ZTE ZM5202 User Manual

Hardware Development Guide of Module Product

Hardware Development Guide of

Module Product

Product Model No:ZM5202

Document Version: 2.0

Release Date: 2013-05-31

Hardware Development Guide of Module Product

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Hardware Development Guide of Module Product

Revision History

Vers ion Date Description

1.0 2010-04-15 1st version

1. Delete the part of 3.13 and 3.14 in former version

2.0

2013-03-20

2013-05-13

2. Change Logo of the header, footer and front cover

3. Modify the legal information

4. Modify the Reference document list in chapter 1.3

5. Add the module dimensions of top plane and thickness

6. Modify the chapter 7.7 of Recommended Product

Upgrading Plan

7. Modify the Standby current from 3.5mA to 5mA in Table

2-1

8. Modify the peak current from ≤470mA to ≤2A and

modify the Working temperature from 70 to 75°C in

Table 2-1

9. Modify the Pin 32-35,64,65,67,68 and description in

chapter 3.1.3

10. Modify chapter 3.8.3 to support of 8 wire UART

11. Modify the MODULE_WAKEUP_AP interface

application

12. Modify the product test environment in Table 6-2 and

6-4

13. Modify the product test result in Table 6-6

14. Update the Figure 3-1 of PIN Configuration Diagram

Modify the Figure 7-2 of Main and AGPS Antenna

Welding Pad Interface

15. Modify the Figure 7-1 of Main Antenna RF Connector

Interface

16. Modify Figure 2-1 of Product Illustration

2013-05-31 17. Release as Version 2.0

Hardware Development Guide of Module Product

TABLE OF CONTENTS

1 About This Document ..................................................................................... 1

1.1 Application Range ............................................................................................................ 1

1.2 Purpose ............................................................................................................................ 1

1.3 Supported & Reference Document List ........................................................................... 1

1.4 Abbreviations ................................................................................................................... 2

2 Product Overview ............................................................................................ 3

2.1 Mechanic Features .......................................................................................................... 3

2.2 Technical Parameters ...................................................................................................... 5

2.3 Function Overview ........................................................................................................... 8

2.3.1 Baseband Function .......................................................................................................... 8

2.3.2 Radio Frequency Function ............................................................................................... 8

3 Interfaces ....................................................................................................... 10

3.1 Definition of PINs ........................................................................................................... 10

3.1.1 Definition of PIN I/O Parameters .................................................................................... 10

3.1.2 PIN Configuration Diagram ............................................................................................ 10

3.1.3 PIN Description .............................................................................................................. 11

3.2 Working Condition .......................................................................................................... 15

3.3 Feature of Interface Power Level ................................................................................... 16

3.3.1 Feature of Digital Power Level Signal ............................................................................ 16

3.4 Power Interface .............................................................................................................. 16

3.4.1 Description of Power PINs ............................................................................................. 16

3.4.2 Requirement of Power Supply ....................................................................................... 16

3.5 (U)SIM Card Interface .................................................................................................... 17

3.5.1 Description of PINs ........................................................................................................ 17

3.5.2 Electric Feature .............................................................................................................. 17

3.5.3 Application of (U)SIM Card Interface ............................................................................. 18

Hardware Development Guide of Module Product

3.6 SD Card Interface .......................................................................................................... 18

3.6.1 Description of PINs ........................................................................................................ 18

3.6.2 Electric Feature .............................................................................................................. 19

3.6.3 Application of SD Card Interface .................................................................................... 19

3.7 USB2.0 Interface ............................................................................................................ 20

3.7.1 Description of PINs ........................................................................................................ 20

3.7.2 Electric Feature .............................................................................................................. 20

3.7.3 Application of USB Interface .......................................................................................... 20

3.8 Serial Interface ............................................................................................................... 21

3.8.1 SPI (Serial Peripheral Interface) Bus Interface .............................................................. 21

3.8.2 I2C Bus .......................................................................................................................... 22

3.8.3 UART Interface .............................................................................................................. 24

3.9 JTAG (Joint Test Action Group) Interface ...................................................................... 26

3.9.1 Description of PINs ........................................................................................................ 26

