ANALOG DEVICES AD7853L Service Manual

查询AD7853供应商

3 V to 5 V Single Supply, 200 kSPS

a

FEATURES
Specified for V
Read-Only Operation
AD7853–200 kSPS; AD7853L–100 kSPS
System and Self-Calibration with Autocalibration on

Power-Up

Low Power:

AD7853: 12 mW (V

AD7853L: 4.5 mW (V
Automatic Power Down After Conversion (25 ␮W)
Flexible Serial Interface:

8051/SPI™/QSPI™/␮P Compatible
24-Lead DIP, SOIC and SSOP Packages

APPLICATIONS
Battery-Powered Systems (Personal Digital Assistants,

Medical Instruments, Mobile Communications)
Pen Computers
Instrumentation and Control Systems
High Speed Modems

of 3 V to 5.5 V

DD

= 3 V)

DD

= 3 V)

DD

AIN(+)

AIN(–)

REFIN/

REF

C

C

OUT

REF1

REF2

CAL

12-Bit Sampling ADCs

AD7853/AD7853L*

FUNCTIONAL BLOCK DIAGRAM

T/H

REFERENCE

BUF

CHARGE

REDISTRIBUTION

DAC

CALIBRATION

MEMORY

AND CONTROLLER

AV

2.5V

DD

AGND

AGND

AD7853/AD7853L

COMP

SAR + ADC

CONTROL

DV

DD

DGND

AMODE

CLKIN

CONVST

BUSY

SLEEP

GENERAL DESCRIPTION

The AD7853/AD7853L are high speed, low power, 12-bit
ADCs that operate from a single 3 V or 5 V power supply, the
AD7853 being optimized for speed and the AD7853L for low
power. The ADC powers up with a set of default conditions at
which time it can be operated as a read-only ADC. The ADC
contains self-calibration and system-calibration options to en­sure accurate operation over time and temperature and have a
number of power-down options for low power applications.
The part powers up with a set of default conditions and can
operate as a read only ADC.

The AD7853 is capable of 200 kHz throughput rate while the
AD7853L is capable of 100 kHz throughput rate. The input
track-and-hold acquires a signal in 500 ns and features a pseudo­differential sampling scheme. The AD7853/AD7853L voltage
range is 0 to V

with both straight binary and twos comple-

REF

ment output coding. Input signal range is to the supply, and the
part is capable of converting full power signals to 100 kHz.

CMOS construction ensures low power dissipation of typically

4.5 mW for normal operation and 1.15 mW in power-down
mode, with a throughput rate of 10 kSPS (V

= 3 V). The part

DD

is available in 24-lead, 0.3 inch wide dual-in-line package
(DIP), 24-lead small outline (SOIC) and 24-lead small shrink
outline (SSOP) packages.

SERIAL INTERFACE / CONTROL REGISTER

SM1 SCLK

SYNC

POLARITYDOUTDINSM2

PRODUCT HIGHLIGHTS

1. Specified for 3 V and 5 V supplies.

2. Automatic calibration on power-up.

3. Flexible power management options including automatic
power-down after conversion.

4. Operates with reference voltages from 1.2 V to V

5. Analog input ranges from 0 V to V

DD

.

DD

.

6. Self- and system calibration.

7. Versatile serial I/O port (SPI/QSPI/8051/µP).

8. Lower power version AD7853L.

*Patent pending.
SPI and QSPI are trademarks of Motorola, Incorporated.

REV. B

Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] World Wide Web Site: http://www.analog.com
Fax: [phone] © Analog Devices, Inc., 1998

1, 2

AD7853/AD7853L–SPECIFICATIONS

External Reference, f
(AD7853) 100 kHz (AD7853L); SLEEP = Logic High; TA = T

Parameter A Version

= 4 MHz (1.8 MHz B Grade (0ⴗC to +70ⴗC), 1 MHz A and B Grades (–40ⴗC to +85ⴗC) for L Version); f

CLKIN

to T

MIN

1

B Version1Units Test Conditions/Comments

, unless otherwise noted.) Specifications in () apply to the AD7853L.

MAX

(AVDD = DVDD = +3.0 V to +5.5 V, REFIN/REF

DYNAMIC PERFORMANCE

Signal to Noise + Distortion Ratio370 71 dB min Typically SNR Is 72 dB
(SNR) VIN = 10 kHz Sine Wave, f
Total Harmonic Distortion (THD) –78 –78 dB max VIN = 10 kHz Sine Wave, f
Peak Harmonic or Spurious Noise –78 –78 dB max VIN = 10 kHz Sine Wave, f

= 200 kHz (100 kHz)

SAMPLE

= 200 kHz (100 kHz)

SAMPLE

= 200 kHz (100 kHz)

SAMPLE

Intermodulation Distortion (IMD)
Second Order Terms –78 –80 dB typ fa = 9.983 kHz, fb = 10.05 kHz, f
Third Order Terms –78 –80 dB typ fa = 9.983 kHz, fb = 10.05 kHz, f

= 200 kHz (100 kHz)

SAMPLE

= 200 kHz (100 kHz)

