ANALOG DEVICES DAC08 Service Manual

8-Bit, High Speed, Multiplying D/A Converter

FEATURES

Fast settling output current: 85 ns Full-scale current prematched to ±1 LSB Direct interface to TTL, CMOS, ECL, HTL, PMOS Nonlinearity to 0.1% maximum over temperature range High output impedance and compliance: −10 V to +18 V Complementary current outputs Wide range multiplying capability: 1 MHz bandwidth Low FS current drift: ±10 ppm/°C Wide power supply range: ±4.5 V to ±18 V Low power consumption: 33 mW @ ±5 V Low cost

GENERAL DESCRIPTION

The DAC08 series of 8-bit monolithic digital-to-analog convert­ers provide very high speed performance coupled with low cost and outstanding applications flexibility.
Advanced circuit design achieves 85 ns settling times with very low “glitch” energy and at low power consumption. Monotonic multiplying performance is attained over a wide 20-to-1 reference current range. Matching to within 1 LSB between reference and full-scale currents eliminates the need for full-
(Universal Digital Logic Interface)
DAC08
scale trimming in most applications. Direct interface to all popular logic families with full noise immunity is provided by the high swing, adjustable threshold logic input.
High voltage compliance complementary current outputs are provided, increasing versatility and enabling differential operation to effectively double the peak-to-peak output swing. In many applications, the outputs can be directly converted to voltage without the need for an external op amp. All DAC08 series models guarantee full 8-bit monotonicity, and nonlineari­ties as tight as ±0.1% over the entire operating temperature range are available. Device performance is essentially unchanged over the ±4.5 V to ±18 V power supply range, with 33 mW power consumption attainable at ±5 V supplies.
The compact size and low power consumption make the DAC08 attractive for portable and military/aerospace applications; devices processed to MIL-STD-883, Level B are available.
DAC08 applications include 8-bit, 1 µs A/D converters, servo motor and pen drivers, waveform generators, audio encoders and attenuators, analog meter drivers, programmable power supplies, LCD display drivers, high speed modems, and other applications where low cost, high speed, and complete input/output versatility are required.

FUNCTIONAL BLOCK DIAGRAM

V+ V
13 1 5 6 7 8 9 10 11 12
DAC08
BIAS NETWORK
14
V
(+)
REF
15
V
(–)
REF
REFERENCE
AMPLIFIER
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
LC
CURRENT
SWITCHES
(MSB)
B1
V–COMP
B2 B3 B4 B5 B6 B7
316
Figure 1.
(LSB)
B8
I
OUT
4 2
I
OUT
00268-C-001
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
www.analog.com
DAC08
TABLE OF CONTENTS
Specifications..................................................................................... 3
Electrical Characteristics............................................................. 3
Typical E l e ctric a l Characte r i s tics ............................................... 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Connections ............................................................................... 6
Test and Burn-In Circuits................................................................ 7
Typical Performance Characteristics ............................................. 8
Basic Connections.......................................................................... 11
Application Information................................................................ 13
Reference Amplifier Setup ........................................................ 13
Reference Amplifier Compensation for Multiplying Applications
Logic Inputs................................................................................. 13
Analog Output Currents ........................................................... 14
Power Supplies ............................................................................ 14
Temperature Performance......................................................... 14
Multiplying Operation............................................................... 14
Settling Time............................................................................... 14
ADI Current Output DACs........................................................... 16
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 18
................................................................................ 13
REVISION HISTORY
11/04—Rev. B to Rev. C
Changed SO to SOIC .........................................................Universal
Removed DIE......................................................................Universal
Changes to Figure 30, Figure 31, Figure 32................................. 12
Change to Figure 33 ....................................................................... 15
Added Table 4.................................................................................. 16
Updated Outline Dimensions....................................................... 17
Changes to Ordering Guide.......................................................... 18
2/02—Rev. A to Rev. B
Edits to SPECIFICATIONS............................................................. 2
Edits to ABSOLUTE MAXIMUM RATING ................................ 3
Edits to ORDERING GUIDE.......................................................... 3
Edits to WAFER TEST LIMITS...................................................... 5
Edit to Figure 13 ............................................................................... 8
Edits to Figures 14 and 15 ............................................................... 9
Rev. C | Page 2 of 20
DAC08

