MG815+ Module Hardware Design User Manual
MG815+ Module Hardware Design User Manual
Version：V1.4
ZTE Corporation
This manual is also applicable for ME3000/ME3006/MG615+/MG415+/MG416+ modules.
MG815+ Module Hardware Design User Manual
Copyright Statement
Copyright © 2007 by ZTE Corporation
All rights reserved.
No part of this publication may be excerpted, reproduced, translated or utilized in any form or by any means,
electronic or mechanical, including photocopying and microfilm, without the prior written permission of ZTE
Corporation.
is the registered trademark of ZTE Corporation. All other trademarks appeared in this manual
are owned by the relevant companies.
ZTE Corporation reserves the right to make modifications on print errors or update specifications in this
manual without prior notice.
ZTE Corporation keeps the right to make the final explanation to this manual.
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MG815+ Module Hardware Design User Manual
With strong technical force, ZTE Corporation can provide CDMA/GPRS module customers with
the following all-around technical support:
1. Provide complete technical documentation;
2. Provide the development board used for R&D, test, production, after-sales, etc.;
3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;
4. Provide test environment;
ZTE Corporation provides customers with onsite supports, and also you could get supports through telephone,
website, instant communication, E-mail, etc.
The module website
module.ztemt.com.cn provides the relevant industry information and module technical
documentation. The authorized module customers could download the latest technical documentation for our
website. If you have more requirements, you could send an E-mail to
module@zte.com.cn. You can also call us
at 0755-86360280 for more supports.
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MG815+ Module Hardware Design User Manual
Preface
Summary
This manual is applicable for ME3000/ME3006/MG815+/MG615+/MG415+/MG416+ modules. This manual
takes MG815+ and ME3000 as examples to instruct the users how to design the hardware and how to quickly
and conveniently design different kinds of wireless terminals based on the modules.
Target Readers
z System designing engineers
z Mechanical engineers
z Hardware engineers
z Software engineers
z Test engineers
Brief Introduction
Chapter Contents
1 General Description Introduces technical specs of the modules and relevant documents and
abbreviations.
2 Product Introduction to
MG815+
3 PIN Definitions Introduces the name and function of PIN.
4 Hardware Interfaces and
design reference
5 Mechanical Introduces the module’s appearance, assembly line, main board PCB layout
6 Peripherals components Introduces the peripherals components.
Introduces the principle charts and relevant standards of both MG815+ and
ME3000 modules.
Introduces the hardware interface designing of the modules.
and fixing.
Update History
V1.4 （June-25-2007）
This is the fifth time to release the new version. The update contents include:
1.1.4 Modifications in Technical parameters
1.2 Modifications in Relevant Documents
4.2 Power and Reset Add ON/OFF timing
5.1 Change the modules weight a more accurate value.
V1.3 （May-31-2007）
This is the fourth time to release the new version. The update contents include:
4.2 Modifications in Section Power and Reset
4.4 Change user ID card interface to SIM/UIM card interface
4.5 Audio Interface: Deleted x05，x06，x07 in the picture, and just kept receiver, handset, and line out.
Change CDMA and GSM audio interface design
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MG815+ Module Hardware Design User Manual
4.6 Change RF interface as antenna interface.
5.1 Appearance: Add ME3000’s appearance.
5.3 Change PCB Layout.
6 Change Key components as peripherals.
V1.2 (April-24-2007)
This is the third time to release the version. The update contents include:
6.4 Audio Interface
Add Auto power-on/off, audio interface design
V1.1 （April-13-2007）
The update contents include:
5 PIN definitions
Change fig5-1 PIN Diagram
6 Hardware Interface and Reference Design
Change R12 impedance in Fig6-1 as 1K
6.4 Audio Interface
Add the design of audio interface
Add section 6.6 Module Layout
V1.0 （Feb-09-2007）
This is the first to formally release the document.