SAMPLE

DC ACCURACY

Resolution 12 12 Bits

Integral Nonlinearity ±1 ±1 LSB max 2.5 V External Reference V

±1 ±0.5 LSB max 5 V External Reference V

(±1) LSB max (L Version, 5 V External Reference, V

= 3 V, VDD = 5 V (B Grade Only)

DD

= 5 V

DD

= 5 V)

DD

(±1) LSB max (L Version)

Differential Nonlinearity ±1 ±1 LSB max Guaranteed No Missed Codes to 12 Bits. 2.5 V External Reference

VDD = 3 V, 5 V External Reference VDD = 5 V

Total Unadjusted Error ±1 ±1 LSB typ
Unipolar Offset Error ±1 ±1 LSB max 2.5 V External Reference V
Unipolar Offset Error (±2.5) (±2.5) LSB max (L Versions, 2.5 V External Reference V

= 3 V, 5 V External Reference VDD = 5 V

DD

DD

Reference VDD = 5 V)

Positive Full-Scale Error ±2.5 ±2.5 LSB max 2.5 V External Reference V
Positive Full-Scale Error (±4) (±4) LSB max (L Versions, 2.5 V External Reference V

= 3 V, 5 V External Reference VDD = 5 V

DD

DD

Reference VDD = 5 V)

Negative Full-Scale Error ±2.5 ±2.5 LSB max 2.5 V External Reference V
Negative Full-Scale Error (±4) (±4) LSB max (L Versions, 2.5 V External Reference V

= 3 V, 5 V External Reference VDD = 5 V

DD

DD

Reference VDD = 5 V)

Bipolar Zero Error ±2 ±2 LSB max 2.5 V External Reference V
Bipolar Zero Error (±2.5) (±2.5) LSB max (L Versions, 2.5 V External Reference V

= 3 V, 5 V External Reference VDD = 5 V

DD

DD

Reference VDD = 5 V)

ANALOG INPUT

Input Voltage Ranges 0 to V

REF

0 to V

Volts i.e., AIN(+) – AIN(–) = 0 to V

REF

, AIN(–) Can Be Biased

REF

Up But AIN(+) Cannot Go Below AIN(–)

±V

/2 ±V

REF

/2 Volts i.e., AIN(+) – AIN(–) = –V

REF

Be Biased to +V

/2 and AIN(+) Can Go Below AIN(–) But

REF

/2 to +V

REF

REF

Cannot Go Below 0 V

Leakage Current ±1 ±1 µA max

Input Capacitance 20 20 pF typ

REFERENCE INPUT/OUTPUT

REFIN Input Voltage Range 2.3/V

DD

2.3/V

V min/max Functional from 1.2 V

DD

Input Impedance 150 150 kΩ typ

REF

Output Voltage 2.3/2.7 2.3/2.7 V min/max

OUT

REF

Tempco 20 20 ppm/°C typ

OUT

LOGIC INPUTS

Input High Voltage, V

INH

2.4 2.4 V min AVDD = DVDD = 4.5 V to 5.5 V

2.1 2.1 V min AVDD = DVDD = 3.0 V to 3.6 V

Input Low Voltage, V

INL

0.8 0.8 V max AVDD = DVDD = 4.5 V to 5.5 V

0.6 0.6 V max AVDD = DVDD = 3.0 V to 3.6 V

Input Current, I

IN

Input Capacitance, C

4

IN

±10 ±10 µA max Typically 10 nA, V

10 10 pF max

= 0 V or V

IN

DD

= 2.5 V

OUT

= 200 kHz

SAMPLE

= 3 V, 5 V External

= 3 V, 5 V External

= 3 V, 5 V External

= 3 V, 5 V External

/2, AIN(–) Should

–2–

REV. B

AD7853/AD7853L

Parameter A Version

1

B Version1Units Test Conditions/Comments

LOGIC OUTPUTS

Output High Voltage, V

OH

I

SOURCE

= 200 µA

4 4 V min AVDD = DVDD = 4.5 V to 5.5 V

2.4 2.4 V min AVDD = DVDD = 3.0 V to 3.6 V

Output Low Voltage, V

OL

0.4 0.4 V max I

= 0.8 mA

SINK

Floating-State Leakage Current ±10 ±10 µA max

Floating-State Output Capacitance410 10 pF max
Output Coding Straight (Natural) Binary Unipolar Input Range

Twos Complement Bipolar Input Range

CONVERSION RATE

Conversion Time 4.6 (18) 4.6 (18) µs max (L Versions Only, –40°C to +85°C, 1 MHz CLKIN)

(10) µs max (L Versions Only, 0°C to +70°C, 1.8 MHz CLKIN)

Track/Hold Acquisition Time 0.4 (1) 0.4 (1) µs min (L Versions Only)

POWER REQUIREMENTS

AV

DV

DD,

I

DD

DD

Normal Mode

Sleep Mode

5

6

+3.0/+5.5 +3.0/+5.5 V min/max

6 (1.9) 6 (1.9) mA max AVDD = DVDD = 4.5 V to 5.5 V. Typically 4.5 mA (1.5);

5.5 (1.9) 5.5 (1.9) mA max AV

= DVDD = 3.0 V to 3.6 V. Typically 4.0 mA (1.5 mA)

DD

With External Clock On 10 10 µA typ Full Power-Down. Power Management Bits in Control Register

