Acer AR380 F1 User Manual

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AR380 F1 Series
User Guide
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Copyright © 2010. All Rights Reserved. Acer AR380 F1 Series
Acer AR380 F1
Model Number : Serial Number: Purchase Date: Place of Purchase:
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Information for your safety and comfort

Safety instructions

Read these instructions carefully. Keep this document for future reference. Follow all warnings and instructions marked on the product.
Turning the product off before cleaning
Unplug this product from the wall outlet before cleaning. Do not use liquid cleaners or aerosol cleaners. Use a damp cloth for cleaning.
CAUTION for plug as disconnecting device
Observe the following guidelines when connecting and disconnecting power to the power supply unit:
Install the power supply u nit befo re c on nec ting th e po wer c ord to the AC power outlet.
Unplug the power cord before removing the power supply unit from the computer.
If the system has multiple sources of power, disconnect power from the system by unplugging all power cords from the power supplies.
CAUTION for accessibility
Be sure that the power outlet you plug the power cord into is easily accessible and located as close to the equipment operator as possible. When you need to disconnect power to the equipment, be sure to unplug the power cord from the electrical outlet.
Warnings
Do not use this product near water.
Do not place this product on an unstable cart, stand or table. If the product falls, it could be seriously damaged.
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Slots and openings are provided for ventilation to ensure reliable operation of the product and to protect it from overheating. These openings must not be blocked or covered. The openings should never be blocked by placing the product on a bed, sofa, rug or other similar surface. This product should never be placed near or over a radiator or heat register, or in a built-in installation unless proper ventilation is provided.
Never push objects of any kind into this product through cabinet slots as they may touch dangerous voltage points or short-out parts that could result in a fire or electric shock. Never spill liquid of any kind onto or into the product.
To avoid damage of internal components and to prevent battery leakage, do not place the product on a vibrating surface.
Never use it under sporting, exercising, or any vibrating environment which will probably cause unexpected short current or damage rotor devices, HDD, Optical dr ive, and even exposure risk from lithium battery pack.
This product is not suitable for use with visual display workplace devices according to B2 of the German Ordinance for Work with Visual Display Units.
Using electrical power
This product should be operated from the type of power indicated on the marking label. If you are not sure of the type of power available, consult your dealer or local power company.
Do not allow anything to rest on the power cord. Do not lo cate this product where people will walk on the cord.
If an extension cord is used with this product, make sure that the total ampere rating of the equipment plugged into the extension cord does not exceed the extension cord ampere rating. Also, make sure that the total rating of all products plugged into the wall outlet does not exceed the fuse rating.
Do not overload a power outlet, strip or receptacle by plugging in too many devices. The overall system load must not exceed 80% of the branch circuit rating. If power strips are used, the load should not exceed 80% of the power strip's input rating.
This product's power supply is equipped with a three-wire grounded plug. The plug only fits in a grounded power outlet. Make sure the power outlet is properly grounded before inserting the power supply plug. Do not insert the plug into a non-
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grounded power outlet. Contact your electrician for details.
Warning! The grounding pin is a safety feature. Using a power outlet that is not properly grounded may result in electric shock and/or injury.
Note: The grounding pin also provides good protection from unexpected noise produced by other nearby electrical devices that may interfere with the performance of this product.
Use the product only with the supplied power supply cord set. If you need to replace the power cord set, make sure that the new power cord meets the following requirements: detachable type, UL listed/CSA certified, VDE approved or its equivalent, 4.6 meters (15 feet) maximum length.
Product servicing
Do not attempt to service this product yourself, as opening or removing covers may expose you to dangerous voltage points or other risks. Refer all servicing to qualified service personnel.
Unplug this product from the wall outlet and refer servicing to qualified service personnel whe n:
the power cord or plug is damaged, cut or frayed
liquid was spilled into the product
the product was exposed to rain or water
the product has been dropped or the case has been damaged
the product exhibits a distinct change in performance, indicating a need for service
the product does not operate normally after following the operating instructions
Note: Adjust only those controls that are covered by the operating instructions, since improper adjustment of other controls may result in damage and will often require extensive work by a qualified technician to restore the product to normal condition.
This server must be placed in a restricted access location.
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CAUTION: Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer’s instructions.

Additional safety information

Your device and its enhancements may contain small parts. Keep them out of the reach of small children.

Disposal instructions

Do not throw this electronic device into the trash when discarding. To minimize pollution and ensure utmost protection of the global environment, please recycle. For more information on the Waste from Electrical and Electronics Equipment (WEEE) regulations, visit http://www.acer-group.com/public/Sustainability/sustainability01.htm.

Mercury advisory

For projectors or electronic products containing an LCD/CRT monitor or display: Lamp(s) inside this product contain mercury and must be recycled or disposed of according to local, state or federal laws. For more information, contact the Electronic Industries Alliance at www.eiae.org. For lamp-specific disposal information, check www.lamprecycle.org.

Tips and information for comfortable use

Computer users may complain of eyestrin and headaches after prolonged use. Users are also at risk of physical injury after long hours of working in front of a computer. Long work periods, bad posture, poor work habits, stress, inadequate working conditions, personal health and other factors greatly increase the risk of physical injury.
Incorrect computer usage may lead to carpal tunnel syndrome, tendonitis, tenosynovitis or other musculoskeletal disorders. The following symptoms may appear in the hands, wrists, arms, shoulders, neck or back:
• numbness, or a burning or tingling sensation
• aching, soreness or tenderness
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• pain, swelling or throbbing
• stiffness or tightness
• coldness or weakness
If you have these symptoms, or any other recurring or persistent discomfort and/or pain related to comp uter use, consult a physician immediately and inform your company's health and safety department.
The following section provides tips for mor e comfortable computer use.
Finding your comfort zone
Find your comfort zone by adjusting the viewing angle of the monito r, using a footrest, or raising your sitting height to achieve maximum comfort. Observe the following tips:
refrain from staying too long in one fixed posture
avoid slouching forward and/or leaning backward
stand up and walk around regularly to remove the strain on your leg muscles
take short rests to relax your neck and shoulders
avoid tensing your muscles or shrugging your shoulders
install the external display, keyboard and mouse properly and within comfortable reach
if you view your monitor more than your documents, place the display at the center of your desk to minimize neck strain
Taking care of your vision
Long viewing hours, wearing incorrect glasses or contact lenses, glare, excessive room lighting, poorly focused screens, very small typefaces and low-contrast displays could stress your eyes. The following sections provide suggestions on how to reduce eyestrain.
Eyes
Rest your eyes frequently.
Give your eyes regular breaks by looking away from th e monitor and focusing on a distant point.
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Blink frequently to keep your eyes from drying out.
Display
Keep your display clean.
Keep your head at a higher level than the top edge of the display so your eyes point downward when looking at the middle of the display.
Adjust the display brightness and/or contrast to a comfortable level for enhanced text readability and graphics clarity.
Eliminate glare and reflections by:
placing your display in such a way that the side faces the window or any light source
minimizing room light by using drapes, shades or blinds
using a task light
changing the display's viewing angle
using a glare-reduction filter
using a display visor, such as a piece of ca rdboard extended from the display's top front edge
Avoid adjusting your display to an awkward viewing angle.
Avoid looking at bright light sources, such as open windows, for extended periods of time.
Developing good work habits
Develop the following work habits to make your computer use more relaxing and productive:
Take short breaks regularly and often.
Perform some stretching exercises.
Breathe fresh air as often as possible.
Exercise regularly and maintain a healthy body.
Warning! We do not recommend using the computer on a couch or bed. If this is unavoidable, work for only short periods, take breaks regularly, and do some stretching exercises.
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Regulations and safety notices

