packages
Guaranteed monotonic to 16/14 bits
Nominal output voltage range of −10 V to +10 V
Multiple output spans available
Temperature monitoring function
Channel monitoring multiplexer
GPIO function
System calibration function allowing user-programmable
offset and gain
Channel grouping and addressing features
Data error checking feature
FUNCTIONAL BLOCK DIAGRAM
8
TO
MUX 2s
n
n
n
n
n
A/B
n
n
8
n
n
MUX
n
·
n
n
n
·
·
·
·
·
n
TO
MUX 2s
n
·
·
·
·
·
·
n
A/B
MUX
A/B
MUX
A/B
MUX
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
TEMP_OUT
PEC
MON_IN0
MON_IN1
MON_OUT
GPIO
BIN/2S COMP
SYNC
SDI
SCLK
SDO
BUSY
RESET
CLR
DV
TEMP
SENSOR
CONTROL
REGISTER
VOUT0 TO
VOUT15
MUX
GPIO
REGISTER
SERIAL
INTERFACE
STATE
MACHINE
AD5360/
AD5361
CC
8
6
2
n
AGND DGNDLDAC
SS
n = 16 FOR AD5360
n = 14 FOR AD5361
8
A/B SELECT
REGISTER
n
X1 REGISTER
n
M REGISTER
n
C REGIST ER
·
·
·
·
·
·
n
X1 REGISTER
n
M REGISTER
n
C REGIST ER
8
A/B SELECT
REGISTER
n
X1 REGISTER
n
M REGISTER
n
C REGIST ER
·
·
·
·
·
·
n
X1 REGISTER
n
M REGISTER
n
C REGIST ER
X2A REGISTER
X2B REGISTER
·
·
·
·
·
X2A REGISTER
X2B REGISTER
X2A REGISTER
X2B REGISTER
·
·
·
·
·
·
X2A REGISTER
X2B REGISTER
Figure 1.
Serial Input, Voltage-Output DAC
AD5360/AD5361
SPI-compatible serial interface
2.5 V to 5.5 V digital interface
OFS0
DAC 0
·
·
·
·
·
·
DAC 7
OFS1
DAC 0
·
·
·
·
·
DAC 7
RESET
14
n
n
n
n
n
OFFSET
DAC 0
DAC 0
·
·
·
·
·
·
DAC 7
OFFSET
DAC 1
DAC 0
·
·
·
·
·
·
DAC 7
)
VREF0
VOUT0
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
VOUT6
VOUT7
SIGGND0
VREF1
VOUT8
VOUT9
VOUT10
VOUT11
VOUT12
VOUT13
VOUT14
VOUT15
SIGGND1
05761-007
BUFFER
BUFFER
BUFFER
GROUP 0
OUTPUT BUFFER
AND POWER-
DOWN CONTROL
·
·
·
·
·
·
OUTPUT BUFFER
AND POWER-
DOWN CONTROL
GROUP 1
OUTPUT BUFFER
AND POWER-
DOWN CONTROL
·
·
·
·
·
·
OUTPUT BUFFER
AND POWER-
DOWN CONTROL
Digital reset (
Clear function to user-defined SIGGNDx
Simultaneous update of DAC outputs
APPLICATIONS
Instrumentation
Industrial control systems
Level setting in automatic test equipment (ATE)
Variable optical attenuators (VOA)
Optical line cards
14
REGISTER
n
MUX
REGISTER
2
·
·
·
·
·
n
MUX
2
REGISTER
14
REGISTER
n
MUX
REGISTER
2
·
·
·
·
·
·
n
MUX
REGISTER
2
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The AD5360/AD5361 contain sixteen, 16-/14-bit DACs in a
single 52-lead LQFP or 56-lead LFCSP package. They provide
buffered voltage outputs with a span four times the reference
voltage. The gain and offset of each DAC can be independently
trimmed to remove errors. For even greater flexibility, the device is
divided into two groups of eight DACs, and the output range of
each group can be independently adjusted by an offset DAC.
The AD5360/AD5361 offer guaranteed operation over a wide
supply range with V
+8 V to +16.5 V. The output amplifier headroom requirement
is 1.4 V.
from −4.5 V to −16.5 V and VDD from
SS
The AD5360/AD5361 have a high speed 4-wire serial interface,
which is compatible with SPI, QSPI™, MICROWIRE™, and DSP
interface standards and can handle clock speeds of up to
50 MHz. All the outputs can be updated simultaneously by
taking the
gain register and an offset adjust register.
Each DAC output is amplified and buffered on-chip with
respect to an external SIGGNDx input. The DAC outputs can
also be switched to SIGGNDx via the
LDAC
input low. Each channel has a programmable
CLR
pin.
Rev. A | Page 3 of 28
AD5360/AD5361
www.BDTIC.com/ADI
SPECIFICATIONS
DVCC = 2.5 V to 5.5 V; VDD = 9 V to 16.5 V; VSS = −16.5 V to −4.5 V; V
gain (M), offset (C), and DAC offset registers at default value; all specifications T
Table 1.