Set as PMGT1 = 1, PMGT0 = 0

400 400 µA typ Partial Power-Down. Power Management Bits in Control

Register Set as PMGT1 = 1, PMGT0 = 1

With External Clock Off 5 5 µA max Typically 1 µA. Full-Power Down. Power Management Bits in

Control Register Set as PMGT1 = 1, PMGT0 = 0

200 200 µA typ Partial Power-Down. Power Management Bits in Control

Register Set as PMGT1 = 1, PMGT0 = 1

Normal Mode Power Dissipation 33 (10.5) 33 (10.5) mW max V

20 (6.85) 20 (6.85) mW max VDD = 3.6 V: Typically 15 mW (5.4); SLEEP = V

= 5.5 V: Typically 25 mW (8); SLEEP = V

DD

DD

DD

Sleep Mode Power Dissipation

With External Clock On 55 55 µW typ V

36 36 µW typ V

With External Clock Off 27.5 27.5 µW max V

= 5.5 V; SLEEP = 0 V

DD

= 3.6 V; SLEEP = 0 V

DD

= 5.5 V: Typically 5.5 µW; SLEEP = 0 V

DD

18 18 µW max VDD = 3.6 V: Typically 3.6 µW; SLEEP = 0 V

SYSTEM CALIBRATION

Offset Calibration Span
Gain Calibration Span

NOTES

1

Temperature ranges as follows: A, B Versions, –40°C to +85°C. For L Versions, A and B Versions f
B Version f

2

Specifications apply after calibration.

3

SNR calculation includes distortion and noise components.

4

Sample tested @ +25°C to ensure compliance.

5

All digital inputs @ DGND except for CONVST, SLEEP, CAL, and SYNC @ DVDD. No load on the digital outputs. Analog inputs @ AGND.

6

CLKIN @ DGND when external clock off. All digital inputs @ DGND except for CONVST, SLEEP, CAL, and SYNC @ DVDD. No load on the digital outputs.
Analog inputs @ AGND.

7

The offset and gain calibration spans are defined as the range of offset and gain errors that the AD7853/AD7853L can calibrate. Note also that these are voltage spans

= 1.8 MHz over 0°C to +70°C temperature range.

CLKIN

and are not absolute voltages (i.e., the allowable system offset voltage presented at AIN(+) for the system offset error to be adjusted out will be AIN(–) ±0.05 × V
and the allowable system full-scale voltage applied between AIN(+) and AIN(–) for the system full-scale voltage error to be adjusted out will be V
This is explained in more detail in the calibration section of the data sheet.

7

7

+0.05 × V
+1.025 × V

/–0.05 × V

REF

/–0.975 × V

REF

REF

REF

V max/min Allowable Offset Voltage Span for Calibration
V max/min Allowable Full-Scale Voltage Span for Calibration

= 1 MHz over –40°C to +85°C temperature range,

CLKIN

± 0.025 × V

REF

REF

REF

Specifications subject to change without notice.

,

).

REV. B

–3–

AD7853/AD7853L

TIMING SPECIFICATIONS

Limit at T

MIN

, T

(AVDD = DVDD = +3.0 V to +5.5 V; f

1

T

, unless otherwise noted)

MAX

MAX

= 4 MHz for AD7853 and 1.8/1 MHz for AD7853L; TA = T

CLKIN

MIN

to

(A, B Versions)

Parameter 5 V 3 V Units Description

f

CLKIN

2

500 500 kHz min Master Clock Frequency
4 4 MHz max

1.8 1.8 MHz max L Version, 0°C to +70°C, B Grade Only

3

f

SCLK

4

t

1

t

2

t

CONVERT

t

3

t

4

5

t

5

5

t

5A

5

t

6

t

7

t

8

6

t

9

6

t

10

t

11

t

11A

7

t

12

t

13

8

t

14

t

15

t

16

9

t

CAL

9

t

CAL1

9

t

CAL2

NOTES
Descriptions that refer to SCLK↑ (rising) or SCLK↓ (falling) edges here are with the POLARITY pin HIGH. For the POLARITY pin LOW then the opposite edge of
SCLK will apply.

1

Sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V
Table X and timing diagrams for different interface modes and calibration.

2

Mark/Space ratio for the master clock input is 40/60 to 60/40.

3

For Interface Modes 1, 2, 3 the SCLK max frequency will be 4 MHz. For Interface Modes 4 and 5 the SCLK will be an output and the frequency will be f

4

The CONVST pulsewidth will apply here only for normal operation. When the part is in power-down mode, a different CONVST pulsewidth will apply (see Power­Down section).

5

Measured with the load circuit of Figure 1 and defined as the time required for the output to cross 0.8 V or 2.4 V.

6

For self-clocking mode (Interface Modes 4, 5) the nominal SCLK high and low times will be 0.5 t

7

t12 is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated
back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time, t12, quoted in the timing characteristics is the true bus relin­quish time of the part and is independent of the bus loading.

8

t14 is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated
back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time quoted in the timing characteristics is the true delay of the part
in turning off the output drivers and configuring the DIN line as an input. Once this time has elapsed the user can drive the DIN line knowing that a bus conflict will
not occur.