FCC notice

This device has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the device and receiver.
Connect the device into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/television technician for help.
Notice: Shielded cables
All connections to other computing devices must be made using shielded cables to maintain compliance with FCC regulations. In compliance with FCC regulations, use shielded cables to connect to other computing devices. A dual-link cable is recomm e nded for DVI output.
Notice: Peripheral devices
Only peripherals (input/output devices, terminals, printers, etc.) certified to comply with the Class A limits may be attached to this equipment. Operation with non-certified peripherals is likely to result in interference to radio and TV reception.
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Caution
Changes or modifications not expressly approved by the manufacturer could void the user's authority, which is granted by the Federal Communications Commission, to operate this computer.
Operation conditions
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Notice: Canadian users
This Class A digital apparatus complies with Canadian ICES-003.
Remarque à l'intention des utilisateurs canadiens
Cet appareil numérique de la classe B est conforme a la norme NMB­003 du Canada.
Compliant with Russian regulatory certification
Notice for Australia
For safety reasons, only connect headsets with a telecommunications compliance label. This includes customer equipment previously labelled permitted or certified.
Notice for New Zealand
1 The grant of a Telepermit for any item of terminal equipment
indicates only that Telecom has accepted that the item complies with minimum conditions for connection to its network. It indicates no endorsement of the product by Tel ecom, nor does it provide any sort of warranty. Above all, it provides no assurance that any item will work correctly in all respects with another item of Telepermitted equipment of a different make or model, nor does it imply that any product is compatible with all of Telecom's network services.
2 This equipment is not capable, under all operating conditions, of
correct operation at the higher speeds for which it is designed. Telecom will accept no responsibility should difficulties arise in such circumstances.
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3 Some parameters required for compliance with Telecom's
Telepermit requirements are dependent on the equipment (PC) associated with this device. The associated equipment shall be set to operate within the following limits for compliance with Telecom's Specifications:
a There shall be no more than 10 call attempts to the same number
within any 30 minute period for any single manual call initiation, and
b The equipment shall go on-hook for a period of not less than 30
seconds between the end of one attempt and the beginning of the next call attempt.
4 Some parameters required for compliance with Telecom's
Telepermit requirements are dependent on the equipment (PC) associated with this device. In order to operate within the limits for compliance with Telecom's specifications, the associated equipment shall be set to ensure that automatic calls to different numbers are spaced such that there is not less than 5 seconds between the end of one call attempt and the beginning of another.
5 This equipment shall not be set up to make automatic calls to
Telecom's 111 Emergency Service.
6 This device is equipped with pulse dialing while the Telecom
standard is DTMF tone dialing. There is no guarantee that Telecom lines will always continue to support pulse dialing.
7 Use of pulse dialing, when this equipment is connected to the
same line as other equipment, may give rise to bell tinkle or noise and may also cause a false answer condition. Should such problems occur, the user should NOT contact the telecom Fault Service.
8 This equipment may not provide for the effective hand-over of a
call to another device connected to the same line.
9 Under power failure conditions this appliance may not operate.
Please ensure that a separate telephone, not dependent on local power, is available for emergency use.
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Notice: BSMI

Power Supply Unit (PSU) statement

Power supply unit (PSU) redundancy claim ensures that the system may continue to run normally in the event one power supply unit becomes inoperable. Under normal operation, both power supplies share the system loading.

Laser compliance statement

The CD or DVD drive used with this computer is a laser product. The CD or DVD drive's classification label (shown below) is located on the drive.
CLASS 1 LASER PRODUCT CAUTION: INVISIBLE LASER RADIATION WHEN OPEN. AVOID EXPOSURE TO BEAM.
Appareil à laser de classe 1 Attention : Radiation laser visible et invisible en cas d’ouverture. Éviter toute exposition aux rayons.
Laserprodukt der Klasse 1 Achtung: Beim Öffnen werden unsichtbare Laserstrahlen freigelegt. Setzen Sie sich diesen Strahlen nicht aus.
Prodotto laser di classe 1 Attenzione: Radiazioni laser invisibili in caso d’apertura. Evitare l’esposizione ai raggi.
Producto láser de Clase 1 Precaución: Cuando está abierta, hay radiación láser. Evite una exposición al haz de luz.
Produto Laser de Classe 1 Precaução: Radiação laser in vis íve l quando aberto. Evite exposição ao feixe.
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Laserproduct klasse 1 Voorzichtig: Onzichtbare laserstraling indien geopend. Voorkom blootstelling aan straal.

Declaration of Conformity for EU countries

Hereby, Acer, declares that this system is in compliance with the essential requirements and other relevant provisions of Directive 1999/ 5/EC.
List of applicable countries
This device must be used in strict accordance with the regulations and constraints in the country of use. For further information, please contact local office in the country of use. Please see http://ec.europa.eu/enterprise/rtte/implem.htm for the latest country list.
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Information for your safety and comfort iii Regulations and safety notices ix
1 System tour 1
Overview 2 External and internal structure 3
Front panel 3 Rear panel 7 Internal components 9
Mainboard 10
2 System setup 17
Setting up the system 18
Pre-installation requirements 18 Connecting peripherals 19 Turning on the system 20
To power on the system: 20
Power-on problems 20 Configuring the system OS 22 Turning off the system 23
3 System upgrades 25
Installation precautions 26
ESD precautions 26
Pre-installation instructions 26
Post-installation instructions 27 Opening the server 28 Configuring the storage devic e s 30
Accessing the drive bays 30
Hard disk drive configuration guidelines 30
Determining drive status 31
Removing and installing a 3.5” hard disk drive 32
Removing and installing a 2.5” hard disk drive 34
Removing and installing an optical drive 37 Installing and removing the power supply 41 Power supply failure 42
Replacing the power supply 42
Removing and installing the air duct 43
Replacing a system fan 44 Replacing the processor and heatsink 46
Removing the heatsink 46
Contents
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Installing a heatsink 47 Upgrading the processor 49
Upgrading the system memory 52
Installing a memory module: 56 Removing a memory module: 57
Installing an expansion card 59
Installing a SAS card 59 Installing the rear SAS card 60 Installing the right riser card 62
4 System Bios 65
Introduction 66
The BIOS setup utility 66
Changing configuration data 66 Main setup 68 Advanced Settings 70
Boot Features 71
Processor & Clock Options 72
Advanced Chipset Control 76
IDE/SATA configuration 81
PCI/PnP configuration 84
Super IO Configuration 86
Hardware Health Configuration 87
ACPI configuration 90 Security Settings 92 System Management Settings 96
Product Information 97
Remote Access Configuration 99
DMI Event Logging 100 Boot Settings 103
Boot Device Priority 104
Hard Disk Drives 105
CD/DVD Drive 106 Exit 107
5 System troubleshooting 111
Resetting the system 112
Initial system startup problems 112 BIOS error beep codes 113 Initial troubleshooting checklist 114 Hardware diagnostic testing 115
Checking the boot-up status 115
Verifying the condition of the storage devices 115
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Confirming loading of the operating system 116
Specific problems and corrective actions 117
Appendix A: Server management tools 121
Server management overview 122 RAID configuration utilities 123
Intel onboard SATA RAID Creation 123 Adaptec onboard SATA RAID Creation 125 Configuring LSI MegaRAID SAS 8204ELP 127 MEGARAID SAS 8708EM2 RAID CREATION 129 FLEX IO LSI 1078 SAS RAID CREATION 131
Appendix B: 133
Rack installation information 135
System rack installation 137 Vertical mounting hole pattern 138
Installing the system into the rack 139
Appendix C: Acer Smart Console 145
Using Acer Smart Console 146
Software requirements 146 Accessing Acer Smart Console 147 Acer Smart Console user interface 148
System Information 148
Server Health 149
Configuration 151
Remote Control 161
Launch SOL 163
Virtual Media 164
Maintenance 166
KVM function description 167
Exit 173
Index 175
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1 System tour

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1 System tour

Overview

The AR380 F1 is a high-performance 2U rack-mount dual-socket server that supports up to two new generations of Intel architecture processors (Intel® Xeon 5500 series and Intel® Xeon 5600 series processors), DDR3 memory technology, PCI Express Gen2 (5.0Gb/s) quad onboard gigabit Ethernet controllers with Intel Technology (IOAT), VT-d and iSCSI boot and integrated BMC management feature.
The AR380 F1 targets medium businesses that require server solution combined with performance, reliability and expandability to support applications such as FTP server, file/printer server, data center, data center and Internet/Intranet server. The AR380 F1 is a flexible and highly reliable rack-mount server that satisfy growing businesses and customers’ needs.
System features and support
Six 3.5-inch or sixteen 2.5-inch SAS/SATA hard disk drives.
Hot-plug system fans
®
•Dual Intel
Eighteen DIMM slots that support a maximum of 192 GB (registered) or 48 GB (unbuffered) memory
Xeon 5500 / 5600 processors
®
I/O Acceleration
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External and internal structure