3.9.2 Application of JTAG Interface ........................................................................................ 26

3.10 Power-on/Power-off & Reset Signal .............................................................................. 26

3.10.1 Description of PINs ........................................................................................................ 26

3.10.2 Interface Application ...................................................................................................... 27

3.11 Interactive Application Interface ..................................................................................... 28

3.11.1 Description of PINs ........................................................................................................ 28

3.11.2 Interface Application ...................................................................................................... 28

3.12 LED Indicator Interface .................................................................................................. 29

3.12.1 Description of PINs ........................................................................................................ 29

3.12.2 Interface Application ...................................................................................................... 30

4 Electric Feature ............................................................................................. 31

4.1 Power Feature................................................................................................................ 31

4.1.1 Power Supply ................................................................................................................. 31

4.1.2 Working Current ............................................................................................................. 31

4.2 Power-on/Power-off Flow ............................................................................................... 32

Hardware Development Guide of Module Product

4.3 Resetting Flow ............................................................................................................... 34

5 Technical Index of Radio Frequency ........................................................... 35

5.1 Technical Index of Radio Frequency under UMTS Mode .............................................. 35

5.1.1 UMTS (WCDMA)............................................................................................................ 35

5.2 Technical Index of Radio Frequency under GPRS/GSM/EDGE Mode ......................... 35

5.3 Technical Parameters of Antenna Testing Console ...................................................... 35

5.3.1 Sourceless Index............................................................................................................ 36

5.3.2 Sourced Index ................................................................................................................ 36

6 Related Test & Testing Standard ................................................................. 37

6.1 Testing Reference .......................................................................................................... 37

6.2 Description of Testing Environment ............................................................................... 38

6.3 Reliability Testing Environment ...................................................................................... 39

6.4 Reliability Testing Result ................................................................................................ 40

7 Design Guide ................................................................................................. 41

7.1 General Design Rule & Requirement ............................................................................ 41

7.2 Power Supply Circuit Design ......................................................................................... 41

7.3 RF Circuit Design ........................................................................................................... 42

7.3.1 RF Antenna Circuit Design ............................................................................................ 42

7.3.2 Precautions During the Initial Design of Antenna .......................................................... 45

7.4 Suggestions for EMC & ESD Design ............................................................................. 47

7.5 Suggestions for PCB Wielding Panel Design ................................................................ 48

7.6 Suggestions for Heat-dissipation Design ....................................................................... 48

7.7 Recommended Product Upgrading Plan ....................................................................... 49

8 Manufacturing Guide .................................................................................... 50

8.1 Design of Steel Mesh ..................................................................................................... 50

8.2 Furnace Temperature Curve .......................................................................................... 50

9 FCC Regulations ........................................................................................... 51

Hardware Development Guide of Module Product

Figures

Figure 2-1 Product Illustration ....................................................................................... 3

Figure 2-2 Module Dimensions ..................................................................................... 4

Figure 2-3 System Connection Structure ...................................................................... 8

Figure 3-1 PIN Configuration Diagram ........................................................................ 11

Figure 3-2 (U)SIM Card Signal Connection Circuit ...................................................... 18

Figure 3-3 SD Typical Application Circuit .................................................................... 19

Figure 3-4 USB Typical Circuit Application ................................................................. 21

Figure 3-5 SPI Bus Sequence Chart ........................................................................... 22

Figure 3-6 I2C Reference Circuit Diagram .................................................................. 23

Figure 3-7 Module Serial Port & AP Application Processor ......................................... 25

Figure 3-8 The connection of ZM5202 UART and Standard RS-232-C interface ........ 25

Figure 3-9 Module Power-on Plan .............................................................................. 27

Figure 3-10 Recommended Circuit for Power-on/Power-off & Reset........................... 27

Figure 3-11 The output of MODULE_WAKEUP_AP ................................................... 29

Figure 3-12 Reference Circuit of Status Indicator ....................................................... 30

Figure 4-1 Power-on Sequence Chart of ZM5202 Module .......................................... 33

Figure 4-2 Power-off Sequence Chart of ZM5202 Module .......................................... 33

