–3–
REV. 0
AD7862
AB S
Parameter Version1Version Version Units Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, V
OH
4.0 4.0 4.0 V min I
SOURCE
= 200 µA
Output Low Voltage, V
OL
0.4 0.4 0.4 V max I
SINK
= 1.6 mA
DB11–DB0
Floating-State Leakage Current ±10 ±10 ±10 µA max
Floating-State Capacitance
4
10 10 10 pF max
Output Coding
AD7862-10, AD7862-3 Twos Complement
AD7863-2 Straight (Natural) Binary
CONVERSION RATE
Conversion Time 3.6 3.6 3.6 µs max For Both Channels
Track/Hold Acquisition Time
2, 3
0.3 0.3 0.3 µs max
POWER REQUIREMENTS
V
DD
+5 +5 +5 V nom ±5% for Specified Performance
I
DD
Normal Mode 15 15 15 mA max
Standby Mode 25 25 25 µA max Logic Inputs = 0 V or V
DD
Power Dissipation
Normal Mode 75 75 75 mW max Typically 60 mW
Standby Mode 125 125 125 µW max Typically 75 µW
NOTES
1
Temperature ranges are as follows: A, B Versions: –40°C to +85°C;
S Version: –55°C to +125°C.
2
Performance measured through full channel (multiplexer, SHA and ADC).
3
See Terminology.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.3 V
Analog Input Voltage to AGND
AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±17 V
AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7V
AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Reference Input Voltage to AGND . . . –0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Commercial (A, B Version) . . . . . . . . . . . –40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116°C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260°C
Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116°C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
Input Relative Temperature Package Package
Model Input Accuracy Range Description Option
AD7862AR-10 ±10 V ±1 LSB –40°C to +85°C 28-Bit Small Outline Package R-28
AD7862BR-10 ±10 V ±1 LSB –40°C to +85°C 28-Bit Small Outline Package R-28
AD7862ARS-10 ±10 V ±1 LSB –40°C to +85°C 28-Bit Shrink Small Outline Package RS-28
AD7862AN-10 ±10 V ±1 LSB –40°C to +85°C 28-Bit Plastic DIP N-28
AD7862SQ-10 ±10 V ±1 LSB –55°C to +125°C 28-Bit Cerdip Q-28
AD7862AR-3 ±2.5 V ±1 LSB –40°C to +85°C 28-Bit Small Outline Package R-28
AD7862BR-3 ±2.5 V ±1 LSB –40°C to +85°C 28-Bit Small Outline Package R-28
AD7862ARS-3 ± 2.5 V ±1 LSB –40°C to +85°C 28-Bit Shrink Small Outline Package RS-28
AD7862AN-3 ±2.5 V ±1 LSB –40°C to +85°C 28-Plastic DIP N-28
AD7862AR-2 0 V to 2.5 V ±1 LSB –40°C to +85°C 28-Bit Small Outline Package R-28
AD7862ARS-2 0 V to 2.5 V ±1 LSB –40°C to +85°C 28-Bit Shrink Small Outline Package RS-28
4
Sample tested @ +25°C to ensure compliance.
Specifications subject to change without notice.