ZTE MG2618 Users Manual

Version 1.0，2015-03-18

Welink Your Smart

Hardware Development Guide of Module

Product

ZTE MG2618

ZTE MG2618

Hardware Development Guide of Module Product

Legal Information

By accepting this certain document of ZTE CORPORATIN you agree to the following terms. If you do
not agree to the following terms, please notice that you are not allowed to use this document.

Copyright © 2009 ZTE CORPORATION. Any rights not expressly granted herein are reserved. This
document contains proprietary information of ZTE CORPORATION. Any reproduction, transfer,
distribution, use or disclosure of this document or any portion of this document, in any form by any
means, without the prior written consent of ZTE CORPORATION is prohibited.

and are registered trademarks of ZTE CORPORATION. ZTE’s company name, logo
and product names referenced herein are either trademarks or registered trademarks of ZTE
CORPORATION. Other product and company names mentioned herein may be trademarks or trade
names of their respective owners. Without the prior written consent of ZTE CORPORATION or the
third party owner thereof, anyone’s access to this document should not be construed as granting, by
implication, estopped or otherwise, any license or right to use any marks appearing in the document.

The design of this product complies with requirements of environmental protection and personal
security. This product shall be stored, used or discarded in accordance with product manual, relevant
contract or laws and regulations in relevant country (countries).

This document is provided “as is” and “as available”. Information contained in this document is subject

to continuous update without further notice due to improvement and update of ZTE CORPORATION’s

products and technologies.

All Rights reserved, No Spreading abroad without Permission of ZTE I

ZTE MG2618

Version

Date

Description

V1.0

2015-03-18

1st released

Revision History

Hardware Development Guide of Module Product

All Rights reserved, No Spreading abroad without Permission of ZTE II

ZTE MG2618

Hardware Development Guide of Module Product

Contents

1 PRODUCT OVERVIEW ............................................................................................................. 1

1.1 TECHNICAL PARAMETERS ............................................................................................ 1

1.2 APPLICATION FRAME ..................................................................................................... 2

1.3 ABBREVIATIONS.............................................................................................................. 3

2 INTERFACES ............................................................................................................................... 6

2.1 PIN DESCRIPTION ............................................................................................................ 6

2.2 ANTENNA INTERFACE ................................................................................................... 8

2.3 RF PERFORMANCE OF ANTENNA INTERFACE ......................................................... 8

3 ELECTRIC FEATURES ........................................................................................................... 10

3.1 INTERFACE POWER LEVEL ......................................................................................... 10

3.2 POWER CONSUMPTION ................................................................................................ 10

3.3 POWER-ON/OFF TIMING SEQUENCE ......................................................................... 11

3.4 RELIABILITY TEST ........................................................................................................ 11

3.5 ESD CHARACTERISTIC ................................................................................................. 12

3.6 GPS PERFORMANCE ...................................................................................................... 12

4 REFERENCE CIRCUIT OF MODULE INTERFACES ....................................................... 13

4.1 RESET AND POWER DESIGNING ................................................................................ 13

4.2 UART INTERFACE .......................................................................................................... 15

4.2.1 DUPLEX UART INTERFACE .............................................................................. 17

4.3 SIM CARD INTERFACE .................................................................................................. 18

4.4 AUDIO INTERFACE ........................................................................................................ 19

4.5 LED INDICATOR INTERFACE ...................................................................................... 22

4.6 GPS INTERFACE ............................................................................................................. 22

4.7 CONNECTION METHOD OF GPS ACTIVE ANTENNA.............................................. 23

5 MECHANIC FEATURES.......................................................................................................... 24

All Rights reserved, No Spreading abroad without Permission of ZTE III

5.1 APPEARANCE DIAGRAM ............................................................................................. 24

5.2 ASSEMBLY DIAGRAM .................................................................................................. 25

