Apple iPad 4 LTE A1459
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Quad-Band GSM/EDGE
W-CDMA/HSPA+ (850 / 900 / 1900/ 2100 MHz)
LTE (700 / 1700 MHz)
Sample Report
Product Description
The Cellular Apple iPad 4 A1459 tablet, which Apple ofcially
calls the “iPad with Retina Display,” is the company’s fourthgeneration model in this family. It features a 9.7-in. LED-backlit
TFT-LCD Retina Display with QXGA (2048 x 1536) resolution,
16M colors, and multitouch capacitive touchscreen with Gorilla
Glass overlay. It runs the iOS 6.0 operating system on a dualcore 1.4 GHz Apple A6X SoC with quad-core graphics and 1
GB RAM. It also features 32 GB of internal memory (16 GB
and 64 GB models also available) but lacks a memory card
slot for external storage. There are also two cameras: a rearfacing 5 MP BSI CMOS “iSight” camera with autofocus, LED
ash, and HD (1080p) video capability; and a front-facing 1.2
MP “Facetime HD” camera with HD (720p) video capability.
Connectivity is provided by WiFi 802.11a/b/g/n, Bluetooth 4.0,
GPS, microUSB 2.0, and a USB “Lightning” port (in place
of the previous Dock Connector port). Sensors include an
accelerometer, gyroscope, compass, and ambient light sensor.
The iPad 4 A1459 is powered by a large-capacity 3.7 V, 11,560
mAh Li-Polymer battery that supplies a listed 10 hours of use
time and 720 hours of standby.
DISCLAIMER: All company names, product names, and service names mentioned are used for identication purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses
are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes
that these estimates reect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any
information in this document, and shall bear no liability whatsoever for the use of the information.
Copyright © 2014, TechIngsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion
thereof, by any means without the express written permission of TechInsights.
© 2014, TechInsights
Deep Dive Teardown
Deep Dive Teardown
IC Die Count**
IC Package Count**
Retail Price
Product Dimensions (mm)
Total Manufacturing Cost*
Electronics Cost**
Integrated Circuits $117.09 35.9%
Modules, Discretes & Connectors $17.73 5.4%
Substrates
$12.35
3.8%
Component Insertion $8.14 2.5%
Card Test
$0.65
0.2%
Battery Subsystem $20.27
6.2%
Display / Touchscreen Subsystem $112.73 34.6%
Camera Subsystems $16.31 5.0%
Non-Electronic Parts $17.75 5.4%
Final Assembly & Test
$3.25
1.0%
Total
$326.27
100.0%
Key Subsystems
Secondary Camera
1.2 MP BSI CMOS, "Facetime HD" Video (720p)
Battery
3.7 V, 11,560 mAh, Li-Polymer
*Excluding Supporting Materials' Cost
**Including Subsystems
Dual-Core 1.4 GHz A6X SoC w/ Quad-Core
Graphics & 1 GB RAM
Accelerometer; Gyroscope; Compass;
Ambient Light
Sensors
Interface
Multitouch Capacitive Touchscreen; Home
Key; Up/Down Keys; Mute Key
Storage
Internal: 32 GB
External: N/A
$326.27
$729.00
Cost Metrics
Manufacturing Cost Breakdown
$216.29
9.7" TFT-LCD; 2048 x 1536 Pixels (264 ppi); 16,777,216 Colors; Gorilla Glass
Display
Communications
Quad-Band GSM/EDGE; Quad-Band W-CDMA/
HSPA+; LTE (700 MHz-Band XVII/1700 MHzBand IV)
Connectivity
WiFi 802.11n, Bluetooth 4.0, GPS,
microUSB 2.0, "Lightning" Port
Battery Life
Use Time: 10 hours
Standby: 720 hours
Processor
iPad 4 LTE A1459
Integrated Circuit Metrics
Main Camera
5.0 MP BSI CMOS, Autofocus, LED Flash, "iSight" HD Video (1080p)
85
64
iOS 6.0
Product Description
Product Type
Operating System
Tablet
Brand
Apple
Product Features
Official Release Date
11/16/2012
242 x 186 x 9.4
Weight (grams)
662
Product Name & Model #
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview
Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Main
Antenna
Main
Antenna
28
-
Skyworks
#SKY77497
W-CDMA Bands II & V PA
27 - Skyworks
#SKY77729
LTE Band XVII PA
30
-
TriQuint
#TQM666084
W-CDMA Band VIII PA
31
-
Skyworks
#SKY77352
Quad-Band GSM PA
Rx Diversity
Antenna
Rx Diversity
Antenna
DUPL
GPS AntennaGPS AntennaGPS Antenna
32 - Murata
#SWUA ?
Diversity Rx Antenna Switch
w/ SAW Filters
Baseband Processor
29 - Avago
#AFEM-7814
W-CDMA Band I & LTE Band IV PA
22
-
Qualcomm
#RTR8600
GSM / CDMA / W-CDMA / LTE RxD
Transceiver + GPS
33
-
Murata
#D06 ?
RF Antenna Switch
38
-
Analog Devices
#AD7149
Capacitance Sensor Controller
25 - Infineon
#BGM1032N7
GPS / GLONASS Front-End Module
Applications Processor
Estimated block diagram based on observation of this specific pr
oduct
implementation, manufacturer
’
s data sheets where available, and best
engineering judgment. Certain details of the interface circuitry are not
reflected in this block diagram. Partitioning and connectivity are speculative.
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview
Block Diagram
Page 2 Page 3Page 1
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
1
-
Apple
#A6X / APL5598
Dual-Core Applications Processor (CPU)
w/ Quad-Core GPU
2
-
SanDisk
#SDMALBB4 032G
Multichip Memory - 32 GB MLC iNAND
Flash, Memory Controller
35 - STMicroelectronics
#L3G4200DH
3-Axis MEMS Gyroscope
36
-
STMicroelectronics
#LIS331DLH
3-Axis MEMS Accelerometer
37
-
AKM Semiconductor
#AK8975B
3-Axis Electronic Compass
LightningLightning
VibratorVibrator
15
-
TI
#CD3240B0
Touchscreen Line Driver ?
17 - Broadcom
#BCM5973A1
Touchscreen Controller
To Touchscreen
To Display
To Battery
3
-
Apple / Dialog Semi
#343S0622-A1 / D2018
Power Management
8
-
NXP Semiconductor
#CBTL1608A1
Display Port Multiplexer ?
16
-
Broadcom
#BCM5974
Touchscreen Controller
21
-
Qualcomm
#MDM9615M
Multimode Baseband
Processor
w/ Memory
23 - Winbond
#W25Q16DWBYIG
Serial Flash Memory - 2 MB
26
-
Qualcomm
#PM8018
Power Management
WiFi / BT AntennaWiFi / BT AntennaWiFi / BT Antenna
18
-
USI
#339S0175
WiFi 802.11a/b/g/n / Bluetooth / FM Radio
SpeakerSpeaker
MicrophoneMicrophone
SIMSIM
To Touchscreen
HeadsetHeadset
4
-
Apple / Cirrus Logic
#338S1077 / CS35L19
Audio Amplifier
SpeakerSpeaker
Transceiver
45
-
OmniVision
#OV2C3BH ?
1.2 MP BSI CMOS Image Sensor
Camera
45
-
OmniVision
#OV2C3BH ?
1.2 MP BSI CMOS Image Sensor
Camera
Capacitance Sensor Controller
14
- SK Hynix
#H9TCNNN4KDBMUR-NGM
Multichip Memory -
512 MB Mobile DDR2-S4 SDRAM
14 -
SK Hynix
#H9TCNNN4KDBMUR-NGM
Multichip Memory -
512 MB Mobile DDR2-S4 SDRAM
14
- SK Hynix
#H9TCNNN4KDBMUR-NGM
Multichip Memory -
512 MB Mobile DDR2-S4 SDRAM
14 -
SK Hynix
#H9TCNNN4KDBMUR-NGM
Multichip Memory -
512 MB Mobile DDR2-S4 SDRAM
47
-
OmniVision
#OV5650
5 MP BSI CMOS Image Sensor
Camera
47
-
OmniVision
#OV5650
5 MP BSI CMOS Image Sensor
Camera
46
-
AMS
#TSL2583
Ambient Light Sensor
5
-
Apple / Cirrus Logic
#338S1116 / CLI1586A1
Audio CODEC
4
-
Apple / Cirrus Logic
#338S1077 / CS35L19
Audio Amplifier
Estimated block diagram based on observation of this specific pr
oduct
implementation, manufacturer’s data sheets where available, and best
engineering judgment. Certain details of the interface circuitry are not
reflected in this block diagram. Partitioning and connectivity are speculative.
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview
Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Page 1 Page 3Page 2
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
51
-
RichTek
#RT9966GQW ?
Power Management
52
-
Integrated Memory Logic
#Iml7990
Programmable Gamma Buffer
53
-
Parade Technologies
#DP635
Display Port Timing Controller
Touchscreen
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
50
-
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
51
-
RichTek
#RT9966GQW ?
Power Management
52
-
Integrated Memory Logic
#Iml7990
Programmable Gamma Buffer
53
-
Parade Technologies
#DP635
Display Port Timing Controller
Touchscreen
40
-
Seiko Instruments
#S
-
8244
Secondary Battery Protection
41
-
Seiko Instruments
#S
-
8211
Battery Protection IC
44
-
TI
#BQ7541
Battery Fuel Gauge
Display
Battery
To Touchscreen Line Driver and Touchscreen Controller
To Applications Processor
To Power Management
Estimated block diagram based on observation of this specific pr
oduct
implementation, manufacturer
’
s data sheets where available, and best
engineering judgment. Certain details of the interface circuitry
are not
reflected in this block diagram. Partitioning and connectivity a
re speculative.