Figure 4-3 Module Resetting Flow .............................................................................. 34

Figure 7-1 Main Antenna RF Connector Interface ....................................................... 42

Figure 7-2 Interface of Main Antenna and AGPS Antenna Welding Pad ..................... 44

Figure 7-3 RF Interface Testing Console (W.FL-R-SMT-1 from HRS) ......................... 44

Figure 7-4 T esting Cable ............................................................................................ 45

Figure 8-1 Recommended Pattern of Steel Mesh on Wielding panel .......................... 50

Figure 8-2 Furnace Temperature Curve Reference Diagram ...................................... 53

Figure 8-3 T esting Result............................................................................................ 53

Hardware Development Guide of Module Product

Tables

Table 1-1 Supported Document List ............................................................................. 1

Table 1-2 A bbreviation List ........................................................................................... 2

Table 2-1 M ajor Technical Parameters ......................................................................... 6

Table 2-2 Working Frequency Band ............................................................................. 9

Table 3-1 P IN Parameters .......................................................................................... 10

Table 3-2 PIN Interface Definition ............................................................................... 11

Table 3-3 Working Condition ...................................................................................... 15

Table 3-4 Power Level Range of Digital Signal ........................................................... 16

Table 3-5 Definition & Description of (U)SIM Card Signal Group ................................ 17

Table 3-6 Definition of SD Card Signal Interface ......................................................... 18

Table 3-7 Definition of SPI Signal ............................................................................... 21

Table 3-8 Definition of UART Signal ........................................................................... 24

Table 3-9 Definition of JTAG Signal ............................................................................ 26

Table 3-10 Interactive Application Interface ................................................................ 28

Table 3-11 Definition of LED PIN Signal ..................................................................... 29

Table 3-12 Definition of Indicator Status ..................................................................... 30

Table 4-1 Input Voltage .............................................................................................. 31

Table 4-2 Working Current .......................................................................................... 31

Table 4-3 P ower-on/Power-off Time ........................................................................... 33

Table 5-1 Sourceless Index of Main Antenna (Recommended) .................................. 36

Table 6-1 Testing Standard ........................................................................................ 37

Table 6-2 Testing Environment ................................................................................... 38

Table 6-3 Testing Instrument & Device ....................................................................... 38

Table 6-4 R eliability Features ..................................................................................... 39

Table 6-5 Temperature Testing Result Under Windless Environment ......................... 40

Table 6-6 H igh/Low-temperature Running & Storage Testing Result .......................... 40

Table 8-1 Curve Temperature Curve Parameter Setting ............................................. 52

Hardware Development Guide of Module Product

1 About This Document

1.1 Application Range

This document is applicable as the hardware development guide of ZM5202

WCDMA module products. The user can design ZM5202 according to the

requirement and guidance in this document. It is only applicable for the hardware

application and development of ZM5202 WCDMA module products.

1.2 Purpose

This document provides the design and development fundamentals for the users of

ZM5202. By reading this document, the user can have an overall knowledge of

ZM5202 and a clear understanding of the technical parameters. With this document,

the user can successfully fulfill the application and development of wireless 3G

Internet product or equipment.

Besides the product features and technical parameters, this document also

provides the product reliability tests and related testing standards, service function

implementation flow, RF performance indexes and a guide on the design of user

circuits, to provide the user with a complete design reference.

1.3 Supported & Reference Document List

Besides the hardware development document, ZTEWelink also provides the board

operation guide, software development guide and upgrading plan guide of ZM5202.

Table 1-1 is the list of supported documents.

Table 1-1 Supported Document List

NO. Document Name

1 ZTEWelink ZM5202 Module Specification.pdf

3 ZM5202 Software Development Guide of Module Product.pdf

ZTEWelink LGA Type Ⅱ Module Dev Board User Guide.pdf

Hardware Development Guide of Module Product

1.4 Abbreviations

Table 1-2 is a list of abbreviations involved in this document, as well as the English

full names.