9

The typical time specified for the calibration times is for a master clock of 4 MHz. For the L version the calibration times will be longer than those quoted here due to
the 1.8/1 MHz master clock.

Specifications subject to change without notice.

1 1 MHz max L Version, –40°C to +85°C

4 4 MHz max Interface Modes 1, 2, 3 (External Serial Clock)
f

CLKIN

f

CLKIN

MHz max Interface Modes 4, 5 (Internal Serial Clock)

100 100 ns min CONVST Pulsewidth
50 90 ns max CONVST↓ to BUSY↑ Propagation Delay

4.6 4.6 µs max Conversion Time = 18 t
10 (18) 10 (18) µs max L Version 1.8 (1) MHz CLKIN. Conversion Time = 18 t

–0.4 t
⫿0.4 t

0.6 t

SCLK

SCLK

SCLK

–0.4 t
⫿0.4 t

0.6 t

SCLK

SCLK

SCLK

ns min SYNC↓ to SCLK↓ Setup Time (Noncontinuous SCLK Input)
ns min/max SYNC↓ to SCLK↓ Setup Time (Continuous SCLK Input)
ns min SYNC↓ to SCLK↓ Setup Time. Interface Mode 4 Only

CLKIN

CLKIN

50 90 ns max Delay from SYNC↓ until DOUT 3-State Disabled
50 90 ns max Delay from SYNC↓ until DIN 3-State Disabled
75 115 ns max Data Access Time After SCLK↓
40 60 ns min Data Setup Time Prior to SCLK↑

20 30 ns min Data Valid to SCLK Hold Time

0.4 t

0.4 t

SCLK

SCLK

0.4 t

0.4 t

SCLK

SCLK

ns min SCLK High Pulsewidth (Interface Modes 4 and 5)
ns min SCLK Low Pulsewidth (Interface Modes 4 and 5)

30 50 ns min SCLK↑ to SYNC↑ Hold Time (Noncontinuous SCLK)

30/0.4 t

SCLK

50/0.4 t

ns min/max (Continuous SCLK) Does Not Apply to Interface Mode 3

SCLK

50 50 ns max SCLK↑ to SYNC↑ Hold Time
50 50 ns max Delay from SYNC↑ until DOUT 3-State Enabled
90 130 ns max Delay from SCLK↑ to DIN Being Configured as Output
50 90 ns max Delay from SCLK↑ to DIN Being Configured as Input

2.5 t

2.5 t

CLKIN

CLKIN

2.5 t

2.5 t

CLKIN

CLKIN

ns max CAL↑ to BUSY↑ Delay
ns max CONVST↓ to BUSY↑ Delay in Calibration Sequence

31.25 31.25 ms typ Full Self-Calibration Time, Master Clock Dependent
(125013 t

CLKIN

)

27.78 27.78 ms typ Internal DAC Plus System Full-Scale Cal Time, Master Clock
Dependent (111114 t

CLKIN

)

3.47 3.47 ms typ System Offset Calibration Time, Master Clock Dependent
(13899 t

CLKIN

SCLK

)

= 0.5 t

) and timed from a voltage level of 1.6 V. See

DD

.

CLKIN

CLKIN

.

–4–

REV. B

AD7853/AD7853L

TYPICAL TIMING DIAGRAMS

Figures 2 and 3 show typical read and write timing diagrams.
Figure 2 shows the reading and writing after conversion in In­terface Modes 2 and 3. To attain the maximum sample rate of
100 kHz (AD7853L) or 200 kHz (AD7853) in Interface Modes
2 and 3, reading and writing must be performed during conver­sion. Figure 3 shows the timing diagram for Interface Modes 4
and 5 with sample rate of 100 kHz (AD7853L) or 200 kHz
(AD7853). At least 400 ns acquisition time must be allowed
(the time from the falling edge of BUSY to the next rising edge
of CONVST) before the next conversion begins to ensure that
the part is settled to the 12-bit level. If the user does not want to
provide the CONVST signal, the conversion can be initiated in
software by writing to the control register.

t

= 4.6ms MAX, 10ms FOR L VERSION

CONVST (I/P)

BUSY (O/P)

SYNC (I/P)

SCLK (I/P)

DOUT (O/P)

POLARITY PIN LOGIC HIGH

t

1

t

2

t

CONVERT

THREE-

STATE

CONVERT

t1

= 100 ns MIN,

t

5

t5

= 50/90 ns MAX 5V/3V,

t

3

15616

t

6

DB15

t

7

DB15 DB0

I

OL

+2.1V

I

OH

TO OUTPUT

PIN

100pF

1.6mA

C

L

200mA

Figure 1. Load Circuit for Digital Output Timing
Specifications

t

= 40/60 ns MIN 5V/3V

7

t

t

9

t

10

t

6

t

8

DB11

11

t

12

DB0DB11

THREE-

STATE

Figure 2. AD7853/AD7853L Timing Diagram (Typical Read and Write Operation for Interface Modes 2, 3)

t

= 4.6ms MAX, 10ms FOR L VERSION

CONVERT

t

= 100 ns MIN, t

1

= 50/90 ns MAX 5V/3V, t

5

DB11

= 40/60 ns MIN 5V/3V

7

t

CONVERT

t

9

t

t

6

10

t

11

t

12

DB0DB11

THREE-

STATE

CONVST (I/P)