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MG815+ Module Hardware Design User Manual
Table of Contents
1 General Description........................................................................................................................................8
1.1 Technical Specification.........................................................................................................................8
1.1.1 Module Specification..............................................................................................................8
1.1.2 Main Functions and Features.................................................................................................. 8
1.1.3 Interfaces ................................................................................................................................9
1.1.4 Technical parameters..............................................................................................................9
1.2 Relevant Documents........................................................................................................................... 10
1.3 Abbreviations .....................................................................................................................................10
2 Brief Introduction to MG815+.....................................................................................................................12
2.1 Brief Introduction to MG815+ ........................................................................................................... 12
2.2 Brief Introduction to ME3000............................................................................................................12
3 PIN definitions..............................................................................................................................................14
4 Hardware Interfaces and Design Reference ................................................................................................. 18
4.1 Summary............................................................................................................................................. 18
4.2 Power and Reset ................................................................................................................................. 18
4.3 Serial Port...........................................................................................................................................19
4.4 SIM/UIM Card Interface ....................................................................................................................21
4.5 Audio Interface................................................................................................................................... 21
4.6 Antenna Interface ............................................................................................................................... 23
5 Mechanical ...................................................................................................................................................24
5.1 Appearance.........................................................................................................................................24
5.2 Module Assembly Line.......................................................................................................................25
5.3 Main board PCB layout ......................................................................................................................25
5.4 Fixing Method ....................................................................................................................................26
6 Peripherals components................................................................................................................................ 27
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MG815+ Module Hardware Design User Manual
Table of figures
FIGURE 2-1 MG815+ PRINCIPLE....................................................................................................................................12
FIGURE 2-2 ME3000 PRINCIPLE ....................................................................................................................................12
FIGURE 3-1 PIN.............................................................................................................................................................14
FIGURE 4-1 POWER AND RESET CIRCUIT DESIGN REFERENCE.........................................................................................18
FIGURE 4-2 ON/OFF TIMING.........................................................................................................................................19
FIGURE 4-3 UART TO MCU INTERFACE........................................................................................................................20
FIGURE 4-4 UART 1 SIGNAL DIAGRAM ........................................................................................................................20
FIGURE 4-5 SIM/UIM CARD INTERFACE DESIGN REFERENCE........................................................................................21
FIGURE 4-6 AUDIO INTERFACE CIRCUIT DESIGN REFERENCE ..........................................................................................22
FIGURE 4-7 ANTENNA INTERFACE.................................................................................................................................23
FIGURE 4-8 RF CABLE INTERFACE.................................................................................................................................24
FIGURE 5-1 MODULE APPEARANCE OF MG815+............................................................................................................ 24
FIGURE 5-2 MODULE APPEARANCE OF ME3000 ............................................................................................................25
FIGURE 5-3 MODULE ASSEMBLY LINE（BOTTOM VIEW） .............................................................................................25
FIGURE 5-4 MAIN BOARD PCB LAYOUT（TOP VIEW） ..................................................................................................25
FIGURE 5-5 FIXING METHOD..........................................................................................................................................26
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MG815+ Module Hardware Design User Manual
Tables
TABLE 1-1 MODULE SPECIFICATION.................................................................................................................................8
TABLE 1-2 MAIN FUNCTIONS AND FEATURES...................................................................................................................8
TABLE 1-3 INTERFACES OF THE MODULES .......................................................................................................................9
TABLE 1-4 TECHNICAL PARAMETERS OF MC8530...........................................................................................................9
TABLE 3-1 PIN DEFINITIONS OF 40 PIN CONNECTOR.....................................................................................................14
TABLE 3-2 PIN DEFINITIONS OF 10 PIN CONNECTOR.....................................................................................................16
TABLE 4-1 VOLTAGE FEATURES .....................................................................................................................................18
TABLE 4-2 ON/OFF TIMING FEATURES..........................................................................................................................19
TABLE 4-3 USB AND UART-2 PIN SN AND NAME........................................................................................................20
TABLE 6-1 PERIPHERALS COMPONENTS.........................................................................................................................27
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MG815+ Module Hardware Design User Manual
1 General Description
This manual is applicable for ME3000/ME3006/MG815+/MG615+/MG415+/MG416+ modules. Except for
antenna design, the hardware/mechanical design is completely compatible with the applications of CDMA
800M, Sec800MHz, 450M and GSM/GPRS. All above modules have voice, SMS and data service function,
which could be used for data transmission, wireless POS, security, lottery, intelligent metering, wireless fax,
small exchangers, tobacco network, campus network, wireless AD, wireless media, medical surveillance,
relay station surveillance, railway terminal, intelligent home appliances, vehicle-mounted surveillance, etc.