Front panel

The illustration below shows the system front panel. With 3.5-inch HDD bays
With 2.5-inch HDD bays
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No. Icon Component
1 Optical drive
2 Monitor port
3 USB 2.0 ports
4 LAN4 activity indicator
5 LAN3 activity indicator
6 System ID indicator/button
7 LAN2 activity indicator
8 LAN1 activity indicator
1 System tour
9 Status/fault indicator
10 HDD activity indicator
11 Power indicator
12 Power button
13 Rack handles
14 Tape drive bay
15 3.5-inch or 2.5-inch hard disk drive (HDD) bays
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No. Icon Component
16 Hot-plug HDD activity indicator
17 Hot-plug HDD status indicator
Front panel LED indicator status
LED indicator LED color LED state Status
Power indicator
HDD activity indicator
System ID LED / Button
Status/Fault indicator
Green On S0: Power ON
Green Blinking (1 Hz at
50% duty cycle)
N/A Off S4
N/A Off S5
Amber Blinking HDD access
N/A Off No access
Blue On System ID button
Blue Blinking IPMI-activated system
Red On CPU overheat
Red Fast Blink (1x/sec) Fan failure
Red Slow Blink (1x/4sec) Power failure
S1: Sleep
pressed
ID
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LED indicator LED color LED state Status
1 System tour
LAN activity indicators
(LAN1, LAN2
LAN3 LAN4)
Green On LAN Link / No Access
Green Blinking LAN Access
N/A Off Disconnect / Idle
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Rear panel

No. Component
1 Power supply modules
2 PS/2 mouse port
3 PS/2 keyboard port
4 Server management port (RJ-45) (10/100 Mbps)
5 USB 2.0 ports
6COM port
7 Monitor port
8-11 Gigabit LAN1 - 4 ports (10/100/1000 Mbps)
12 Flex I/O expansion slot
13 -14 Full-height PCI Express 2.0 x8 (x4 link) expansion slots
15 Full-height PCI Express 2.0 x16 (x8 link) expansion slot
16-18 Low-profile PCI Express 2.0 x8 (x4 link) expansion slots
19 System ID indicator
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1 System tour
Rear panel LED indicator status
LED indicator LED color LED state Status
System ID LED N/A Off Normal
Blue On System ID button pressed
Blue Blinking IPMI-activated system ID
LAN port LED indicators
LED indicator LED color LED state Status
RJ45 LED (Left) N/A Off No connection or 10 Mbps
Green On 100 Mbps
Amber On 1000 Mbps
RJ45 LED (Right) Yellow On Active connection
Yellow Blinking Transmit/Receive activity
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Internal components

No. Component
1 Hard disk drive bay
2System fan modules
3 Memory modules
4 Air duct
5 PCI riser board bracket assembly
6 Mainboard
7 Power supply module
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1 System tour

Mainboard

The mainboard becomes accessible once you open the system. It should look like the figure shown below.
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No. Connector Description
1 P1-DIMM3A
P1-DIMM3B P1-DIMM3C P1-DIMM2A P1-DIMM2B P1-DIMM2C P1-DIMM1A P1-DIMM1B P1-DIMM1C
2 CPU2 Processor 2 socket
3 JPW1 ATX 24-pin power connector
4 JPW2/JPW3 12V 8-pin power connectors
5 FAN1 Chassis fan 1
6 JPI2C Power supply SMB bus I2C header
7 JPK1 NIC3/NIC4 LED headers
8 FAN2 Chassis fan 2
9IPMB1/
JIPMB2
10 FAN3 Chassis fan 3
DDR3 sockets for processor 1
4-pin/3-pin external BMC I2C header
11 FAN4 Chassis fan 4
12 USB 2/3 Internal 2-port USB header (USB 2/3) for tape drive
13 JF1 Front panel control header
14 T-SGPIO1 Serial General Purpose Input/Output header 1
15 T-SGPIO2 Serial General Purpose Input/Output header 2
16 I-SATA0~5 SATA ports
Note: I-SATA5 is reserved for an installed optical drive.
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No. Connector Description
17 USB 4/5 Front panel accessible USB headers (USB4/5)
18 JL1 Chassis intrusion
19 USB 6 Front panel accessible type A USB connector USB6
20 JTPM Trusted platform module header (JP8)
21 COM2 Serial port 2 connection
22 SXB3 Left side riser card slot
23 SXB1 Left side riser card slot
24 SXB2 Right side riser card slot
25 UIOP Left side riser card slot
26 ID System ID LED
27 LAN3/LAN4 G-bit ethernet ports 3/4
28 LAN1/LAN2 G-bit ethernet ports 1/2
1 System tour
29 VGA1 Rear VGA port
30 VGA2 Front VGA port
31 COM1 COM1 serial connection
32 IPMI LAN IPMI dedicated LAN
33 USB 0/1 Back panel USB 0/1
34 KB/MS PS2 keyboard/mouse
35 SP1 Onboard buzzer
36 JBT1 Onboard battery
37 FAN7 CPU2 FAN (Reserved)
38 FAN8 CPU1 FAN (Reserved)
39 CPU1 Processor 1 socket
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No. Connector Description
40 P2-DIMM1C
P2-DIMM1B P2-DIMM1A P2-DIMM2C P2-DIMM2B P2-DIMM2A P2-DIMM3C P2-DIMM3B P2-DIMM3A
41 USB7 Front panel accessible USB headers (USB7)
DDR3 sockets for processor 2
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Mainboard jumper settings
1 System tour
No. Jumper Description Default Setting
1 JBT1 Clear CMOS Instead of pins, this jumper consists
2JI2C1/
JI2C2
3 JP3 ME Mode Select Pins 2~3 (disable)
4 JP5 ME Recovery Open (normal)
SMB to PCI-E slots Off (disable)
of contact pads to prevent accidental clearing of the CMOS contents. To clear CMOS, disconnect the power and short the CMOS pads with a metal object such as a small screwdriver.
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No. Jumper Description Default Setting
5 JPB BMC Enabled Pins 1~2 (enable)
6 JPG1 VGA Enable Pins 1~2 (enable)
7 JPL1/
JPL2
8 JPRST1 BMC/PHY Enable Pins 1~2 (enable)
9 JWD Watch Dog Pins 1~2 (reset)
GLAN1/GLAN2 Enable
Note: Jumpers not indicated are for test purposes only.
Pins 1~2 (enable)
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Mainboard LEDs
1 System tour
No. LED Description State Status
1 D20 BMC heartbeat
LED
2 LE1 Standby power
LED
3 LE11 System ID LED Solid blue System ID
Green blinking Normal
Solid green Power on
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2 System
setup
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2 System setup

Setting up the system

Pre-installation requirements

Selecting a site
Before unpacking and installing the system, select a suitable site fo r the system for maximum efficiency. Consider the following factors when choosing a site for the system:
Near a grounded power outlet.
Clean and dust-free.
Stable surface free from vibration.
Well-ventilated and away from sources of heat.
Protected from electromagnetic fields produced by electrical devices such as air conditioners, radio and TV transmitters, etc.
Package contents
Ensure you have the following items:
Acer AR380 system
Acer AR380 accessory box
If any of the above items is damaged or missing, contact your dealer immediately.
Save the boxes and packing materials for future use.
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Connecting peripherals

Caution! The server operates on 100-127/200-240 VAC only. Do not connect the system to an incorrect voltage source.
Refer to the illustration below for specific connection instructions on the peripherals you want to connect to the system.
Front connections
Rear connections
Note: Consult the operating system manual for information on how to configure the network setup.
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2 System setup

Turning on the system

After making sure that you have properly set up the system and connected all the required cables, you can now power on the system.

