Self-Contained
REFERENCE
1
2
3
4
8
7
6
5
TOP VIEW
(Not to Scale)
–IN
+IN
V–
V+
OUT
RG
2
RG
1
SSM2017
a
FEATURES
Excellent Noise Performance: 950 pV/√
Noise Figure
Ultralow THD: < 0.01% @ G = 100 Over the Full Audio
Band
Wide Bandwidth: 1 MHz @ G = 100
High Slew Rate: 17 V/ms typ
Unity Gain Stable
True Differential Inputs
Subaudio 1/f Noise Corner
8-Pin Mini-DIP with Only One External Component
Required
Very Low Cost
Extended Temperature Range: –408C to +858C
APPLICATIONS
Audio Mix Consoles
Intercom/Paging Systems
Two-Way Radio
Sonar
Digital Audio Systems
Hz or 1.5 dB
Audio Preamplifier
SSM2017
FUNCTIONAL BLOCK DIAGRAM
V–
+IN
RG
RG
2
–IN
1
5kΩ
5kΩ
X1
PIN CONNECTIONS
Epoxy Mini-DIP (P Suffix)
X1
5kΩ
5kΩ
SSM2017
5kΩ
5kΩ
REFERENCE
V+
OUT
V–
GENERAL DESCRIPTION
The SSM2017 is a latest generation audio preamplifier, combining SSM preamplifier design expertise with advanced processing. The result is excellent audio performance from a selfcontained 8-pin mini-DIP device, requiring only one external
gain set resistor or potentiometer. The SSM2017 is further enhanced by its unity gain stability.
Key specifications include ultralow noise (1.5 dB noise figure)
and THD (<0.01% at G = 100), complemented by wide bandwidth and high slew rate.
Applications for this low cost device include microphone preamplifiers and bus summing amplifiers in professional and consumer audio equipment, sonar, and other applications requiring
a low noise instrumentation amplifier with high gain capability.
16-Pin Wide Body SOL (S Suffix)
16
NC
15
RG
14
NC
13
V+
NC
12
OUT
11
REFERENCE
10
NC
9
2
RG
NC
1
NC
–IN
+IN
NC
V–
NC
1
2
3
SSM2017
4
TOP VIEW
TOP VIEW
(Not to Scale)
5
(Not to Scale)
6
7
8
NC = NO CONNECT
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 World Wide Web Site: http://www.analog.com
Fax: 617/326-8703 © Analog Devices, Inc., 1997
(VS = 615 V and –408C ≤ TA ≤ +858C, unless otherwise noted. Typical speci-
SSM2017–SPECIFICA TIONS
Parameter Symbol Conditions Min Typ Max Units
DISTORTION PERFORMANCE T
Total Harmonic Distortion Plus Noise THD+N G = 1000, f = 1 kHz 0.012 %
NOISE PERFORMANCE
Input Referred Voltage Noise Density e
Input Current Noise Density i
DYNAMIC RESPONSE
Slew Rate SR G = 10 10 17 V/µs
Small Signal Bandwidth BW
INPUT
Input Offset Voltage V
Input Bias Current I
Input Offset Current Ios V
Common-Mode Rejection CMR V
Power Supply Rejection PSR V
Input Voltage Range IVR ±8V
Input Resistance R
OUTPUT
Output Voltage Swing V
Output Offset Voltage V
Minimum Resistive Load Drive T
Maximum Capacitive Load Drive 50 pF
Short Circuit Current Limit I
Output Short Circuit Duration 10 sec
GAIN
Gain Accuracy
Maximum Gain G 70 dB
REFERENCE INPUT
Input Resistance 10 kΩ
Voltage Range ±8V
Gain to Output 1 V/V
POWER SUPPLY
Supply Voltage Range V
Supply Current I
Specifications subject to change without notice.
n
n
–3 dB
IOS
B
IN
O
OOS
SC
10 kΩ T
R
=
G
G – 1 RG = 10 Ω, G = 1000 0.25 1 dB
S
SY
fications apply at TA = +258C.)
= +25°C
A
V
= 7 V rms
O
R
= 5 kΩ
L
G = 100, f = 1 kHz 0.005 %
G = 10, f = 1 kHz 0.004 %
G = 1, f = 1 kHz 0.008 %
f = 1 kHz, G = 1000 0.95 nV/√Hz
f = 1 kHz; G = 100 1.95 nV/√
f = 1 kHz; G = 10 11.83 nV/√
f = 1 kHz; G = 1 107.14 nV/√
f = 1 kHz, G = 1000 2 pA/√Hz
R
= 4.7 kΩ
L
C
= 50 pF
L
T
= +25°C
A
G = 1000 200 kHz
G = 100 1000 kHz
G = 10 2000 kHz
G = 1 4000 kHz
0.1 1.2 mV
VCM = 0 V 6 25 µA
= 0 V ±0.002 ±2.5 µA
CM
= ±8 V
CM
G = 1000 80 112 dB
G = 100 60 92 dB
G = 10 40 74 dB
G = 1, T
G = 1, T
= ±6 V to ±18 V
S
= +25°C2654dB
A
= – 40°C to +85°C2054 dB
A
G = 1000 80 124 dB
G = 100 60 118 dB
G = 10 40 101 dB
G = 1 26 82 dB
Differential, G = 1000 1 MΩ
G = 1 30 MΩ
Common Mode, G = 1000 5.3 MΩ
G = 1 7.1 MΩ
RL = 2 kΩ; TA = +25°C ±11.0 ±12.3 V
–40 500 mV
= +25°C2kΩ
A
T
= –40°C to +85°C 4.7 kΩ
A
Output-to-Ground Short ±50 mA
= +25°C
A
R
= 101 Ω, G = 100 0.20 1 dB
G
R
= 1.1 kΩ, G = 10 0.20 1 dB
G
R
= `, G = 1 0.05 0.5 dB
G
±6 ± 22 V
VCM = 0 V, RL = ` ±10.6 ±14.0 mA
Hz
Hz
Hz
–2–
REV. C
WARNING!
ESD SENSITIVE DEVICE
Typical Performance Characteristics
SSM2017
Figure 1. Typical THD+Noise* at G = 1, 10, 100, 1000;
= 7 V rms, VS = ±15 V, RL = 5 kΩ; TA = +25°C
V
O
*80 kHz low-pass filter used for Figures 1-2.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±22 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . 10 sec
Storage Temperature Range (P, Z Packages) –65°C to +150°C
Junction Temperature (T
) . . . . . . . . . . . . . –65°C to +150°C
J
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300°C
Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C
Thermal Resistance*
8-Pin Hermetic DIP (Z): θ
8-Pin Plastic DIP (P): θ
16-Pin SOIC (S): θ
*θJA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for cerdip and plastic DIP; θJA is specified for device soldered to printed
circuit board for SOL package.
JA
= 134; θJC = 12 . . . . . . °C/W
JA
= 96; θJC = 37 . . . . . . . . . . °C/W
JA
= 92; θJC = 27 . . . . . . . . . . . . . °C/W
Figure 2. Typical THD+ Noise * at G = 2, 10, 100, 1000;
= 10 V rms, VS = ±18 V, RL = 5 kΩ; TA = +25°C
V
O
ORDERING GUIDE
Model Range* Description Option
SSM2017P –40°C to +85°C 8-Pin Plastic DIP N-8
SSM2017S –40°C to +85°C 16-Lead SOL R-16
SSM2017S-REEL –40°C to +85°C 16-Lead SOL R-16
*XIND = –40°C to +85°C.
Temperature Package Package
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SSM2017 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. C
–3–