Taking MG815+ and ME3000 module as examples, this manual describes the module’s logic structure,
hardware interface and main functions, and provides reference design for the hardware and mechanics.
1.1 Technical Specification
1.1.1 Module Specification
Please refer to table 1-1 for the specifications of 5 types of modules ME3000, MG815+, MG615+, MG415+
and MG416+.
Table 1-1 module specification
Module Models Standard
ME3000 GSM/GPRS Quad Band: GSM 850/EGSM 900/DCS 1800/PCS 1900
MG815+ CDMA 2000 1X 800MHz
MG615+ CDMA 2000 1X Sec800MHz
MG415+ CDMA 2000 1X 450MHz block A
MG416+ CDMA 2000 1X 450MHz block C
Remarks: The modules are compatible on hardware and mechanical design except for frequency. Below is
just an example for MG815+ and ME3000 modules.
Frequency(MHz)
1.1.2 Main Functions and Features
Please refer to Table 1-2 for the Main Functions and Features.
Table 1-2 Main functions and features
Description Item
CDMA GSM
Voice EVRC and 13kQCELP High-quality voice
SMS Support TEXT Support TEXT and PDU
Data 9 Support internal TCP/IP stack
9 Support virtual keep on-line(VKL)
CDMA maximum up/down link data rate 153.6kbps; GSM maximum up-link
data rate 42.8kbps, maximum down-link data rate 85.6kbps.
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MG815+ Module Hardware Design User Manual
1.1.3 Interfaces
Please refer to Table 1-3 for the Interfaces.
Table 1-3 Interfaces of the modules
Description Item
CDMA GSM
UART interface Download software to update
Data communication
Maximum data rate 230.4kbps through the port
Audio interface Double audio I/O channel.
UIM card interface Built-in UIM/R-UIM UIM card interface
Antenna interface 50 Ohm input impedance control
RTC none RTC
1.1.4 Technical parameters
Please refer to Table 1-4 for the Technical parameters of MC8530.
Table 1-4 Technical parameters of MC8530
Description Item
CDMA GSM
Working temperature -30°C ~ +75°C -20°C ~ +80°C
Input voltage 3.3V-4.25V
Maximum current 560mA @ -104 dBm 500mA @ -102 dBm
Idle current 5mA @ -75 dBm 10mA @ -75 dBm
Call current 230mA @ -75 dBm 150mA @ -75 dBm
sensitivity 104 dBm 102dBm
Tx power 23dBm ~ 30dBm (Class III) GSM850,EGSM900:Class4(2W)
GSM1800, PCS1900:Class1(1W)
Frequency range
800MHz
Tx：824~849 MHz
Rx：869~894 MHz
Sec800MHz
Tx：806~821 MHz
Rx：851~DL866 MHz
450MHz A 段
Tx：450~460 MHz
Rx：460~470 MHz
Preferred channel：160，210，260
450MHz C 段
Tx：450~460 MHz
Rx：460~470 MHz
Preferred channel：47，97，147
GSM850
Tx：824~849 MHz
Rx：869~894MHz
EGSM900
Tx：880~915 MHz
Rx：925~960MHz
DCS1800
Tx：1710~1785MHz
Rx 1805~1880MHz
PCS1900
Tx：1850~1910MHz
Rx：1930~1990MHz
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MG815+ Module Hardware Design User Manual
1.2 Relevant Documents
z 《ZTE Dragon tooth wireless module series product catalog》
z 《AT Command Manual for ZTE Corporation's MG815+ Modules》
z 《AT Command Manual for ZTE Corporation's ME3000 Modules》
z 《ZTE MG815+ Module Development Board User Guide》
z 《FAQ for ZTE Corporation's CDMA Modules》
z 《FAQ for ZTE Corporation's GSM/GPRS Modules》
z 《Test References of ZTE Corporation's CDMA Wireless Modules》
1.3 Abbreviations
Abbr. Full name
ADC
AFC Automatic Frequency Control
AGC Automatic Gain Control
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASIC Application Specific Integrated Circuit
BER Bit Error Rate
BTS Base Transceiver Station
CDMA Code Division Multiple Access
CDG CDMA Development Group
CS Coding Scheme
CSD Circuit Switched Data
CPU Central Processing Unit
DAI Digital Audio interface
DAC Digital-to-Analog Converter
DCE Data Communication Equipment
DSP Digital Signal Processor
DTE Data Terminal Equipment
DTMF Dual Tone Multi-Frequency
DTR Data Terminal Ready
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
