratio to ensure
maximum possible ratio for SSE workloads.
AVX-512 Ratio Oset
AVX-512 Ratio Oset species a negative oset from the CPU Ratio for AVX-512
workloads. AVX-512 is a more stressful work load that lower the AVX ratio to ensure
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39
maximum possible ratio for SSE workloads.
CPU Cache Ratio
e CPU Interna l Bus Speed Ratio. e maximum should be the same as the CPU
Ratio.
GT Frequency
Congure the frequency of the integrated GPU.
BCLK Spread Spectrum Mode
Enable Spread Spectrum to reduce electromagnetic interference for passing EMI
tests. Disable to achieve higher clock speeds when overclocking.
BCLK Aware Adaptive Voltage
BCLK Aware Adaptive Voltage enable/disable. When enabled, pcode will be aware
of the BCLK frequency when calculating the CPU V/F curves. is is ideal for
BCLK OC to avoid high voltage overrides.
Boot Performance Mode
Select the performance state that the BIOS will set before OS hando.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same fre-
quency.
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Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Intel Turbo Boost Max Technology 3.0
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Thermal Velocity Boost Voltage Optimizations
is service controls thermal based voltage optimizations for processors that
implment the Intel ermal Velocity Boost (TVB) feature.
Dual Tau Boost
Enable Dual Tau Boost feature. is is only applicable for CMLS 35W/65W/125W
skus. is item is only supported with processors with Cong TDP support.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
H510M-HDV R2.0 H510M-HVS R2.0
CPU Core Current Limit
Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
System Agent Current Limit
Congure the current limit of the system agent. A lower limit can protect the CPU
and save power, while a higher limit may improve performance.
GT Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
DRAM Conguration
Memory Information
Allows users to browse the serial presence detect (SPD) and Intel extreme memory prole
(XMP) for DDR4 modules.
DRAM Timing Conguration
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Load XMP Setting
Load XMP settings to overclock the memory and perform beyond standard
specications.
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
DRAM Gear Mode
Gear2 mode doubled the ratio in memory controller, and it is good for high
frequency.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP)
RAS# to CAS# Delay : e number of clock cycles required between the opening of a row
of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the precharge
command and opening the next row.
RAS# Active Time (tRAS)
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e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memor y chip is selected and when the rst active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
H510M-HDV R2.0 H510M-HVS R2.0
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
Turn Around Timing
Turn Around Timing Optimization
Auto is enabled in general case.
tRDRD_sg
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Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
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tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
Round Trip Timing
Round Trip Timing Optimization
Auto is enabled in general case.
Rx FiF0 Delay Oset
Congure Rx FIF0 Delay Oset.
Initial RTL (A1 Rank1)