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview
Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Page 2Page 1
Page 3
Costs and Metrics
Deep Dive Teardown
Total Estimated
Cost of Supporting Materials: $5.20
USB / Lightning Cable
-
$1.75
Documentation
- $0.10
AC Adapter - $2.40
Packaging - $0.90
SIM Card Extractor - $0.05
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging
LabelSupporting Materials
Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging
Supporting Materials Label
Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Home Key
Capacitive
Touchscreen
Front
Camera
Ambient
Light Sensor
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Bottom BacklightsTop
Product Packaging Teardown Overview & DiscussionOther Substrates
Exterior Features
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Rear
Camera
On/Off &
Sleep/Wake Key
Microphone
3.5 mm Headset Jack
Micro SIM Card Tray
Micro SIM Card Release
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Teardown Overview & DiscussionOther Substrates
Exterior Features
Top BacklightsBottom
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
BottomTop Backlights
Product Packaging Teardown Overview & DiscussionOther Substrates
Exterior Features
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 2Side 1
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components
Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 Side 2
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components
Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther SubstratesComponent Arrangement
Major Components Antenna Subsystems Main Board
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Step 2 Step 3 Step 4 Step 5 Step 6 Step 8Step 7Step 1
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Step 1 Step 3 Step 4 Step 5 Step 6 Step 8Step 7Step 2
Product Overview Block Diagram
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Step 1 Step 2 Step 4 Step 5 Step 6 Step 8Step 7Step 3
Product Overview Block Diagram
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Step 1 Step 2 Step 3 Step 5 Step 6 Step 8Step 7Step 4
Product Overview Block Diagram
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Step 1 Step 2 Step 3 Step 4 Step 6 Step 8Step 7Step 5
Product Overview Block Diagram
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Step 1 Step 2 Step 3 Step 4 Step 5 Step 8Step 7Step 6
Product Overview Block Diagram
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 8
Product Overview Block Diagram
Step 7
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8
Product Overview Block Diagram
Product Packaging Exterior Features Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Teardown
Costs and Metrics
Deep Dive Teardown
Note: The Main Antenna is the only flex antenna that has
two metal layers, which have a concentric pattern creating a
capacitive RF Proximity Sensor used to detect the presence
of a hand nearby. A hand would change the capacitance and
therefore trigger the reduction of the RF power transmitted.
Grid = 1 cm
This is an image of the opposite
side of the antenna with the
outer plastic layer scraped away.
RF Proximity Sensor
Connection to Interconnect Board
50.0
mm
35.0
mm
0.2
mm
Main
Antenna Element
Length
Width
Height
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Diversity Antenna GPS AntennaWiFi & Bluetooth AntennaMain Antenna
Major Components SubsystemsComponent Arrangement Main Board
Antenna
Costs and Metrics
Deep Dive Teardown
Grid = 1 cm
20.5
mm
46.2
mm
0.2
mm
Length
Width
Height
Rx Diversity
Antenna Element
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Main Antenna GPS AntennaWiFi & Bluetooth AntennaDiversity Antenna
Major Components SubsystemsComponent Arrangement Main Board
Antenna
Costs and Metrics
Deep Dive Teardown
Grid = 1 cm
30.0
mm
11.0
mm
0.2
mm
WiFi/Bluetooth
Antenna Element
Length
Width
Height
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Diversity AntennaMain Antenna GPS AntennaWiFi & Bluetooth Antenna
Major Components SubsystemsComponent Arrangement Main Board
Antenna
Costs and Metrics
Deep Dive Teardown
Grid = 1 cm
21.4
mm
23.6
mm
0.2
mm
Length
Width
Height
GPS
Antenna Element
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Diversity AntennaMain Antenna WiFi & Bluetooth Antenna GPS Antenna
Major Components SubsystemsComponent Arrangement Main Board
Antenna
Costs and Metrics
Deep Dive Teardown
Front Page
Estimated Cost
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Battery Pack
Display / Touchscreen Camera Battery
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components AntennaComponent Arrangement Main Board
Subsystems
Costs and Metrics
Deep Dive Teardown
40
-
Seiko Instruments
#S-8244
Secondary Battery Protection
41
-
Seiko Instruments
#S-8211
Battery Protection IC
44
-
TI
#BQ7541
Battery Fuel Gauge
Grid = 1 cm
Apple
A1389
3.7
Lithium Polymer
11560
198 x 126 x 4
428.6
209.0
204.7
ATL
Cell(s)
$11.76
Electronic Parts
$1.70
Non-electronic Parts
$0.09
Assembly
$0.54
Test
$0.10
Markup
$6.08
$20.27
Battery Pack
Pack Brand
Cell Type
Vol. Energy Density (mWHrs/cc)
Wt. Energy Density (mWHrs/g)
Estimated Costs
Pack Weight (grams)
Cell Brand
Estimated Pack Price
Pack Part Number
Pack Voltage
Pack Rating (mAHrs)
Pack Size (mm)
Front Page
Battery Pack
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components AntennaComponent Arrangement Main Board
Estimated Cost
Display / Touchscreen Camera Battery
Subsystems
Costs and Metrics
Deep Dive Teardown
45
-
OmniVision
#OV2C3BH ?
1.2 MP BSI CMOS Image Sensor
46
-
AMS
#TSL2583
Ambient Light Sensor
Grid = 1 cm
Grid = 1 cm
Unknown
Unknown
15.8 x 10.6 x 3.9
15.8 x 10.6 x 3.7
0.6
0.5
CMOS
1 MP
1/5
4
1
Electronic Parts $2.54
Non-Electronic Parts $1.07
Assembly $0.18
Test $0.10
Markup $1.67
$5.55
Estimated Module Price
Subsystem Size (mm)
Type
Estimated Costs
Camera Size (mm)
Camera Weight (grams)
Optical Zoom
Resolution
Lens Elements
Optical Size
Part Number
Secondary Camera
Brand
Subsystem Weight (grams)
Front Page
Rear
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Front
Battery Display / Touchscreen Camera
Major Components AntennaComponent Arrangement Main Board
Subsystems
Costs and Metrics
Deep Dive Teardown
47
-
OmniVision
#OV5650
5 MP BSI CMOS Image Sensor
48
-
Rohm
#Unknown
Autofocus VCM Driver
Grid = 1 cm
Grid = 1 cm
Unknown
MFC3612
8.6 x 8.5 x 5.3
8.5 x 8.5 x 6.8
0.9
1.4
CMOS
5 MP
1/3.2
5
1
Electronic Parts $5.74
Non-Electronic Parts $1.36
Assembly $0.28
Test $0.15
Markup $3.23
$10.76
Camera Weight (grams)
Camera Size (mm)
Subsystem Weight (grams)
Optical Zoom
Estimated Costs
Estimated Module Price
Resolution
Optical Size
Brand
Subsystem Size (mm)
Part Number
Main Camera
Lens Elements
Type
Front Page
Front
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components AntennaComponent Arrangement Main Board
Battery Display / Touchscreen Camera
Rear
Subsystems
Costs and Metrics
Deep Dive Teardown
50 -
Samsung
#S6CG246X01
TFT
-
LCD Display Row Driver
49
-
Samsung
#S6C24A1X01
TFT
-
LCD Display Column Driver
Touchscreen
51
-
RichTek
#RT9966GQW ?
Power Management (3
-
Die Pkg.)
52
-
Integrated Memory Logic
#iML7990
Programmable Gamma Buffer
53
-
Parade Technologies
#DP635
Display Port Timing Controller
54
-
Ricoh
#RP111L071D
500 mA / 0.7 V LDO Regulator
55
-
TI
#TPS62260
600 mA Step
-
Down DC
-
DC Converter
56
-
Rohm
#BR24T16
-
W
Serial EEPROM Memory
-
2 KB
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
IC Identication Estimated Cost
Battery Camera Display / Touchscreen
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components AntennaComponent Arrangement Main Board
Subsystems
Costs and Metrics
Deep Dive Teardown
Note: The Display /
Touchscreen cost includes
the Cover Glass. The original report was posted
with the Display and Touchscreen as separate
subsystems; the Cover Glass was originally
categorized as part of the Main Non-Electronics.
The original overall cost will differ from this
revised report.
Per today’s teardown techniques we now group
the Display, Touchscreen, and Cover Glass as
one subsystem.
Samsung
LQ097L1JY11
238.2 x 182.7 x 3.69
240.60
View Size (mm)
197.104 x 147.828
Type
TFT
Colors
16777216
Rows / Columns 1536 / 2048
Backlighting Scheme
84 White LEDs
Panel(s)
$12.12
Electronic Parts
$47.25
Circuit Assembly $1.87
Non-Electronic Parts $11.40
Final Assembly
$0.28
Test
$0.35
Markup
$39.57
$112.73
Estimated Module Price
Weight (grams)
Display / Touchscreen Module
Brand
Part Number
Panel Metrics
Estimated Costs
Module Dimensions
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components AntennaComponent Arrangement Main Board
IC Identication Estimated Cost
Battery Camera Display / Touchscreen
Subsystems
Costs and Metrics
Deep Dive Teardown
Display
Touchscreen
Interconnect Flex
Docking Flex
Speaker
Home Button Board
WiFi/Bluetooth Antenna
Battery
Grid = 1 cm
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 IC Identication Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die PhotosSide 1
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Main Board
Costs and Metrics
Deep Dive Teardown
1
-
Apple
#A6X / APL5598
Dual-Core Applications Processor
(CPU) w/ Quad-Core GPU
2
-
SanDisk
#SDMALBB4 032G
Multichip Memory - 32 GB MLC iNAND
Flash, Memory Controller (5-Die Pkg.)
7
-
TI
#TPS61045
Adjustable LCD Boost Converter
6
-
TI
#SN74AVCH4T245
4-Bit Dual-Supply Bus Transceiver
5
-
Apple / Cirrus Logic
#338S1116 / CLI1586A1
Audio CODEC
3
-
Apple / Dialog Semiconductor
#343S0622-A1 / D2018
Power Management
8
-
NXP Semiconductor
#CBTL1608A1
Display Port Multiplexer ?