EMI Electro Magnetic Interference
ESD Electronic Static Discharge
ETS European Telecommunication Standard
FDMA Frequency Division Multiple Access
FR Full Rate
GPRS General Packet Radio Service
Analog-Digital Converter
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MG815+ Module Hardware Design User Manual
GSM Global Standard for Mobile Communications
HR Half Rate
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
LCD Liquid Crystal Display
LED Light Emitting Diode
MCU Machine Control Unit
MMI Man Machine Interface
MS Mobile Station
PCB Printed Circuit Board
PCL Power Control Level
PCS Personal Communication System
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
RAM Random Access Memory
RF Radio Frequency
ROM Read-only Memory
RMS Root Mean Square
RTC Real Time Clock
SIM Subscriber Identification Module
SMS Short Message Service
SRAM Static Random Access Memory
TA Terminal adapter
TDMA Time Division Multiple Access
TE Terminal Equipment also referred it as DTE
UART Universal asynchronous receiver-transmitter
UIM User Identifier Management
USB Universal Serial Bus
VSWR Vo ltage Standing Wave Ratio
ZTE ZTE Corporation
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MG815+ Module Hardware Design User Manual
2 Brief Introduction to MG815+
2.1 Brief Introduction to MG815+
Please refer to Figure 2-1 for the Technical parameters of MG815+.
Figure 2-1 MG815+ principle
2.2 Brief Introduction to ME3000
Please refer to Figure 2-2 for the Technical parameters of ME3000.
Figure 2-2 ME3000 principle
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MG815+ Module Hardware Design User Manual
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MG815+ Module Hardware Design User Manual
3 PIN definitions
The main connector of MG815+ or ME3000 is 40-PIN connector and 10-PIN connector. The distance between
two PINS is 1.27mm. Refer to the figure below:
Figure 3-1 PIN
Refer to table 3-1/3-2 below for PIN definitions:
Table 3-1 PIN definitions of 40 PIN connector
Function Pin No. Signal name
39
MIC_1P I MIC 1 Anode
I/O Basic functions Remarks
37 MIC_1N I MIC 1 Cathode
34 SPK_1P O Receiver 1 Anode
SPK_1N O
MIC_2P I MIC 2 Anode
MIC_2N I MIC 2 Cathode
SPK_2P O Receiver 2 Anode
EAR_AN_DET I
Audio
32
40
38
33
35
36 EAR_DET I
AUXOP O Line output, anode
AUXON O Line output, Cathode
/CTS O Clear to send low level valid.
/RTS I
TXD O
RXD I
Serial
port 1
27
29
12
14
13
11
Receiver 1 Cathode
Earphone button test
Earphone inserting test
Request to send
Transmit data
Receive data
MIC 1 is the default
configuration for audio I/O
when power on, generally
MIC 1 is used for handset,
MIC 2 for earphone
draw up internal，low level
valid
draw down internal， low
level valid
low level valid
15 RI
O Ring indicating signal
14
TTL level.
1. high level when
UIM
card
interface
Serial
port 2 or
USB
interface
MG815+ Module Hardware Design User Manual
initialized;
2. producing a periodic
signal(100ms low,5.9s
high) when received a
ring indicating signal;
3. Back to high level when
the ring indicating
signal is terminated.
17 /DSR
18 DCD
16
/DTR I User circuit is ready low level valid
CARD_DAT
4
A
6 CARD_CLK
8 V_CARD
2 CARD_RST
PIN
Signal name
number
USB_
1
3
5
7
9
OE/TXD2
USB_DATA/
RXD2
USB_VMO/
RTS2
USB_VPO/
CTS2
USB_SUS O NC
O Module is ready low level valid
O Carrier signal testing
I/O
O
Data cable
Clock wire
O 3V power output
O Reset wire
USB
O O
I I
O I
O O
UAR
T
USB UART
To USB
Transceiver
To USB
Transceiver
To USB
Transceiver
The
same to
serial
port 1
To USB
Transceiver
Suspend status
indicating
suspend
GSM module
supports UART but
not USB.CDMA
module supports both
UART and USB, but
software should be
changed with
different interface.