Table 1-2 Abbreviation List

Abbreviations Full Name

ESD Electro-Static discharge

GPRS General Packet Radio Service

GSM Global Standard for Mobile

Communications

I/O Input/output

LED Light Emitting Diode

SPI Serial Peripheral Interface

WCDMA Wideband Code Division Multi Access

UMTS Universal Mobile Telecommunication

System

BER Bit Error Rate

DL Downlink

DPCH Dedicated Physical Channel

DPCH_Ec Average energy per PN chip for DPCH.

DPCH

SIM Subscriber Identification Module

Hardware Development Guide of Module Product

2 Product Overview

ZM5202 is one WCDMA wireless Internet module with LGA interface. It is widely

applied to but not limited to the various products and equipment such as laptops,

vehicle-mounted terminals, and e lectric devices, by providing data services. The

features of ZM5202 module are described as below.

1. It can support UMTS 850(900)/1900/2100MHz frequency band, and

GSM/GPRS/EDGE 850/900/1800/ 1900MHz frequency band.

2. It can provide high-speed data access service under the mobile environment.

3. It provides the SPI interface, I2C interface, (U)SIM card interface (3.0V/1.8V),

USB2.0 interface, UART interface, SD2.0 interface, power-on/power-off, and

resetting.

Figure 2-1 Product Illustration

2.1 Mechanic Features

ZM5202 is a 108-pin LGA encapsulation module. Except for the signal PIN, there

are many dedicated heat-dissipation ground wielding panel to improve the

grounding performance, mechanical strength and heat-dissipation performance.

There are altogether 30 heat-dissipation ground wielding panels, evenly distributed

at the bottom of PCB. The dimensions of 108-pin LGA encapsulation are 26*36mm,

and the height is 2.5+/-0.2mm. The location of PIN 1 is identified by the ground

wielding panel with an inclination at the bottom, and its angle orientates to the top

Hardware Development Guide of Module Product

welding panel of the corresponding module. Figure 2-2 is a figure about the

dimensions of ZM5202 module.

Figure 2-2 Module Dimensions

(a)Dimensions on Top plane (b) Thickness

Hardware Development Guide of Module Product

2.2 Technical Parameters

The major features of ZM5202 can be described from the aspects of mechanic

feature, base band, radio frequency, technical standard and e nvironment feature.

Table 2-1 is a l ist of the major technical parameters and f eatures supported by

ZM5202.

Hardware Development Guide of Module Product

Table 2-1 Major Technical Parameters

Name Parameter

Item

Mechanical

Feature

Dimensions 36mm * 26mm * (2.5+/-0.2)mm

Weight About 5.2g

Encapsulation

type

Processor

architecture

(U)SIM/SIM

Memory 32MByte/128MByte

USB interface USB 2.0 HIGH SPEED

Maximum

Baseband

power

consumption

Voltage DC 3. 4V-4.2V, typical: 3.8V

Working

current

Specifications

LGA package(108 Pin)

ARM 9 architecture

Standard 6 PIN SIM card interface

3V SIM card and 1.8V SIM card

2.2W

Peak current

Average normal working current

(without services)

Standby current

≤2A (3 . 8V)

note1

≤150mA (3.8V)

≤75mA

≤5mA (3.8V)

note3

note2

GSM band EDGE/GPRS/GSM: 1900/1800/900/850MHz

UMTS band /WCDMA: 2100/1900/850(900)MHz;

note

RxDiv Band

UMTS2100/1900/850(900): Power Class 3 (+24dB +1/-3dBm)

GSM/GPRS 850MHz/900MHz: Power Class 4 (+33dBm

±2dBm)

Max.

transmitter

power

GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm

±2dBm)

EDGE 850MHz/900MHz: Power Class E2 (+27dBm ±3dBm)

EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm

-4/+3dBm)

WCDMA2100 : ≤-106.7dBm

Receiving

sensitivity

WCDMA1900/850 : ≤-104.7dBm

WCDMA900 : ≤-103.7dBm

Hardware Development Guide of Module Product

Name Parameter

Item

Equalization Support

Main antenna

interface

Receive

diversity

(GPS)

antenna

interface

Data rate

Specifications

GSM850/900/1800/1900 : ≤-102dBm

Support

Support the GPS wielding panel interface, support the diversity

antenna interface; but they are not supported simultaneously.