4
-
Apple / Cirrus Logic
#338S1077 / CS35L19
Audio Amplifier
9
-
TI
#SN74LVC1T45
Single-Bit Bus Transceiver
10
-
NXP Semiconductor
#74LVC1G32
Single 2-Input OR Gate
11
-
NXP Semiconductor
#74LVC1G125G
Tri-State Buffer
12
-
NXP Semiconductor
#74LVC1G126
Bus Buffer / Line Driver
13
-
TI
#SN74AUP1G08
Single 2-Input Positive AND Gate
Grid = 1 cm
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 Side 2 Cross-SectionSide 2 IC Identication Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos
Side 1 IC Identication
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement
Main Board
Costs and Metrics
Deep Dive Teardown
2
-
SanDisk
#SDMALBB4 032G
Multichip Memory - 32 GB MLC iNAND Flash, Memory Controller (5-Die Pkg.)
Pkg Size: 17 x 12 mm
2.2
-
SanDisk
#EHL9-64G
MLC iNAND Flash Memory - 8 GB
Die Size: 15.87 x 7.83 mm
2.1
-
SanDisk
#ANOBIT
Memory Controller
Die Size: 5.6 x 2.81 mm
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 IC Identication Side 2 X-Ray & Die Photos
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Side 1 X-Ray & Die Photos
Major Components Antenna SubsystemsComponent Arrangement
Main Board
Costs and Metrics
Deep Dive Teardown
Grid = 1 cm
Radio Board
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 IC Identication Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos Side 2
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Main Board
Costs and Metrics
Deep Dive Teardown
14
-
SK Hynix
#H9TCNNN4KDBMUR-NGM
Multichip Memory - 512 MB Mobile DDR2-S4 SDRAM (2-Die Pkg.)
15
-
TI
#CD3240B0
Touchscreen Line Driver ?
17
-
Broadcom
#BCM5973A1
Touchscreen Controller
16
-
Broadcom
#BCM5974
Touchscreen Controller
18
-
USI
#339S0175
WiFi 802.11a/b/g/n / Bluetooth / FM Radio (4-Die Pkg.)
19
-
Silego
#SLG59M301V
4 A Load Switch
Grid = 1 cm
*Broadcom BCM4334 inside
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement
Side 2 IC Identication
Main Board
Costs and Metrics
Deep Dive Teardown
14.1 - SK Hynix
#H5LR2D23AFR
Mobile DDR2
-
S4 SDRAM Memory - 256 MB
Die Size: 7.75 x 4.94 mm
14
-
SK Hynix
#H9TCNNN4KDBMUR-
NGM
Multichip Memory - 512 MB Mobile DDR2-S4 SDRAM (2-Die Pkg.)
Pkg Size: 11 x 11 mm
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Image 2 Image 3Image 1
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 IC IdenticationSide 1 X-Ray & Die Photos
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement
Side 2 X-Ray & Die Photos
Main Board
Costs and Metrics
Deep Dive Teardown
18.1
-
Broadcom
#BCM4334
WiFi 802.11a/b/g/n / Bluetooth / FM Radio
Die Size: 4.66 x 4.1 mm
18.2
-
Sk yworks
#458A01
RF LNA
Die Size: 1.4 x 0.65 mm
18.3
-
Sk yworks
#457B12
RF Power Amplifier
Die Size: 1.5 x 0.75 mm
18.4
-
TriQuint
#W2056B
RF Power Amplifier / LNA
Die Size: 1.45 x 1.45 mm
18
-
USI
#339S0175
WiFi 802.11a/b/g/n / Bluetooth / FM Radio (4-
Die Pkg.)
Pkg Size: 10.4 x 6.6 mm
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Image 1 Image 3Image 2
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 IC IdenticationSide 1 X-Ray & Die Photos
Side 2 X-Ray & Die Photos
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement
Main Board
Costs and Metrics
Deep Dive Teardown
18.1
-
Broadcom
#BCM4334
WiFi 802.11a/b/g/n / Bluetooth / FM Radio
Die Size: 4.66 x 4.1 mm
18.2
-
Sk yworks
#458A01
RF LNA
Die Size: 1.4 x 0.65 mm
18.3
-
Sk yworks
#457B12
RF Power Amplifier
Die Size: 1.5 x 0.75 mm
18.4
-
TriQuint
#W2056B
RF Power Amplifier / LNA
Die Size: 1.45 x 1.45 mm
18
-
USI
#339S0175
WiFi 802.11a/b/g/n / Bluetooth / FM Radio (4-
Die Pkg.)
Pkg Size: 10.4 x 6.6 mm
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 IC IdenticationSide 1 X-Ray & Die Photos
Image 1 Image 2
Image 3
Side 2 X-Ray & Die Photos
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement
Main Board
Costs and Metrics
Deep Dive Teardown
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1 IC IdenticationSide 1 Side 2 Cross-SectionSide 2 IC Identication Side 2 X-Ray & Die PhotosSide 1 X-Ray & Die Photos Cross-Section
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Main Board
Costs and Metrics
Deep Dive Teardown
21
–
Qualcomm*
#MDM9615M
Multimode Baseband Processor w/ Memory (2-Die Pkg.)
22 - Qualcomm
#RTR8600
GSM / CDMA / W
-CDMA / LTE RxD Transceiver + GPS
25
-
Infineon
#BGM1032N7
GPS / GLONASS Front
-End Module
23
-
Winbond
#W25Q16DWBYIG
Serial Flash Memory
- 2 MB
24
-
Murata ?
#2S7 EA ?
Dual SPDT Antenna
Switch ? (2-Die Pkg.)
Grid = 1 cm
20 - TI
#TPD4E101
4
-Ch. ESD Protection
* Die and
Xrays
images are available.
Front Page
Side 2
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Radio Boad
Product Packaging Exterior Features Teardown Overview & Discussion
Major Components Antenna SubsystemsComponent Arrangement Main Board
Side 1
Interconnect Board Side Key Flex
Other Substrates
Costs and Metrics
Deep Dive Teardown
26 - Qualcomm
#PM8018
Power Management
27 – Skyworks*
#SKY77729
LTE Band XVII Power
Amplifier (2-Die Pkg.)
28 – Skyworks*
#SKY77497
W-CDMA Bands II & V
Power Amplifier (2-Die Pkg.)
34 - Maxim
#Unknown
DC
-DC Converter ?
29
–
Avago
*
#AFEM
-7814
W-CDMA Band I & LTE Band IV
Power Amplifier (3-Die Pkg.)
32
–
Murata*
#SWUA ?
Diversity Rx Antenna Switch
w/ SAW Filters (2-Die Pkg.)
31
–
Skyworks
*
#SKY77352
Quad-Band GSM Power
Amplifier (2-Die Pkg.)
33
–
Murata*
#D06 ?
RF Antenna Switch
30 – TriQuint*
#TQM666084
W-CDMA Band VIII
Power Amplifier
Grid = 1 cm
* Die and
Xrays
images are available.
Front Page
Side 1
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Radio Boad
Product Packaging Exterior Features Teardown Overview & Discussion
Major Components Antenna SubsystemsComponent Arrangement Main Board
Interconnect Board Side Key Flex
Side 2
Other Substrates
Costs and Metrics
Deep Dive Teardown
36
-
STMicroelectronics
#LIS331DLH
3-Axis MEMS Accelerometer (2-Die Pkg.)
35
-
STMicroelectronics
#L3G4200DH
3-Axis MEMS Gyroscope (2-Die Pkg.)
Grid = 1 cm
Front Page
Side 2
Apple iPad 4 LTE A1459 32 GB Sample Report
Side 1
Product Overview Block Diagram
Radio Boad Side Key Flex
Product Packaging Exterior Features Teardown Overview & Discussion
Major Components Antenna SubsystemsComponent Arrangement Main Board
Interconnect Board
Other Substrates
Costs and Metrics
Deep Dive Teardown
37
-
AKM Semiconductor
#AK8975B
3-Axis Electronic Compass
38
-
Analog Devices
#AD7149
Capacitance Sensor Controller
Grid = 1 cm
Note: This Capacitance Sensor Controller notifies the
system to back off on the RF power when it senses
the presence of a hand via the RF Proximity Sensor.
Front Page
Side 1
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 2
Radio Boad Side Key Flex
Product Packaging Exterior Features Teardown Overview & Discussion
Major Components Antenna SubsystemsComponent Arrangement Main Board
Interconnect Board
Other Substrates
Costs and Metrics
Deep Dive Teardown
Volume
Grid = 1 cm
Front Page
Side 2
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Side 1
Radio Boad Interconnect Board
Product Packaging Exterior Features Teardown Overview & Discussion
Major Components Antenna SubsystemsComponent Arrangement Main Board
Side Key Flex
Other Substrates
Costs and Metrics
Deep Dive Teardown
Mute
On/Off &
Sleep/Wake
Interconnect Board
39
-
AKM Semiconductor ?
#AK5836 ?
Hall Effect Sensor
Grid = 1 cm
Front Page
Side 1
Apple iPad 4 LTE A1459 32 GB Sample Report
Note: Additional Substrate images were made available in the original report.
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Radio Boad Interconnect Board Side Key Flex
Major Components Antenna SubsystemsComponent Arrangement Main Board
Side 2
Other Substrates
Costs and Metrics
Deep Dive Teardown
Assembly
Name
Manufacturer Core Material Mfg. Technology Layers
Area
(cm²)
Min.
Trace
Pitch
(mm)
Min.
