Yokogawa TDLS200 User Manual

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User’s Manual

TDLS200

Tunable Diode Laser Spectroscopy Analyzer

IM 11Y01B01-01E-A

Yokogawa Corporation of America

Yokogawa Corporation of America 2 Dart Road, Newnan, Georgia U.S.A. 30265 Tel: 1-800-258-2552 Fax: 1-770-254-0928

IM 11Y01B01-01E-A

6th Edition

Introduction

Thank you for purchase the TDLS200 Tunable Diode Laser Analyzer. Please read the following respective documents before installing and using the TDLS200.

Notes on Handling User’s Manuals

• This manual should be passed on to the end user.

• The contents of this manual are subject to change without prior notice.

• The contents of this manual shall not be reproduced or copied, in part or in whole, without permission.

• This manual explains the functions contained in this product, but does not warrant that they are suitable

for the particular purpose of the user.

• Every effort has been made to ensure accuracy in the preparation of this manual. However, when you realize mistaken expressions or omissions, please contact the nearest Yokogawa Electric representative or sales ofce.

• This manual does not cover the special specications. This manual may be left unchanged on any change of specication, construction or parts when the change does not affect the functions or

performance of the product.

• If the product is not used in a manner specied in this manual, the safety of this product may be impaired.

Yokogawa is not responsible for damage to the instrument, poor performance of the instrument or losses |resulting from such, if the problems are caused by:

• Improper operation by the user.

• Use of the instrument in improper applications

• Use of the instrument in an improper environment or improper utility program

• Repair or modication of the related instrument by an engineer not authorized by Yokogawa.

Drawing Conventions

Some drawings may be partially emphasized, simplied, or omitted, for the convenience of description. Some screen images depicted in the user’s manual may have different display positions or character types

(e.g., the upper / lower case). Also note that some of the images contained in this user’s manual are display examples.

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Safety Precautions



 Safety, Protection, and Modification of the Product

• In order to protect the system controlled by the product and the product itself and ensure safe operation, observe the safety precautions described in this user’s manual. We assume no liability for safety if users fail to observe these instructions when operating the product.

• If this instrument is used in a manner not specified in this user’s manual, the protection provided by this instrument may be impaired.

• If any protection or safety circuit is required for the system controlled by the product or for the product itself prepare it separately.

• Be sure to use the spare parts approved by Yokogawa Electric Corporation (hereafter simply referred to as YOKOGAWA) when replacing parts or consumables.

• Modification of the product is strictly prohibited.

• The following safety symbols are used on the product as well as in this manual.

Safety, Protection, and Modication of the Product

• In order to protect the system controlled by the product and the product itself and ensure safe operation,

observe the safety precautions described in this user’s manual. We assume no liability for safety if users fail to observe these instructions when operating the product.

• If this instrument is used in a manner not specied in this user’s manual, the protection provided by this instrument may be impaired.

• If any protection or safety circuit is required for the system controlled by the product or for the product itself, prepare it separately.

• Be sure to use the spare parts approved by Yokogawa Electric Corporation (hereafter simply referred to as YOKOGAWA) when replacing parts or consumables.

• Modication of the product is strictly prohibited.

• The following safety symbols are used on the product as well as in this manual.

This symbol indicates that an operator must follow the instructions laid out in this manual in order to avoid the risks, for the human body, of injury, electric shock, or fatalities. The manual describes what special care the operator must take to avoid such risks.

DANGER

WARNING

This symbol indicates that the operator must refer to the instructions in this manual in order to prevent the instrument (hardware) or software from being damaged, or a system failure from occurring.

CAUTION

This symbol gives information essential for understanding the operations and functions.

Note!

This symbol indicates information that complements the present topic.

This symbol indicates Protective Ground Terminal

ThissymbolindicatesFunctionGroundTerminal(Donotusethisterminalastheprotectiveground terminal.)

 Warning and Disclaimer

The product is provided on an “as is” basis. YOKOGAWA shall have neither liability nor responsibility to any person or entity with respect to any direct or indirect loss or damage arising from using the product or any defect of the product that YOKOGAWA cannot predict in advance.

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TDLS200

CAUTION

SAFETY should be considered rst and foremost importance when working on the equipment described in this manual. All persons using this manual in conjunction with the equipment must evaluate all aspects of the task for potential risks, hazards and dangerous situations that may exist or potentially exist. Please take appropriate action to prevent ALL POTENTIAL ACCIDENTS.

AVOID SHOCK AND IMPACT TO THE ANALYZER THE LASERS CAN BE PERMANENTLY DAMAGED

Laser Safety & Classication according to FDA Regulations. The TDLS200 is Registered with the United States FDA as a Laser Product.

WARNING

THIS ANALYZER CONTAINS A LASER PRODUCT THAT IS GENERALLY IN ACCORDANCE WITH THE REGULATIONS FOR THE ADMINISTRATION AND ENFORCEMENT OF THE RADIATION CONTROL FOR HEALTH AND SAFETY ACT OF 1968 (TITLE 21, CODE OF FEDERAL REGULATIONS, SUBCHAPTER J). REFER SECTION

1002.10 OF THE REGULATIONS REFERENCED ABOVE.

CAUTION INVISIBLE LASER RADIATION AVOID DIRECT EXPOSURE

MAXIMUM OUTPUT POWER < 1 MW (Oxygen)

MAXIMUM OUTPUT POWER < 20 mW (other Gases) DURING NORMAL OPERATION THIS ANALYZER IS:

CLASS I LASER PRODUCT (according to IEC 60825-1)

CAUTION

iii

The Instrument is packed carefully with shock absorbing materials, nevertheless, the instrument may be damaged or broken if subjected to strong shock, such as if the instrument is dropped. Handle with care.

Warranty and service

Yokogawa products and parts are guaranteed free from defects in workmanship and material under normal use and service for a period of (typically) 12 months from the date of shipment from the manufacturer. Individual sales organizations can deviate from the typical warranty period, and the conditions of sale relating to the original purchase order should be consulted. Damage caused by wear and tear, inadequate maintenance, corrosion, or by the effects of chemical processes are excluded from this warranty coverage.

In the event of warranty claim, the defective goods should be sent (freight paid) to the service department of the relevant sales organization for repair or replacement (at Yokogawa discretion). The following information must be included in the letter accompanying the returned goods:

• Part number, model code and serial

• Number

• Original purchase order and date

• Length of time in service and a description of the process

• Description of the fault, and the circumstances of failure

• Process/environmental conditions that may be related to the failure of the device.

• A statement whether warranty or nonwarranty service is requested

• Complete shipping and billing instructions for return of material, plus the name and phone number of a

contact person who can be reached for further information.

Returned goods that have been in contact with process uids must be decontaminated/ disinfected before shipment. Goods should carry a certicate to this effect, for the health and safety of our employees. Material safety data sheets should also be included for all components of the processes to which the equipment has been exposed.

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DANGER

WARNING

DANGER

Dont install “general purpose type” instruments in the hazardous area.

