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ZTE MG2636 Module Hardware Design
User Manual
Version: V1.0
This user manual is for MG2636 module
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Copyright Statement
Copyright © 2010 by ZTE Corporation
All rights reserved.
No part of this publication may be excerpted, reproduced, translated or utilized in any form or by any
means, electronic or mechanical, including photocopying and microfilm, without the prior written
permission of ZTE Corporation.
is the registered trademark of ZTE Corporation. All other trademarks appeared in this
manual are owned by the relevant companies.
ZTE Corporation reserves the right to make modifications on print errors or update specifications in
this manual without prior notice.
ZTE Corporation keeps the right to make the final explanation to this manual.
1.0-TY edition in Apr. 2010
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With strong technical force, ZTE Corporation can provide CDMA/GPRS module customers with the
following all-around technical support:
1. Provide complete technical documentation;
2. Provide the development board used for R&D, test, production, after-sales, etc.;
3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;
4. Provide test environment;
ZTE Corporation provides customers with onsite supports, and also you could get supports through
telephone, website, instant communication, E-mail, etc.
The module website module.ztemt.com.cn provides the relevant industry information and module
technical documentation. The authorized module customers could download the latest technical
documentation for our website. If you have more requirements, you could send an E-mail to
module@zte.com.cn
. You can also call us at 0755-86140899 for more supports.
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Preface
Summary
This user manual is for MG2636 modules. It takes MG2636 modules for example to give the reference
to the relevant hardware and mechanical design. This manual could instruct the users how to quickly
and conveniently design different kinds of wireless terminals based on this type of module.
Target Readers
System designing engineers
Mechanical engineers
Hardware engineers
Software engineers
Test engineers
Brief Introduction
This manual contains 4 chapters. See the table below:
Chapter Contents
1. General Description Introduces MG2636 module’s basic functions, principle diagrams,
application diagrams, the relevant documents for reference.
2. PIN Definitions Introduces MG2636 module’s PIN name and functions.
3. Description of Hardware
Interface
4. Mechanical Design Introduces MG2636 module’s appearance diagram and assembly
Introduces the design of the hardware interface on each part of MG2636
modules.
diagram.
Update History
The update history records the document’s update descriptions every time. The updates of all
previous versions will be contained in the latest version.
Document Version V1.0 (2010-04-22)
The document is formally released on Apr. 22, 2010.
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Contents
1 General Description...................................................................................................................... 7
1.1 Functions ........................................................................................................................................7
1.2 Principle Diagrams .........................................................................................................................9
1.3 Application Diagrams ...................................................................................................................10
1.4 Relevant Documents .................................................................................................................... 11
1.5 Acronyms......................................................................................................................................11
2 PIN Definitions............................................................................................................................14
2.1 Module’s PIN Diagram..................................................................................................................14
2.2 50-Pin B2B Connector Interface Definitions.................................................................................15
3 Decription of Hardware Interfaces .............................................................................................. 18
3.1 Summary ......................................................................................................................................18
3.2 Power and Reset..........................................................................................................................18
3.2.1 Power ................................................................................................................................18
3.2.2 Power On/Off ....................................................................................................................19
3.2.3 Reset .................................................................................................................................20
3.3 COM Port......................................................................................................................................20
3.4 SIM Card Interface .......................................................................................................................21
3.5 Audio Interface .............................................................................................................................22
3.5.1 Microphone .......................................................................................................................23
3.5.2 Receiver ............................................................................................................................23
3.6 DAI (Digital Audio Interface) .........................................................................................................23
3.7 Network Status LED Interface ......................................................................................................24
3.8 Antenna Interface .........................................................................................................................24
4 Mechanical Design ..................................................................................................................... 26
4.1 Appearance Diagram ...................................................................................................................26
4.2 Assembly Diagrams .....................................................................................................................26
4.2.1 MG2636 Module’s Assembly Diagram Dimensions..........................................................27
4.2.2 B2B Connector Socket......................................................................................................27
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Figure Contents
Figure 1-1 Module’s principle diagrams................................................................................................9
Figure 1-2 Module’s application diagrams ..........................................................................................10
Figure 2.1 Module’s PIN Diagram.......................................................................................................14
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Table Contents
Table 1-1 Table of functions .................................................................................................................7
Table 1-2 Table of Acronyms .............................................................................................................11
Table 2-1 50-Pin B2B Connector Interface Definitions .......................................................................15
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1 General Description
This user manual is for MG2636 modules. Refer to this manual to make your hardware and
mechanical design fully compatible with GSM/GPRS applications, except for antenna design. With
the function of voice, SMS and data service, ZTE MG2636 module can be used for data transmission,
wireless POS, security and surveillance, lottery terminal, intelligent metering system, wireless fax,
small switch, tobacco communication system, campus communications, wireless AD, wireless media,
medical surveillance, direct discharge station surveillance, railway terminals, intelligent home
appliances and vehicle-mounted monitoring, etc.