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

VS = ±15 V, I DAC08C, unless otherwise noted. Output characteristics refer to both I
Table 1.
DAC08A/DAC08H DAC08E DAC08C Parameter
Resolution 8 8 8 Bits Monotonicity 8 8 8 Bits Nonlinearity NL ±0.1 ±0.19 ±0.39 %FS Settling Time t
Propagation Delay
Each Bit t
All Bits Switched t Full-Scale Tempco1 TCI DAC08E ±50 Output Voltage
Compliance V
(True Compliance) Change <1/2 LSB, R
Full Range Current I
Full Range Symmetry I Zero-Scale Current I Output Current
Range I
V V− = −12 V Output Current
Noise Logic Input Levels
Logic 0 V
Logic 1 V Logic Input Current VLC = 0 V
Logic 0 I
Logic 1 I Logic Input Swing V Logic Threshold
Range Reference Bias
Current Reference Input dI/dt REQ = 200 Ω 4 8 4 8 4 8 mA/µs
Slew Rate RL = 100 Ω C Power Supply
Sensitivity PSSI I
= 2.0 mA, –55°C ≤ TA ≤ +125°C for DAC08/DAC08A, 0°C ≤ TA ≤ +70°C for DAC08E and DAC08H, −40°C to +85°C for
REF
I
OUT
Symbol
S
PLH
PHL
FS
OC
and
OUT
Conditions Min Typ Max Min Typ Max Min Typ Max Unit
To ±1/2 LSB, all bits switched on or off,
1
= 25°C
T
A
85 135 85 150 85 150 ns
TA = 25°C1 35 60 35 60 35 60 ns 35 60 35 60 35 60 ns ±10 ±50 ±10 ±80 ±10 ±80 ppm/°C
Full-scale current
>
OUT
−10 +18 −10 +18 –10 +18 V
.
20 MΩ typ V
FR4
FRS
ZS
I
OR1
OR2
= 10.000 V R14, R15 =
REF
5.000 kΩ T I
FR4
− I
= 25°C
A
FR2
0.1 1 0.2 2 0.2 4 µA R14, R15 = 5.000 kΩ 2.1 2.1 2.1 mA
V
= +15.0 V,
REF
1.984 1.992 2.000 1.94 1.99 2.04 1.94 1.99 2.04 mA
±0.5 ±4 ±1 ±8 ±2 ±16 µA
V− = −10 V
= +25.0 V, 4.2 4.2 4.2 mA
REF
I
IL
IL
IL
IH
IS
V
THR
I
15
PSSI
FS+
FS–
= 2 mA 25 25 25 nA
REF
VLC = 0 V 0.8 0.8 0.8 V 2 2 2 V
VIN = −10 V to +0.8 V −2 −10 −2 −10 −2 −10 µA VIN = 2.0 V to 18 V 0.002 10 0.002 10 0.002 10 µA V− = −15 V −10 +18 −10 +18 −10 +18 V VS = ±15 V1 −10 +13.5 −10 +13.5 −10 +13.5 V
−1 −3 −1 −3 −1 −3 µA
= 0 pF. See Figure 7.
C
1
V+ = 4.5 V to 18 V ±0.0003 ±0.01 ±0.0003 ±0.01 ±0.0003 ±0.01 %∆IO/%∆V+
V− = −4.5 V to −18 V ±0.002 ±0.01 ±0.002 ±0.01 ±0.002 ±0.01 %∆IO/%∆V−
= 1.0 mA
REF
Rev. C | Page 3 of 20
DAC08
DAC08A/DAC08H DAC08E DAC08C Parameter
Power Supply Current I+ VS = ±5 V, I I− −4.3 −5.8 −4.3 −5.8 −4.3 −5.8 mA I+ VS = +5 V, −15 V, 2.4 3.8 2.4 3.8 2.4 3.8 mA I− I I+ VS = ±15 V, 2.5 3.8 2.5 3.8 2.5 3.8 mA I− I Power Dissipation P
I
135 174 135 174 135 174 mW
1
Guaranteed by design.