CAUTION

The intrument is packed carefully with shock absorbing materials, nevertheless, the instrument may be damaged or broken if subjected to strong shock, such as if the instrument is dropped. Handle with care.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

TOC-1

TABLE OF CONTENTS

Introduction .......................................................................................................................................................... i

Safety Precutions ............................................................................................................................................... ii

1 Quick Start .................................................................................................................................................1-2

2 Introduction and General Description ....................................................................................................2-1

2.1 Functional Description ........................................................................................................................2-1

2.1.1 Measurement .................................................................................................................................. 2-2

2.2 Instrument Check ................................................................................................................................2-2

3 General Specications .............................................................................................................................3-1

3.1 Model & Sufx Code ............................................................................................................................3-4

4 Analyzer Components ..............................................................................................................................4-1

4.1 Launch Unit .........................................................................................................................................4-2

4.2 Main Electronics Housing ....................................................................................................................4-3

4.3 Laser Assembly ...................................................................................................................................4-6

4.4 Check Gas Flow Cell (for On-Line) ......................................................................................................4-7

4.5 Detect Unit ..........................................................................................................................................4-8

4.6 Process Interface .................................................................................................................................4-9

4.7 Analyzer Connections ........................................................................................................................4-10

4.8 Communications ...............................................................................................................................4-11

4.9 Purge .................................................................................................................................................4-13

5 Installation and Wiring .............................................................................................................................5-1

5.1 Process Measurement Point Considerations .....................................................................................5-1

5.2 Position of Process Flanges for Launch and Detect Units .................................................................5-2

5.3 Process Flange Welding Alignment and Line-Up ............................................................................... 5-4

5.4 Process Flange Clear Aperture ...........................................................................................................5-5

5.5 Mounting the Launch and Detect Units to the Process Flange .........................................................5-5

5.5.1 Process Window Purge Gas Connection .....................................................................................5-6

5.6 Mounting the Process Interface .........................................................................................................5-6

5.7 Typical Purge Gas Conguration, In-Situ ...........................................................................................5-7

5.8 Typical Purge Gas Conguration, Extractive trace ppm H2O system.................................................5-7

5.9 Dimensional Drawings ........................................................................................................................5-8

5.10 Wiring Drawings ...............................................................................................................................5-14

5.11 Hazardous Area Systems .................................................................................................................5-19

5.11.1 Purging Analyzer for Hazardous Areas (with On-Line Validation) ..............................................5-20

5.11.2 Purging Analyzer for Hazardous Areas (without On-Line Validation) ..........................................5-20

5.11.3 Purging Analyzer and Universal Power Supply and/or URD for Hazardous Areas

(with On-Line Validation) .............................................................................................................5-21

5.11.4 Purging Analyzer and Universal Power Supply and/or URD (not using On-Line Validation) ......5-21

5.12 Cyclops Division 2/ zone 2 Purge Indicator, with Switch .................................................................5-22

6 Basic Operations .......................................................................................................................................6-1

6.1 Menu Structure Map...........................................................................................................................6-1

6.2 Software Guide ...................................................................................................................................6-5

6.3 Non-Process Parameters .................................................................................................................6-18

6.4 Reference Peak Lock with 2nd Absorption gas ...............................................................................6-22

6.5 Large Aperture Optics ......................................................................................................................6-26

6.5.1 LAO Installation, Alignment & Dector Gain .................................................................................6-27

6.5.2 Adjustment of Dector Gain for LAO ...........................................................................................6-28

6.5.3 Dector Gain Adjustment Service Tips ........................................................................................6-30

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6.6 Valve Control Logic ...........................................................................................................................6-30

6.7 Introduction for H2Oppm measurements in Methane Gas ...............................................................6-32

6.8 Introduction to Gas Temperature Predictions with High Temperature Oxygen Measurements .......6-38

6.9 Controlling the Analyzer Remotely or Locally via external PC/Laptop2 ...........................................6-34

6.9.1 Instructions for Connecting an External Computer to the Analyzer ...........................................6-35

6.9.2 Using Ultra-VNC Software ..........................................................................................................6-36

6.9.3 Remote Interface Unit (RIU) ........................................................................................................6-37

6.9.4 Virtual Analyzer Controller (VAC) Operating Software Map ........................................................ 6-37

6.9.5 Remote Interface Unit ................................................................................................................6-38

6.9.6 Virtual Analyzer Controller (VAC) Operating Software Guide......................................................6-38

7 Routine Maintenance ................................................................................................................................7-1

7.1 Maintaining Good Transmission .......................................................................................................... 7-1

7.2 Alignment .............................................................................................................................................7-4

8 Validation and Calibration ............................................................................................................ 8-1

8.1 Off-Line manual/Automatic Checking and Off-Line Calibration..........................................................8-2

8.2 Off-Line Calibration for Reference Peak Lacking Application ...........................................................8-13

8.3 On-Line Validation .............................................................................................................................8-14

8.4 On-Line Validation Overview .............................................................................................................8-14

8.5 Performing manual On-Line Validation ..............................................................................................8-18

8.6 Performing Automated On-Line Validation ........................................................................................8-21

9 Troubleshootin ...........................................................................................................................................9-1

9.1 Common Troubleshooting Steps .........................................................................................................9-2

9.2 Field Up-Gradable Files and Software from Factory ...........................................................................9-9

9.3 Analyzer Warnings ...............................................................................................................................9-9

9.4 Analyzer Faults ..................................................................................................................................9-10

10. Data Files And Format ............................................................................................................................10-1

10.1 Conguring Data Capture .................................................................................................................. 10-5

10.2 Downloading (Transfering/Exporting) the Data ..................................................................................10-8

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<1 QUICK START>

1-1

1 QUICK START

Step Title Description

1.0

1.1 Ensure the process connections match the supplied process interface.

1.2 Ensure the appropriate utilities are available and ready for connection. These may include electrical

1.3 Ensure you comply with any local and/or site specic safety requirements.

1.4 Read the appropriate sections of the Instruction Manual BEFORE starting any installation work –

2.0

2.1 Attach the process interface (alignment anges) to the site installed anges (or isolation valves as

2.2 Carefully mount the Launch and Detect Units to their alignment anges using the quick connect

2.3 Mount optional equipment such as Universal Power Supply (UPS), Universal Remote Display (URD),

2.4

Preparation

Installation

Ambient Temperature

3.0

3.1 Connect the appropriate electrical power supply.

3.2 Connect the Launch to Detect interconnect cable (supplied with analyzer) according to the supplied

3.3 Connect any analog I/O signals to the analog I/O Board. Outputs land on TB8 and Inputs land on TB9.

3.4 Connect any other equipment such as URD, Ethernet, solenoid valves, digital I/O, etc.

3.5

Wiring

Carefully un-pack and check equipment for any obvious damage. This includes anges, Cables, Power Supplies, manuals and any other supplied options.

NOTES: There are 14 ferrules in the accessory bag for tubing-piping. The number of ferrule that are required for actual tubing-piping are different by application. Please see tubing-piping gure specic to project for exact detail.

power, nitrogen purge gas, instrument air, validation gas, etc.

Contact Yokogawa Laser Analysis Division or Local Agent if any doubts!

If separate process isolation anges have been provided for corrosive service, then install to the process/stack ange/isolation valves.

appropriate).