Pin 5 and pin 7 are
available at low level
within UART.
LED
28
30
SMS_LED O
SIG_LED
O
Call/message indicator
Signal indicator
Draw down internal, LED
will be turned on at high
level(with external driver)
Draw down internal, LED
will be turned on at high
level (with external driver).
-Turn on: LED off
-Searching for network:
LED flashes, and it lasts for
about 50ms when it is on,
and the time is flexible when
it is off;
-Idle: LED blinks per
100ms.
--Traffic (call, data): LED
blinks per 500ms
15
Reset
power
reserved
MG815+ Module Hardware Design User Manual
Draw up internal，Low level
26 ON/OFF I
switch control
valid. For details, please
refer to section 4.2 Power
and Reset
Low level valid
Need to connect an open
10 /RESET I
Reset signal
collector or an open drain
switch. For details, please
refer to section 4.2 Power
and Reset
19 V_MAIN
21 V_MAIN
22 V_MAIN
Power
input
Power
input
Power
input
Main power of module
Main power of module
Main power of module
23 GND Ground
24 GND Ground
MG815+ module has a
voltage output pin with
current limited adjuster. It
can be used to supply
external circuit on main
board. the voltage of this
pin, baseband processor and
storage come from the same
25 V_MSM
power
output
Digital power
voltage adjuster. voltage
output is 2.85V when power
on. Users should distribute
current as little as possible
from this pin(less than
10mA). Generally, we
suggest this pin is used to
pull up chips’ pin only when
it needs level match.
Used for module inside,
20 NC
31
NC
need to be suspended
Used for module inside,
need to be suspended
Table 3-2 PIN definitions of 10 PIN connector
Function PIN No. Signal Name I/O Basic functions
power
1 GND GND
2 GND GND
3 GND GND
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Remarks
MG815+ Module Hardware Design User Manual
reserved
4 GND GND
5 NC
6 NC
7 NC
8 NC
9 NC
0 NC
Used for module inside, need to be
suspended
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MG815+ Module Hardware Design User Manual
4 Hardware Interfaces and Design Reference
4.1 Summary
This section describes the function interfaces and usage of MG815+ modules in details, and provides the
designing sample.
z Power and Reset Interface
z Serial Port
z SIM/UIM Card Interface
z Audio Interface
z Antenna Interface
Remarks: In the system, the module layout should be far away from high-speed circuit, switch power, power
transformer, large power inductor, or single chip microcomputer’s clock circui t.
4.2 Power and Reset
Figure 4-1 power and reset circuit design reference
z Power design
The module is powered by V-MAIN, and the voltage feature is below:
Table 4-1 Voltage features
Category Min. Typical Max.
Input voltage 3.3 V 3.9 V 4.25 V
D1 is a LDO with low-valid control, making V_MAIN supplies power to module through adjusting R31and
R41 at 3.9V. Modules have very high requirements on power and ground processing, signals must be filtered.
Power ripple needs to be controlled under 50Mv. Do not supply power to any other part of system, otherwise
RF performance will be compromised. Finally, select the power cables with at least 40mil traces during the
layout and keep the integrality of ground line.
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MG815+ Module Hardware Design User Manual
z Power ON
The module will be turned off after power-on normally. To turn on the module, firstly put /RESET at high level,
and then provide a 1500-2000mS low level pulse to ON/OFF PIN. /Reset needs to connect an open collector or
open drain gate.
z Power OFF
To turn off the module, firstly provide a 1500-2000mS low level pulse to ON/OFF PIN, after 5s or 6s, and put
/RESET at low level.
z Reset
You could turn off the module firstly and then turn it on to reset the module.
ON/OFF timing figure is as follows:
Figure 4-2 ON/OFF timing
Table 4-2 ON/OFF timing features
t
a
t
b
t
c
td t
e
20mS 10mS 2S 2S 6S
z V_MSM
There is a voltage output pin with current adjuster, which can be used to supply external power to the board.
The voltage of this pin and the voltage of baseband processor/memory come from the same voltage adjuster.