This manual describes MG2636 module’s logic structure, hardware interface & major functions,
and provides references to the hardware and mechanical design.
1.1 Functions
Table 1-1 Table of functions
Basic functions Descriptions
Work frequency
(Dual band:
EGSM9000/
DCS1800)
Rx. Sensitivity <-106 dBm
Work
temperature
Voltage 3.4V~4.7V (recommended value: 3.8V)
Power
consumption
(current)
Application
interface (50Pin
B2B connector)
DCS1800
EGSM900: Class4 (2W) 31~35dBm (typical value: 33 dBm) Max. Tx power
DCS1800: Class1 (1W) 28~32dBm (typical value: 30 dBm)
Normal work temperature: -20°C~+55°C
Expanded work temperature: -30°C~+70°C
Storage temperature: -40°C~+85°C
Power off current: 50uA
Standby average current: 2.5mA
GPRS Class10 (MAX): 300mA
UART0 interface (8-wire hardware flow control, max. data rate: 921600bps),
support download and data communication
UART1 interface (4-wire hardware flow control, max. data rate: 921600bps)
Standard SIM card interface (1.8V/3.0V), support R-UIM
2CH analog audio I/O interface, using differential signals
1CH serial digital audio interface, using PCM encoding analog audio signal to
digital signal
Power management interface (including power interface and charge interface)
Network status indication interface (different network status indicated by LED’s
different flashing modes )
Power on-off interface (externally power on/off the module through the interface
(indirect switch power) )
Reset interface (externally reset the module through the interface)
Transmit (uplink: MS→BTS): 880~915 MHz EGSM900
Receive (downlink: BTS→MS): 925~960 MHz
Transmit (uplink: MS→BTS) : 1710~1785 MHz
Receive (downlink: BTS→MS): 1805~1880 MHz
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MURATA: MM9329-2700RA1 50-ohm antenna connector Antenna
interface
Antenna’s welding pad
Protocol Support GSM/GPRS Phase2/2+
AT command
Refer to《AT Command Set User Manual of ZTE Corporation’s MG2636 modules》
Support FR, EFR, HR and AMR audio encoding Voice
Support hands-free talk, echo suppression function
SMS
Support MO and MT
Support Point to Point and cell broadcast
Support TEXT and PDU
GPRS
GPRS CLASS 10
Encoding method: CS 1,CS 2,CS 3,CS 4
Max. downlink transmitting rate: 85.6 kbps
Max. uplink transmitting rate: 42.8 kbps
Support PBCCH and virtual online;
Embedded TCP/IP protocol: support multi-link, provides ACK and large capacity
cache;
Support CSD data service, max. data rate: 14.4Kbit/s Circuit domain
data service
Supplementary
Support USSD
Incoming caller ID presentation, call forwarding, call held, call waiting, etc.