To power on the system:

After plugging in the power cord, press the power button.
The system starts up and displays a welcome message on the monitor. After that, a series of POST messages appears. The POST messages indicate if the system is running well or not.
Note: If the system does not turn on or boot after pressing the power button(s), go to the next section for the possible causes of the boot failure.
Aside from the POST messages, you can determine if the system is in good condition by checking if the following occurred.
The power indicator on the front panel lights up green.
The Num Lock, Caps Lock, and Scroll Lock indicators on the keyboard light up.

Power-on problems

If the system does not boot after you have applied power, check thefollowing factors that might have caused the boot failure.
The external power cord may be loosely connected. Check the power cord connection from the power so urce to the
power supply module AC input connector on the rear panel. Make sure that the power cord is properly connected to the power source and to the AC input connector.
No power comes from the grounded power outlet.
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Have an electrician check your power outlet.
Loose or improperly connected internal power cables. Check the internal cable connections. If you are not confident to
perform this step, ask a qualified technician to assist you.
Warning! Make sure all power cords are disconnected from the electrical outlet before performing this task.
Note: If you have gone through the preceding actions and the system still fails to boot, ask your dealer or a qualified technician for assistance.
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2 System setup

Configuring the system OS

Acer Smart Setup assists you to conveniently install your choice of operating system.
Note: To purchase the Acer Smart Server Manager software, contact your local Acer representative.
To start using Smart Setup, follow the steps below. 1 Locate the Smart Setup included in the system package. 2 If an optional DVD drive is not installed in the server, connect an
external DVD drive to your system. Press the Stop/Eject button on the DVD drive to eject the disc tray.
3 When the disc tray slides open, insert the Smart Setup DVD with
the label or title side of the disc facing upward.
Note: When handling the disc, hold it by the edges to avoid smudges or fingerprints.
4 Gently press the disc down to make sure that it is properly
inserted.
Caution! While pressing the disc, be careful not to bend the disc tray. Make sure that the disc is properly inserted before closing the disc tray. Improper insertion may damage both the disc and the CD-ROM drive.
5 Gently press the drive Stop/Eject button again to close the disc
tray. 6 On the Acer Smart Setup window, select OS Installation. 7 Follow all onscreen instructions.
For more information, refer to the Smart Setup Help file.
Note: The Windows or Linux OS disc is needed when you install the OS with the Smart Setup.
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Turning off the system

There are two ways to turn off the server — via software or via hardware. The software procedure below applies to a system running the Windows operating system. For further operating system shutdown procedures, refer to the related user documentation.
To turn off the system via software: 1 Press <Ctrl> + <Alt> + <Delete> on the attached keyboard or click
Start on the Windows taskbar. 2 Select Shut Down. 3 Select Shut down from the drop-down window then click on OK.
To turn off the system via hardware: If you cannot shut down the server using the software, press and hold
the power button for at least four seconds. Quickly pressing the button may put the server in a Suspend mode only.
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2 System setup
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3 System upgrades

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3 System upgrades

Installation precautions

Before you install any serve r component, we recommend that you read the following sections. These sections c ontain important ESD precautions along with pre-installation and post-installation instructions.

ESD precautions

Electrostatic discharge (ESD) can damage the processor, disk drives, expansion boards, mainboard, memory modules and other server components. Always observe the fo llowing precautions before you install a server component:
Do not remove a component from its protective packaging until you are ready to install it.
Do not touch the component pins, leads, or circuitry.
Components with a Printed Circuit Board (PCB) assembly should always be laid with the assembly-side down.
Wear a wrist grounding strap and attach it to a metal part of the server before handling components. If a wrist strap is not available, maintain contact with the server throughout any procedure requiring ESD protection.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and foam packing.

Pre-installation instructions

Perform the steps below before you open the server or before you remove or replace any component:
Warning! Failure to properly turn off the server before you start installing components may cause serious damage. Do not attempt the procedures described in the following sections unless you are a qualified service technician.
1 Turn off the system and all the peripherals connected to it. 2 Unplug all cables from the power outlets. 3 Disconnect all telecommunication cables from their ports.
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4 Place the system unit on a flat, stable surface. 5 Open the system according to the instructions on page 43. 6 Follow the ESD precauti ons desc rib ed in this sect ion when
handling a server component.

Post-installation instructions

Perform the steps below after installing a server component. 1 See to it that all components are installed according to the
described step-by-step instructions.
2 Reinstall all components or cable that have been previously
removed. 3 Reinstall the top cover. 4 Reconnect th e necessary cables. 5 Turn on the system.
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3 System upgrades

Opening the server

Caution: Before you proceed, make sure that you have turned off the system and all peripherals connected to it. Read the “Pre­installation instructions” on page 26.
You need to open the server before you can install additional components or access the system’s internal components. Refer to the following sections for instructions.
Removing the top cover
Note: Observe the ESD precautions and pre-installation instructions described on page 26.
1 Press and hold the two release buttons. 2 Slide the cover toward the rear of the chassis. 3 Lift the cover off the chassis.
4 Put the top cover asid e for reinstallation later.
Installing the top cover
1 Perform the pre-installation instructions described on page 26.
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2 Insta l l the top cover.
(1) Place the top cover on the chassis so that the tabs on the
cover align with the slots on the chassis.
(2) Slide the top cover toward the fr ont of the chassis until it
is fully closed.
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3 System upgrades

Configuring the storage devices

The system supports up to four 3.5-inch hot-plug SAS/SATA hard disk drives. An optional optical drive can also be added to the server.

Accessing the drive bays

Since SAS/SATA drives have hot-plug capability, you do not need to access the inside of the chassis or power down the system to install or replace SAS/SATA drives. Proceed to the next step for instructions.
Note: The operating system you use must have RAID support to enable the hot-plug capability of the SATA drives.
Caution: When working around the SATA backplane, do not touch the backplane with any metal objects and make sure no cables touch the backplane. Also, regardless of how many SATA drives are installed, all eight drive carriers must remain in the chassis to maintain proper airflow.

Hard disk drive configuration guidelines

Observe these guidelines when replacing or installing a hard disk drive.
Use only qualified SAS or SATA HDDs. To purchase a SAS or SATA HDD, contact your local representative.
Before removing a hard disk drive, make sure to back up all important system files.
Check hard disk drive status by checking the status LED indicators on the HDD carrier.
The hard disk drive carriers must be installed in the following
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order:

Determining drive status

Each HDD carrier features two status LED indicators (see page 5) to display the hard drive status. If you are replacing a failed HDD, determine which drive has failed by checking the hot-plug HDD status indicators.
3.5” HDD
2.5” HDD
Description
Onboard SATA RAID Green Red
HDD present no access Off Off
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Description
HDD access Blink Off
RAID add-on card
HDD present no access SAS: On
SATA: Off
HDD access Blink
HDD failure On
HDD removal Off Off
HDD insertion and rebuilding Blin k 1Hz
HDD locate Blink 4Hz
3 System upgrades

Removing and installing a 3.5” hard disk drive

Removing a 3.5” hard disk drive with carrier
1 Observe the ESD precautions described on page 26. 2 Remove the carrier with failed HDD. 3 Remove the HDD carrier.
(1) Unlock the HDD carrier latch. (2) Slide the HDD carrier latch to release the lever.
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(3) Pull the lever and slide the car r i e r fr o m the c ha s sis.
4 Observe the post-installation instructions described on page 27.
Installing a 3.5” hard disk drive with carrier
1 Slide the HDD carrier all the way into the drive bay. 2 Use the lever to push the HDD carrier until it locks into place, then
close the HDD carrier lever.
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3 Lock the HDD carrier.
4 Observe the post-installation instructions described on page 27.
3 System upgrades

Removing and installing a 2.5” hard disk drive

Removing a 2.5” hard disk drive with carrier
1 Observe the ESD precautions described on page 26. 2 Remove the carrier with failed HDD. 3 Remove the HDD carrier.
(1) Unlock the HDD carrier latch. (2) Slide the HDD carrier latch to release the lever. (3) Pull the lever up.
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(4) Grasp the lever and pull the carrier from the chassis.
4 Observe the post-installation instructions described on page 27.
Installing a 2.5” hard disk drive with carrier
1 Slide the HDD carrier all the way into the drive bay. 2 Use the lever to push the HDD carrier into the chassis until it locks
in place, then close the HDD carrier lever.
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3 Lock the HDD carrier.
Observe the post-installation instructions described on page 27
3 System upgrades
Removing the 2.5” Carrier Cage
1 Observe the ESD precautions described on page 26. 2 Observe the Pre-installation instructions on page 26. 3 Unplug the power and data cables from the cage drives. 4 Remove the four screws of the HDD cage (1). 5 Slide the HDD cage out of the system chassis (2). 6 Observe the post-installation instructions described on page 27.
Installing the 2.5” Carrier Cage
1 Slide the HDD cage into the system chassis.
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2 Replace the four screws of the HDD cage.
3 Pug the power and data cables of the carrier hard drives. 4 Install the top cover. See page 28. 5 Observe the post-installation instructions described on page 27.