Congure round trip latency initial value.
Initial RTL (A1 Rank2)
Congure round trip latency initial value.
Initial RTL (B1 Rank1)
Congure round trip latency initial value.
H510M-HDV R2.0 H510M-HVS R2.0
Initial RTL (B1 Rank2)
Congure round trip latency initial value.
RTL (A1 Rank1)
Congure round trip latency.
RTL (A1 Rank2)
Congure round trip latency.
RTL (B1 Rank1)
Congure round trip latency.
RTL (B1 Rank2)
Congure round trip latency.
ODT Setting
ODT WR (A1)
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Congure the memory on die termination resistors' WR for channel A1.
ODT WR (B1)
Congure the memory on die termination resistors' WR for channel B1.
ODT NOM (A1)
Use this to change ODT (CH A1) Auto/Manual settings. e default is [Auto].
ODT NOM (B1)
Use this to change ODT (CH B1) Auto/Manual settings. e default is [Auto].
ODT PARK (A1)
Congure the memory on die termination resistors' PARK for channel A1.
ODT PARK (B1)
Congure the memory on die termination resistors' PARK for channel B1.
Advanced Setting
ASRock Timing Optimization
Congure the fast path through the MRC.
ASRock Second Timing Optimization
Congure the second fast path through the MRC.
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Memory Training Mode
Congure the Training Memory Mode.
Realtime Memory Timing
Congure the realtime memory timings.
[Enabled] e system will allow performing realtime memory timing changes aer
MRC_DONE.
Reset for MRC Failed
Reset system aer MRC training is failed.
Train on Warm Boot
When enabled, memory training will be executed when warm boot.
MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
Voltage Mode
[OC]: Larger range voltage for overclocking.
[STABLE]: Smaller range voltage for stable system.
CPU Core/Cache Voltage
Input voltage for the processor by the external voltage regulator.
CPU Core/Cache Load-Line Calibration
CPU Core/Cache Load-Line Calibration helps prevent CPU Core/Cache voltage
droop when the system is under heavy loading.
CPU GT Voltage
Congure the voltage for the integrated GPU.
CPU GT Load-Line Calibration
GT Load-Line Calibration helps prevent integrated GPU voltage droop when the
system is under heav y load.
H510M-HDV R2.0 H510M-HVS R2.0
VCCSA Voltage
Congure the voltage for the VCCSA.
DRAM Voltage
Use this to congure DRAM Voltage. e default value is [Auto].
VCCIO Voltage
Congure the voltage for the VCCIO.
CPU Standby Voltage
Congure the voltage for the CPU Standby.
VCCIN AUX Voltage
Congure the voltage for the VCCIN AUX.
AVX Conguration
AVX2 Voltage Guardband Scale Factor
AVX2 Voltage Guardband Scale Factor controls the voltage guardband applied to
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AVX2 workloads. A value > 1.00 will increase the voltage guardband, and < 1.00
will decrease the voltage guardband.
AVX-512 Voltage Guardband Scale Factor
AVX-512 Voltage Guardband Scale Factor controls the voltage guardband applied
to AVX-512 workloads. A value > 1.00 will increase the voltage guardband, and < 1.00
will decrease the voltage guardband.
Save User Default
Type a prole name and press enter to save your settings as user default.
Load User Default
Load previously saved user defaults.
Save User UEFI Setup Prole to Disk
It helps you to save current UEFI settings as an user prole to disk.
Load User UEFI Setup Prole from Disk
You can load previous saved prole from the disk.
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H510M-HDV R2.0 H510M-HVS R2.0