service
Dimensions: 35±0.10 x 32.5±0.10 x 3.85±0.20 mm Physical
features
ROHS
Weight: 7.0 g
Meet the requirements of ROHS
environment
protection
CE certification Meet the requirements of CE
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1.2 Principle Diagrams
Figure 1-1 Module’s principle diagrams
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1.3 Application Diagrams
Figure 1-2 Module’s application diagrams
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1.4 Relevant Documents
《AT Command Manual for ZTE Corporation's MG2636 Modules》
《ZTE Corporation GPRS modules FAQ》
《Wireless modules’ Test References》
1.5 Acronyms
Table 1-2 Table of Acronyms
A
ADC
AFC
AGC
ARFCN
ARP
ASIC
B
BER
BTS
C
CDMA
CDG
CS
CSD
CPU
D
DAI
DAC
DCE
DSP
DTE
DTMF
DTR
E
EDGE
EFR
EGSM
Analog-Digital Converter
Automatic Frequency Control
Automatic Gain Control
Absolute Radio Frequency Channel
Number
Antenna Reference Point
Application Specific Integrated Circuit
Bit Error Rate
Base Transceiver Station
Code Division Multiple Access
CDMA Development Group
Coding Scheme
Circuit Switched Data
Central Processing Unit
Digital Audio interface
Digital-to-Analog Converter
Data Communication Equipment
Digital Signal Processor
Data Terminal Equipment
Dual Tone Multi-Frequency
Data Terminal Ready
Enhanced Data Rate for GSM Evolution
Enhanced Full Rate
Enhanced GSM
模数转换
自动频率控制
自动增益控制
绝对射频信道号
天线参考点
专用集成电路
比特误码率
基站收发信台
码分多址
CDMA 发展组织
译码图案
电路交换数据
中央处理单元
数字音频接口
数模转换
数据通讯设备
数字信号处理
数据终端设备
双音多频
数据终端准备好
提高数据速率的 GSM 演进技术
增强型全速率
增强型 GSM
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EMC
EMI
ESD
ETS
F
FDMA
FR
G
GPRS
GSM
H
HR
I
IC
IMEI
ISO
ITU
L
LCD
LED
M
MCU
MMI
MS
MTBF
P
PCB
PCL
PCS
PDU
PLL
PPP
R
RAM
RF
Electromagnetic Compatibility
Electro Magnetic Interference
Electronic Static Discharge
European Telecommunication Standard
电磁兼容
电磁干扰
静电放电
欧洲通信标准
Frequency Division Multiple Access
Full Rate
频分多址
全速率
General Packet Radio Service
Global Standard for Mobile
通用分组无线业务
全球移动通讯系统
Communications
Half Rate
半速率
Integrated Circuit
International Mobile Equipment Identity
International Standards Organization
International Telecommunications Union
集成电路
国际移动设备标识
国际标准化组织
国际电信联盟
Liquid Crystal Display
Light Emitting Diode
液晶显示器
发光二极管
Machine Control Unit
Man Machine Interface
Mobile Station
Mean Time Before Failure
机器控制单元
人机交互接口/人机界面
移动台
平均故障间隔时间
Printed Circuit Board
Power Control Level
Personal Communication System
Protocol Data Unit
Phase Locked Loop
Point-to-point protocol
印刷电路板
功率控制等级
个人通讯系统
协议数据单元
锁相环
点到点协议
Random Access Memory
Radio Frequency
随机访问存储器
无线频率
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ROM
RMS
RTC
Read-only Memory
Root Mean Square
Real Time Clock
只读存储器
均方根
实时时钟
S
SIM
SMS
SMT
SRAM
Subscriber Identification Module
Short Message Service
Surface Mount Technology
Static Random Access Memory
用户识别卡
短消息服务
表面安装技术
静态随机访问存储器
T
TA
TDMA
TE
Terminal adapter
Time Division Multiple Access
Terminal Equipment also referred it as
终端适配器
时分多址
终端设备，也指 DTE
DTE
U
UART
Universal asynchronous
通用异步接收/发送器
receiver-transmitter
UIM
USB
USIM
User Identifier Management
Universal Serial Bus
Universal Subscriber Identity Module
用户身份管理
通用串行总线
用户识别模块
V
VSWR
Voltage Standing Wave Ratio
电压驻波比
Z
ZTE
ZTE Corporation
中兴通讯股份有限公司
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2 PIN Definitions
Adopting 50-Pin B2B connector interface, MG2636 module has 50 pins with the distance 0.5mm
between the pins.
2.1 Module’s PIN Diagram
Figure 2.1 Module’s PIN Diagram
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2.2 50-Pin B2B Connector Interface Definitions
Table 2-1 50-Pin B2B Connector Interface Definitions
Functions PIN No. Definitions I/O Descriptions
1 SIM-CLK O SIM card clock
2 SIM-VCC O SIM card power Max. output current 20mA
3 SIM-DATA I/O SIM card data
4 SIM-RST O SIM card reset
5 ISENSE AI Current inductor detect
current
6 SIM-GND P SIM card GND SIM card’s GND PIN and
7 DAIRXD I DAI: receive data internal pull-down(51.1KΩ)
8 DAISYNC O DAI: frame SYNC
9 DAICLK O DAI: clock internal pull-down(51.1KΩ)
10 DAITXD O DAI: transmit data
11 DAIRST O DAI: reset internal pull-down(51.1KΩ)
12 BATT_TEMP AI Battery ID or battery
temperature detection
13 SIG_LED O Network signal LED High level LED ON, need
14 RXD1 O UART1 corresponding to
DTE’s RXD
15 RXD0 O UART0 corresponding to
DTE’s RXD
16 TXD1 I UART1 corresponding to
DTE’s TXD
17 TXD0 I UART0 corresponding to
DTE’s TXD
18 BAT_BACKUP P Real-time clock (RTC)
backup power
19 CHRIN P External charge power
detection input
SIM-GND PIN must connect
with the module’s power GND.