Parameter B Version1Unit Test Conditions/Comments
ACCURACY
Resolution
AD5360 16 Bits
AD5361 14 Bits
Relative Accuracy
AD5360 ±4 LSB max
AD5361 ±1 LSB max
Differential Nonlinearity ±1 LSB max Guaranteed monotonic by design over temperature
Zero-Scale Error ±15 mV max Before calibration
Full-Scale Error ±20 mV max Before calibration
Gain Error 0.1 % FSR Before calibration
Zero-Scale Error
Full-Scale Error
Span Error of Offset DAC ±75 mV max
VOUTx3 Temperature Coefficient 5 ppm FSR/°C typ Includes linearity, offset, and gain drift
DC Crosstalk4 180 μV max Typically 20 μV; measured channel at midscale, full-scale
REFERENCE INPUTS (VREF0, VREF1)
VREF Input Current ±10 μA max Per input; typically ±30 nA
VREF Range
SIGGND INPUT (SIGGND0 to SIGGND1)4
DC Input Impedance 50 kΩ min Typically 55 kΩ
Input Range ±0.5 V max
SIGGND Gain 0.995/1.005 Min/max
OUTPUT CHARACTERISTICS
Output Voltage Range VSS + 1.4 V min I
V
Nominal Output Voltage Range −10 to +10 V nominal
Short-Circuit Current 15 mA max VOUTx3 to DVCC, VDD, or VSS
Load Current ±1 mA max
Capacitive Load 2200 pF max
DC Output Impedance 0.5 Ω max
MONITOR PIN (MON_OUT)
Output Impedance
DAC Output at Positive Full-Scale 1000 Ω typ
DAC Output at Negative Full-Scale 500 Ω typ
Three-State Leakage Current 100 nA typ
Continuous Current Limit 2 mA max
DIGITAL INPUTS JEDEC compliant
Input High Voltage 1.7 V min DVCC = 2.5 V to 3.6 V
2.0 V min DV
Input Low Voltage 0.8 V max DVCC = 2.5 V to 5.5 V
Input Current ±1 μA max
±20 μA max
Output Low Voltage 0.5 V max Sinking 200 μA
Output High Voltage (SDO) DVCC − 0.5 V min Sourcing 200 μA
High Impedance Leakage Current ±5 μA max SDO only
High Impedance Output Capacitance
TEMPERATURE SENSOR (TEMP_OUT)
4
4
Accuracy ±1 °C typ @ 25°C
±5 °C typ −40°C < T < +85°C
Output Voltage at 25°C 1.46 V typ
Output Voltage Scale Factor 4.4 mV/°C typ
Output Load Current 200 μA max Current source only
Power-On Time 10 ms typ To within ±5°C
POWER REQUIREMENTS
DVCC 2.5/5.5 V min/max
VDD 8/16.5 V min/max
VSS −4.5/−16.5 V min/max
Power Supply Sensitivity
4
∆ Full Scale/∆ VDD −75 dB typ
∆ Full Scale/∆ VSS −75 dB typ
∆ Full Scale/∆ DVCC −90 dB typ
DICC 2 mA max VCC = 5.5 V, VIH = DVCC, VIL = GND
IDD 10 mA max Outputs unloaded
ISS 10 mA max Outputs unloaded
Power-Down Mode Bit 0 in the Control Register is 1
DICC 5 μA typ
IDD 35 μA typ
ISS −35 μA typ
Power Dissipation
Power Dissipation Unloaded (P) 245 mW max VSS = −12 V, VDD = +12 V, DVCC = 2.5 V
Junction Temperature 130 °C max TJ = TA + P
1
Temperature range for B version: −40°C to +85°C. Typical specifications are at 25°C.
2
Specifications are guaranteed for a 5 V reference only.
3
VOUTx refers to any of VOUT0 to VOUT15.
4
Guaranteed by design and characterization, not production tested.
)
10 pF typ
TOTAL
× θJA
AC CHARACTERISTICS
DVCC = 2.5 V; VDD = 15 V; VSS = −15 V; V
DAC offset registers at default value; all specifications T
Table 2.
Parameter B Version1Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
1
Output Voltage Settling Time 20 μs typ Full-scale change
30 μs max DAC latch contents alternately loaded with all 0s and all 1s
Slew Rate 1 V/μs typ
Digital-to-Analog Glitch Energy 5 nV-s typ
Glitch Impulse Peak Amplitude 10 mV max
Channel-to-Channel Isolation 100 dB typ VREF0, VREF1 = 2 V p-p, 1 kHz
DAC-to-DAC Crosstalk 10 nV-s typ
Digital Crosstalk 0.2 nV-s typ
Digital Feedthrough 0.02 nV-s typ Effect of input bus activity on DAC output under test
Output Noise Spectral Density @ 10 kHz 250 nV/√Hz typ VREF0 = VREF1 = 0 V
1
Guaranteed by design and characterization, not production tested.