Removing and installing an optical drive

The system supports a slim SATA optical drive.
Removing an optical drive
1 Observe the ESD precautions described on page 26. 2 Observe the Pre-installation instructions on page 26. 3 Unplug the power and data cables from the drive (1),(2). 4 Locate the locking tab at the rear of the drive.
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5 Pull the tab away from the drive and push the drive out of the
system.(3)
6 Remove the ODD carrier frame.
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Installing an optical drive
1 Remove the ODD slot cover if present.
2 Install the ODD carrier frame to the ODD with the four screws.
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3 System upgrades
3 Insert the ODD into the system chassis. The drive is properly
inserted if you hear a click and the locking tab locks into place (1).
4 Plug the po wer and data cabl es to the new optical drive (2), (3).
5 Observe the post-installation instructions described on page 27.
Note: I-SATA5 port is reserved for connecting to the installed optical drive.
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Installing and removing the power supply

WARNING! To reduce the risk of personal injury or damage to the equipment, the installation of power supply modules should be referred to individuals who are qualified to service server systems and are trained to deal with equipment capable of generating hazardous energy levels.
WARNING! To reduce the risk of personal injury from hot surfaces, observe the thermal labels on each power supply module. You can also consider wearing protective gloves.
WARNING! To reduce the risk of personal injury from electric shock hazards, do not open the power supply modules. There are no serviceable parts inside the module.
Caution! Electrostatic discharge can damage electronic components. Make sure that you are properly grounded before handling a power supply module.
Caution! Due to chassis airflow disruption, a power supply bay should never be vacant for more than two minutes when the server is powered on. Exceeding five minutes might cause the system to exceed the maximum acceptable temperature and possibly damage the system components.
Caution! The power supply is only hot-pluggable if you have a redundant system with two power supplies installed. If you only have one power supply installed, before removing or replacing the power supply, you must first take the server out of service, turn off all peripheral devices connected to the system, turn off the system by pressing the power button, and unplug the AC power cord from the system or wall outlet.
The server has a single 720-Watt power supply, capable of operating at 100 - 240 input volts.
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3 System upgrades

Power supply failure

If the power supply unit fails, the system will shut down and you will need to replace the power supply unit. Replacement units can be ordered directly from Acer.

Replacing the power supply

Press the main power button on the front of the chassis and then unplug the AC power cord to completely remove power from the system before removing the power supply.
1 Remove the AC power cord from the power supply. 2 Remove the power supply module.
(1) Press the power supply release latch to release the power
supply module from the chassis.
(2) Use the handle to pull the failed power supply module
out of the server.
3 Install a new power supply module with the exact same model.
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4 Push the new power supply module into the power bay until it
clicks into place.
5 Plug the AC power cord back into the module and power up the
server by pushing the power on button.

Removing and installing the air duct

Caution: Always operate your server with the air duct installed to ensure reliable and continued operation.
Removing the air duct
1 Perform the pre-installation instructions described on page 26. 2 Lift the air duct from the chassis.
Installing the air duct
1 Perform the pre-installation instructions described on page 26.
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2 Place the air duct on the chassis so that the tabs on the air duct
align with the slots on the chassis.
Caution: Do not pinch or unplug cables that may be near or under the air duct.
3 System upgrades
3 Observe the post-installation instructions described on page 27.

Replacing a system fan

The system has four high-performance PWM fans to provide the cooling for the system. Fan speed may be controlled by a setting in BIOS (see Chapter 4).
To replace a fan module:
1 Perform the pre-installation instructions described on page 26.
Warning! The system fan becomes very hot when the system is on. Allow it to cool off first before handling.
2 Remove the top chassis cover while the system is still running to
determine which of the fans has failed.
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3 Remove the fan module.
(1) Push the fan clip handles inwards. (2) Pull the fan up and away from the chassis.
4 Install the new fan module.
(1) Insert the new fan into the chassis.
(2) Push downwards until firml y seat e d.
5 Observe the post-installation instructions described on page 27.
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3 System upgrades

Replacing the processor and heatsink

Notes:
Always connect the power cord last and always remove it before adding, removing or changing any hardware components. Make sure that you install the processor into the CPU socket before you install the CPU heatsink.
If you buy a CPU separately, make sure that you use an Intel­certified multidirectional heatsink and fan only.
Make sure to install the serverboard into the chassis before you install the CPU heatsinks.
When receiving a serverboard without a processor pre-installed, make sure that the plast ic CPU socket cap is in place and none of the socket pins is bent; otherwise, contact your retailer immediately.

Removing the heatsink

Warning! It is not recommended that the CPU or the heatsink be removed. However, if you do need to uninstall the heatsink, please follow the instructions below to prevent damage to the CPU or the CPU socket.
1 Remove power from the system and unplug the AC power cord
from the power supply.
2 Observe the pre-installation instructions on page 26. 3 Remove the air duct. See page 43. 4 Disconnect the heatsink fan wires from the CPU fan header.
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5 Using a screwdriver, loosen the heatsink screws from the
mainboard.
6 Lift the heat sink away from the processor.
7 Lay down the heat sink in an upright position — with the thermal
patch facing upward. Do not let the thermal patch touch the work surface.

Installing a heatsink

Caution: The heat sink has a thermal interface material (TIM) on the underside. Use caution so that you do not damage the TIM. If a protective film is installed on the TIM, remove it.
1 Remove power from the system and unplug the AC power cord
from the power supply.
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3 System upgrades
2 Do not apply any thermal grease to the heatsink or the CPU die;
the required amount has already been applied.
3 Place the heatsink on top of the CPU so that the four mounting
holes are aligned with those on the (preinstalled) heatsink retention mechanism.
4 Screw in two diagonal screws (i.e. the #1 and the #2 screws) until
just snug. Do not fully tighten the screws or you may damage the CPU.)
5 Add the two remaining screws then finish the installation by fully
tightening all four screws.
6 Install the air duct. See page 43. 7 Observe the post-installation instructions on page 27.
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Upgrading the processor

Processor configuration guidelines
The server supports two LGA 1366 processor sockets supporting dual­core or quad-core Intel Xeon processors. The supplied processors may be upgraded or additional processors installed.
Observe the following guidelines when replacing or installing a processor.
Processor 1 socket must always be populated. If no processor is installed in this socket, the system will fail to boot.
Before removing a processor, make sure to back up all important system files.
When installing a second processor, make sure it has same stepping and frequency specifications as the default processor.
Handle the processor and the heat sink carefully. Damage to either may prevent the system from functioning properly.
Replacing the processor
Warning! The processor becomes very hot when the system is on. Allow it to cool off first before handling.
(1) Remove the heatsink (see “Removing the heatsink” on
page 46). (2) Release then lift the load lever. (3) Open the retention plate to expose the socket body.
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3 System upgrades
(4) Grasp the installed processor by its edges and lift it out of
its socket.
(5) Store the old processor inside an anti-static bag. 8 Remove the new processor from its protective packaging. 9 Install the new processor.
(1) Hold the processor by its edges. Make sure the alignment
tabs on the socket fit the two notch located on the edge of the processor. The pins are keyed in such a way that you cannot install the processor in the wrong orientation
without bending the pins. (2) Insert the new processor in the socket. (3) Close the retention plate.
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(4) Engage the load lever back into place.
10 Apply the thermal interface material.
(1) Use an alcohol pad to wipe off the old thermal grease
from both the heat sink and the processor socket retention plate.
(2) Apply a thin layer of an approved thermal interface
material before installing the heat sink. Make sure that only a very thin layer is applied so that
both contact surfaces are still visible. 11 Install the heatsink (see “Installing a heatsink” on page 47). 12 Observe the post-installation instructions described on page 27. 13 Repeat the steps above to replace the second processor.
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3 System upgrades