If installing Large Aperture Optics, ensure the detect system is correctly mounted and purged to

prevent damage to the large optical element.

coupling.

Remote Interface Unit (RIU), etc.

The analyzer and some accessories (such as LAO, RIU, UPS, URD, alignment anges, etc.) are suitable for -20 to +50oC ambient operating temperature. Accessories and Options are available to increase these the operating conditions – please consult Yokogawa for further details.

Ensure that all wiring will enable the analyzer launch and detect units to be freely moved from their process location to an adjacent off-line calibration cell. This will entail the use of tray rated cables and/ or exible conduit and/or other suitable armored cable. Rigid conduit systems are not recommended.

• 24 VDC to TB1 on the analyzer (launch Unit) backplane. Check that the actual voltage is >23.5VDC otherwise the SBC and other devices will not function!

• 110/240 50/60 Hz to UPS or URD, then take 24 VDC to analyzer

wiring detail (TB7 on the Launch and TB 13 on the Detect Unit).

Check terminations and ensure all cable shields are landed per supplied wiring details.

4.0

Utilities

4.1 Connect the appropriate process window purge gas (nitrogen for oxygen analyzers) and make site

4.2 Connect the appropriate analyzer on-line check gas ow cell gas (nitrogen for oxygen analyzers) and

4.3 Connect and check any other required utility connections (such as steam trace for heated isolation

NOTE! – All purge, Validation Gas and other gas utility lines should be thoroughly cleaned, dried and purged prior to connecting to the analyzer – Failure to do so can result in serious damage to the TDLS200 or contamination to the

internal optical elements.

Connect the appropriate analyzer purge gas (nitrogen for oxygen analyzers) and make site connections per the supplied purge gas sequence details (including any Hazardous area purge system). Start the purge gas ow accordingly.

ATEX purge requires dual regulators at the inlet purge gas supply to prevent overpressure damage in the event of a single regulator failure!

connections per the supplied purge gas sequence details. Start the window purge gas ow accordingly – ensuring that any isolation valves are open.

make site connections per the supplied purge gas sequence details. Start the purge gas ow

accordingly.

anges or ow cells) or secondary window purges for lethal service gases. Start other utilities accordingly.

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<1 QUICK START>

4.4

5.0

5.1 Use the internal On-Off switch to power-up the analyzer.

5.2 Observe the various LED clusters on the backplane and FPGA boards. All blue LEDs located on the

5.3 Observe the Green power indicator on the SBC.

5.4

6.0

6.1 If there is an installed optional Mini Display (4x20 VFD) – Observe the status line message.

6.2 If there is no installed User Interface, then connect a laptop PC via Ethernet to the SBC mounted

6.3

Power-Up

Checking

Alignment

Leak-check all connections and ensure pressure ratings are not exceeded!

Apply power to the analyzer and using a multi-meter, check for 24VDC power at TB1 on the launch

unit back plane.

lower right side of the back-plane should be on.

Observe the LEDs on the analog I/O board.

If there is an installed optional 6.5” Display and Keypad – Observe the Main Menu messages and

status information.

on the backplane. Initiate the supplied VNC software from the laptop to initiate a VNC session with

the ‘blind’ analyzer and observe the analyzer Main Menu via the laptop.

At this time there may be one or more alarm message due to low transmission, out of range parameters or other – nal system conguration is still required!

Please also note that the analyzer laser temperature control is disabled for the initializing period (5 minutes) – this means that even manual control of the laser temperature is disabled during this period.

Initially, observe the Transmission value through the appropriate user interface. The objective is to adjust alignment until the maximum transmission value is obtained. Perfect alignment in a clear process gas will yield close to 100% transmission.

If the analyzer displays a Warning “Validation Required”, this indicates there is no target gas absorption peak found at start-up.

7.0

7.1 Start by adjusting the Launch unit alignment ange nuts up-down and left right. Look for increases

7.2 When it has been maximized at the launch side, adjust the detect unit accordingly.

7.3 Further adjustment can be made by maximizing the raw detector voltage signal (available at test

7.4

8.0

Alignment – check

Detector Gain

Congure

BASIC

8.1 Enter the Basic Menu and go to Congure.

8.2

8.3

8.4

8.5 If any other parameters are required to be set (such as analog I/O ranges, alarms levels, Auto

Optical Path

Gas Pressure

Gas Temperature

Introduce some measured gas into the optical path and re-start or perform a validation with target

gas. This will ensure that the analyzer is correctly tuned to the measurement gas absorption peak.

If this Warning cannot be cleared by either method, please contact Yokogawa Laser Analysis

Division or your local agent for further assistance.

If you have 100% certainty that the analyzer is already measuring the process gas and validation is not currently possible then, this alarm can be cleared via the Advanced Calibrate & Validate menu.

Initially, observe the Transmission value through the appropriate user interface. The objective is to adjust alignment until the maximum transmission value is obtained. Perfect alignment a clear process gas will yield close to 100% transmission.

and decreases in transmission strength to aid in the alignment.

points on both launch and detect). The signal should be maximized and will not exceed 5.3V DC for low temperature (<600C process) or 9.9V DC for high temperature (>600C process).

For Large Aperture Optics (LAO) systems, please refer to the Detector Gain Adjustment section of this User Guide to ensure correct functionality and adjustment.

By way of the appropriate user interface, the correct process parameters and other parameters can

now be entered.

Enter in the correct optical path length.

Enter in the correct process gas pressure (if Active, see Advanced Congure).

Enter in the correct process gas temperature (if Active, see Advanced Congure).

Validation sequences) then the Advanced Menu needs to be accessed.

Advanced Menu access is Password protected and should only be used by skilled and

trained persons - Contact Yokogawa Laser Analysis Division or Local Agent if any doubts!

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<1 QUICK START> 1-3

2-3

9.0

Congure

Using the correct password (Default 1234), enter in to the Advanced Menu, then the Congure.

ADVANCED

9.1 Select the desired measurement units (English or Metric selected on an individual parameter basis).

9.2

9.3

9.4

9.5 Congure the system I/O by entering in to the System I/O sub menu in Congure.

9.6 If the Analog I/O board is installed, then select Analog Output and set the appropriate 4mA and

9.7 Select what mode (Block, Track or Hold) the 4-20mA outputs are to be when the analyzer is in

9.8 Congure Digital outputs – Warnings and Faults. Many of these will be factory preset so if unsure

9.9 Go to the Data screen and set the appropriate parameters for and ‘Spectrum Capture’. These will

9.10 Go to the Trends screen and review/plot several of the listed parameters to check analyzer

9.11

Optical Path

Gas Pressure

Gas Temperature

Non- Process Parameters

10.0

10.1 To Export Data, simply insert an empty USB memory stick in to a USB port on the launch unit back

10.2 Close out the VNC software and disconnect the service PC – if connected.

10.3 Ensure the doors/lids are closed and tightly sealed.

10.4 The system is now in normal operation mode.

10.5

Normal Operation

Enter in the correct optical path length.

Select Fixed or Active. If Fixed, enter in the correct process gas pressure. If Active, enter in the 4-20mA input signal range proportional to the pressure range.