Table 3. SPI Interface (See Figure 4 and Figure 5)
1, 2
Parameter
t
1
Limit at T
MIN
, T
Unit Description
MAX
20 ns min SCLK cycle time
t2 8 ns min SCLK high time
t3 8 ns min SCLK low time
t4 11 ns min
t
5
20 ns min
t6 10 ns min
t
7
5 ns min Data setup time
falling edge to SCLK falling edge setup time
SYNC
Minimum SYNC
24th SCLK falling edge to SYNC
high time
rising edge
t8 5 ns min Data hold time
3
t
9
t
1/1.5 μs typ/max
10
42 ns max
rising edge to BUSY falling edge
SYNC
pulse width low (single-channel update); see Table 8
BUSY
t11 600 ns max Single-channel update cycle time
t12 20 ns min
t13 10 ns min
t14 3 μs max
t15 0 ns min
t16 3 μs max
rising edge to LDAC falling edge
SYNC
pulse width low
LDAC
rising edge to DAC output response time
BUSY
rising edge to LDAC falling edge
BUSY
falling edge to DAC output response time
LDAC
t17 20/30 μs typ/max DAC output settling time
t18 140 ns max
t19 30 ns min
t20 400 μs max
t21 270 ns min
4
t
22
25 ns max SCLK rising edge to SDO valid
t23 80 ns max
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tr = tf = 2 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
3
This is measured with the load circuit shown in Figure 2.
4
This is measured with the load circuit shown in Figure 3.
/RESET pulse activation time
CLR
pulse width low
RESET
time indicated by BUSY low
RESET
Minimum SYNC
rising edge to BUSY falling edge
RESET
high time in readback mode
200µAI
DV
CC
R
L
2.2k
TO
OUTPUT
PIN
Figure 2. Load Circuit for
Ω
C
L
50pF
BUSY
Timing Diagram
V
OL
05761-008
Rev. A | Page 6 of 28
O OUTPUT
PIN
C
L
50pF
200µAI
Figure 3. Load Circuit for SDO Timing Diagram
OL
OH
VOH (MIN) – VOL (MAX)
2
5761-009
AD5360/AD5361
V
V
www.BDTIC.com/ADI
t
1
SCLK
SYNC
BUSY
LDAC
OUTx
LDAC
OUTx
SDI
1
1
2
2
1
2
t
3
t
4
t
5
t
7
t
8
DB23
24
t
2
t
6
DB0
t
9
t
1
t
11
t
10
12
t
13
24
t
17
t
14
t
15
t
13
t
17
t
16
CLR
VOUTx
RESET
VOUTx
BUSY
1
LDAC ACTIVE DURING BUSY.
2
LDAC ACTIVE AFTER BUSY.
t
18
t
19
t
18
t
20
t
23
05761-010
Figure 4. SPI Write Timing
Rev. A | Page 7 of 28
AD5360/AD5361
www.BDTIC.com/ADI
SCLK
SYNC
SDI
INPUT WORD SPECIFIES
REGISTER TO BE READ
SDO
t
22
DB0DB23DB23
LSB FRO M PREVIOUS W RITE
t
21
NOP CONDITI ON
DB0
DB23DB15
SELECTED REG ISTER DATA CLOCKED OUT
48
DB0
DB0
05761-011
Figure 5. SPI Read Timing
OUTPUT
VOLTAGE
VMAX
ACTUAL
TRANSFER
FUNCTION
IDEAL
TRANSFER
FUNCTION
FULL-SCAL E
ERROR
+
ZERO-SCALE
ERROR
N
– 1
2
n = 16 FOR AD5360
n = 14 FOR AD5361
05761-001
VMIN
0
DAC CODE
ZERO-SCALE
ERROR
Figure 6. DAC Transfer Function
Rev. A | Page 8 of 28
AD5360/AD5361
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
60 mA do not cause SCR latch-up.
Table 4.
Parameter Rating
VDD to AGND −0.3 V to +17 V
VSS to AGND −17 V to +0.3 V
DVCC to DGND −0.3 V to +7 V
Digital Inputs to DGND −0.3 V to DVCC + 0.3 V
Digital Outputs to DGND −0.3 V to DVCC + 0.3 V
VREF0, VREF1 to AGND −0.3 V to +5.5 V
VOUT0 to VOUT15 to AGND VSS − 0.3 V to VDD + 0.3 V
SIGGND0, SIGGND1 to AGND −1 V to +1 V
AGND to DGND −0.3 V to +0.3 V
MON_IN0, MON_IN1, MON_OUT to AGND VSS − 0.3 V to VDD + 0.3 V
Operating Temperature (TA)
Industrial (B Version) −40°C to +85°C
Storage −65°C to +150°C
Junction (TJ max) 130°C
θJA Thermal Impedance
52-Lead LQFP 38°C/W
56-Lead LFCSP 25°C/W
Reflow Soldering
Peak Temperature 230°C
Time at Peak Temperature 10 sec to 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. A | Page 9 of 28
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