Trace
Width
(mm)
ThruVia
Land Dia
(mm)
ThruVia
Hole Dia
(mm)
BlindVia
Land Dia
(mm)
BlindVia
Hole Dia
(mm)
Thickness
(mm)
Routing
Density
Estimated
Costs
Docking Flex Unknown Polyimide 4 Layer flex w/vias 4 6.6 0.40 0.20 0.40 0.20 0.3 41.6 1.66$
Home Button Board Unknown FR4 2 Layer conventional FR4 / HF 2 1.6 0.40 0.20 0.50 0.20 0.2 16.4 0.02$
Interconnect Board Multek Hong Kong FR4 10 Layer buildup FR4 / HF 10 9.1 0.20 0.10 0.50 0.25 0.30 0.10 0.8 32.6 0.85$
Interconnect Flex Nippon Mektron Polyimide 4 Layer flex w/vias 4 13.5 0.15 0.08 0.30 0.15 0.3 5.5 3.39$
Main Board AT&S FR4 10 Layer buildup FR4 / HF 10 39.0 0.20 0.10 0.50 0.25 0.25 0.10 0.8 75.5 3.63$
Microphone Flex Unknown Polyimide 2 Layer flex w/vias 3 1.8 0.15 0.08 0.30 0.10 0.2 12.0 0.37$
Radio Board Ibiden FR4 10 Layer buildup FR4 / HF 10 13.0 0.15 0.08 0.25 0.10 0.7 69.3 1.21$
Side Key Flex Multi-Fineline Electronix Polyimide 2 Layer flex w/vias 2 2.6 0.20 0.10 0.50 0.20 0.1 18.2 0.42$
SIM Card Flex Unknown Polyimide 2 Layer flex w/vias 3 3.9 0.20 0.10 0.50 0.25 0.2 9.2 0.81$
Substrates
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Substrates
Integrated Circuits Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Major Components Antenna SubsystemsComponent Arrangement Main BoardProduct Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Costs and Metrics
Deep Dive Teardown
Note: Supplemental information, such as IC package & die marking
s, is included in the Excel Bill of Materials (BOM) spreadsheet.
Pkg Ref. #
Pkg
Qty
Brand Name Part Number Pkg Description Form Pin Count
Length
(mm)
Width
(mm)
Height
(mm)
Die Ref # Die Qty Brand Name Part Number Description
Length
(mm)
Width
(mm)
Each Total
1 1 Apple A6X / APL5598 Dual-Core Applications Processor (CPU) w/ Quad-Core GPU BGA (UF) 1089 16.90 16.90 1.20 1.1 1 Apple A6X / APL5598 Dual-Core Applications Processor (CPU) w/ Quad-Core GPU
12.30 10.80 $ 39.540 $ 39.540
2.1 1 SanDisk ANOBIT Memory Controller
5.60 2.81 $ 0.950 $ 0.950
2.2 4 SanDisk EHL9-64G MLC iNAND Flash Memory - 8 GB
15.87 7.83 $ 3.510 $ 14.040
3 1 Apple 343S0622-A1 / D2018 Power Management Flip Chip, Solder (UF) 296 8.94 5.55 1.10 3.1 1 Dialog Semiconductor 343S0622-A1 / D2018 Power Management
8.94 5.55 $ 3.320 $ 3.320
4 2 Apple 338S1077 / CS35L19 Audio Amplifier Flip Chip, Solder (UF) 42 3.20 2.73 0.80 4.1 1 Cirrus Logic 338S1077 / CS35L19 Audio Am plifier
3.20 2.73 $ 0.600 $ 1.200
5 1 Apple 338S1116 / CLI1586A1 Audio CODEC Flip Chip, Solder (UF) 100 4.30 4.30 0.80 5.1 1 Cirrus Logic 338S1116 / CLI1586A1 Audio CODEC
4.30 4.30 $ 1.510 $ 1.510
6 1 TI SN74AVCH4T245 4-Bit Dual-Supply Bus Transceiver QFN 16 2.60 1.80 0.90 6.1 1 TI SN74AVCH4T245 4-Bit Dual-Supply Bus Transceiver
1.28 1.15 $ 0.160 $ 0.160
7 1 TI TPS61045 Adjustable LCD Boost Converter DFN 8 3.00 3.00 1.10 7.1 1 TI TPS61045 Adjustable LCD Boost Converter
1.41 1.17 $ 0.140 $ 0.140
8 1 NXP Semiconductor CBTL1608A1 Display Port Multiplexer ? Flip Chip, Solder (UF) 36 2.10 2.09 0.80 8.1 1 NXP Semiconductor CBTL1608A1 Display Port Multiplexer ?
2.10 2.09 $ 0.330 $ 0.330
9 1 TI SN74LVC1T45 Single-Bit Bus Transceiver Flip Chip, Solder (UF) 6 1.40 0.91 0.90 9.1 1 TI SN74LVC1T45 Single-Bit Bus Transceiver
1.40 0.91 $ 0.100 $ 0.100
10 1 NXP Semiconductor 74LVC1G32 Single 2-Input OR Gate DFN 6 1.00 1.00 0.90 10.1 1 NXP Semiconductor 74LVC1G32 Single 2-Input OR Gate
0.51 0.34 $ 0.040 $ 0.040
11 1 NXP Semiconductor 74LVC1G125G Tri-State Buffer DFN 6 1.40 1.00 0.90 11.1 1 NXP Semiconductor 74LVC1G125G Tri-State Buffer
0.56 0.38 $ 0.040 $ 0.040
12 1 NXP Semiconductor 74LVC1G126 Bus Buffer / Line Driver DFN 6 1.40 1.00 0.90 12.1 1 NXP Semiconductor 74LVC1G126 Bus Buffer / Line Driver
0.56 0.38 $ 0.040 $ 0.040
13 1 TI SN74AUP1G08 Single 2-Input Positive AND Gate BGA 6 1.00 1.00 0.90 13.1 1 TI SN74AUP1G08 Single 2-Input Positive AND Gate
0.56 0.38 $ 0.040 $ 0.040
14 2 SK Hynix H9T CNNN4KDBMUR-NGM Multichip Memory - 512 MB Mobile DDR2-S4 SDRAM BGA Stacked 2 (UF) 225 11.00 11.00 0.70 14.1 2 SK Hynix H5LR2D 23AFR Mobile DDR2-S4 SDRAM Memory - 256 MB
7.75 4.94 $ 1.210 $ 4.840
15 1 TI CD3240B0 Touchscreen Line Driver ? BGA (UF) 121 6.00 6.00 0.50 15.1 1 TI CD3240B0 Touchsc reen Line Driver ?
3.25 3.19 $ 1.080 $ 1.080
16 1 Broadcom BCM5974 Touchscreen Controller BGA (UF) 81 5.00 5.00 0.57 16.1 1 Broadcom BCM5974 T ouchscreen Controller
3.25 3.19 $ 1.230 $ 1.230
17 1 Broadcom BCM5973A1 Touchscreen Controller BGA (UF) 119 7.00 7.00 0.56 17.1 1 Broadcom BCM5973A1 T ouchscreen Controller
4.83 4.34 $ 2.180 $ 2.180
18.1 1 Broadc om BCM4334 WiFi 802.11a/b/g/n / Bluetooth / FM Radio
4.66 4.10 $ 3.960 $ 3.960
18.2 1 Skyworks 458A01 RF LNA
1.40 0.65 $ 0.200 $ 0.200
18.3 1 Skyworks 457B12 RF Power Amplifier
1.50 0.75 $ 0.260 $ 0.260
18.4 1 T riQuint W2056B RF Power Amplifier / LNA
1.45 1.45 $ 0.460 $ 0.460
19 1 Silego SLG59M301V 4 A Load Switch DFN 8 2.00 1.50 1.10 19.1 1 Silego SLG59M301V 4 A Load Switch
1.59 0.98 $ 0.120 $ 0.120
20 1 TI TPD4E101 4-Ch. ESD Protection DFN 4 0.80 0.80 0.35 20.1 1 TI TPD4E101 4-Ch. ESD Protection
0.35 0.35 $ 0.030 $ 0.030
21.1 1 Micron M100ACD ? Mobile DDR SDRAM Mem ory - 128 MB ?
7.57 3.66 $ 0.780 $ 0.780
21.2 1 Qualc omm HG11-N3877 Multimode Baseband Processor
7.28 5.80 $ 21.490 $ 21.490
22 1 Qualcomm RTR8600 GSM / CDMA / W -CDMA / LTE RxD Transceiver + GPS BGA (UF) 196 7.80 6.20 0.90 22.1 1 Qualcomm HG11- VF535-220 GSM / CDMA / W-CDMA / LTE RxD Transc eiver + GPS
6.59 3.99 $ 3.910 $ 3.910
23 1 Winbond W 25Q16DWBYIG Serial Flash Memory - 2 MB Flip Chip, Solder (UF) 8 2.70 1.76 0.80 23.1 1 Winbond W25Q16DW BYIG Serial Flash Memory - 2 MB
2.70 1.76 $ 0.160 $ 0.160
24 1 Murata ? 2S7 EA ? Dual SPDT Antenna Switch ? MCP - 2 Chips (UF) 10 1.50 1.10 0.80 24.1 2 Murata ? 25SJ ? SPDT Antenna Switch
0.33 0.33 $ 0.050 $ 0.100
25 1 Infineon BGM1032N7 GPS / GLONASS Front-End Module DF N 6 2.26 1.68 0.90 25.1 1 Infineon BGM1032N7 GPS / GLONASS Front-End Module
1.00 0.53 $ 0.210 $ 0.210
26 1 Qualcomm PM8018 Power Management Flip Chip, Solder (UF) 106 4.46 3.90 0.80 26.1 1 Qualcomm HG11-VU756-210 Power Managem ent
4.46 3.90 $ 1.190 $ 1.190
27.1 1 Skyworks 31087 01 Bias Control
0.70 0.40 $ 0.030 $ 0.030
27.2 1 Skyworks 94031_34 RF Power Amplifier
1.00 0.90 $ 0.210 $ 0.210
28.1 1 Skyworks RP1629_1 Bias Control
0.71 0.31 $ 0.070 $ 0.070
28.2 1 Skyworks 94040_01 RF Power Amplifier
1.95 0.90 $ 1.450 $ 1.450
29.1 1 Avago 4DT7A Bias Control
0.77 0.57 $ 0.190 $ 0.190
29.2 1 Avago PBS1 RF Power Amplifier
0.95 0.88 $ 0.990 $ 0.990
29.3 1 Avago PBS3 RF Power Amplifier
0.87 0.72 $ 0.730 $ 0.730
30 1 TriQuint TQM666084 W-CDMA Band VIII Power Amplifier QFN 14 4.50 3.50 1.00 30.1 1 TriQuint TQM666084 W-CDMA Band VIII Power Amplifier
1.53 0.99 $ 0.980 $ 0.980
31.1 1 Skyworks 31531 02 Power Amplif ier Controller
0.98 0.98 $ 0.120 $ 0.120
31.2 1 Skyworks 94030_01 RF Power Amplifier
1.20 0.80 $ 0.310 $ 0.310
32.1 1 Peregrine C9941_1 RF Antenna Switch
1.21 1.16 $ 1.020 $ 1.020
32.2 1 Murata XM0825SX RF Switch ?