Upgrading the system memory

System memory interface
The system has eighteen DIMM slots. Each CPU controls nine slots. The DIMM slots support DDR3-1333 registered/unbuffered ECC memory modules. For single rank and dual rank RDIMM, a maximum 3 DIMMs per channel and a total 18 DIMMs can be supported. For UDIMMs and quad rank RDIMMs, only 2 DIMMs per channel are supported and maximum total 12 DIMMs.
Each CPU has three memory channels (channel 1, 2 and 3).
Each channel has 3 slots. To maximize the memory performance, the DIMM modules should be
installed as balanced as possible among processors and memory channels. And slots with the same slot number across memory channels should be populated with identical DIMM.
Independent mode: Single processor configuration
No. of
P11C P11B P11A P12C P12B P12A P13C P13B P13A
DIMM
1X
2XX
3XXX
4XXXX
6XXXXXX
9* XXXXXXXXX
*SR/DR RDIMM only
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Dual processor configuration
No. of DIMM
2X
3XXX
4XX
6XXX
8XXXX
9XXXXXX
12 XX XX XX
18* XXXXXXXXXX
No. of DIMM
2X
3
4X X
6XXX
P11C P11B P11A P12C P12B P12A P13C P13B P13A P21C
P21B P21A P22C P22B P22A P23C P23B P23A
8XX XX
9XXX
12 XX XX XX
18* XXXXXXXX
*SR/DR RDIMM only 3 DIMM per channel configuration is only available for single/dual ran k
RDIMM. UDIMM and Quad rank RDIMM can only support 2 DIMM per channel.
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Mirroring mode:
For mirroring mode, the memory contains a primary image and a copy of the primary image. Therefore, the effective size of memory is reduced by at least one-half.
Channel 3 has no function and can't be populated in this mode.
Follow the population rules described in independent mode.
Mirroring mode needs the channel 1 & channel 2 with identical DIMM. DIMM slot populations within a channel do not have to be identical but the same DIMM slot location across channel 1 and channel 2 must be the same. DIMM1A and DIMM2A should be the same type, size and manufacturer. DIMM1B and DIMM2B memory should be the same type, size and manufacturer. DIMM1C and DIMM2C memory should be the same type, size and manufacturer.
Same rule is applied to the CPU2.
3 DIMM per channel configuration i s only available fo r single/dual rank RDIMM.
16GB DIMM is only supported for Intel Xeon 5600 series processor.
Please refer to the User Guide for complete population for both single and dual processor configurations.
Lockstep mode:
In Lockstep Channel Mode, each memory access is a 128-bit data access that spans Channel 1 and Channel 2. This is done to support SDDC for DRAM devices with 8-bit wide data ports. The same address is used on both channels such that an address error on any channel is detectable by bad ECC. Lockstep Channel mode is the only RAS mode that supports x8 SDDC.
Channel 3 has no function and can't be populated in this mode.
Follow the population rules described in independent mode.
Lockstep mode needs the channel 1 & channel 2 with identical DIMM. DIMM slot populations within a channel do not have to be identical but the same DIMM slot location across channel 1 and channel 2 must be the same. DIMM1A and DIMM2A should be the same type, size and manufacturer. DIMM1B and DIMM2B memory should be the same type, size and manufacturer. DIMM1C and DIMM2C memory should be the same type, size and manufacturer.
Same rule is applied to the CPU2.
3 DIMM per channel configuration i s only available fo r single/dual rank RDIMM.
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16GB DIMM is only supported for Intel Xeon 5600 series processor.
Please refer to the User Guide for complete population for both single and dual processor configurations.
Sparing mode:
In this mode, if system detects degrading memory and system still not crash, the data in failed channel will be copied to spare channel. Failed channel is then isolated and spare channel becomes active. But if any uncorrectable error happens before the isolation, it will still cause the system stop normal operation.
Channel 3 is the spare channel. Therefore, the effective size will be reduced by one-third.
Follow the population rules described in independent mode.
Sparing mode need all three channels with identical DIMMs. 1A, 2A and 3A should be the same type, size and manufacturer. 1B, 2B and 3B memory should be the same type, size and manufacturer. 1C, 2C and 3C memory should be the same type, size and manufacturer. Same rule is applied to CPU2.
Memory sparing mode is only supported by Intel Xeon 5600 series processor. Intel Xeon 5500 series processor does NOT support the memory sparing mode.
3 DIMM per channel configuration i s only available fo r single/dual rank RDIMM.
16GB DIMM is only supported for Intel Xeon 5600 series processor.
Please refer to the User Guide for complete population for both single and dual processor configurations.
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Memory identification
Generally, there are some memory information printed on the label of the DIMM module. Different vendors may have different formats but the convention is usually like this:
Item Description
Density 1GB, 2GB,4GB,8GB.
Intel Xeon Processor 5500 Series CPU supports DIMM organized by 1Gb or 2Gb DRAM chips.
Rank 1R = Single Rank
2R = Dual Rank 4R = Quad Rank Note: If quad rank DIMM is used, a maximum of only two
DIMMs per channel can be supported.
Bit Organization
Speed PC3 - 6400 => DDR3- 800
This platform supports x4 and x8. Note: It is not recommend to mix DIMMs with different bit
organizations in one system.
PC3 - 8500 => DDR3- 1066 PC3 - 10600 => DDR3- 1333 PC3 - 12800 => DDR3- 1600

Installing a memory module:

Warning! Memory of the identical size, speed, and organization must be installed in the same colored DIMM slots.
1 Observe the pre-installation instructions on page 26.
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2 Locate the DIMM slot on the mainboard. 3 Install the memory module.
a Align then insert the DIMM into the socket (1). b Push the DIMM to the socket until the retaining clips snap inward (2).
Note: The DIMM slot is slotted to ensure proper installation. If you insert a DIMM but it does not fit easily into the socket, you may have inserted it incorrectly. Reverse the orientation of the DIMM and insert it again.
4 Observe the post-installation instructions described on page 27. 5 Reconfigure the system memory. See “To reconfigure the system
memory” section on page 58 for more information.

Removing a memory module:

Important: Before removing any DIMM from the mainboard, make sure to create a backup file of all important data.
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3 System upgrades
1 Remove the memory module.
a Press the holding clips on both sides of the DIMM slot outward to
release the DIMM (1).
b Gently pull the DIMM upward to remove it from the DIMM slot (2).
2 If you intend to install a new memory module, refer to the
previous section.
To reconfigure the system memory:
The system automatically detects the amount of memory installed. Run the BIOS setup to view the new value for total system memory and make a note of it.
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Installing an expansion card

Your server has a preinstalled riser card designed specifically for use in the 2U rackmount chassis. Depending on the type of riser card installed, you can install the following expansion cards:
Left riser card (pre-installed)
• One Acer Flex I/O (PCI-E 2.0 x8) slot
• Two full height PCI-E 2.0 x8 slots (with x4 link)
• One full height PCI-E 2.0 x16 slot (with x8 link)
Right riser card (optional)
• Three low profile PCI-E 2.0 x8 slots (with x4 link)

Installing a SAS card

1 Observe the pre-installation instructions on page 26. 2 Unclip th e restrai ning latch and open in the direction shown
below (1).
3 Remove the slot shield (2).
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4 Insert the card.
5 Close the restraining latch.
3 System upgrades
6 Connect the appropriate cables to the card. 7 Observe the post-installation instructions on page 27.