5.3 PCB PACKAGE DIMENSIONS ....................................................................................... 26

ZTE MG2618

Hardware Development Guide of Module Product

6 SMT PROCESS AND BAKING GUIDE .................................................................................. 28

6.1 STORAGE REQUIREMENTS.......................................................................................... 28

6.2 RECOMMENDED PAD DESIGN .................................................................................... 28

6.3 REQUIREMENTS OF MODULE’S POSITION ON MAIN BOARD ............................. 30

6.4 MODULE PLANENESS STANDARD ............................................................................ 31

6.5 PROCESS ROUTING SELECTION ................................................................................. 31

6.5.1 SOLDER PASTE SELECTION.............................................................................. 31

6.5.2 DESIGN OF MODULE PAD’S STEEL MESH OPENING ON MAIN BOARD . 31

6.5.3 MODULE BOARD’S SMT PROCESS .................................................................. 32

6.5.4 MODULE SOLDERING REFLOW CURVE ........................................................ 33

6.5.5 REFLOW METHOD .............................................................................................. 34

6.5.6 MAINTENANCE OF DEFECTS ........................................................................... 34

6.6 MODULE’S BAKING REQUIREMENTS ....................................................................... 35

6.6.1 MODULE’S BAKING ENVIRONMENT .............................................................. 35

6.6.2 BAKING DEVICE AND OPERATION PROCEDURE ........................................ 35

6.6.3 MODULE BAKING CONDITIONS ...................................................................... 35

7 SAFETY INFORMATION ........................................................................................................ 36

All Rights reserved, No Spreading abroad without Permission of ZTE IV

ZTE MG2618

Hardware Development Guide of Module Product

Figures

Figure 1–1 Application Frame ...................................................................................................................... 3

Figure 3–1 Power-on/off timing sequence .................................................................................................. 11

Figure 4–1 Reference Circuit of Power Supply & Reset Interface ............................................................. 14

Figure 4–2 Reference Circuit of Power Supply Interface ........................................................................... 14

Figure 4–3 Reference Circuit 1 of UART Interface ................................................................................... 16

Figure 4–4 Reference Circuit 2 of UART Interface ................................................................................... 16

Figure 4–5 UART Connection between DCE－DTE ................................................................................. 17

Figure 4–6 Reference Circuit of SIM Card Interface ................................................................................. 19

Figure 4–7 MIC reference circuit ............................................................................................................... 20

Figure 4–8 SPK reference circuit ............................................................................................................... 21

Figure 4–9 Reference Circuit of Status Indicator ....................................................................................... 22

Figure 4–10 Reference Circuit of GPS Interface ........................................................................................ 23

Figure 4–11 Active GPS antenna circuit reference design principle diagram ............................................ 23

Figure 5–1 Top & bottom & side view of module ..................................................................................... 24

Figure 5–2 The assembly diagram of module ............................................................................................ 25

Figure 5–3 The PCB package dimensions of module (Top View) ............................................................. 26

Figure 5–4 Test point of module ................................................................................................................ 27

Figure 6–1 Module’s dimensions ............................................................................................................... 29

Figure 6–2 Recommended PAD dimensions on corresponding main board .............................................. 29

Figure 6–3 Module board’s PAD mounted on main board......................................................................... 30

Figure 6–4 Green oil and white oil at module’s position on main board .................................................... 30

Figure 6–5 Module Board’s Steel Mesh Diagram ...................................................................................... 32

Figure 6–6 Material Module Pallet ............................................................................................................. 33

Figure 6–7 Module Furnace Temperature Curve Diagram ......................................................................... 34

All Rights reserved, No Spreading abroad without Permission of ZTE V

ZTE MG2618

Hardware Development Guide of Module Product

Tables

Table 1–1 The function information of module ............................................................................................ 1

Table 1–2 Major Technical Parameters ........................................................................................................ 1

Table 1–3 Abbreviation List ......................................................................................................................... 3

Table 2–1 PIN Interface Definition .............................................................................................................. 6

Table 2–2 RF Performance of antenna interface .......................................................................................... 8

Table 3–1 Power Level Range of Digital Signal ........................................................................................ 10

Table 3–2 Power Consumption of Module (Typical) ................................................................................. 10

Table 3–3 Module testing environment of temperature .............................................................................. 11

Table 3–4 ESD Endurance.......................................................................................................................... 12

Table 3–5 GPS Performance ...................................................................................................................... 12

Table 4–1 Working Condition .................................................................................................................... 13

Table 4–2 UART Interface Definition ........................................................................................................ 17

Table 4–3 Definition of SIM Card Signal .................................................................................................. 18

Table 4–4 Audio interface definition .......................................................................................................... 19

Table 4–5 Definition of LED Indicator Status ............................................................................................ 22

Table 6–1 Baking parameters ..................................................................................................................... 28

Table 6–2 Recommended PAD dimensions of main board ........................................................................ 30

Table 6–3 LCC module PAD’s steel mesh opening ................................................................................... 31

All Rights reserved, No Spreading abroad without Permission of ZTE VI

ZTE MG2618

Hardware Development Guide of Module Product

R&TTE Regulation:

In all cases assessment of the final product must be mass against the Essential requirements of the R&TTE
Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3
requirements.