Analog input voltage range:
0~2.8V
externally connect dynatron
driver
internal pull-down(75KΩ)
internal pull-down(75KΩ)
internal pull-down(75KΩ)
internal pull-down(75KΩ)
Connect button battery or
large capacitor. Input: 2.2~5V;
max. output: 2.6~2.85V;under
POWER DOWN mode, min.
input: 1.3V.
4.2V~8V (recommended
5.5V), external connect the
charge power with the current
no less than 800mA. This pin
is just used as diction. And It
will be hung out when not
used.
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20 GATEDRV O Battery charge control
Valid at low level
switch
21 GND P
GND
22 GND P
23 GND P
24 GND P
25 GND P
26 BATT+ P
27 BATT+ P
28 BATT+ P
29 BATT+ P
30 BATT+ P
Work current anode input 3.4V~4.7V (recommended
3.8V), as the module
transmits with the max. power,
the current will instantly reach
1.6A. The min, value of
BATT+ voltage is no lower
than 3.3V, and the current no
lower than 2A.
31 VDDIO O Module output digital
interface voltage
Typical value: 2.85V(MIN:
2.75V,MAX: 2.95V,MAX
current: 150mA). There is
voltage output only as the
module is powered on. And It
will be hung out when not
used.
32 RING0 O UART0 corresponding to
internal pull-down(75KΩ)
DTE’s RING
33 DSR0 O UART0 corresponding to
internal pull-down(75KΩ)
DTE’s DSR
34 RTS0 I UART0 corresponding to
internal pull-down(75KΩ)
DTE’s RTS
35 DTR0 I UART0 corresponding to
internal pull-down(75KΩ)
DTE’s DTR
36 RTS1 I UART1 corresponding to
internal pull-down(75KΩ)
DTE’s RTS
37 CTS0 O UART0 corresponding to
internal pull-down(75KΩ)
DTE’s CTS
38 CTS1 O UART1 corresponding to
internal pull-down(75KΩ)
DTE’s CTS
39 DCD0 O UART0 corresponding to
internal pull-down(75KΩ)
DTE’s DCD
40 SYSRST_N I Module’s reset Valid at low level, need
externally connect dynatron
driver. It’s recommended to
parallel connect 0.1uF
capacitor to GDN for ESD
protection near 50-pin B2B
connector.
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41 PWRKEY_N I Module’s power on/off Valid at low level, need
externally connect dynatron
driver.
42 AGND P GND
43 MIC1_N AI 1CH audio input cathode
44 MIC1_P AI 1CH audio input anode
45 MIC2_P AI 2CH audio input anode
Default audio I/O is the first
channel. Usually the first
channel is used for the
receiver and the second
channel used for headset or
hands-free.
46 MIC2_N
AI
2CH
audio
input
cathode
47 SPK1_N AO 1CH audio output cathode
48 SPK1_P AO 1CH audio output anode
49 SPK2_P AO 2CH audio output
anode(right ear)
50 SPK2_N AO 2CH audio output
cathode(left ear)
Note: 1） I－representing digital signal input PIN; O－representing digital signal output PIN;
AI － representing analog signal input PIN; AO － representing analog signal input PIN; ； P －
representing power PIN;
2）UART0 and UART1 are named by DCE PIN signals.
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3 Decription of Hardware Interfaces
3.1 Summary
This chapter introduces MG2636 module’s each function & its operation descriptions, and provides
the designing sample.
Power interface
Charge interface
Power on/off interface
Reset interface
UART interface (2CH)
SIM Card
Audio Interface (2CH analog audio interface)
DAI interface (1CH digital audio interface)
Network signal indication interface
Antenna interface
Other
3.2 Power and Reset
3.2.1 Power
MG2636 GSM module requires VBAT and real-time clock BAT_BACKUP to work normally. For
details, please see the following table 3-1 Power PIN Interface Definitions.