1.20 0.80 $ 0.380 $ 0.380
33 1 Murata D06 ? RF Antenna Switch QFN 20 3.00 3.00 1.10 33.1 1 Peregrine C9930_2 RF Antenna Switch
1.98 1.25 $ 0.880 $ 0.880
34 1 Maxim Unknown DC-DC Converter ? Flip Chip, Solder 9 1.57 1.56 0.90 34.1 1 Maxim Unknown DC-DC Converter
1.57 1.56 $ 0.170 $ 0.170
35.1 1 ST Microelectronics V654A Gyroscope Processor
2.56 2.56 $ 0.430 $ 0.430
35.2 1 ST Microelectronics G K10A MEMS Sensor
3.10 3.00 $ 2.930 $ 2.930
36.1 1 ST Microelectronics V583A Accelerometer Processor
2.19 1.52 $ 0.240 $ 0.240
36.2 1 ST Microelectronics CSL12B MEMS Sensor
2.10 1.94 $ 1.380 $ 1.380
37 1 AKM Sem iconductor AK8975B 3-Axis Electronic Compass Flip Chip, Solder 14 2.00 2.00 0.80 37.1 1 AKM Semic onductor AK8975B 3-Axis Electronic Com pass
2.00 2.00 $ 0.470 $ 0.470
38 1 Analog Devices AD7149 Capacitanc e Sensor Controller Flip Chip, Solder (UF) 25 2.20 2.00 0.80 38.1 1 Analog Devices AD7149 Capacitanc e Sensor Controller
2.20 2.00 $ 0.410 $ 0.410
Side Key Flex, Side 2 39 1 AKM Semiconductor ? AK5836 ? Hall Effect Sensor SOP 4 2.11 1.20 0.80 39.1 1 AKM Semiconductor ? AK5836 ? Hall Effect Sensor 0.76 0.71 $ 0.050 $ 0.050
41 3489 60 $117.09
(UF) = Underfilled
Main Board, Side 1
Main Board, Side 2
Radio Board, Side 1
Radio Board, Side 2
Interconnect Board, Side 1
Interconnect Board, Side 2
3.00
3.00
0.98
3-Axis MEMS Accelerometer
QFN Stacked 2
16361
STMicroelectronics
LIS331DLH
16
3-Axis MEMS Gyroscope
QFN Stacked 2
4.00
4.00
1.00
4.50
4.20
1.40
351STMicroelectronics
L3G4200DH
Diversity Rx Antenna Switch w/ SAW Filters
MCP - 2 Chips
24321
Murata
SWUA ?
14
5.00
3.50
1.00
6.00
4.50
0.81
311Skyworks
SKY77352
Quad-Band GSM Power Amplifier
MCP - 2 Chips
W-CDMA Band I & LTE Band IV Power Amplifier
MCP - 3 Chips
30291
Avago
AFEM-7814
30
6.00
4.50
0.95
3.00
3.00
0.95
281Skyworks
SKY77497
W-CDMA Bands II & V Power Amplifier
QFN Stacked 2
LTE Band XVII Power Amplifier
MCP - 2 Chips
10271
Skyworks
SKY77729
383
9.00
9.00
0.95
10.40
6.60
0.75
211Qualcomm
MDM9615M
Multimode Baseband Processor w/ Memory
BGA Stacked 2 (UF)
12.00
1.06
181USI
339S0175
WiFi 802.11a/b/g/n / Bluetooth / FM Radio
MCP - 4 Chips (UF)
52
BGA Stacked 5 (UF)
60
17.001SanDisk
SDMALBB4 032G
Multichip Memory - 32 GB MLC iNAND Flash, Memory Controller
Totals
Location
Estimated Costs
Die Info
Package Info
2
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Substrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Product Overview Block Diagram
Integrated Circuits
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
Note: The ICs listed below are for reference only.
Their costs are integrated into the cost of the individual subsy
stems.
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Pkg Ref. #
Pkg
Qty
Brand Name Part Number Pkg Description Form Pin Count
Length
(mm)
Width
(mm)
Height
(mm)
Die Ref # Die Qty B rand Name Part Number Description
Length
(mm)
Width
(mm)
Each Total
40 1 Seiko Instrum ents S-8244 Secondary Battery Protection DFN 8 2.10 1.90 0.90 40.1 1 Seiko Instrum ents S-8244 Secondary Battery Protection
1.24 1.18 $ 0.120 $ 0.120
41 1 Seiko Instrum ents S-8211 Battery Protection IC DFN 6 1.50 1.50 0.90 41.1 1 Seiko Instruments S-8211 Battery Protection IC
1.14 0.78 $ 0.080 $ 0.080
44 1 TI BQ7541 Battery Fuel Gauge DFN 12 4.00 2.50 0.90 44.1 1 TI BQ7541 Battery Fuel Gauge
2.39 1.92 $ 0.320 $ 0.320
45 1 OmniVision OV2C3BH ? 1.2 MP BSI CMOS Image Sensor Other - Surface Mount 16 5.90 5.40 1.10 45.1 1 OmniVision OV2C3BH ? 1.2 MP BSI CMOS Image Sensor
4.32 4.15 $ 2.010 $ 2.010
46 1 AMS TSL2583 Ambient Light Sensor DFN 6 1.90 1.90 0.80 46.1 1 AMS TSL2583 Ambient Light Sensor
1.65 1.10 $ 0.140 $ 0.140
47 1 OmniVision OV5650 5 MP BSI CMOS Image Sensor Other - Surface Mount 31 8.60 8.50 1.00 47.1 1 OmniVision OV5650 5 MP BSI CMOS Image Sensor
6.54 6.06 $ 4.520 $ 4.520
48 1 Rohm Unknown Autofocus VCM Driver Flip Chip, Solder 6 1.30 0.95 0.80 48.1 1 Rohm Unknown Autofocus VCM Driver
1.30 0.95 $ 0.110 $ 0.110
49 6 Samsung S6C24A1X01 TFT-LCD Display Column Driver Flip Chip, Adhesive 1225 20.90 1.30 0.22 49.1 1 Samsung S6C24A1X01 TFT -LCD Display Column Driver
20.90 1.30 $ 1.510 $ 9.060
50 4 Samsung S6CG246X01 TFT-LCD Dis play Row Driver Flip Chip, Adhesive 668 14.30 0.80 0.12 50.1 1 Samsung S6CG246X01 TFT-LCD Display Row Driver
14.30 0.80 $ 0.690 $ 2.760
51.1 1 RichTek Unknown MOSFET ?
0.59 0.51 $ 0.030 $ 0.030
51.2 1 RichTek RT436D2 DC-DC Converter ?
1.65 0.75 $ 0.100 $ 0.100
51.3 1 RichTek RT248F DC-DC Converter ?
2.49 1.74 $ 0.350 $ 0.350
52 1 Integrated Mem ory Logic iML7990 Programmable Gamma Buffer QFN 32 5.00 5.00 0.80 52.1 1 Integrated Memory Logic iML7990 Programmable Gamma Buffer
2.98 2.95 $ 0.650 $ 0.650
53 1 Parade Technologies DP635 Display Port Timing Controller BGA 119 12.00 5.00 1.00 53.1 1 Parade Technologies DP635 Display Port Timing Contr oller
4.83 3.01 $ 1.440 $ 1.440
54 1 Ricoh RP111L071D 500 m A / 0.7 V LDO Regulator DFN 6 1.20 1.20 0.70 54.1 1 Ricoh RP111L071D 500 mA / 0.7 V LDO Regulator
0.73 0.56 $ 0.050 $ 0.050
55 1 TI TPS62260 600 mA Step-Down DC-DC Converter DFN 6 2.00 2.00 0.80 55.1 1 TI TPS62260
600 mA Step-Down DC-DC Converter
1.44
0.85
$ 0.090
$ 0.090
56 1 Rohm
BR24T16-W
Serial EEPROM Memory - 2 KB
DFN
8
3.00
2.00
0.80
56.1
1
Rohm
BR24T16-W Serial EEPROM Mem ory - 2 KB
1.17 0.77 $ 0.100 $ 0.100
23 10306
25
$21.93
Battery Pack: Battery Board
Secondary Camera: Secondary Camera Flex
Main Camera: Main Camera Flex
Display / Touchscreen Module:
Display / Touchscreen Module: Display Board
Power Management
Totals
Package Info
5115.00
4.00
RichTek
RT9966GQW ?