The voltage output is available only when the module is on. The normal output voltage is 2.85V, and the user
should absorb the current from this pin as little as possible (less than 10mA). Generally, it is recommended to
use this pin to match the level. When the module is off, the output voltage for this pin remains unchanged, but
the impedance is rather high. Therefore, it’s not recommended to use this pin for other purposes.
z Other Advice
In order to make sure the data is saved safely, please don’t cut off the power when the module is on. It’s
strongly recommended to add battery or soft switch like the power key on the mobile phone.
4.3 Serial Port
The module provides 2 UART transceivers and its logic functions conform to RS-232 interface standard. These
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MG815+ Module Hardware Design User Manual
two UART could be used as serial port data interfaces to transmit data, provide test and debug channel, and
download the software for upgrade.
Refer to Fig 4-3 when UART 1 is used as MCU:
Figure 4-3 UART to MCU interface
It is noted that the interface level of UART provided by the module shall conform to CMOS level, while not
meet the requirements specified by RS-232 interface standard. If it is required to connect with the devices
through standard RS-232 interface during the applications, second development designers must add transfer
chip into their own designing, and use UART pins according to CMOS interface designing requirements. It’s
recommended to use 3V for UART level. MCU_BUT is the reset button.
It’s specially noted that users need to extend UART 1 or UART 2 to update software, if they’d like to connect
module to DTE in the design phase.
Refer to Fig 4-4 for UART 1 signal diagram:
Figure 4-4 UART 1 Signal Diagram
The corresponding PINS of UART 2 are for both UART and USB. GSM modules support UADT, but not USB;
while CDMA modules support USB and UART both. Please refer to table 4-3 for details.
Table 4-3 USB and UART-2 Pin SN and Name
Signal name UART USB pin
USB_ OE/TXD2 TXD2 USB_ OE 1
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MG815+ Module Hardware Design User Manual
USB_DATA/RXD2 RXD2 USB_DATA 3
USB_VMO/ RTS2 RTS2 USB_VMO 5
USB_VPO/ CTS2 CTS2 USB_VPO 7
USB_SUS USB_SUS 9
4.4 SIM/UIM Card Interface
Modules support 3V SIM/UIM card, SIM/UIM terminal includes 4 pins. V_CARD is used to supply SIM/UIM
card. It’s strongly recommended to add ESD to protect SIM/UIM card in hostile environments. D2 in the
following layout is for ESD:
Figure 4-5 SIM/UIM card interface design reference
NOTE: A 10k resistor is required for CARD_DATA pin to be draw up to V_CARD pin, because there are
different SIM/UIM cards with quite different output currents. SIM/UIM card PCB circuit should be laid closely
around the module as possible as you can, to avoid the interference of reading/writing from other sources.
4.5 Audio Interface
The module provides audio input and output through MIC_2P. There are 2 speaker interfaces, 2 microphone
interfaces and 1 line output. Only one pair I/O works at the same time.
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MG815+ Module Hardware Design User Manual
Figure 4-6 audio interface circuit design reference
z Microphone
The system connector provides two microphone interfaces MIC_1 and MIC_2, which are both differential
interface. They could be also used as single ended input (for example: earphone). It’s recommended to use
differential mode to reduce the noises. These two input are coupled in AC domain and added a 1.8V offset
voltage inside, and they should directly connect with the receiver.
z Speaker
The system connector provides two speakers, SPK_1 & SPK_2. The former is differential interface, and the
latter is single-ended interface, usually used for earphone. They both have 32 ohm impedance.
z Line output
The MIC_2P connector provides a differential line output via AUXOP and AOXON. The impedance is 8 ohm.
CDMA module audio interface is designed as below:
z Design of audio interface on the handset
Select the microphone with the sensitivity lower than -52dB since the output power for SPK_1 is 35mW and
the max. gain in MIC_1 reaches 52dB. The level of MIC_1P PIN is about 1.8V.
Note: if other kind of audio input method is adopted, the input signal should be within 2V. If the signal voltage
is lower than 2V, then the pre-amplifier should be added. If the signal voltage is higher than 2V, then network
attenuation should be added.
z Design of audio interface on the receiver
Select the microphone with the sensitivity lower than -52dB since the output power for SPK_2 is 8.8mW and
the max. gain in MIC_2 reaches 52dB. The level of MIC_2P PIN is about 1.8V. The receiver’s design is just the
same as the handset’s.