Installing the rear SAS card

1 Observe the pre-installation instructions on page 26.
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2 Unclip th e restrai ning latch and open in the direction shown
below (1).
3 Remove the slot shield (2).
4 Insert the card.
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5 Close the restraining latch.
6 Connect the appropriate cables to the card. 7 Observe the post-installation instructions on page 27.
3 System upgrades

Installing the right riser card

Perform the following steps: 1 Observe the pre-installation instructions on page 26. 2 Unclip th e restrai ning latch and open in the direction shown
below.
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3 Remove the PCI slot shield.
4 Insert the add-on card into the riser card. 5 Close the restraining latch.
6 Connect the appropriate cables to the card. 7 Observe the post-installation instructions on page 27.
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Page 83

4 System Bios

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4 System Bios

Introduction

This chapter describes the BIOS Setup Utility for your server. The AMI ROM BIOS is stored in a Flash EEPROM and can be easily updated.
This chapter describes the basic navigation of the BIOS Setup Utility setup screens.

The BIOS setup utility

To enter the BIOS Setup Utility, press the <F2> key while the system is booting up.
Each main BIOS menu option is described in this manual. The Main BIOS setup menu screen has two main frames. The left frame displays all the options that can be configured. Grayed-out options cannot be configured. Options in blue can b e configured by you.
The right frame displays the key legend. Above the key legend is an area reserved for a text message. When an option is selected in the left frame, it is highlighted in white. Often a text message will accompany it.
Note: The BIOS has default text messages built in. Acer retains the option to include, omit or change any of these text messages.
The BIOS setup utility uses a key-based navigation system called hotkeys. Most of the BIOS setup utility hotkeys can be used at any time during the setup navigation process. These keys include <F1>, <F10>, <Enter>, <Esc> and arrow keys.

Changing configuration data

The configuration data that determines the system parameters may be changed by entering the BIOS setup utility. This setup utility can be accessed by pressing <F2> at the appropriate time during system boot.
Starting the setup utility normally, the only visible Power-On Self-Test (POST) routine is the memory test. As the memory is being tested, press the <F2> key to enter the BIOS setup utility main menu. From the main menu, you can access the other setup screens. A BIOS identification string is displayed at the left bottom corner of the screen below the copyright message.
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Warning! Do not upgrade the BIOS unless your system has a BIOS­related issue. Flashing the wrong BIOS can cause irreparable damage to the system. In no event shall Acer be liable for direct, indirect, special, incidental, or consequential damages arising from a BIOS update. If you have to update the BIOS, do not shut down or reset the system while the BIOS is updating. This is to avoid possible boot failure.
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4 System Bios

Main setup

When you first enter the BIOS setup utility, you will enter the main setup screen. You can always return to the main setup screen by selecting the main tab on the top of the screen. The main BIOS setup screen is shown below.
System Overview
System Time/System Date
Use this option to change the system time and date. Highligh t Sys te m Time or System Date using the arrow keys. Enter new values using the keyboard. Press the <Tab> key or the arrow keys to move between fields. The date must be entered in MM/DD/YY format. The time is entered in HH:MM:SS format. (Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as 17:30:00.)
BIOS Build Ver: This item displays the BIOS revision used in your system. BIOS Build Date: This item displays the date this BIOS was completed.
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Processor
The BIOS will automatically display the status of the processor used in your system and indicate the CPU type used.
Speed: This item displays the speed of the CPU detected by the BIOS. Physical Count: This item displays the number of processors installed in
your system as detected by the BIOS. Logical Count: This item displays the number of CPU cores installed in
your system as detected by the BIOS.
System Memory
This displays the size of memory available in the system as detected by the BIOS.
Populated Size: Displays the size of the memory modules installed in the system as detected by the BIOS.
Available Size: Displays the memory available for use.
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4 System Bios

Advanced Settings

Use the arrow keys to select Boot Setup and press <Enter> to access the submenu items:
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Boot Features

Quick Boot: Skip certain tests during POST to reduce the time needed for system boot.
Quiet Boot: Allows the bootup screen options to be modifi ed between POST messages or the OEM logo. Select Disabled to display the POST messages. Select Enabled to display the OEM logo instead of the normal POST messages.
AddOn ROM Display Mode: Sets the display mode for Option ROM. Bootup Num-Lock: Selects the Power-on state for Numlock key. Wait For 'F1' If Error: Forces the system to wait until the <F1> key is
pressed if an error occurs. Interrupt 19 Capture: Interrupt 19 is the software interrupt that
handles the boot disk function. When this item is set to Enabled, the ROM BIOS of the host adaptors will capture Interrupt 19 at boot and allow the drives that are attached to these host adaptors to function as bootable disks. If this item is set to Disabled, the ROM BIOS of the host adaptors will not capture Interrupt 19, and the drives attached to these adaptors will not function as bootable devices.
Power Button Function: If set to Instant_Off, the system will power off immediately when you press the power button. If set to
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4_Second_Override, the system will power off when you press the power button for four seconds or longer.
Restore on AC Power Loss: Use this feature to set the power state after a power outage. Select Power-Off for the system power to remain off after a power loss. Select Power-On for the system power to be turned on after a power loss. Select Last State to allow the system to resume its last state before a power loss.
Watch Dog Function: If Enabled, the Watch Dog Timer will allow the system to reboot when it is inactive for more than five minutes.
4 System Bios

Processor & Clock Options

This submenu displays the status of the processor as detected by the BIOS, including items such as the processor manufacturer, type, frequency, CPUID, Microcode Revision, Cache L1/L2/L3, Ratio Status, and Ratio Actual Value. The submenu also allows you to configure the processor and clock settings.
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Ratio to CMOS Setting: Select Manual to manually configure the CPU Ratio. Select Auto to allow the BIOS to automatically configure the CPU Ratio based on the processor installed on the motherboard.
C1E Support: Select Enabled to use the feature of Enhanced Halt State. C1E significantly reduces the CPU's powe r consumption by reducing the CPU's clock cycle and voltage during a Halt State.
Important: The following feature is only available if supported by the processor and/or operating system.
Hardware Prefetcher: If set to Enabled, the hardware prefetcher will prefetch streams of data and instructions from the main memory to the L2 cache in the forward or backward manner to improve CPU performance.
Important: The following feature is only available if supported by the processor and/or operating system.
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4 System Bios
Adjacent Cache Line Prefetch: The CPU fetches the cache line for 64 bytes if this option is set to Disabled. The CPU fetches both cache lines for 128 bytes as comprised if Enabled.
MPS and ACPI MADT Ordering: Allo ws you to configure the MPS (Multi-Processor Specifi cations) and ACPI settings for your motherboard. Select Modern Ordering if Windows XP or newer is used. Select Legacy Ordering if Windows 2000 or earlier is used.
Important: The following feature is only available if supported by the processor and/or operating system.
Intel (R) Virtualization Technology: Select Enabled to use Virtu alization Technology to allow one platform to run multiple operating systems and applications in independent partitions, creating multiple virtual systems in one physical computer.
Important: The following feature is only available if supported by the processor and/or operating system.
Execute-Disable Bit Capability: Set to Enabled to enable the Execute Disable Bit which will allow the processor to designate areas in the system memory where an application code can execute and where it cannot, thus preventing a worm or a virus from flooding i llegal codes to overwhelm the processor or damage the system during an attack.
Important: The following feature is only available if supported by the processor and/or operating system.
Simultaneous Multi-Threading: Set to Enabled to use simultaneous multi-threading technology, which will result in increased CPU performance.
Active Processor Cores: Set to Enabled to use a processor's second core and beyond. The options are All, 1 and 2.
Intel EIST Technology: EIST (Enhanced Intel SpeedStep Technology) allows the system to automatically adjust processor voltage and core frequency in an effort to reduce power consumption and heat dissipation. Please refer to Intel’s web site for detailed information. The options are Disable (Disable GV3) and Enable (Enable GV3).
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Intel C-STATE Tech: If Enabled, C-State is set by the system automatically to either C2, C3 or C4.
C-State package limit setting: If set to Auto, the BIOS will automatically set the limit on the C-State package register.
C1 Auto Demotion: When Enabled, the CPU will conditionally demote C3, C6 or C7 requests to C1 based on un-co r e auto-demote information.
C3 Auto Demotion: When Enabled, the CPU will conditionally demote C6 or C7 requests to C3 based on un-core auto-demo t e information.
Clock Spread Spectrum: Select Enable to use the feature of Clock Spectrum, which will allow the BIOS to monitor and attempt to reduce the level of Electromagnetic Interference caused by the components whenever needed.
DCA Technology: Uses Intel's DCA (Direct Cache Access) Technology to enhance data transfer effi ciency.
DCA Prefetch Delay: Used with TOE components to prefetch data in order to shorten execution cycles and maximize data processing effi ciency. Prefetching too frequently can saturate the cache directory and delay necessary cache accesses. This feature reduces or increases the frequency the system prefetches data.
Clock Spread Spectrum: Select Enable to use the Clock Spectrum feature, which allows BIOS to monitor and attempt to reduce the level of Electromagnetic Interference caused by the components.
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4 System Bios