Table 3-1 Power PIN Interface Definitions
PIN No. Signal Name I/O Descriptions of
Functions
21～25
26～30
18 BAT_BACKUP P Real-time
MG2636 module requires external power supply and the power supply voltage ranges from
3.4V～4.7V (typical value 3.8V). The external power supplies the power to the module through B2B
connector’s VBAT PIN. As the module transmits with the max. power, the current will instantly reach
GND P GND
BATT+ P Work Power
Anode Input
Clock (RTC)
Backup
3.4V~4.7V (recommended 3.8V), as
the module transmits with the max.
power, the current will instantly reach
1.6A. The min, value of BATT+
voltage is no lower than 3.3V, and the
current no lower than 2A.
Connect button battery or large
capacitor. Input: 2.2~5V; max. output:
2.6~2.85V;under POWER DOWN
mode, min. input: 1.3V.
Remarks
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about 1.6A and VBAT voltage will fall down, however the min, value of BATT+ voltage must be no
lower than 3.4V. The external power can provide the current required at MAX. Tx. Power, and it’s
recommended to use LDO or switch power with the output current larger than 2A and a 100uF energy
storage capacitor is parallel connected at the power end of the module. In order to guarantee the
supply of current, use 5PIN on the power loop as the power supply and GND return current
respectively.
BAT_BACKUP is real-time backup input interface of MG2636 GSM module. As VBAT is ON,
real-time clock could supply power through VBAT; as VBAT is not ON, BAT_BACKUP will supply the
backup power for real-time clock. BAT_BACKUP can use the battery to supply the power and the
battery voltage ranges from 2.8～5V. If the backup battery is not used, it could externally connect the
capacitor. The value of capacitor decides the clock’s duration as VBAT is not ON. The calculation
formula is as below: t=C/15; t represents the real-time clock’s duration (unit: s), and C represents the
value of capacitor (unit: uF). The required current is about 15uA as MG2636 modules maintains the
real-time clock function upon the power cut-off. The following figure is the charge reference circuit of
RTC backup battery or capacitor.
Figure 3-1 MG2636 Module’s RTC Backup Battery/Capacitor Reference Circuit
AS VBAT> backup battery, it can charge the backup battery, and the charging cut-off voltage is
3.3V; as the battery does not work, RTC work current is 15uA.
3.2.2 Power On/Off
The module is under power-off status after it’s normally powered on. To turn on the module,
provide a 2000-3000mS low level pulse to PWRKEY_N pin when the module is OFF.
In Data mode, if you connect VCHG to VPH_PWR, the module will be automatically powered on.
It’s specially noted that PWRKEY_N is valid at low level, which is required externally to connect
dynatron driver. It’s recommended to parallel connect 0.1uF capacitor to GDN for ESD protection near
50-pin B2B connector
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3.2.3 Reset
SYSRST_N PIN is used to reset the module’s main chip, and SYSRST_N signal needs to be
pulled down 200ms to reset the module. Likewise, this pin is required externally to connect dynatron
driver and parallel connect 0.1uF capacitor to GDN to prevent SYSRST_N signal from external
interference. And it’s noted that the wiring of 50pin connector must be as short as possible.
3.3 COM Port
The module provides 1CH serial interface, supports 8-wire serial BUS interface or 4-wire serial
BUS interface or 2-wire serial interface. The module communicates with the external devices and
inputs AT commands through UART interface. UART supports programmable data width,
programmable data stop bit, programmable parity check or no check, and UART port supports from
300bit/s to 921.6kbit/s baud rate. The default baud rate is 115200bit/s and it supports baud rate
storage upon power drop.
MG2636 module can directly connect the same signal name of DTE devices. Please see table
3-2 module UART signal names and figure 3-2 for the connection diagram between the module and
DTE device.