Die Info
Location
MCP - 3 Chips
28
0.70
Estimated
Costs
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Costs and Metrics
Costs and Metrics
Product Overview Block Diagram
Integrated CircuitsSubstrates Modules Active Discretes Passive Discretes Connectors
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Subsystem ICs
Major Components Antenna SubsystemsComponent Arrangement Main Board
Deep Dive Teardown
Pin
Count
Length
(mm)
Width
(mm)
Each
Total
1
Unknown
Unknown
Shielding: Large
1
38.50
18.20
$ 0.040
$ 0.040
1
Unknown
Unknown
Shielding: Large
1
24.50
17.00
$ 0.040
$ 0.040
1
Unknown
A238L
Crystal: Ceramic
2
2.00
1.10
$ 0.200
$ 0.200
1
Unknown
T240
Crystal: Ceramic
4
2.00
1.50
$ 0.200
$ 0.200
1
Unknown
Unknown
Speaker: Dual Assembly w/ Acoustic Chamber
6
74.00
16.00
$ 1.600
$ 1.600
1
Unknown
821-1728
Antenna: Film - WiFi/Bluetooth w/ Coax Cable
1
30.00
11.00
$ 0.200
$ 0.200
1
Unknown
Unknown
Shielding: Large
1
62.40
28.40
$ 0.040
$ 0.040
1
Unknown
Unknown
Shielding: Large
1
55.00
28.00
$ 0.040
$ 0.040
1
Unknown
Unknown
Shielding: Large
1
55.00
26.00
$ 0.040
$ 0.040
1
Murata
Unknown
Filter: SAW
5
1.00
0.92
$ 0.070
$ 0.070
1
Unknown
Unknown
Shielding: Large
1
36.50
26.90
$ 0.040
$ 0.040
1
Unknown
Unknown
Shielding: Large
1
36.50
20.20
$ 0.040
$ 0.040
1
Sawtek
Unknown
Crystal: Ceramic
4
2.60
2.10
$ 0.200
$ 0.200
1
Unknown
821-1546-A
Antenna: Film - Rx Diversity w/ Support & Cable
1
20.50
46.20
$ 0.250
$ 0.250
1
Shanghai Amphenol Airwave (SAA)
821-1565-A
Antenna: Film - Main w/ Support & Cable (RF Prox.)
1
50.00
35.00
$ 0.350
$ 0.350
1
Murata
Unknown
Filter: SAW
5
1.00
0.90
$ 0.070
$ 0.070
1
Murata
Unknown
Filter: SAW
5
1.00
0.90
$ 0.070
$ 0.070
1
Murata
Unknown
Filter: SAW
5
1.00
0.90
$ 0.070
$ 0.070
1
Murata
Unknown
Filter: SAW
5
1.00
0.90
$ 0.070
$ 0.070
1
Murata
Unknown
Filter: SAW
5
1.00
0.90
$ 0.070
$ 0.070
1
Murata
Unknown
Filter: SAW
5
1.00
0.90
$ 0.070
$ 0.070
1
Murata
Unknown
Filter: SAW
5
1.00
0.90
$ 0.070
$ 0.070
1
Murata
Unknown
Filter: SAW - Duplexer
9
1.75
1.39
$ 0.290
$ 0.290
1
Tyco Electronics
821-1598-A
Antenna: Film - GPS w/ Cable
1
21.40
23.60
$ 0.200
$ 0.200
Home Button Board, Side 1
1
Unknown
Unknown
Switch: SMT - Home Button
4
3.90
3.80
$ 0.070
$ 0.070
Side Key Flex, Side 1
2
Unknown
Unknown
Switch: SMT - Volume
4
3.20
2.80
$ 0.070
$ 0.140
1
Unknown
Unknown
Switch: SMT - On/Off & Sleep/Wake
4
3.20
2.80
$ 0.070
$ 0.070
1
Unknown
Unknown
Switch: SMT - Slide - Mute
6
8.00
2.20
$ 0.100
$ 0.100
Microphone Flex, Side 1
1
Knowles
SPK0833LM4H-B
Microphone: MEMS
4
3.90 2.90 $ 0.270 $ 0.270
TOTALS 30 102
$4.98
Main Board, Side 1
Main Board, Side 2
Radio Board, Side 1
Radio Board, Side 2
Side Key Flex, Side 2
Qty
Brand Name
Part Number
Package
Estimated
Costs
Description
Location
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Integrated CircuitsSubstrates Subsystem ICs Active Discretes Passive Discretes Connectors
Product Overview Block Diagram
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Modules
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
Form Top Marking Pin Count
Length
(mm)
Width
(mm)
Each Total
1
Small Active Diode, SMT BF t28 2 2.60 1.60 $0.015 $0.015
2 Small Active Diode, SMT
JH
2
1.40
1.00
$0.015
$0.030
1
Small Active
Diode, SMT
SD
2
2.00 1.50 $0.015 $0.015
4 Small Active MOSFET - Flip Chip 58874 34047 6 1.40 0.97 $0.090 $0.360
4
Small Active
Diode, SMT
2
1.00
0.60 $0.015 $0.060
8
Small Active
Diode, SMT
2 0.60 0.30 $0.015 $0.119
Interconnect Board, Side 1
2
Small Active
Diode, SMT
V
2
0.50
0.30 $0.015 $0.030
Interconnect Flex, Side 1
7 Small Active Diode, SMT 2 0.60 0.30 $0.015 $0.104
TOTALS 29 74 $0.73
Estimated Costs
Location
Functional Description
Qty
Package
Main Board, Side 1
Main Board, Side 2
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Integrated CircuitsSubstrates Subsystem ICs Modules Passive Discretes Connectors
Product Overview Block Diagram
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Active Discretes
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
Form Pin Count Each Total
3 Coil SMT, Small 2 $0.050 $0.150
1 Coil SMT, Small 2 $0.080 $0.080
10 Coil SMT, Small 2 $0.050 $0.500
1 Coil SMT, Small 2 $0.050 $0.050
2 Capacitor Tantalum / Niobium, Small 2 $0.050 $0.100
356 Small Passive Cap, Res, Ferrite 2 $0.004 $1.424
427 Small Passive Cap, Res, Ferrite 2 $0.004 $1.708
12 Small Passive Cap, Res, Ferrite Array 4 $0.007 $0.089
8 Small Passive Cap, Res, Ferrite Array 10 $0.007 $0.059
1 Filter Ceramic, Small 6 $0.065 $0.065
39
Small Passive
Coil, Inductor 2 $0.008 $0.312
142
Small Passive
Cap, Res, Ferrite 2 $0.004 $0.568
30 Small Passive Coil, Inductor 2 $0.008 $0.240
5 Coil SMT, Small 2 $0.050 $0.250
2 Filter Ceramic, Small 2 $0.065 $0.130
144 Small Passive Cap, Res, Ferrite 2 $0.004 $0.576
44 Small Passive Cap, Res, Ferrite 2 $0.004 $0.176
2 Small Passive Coil, Inductor 2 $0.008 $0.016
26 Small Passive Cap, Res, Ferrite 2 $0.004 $0.104
5 Small Passive Cap, Res, Ferrite Array 4 $0.007 $0.037
4 Small Passive Coil, Inductor 2 $0.008 $0.032
Home Button Board, Side 1
1 Small Passive Cap, Res, Ferrite 2 $0.004 $0.004
Docking Flex, Side 1
1 Small Passive Cap, Res, Ferrite 2 $0.004 $0.004
Side Key Flex, Side 2
1 Small Passive Cap, Res, Ferrite 2 $0.004 $0.004
Microphone Flex, Side 1
4 Small Passive Cap, Res, Ferrite 2 $0.004 $0.016
TOTALS 1271
2644 $6.69
Main Board, Side 1
Main Board, Side 2
Radio Board, Side 1
Radio Board, Side 2
Interconnect Board, Side 1
Interconnect Board, Side 2
Qty
Functional Description
Package
Location
Estimated
Costs
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Connectors
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Passive Discretes
Costs and Metrics
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
Pin
Count
Length
(mm)
Width
(mm)
Each Total
Docking Flex, Side 1
1 Port: Lightning 10 14.50 8.50 $0.500 $0.500
Docking Flex, Side 2
1 Bd to Bd: Main Board 50 13.20 3.70 $0.270 $0.270
Home Button Board, Side 1
1 Cable: Flex - Home Button Board to Main Board 6 107.50 11.76 $0.620 $0.620
Interconnect Board, Side 1
1 Bd to Bd: Main Camera 32 7.80 1.30 $0.180 $0.180
1 Connector: ZIF - Microphone Flex 6 4.35 3.20 $0.092 $0.092
1 Bd to Bd: RF Proximity Sensor / Main Antenna 10 4.40 2.40 $0.070 $0.070
1 Bd to Bd: Secondary Camera 18 5.00 1.60 $0.110 $0.110
Interconnect Flex, Side 1
1 Jack: Headphone 5 14.60 15.80 $0.150 $0.150
1 Connector: ZIF - Home Button Flex 6 4.30 3.20 $0.092 $0.092
1 Connector: Speaker 6 8.91 5.10 $0.080 $0.080
1 Connector: Antenna Coax - WiFi/Bluetooth 2 2.56 1.65 $0.040 $0.040
1 Connector: Battery Module 5 19.00 9.20 $0.120 $0.120
1 Bd to Bd: Docking Flex 50 12.00 2.20 $0.270 $0.270
4 Connector: ZIF - Touchscreen/Interconnect Flex 37 12.80 4.10 $0.309 $1.236
1 Connector: ZIF - Display 51 17.10 4.00 $0.407 $0.407
1 Cable: Flex - Main to Radio Board 42 13.30 16.00 $0.350 $0.350
1 Connector: External Test Antenna 2 2.00 2.00 $0.070 $0.070
Radio Board, Side 1
1 Connector: ZIF - SIM Card Flex 6 4.20 3.30 $0.092 $0.092
3 Connector: External Test Antenna 2 2.00 2.00 $0.070 $0.210
3 Connector: Antenna Coax - Main, Rx Diversity, GPS 2 1.60 1.60 $0.040 $0.120
SIM Card Flex, Side 1
1 Socket: Micro SIM 6 18.10 17.40 $0.230 $0.230
TOTALS 28 473 $5.31
Interconnect Board, Side 2
Main Board, Side 1
Main Board, Side 2
Radio Board, Side 2
Location
Estimated
Costs
Qty
Form
Package
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Connectors
Costs and Metrics
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Deep Dive Teardown
General Area Assembly Name
Substrate Area
(sq.cm)
Metal Layers
Circuit Area
(sq.cm)
Routing Density
(cm of routing per sq.cm of
substrate)
Number of
Components
Number of
Connections
Component Density
(Components/sq.cm)
Connection Density
(Connections/sq.cm)
Avg. Pin Count
Assembly Weight
(grams)
Main Electronics
Docking Flex 6.6 4 26.4 41.6 3 62 0.5 9.4 20.7 1.80
Main Electronics
Home Button Board 1.6 2 3.2 16.4 3 12 1.9 7.5 4.0 0.30
Main Electronics
Interconnect Board 9.1 10 91.0 32.6 91 313 10.0 34.4 3.4 2.10
Main Electronics
Interconnect Flex 13.5 4 54.0 5.5 8 19 0.6 1.4 2.4 1.30
Main Electronics
Main Board 39.0 10 390.0 75.5 883 4670 22.6 119.7 5.3 34.80
Main Electronics
Microphone Flex 1.8 3 5.4 12.0 5 12 2.8 6.7 2.4 0.10
Main Electronics
Radio Board 13.0 10 130.0 69.3 399 1664 30.7 128.0 4.2 4.40
Main Electronics
Side Key Flex 2.6 2 5.2 18.2 6 24 2.3 9.2 4.0 0.20
Main Electronics
SIM Card Flex 3.9 3 11.7 9.2 1 6 0.3 1.5 6.0 0.70
Main Electronics Totals 91.1 48 716.9 1399 6782 15.4 74.4 4.8 45.70
Subsystem Electronics
Battery Pack: Battery Board 10.4 8 83.2 18.2 69 163 6.6 15.7 2.4 3.70
Subsystem Electronics
Secondary Camera: Secondary Camera Flex 1.7 2 3.4 53.1 3 40 1.8 23.5 13.3 0.20
Subsystem Electronics
Main Camera: Main Camera Flex 1.7 2 3.4 81.6 4 71 2.4 41.8 17.8 0.50
Subsystem Electronics
Display / Touchscreen Module: Backlight Flex - Bottom 10.4 2 20.8 12.1 42 84 4.0 8.1 2.0 0.50
Subsystem Electronics
Display / Touchscreen Module: Backlight Flex - Top 14.4 2 28.8 10.3 42 84 2.9 5.8 2.0 0.70
Subsystem Electronics
Display / Touchscreen Module: Display Board 20.3 10 203.0 30.0 153 629 7.5 27.3 4.1 5.40
Subsystem Electronics Totals 58.9 26 342.6 313 1071 5.3 18.2 3.4 11.00
System Totals 150.0 74 1059.5 1711 7779 11.4 51.9 4.5 56.70
Electronic Assembly Metrics by Assembly
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Electronic Assembly Metrics
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs Breakdown Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Page 1
Major Components Antenna SubsystemsComponent Arrangement Main BoardProduct Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Page 2 Page 3 Page 4
Costs and Metrics
Deep Dive Teardown
NOTE: Occasional inconsistencies in totals may be present due to
rounding error.