BUSY (O/P)

SYNC (O/P)

SCLK (O/P)

DOUT (O/P)

DIN (I/P)

POLARITY PIN LOGIC HIGH

t

1

t

2

t

5

THREE-

STATE

t

7

t

8

DB15 DB0

t

4

15616

DB15

Figure 3. AD7853/AD7853L Timing Diagram (Typical Read and Write Operation for Interface Modes 4, 5)

REV. B

–5–

AD7853/AD7853L

ABSOLUTE MAXIMUM RATINGS

(T

= +25°C unless otherwise noted)

A

1

AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DV

to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DD

to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

AV

DD

Analog Input Voltage to AGND . . . . –0.3 V to AV

Digital Input Voltage to DGND . . . . –0.3 V to DV

Digital Output Voltage to DGND . . . –0.3 V to DV
REF

/REF

IN

Input Current to Any Pin Except Supplies

to AGND . . . . . . . . . –0.3 V to AVDD + 0.3 V

OUT

2

. . . . . . . . ±10 mA

+ 0.3 V

DD

+ 0.3 V

DD

+ 0.3 V

DD

Operating Temperature Range

Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW

Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W

θ

JA

Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W

θ

JC

Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260°C

SOIC, SSOP Package, Power Dissipation . . . . . . . . . 450 mW

Thermal Impedance . . . 75°C/W (SOIC) 115°C/W (SSOP)

θ

JA

θ

Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP)

JC

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >3 kV

NOTES

1

Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.

2

Transient currents of up to 100 mA will not cause SCR latch-up.

ORDERING GUIDE

Linearity Power
Error Dissipation Package

Model (LSB)

1

(mW) Options

2

AD7853AN ±1 20 N-24
AD7853BN ±1/2 20 N-24

AD7853LAN
AD7853LBN

3

3

±1 6.85 N-24
±1 6.85 N-24

AD7853AR ±1 20 R-24
AD7853BR ±1/2 20 R-24

AD7853LAR
AD7853LBR

AD7853ARS ±1 6.85 RS-24

AD7853LARS
EVAL-AD7853CB
EVAL-CONTROL BOARD

NOTES

1

Linearity error refers to the integral linearity error.

2

N = Plastic DIP; R = SOIC; RS = SSOP.

3

L signifies the low power version.

4

This can be used as a stand-alone evaluation board or in conjunction with the
EVAL-CONTROL BOARD for evaluation/demonstration purposes.

5

This board is a complete unit allowing a PC to control and communicate with
all Analog Devices, Inc. evaluation boards ending in the CB designators.

3

3

3

±1 6.85 R-24
±1 6.85 R-24

±1 6.85 RS-24

4

5

PIN CONFIGURATIONS

DIP, SOIC AND SSOP

REF

CONVST

/REF

IN

BUSY

SLEEP

OUT

AV

AGND
CREF1

CREF2

AIN(+)

AIN(–)

NC

AGND

1
2
3
4

5

AD7853/53L

DD

6

(Not to Scale)

7
8

9
10
11
12

NC = NO CONNECT

TOP VIEW

24
23
22
21
20
19
18
17
16
15
14
13

SYNC

SCLK
CLKIN

DIN

DOUT
DGND

DV

DD

CAL

SM2
SM1
POLARITY

AMODE

–6–

REV. B

AD7853/AD7853L

PIN FUNCTION DESCRIPTIONS

Pin Mnemonic Description

1 CONVST Convert Start. Logic Input. A low to high transition on this input puts the track/hold into its hold mode and

starts conversion. When this input is not used, it should be tied to DVDD.

2 BUSY Busy Output. The busy output is triggered high by the falling edge of

remains high until conversion is completed. BUSY is also used to indicate when the AD7853/AD7853L has
completed its on-chip calibration sequence.

3 SLEEP Sleep Input/Low Power Mode. A Logic 0 initiates a sleep and all circuitry is powered down including the

internal voltage reference provided there is no conversion or calibration being performed. Calibration data
is retained. A Logic 1 results in normal operation. See Power-Down section for more details.

4 REF

/ Reference Input/Output. This pin is connected to the internal reference through a series resistor and is the

REF

IN

OUT

reference source for the analog-to-digital converter. The nominal reference voltage is 2.5 V and this appears
at the pin. This pin can be overdriven by an external reference or can be taken as high as AV

5AV

DD

pin is tied to AV
tied to AV

DD

Analog Positive Supply Voltage, +3.0 V to +5.5 V.

, or when an externally applied reference approaches AVDD, the C

DD

.

6, 12 AGND Analog Ground. Ground reference for track/hold, reference and DAC.
7C

REF1

Reference Capacitor (0.1 µF multilayer ceramic). This external capacitor is used as a charge source for the

internal DAC. The capacitor should be tied between the pin and AGND.

8C

REF2

Reference Capacitor (0.01 µF ceramic disc). This external capacitor is used in conjunction with the on-chip

reference. The capacitor should be tied between the pin and AGND.

9 AIN(+) Analog Input. Positive input of the pseudo-differential analog input. Cannot go below AGND or above

AV

at any time, and cannot go below AIN(–) when the unipolar input range is selected.