“Control” mode is not applicable to TDLS200

Select Fixed or Active. If Fixed, enter in the correct process gas temperature. If Active, enter in the 4-20mA input signal range proportional to the temperature range. Active ambient and Active Peaks may also be used, refer to project specic and application specic details.

“Control” mode is not applicable to TDLS200

20mA values for Ch1 Concentration and Ch2 Transmission.

Warning, Fault and Calibration Modes.

about any settings then leave as Factory Default. Select and set level for Alarm Limit to either the Measured Gas orTransmission.

ensure the analyzer stores important information during operation that may be used to verify

operation/status/diagnostics and other trouble shooting.

performance over a period of time.

If the application use gas containing the target gas (e.g. Oxygen measurement with Instrument Air Purge) then the Non-Process parameters should be congured as detailed later in this manual under the Software Section. Non-Process Parameters should also be congured if using a linelocking gas in the validation cell (e.g. CO for combustion).

When the site/eld conguration is complete and the analyzer has operated for at least two hours without any functional alarms, then perform an export data routine.

plane. The data transfer may take several minutes.

DO NOT REMOVE THE MEMORY STICK DURING THIS TIME!

We RECOMMEND sending all the Exported Data les to Yokogawa Laser Analysis Division along with any notes and comments. We will then be able to store these les on a master record for future reference.

Please carefully read the appropriate Sections of this Instruction Manual. The TDLS200 Tunable Diode Laser (TDL) Analyzer is a technologically advanced instrument that requires the appropriate care when handling, installing and operating.

Failure to do so may result in damage and can void any warranties!

If there is any doubt about any aspect of the Instrument or its use, please contact Yokogawa Laser Analysis Division and/or your authorized Representative/Distributor.

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<2. INTRODUCTION AND GENERAL DESCRIPTION>2-3 2-1

2 INTRODUCTION AND GENERAL DESCRIPTION

The TDLS200 TDLS analyzer is designed to measure selected target gases in gas phase samples directly

at the process point (across stack, across pipe, etc.), close coupled/by-pass leg or in full extractive systems (ow cell).

The analyzer measures free molecules on a path

averaged basis. Unless there is an extractive sampling system up-stream that removes water (or other condensables) then the measurements are considered to be on a ‘Wet Basis’.

Measurements are possible (with correct analyzer

conguration) at the following conditions:

• Gas temperatures up to 1500˚C (2730˚F)

• Gas pressures up to 10 BarG (145 psig)

• High Particulate loading (as a function of mea surement path length)

Each application may differ in maximum

limitations depending upon the combination of

gas temperature, gas pressure, optical path length

and concentration of the gas being measured. The standard analyzer is designed for operation in a Safe

Area (General Purpose). The addition of a Purge

System facilitates operation in Hazardous Areas in

accordance with the relevant UL, CSA and ATEX

standards for gaseous releases.

The basic TDLS200 analyzer comprises two units,

the Launch Control Unit and Detect Unit.

Various Process Interface congurations are

available for connecting the analyzer to the measurement point. Several options may be added

to the standard analyzer such as:

2.1 Functional Description

Tunable Diode Laser Spectroscopy (or TDLS)

measurements are based on absorption spectroscopy. The TDLS200 Analyzer is a TDLS system and operates by measuring the amount of

laser light that is absorbed (lost) as it travels through the gas being measured. In the simplest form a

TDLS analyzer consists of a laser that produces

infrared light, optical lenses to focus the laser light

through the gas to be measured and then on to a

detector, the detector, and electronics that control

the laser and translate the detector signal into a

signal representing the gas concentration. Gas molecules absorb light at specic colors, called absorption lines. This absorption follows Beer’s Law.

Using a Tunable Diode Laser as a light source for

spectroscopy has the following benets:

• Sensitivity. As low as 10-6 by volume, lower

with path length enhancement.

• Selectivity. The narrow line width of the laser is able to resolve single absorption lines. This provides more choices of a particular peak to use for measurement, usually allowing one isolated peak to be used.

• Power. Diode lasers have power ranging from

0.5 mW to 20 mW. Also, being highly coherent

this allows measurement in optically thick

environments (high particulate loading).

• Monochromatic, no dispersive element (lter, etc.) required. Light source itself is selective.

• Mini Display

• 6.5” screen and keypad

• Display sun shield

• Optional Universal Power Supply (with or without a Mini Display)

• Remote Interface Unit (not required for normal operation)

• Hazardous Area purge systems

• Other options may also be added.

• Tunable Wavelength can be swept across the entire absorption feature, this allows resonant (peak) and non resonant (baseline) measurement during every scan. By

measuring the baseline and peak power at the detector, transmission can uctuate rapidly by large amounts without affecting the measurement. This is useful for high particulate applications.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<2. INTRODUCTION AND GENERAL DESCRIPTION> 2-2

Currentramptolaser

SignalatDetector

Currentramptolaser

SignalatDetector

ProcessedDetectorSignal

2.1.1 Measurement

• During measurement the laser is held at a xed temperature. This is the coarse wavelength adjustment.

• A current ramp is fed to the laser. This is the ne wavelength adjustment. Figure 1.

• The current is ramped to scan across the wavelength region desired.

Figure 1.

• The collimated light passes through the gas to be

measured. The amount of light absorbed by the peak is proportional to the analyte concentration.

• The light is then focused on a detector. Figure 2.

• This signal is used to quantify the light absorbed by the analyte.

Figure 3.

Figure 2.

Currentramptolaser

Figure 3.

2.2 Instrument Check

Upon delivery, unpack the instrument carefully and inspect it to ensure that it was not damaged during shipment. If damage is found, retain the original packing materials (including the outer box) and then immediately notify the carrier and the relevant Yokogawa sales ofce.

TDLS Analyzer

MODEL

TDLS200

SUFFIX

STYLE SUPPLY --- 24.0 VDC

MAX 120W

AMB TEMP -20 TO 50 NO.

THIS PRODUCT COMPLIES WITH 21 CFR PART 1040.10

Made in USA

KCC-REMYCA-EEN999

Make sure the model number on the nameplate of the instrument agrees with your order.

The nameplate will also contain the serial

number and any relevant certication marks. Be sure to apply correct power to the unit, as

detailed on the nameplate.

For products used within the European Community or other countries requiring the CE mark and/or ATEX classication, the following labels are attached (as appropriate):

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<2. INTRODUCTION AND GENERAL DESCRIPTION>2-2 2-3

TDLS200 Instruction Manual V2.1

For Zone 2 (CAT 3) ATEX use the following labels will be attached as appropriate:

For YR-200 (Remote Interface Unit, RIU) Zone 2 (CAT 3) ATEX use the following labels will be attached as appropriate:

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<2. INTRODUCTION AND GENERAL DESCRIPTION> 2-4

CAUTION - For Cleaning of the labels and LCD window, please use wet cloth to avoid electrostatic

condition.

NOTE - ATEX Hazardous Area Operation:

Product MUST NOT be used in Zone 0 (CAT 1) locations

Product MUST NOT be used in Group I (Dust/Grain) locations

Product MUST NOT be used in Group III (Fibers) locations

Conditions of Certication

On loss off purge an alarm shell be made to inform the user, action shall then be taken by the user to

ensure continued use is safe.