GSM/GPRS module audio interface is designed as below:
z Design of audio interface on the receiver
Select the microphone with the sensitivity lower than -51.5dB since the output impedance for SPK_1 is 32 ohm
and the max. gain in MIC_1 reaches 51.5dB. The level of MIC_1P PIN is about 2.5V.
Note: if other kind of audio input method is adopted, the input signal should be within 0.5V. If the signal
voltage is lower than 0.5V, then the pre-amplifier should be added. If the signal voltage is higher than 0.5V,
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MG815+ Module Hardware Design User Manual
then network attenuation should be added .
z Design of audio interface on the earphone
Select the microphone with the sensitivity lower than -51.5dB since the output impedance for SPK_2 is 32 ohm
and the max. gain in MIC_2 reaches 51.5dB. The level of MIC_2P PIN is about 2.5V. The receiver’s design is
just the same as the handset’s.
4.6 Antenna Interface
The module provides two types of RF connector:
z Extended jointing connector
z RF testing socket
PCB jointing connector is used to connect module with antenna by 50 ohm RF shielding cable to cut down the
cost. But it’s not a complete way to shield EMI, and RF signal quality may be trivially affected. So if you
decide to use this method, intense radiation must keep far away from PCB jointing connector. At the same time,
you must ensure that core line of RF shielding cable has been jointed to PCB jointing connector, and the
shielding metal wire netting on the RF cable has been jointed to GND of module. According to the figure below,
the grounding part must be jointed firmly, otherwise, the core cable may be ruptured caused by shielding cable
shaking.
Figure 4-7 Antenna Interfac e
Antenna test socket is used for calibration and testing. It connects module with antenna conveniently by
appropriative 50 ohm socket to SMA connecting cable. The touch impedance of this socket is so tiny, and
shielding characteristics are excellent. The impedance of antenna test socket is 50 ohm, its type is
MM9329-2700B, please refer to socket manual provided by supplier to choose relative plugs. This is the
antenna cable interface:
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MG815+ Module Hardware Design User Manual
Figure 4-8 RF cable interface
Proper measures should be taken to reduce the access loss of effective bands, and good shielding should be
established between external antenna and RF connector. Besides, external RF cables should be kept far away
from all interference sources such as high-speed digital signal or switch power supply.
According to mobile station standard, stationary wave ratio of antenna should be between1.1 to 1.5, and input
impedance is 50 ohm. Different environments may have different requirements on the antenna’s gain. Generally,
the larger gain in the band and smaller outside the band, the better performance the antenna has. Isolation
degree among ports must more than 30dB when multi-ports antenna is used. For example, between two
different polarized ports on dual-polarized antenna, two different frequency ports on dual-frequency antenna, or
among four ports on dual-polarized dual-frequency antenna, isolation degree should be more than 30dB.
5 Mechanical
5.1 Appearance
Figure 5-1 module appearance of MG815+
z Dimensions: 44.0 mm（length）x 28.0mm（width）x 7.6mm（height）
z Weight: 8.5g
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MG815+ Module Hardware Design User Manual
Figure 5-2 module appearance of ME3000
z Dimensions: 44.0 mm（length）x 28.0mm（width）x 7.6mm（height）
z Weight: 8g
5.2 Module Assembly Line
Figure 5-3 Module assembly line（bottom view）
5.3 Main board PCB layout
Figure 5-4 main board PCB layout（top view）
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MG815+ Module Hardware Design User Manual
5.4 Fixing Method
The fixing metal sheet is made of stainless steel，and there are two fixing methods: jointing or inserting bolt.
Refer to Fig 5-5 for product specification:
Figure 5-5 fixing method
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MG815+ Module Hardware Design User Manual
6 Peripherals components
Table 6-1 Peripherals components
Models SN Supplier Website
MIC29302WU D1 MICREL www.micrel.com
UCLAMP0504A.TCT//
NZQA5V6XV5T1G
IDT74FCT3244Q8//
PI74FCT3244Q
SQPOFZ-40-S1-VB-0 X01 stwxe www.stwxe.com.cn
QPOFY-10S1-VB-024 X02 stwxe www.stwxe.com.cn
M-C707 10M006 097 2 X03 AMPHENOL www.amphenol.com
D2 SEMTECH//
ON
D3 PERICOM//
IDT
www.semtech.com
www.onsemi.com
www.pericom.com
www.idt.com
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