Advanced Chipset Control

The items included in the Advanced Chipset Settings submenu are listed below:
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CPU Bridge Configuration
QPI Links Speed: This feature selects QPI data transfer speed.
Important: The following feature is only available when QPI Links Speed is set to Full Speed.
QPI Frequency: This selects the desired QPI frequency. QPI L0s and L1: This enables the QPI power state to low po wer. L0s a nd
L1 are automatically selected by the motherboard. Memory Frequency: This feature enables you to force a DDR3
frequency slower than what the system has detected. Memory Mode: Set the memory mode.
Independent - All DIMMs are available to the operating system.
Channel Mirror - The motherboard maintains two identical copies of all data in memory for redundancy.
Lockstep - The motherboard uses two areas of memory to run the same set of operations in parallel.
Demand Scrubbing: A memory error-correction scheme where the processor writes corrected data back into the memory block from where it was read by the processor.
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4 System Bios
Patrol Scrubbing: A memory error-correction scheme that works in the background looking for and correcting resident errors.
Throttling - Closed Loop/Throttling - Open Loop: Throttling improves reliability and reduces power in the processor by automatic voltage control during processor idle states. If Enabled, the following items will appear:
Hysteresis Temperature (For Closed Loop only) - Temperature Hysteresis is the temperature lag (in degrees Celsius) after the set DIMM temperature threshold is reached before Closed Loop Throttling begins.
Guardband Temperature (For the Closed Loop only) - This is the temperature which applies to the DIMM temperature threshold. Steps are in 0.5 °C increments. The default is [006]. Press "+" or "-" on your keyboard to change this value.
Inlet Temperature - This is the temperature detected at the chassis inlet. Steps are in 0.5 °C increments. The default is [070]. Press "+" or "-" on your keyboard to change this value.
Temperature Rise - This is the temperature rise to the DIMM thermal zone. Steps are in 0.5 °C increments. The default is [020]. Press "+" or "-" on your keyboard to change this value.
Air Flow - This is the air flow speed to the DIMM modules. Each step is one mm/sec. The default is [1500]. Press "+" or "-" on your keyboard to change this value.
Altitude - This feature defines how many meters above or be low sea level the system is located.
DIMM Pitch - This is the physical space between each DIMM module. Each step is 1/1000 of an inch. The default is [400]. Press "+" or "-" on your keyboard to change this value.
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NorthBridge Chipset Configuration
Intel I/OAT: Significantly reduces CPU overhead by leveraging CPU architectural improvements, freeing resources for other tasks.
DCA Technology: Select Enabled to use Intel's DCA (Direct Ca che Access) Technology to improve data transfer efficiency.
DCA Prefetch Delay: A DCA Prefetch is used with TOE components to prefetch data in order to shorten execution cycles and maximize data processing effi ciency. A TOE device is a specialized, dedicated processor that is installed on an add-on card or a network card to handle some or all packet processing of this add-on card. Prefetching too frequently can saturate the cache directory and delay necessary cache accesses. This feature reduces or increases the frequency the system prefetches data. The options are [8], [16], [32], [40], [48], [56], [64], [72], [80], [88], [96], [104], [112], and [120].
Intel VT-d: Select Enabled to enable Intel Virtualization Technology support for Direct I/O VT-d by reporting the I/O device assignments to VMM through the DMAR ACPI Tables. This feature offers fully­protected I/O resource-sharing across the Intel platforms, providing you with greater reliability, security and availability in networking and data-sharing.
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Active State Power-Management: Uses power management for signal transactions between the PCI Express L0 and L1 Links. Select Enabled to configure PCI Express L0 and L1 Link power states.
IOH PCIE Max Payload Size: Some add-on cards perform faster with the coalesce feature, which limits the payload size to 128 MB. Others perform better with a payload size of 256 MB, which inhibits the coalesce feature.
Please refer to your add-on card user guide for the desired setting.
4 System Bios
SouthBridge configuration
This feature allows you to configure the settings for the Intel ICH South Bridge chipset.
USB Functions: This feature allows you to decide how many onboard USB ports to enable.
Legacy USB Support: Select Enabled to use Legacy USB devices. If set to Auto, legacy USB support will be automatically enabled if a legacy USB device is installed on the motherb oard.
Note: Only available when USB Functions is set to Enabled.
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USB 2.0 Controller: Select Enabled to activate the onboard USB 2.0 controller.
Note: Only available when USB Functions is set to Disabled. Otherwise, this item will be set to Enabled by the BIOS.
USB 2.0 Controller Mode: This setting allows you to select the USB 2.0 Controller mode.
BIOS EHCI Hand-Off: Enable or disable BIOS Enhanced Host Controller Interface support to provide a workaround solution for an operating system that does not have EHCI Hand-Off support. When enabled, the EHCI Interface will be changed from BIOS-controlled to OS-controlled.

IDE/SATA configuration

When this submenu is selected, the BIOS automatically detects the presence of the IDE devices and displays the following items:
SATA#1 configuration: If Compatible is selected, it sets SATA#1 to legacy compatibility mode, while selecting Enhanced sets SATA#1 to native SATA mode.
Configure SATA#1 as - This feature allows you to select the drive type for SATA#1. The options are IDE, RAID and AHCI.
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ICH RAID Code Base - Select Intel or Adaptec to launch the appropriate SATA RAID firmware to configure SATA RAID.
Note: Only available when RAID is selected in Configure SATA#1 as.
SATA#2 configuration: Selecting Enhanced will set SATA#2 to native SATA mode.
Note: Only available when IDE is selected in Configure SATA#1 as.
Primary IDE Master/Slave, Secondary IDE Master/Slave, Third IDE Master, and Fourth IDE Master: These settings allow you to set the parameters of the IDE slots. Press <Enter> to activate the submenu screen for detailed options of these items. Set the configurations accordingly. Items included in the submenu are:
Type - Select the type of device connected to the system.
LBA/Large Mode - LBA (Logical Block Addressing) is a method of addressing data on a disk drive. In the LBA mode, the maximum drive capacity is 137 GB. For drive capacities over 137 GB, your system must be equipped with a 48-bit LBA mode addressing. If not, contact your manufacturer or install an ATA/133 IDE controller card that supports 48-bit LBA mode.
Block (Multi-Sector Transfer) - Block Mode boosts the IDE drive performance by increasing the amount of data transferred. Only 512 bytes of data can be transferred per interrupt if Block Mode is not used. Block Mode allows transfers of up to 64 KB per interrupt. Select Disabled to allow data to be transferred from and to the device one sector at a time. Select Auto to allow data transfer from and to the device occur multiple sectors at a time if the device supports it.
PIO Mode - The IDE PIO (Programmable I/O) Mode programs timing cycles between the IDE drive and the programmable IDE controller. As the PIO mode increases, the cycle time decreases.
Select Description
Auto Automatically detect the PIO mode. Use this value if the
IDE disk drive support cannot be determined.
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