A functional test shall be carried out in accordance with clause 17.1 of EN 60079-2:2007 to verify the parameters of the Purge Control Unit when tted.

A leakage test shall be carried out in accordance with clause 17.2 of EN 60079-2:2007. The

manufacturer shall record and retain these results.

Only Lithium batteries specied in manual are to be used in this enclosure.

Special Conditions of Certication:

A suitability certied Purge Control Unit must be sued with the TDLS Analyzer that is capable providing the requirements listed on label/certicate and that either provides a suitable exhaust through a particle

barrier of to a safe area.

When installed there shall be a minimum of two pressure regulators in the air/nitrogen supply line.

Materials of Construction

The analyzer incorporates a variety of materials in its construction and they should therefore be

used in an appropriate manner. Any chemicals (liquid or gas) that may have a detrimental effect on

the product’s structural integrity should not be allowed come in contact.

The electronic enclosures are constructed from Aluminum Alloy AL Si 12 (ASTM A413) and have a protective epoxy powder coated surface nish. The welded bodies are constructed of stainless steel grade 316 The fasteners are constructed of stainless steel grade 18-8 The windows (when tted) are constructed of laminated safety glass

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<2. INTRODUCTION AND GENERAL DESCRIPTION>2-4 2-5

Maintenance Work by Qualied Personnel

Unqualied work on the product may result in severe personal injury and/or extensive damage to property. If the Warnings contained herein are not adhered to the result may also be severe personal injury and/or extensive damage to property.

This product is designed such that maintenance work must be carried out by trained personnel.

Trained personnel are considered as below:

- Engineers familiar with the safety approaches of process analytical instrumentation (and/or general automation technology) and who have read and understood the content of this User Guide.

- Trained start-up/commissioning analyzer technicians who have read and understood the content of this Instruction Manual.

WARNING – Battery replacement

Replacement Battery Installation (Type CR2032 located on CPU).

The battery MUST be factory installed and cannot be installed by others at site (soldered connections, required) – Contact factory for further assistance

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3 GENERAL SPECIFICATIONS

0.5A@125 VAC

<3. GENERAL SPECIFICATIONS>

3G with purge system EEx pz II T5

Class 1 Div.2 Group BCD with integral purge kit

KC mark: KCC-REM-YCA-EEN999

3-1

USB1 and USB2 connection for data transfer using memory stick, data storage

in CF card (result les, spectra capture, conguration data, etc.) Capture rate is congurable typical capacity for results and

spectra is 14 days.

2”, 3” or 4” 150# ANSI RF or adaptors for DN50 PN16, and DN80 PN16

2” 150# Alignment ange 4.5kg (10lbs), 3” 150# Alignment ange 9.5kg (15lbs), 4” 150# Alignment ange 9.1kg (20lbs)

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<3. GENERAL SPECIFICATIONS>

Performance Specification

Repeatability: Application Dependent

Linearity: +/- 1% of FS

Response time: 2-20 seconds, plus transport time for

extractive systems when applicable

Drift: Application Dependant

Installation Specifications

Hazardous Area: Zone 1: Contact Yokogawa Zone 2: ATEX group II Cat. 3G with purge

system EEx pz II T5 (-20< Ta <50C)

By Design: Non-Hazardous Area; Purge required for ATEX zone 1&2 and NEC Class 1 Division 1&2

Maximum Distance between Launch and Detect:

30 m (±90ft)

Maximum interconnecting cable 50m

Wetted Parts: Analyzer & standard Alignment Flange - 316

SS, BK-7 Glass, Teflon encapsulated Viton and Silicone RTV sealant.

Basic System Configuration

The TruePeak can be installed in a number of ways depending on

process requirements. The most typical installation types are shown below, however other installation methods are possible, please contact Yokogawa with your application details.

Cross Stack/Pipe Configuration

• Measures directly across process pipe or vessel

• Typically has nitrogen or other purge gas protecting

process windows

• Span Validation via serial flow cell (see Operation Specifications).

• Full calibration requires removal from process

• May require pressure and temperature inputs (Application Dependant)

• Multiple methods to increase Optical Path Length (OPL) if needed

• 5 meter interconnection cable standard

Close Coupled Extractive / Bypass Configuration*

Optional: Isolation Flanges and Flow Cells - 316 SS,

Sapphire, Kalrez Also available in Monel A400, Hastelloy C-276, Carpenter 20, Titanium Grade 2 and others on request.

Utilities:

Instrument Air may be used as a purge gas in principle for all of the below applications, but this will depend on the application type and the required precision of the measurement.

Oxygen Analyzer N CO Analyzer N2 or Instrument Air CO

Analyzer N2 or other non-CO2 containing inert gas

O ppm Analyzer N2 with <20ppm levels H2O for feed to

O % Analyzer N

optional Dryer Package

Flow Rate: • 5-30 L/min for window purge

• 2 L/min for validation, calibration and optical

purge

SIL Assessment:

The TDLS200 has a FMEDA assessment by exida and is classified as a Type B1 device in compliance with the following standards; IEC 61508 or EN 954-1. Functional Safety of Electrical/ electronic/programmable electronic related systems; SIL 1

capability for single device.

* The TDLS200 is not SIL certified as standard; to be certified the unit must be specified and designed from the beginning to meet all SIL

specifications.

Cal inlet

PROCESS

• Measures across a section of pipe where process flow is directed

• The measurement section can be isolated from process flow for full calibration/validation, zero and span

• Process pressure and temperature can be controlled or the analyzer may require pressure and temperature inputs (Application Dependant)

• Length of measurement section dependant on accuracy requirements

and process conditions

Extractive Configuration*

process sample inlet

Zero check gas, at grade

Span check gas. at grade

Flow-Cell-Outlet

• Sample is fully extracted from process (and may be conditioned before measurement).

• Flow cells are available with ability to purge in front of windows (balanced flow cell) if required.

• Process pressure and temperature can be controlled or the analyzer may require pressure and temperature inputs (Application Dependant)

• Length of flow cell dependant on accuracy requirements

and process conditions

* Contact Yokogawa for further details

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<3. GENERAL SPECIFICATIONS>

3-3

Standard Accessories

Calibration Cell: - Used for off-line calibrations and

validations

- Stainless steel 316 with free standing

frame

- Connects Launch and Detect with

72.6cm (28.6") OPL

Flow Cells: - Used for extracted sample streams at any

location

- 316SS low volume fixed alignment; 50ºC,

5.5 bar (80psig) max

- Enhanced for 200ºC, 20 Bar (290psig), Sapphire window, Kalrez o-rings and can be constructed from 316SS, Monel A400, Hastelloy C-276, Carpenter 20 and other materials on request to suit the process

Isolation Flanges: - Used for additional protection for in-situ

or by-pass installations

- 2” or 3” 150# or 300# ANSI RF, 4”150#, DN80 PN16 welded 5/8” or M16” bolt studs included sapphire 20 Bar (290 psig) or BK-7 5.5bar (80 psig) isolation window

- Kalrez window seal o-ring rated max 200ºC

- 316SS, Monel A400, Hastelloy C-276, Carpenter 20, other on request

Note: Must use in conjunction with alignment flanges

Utility Panel: - Used for convenient field installation of

utilities, configurations for

- Single, dual or four analyzers

- Manual or automatic on-line validation (controlled by analyzer)

- Safe area (GP), Div 2 purged or nonpurged, ATEX CAT 2G components

- Purge flowmeters with integral needle valve, glass tube variable area

- Swagelok double ferrule stainless steel tube

fittings and tubing standard

- Panel mounted or fiberglass (NEMA 4X/ IP65), with viewing window

- 5A 24VDC power supply, output to analyzer – requires VAC input power

Display and Software Functions

TruePeak Software has multiple levels, the default (or start page) is the Main Menu:

Main Menu Displays: - Concentration & Units (% or ppm)

- Transmission %

- Status (warm-up, OK, Warning, Fault, etc.)