ZTEWelink does not provide the antenna, and the antenna is

provided by the third party.

GSM CS: UL 9.6kbps/DL 9.6kbps

GPRS: Multi-slot Class 10

EDGE: Multi-slot Class 12

WCDMA CS: UL 64kbps/DL 64kbps

WCDMA PS: UL 384kbps/DL 384kbps

Technical

Standard

Environment

Feature

Application

GPRS type Class B

3GPP

protocol

R99/R5

Windows XP (SP2 and later)

Windows Vista

Operating

system

Windows 7

Linux

Android

Working

temperature

Storage

temperature

-20 to 75° C

-40 to 85° C

Humidity 5%~ 95%

RAS dialup Support

SMS Support

Network

Optionally support

locking

SIM READER Not support

Upgrading Support

Hardware Development Guide of Module Product

Main Antenna

LGA HSDPA

Wireless module

USB

SIM card

POWER

GND

I2C

UART

Wakeup and

Status

Indication

AGPS Antenna

SPI

Note: 1. Te st condition: The value is measured in Max. transmit power.

Note 2: Testing condition: The value is measured in transmit power of 0dBm and band of WCDMA 2100MHz.

Note 3: Testing condition: The value is measured in cell power of -75dBm and DRX=640.

Note 4: NA means unrelated.

2.3 Function Overview

2.3.1 Baseband Function

The baseband part of ZM5202 mainly includes the following signal groups: USB

signal, (U)SIM card signal, wakeup signal, working status indicator signal, UART

signal, SD interface signal, I2C interface signal, module power-on/resetting signal,

SPI, main antenna interface, AGPS antenna interface and power-supply interface.

Figure 2-3 is a diagram of the system connection structure.

Figure 2-3 System Connection Structure

2.3.2 Radio Frequency Function

The radio frequency function of ZM5202 can be viewed from the aspect of

over-the-air wireless bearer network, frequency band, whether the receive diversity

feature is supported, and the GPS function.

1. Support WCDMA 850(900)/1900/2100MHz;

2. Support GSM/EDGE/GPRS 850/900/1800/1900 MHz;

Hardware Development Guide of Module Product

3. Support GPS/AGPS;

The working frequency band of ZM5202 transceiver transmitter is as shown in Table

2-2.

Table 2-2 Working Frequency Band

Working

Frequency

Band

UMTS850 824 MHz — 849 MHz 869 MHz — 894 MHz

UMTS900 880 MHz — 915 MHz 925 MHz — 960 MHz

UMTS1900 1850 MHz — 1910 MHz 1930 MHz — 1990 MHz

UMTS2100 1920 MHz — 1980 MHz 2110 MHz — 2170 MHz

GSM850 824 MHz — 849MHz 869 MHz — 894 MHz

GSM900 890 MHz — 915MHz 935 MHz — 960MHz

GSM1800 1710 MHz — 1785MHz 1805 MHz — 1880MHz

GSM1900 1850 MHz — 1910MHz 1930 MHz — 1990MHz

Uplink Frequency Band

Downlink Frequency

Band

Hardware Development Guide of Module Product

3 Interfaces

3.1 Definition of PINs

3.1.1 Definition of PIN I/O Parameters

The definition of ZM5202 I/O parameter is as shown in Table 3-1.

Table 3-1 PIN Parameters

PIN Attribute Description

I Input PIN

O Output PIN

B Two-way digital port, CMOS

input

Z High-resistance output

P1 PIN group 1, the power supply

voltage is VDD_P1

P2 PIN group 2, the power supply

voltage is VDD_P2

PU PIN internal pull-up

PD PIN internal pull-down

A, AI, AO, AIO Analog circuit

3.1.2 PIN Configuration Diagram

The PIN sequence of interfaces on ZM5202 is defined as shown in Figure 3-1.

Hardware Development Guide of Module Product

Figure 3-1 PIN Configuration Diagram

3.1.3 PIN Description

Table 3-2 PIN Interface Definition

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