DD

10 AIN(–) Analog Input. Negative input of the pseudo-differential analog input. Cannot go below AGND or above

AV

at any time.

DD

11 NC No Connect Pin.
13 AMODE Analog Mode Pin. This pin allows two different analog input ranges to be selected. A Logic 0 selects range

0 to V
AIN(–) cannot go below AGND. A Logic 1 selects range –V
–V
+V

(i.e., AIN(+) – AIN(–) = 0 to V

REF

/2 to +V

REF

/2 to allow AIN(+) to go from 0 V to +V

REF

/2). In this case AIN(+) cannot go below AGND so that AIN(–) needs to be biased to

REF

). In this case AIN(+) cannot go below AIN(–) and

REF

REF

V.

REF

14 POLARITY Serial Clock Polarity. This pin determines the active edge of the serial clock (SCLK). Toggling this pin will

reverse the active edge of the serial clock (SCLK). A Logic 1 means that the serial clock (SCLK) idles high
and a Logic 0 means that the serial clock (SCLK) idles low. It is best to refer to the timing diagrams and
Table IX for the SCLK active edges.

15 SM1 Serial Mode Select Pin. This pin is used in conjunction with the SM2 pin to give different modes of opera-

tion as described in Table X.

16 SM2 Serial Mode Select Pin. This pin is used in conjunction with the SM1 pin to give different modes of opera-

tion as described in Table X.

17 CAL Calibration Input. This pin has an internal pull-up current source of 0.15 µA. A Logic 0 on this pin resets

all calibration control logic and initiates a calibration on its rising edge. There is the option of connecting a
10 nF capacitor from this pin to DGND to allow for an automatic self-calibration on power-up. This input
overrides all other internal operations. If the autocalibration is not required, this pin should be tied to a
logic high.

18 DV

DD

Digital Supply Voltage, +3.0 V to +5.5 V.
19 DGND Digital Ground. Ground reference point for digital circuitry.
20 DOUT Serial Data Output. The data output is supplied to this pin as a 16-bit serial word.
21 DIN Serial Data Input. The data to be written is applied to this pin in serial form (16-bit word). This pin can act

as an input pin or as a I/O pin depending on the serial interface mode the part is in (see Table X).
22 CLKIN Master Clock Signal for the device (4 MHz for AD7853, 1.8 MHz for AD7853L). Sets the conversion and

calibration times.
23 SCLK Serial Port Clock. Logic input/output. The SCLK pin is configured as an input or output, dependent on the

type of serial data transmission (self-clocking or external-clocking) that has been selected by the SM1 and

SM2 pins. The SCLK idles high or low depending on the state of the POLARITY pin.
24 SYNC This pin can be an input level triggered active low (similar to a chip select in one case and to a frame sync

in the other) or an output (similar to a frame sync) pin depending on SM1, SM2 (see Table X).

CONVST or rising edge of CAL, and

DD

pin should also be

REF1

/2 to +V

/2 (i.e., AIN(+) – AIN(–) =

REF

. When this

REV. B

–7–

AD7853/AD7853L

TERMINOLOGY
Integral Nonlinearity

This is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function. The end­points of the transfer function are zero scale, a point 1/2 LSB
below the first code transition, and full scale, a point 1/2 LSB
above the last code transition.

Differential Nonlinearity

This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.

Total Unadjusted Error

This is the deviation of the actual code from the ideal code
taking all errors into account (Gain, Offset, Integral Nonlinearity,
and other errors) at any point along the transfer function.

Unipolar Offset Error

This is the deviation of the first code transition (00 . . . 000 to
00 . . . 001) from the ideal AIN(+) voltage (AIN(–) + 1/2 LSB)
when operating in the unipolar mode.

Positive Full-Scale Error

This applies to the unipolar and bipolar modes and is the devia­tion of the last code transition from the ideal AIN(+) voltage
(AIN(–) + Full Scale – 1.5 LSB) after the offset error has been
adjusted out.

Negative Full-Scale Error

This applies to the bipolar mode only and is the deviation of the
first code transition (10 . . . 000 to 10 . . . 001) from the ideal
AIN(+) voltage (AIN(–) – V

/2 + 0.5 LSB).

REF

Bipolar Zero Error

This is the deviation of the midscale transition (all 1s to all 0s)
from the ideal AIN(+) voltage (AIN(–) – 1/2 LSB).

Track/Hold Acquisition Time

The track/hold amplifier returns into track mode and the end of
conversion. Track/Hold acquisition time is the time required for
the output of the track/hold amplifier to reach its final value,

within ±1/2 LSB, after the end of conversion.

Signal to (Noise + Distortion) Ratio

This is the measured ratio of signal to (noise + distortion) at the
output of the A/D converter. The signal is the rms amplitude of
the fundamental. Noise is the sum of all nonfundamental sig­nals up to half the sampling frequency (f

/2), excluding dc. The

S

ratio is dependent on the number of quantization levels in the
digitization process; the more levels, the smaller the quantiza­tion noise. The theoretical signal to (noise + distortion) ratio for
an ideal N-bit converter with a sine wave input is given by:

Signal to (Noise + Distortion) = (6.02 N +1.76) dB

Thus for a 12-bit converter, this is 74 dB.