- Temperature (Fixed, Active Ambient or Active)

- Pressure (Fixed or Active)

Main Menu:

Basic Menu - Configure, 3 functions

- View Spectra, 2 functions

- Data, 3 sub-menus

- Trends

Advanced Menu - Configure, 9 sub-menus (User Password) - Calibrate & Validate, 3 sub-menus

- Data, 4 sub-menus

- Trends,

Active Alarms - List of active alarms Shut Down Analyzer - Instructions to close TruePeak local or

VAC

Calibration Functions:

Off-line Calibrations: - Zero calibration

- Zero off-set

- Span calibration

- Transmission

- Dark current

- peak search

Off-line Validations: - Check gas #1

- Check gas #2

- Check gas #3

On-Line Validations: - Manual

- Automatic

Setup Functions:

Configuration: - Process Path Length

- Pressure

- Temperature

- Units

- System I/O

- System

- Valve Control

- Laser Spectra & Control

Note: Custom configuration available to suit customer requirements

Integration: - Used for convenient analyzer & extractive

system/flow cell integration

- Free standing frame, galvanized steel with 304SS roof

- Fiberglass enclosure with powder coated

steel frame

- Heat tracing and insulation for flow cells

and sample handling

- 316SS and/or Monel A400 wetted parts – other on request

- Sample handling and conditioning

systems to suit applications

- Stream switching manual or automatic (controlled by analyzer)

Note: Custom configuration available to suit customer requirements

Diagnostics:

Warnings include: - Detector signal low

- Transmission low

- Spectrum noise high

- Process pressure out of range

- Process temperature out of range

- Concentration out of range

- Board temperature out of range

- Validation failure Faults include: - Laser temperature out of range

- Detector signal high

- Detector signal lost

- Peak center out of range

Output Settings:

Analog Output: - Channel 1

- Channel 2

- Channel 3

- Warning Mode

- Fault Mode

- Field Loop Check

- AO CH calibration

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<3. GENERAL SPECIFICATIONS>

3.1 Model and Sufx Codes

Model Sufx Code Option Code Description

TDLS200 -------------------------------------------- ---------------------------- Tunable Diode Laser

Type -N ---------------------------- General Purpose (None CE)

-G ---------------------------- General Purpose (CE/KC)

-D ---------------------------- Class I Div 2 BCD Purged

-S ---------------------------- ATEX CAT 3/ zone 2 Purged, KC

-J ---------------------------- TIIS Hazardous Area

Gas Parameter -X1 ---------------------------- Oxygen (O

-X2 ---------------------------- Oxygen (O

-X3 ---------------------------- Oxygen (O

-C1 ---------------------------- Carbon Monoxide (CO) % <500°C

-C2 ---------------------------- Carbon Monoxide ppm (CO) <500°C

-C3 ---------------------------- Carbon Monoxide ppm (CO) <1500°C

-C4 ---------------------------- Carbon Monoxide (CO) ppm <1500°C + CH4 0-5%

-A1 ---------------------------- Ammonia (NH

-A2 ---------------------------- Ammonia (NH

-S1 ---------------------------- Hydrogen Sulde (H

-D1 ---------------------------- Carbon dioxide (CO

-D5 ---------------------------- Carbon dioxide (CO

-H1 ---------------------------- Water moisture (H

-H2 ---------------------------- Water moisture (H

-H3 ---------------------------- Water moisture (H

-H4 ---------------------------- High moisture (H

-K1 ---------------------------- Special Applications

Laser Interface -N ---------------------------- None- Blind Controller

-1 ---------------------------- Integral Mini Display

-2 ---------------------------- Integral Color LCD Backlit

Interface -N ---------------------------- No Process Interface Included

-A ---------------------------- Large Aperture Optics with 3" 150# alignment bellows

-B ---------------------------- Large Aperture Optics, with 4" 150# alignment bellows

-2 ---------------------------- 2" 150# Alignment Bellows

-3 ---------------------------- 3" 150# Alignment Bellows

-4 ---------------------------- 4" 150# Alignment Bellows

-5 ---------------------------- DN50 Alignment Bellows

-8 ---------------------------- DN80 Alignment Bellows

) < 600°C, 0-25%

) < 1500°C, 0-25%

) <1500°C, 0-25%/ Temp

) up to 0-5,000ppm

) 0-5,000ppm & 0-50% H2O

S) up to 0-50%

) High Range 0-1; 0-5%

) Extend. Range 0=5; 0-50%

O) min 0-30ppm Cl2 background

O) ppm non-hydrocarbon background

O) ppm Hydrocarbon background

O) level min 0-5%

Options /U ----------------------- Ext.USB Port IP66 (NOT ATEX)

/P ----------------------- Pressure Comp Curve

/D ----------------------- Diverging Beam No Large Aperture Optics

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TDLS200 TDL Analyzer Instruction Manual V2.1

Launch to Detect Interconnect (cable)

Launch Unit:

• Main Electronics Housing

• User Interface (optional)

• Laser Assembly

• Check Gas Flow Cell (for

On-Line Validation)

Detect Unit:

• Detect Electronics

Housing

• Detector

Assembly

Process Interface:

• Analyzer detachable from process interface for Off-Line

calibration / service.

• Flanged O-Ring Alignment

• Flanged Metal Bellows Seal Alignment

• Flow Cell

• Isolation Flanges

• By-Pass Piping

• Custom designs for specific applications.

Hazardous Area Purge (optional)

•

NEC/CSA Class 1, Div. 2, Gr. A-D

• ATEX Zone 2 Cat 3

4 ANALYZER COMPONENTS

<4. ANALYZER COMPONENTS>

4-1

Launch Unit:

• Main Electronics Housing

• User Interface (optional)

• Laser Assembly

• Check Gas Flow Cell (for On-Line Validation)

Hazardous Area Purge (optional)

• NEC/CSA Class 1, Div. 2, Gr. A-D

• ATEX Zone 2 Cat 3

Launch Unit:

• Analyzer detachable from process interface for Off-Line calibration / service.

• Flanged O-Ring Alignment

• Flanged Metal Bellows Seal Alignment

• Flow Cell

• Isolation Flanges

• By-Pass Piping

• Custom designs for specic applications.