4.6 Advanced Screen

In this section, you may set the congurations for the following items: CPU
Conguration, Chipset Conguration, Storage Conguration, ACPI Conguration,
USB Conguration and Trusted Computing.
Setting wrong values in this sec tion may cause the system to malfunction.
UEFI Conguration
UEFI Setup Style
Select the default mode when entering the UEFI setup utility.
Active Page on Entry
Select the default page when entering the UEFI setup utility.
Full HD UEFI
When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor
supports Full HD resolution. If the monitor does not support Full HD resolution,
then the resolution will be set to 1024 x 768. When [Disable] is selected, the
resolution will be set to 1024 x 768 directly.
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4.6.1 CPU Conguration
Intel Hyper Threading Technology
Intel Hyper reading Technology allows multiple threads to run on each core, so
that the overall performance on threaded soware is improved.
Active Processor Cores
Select the number of cores to enable in each processor package.
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CPU C States Support
Enable CPU C States Support for power saving. It is recommended to keep C6 and
C7 all enabled for better power saving.
Enhanced Halt State (C1E)
Enable Enhanced Halt State (C1E) for lower power consumption.
CPU C6 State Support
Enable C6 deep sleep state for lower power consumption.
CPU C7 State Support
Enable C7 deep sleep state for lower power consumption.
Package C State Support
Enable CPU, PCIe, Memory, Graphics C State Support for power saving.
H510M-HDV R2.0 H510M-HVS R2.0
CFG Lock
is item allows you to disable or enable the CFG Lock.
C6DRAM
Enable/Disable moving of DRAM contents to PRM memory when CPU is in C6
state.
CPU Thermal Throttling
Enable CPU internal thermal control mechanisms to keep the CPU from overheat-
ing.
Intel AVX/AVX2
Enable/Disable the Intel AVX and AVX2 Instructions. is is applicable for Big
Core only.
Intel AVX-512
Enable/Disable the Intel AVX-512 (a.k.a. AVX3) Instructions. is is applicable for
Big Core only.
Intel Virtualization Technology
Intel Virtualization Technology allows a platform to run multiple operating systems
and applications in independent partitions, so that one computer system can
function as multiple virtual systems.
Hardware Prefetcher
Automatically prefetch data and code for the processor. Enable for better
performance.
Adjacent Cache Line Prefetch
Automatically prefetch the subsequent cache line while retrieving the currently
requested cache line. Enable for better performance.
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4.6.2 Chipset Conguration
Primary Graphics Adapter
Select a primary VGA.
Above 4G Decoding
Enable or disable 64bit capable Devices to be decoded in Above 4G Address Space
(only if the system supports 64 bit PCI decoding).
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VT-d
Intel® Virtualization Technology for Directed I/O helps your virtual machine
monitor better utilize hardware by improving application compatibility and
reliability, and providing additional levels of manageability, security, isolation, and
I/O performance.
SR-IOV Support
If system has SR-IOV capable PCIe Devices, this option Enables or Disables Single
Root IO Virtualization Support.
DMI Link Speed
Congure DMI Slot Link Speed. Auto mode is optimizing for overclocking.
PCIE1 Link Speed
Select the link speed for PCIE1.
H510M-HDV R2.0 H510M-HVS R2.0
PCIE2 Link Speed
Select the link speed for PCIE2.
PCI Express Native Control
Select Enable for enhanced PCI Express power saving in OS.
PCIE ASPM Support
is option enables/disables the ASPM support for all CPU downstream devices.
PCH PCIE ASPM Support
is option enables/disables the ASPM support for all PCH PCIE devices.
DMI ASPM Support
is option enables/disables the control of ASPM on CPU side of the DMI Link.
PCH DMI ASPM Support
is option enables/disables the ASPM support for all PCH DMI devices.
Share Memory
Congure the size of memory that is allocated to the integrated graphics processor when
the system boots up.
IGPU Multi-Monitor
Select disable to disable the integrated graphics when an external graphics card is installed.
Select enable to keep the integrated graphics enabled at all times.
Onboard LAN
Enable or disable the onboard network interface controller.
Onboard HD Audio
Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and
automatically disable it when a sound card is installed.
Front Panel
Enable/disable front panel HD audio.
Onboard HDMI HD Audio
Enable audio for the onboard digital outputs.
Deep Sleep
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Congure deep sleep mode for power saving when the computer is shut down.
Restore on AC/Power Loss
Select the power state aer a power failure. If [Power O] is selected, the power will
remain o when the power recovers. If [Power On] is selected, the system will start
to boot up when the power recovers.
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4.6.3 Storage Conguration
SATA Controller(s)
Enable/disable the SATA controllers.
H510M-HDV R2.0 H510M-HVS R2.0
SATA Aggressive Link Power Management
SATA Aggressive Link Power Management allows SATA devices to enter a low
power state during periods of inactivity to save power. It is only supported by AHCI
mode.
Hard Disk S.M.A.R.T.
S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technolog y. It is a
monitoring system for computer hard disk drives to detect and report on various
indicators of reliability.
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4.6.4 ACPI Conguration
Suspend to RAM
Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI
S3 power saving.
PS/2 Keyboard S4/S5 Wakeup Support
Allow the system to be waked up by a PS/2 Keyboard in S4/S5.
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PCIE Devices Power On
Allow the system to be waked up by a PCIE device and enable wake on LAN.
RTC Alarm Power On
Allow the system to be waked up by the rea l time clock alarm. Set it to By OS to let
it be handled by your operating system.
USB Keyboard/Remote Power On
Allow the system to be waked up by an USB keyboard or remote controller.
USB Mouse Power On
Allow the system to be waked up by an USB mouse.
4.6.5 USB Conguration
Legacy USB Support
Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB
compatibility issues it is recommended to disable legacy USB support. Select UEFI
Setup Only to support USB devices under the UEFI setup and Windows/Linux
operating systems only.
H510M-HDV R2.0 H510M-HVS R2.0
XHCI Hand-o
is is a workaround for OSes without XHCI hand-o support. e XHCI
ownership change should be claimed by XHCI driver.
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4.6.6 Trusted Computing