General Area Assembly Name
Total
Integrated Circuits
Modular & Odd Form
Components
Small Active
Components
Passive Components
Connector Components
Substrates
Insertion
Card Test
Main Electronics
Docking Flex 2.53$ -$ -$ -$ 0.00$ 0.77$ 1.66$ 0.04$ 0.05$
Main Electronics
Home Button Board 0.77$ -$ 0.07$ -$ 0.00$ 0.62$ 0.02$ 0.03$ 0.02$
Main Electronics
Interconnect Board 8.15$ 5.86$ -$ 0.03$ 0.37$ 0.45$ 0.85$ 0.55$ 0.05$
Main Electronics
Interconnect Flex 3.72$ -$ -$ 0.10$ -$ 0.15$ 3.39$ 0.05$ 0.02$
Main Electronics
Main Board 94.62$ 75.78$ 2.40$ 0.60$ 4.22$ 2.66$ 3.63$ 5.07$ 0.25$
Main Electronics
Microphone Flex 0.70$ -$ 0.27$ -$ 0.02$ -$ 0.37$ 0.02$ 0.02$
Main Electronics
Radio Board 43.54$ 35.40$ 1.93$ -$ 2.08$ 0.42$ 1.21$ 2.31$ 0.20$
Main Electronics
Side Key Flex 0.85$ 0.05$ 0.31$ -$ 0.00$ -$ 0.42$ 0.05$ 0.02$
Main Electronics
SIM Card Flex 1.07$ -$ -$ -$ -$ 0.23$ 0.81$ 0.01$ 0.02$
Main Electronics Totals 155.95$ 117.09$ 4.98$ 0.73$ 6.69$ 5.31$ 12.36$ 8.14$ 0.65$
Subsystem Electronics
Battery Pack 2.25$ 0.52$ -$ 0.30$ 0.35$ 0.15$ 0.38$ 0.45$ 0.10$
Subsystem Electronics
Display / Touchscreen Module 49.43$ 14.63$ 15.81$ 4.34$ 0.59$ 4.68$ 7.21$ 1.83$ 0.35$
Subsystem Electronics
Main Camera 5.96$ 4.63$ 0.65$ -$ -$ 0.18$ 0.28$ 0.07$ 0.15$
Subsystem Electronics
Secondary Camera 2.70$ 2.15$ -$ -$ -$ 0.11$ 0.28$ 0.06$ 0.10$
Subsystem Electronics Totals 60.34$ 21.93$ 16.46$ 4.64$ 0.94$ 5.12$ 8.15$ 2.40$ 0.70$
System Totals 216.29$ 139.02$ 21.44$ 5.37$ 7.64$ 10.42$ 20.51$ 10.55$ 1.45$
Electronics Costs by Assembly
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Electronic Assembly Metrics
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs Breakdown Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Page 1 Page 3 Page 4
Major Components Antenna SubsystemsComponent Arrangement Main BoardProduct Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Page 2
Costs and Metrics
Deep Dive Teardown
NOTE: Occasional inconsistencies in totals may be present due to
rounding error.
General Area Assembly Name
IC Package Count
IC Connections
Modular/Odd Form
Components
Modular/Odd Form
Component Connections
Small Active Components
Small Active Component
Connections
Passive Components
Passive Component
Connections
Connectors
Connector Connections
Subsystem IOs
Opportunities
Main Electronics Docking Flex 0 0 0 0 0 0 1 2 2 60 0 65
Main Electronics Home Button Board 0 0 1 4 0 0 1 2 1 6 0 15
Main Electronics Interconnect Board 4 71 0 0 2 4 81 172 4 66 0 404
Main Electronics Interconnect Flex 0 0 0 0 7 14 0 0 1 5 0 27
Main Electronics Main Board 21 2550 9 18 20 56 821 1734 12 312 0 5553
Main Electronics Microphone Flex 0 0 1 4 0 0 4 8 0 0 0 17
Main Electronics Radio Board 15 864 15 58 0 0 362 724 7 18 0 2063
Main Electronics Side Key Flex 1 4 4 18 0 0 1 2 0 0 0 30
Main Electronics SIM Card Flex 0 0 0 0 0 0 0 0 1 6 0 7
Main Electronics Totals 41 3489 30 102 29 74 1271 2644 28 473 0 8181
Subsystem Electronics Battery Pack 3 26 0 0 8 25 52 106 6 6 5 237
Subsystem Electronics Display / Touchscreen Module 16 10221 3 76 89 182 136 272 3 68 51 11116
Subsystem Electronics Main Camera 2 37 1 2 0 0 0 0 1 32 32 107
Subsystem Electronics Secondary Camera 2 22 0 0 0 0 0 0 1 18 18 61
Subsystem Electronics Touchscreen Module 0 0 1 74 0 0 0 0 0 0 74 149
Subsystem Electronics Totals 23 10306 5 152 97 207 188 378 11 124 180 11670
System Totals 64 13795 34 180 126 281 1459 3022 39 597 180 19777
Counts by Assembly
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Electronic Assembly Metrics
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs Breakdown Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Major Components Antenna SubsystemsComponent Arrangement Main BoardProduct Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Page 2Page 1 Page 4
Page 3
Costs and Metrics
Deep Dive Teardown
NOTE: Occasional inconsistencies in totals may be present due to
rounding error.
General Area Assembly Name
IC Die Count
IC Package Count
Number of Package Connections
Die Area
(sq.mm)
Substrate Tiling Density
(die area / substrate area)
Package Area
(sq.mm)
Die Area/Package Area Ratio
Package Connections
per sq.cm of Package Area
Volatile Memory
(KBytes)
Non-Volatile Memory
(KBytes)
Main Electronics Interconnect Board 6 4 71 31.7 0.03 33.4 0.95 212.6 0 0
Main Electronics Main Board 30 21 2550 960.4 0.25 1023.0 0.94 249.3 1048576 33554432
Main Electronics Radio Board 23 15 864 135.0 0.1 284.2 0.48 304.0 131072 2048
Main Electronics Side Key Flex 1 1 4 0.5 0 2.5 0.21 158.0 0 0
Main Electronics Totals 60 41 3489 1127.7 1343.1 0.84 259.8 1179648 33556480
Subsystems Battery Pack 3 3 26 6.9 16.2 0.43 1.6 0 0
Subsystems Display / Touchscreen Module 18 16 10221 240.5 325.2 0.74 31.4 0 8
Subsystems Main Camera 2 2 37 40.9 74.3 0.55 0.5 0 0
Subsystems Secondary Camera 2 2 22 19.7 35.5 0.56 0.6 0 0
Subsystem Electronics Totals 25 23 10306 308.1 451.3 0.68 2283.8 0 8
System Totals 85 64 13795 1435.7 1794.4 0.80 768.8 1179648 33556488
IC Metrics
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Apple iPad 4 LTE A1459 32 GB Sample Report
Electronic Assembly Metrics
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs Breakdown Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Major Components Antenna SubsystemsComponent Arrangement Main BoardProduct Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Page 2Page 1 Page 3 Page 4
Costs and Metrics
Deep Dive Teardown
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
Estimated Cost
of Electronics
(Includes Subsystem Electronics)
$216.29
Estimated Cost
of Electronics
(Includes Subsystem Electronics)
$216.29
Card Test
1%
Insertion
5%
Small Active Components
2%
Modular & Odd
Components
10%
Substrates
9%
Passive Components
4%
Connector Components
5%
Integrated Circuits
64%
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Apple iPad 4 LTE A1459 32 GB Sample Report
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost Electronic Costs Breakdown
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
Pkg. Brand Cost
Apple $45.57
Qualcomm $27.37
SanDisk $14.99
Samsung $11.82
OmniVision $6.53
STMicroelectronics $4.98
USI $4.88
SK Hynix $4.84
Broadcom $3.41
Murata $2.38
Skyworks $2.19
TI $1.96
Avago $1.91
Parade Technologies $1.44
TriQuint $0.98
Integrated Memory Logic $0.65
AKM Semiconductor $0.52
RichTek $0.48
NXP Semiconductor $0.45
Analog Devices $0.41
Rohm $0.21
Infineon $0.21
Seiko Instruments $0.20
Maxim $0.17
Winbond $0.16
AMS $0.14
Silego $0.12
Ricoh $0.05
Other
NOTE: Occasional inconsistencies in totals may be present due to
rounding error.