Total Harmonic Distortion

Total harmonic distortion (THD) is the ratio of the rms sum of
harmonics to the fundamental. For the AD7853/AD7853L, it is
defined as:

2

2

2

2

2

+V

5

)

6

THD (dB ) =20 log

(V

+V

+V

2

3

+V

4

V

1

where V1 is the rms amplitude of the fundamental and V2, V3,

, V5 and V6 are the rms amplitudes of the second through the

V

4

sixth harmonics.

Peak Harmonic or Spurious Noise

Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to f

/2 and excluding dc) to the rms value of the

S

fundamental. Normally, the value of this specification is deter­mined by the largest harmonic in the spectrum, but for parts
where the harmonics are buried in the noise floor, it will be a
noise peak.

Intermodulation Distortion

With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities will create distortion

products at sum and difference frequencies of mfa ± nfb where

m, n = 0, 1, 2, 3, etc. Intermodulation distortion terms are
those for which neither m nor n are equal to zero. For example,
the second order terms include (fa + fb) and (fa – fb), while the
third order terms include (2fa + fb), (2fa – fb), (fa + 2fb) and
(fa – 2fb).

Testing is performed using the CCIF standard where two input
frequencies near the top end of the input bandwidth are used. In
this case, the second order terms are usually distanced in fre­quency from the original sine waves while the third order terms
are usually at a frequency close to the input frequencies. As a
result, the second and third order terms are specified separately.
The calculation of the intermodulation distortion is as per the
THD specification where it is the ratio of the rms sum of the
individual distortion products to the rms amplitude of the sum
of the fundamentals expressed in dBs.

–8–

REV. B

AD7853/AD7853L

RDSLT1, RDSLT0

DECODE

CALIBRATION

REGISTERS

GAIN(1)

OFFSET(1)

01

10 11

CALSLT1, CALSLT0

DECODE

00 01 10 11

TEST

REGISTER

STATUS

REGISTER

OFFSET(1)

GAIN(1)

GAIN(1)

OFFSET(1)

DAC(8)

ADC OUTPUT

DATA REGISTER

00

ON-CHIP REGISTERS

The AD7853/AD7853L powers up with a set of default conditions, and the user need not ever write to the device. In this case the
AD7853/AD7853L will operate as a Read-Only ADC. The AD7853/AD7853L still retains the flexibility for performing a full power­down, and a full self-calibration. Note that the DIN pin should be tied to DGND for operating the AD7853/AD7853L as a Read­Only ADC.

Extra features and flexibility such as performing different power-down options, different types of calibrations including system cali­bration, and software conversion start can be selected by writing to the part.

The AD7853/AD7853L contains a Control register, ADC output data register, Status register, Test register and 10 Calibra-
tion registers. The control register is write-only, the ADC output data register and the status register are read-only, and the test and
calibration registers are both read/write registers. The test register is used for testing the part and should not be written to.

Addressing the On-Chip Registers

Writing

A write operation to the AD7853/AD7853L consists of 16 bits. The two MSBs, ADDR0 and ADDR1, are decoded to determine
which register is addressed, and the subsequent 14 bits of data are written to the addressed register. It is not until all 16 bits are writ­ten that the data is latched into the addressed register. Table I shows the decoding of the address bits, while Figure 4 shows the over­all write register hierarchy.

Table I. Write Register Addressing

ADDR1 ADDR0 Comment

0 0 This combination does not address any register so the subsequent 14 data bits are ignored.

0 1 This combination addresses the TEST REGISTER. The subsequent 14 data bits are written to the test register.

1 0 This combination addresses the CALIBRATION REGISTERS. The subsequent 14 data bits are written

to the selected calibration register.

1 1 This combination addresses the CONTROL REGISTER. The subsequent 14 data bits are written to the

control register.

Reading

To read from the various registers the user must first write to Bits 6 and 7 in the Control Register, RDSLT0 and RDSLT1. These
bits are decoded to determine which register is addressed during a read operation. Table II shows the decoding of the read address
bits while Figure 5 shows the overall read register hierarchy. The power-up status of these bits is 00 so that the default read will be
from the ADC output data register.

Once the read selection bits are set in the control register all subsequent read operations that follow will be from the selected register
until the read selection bits are changed in the control register.

Table II. Read Register Addressing

RDSLT1 RDSLT0 Comment

0 0 All successive read operations will be from ADC OUTPUT DATA REGISTER. This is the power-up

default setting. There will always be four leading zeros when reading from the ADC output data register.

0 1 All successive read operations will be from TEST REGISTER.

1 0 All successive read operations will be from CALIBRATION REGISTERS.

1 1 All successive read operations will be from STATUS REGISTER.

ADDR1, ADDR0

DECODE

01
TEST

REGISTER

10 11

CALIBRATION

REGISTERS

CONTROL
REGISTER

GAIN(1)

CALSLT1, CALSLT0

DECODE

Figure 4. Write Register Hierarchy/Address Decoding

REV. B

OFFSET(1)

DAC(8)

00 01 10 11

GAIN(1)

OFFSET(1)

OFFSET(1)

GAIN(1)

Figure 5. Read Register Hierarchy/Address Decoding

–9–

AD7853/AD7853L

CONTROL REGISTER

The arrangement of the control register is shown below. The control register is a write only register and contains 14 bits of data. The
control register is selected by putting two 1s in ADDR1 and ADDR0. The function of the bits in the control register are described
below. The power-up status of all bits is 0.