Security Device Support
Enable or disable BIOS support for security device.
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4.7 Tools

UEFI Tech Service
Contact ASRock Tech Service if you are having trouble with your PC. Please setup
network conguration before using UEFI Tech Service.
H510M-HDV R2.0 H510M-HVS R2.0
SSD Secure Erase Tool
All the SSD's listed that supports Secure Erase function.
NVME Sanitization Tool
Aer you Sanitize SSD, all user data will be permanently destroyed on the SSD and
cannot be recovered.
Instant Flash
Save UEFI les in your USB storage device and run Instant Flash to update your
UEFI.
Internet Flash - DHCP (Auto IP), Auto
ASRock Internet Flash downloads and updates the latest UEFI rmware version
from our servers for you. Please setup network conguration before using Internet
Flash.
*For BIOS backup and recovery purpose, it is recommended to plug in your USB
pen drive before using this function.
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Network Conguration
Use this to congure internet connection settings for Internet Flash.
Internet Setting
Enable or disable sound eects in the setup utility.
UEFI Download Server
Select a server to download the UEFI rmware.
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4.8 Hardware Health Event Monitoring Screen

is section allows you to monitor the status of the hardware on your system,
including the parameters of the CPU temperature, motherboard temperature, fan
speed and voltage.
H510M-HDV R2.0 H510M-HVS R2.0
Fan Tuning
Measure Fan Min Duty Cycle.
Fan-Tastic Tuning
Select a fan mode for CPU Fan, or choose Customize to set 5 CPU temperatures and
assign a respective fan speed for each temperature.
CPU Fan 1 Setting
Select a fan mode for CPU Fan 1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
CPU Fan 1 Step Up
Set the value of CPU Fan 1 Step Up.
CPU Fan 1 Step Down
Set the value of CPU Fan 1 Step Down.
CHA_FAN1 / W_PUMP Switch
Select Chassis Fan 1 or Water Pump mode.
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Chassis Fan 1 Control Mode
Select PWM mode or DC mode for Chassis Fan 1.
Chassis Fan 1 Setting
Select a fan mode for Chassis Fan 1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan 1 Temp Source
Select a fan temperature source for Chassis Fan 1.
Chassis Fan 1 Step Up
Set the value of Chassis Fan 1 Step Up.
Chassis Fan 1 Step Down
Set the value of Chassis Fan 1 Step Down.
Case Open Feature
Enable or disable Case Open Feature to detect whether the chassis cover has been
removed.
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4.9 Security Screen

In this section you may set or change the supervisor/user password for the system.
You may also clear the user password.
Supervisor Password
Set or change the password for the administrator account. Only the administrator
has authority to change the settings in the UEFI Setup Utility. Leave it blank and
press enter to remove the password.
H510M-HDV R2.0 H510M-HVS R2.0
User Password
Set or change the password for the user account. Users are unable to change the
settings in the UEFI Setup Utility. Leave it blank and press enter to remove the
password.
Secure Boot
Use this item to enable or disable support for Secure Boot.
Intel(R) Platform Trust Technology
Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.
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4.10 Boot Screen