Table 3-2 MG2636 module UART external device’s signal names and functions
PIN No. Signal Name I/O Descriptions of Functions Remarks
32 RING0 O UART0 port, corresponding
to DTE’s RING port
33 DSR0 O UART0 port, corresponding
to DTE’s DSR port
34 RTS0 I UART0 port, corresponding
to DTE’s RTS port
35 DTR0 I UART0 port, corresponding
to DTE’s DTR port
36 RTS1 I UART1 port, corresponding
to DTE’s RTS port
37 CTS0 O UART0 port, corresponding
to DTE’s CTS port
38 CTS1 O UART1 port, corresponding
to DTE’s CTS port
39 DCD0 O UART0 port, corresponding
to DTE’s DCD port
Internal pull-up（75KΩ）
Internal pull-up（75KΩ）
Internal pull-up（75KΩ）
Internal pull-up（75KΩ）
Internal pull-up（75KΩ）
Internal pull-up 75KΩ）
Internal pull-up（75KΩ）
Internal pull-up（75KΩ）
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Figure 3-2 MG2636 module external DTE device’s circuit connection diagram
MG2636 module can communicate with RXD and TXD of single chip microcomputer to compose
the simplest 2-line mode. It’s noted that MG2636 module’s PIN level typical value is 2.8V, and
interface level range 2.4V～3.1V.
Likewise, the module can also communicate with the standard RS232 device. Due to the different
interface level, 232 chip must be added for level conversion, e.g., use MAX3232 for 2-wire serial port
and use MAX3238 for 8-wire serial port. The connection is the same as DTE device above.
3.4 SIM Card Interface
The module supports 1.8V/3V UIM card, and there are 4 pins at the terminal of the card.
VREG_RUIM is used to supply the UIM card. It’s strongly recommended to add ESD to protect the
UIM card in hostile environments. FV2 in figure 4-4 is ESD protection device:
MG2636 module baseband processor integrates SIM card interface conforming to ISO 7816-3
standard, and it’s compatible with SIM card with two voltages 1.8V/3.0V and reserves SIM card
interface signal on B2B connector.
Users should note that SIM card’s electrical interface definitions are the same as SIM card
socket’s definitions. See table 3-3 for MG2636 module’s B2B connector’s interface definitions.
Table 3-3 MG2636 module’s SIM card signal
PIN No. Signal Name I/O Descriptions of
Functions
1 SIM-CLK O SIM card clock
2 SIM-VCC O SIM card power Max. output current
3 SIM-DATA I/O SIM card data
4 SIM-RST O SIM card reset
6 SIM-GND P SIM card GND SIM card’s GND PIN
and SIM-GND PIN must
connect with the
Remarks
20mA
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module’s power GND.
Figure 3-3 Standard SIM card PIN Definitions
As shown in figure 3-4, the module connects the external SIM card and SIM-VPP could directly
connect SIM-VCC. 33 ohm resistor on 3 wires has been parallel connected with the capacitor to
guarantee the compatibility of SIM card with different electrical performances; meantime it can also
meet the requirements of EMC test standards.
Figure 3-4 Connection Diagram of MG2636 module and external SIM card
Besides, since SIM card design should meet the requirements of ESD electrical performances to
avoid the damage of SIM card, it’s recommended to add TVS component on 4-CH SIM card signal,
meantime, the signal wire need first pass TVS component and enter the module’s baseband
processor to avoid the damage of module.
3.5 Audio Interface
MG2636 GSM module supports 2CH audio signal input/output. When it’s used for hand held
devices, the hand held MIC, hand held receiver or hands-free speaker, headset MIC, headset receiver
could be divided. See table 3-4 for the audio interface signals.
Table 3-4 MG2326 module’s audio input signals
PIN No. Signal Name I/O Descriptions of Functions Remarks
43 MIC1_N AI 1CH audio input cathode
44 MIC1_P AI 1CH audio input anode
45 MIC2_P AI 2CH audio input anode
46 MIC2_N AI 2CH audio input cathode
47 SPK1_N AO 1CH audio output cathode
48 SPK1_P AO 1CH audio output anode
!st channel is the
default audio
input/output. Usually
st
1
channel used for
receiver, 2
nd
channel used for
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49 SPK2_P AO 2CH audio output anode
（right ear）
50 SPK2_N AO
2CH audio output anode（left
ear）
headset or
hands-free.
3.5.1 Microphone
The two microphone interfaces MIC1 and MIC2 are both differential interfaces, which could also
be used for single-end input. It’s recommended to use differential mode and meet the requirements of
differential signals during the wiring layout and the wiring must be as short as possible to reduce the
noises. These two inputs are coupled in AC domain and added a 1.8V offset voltage inside, and they
should directly connect with the microphone.
ON the circuit design, add 33pF filter capacitor to the audio signal wire to reduce the
interferences caused by the external antenna; meantime add TVS components accordingly.