* Includes Subsystem Vendors & Associated Costs
STMicroelectronics
4%
OmniVision
5%
Samsung
9%
Other
20%
Qualcomm
19%
Apple
32%
SanDisk
11%
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs BreakdownElectronic Assembly Metrics Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost Vendor IC Cost Distribution
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
Subsystem
Part ID
No.
Qty Description
Fabrication Process Material Dimensions (mm)
Weight
(grams)
Est'd Cost
Each
Est'd
Extended Cost
1
1 Enclosure Cast + Machined + Anodized + Printed Aluminum 241.2 x 185.8 x 8.9 122.30 13.000 13.000
3
1 Bezel Molded Plastic + Adhesive 240 x 184 x 1 1.20 0.200 0.200
4
1 Antenna Well Molded + Pulls Plastic + Adhesive 120 x 16.5 x 8.6 4.80 0.270 0.270
5
59 Screw Machined Metal x 0.59 0.007 0.413
6
2 Strong Magnet + Spring Cast + Stamped + Assembled Metal 50 x 3.6 x 3 4.40 0.400 0.800
7
4 Weak Magnet Cast Metal 13 x 3.2 x 0.7 0.80 0.050 0.200
8
1 Micro SIM Holder Machined + Anodized Aluminum 20.6 x 16.8 x 1.9 0.30 0.200 0.200
9
1 Lightning Connector Support Cast + Machined + Anodized Aluminum 25.6 x 8 x 4.9 2.00 0.250 0.250
10
1 Micro SIM Holder Lever Cast Metal 12.6 x 2.7 x 3.2 0.05 0.100 0.100
11
4 Corner Plates Cast Metal x 6.40 0.100 0.400
12
1 Side Key Bracket Cast Metal 40.8 x 5 x 2.9 1.00 0.050 0.050
13
1 Bracket Cast Metal 18.2 x 4.8 x 0.9 0.05 0.030 0.030
14
1 Secondary Camera Bracket Stamped + Press Fit Metal 15.8 x 10.9 x 2.1 0.05 0.070 0.070
15
1 Power Button Molded + Extruded Plastic + Metal 12.3 x 3.7 x 2.8 0.05 0.100 0.100
16
1 Home Key Cover w/ Spring Molded + Painted + Printed + Stamped + Assembled Plastic + Metal + Adhesive 13.6 x 13.4 x 1.1 0.20 0.180 0.180
17
1 Home Key Bracket Cast + Painted Metal 36.1 x 7.9 x 1.9 1.30 0.100 0.100
18
1 Bracket Molded Plastic 21.2 x 7.4 x 1.7 0.05 0.020 0.020
19
1 Camera Lens Cover Molded + Stamped + Painted Plastic + Metal 10.9 x 8 x 1.3 0.05 0.080 0.080
20
1 Camera Bezel Molded Plastic 11.3 x 8.2 x 1.6 0.05 0.020 0.020
21
1 Apple Logo Molded Plastic 40 x 32 x 0.7 1.20 0.100 0.100
22
1 Magnet Bracket Molded Plastic 61.9 x 3.2 x 1.1 0.05 0.030 0.030
23
4 Magnet Brackets Molded Plastic 8 x 5.1 x 2.5 0.20 0.020 0.080
24
1 Bracket Molded Plastic 54.3 x 6.6 x 5.4 1.10 0.050 0.050
25
1 Bracket Stamped + Painted Aluminum 45.6 x 7 x 1.1 1.30 0.040 0.040
26
1 Mute Button Co-Molded + Painted Plastic + Aluminum 11.2 x 4.8 x 4.4 0.05 0.150 0.150
27
1 Side Keys Molded + Painted Plastic 20 x 3.7 x 1.7 0.05 0.050 0.050
28
1 Speaker Screen Die-Cut Plastic + Adhesive 41.6 x 14.9 x 0.04 0.01 0.010 0.010
29
4 Foam Die-Cut Foam + Adhesive x 0.04 0.005 0.020
30
19 Conductive Gasket Die-Cut Conductive Foam + Adhesive x 0.19 0.005 0.095
31
7 Grounding Tape Die-Cut Conductive Fabric + Adhesive x 0.07 0.020 0.140
32
4 Label Die-Cut + Printed Plastic + Adhesive x 0.04 0.010 0.040
33
37 Tape Die-Cut Plastic + Adhesive x 0.37 0.005 0.185
34
5 Gasket Die-Cut Foam + Adhesive x 0.05 0.005 0.025
35
4 Gasket Die-Cut Plastic + Adhesive x 0.04 0.010 0.040
36
8 Thermal Pad Die-Cut Thermal Elastomer x 0.08 0.020 0.160
37
1 Tape Die-Cut Plastic + Adhesive 203 x 7.7 x 0.03 1.00 0.010 0.010
38
2 Gasket Die-Cut Plastic + Adhesive 75 x 1 x 0.8 0.10 0.010 0.020
39
1 Gasket Die-Cut Plastic + Adhesive 222 x 165 x 0.05 0.80 0.020 0.020
187 $17.75
Estimated Cost
Total
Enclosures
Miscellaneous
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Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Cost SummaryFinal Ass’y Labor & Test Cost Non-Electronic Cost Estimate
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
1.64
$
1.60
$
Est'd final test cost
China
229
779
2959
Made in
Est'd final assembly cost
Number of parts
Est'd number of steps
Est'd time (seconds)
Final Assembly & Test
Front Page
Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Cost SummaryFinal Ass’y Labor & Test Cost
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
Cameras
5%
Non
-
Electronic Parts
5%
Main Electronic Assemblies
48%
Final Assembly & Test
1%
Battery Pack
6%
Display /
Touchscreen
35%
Main Electronic Assemblies
155.95$
Battery Pack
20.27$
Display / Touchscreen
112.73
$
Cameras
16.31
$
Non-Electronic Parts
17.75
$
Final Assembly & Test
3.25
$
Total
326.27
$
Estimated Cost Totals
Note: An additional $5.20 estimated for accessories and
supporting materials
Cost Total Notes:
Estimated final assembly cost includes labor only.
Total cost does not include Non-recurring, R&D, G&A, IP
licensing fees/royalties, software, sales & marketing,
distribution.
Assumes fully scaled production.
Note: Because the Touchscreen and Cover Glass were included in
the Display costs, there is a difference in the final cost from
the
original report.
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Apple iPad 4 LTE A1459 32 GB Sample Report
Product Overview Block Diagram
Integrated CircuitsSubstrates Subsystem ICs Modules Active Discretes Passive Discretes Connectors
Electronic Costs BreakdownElectronic Assembly Metrics Vendor IC Cost Distribution Non-Electronic Cost Estimate Final Ass’y Labor & Test Cost Cost Summary
Product Packaging Exterior Features Teardown Overview & DiscussionOther Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Costs and Metrics
Deep Dive Teardown
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Apple iPad 4 LTE A1459 32 GB Sample Report
COST ESTIMATION PROCESS
Overview and Discussion
Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand
in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions
about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that
which strives to maintain comparability of the output of the model across product families and over time.
TechInsights' philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years,
we have developed an estimation process that, while necessarily lacking an insider's knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction
of unit costs in high-volume production environments. We do not claim that the model will produce the "right" answer for your firm's environment. However, TechInsights does give
customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify
the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.
Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-ofmaterials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type,
manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer
size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and
interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD
display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative
sources, LCD panel costs are taken from and referenced to these sources.
Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive
at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average
high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly
time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.
The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules,
electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under
evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.
We believe our cost estimates generally fall within 15 percent of the "right answer," which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the
TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type.
Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view
of OEM high volume cost-to-produce.
Please feel free to contact us at support@techinsights.com with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.
MetricsCost Estimation Process
Metrics
Product Overview Block Diagram
Product Packaging Exterior Features Teardown Other Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Overview & Discussion
Deep Dive Teardown
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Apple iPad 4 LTE A1459 32 GB Sample Report
Metrics
Overview and Discussion
In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system
semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count,
and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products
are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking
purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either "raw" measured data or ratios of these measured data
sets.
Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes
packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the
major cost driver for most systems we examine.
Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board "projected" area (i.e. the simple board area and not the cumulative surface area of both sides of the board).
This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small formfactor IC packaging technologies. High density circuit boards are also often a supporting technology.
Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.
Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical
connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).
Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an
opportunity for failure. A high opportunity count means more complex and riskier electronics assembly.
Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the `average' terminal complexity of the
components and often provide a signature of integration level and/or "digital-ness" of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often
characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.
Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data
related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount
memory chips is more readily achieved than comparable silicon tiling of high pincount logic.
Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the
Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density
of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount
assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances.
Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of
the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the
regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.
Product Overview Block Diagram
Cost Estimation Process Metrics
Product Packaging Exterior Features Teardown Other Substrates
Major Components Antenna SubsystemsComponent Arrangement Main Board
Costs and Metrics
Overview & Discussion
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