Hereby, ZTE CORPORATION declares that this product is in complies with the essential requirements of
Article 3 of the R&TTE 1999/5/EC Directive.

All Rights reserved, No Spreading abroad without Permission of ZTE VII

ZTE MG2618

Hardware Development Guide of Module Product

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:

 Reorient or relocate the receiving antenna.
 Increase the separation between the equipment and receiver.
 Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.

End Product Labeling
The final end product must be labeled in a visible area with the following: “Contains FCC ID:
SRQ-ZTEMG2618”. The grantee's FCC ID can be used only when all FCC compliance

requirements are met.The FCC part15.19 staement below has also be available on the
label:The device complies with part 15 of FCC rules,Operation is sugject to the following two
conditions:(1)This device may not cause harmful interference,and(2)this device must accept
any interference received,including interference that may cause undesired operation,to comply
With FCC regulations limiting both maximum RF output power and human exposure to RF
radiation.
A user maual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
Guidelines,The end product with an module may also need to pass the FCC part15
unintentional emission testing requirements and be properly authorized for FCC
part15.Note:If thie module is intended for use in a portable device,you are responsinble
For separate approval to satify the SAR requirements of FCC part2.1093

This device is intended only for OEM integrators under the following conditions:

1)The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 3 dBi.

2)The transmitter module may not be co-located with any other transmitter or antenna.

All Rights reserved, No Spreading abroad without Permission of ZTE VIII

ZTE MG2618

SN

PID

BAND

GPS

1

V2A

GSM 900/1800

Not support

2

V2B

GSM 850/900/1800/1900

Not support

3

V2C

GSM 850/900/1800/1900

Support

Items

Parameters

Basic Features

Bands

GSM850/EGSM900/DCS1800/PCS1900(Optional)

Dimensions

22.00mm*20.00mm*2.0mm

Weight

About 1.9g

Normal Working Temperature

-35~75°C

Extreme Working Temperature

-40~85°C

Storage Temperature

-50~90°C

Humidity

0% ~ 95%

Performance

Power Supply

The range of voltage supply is 3.4V-4.2V, typical value: 3.8V

Max. Transmitter Power

33±2dBm @ GSM850/GSM900

Hardware Development Guide of Module Product

1 Product Overview

MG2618 is a GSM/GPRS wireless industrial module, and it contains three variants V2A, V2B and
V2C. Customer can choose the dedicated type based on the wireless network configuration. The following
table shows the entire configuration of MG2618 series.

Table 1–1 The function information of module

MG2618 is a wireless Internet module with 49 pin LCC interface. It is widely applied to but not
limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric
devices, by providing data services, transceiver Email, web browsing, high speed download and so on.

In places with GSM network coverage, you can send and receive SMS, use high-speed data access
service, voice calls and other functions under the mobile environment. The module provides users with a
high degree of freedom, convenient solution to realize mobile office dreams.

This section describes the basic functions and logic diagram of the module.

1.1 Technical Parameters

Table 1–2 Major Technical Parameters

All Rights reserved, No Spreading abroad without Permission of ZTE 1

ZTE MG2618

Items

Parameters

30±2dBm @ DCS1800/PCS1900

Receiving sensitivity

-108dBm @ GSM850/GSM900

-106dBm @ DCS1800/PCS1900

Interface

Encapsulation type

49 Pin LCC

Antenna interface

LCC pad

UART Interface

AT commands, data transmission

SIM card Interface

1.8V/3V

Data Service

Service

GPRS, Class A or B, Class 10 or 12

GPRS Mobile station

Class C

GPRS class

Class 12

Max. DL Data rate

85.6Kbps

Max. UL Data rate

42.8Kbps

Protocols
Embedded TCP/IP and UDP/IP protocol stack

TCP Server, UDP Server

Embedded FTP

SMS

Support TEXT/PDU mode

Point-to-point MO/MT

SMS Cell Broadcast

AT Commands

Static AT commands set

Extended AT commands set

Hardware Development Guide of Module Product

1.2 Application Frame

The application frame of module is as follows:

All Rights reserved, No Spreading abroad without Permission of ZTE 2

ZTE MG2618

A

ADC

Analog-Digital Converter

模数转换

AFC

Automatic Frequency Control

自动频率控制

AGC

Automatic Gain Control

自动增益控制

ARFCN

Absolute Radio Frequency Channel Number

绝对射频信道号

ARP

Antenna Reference Point

天线参考点

ASIC

Application Specific Integrated Circuit

专用集成电路

B

BER

Bit Error Rate

比特误码率

BTS

Base Transceiver Station

基站收发信台

C

CDMA

Code Division Multiple Access

码分多址

CDG

CDMA Development Group

CDMA

发展组织

Main Chip

GPS Chip

Hardware Development Guide of Module Product

Figure 1–1 Application Frame

Note: Only the modules which support GPS function have the function of GPS as shown in Blue
Block Diagram above.

1.3 Abbreviations

Table 1–3 Abbreviation List

All Rights reserved, No Spreading abroad without Permission of ZTE 3

ZTE MG2618

CNR

Carrier Noise Ratio

载噪比

CSD

Circuit Switched Data

电路交换数据

CPU

Central Processing Unit

中央处理单元

D

DAC

Digital-to-Analog Converter

数模转换

DCE

Data Communication Equipment

数据通讯设备

DSP

Digital Signal Processor

数字信号处理

DTE

Data Terminal Equipment

数据终端设备

DTMF

Dual Tone Multi-Frequency

双音多频

DTR

Data Terminal Ready

数据终端准备好

E

EFR

Enhanced Full Rate

增强型全速率

EGSM

Enhanced GSM

增强型

GSM

EMC

Electromagnetic Compatibility

电磁兼容

EMI

Electro Magnetic Interference

电磁干扰

ESD

Electronic Static Discharge

静电放电

ETS

European Telecommunication Standard

欧洲通信标准

F

FDMA

Frequency Division Multiple Access

频分多址

FR

Full Rate

全速率

G

GPRS

General Packet Radio Service

通用分组无线业务

GSM

Global Standard for Mobile Communications

全球移动通讯系统

H

HR

Half Rate

半速率

I

IC

Integrated Circuit

集成电路

IMEI

International Mobile Equipment Identity

国际移动设备标识

ISO

International Standards Organization

国际标准化组织

ITU

International Telecommunications Union

国际电信联盟

L

LCD

Liquid Crystal Display

液晶显示器

LED

Light Emitting Diode

发光二极管

M

MCU

Machine Control Unit

机器控制单元

MMI

Man Machine Interface

人机交互接口/人机界面

MS

Mobile Station

移动台

P

PCB

Printed Circuit Board

印刷电路板

PCL

Power Control Level

功率控制等级

PCS

Personal Communication System

个人通讯系统

Hardware Development Guide of Module Product

All Rights reserved, No Spreading abroad without Permission of ZTE 4

ZTE MG2618

PDU

Protocol Data Unit

协议数据单元

PPP

Point-to-point protocol

点到点协议

R

RAM

Random Access Memory

随机访问存储器

RF

Radio Frequency

无线频率

ROM

Read-only Memory

只读存储器

RTC

Real Time Clock

实时时钟

S

SIM

Subscriber Identification Module

用户识别卡

SMS

Short Message Service

短消息服务

SRAM

Static Random Access Memory

静态随机访问存储器

T

TA

Terminal adapter

终端适配器

TDMA

Time Division Multiple Access

时分多址

TE

Terminal Equipment also referred it as DTE

终端设备，也指

DTE

TTFF

Time To First Fix

首次定位时间

U

UART

Universal asynchronous receiver-transmitter

通用异步接收/发送器

UIM

User Identifier Management

用户身份管理

USB

Universal Serial Bus

通用串行总线

Hardware Development Guide of Module Product

All Rights reserved, No Spreading abroad without Permission of ZTE 5