3.5.2 Receiver
The receiver interfaces are SPK_1 and SPK_2. SPK_1 is differential interface with 32Ω
resistance; SPK_2 is the single-end interface with 32Ω resistance. Due to the differences between
SPK_1 and SPK_2, SPK_1 is usually used as hand hold device’s Receiver, and SPK_2 is used for
headset’s left/right ears.
Note: Differential design of audio signals could suppress the noise, and the PCB wiring must be
as short as possible. The differential signals must be kept far away from the power, RF and antenna
circuit.
3.6 DAI (Digital Audio Interface)
DAI digital audio interface adopts PCM encoding from analog signal to digital signal, which could
connect with devices for digital audio communications, such as Bluetooth device, and it is convenient
for users to develop peripheral audio communicating system.
Table 3-5 MG2636 module DAI
PIN No. Signal Name I/O Descriptions of
Functions
7 DAIRXD I DAI: Rx data Internal pull-down
(51.1KΩ)
8 DAISYNC O DAI: frame SYNC
9 DAICLK O DAI: clock Internal pull-down
(51.1KΩ)
10 DAITXD O DAI: Tx data
11 DAIRST O DAI: reset Internal pull-down
(51.1KΩ)
Remarks
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3.7 Network Status LED Interface
MG2636 GSM module provides a network status LED interface (SIG_LED), which outputs pulse
signal to control the blinking frequency of LED and indicate different network status through the
definitions of LED’s blinking modes. For details, please refer to table 3-6.
Table 3-6 MG2636 module’s network status definitions
SIG_LED PIN Output Status Work or Network Status
Output high level Module startup
Continue high level Module calling
Continue low level Deep sleep
Period 1s, high level output 0.1s No SIM card, not enter PIN or searching
network
Period 3s, high level output 0.1s Registered to network, IDLE
Period 0.125s, high level output 0.1s GPRS data transmitting
SIG_LED PIN output status is defined according to the software protocol, and users could judge
the module’s work status according to SIG_LED status.
SIG_LED PIN is common I/O port, which can’t directly drive LED, and it needs to work with
dynatron. For detailed circuit, please see figure 3-5.
Figure 3-5 SIG_LED driver LED reference circuit
3.8 Antenna Interface
The module provides two kinds of antenna interface:
PCB welding pad
Antenna test socket
PCB welding pad adopts 50Ω RF shield cable to connect the module and the antenna, in order to
reduce the cost. However, this method can not completely shield the electromagnets, which might
have slight influence on RF signal quality. Please note that there should not be strong radiation near
the welding pad. Meantime, during the welding, make sure the core of RF shield cable must connect
with RF welding pad, and RF shield cable’s shield metal mask must be welded to the module’s GND.
During the welding, the GND must be welding securely, otherwise, the core is easily broken due to the
shaking of shield cable. See figure 3-6 for RF welding pad antenna.
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GSM Modules
Figure 3-6 MG2636 module RF welding pad antenna
The antenna test socket is used for the module’s calibration and test. The contact resistance is small
and the shielding is good. An exclusive 50Ω socket to SMA connection cable is used to connect the
module and the antenna. The antenna test socket’s resistance is 50Ω. The antenna test socket’s part
number is MM9329-2700B. Please refer the socket manufacturer’s manual to select the relevant
antenna to connect the plug and module.
Figure 3-7 MG2636 module’s RF test socket
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4 Mechanical Design
4.1 Appearance Diagram
MG2636 module’s appearance
Figure 3-8 MG2636 module’s appearance
Dimensions（LxWxH） :
Weight: 7g
35±0.10 x 32.5±0.10 x 3.85±0.20 mm
4.2 Assembly Diagrams
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4.2.1 MG2636 Module’s Assembly Diagram Dimensions
Figure 4-2 MG2636 Module’s Assembly Diagram
Technical requirements: 1）*Dimensions. Representing check the dimensions;
2）tolerances +-0.1mm。
4.2.2 B2B Connector Socket
In order to meet the requirements of electrical performances of B2B connector, users should
select the proper connector. The part number of the connector for MG2636 module is
DF12C(3.0)-50DS-0.5V(81). Users can refer to DF12C(3.0)-50DS-0.5V(81) specifications to search
for the matched connector.
Remarks: DF12C (3.0)-50DS-0.5V (81) is Shenzhen JieRong Technology Co., Ltd.
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GSM Modules
Figure 4-3 MG2636 module connector’s assembly status
Figure 4-4 MG2636 module connector’s relevant appearance diagram
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