MSB

ZERO ZERO ZERO ZERO PMGT1 PMGT0 RDSLT1

RDSLT0 2/3 MODE CONVST CALMD CALSLT1 CALSLT0 STCAL

LSB

Control Register Bit Function Descriptions

Bit Mnemonic Comment

13 ZERO These four bits must be set to 0 when writing to the control register.
12 ZERO
11 ZERO
10 ZERO

9 PMGT1 Power Management Bits. These two bits are used with the
8 PMGT0 power-down modes (See Power-Down section for more details).

7 RDSLT1 These two bits determine which register is addressed for the read operations. See Table II.
6 RDSLT0

52/

4 CONVST Conversion Start Bit. A logic one in this bit position starts a single conversion, and this bit is automati-

3 CALMD Calibration Mode Bit. A 0 here selects self-calibration and a 1 selects a system calibration (see Table III).

2 CALSLT1 Calibration Selection Bits and Start Calibration Bit. These bits have two functions.
1 CALSLT0 With the STCAL bit set to 1, the CALSLT1 and CALSLT0 bits determine the type of calibration per­0 STCAL formed by the part (see Table III). The STCAL bit is automatically reset to 0 at the end of calibration.

3 MODE Interface Mode Select Bit. With this bit set to 0, Interface Mode 2 is enabled. With this bit set to 1,

Interface Mode 1 is enabled where DIN is used as an output as well as an input. This bit is set to 0 by
default after every read cycle; thus when using Interface Mode 1, this bit needs to be set to 1 in every
write cycle.

cally reset to 0 at the end of conversion. This bit may also used in conjunction with system calibration
(see Calibration Section on page 21).

With the STCAL bit set to 0, the CALSLT1 and CALSLT0 bits are decoded to address the calibration
register for read/write of calibration coefficients (see section on the calibration registers for more details).

SLEEP pin for putting the part into various

Table III. Calibration Selection

CALMD CALSLT1 CALSLT0 Calibration Type

00 0 A full internal calibration is initiated where the internal DAC is calibrated followed by the

internal gain error and finally the internal offset error is calibrated out. This is the default setting.

0 0 1 Here the internal gain error is calibrated out followed by the internal offset error calibrated

out.

0 1 0 This calibrates out the internal offset error only.

0 1 1 This calibrates out the internal gain error only.

10 0 A full system calibration is initiated here where first the internal DAC is calibrated, fol-

lowed by the system gain error, and finally the system offset error is calibrated out.

1 0 1 Here the system gain error is calibrated out followed by the system offset error.

1 1 0 This calibrates out the system offset error only.

1 1 1 This calibrates out the system gain error only.

–10–

REV. B

AD7853/AD7853L

STATUS REGISTER

The arrangement of the status register is shown below. The status register is a read-only register and contains 16 bits of data. The
status register is selected by first writing to the control register and putting two 1s in RDSLT1 and RDSLT0. The function of the
bits in the status register are described below. The power-up status of all bits is 0.

START

WRITE TO CONTROL REGISTER
SETTING RDSLT0 = RDSLT1 = 1

READ STATUS REGISTER

Figure 6. Flowchart for Reading the Status Register

MSB

ZERO BUSY ZERO ZERO ZERO ZERO PMGT1 PMGT0

RDSLT1 RDSLT0 2/3 MODE X CALMD CALSLT1 CALSLT0 STCAL

LSB

Status Register Bit Function Descriptions

Bit Mnemonic Comment

15 ZERO This bit is always 0.

14 BUSY Conversion/Calibration Busy Bit. When this bit is 1, it indicates that there is a conversion or calibration in

progress. When this bit is 0, no conversion or calibration is in progress.

13 ZERO These four bits are always 0.
12 ZERO
11 ZERO
10 ZERO

9 PMGT1 Power Management Bits. These bits, along with the SLEEP pin, will indicate whether or not the part is in a
8 PMGT0 power-down mode. See Table VI in Power-Down Section for description.

7 RDSLT1 Both of these bits are always 1, indicating it is the status register that is being read. See Table II.
6 RDSLT0

52/3 MODE Interface Mode Select Bit. With this bit at 0, the device is in Interface Mode 2. With this bit at 1, the device

is in Interface Mode 1. This bit is reset to 0 after every read cycle.

4 X Don’t care bit.

3 CALMD Calibration Mode Bit. A 0 in this bit indicates a self-calibration is selected; a 1 in this bit indicates a system

calibration is selected (see Table III).

2 CALSLT1 Calibration Selection Bits and Start Calibration Bit. The STCAL bit is read as a 1 if a calibration is in
1 CALSLT0 progress and as a 0 if no calibration is in progress. The CALSLT1 and CALSLT0 bits indicate
0 STCAL which of the calibration registers are addressed for reading and writing (see section on the Calibration

Registers for more details).

REV. B

–11–