TYPICAL ELECTRICAL CHARACTERISTICS

VS = ±15 V, and I
Table 2.
Parameter Symbol Conditions All Grades Typical Unit
Reference Input Slew Rate dI/dt 8 mA/µs Propagation Delay t Settling Time t
Symbol
D
= 2.0 mA, unless otherwise noted. Output characteristics apply to both I
REF
Conditions Min Typ Max Min Typ Max Min Typ Max Unit
= 1.0 mA 2.3 3.8 2.3 3.8 2.3 3.8 mA
REF
= 2.0 mA −6.4 −7.8 −6.4 −7.8 −6.4 −7.8 mA
REF
= 2.0 mA −6.5 −7.8 −6.5 −7.8 −6.5 −7.8 mA
REF
±5 V, I
= 1.0 mA +5 V,
REF
−15 V, = 2.0 mA ±15 V, I
REF
2.0 mA
, t
PLH
PHL
S
REF
33 48 33 48 33 48 mW
=
108 136 103 136 108 136 mW
TA = 25°C, any bit 35 ns To ±1/2 LSB, all bits switched on or
= 25°C
off, T
A
OUT
and
.
I
OUT
85 ns
Rev. C | Page 4 of 20
DAC08

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
Operating Temperature
DAC08AQ, DAC08Q −55°C to +125°C DAC08HQ, DAC08EQ, DAC08CQ,
0°C to +70°C
DAC08HP, DAC08EP
DAC08CP, DAC08CS −40°C to +85°C Junction Temperature (TJ) −65°C to +150°C Storage Temperature Q Package −65°C to +150°C Storage Temperature P Package −65°C to +125°C Lead Temperature (Soldering, 60 sec) 300°C V+ Supply to V− Supply 36 V Logic Inputs V− to V− + 36 V V
LC
V− to V+ Analog Current Outputs (at VS− = 15 V) 4.25 mA Reference Input (V
to V15) V− to V+
14
Reference Input Differential Voltage
(V14 to V15) ±18 V
Reference Input Current (I14) 5.0 mA
Package Type θ
1
JA
θ
Unit
JC
16-Lead CERDIP (Q) 100 16 °C/W 16-Lead PDIP (P) 82 39 °C/W 20-Terminal LCC (RC) 76 36 °C/W 16-Lead SOIC (S) 111 35 °C/W
1
θJA is specified for worst-case mounting conditions, that is, θJA is specified for
device in socket for CERDIP, PDIP, and LCC packages; θ device soldered to printed circuit board for SOIC package.
is specified for
JA
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. C | Page 5 of 20
DAC08

PIN CONNECTIONS

1
V
LC
I
2
OUT
V–
3
OUT
B2 B3 B4
DAC08
4
TOP VIEW
(Not To Scale)
5
6
7
8
I
(MSB) B1
Figure 2. 16-Lead Dual In-Line Package
(Q and P Suffixes)
16
COMP V
15
V
14
V+
13
12
B8 (LSB) B7
11
10
B6
9
B5
REF
REF
(–) (+)
00268-C-002
V
REF
V
REF
COMP
I
I
(+) (–)
V
OUT
OUT
V+
LC
V–
1
2
3
DAC08
4
TOP VIEW
(Not To Scale)
5
6
7
8
16
B8 (LSB) B7
15
B6
14
B5
13
12
B4 B3
11
10
B2
9
B1 (MSB)
00268-C-003
Figure 3. 16-Lead SOIC
(S Suffix)
(–)
LC
REF
V
NC
V
COMP
20 19123
V
18
REF
V+
17
NC
16 15
B8 (LSB) B7
14
B5
B6
B4
NC
I
OUT
NC
(MSB) B1
OUT
I
4
V–
5
DAC08
TOP VIEW
6
(Not To Scale)
7
B2
8
10 11 12 13
9
B3
NC = NO CONNECT
Figure 4. DAC08RC/883 20-Lead LCC
(RC Suffix)
(+)
00268-C-004
Rev. C | Page 6 of 20
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