is section displays the available devices on your system for you to congure the
boot settings and the boot priority.
Fast Boot
Fast Boot minimizes your computer's boot time. In fast mode you may not boot
from an USB storage device. e VBIOS must support UEFI GOP if you are using
an external graphics card. Please notice that Ultra Fast mode will boot so fast that
the only way to enter this UEFI Setup Utility is to Clear CMOS or run the Restart to
UEFI utility in Windows.
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Boot From Onboard LAN
Allow the system to be waked up by the onboard LAN.
Setup Prompt Timeout
Congure the number of seconds to wait for the setup hot key.
Bootup Num-Lock
Select whether Num Lock should be turned on or o when the system boots up.
Boot Beep
Select whether the Boot Beep should be turned on or o when the system boots up. Please
note that a buzzer is needed.
H510M-HDV R2.0 H510M-HVS R2.0
Full Screen Logo
Enable to display the boot logo or disable to show normal POST messages.
AddOn ROM Display
Enable AddOn ROM Display to see the AddOn ROM messages or congure the
AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.
Boot Failure Guard Message
If the computer fails to boot for a number of times the system automatically restores
the default settings.
CSM (Compatibility Support Module)
CSM
Enable to launch the Compatibility Support Module. Please do not disable unless
you’re running a WHCK test.
Launch PXE OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Launch Storage OpROM Policy
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Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Other PCI Device ROM Priority
For PCI devices other than Network. Mass storage or Video denes which OpROM
to launch.
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H510M-HDV R2.0 H510M-HVS R2.0

4.11 Exit Screen

Save Changes and Exit
When you select this option the following message, “Save conguration changes
and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP
UTILITY.
Discard Changes and Exit
When you select this option the following message, “Discard changes and exit
setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving
any changes.
Discard Changes
When you select this option the following message, “Discard changes?” will pop
out. Select [OK] to discard all changes.
Load UEFI Defaults
Load UEFI default values for a ll options. e F9 key can be used for this operation.
Launch EFI Shell from lesystem device
Copy shellx64.e to the root directory to launch EFI Shell.
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Contact Information
If you need to contact ASRock or want to know more about ASRock, you’re welcome
to visit ASRock’s website at http://ww w.asrock.com; or you may contact your dealer
for further information. For technical questions, please submit a support request
form at https://event.asrock.com/tsd.asp
ASRock Incorporation
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,
Taipei City 112, Taiwan (R.O.C.)
ASRock EUROPE B.V.
Bijsterhuizen 11-11
6546 AR Nijmegen
e Netherlands
Phone: +31-24-345-44-33
Fax: +31-24-345-44-38
ASRock America, Inc.
13848 Magnolia Ave, Chino, CA91710
U.S.A.
Phone: +1-909-590-8308
Fax: +1-909-590-1026
DECLARATION OF CONFORMITY
Per FCC Part 2 Section 2.1077(a)
Responsible Party Name: ASRock Incorporation
Address:
Phone/Fax No:
hereby declares that the product
Product Name : Motherboard
13848 Magnolia Ave, Chino, CA91710
+1-909-590-8308/+1-909-590-1026
Model Number :
Conforms to the following specications:
FCC Part 15, Subpart B, Unintentional Radiators
Supplementary Information:
H510M-HDV R2.0 / H510M-HVS R2.0
is device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) is device may not cause harmful interference,
and (2) this device must accept any interference received, including interference
that may cause undesired operation.
James
Representative Person’s Name:
Signature :
Date :
May 12, 2017
EU Declaration of Conformity
EMC —Directive 2014/30/EU (from April 20th, 2016)
For the following equipment:
Motherboard
(Product Name)
H510M-HDV R2.0 / H510M-HVS R2.0 / ASRock
(Model Designation / Trade Name)
ASRock Incorporation
(Manufacturer Name)
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)
(Manufacturer Address)
ڛ
☐ EN 55022:2010/AC:2011 Class B EN 55024:2010/A1:2015
ڛ EN 55032:2012+AC:2013 Class B ڛڛ EN 61000-3-3:2013 ڛ EN 61000-3-2:2014
LVD —Directive 2014/35/EU (from April 20th, 2016)
EN 60950-1 : 2011+ A2: 2013
ڛ RoHS — Directive 2011/65/EU ڛ CE marking
EN 60950-1 : 2006/A12: 2011
(EU conformity marking)
ASRock EUROPE B.V.
(Company Name)
Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands
(Company Address)
Person responsible for making this declaration:
(Name, Surname)
A.V.P
(Position / Title)
May 28, 2021
(Date)
P/N: 15G062304000AK V1.0
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