Detect Unit:

• Detect Electronics

Housing

• Detector Assembly

Launch to Detect Interconnect (cable)

Figure 4 - System Overview

• The Launch Unit and Detect Unit are connected to each other via a Tray Rated 4-pair shielded twisted

pair cable.

• The Launch Unit requires a single 24VDC power supply (by customer or via optional Power Supply Unit).

• Nitrogen purge gas is required to prevent ambient oxygen ingress however, for other target gases it may be possible to use Instrument Air for purging.

• The Process Interfaces are available in various formats, sizes and materials to suit the desired measurement/installation.

• The available Remote Interface Unit (RIU) can be located typically up to 100m (330ft) away from the Launch Unit. The RIU also requires a 24VDC power supply. The RIU connects to the Launch Unit on Ethernet (10-base-T 10/100) via CAT5e eld rated cable.

• The available Universal Remote Display (URD) can be located typically up to 40m (120ft) away from the Launch Unit. The URD requires an AC power input that is connected to a universal power supply with 24VDC output power supply (for the analyzer). The URD connects to the Launch Unit via multipair

sheilded twisted pair cable.

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4.1 Launch Unit

Main Electronics Housing

• Back Plane circuit board

• Single Board Computer (SBC)

• FPGA signal Processing board

• Analog I/O circuit board

• Field electrical terminals are located on Back Plane (and optional Analog I/O board).

• Optional Mini Display (4x20 VFD) shown

<4. ANALYZER COMPONENTS>

Check Gas Flow Cell

Short cell (gas tight chamber)

allows Zero Gas or Span gas to flow through the measuring path for

on-line validation)

4-2

Figure 5 - Launch Unit - Optional Keypad and Display

Laser Housing and Laser Module

• Laser diode and collimating lens assembly

• Laser module designed to be field

replaceable and purged to prevent ambient air ingress.

• Housed in a stainless steel body with O-rings seals, attached to the main

electronics housing.

Laser Assembly

Check Gas

Flow Cell

Main

Electronic

Housing

Process

Interface

Figure 7 - Launch Unit OverviewFigure 6 - Launch Unit-Optional Keypad & display

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<4. ANALYZER COMPONENTS>

4.2 Main Electronics Housing

Enclosure

Die cast copper free aluminum grade AL Si 12 alloy (A413.0) with a powder coat exterior nish. The copper free aluminum alloy is particularly resistant to salt atmospheres, sulfur gases and galvanic corrosion.

An externally hinged door opening to the left incorporates a weather tight gasket seal and four captive fastening screws (stainless steel). The external dimensions are approx 16” W x 12” H x 7” D (400mm x 300mm x 180mm).

The environmental protection rating is considered IP65 (EN 60529) or NEMA 4X.

Cable entries are located on the bottom face of the enclosure. They are typically ¾” Myers hubs that have ¾”

NPT female threads. Each has a ground lug to facilitate the grounding of cable shields to the analyzer chassis.

When an analyzer has been supplied with the optional Mini Display (4x20 VFD), the normally blank (blind) door has a different conguration. The center of the door has a cut-out measuring approx 3” W x 1” H (75mm x 25mm). A clear laminated safety glass window is mounted to the inside of the door with stainless steel fasteners and a weather tight gasket. This allows for external viewing of the actual VFD display without

opening the door.

When an analyzer has been supplied with the optional integral 6.5” display and keypad, then the normally blank (blind) door has a different conguration. The left hand side of the door has a cutout measuring approx 5” W x 4” H (130mm x 100mm). A clear laminated safety glass window is mounted to the inside of the door with stainless steel fasteners and a weather tight gasket. This allows for external viewing of the actual display without opening the door. The right hand side of the door accommodates a keypad (30 keys, stainless steel) which is also operated externally without opening the door.

Backplane Circuit Board

Large (approx. 10” H x 15” W) printed circuit board that mounts inside the enclosure. The board has several integral circuits and several connectors to accommodate various plug-in boards. The board is designed such that any eld terminations are located along the lower edge of the board via pluggable terminal blocks for customer or eld cable interface.

All components and devices on the board are designed for extended temperature (-20 to +80ºC) and low drift

operation.

The Backplane Circuit Board contains the following integrated circuits:

• DC Power Input

• DC Power Distribution

• Watchdog Circuit

• Display Backlight Power Interrupt

• Alarm Relays

• Remote Calibration Initiation

• Calibration Valve Driver Relays

• Laser Temperature and Current Control

• Board temperature

DC Power Input

There are four pluggable screw terminals located on the lower right hand side of the Back Plane. These are used for connecting the 24VDC power input supply.

There is an adjacent On/Off miniature toggle switch and re-settable thermal fuse.

The single 24DVC power supply is distributed to various output power channels. Each output power channel has the appropriate DC-DC converter, regulator(s), ltering capacitors and status LEDs, etc.

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<4. ANALYZER COMPONENTS>

Relay Coil

24VDC

TB3

DGND

wired outputs to prevent

4-4

Watchdog Power Interrupts

The power output channels for microprocessors have control logic lines (TTL activated). These allow for watchdog interrupt/reset functionality.

Alarm Relays

There are three alarm relay circuits on the board. These are capable of actuating Form C Single Pole Double Throw (SPDT) relays. The three connections of each relay (Common, Normally Open and Normally Closed) are routed through the board to eld terminals.

The contacts are rated for a maximum of 1A @ 24VDC.

The pluggable eld terminals are mounted on the lower edge of the board, just to the left side of the DC power input terminals. The appropriate relay(s) is actuated when there is an analyzer Warning, Fault and/or Level Alarm.

Remote Validation/ Remote Calibration Initiation

A validation/calibration routine can be initiated from a remote location (up to 300m away) using contact closures. The Back Plane has circuitry such that it can monitor for a return voltage. The return voltage comes from remote Volt Free Contacts (VFCs) at the customer DCS (or other control system).

The circuits include suitable protection against inadvertent shorting/grounding of the supply 24VDC or the application of excess power to the monitoring circuit. There are three sets of remote contact monitoring circuits on the Back Plane.

Valve Relays

There are three calibration valve relay circuits on the board. These are capable of actuating Form C SPDT relays. The common pole is connected to 24VDC power and the normally open pole is routed to the eld terminal block. Digital ground is also routed to the terminal block TB3 as shown below.

FPGA TTL out

Relay Coil Drive Circuit

Relay Coil

Relay

Contacts

24VDC to

24VDC to C

C and to NO

C to NO

NOTE; Use ferrite coil or direction diode on TB6

24VDC to external

switching spikes

Figure 8 - Calibration Valve Relay Diagram

24VDC 12W max to

solenoid valve when

external solenoid valve

relay is engergized

when relay is energized

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<4. ANALYZER COMPONENTS>

Connections of each relay (Common and Normally Open) are routed through the board to eld terminals.

The contacts are rated for a maximum of 1A @ 24VDC (or 0.5A @ 125VAC).

The pluggable eld terminals are mounted on the lower edge of the board, just to the left side of the DC power

input terminals.

The appropriate relay(s) is actuated when a calibration gas check valve is to be initiated.

Laser Temperature & Current Control

The board has two main laser control function circuits, temperature control and laser current control.

Board Temperature

The board has a temperature sensing chip/circuit that monitors temperature of the board inside the main electronics enclosure. The sensor is located on the top edge of the Back Plane.

Backplane Circuit Board Power & Signal Routing

The Back Plane carries out several routing functions for both power and signals: I/O for Detect Unit is routed through the Back Plane from one set of pluggable eld terminals (located lower left hand of Back Plane) to the appropriate destination. Terminals are provided for:

• Analog DC power (x3)

• Raw Detector Signal (differential voltage) (x2)

• Detect Unit Temperature (differential voltage) (x2)

Analog I/O Board outputs the analyzer results and reads input process gas compensation values (pressure and

temperature). The board has power status LEDs as well as voltage test points for the input and output channels.

• Output channels (three) are ranged 0-20mA. They can be assigned to measured values Oxygen, Transmission or compensation signal re-transmission.

• Input Channels (two) are used by the analyzer to read active values for process gas temperature and/or process gas pressure. These are application dependant and may or may not be required inputs. There are two channels, one for temperature and one for pressure. Each may be used to read 4-20mA signals that are isolated or to read and loop power (with integral 24VDC) signals.

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<4. ANALYZER COMPONENTS>

4-6

Optional Mini Display (4x20 VFD) mounts on the analyzer enclosure door. The display itself is an indus-

trial grade 4 line 20 character vacuum uorescence display (VFD) that is self illuminating (i.e. no back light required).

Optional 6.5” Display is an industrial grade 6.5” VGA color TFT LCD Module that has a built-in CCFL backlight. Both the display and interface board are mounted to a cover plate that attaches to the inside of

the enclosure door.

Optional Keypad is an industrial rated 30 key unit that has a PS/2 (6-pos miniDIN) interface direct to the SBC. It has an Ingress Protection Rating of IP65 equivalent to NEMA 4X and is of low prole design.

Backplane Field Terminal Blocks:

• TB1 - 24VDC Power input 80 w (and optional purge power)

• TB2 – Remote Initiate Validate, calibrate and/or streamswitch

• TB3 – Solenoid Valve(s) Drivers (max 11 w each @24 VDC)

• TB4 – Alarm Contacts (Warning & Fault) Form-C

• TB5 – Alarm Contacts (user & optional Purge) Form-C, Purge is closed on pressure

• TB6 – Ethernet TCP/IP 10/100

• TB7 – Launch Control to Detect Interconnect

• TB14 – Remote Mini Display

Analog I/O Board

• TB8 – Analog Outputs, three 4-20mA isolated

• TB9 – Analog Inputs, two 4-20mA powered or loop powered

Optional Feed-through Board (URD only)

• TB10 – Ethernet to remote Analyzer via Interconnect Cable

• TB11 – to remote Analyzer via Interconnect Cable

• TB12 – Local Connections for RIU or URD + Field I/O

4.3 Laser Assembly

The laser assembly contains: Laser Diode, Collimating Lens, Module, Body, Window

Laser Assembly Body

Laser Assembly Body is a stainless steel mechanical pipe

housing that accommodates the module and protects it from the environment. The body has two Swagelok style tube fittings welded on that serve as inlet and outlet ports for the nitrogen purge gas. The

body attaches to the Main Electronics Housing with an O-Ring seal

and several stainless steel fasteners. At the other end of the body there is a standard adaptor piece welded in place. This adaptor

can fit several different Process interface systems as well as an off-

line calibration cell. The adaptor also accommodates the standard Process isolation window holder.

Laser Module

Laser Module is a mechanical component that holds both the

laser diode and the lens holder. The assembly is factory setup, permanently configured and can be replaced in the field if

necessary.

Body

Laser Module

Figure 9 - Laser Assembly

Window

Figure 10 - Laser Module

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<4. ANALYZER COMPONENTS>

Laser Diode is either a Vertical Cavity Surface-Emitting Laser (VCSEL) or Distributed Feedback (DFB) that outputs at wavelengths in the 750nm to 2400nm range (invisible)

depending on the target gas being measured. The primary output wavelength of the laser is controlled by a thermoelectric

cooling module (Peltier Element). The laser diode is permanently

attached to the module. Collimating Lens is an optical component that collimates the diverging light source.

4.4 Check Gas Flow Cell (for On-Line Validation and/or

Laser Module

Check Gas

Body

Line Locking

Flow Cell

The Check or Check Gas Flow Cell is a short chamber that exists between the laser collimating lens and the standard Process

isolation window. The cell is sealed with double O-rings and is

in series with the measurement optical path. The body has two

Figure 11 - Check Gas Flow Cell

Swagelok style tube fittings welded on that serve as inlet and outlet ports for the nitrogen purge gas or calibration check gas as appropriate.

The Check gas flow cell is used for performing on-line validations (or Dynamic Spiking) while the analyzer is mounted

on the Process. This feature allows for the analyzer to be validated without removing it from the Process location.

By introducing a gas of known target gas concentration, at a given temperature and pressure, the analyzer can

determine if the Validation routine has been PASSED or FAILED.

Window

This cell can also be used for Line Locking applications, such as %CO for combustion applications. Refer to Non-Process Parameters for details of how to configure the software when implementing a line-locking application.

Please also refer to project specific drawings for detail of how to configure the tubing/valving when implementing line

locking.

The various parameters that enable the validation are all configurable within the TDLS200 software. Refer to the

Validation and Calibration section of this User Guide for further details.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

4.5 Detect Unit

<4. ANALYZER COMPONENTS>

4-8

Detect Electronics Housing

• Detector Circuit Board

Process Interface

Detect unit

Detect

Electronic

Housing

Detect

Assembly

Detector Housing and Detector Module

• Detector and focusing lens assembly

• Detector module designed to be field replaceable

and purged to prevent ambient air ingress.

• Housed in a stainless steel body with O-rings

seals, attached to the detect electronics housing.

Figure 12 - Detect Unit

Detect or Electronics Housing

The Enclosure is die cast copper free aluminum grade AL Si 12 alloy (A413.0) with a powder coat exterior finish.

The copper free aluminum alloy is particularly resistant to salt atmospheres, sulfur gases and galvanic corrosion. A

removable cover (lid) incorporates a weather tight gasket seal and four captive fastening screws (stainless steel). The external dimensions are approx 7” W x 7” H x 4” D (180mm x 180mm x 100mm).

The environmental protection rating is considered IP65 (EN 60529) or NEMA 4X.

The cable entry located on the bottom face of the enclosure. It is typically a ¾” Myers hub that has a ¾” NPT female thread. It has a ground lug to facilitate the grounding of cable shields to the analyzer chassis.

Detector Circuit Board

Detector Circuit Board main function is to convert detector photocurrent into voltage and send it to be digitized.

LEDs are incorporated to provide simple diagnostic of available power. The board has a temperature sensing chip/

circuit that monitors the ambient temperature inside the detect electronics enclosure. The sensor is located on the top edge of the detect board to ensure the maximum temperature reading is monitored.

The board is medium size (approx. 4” H x 6” W) printed circuit board that mounts inside the enclosure. The field

terminations are located along the lower edge of the board via pluggable terminal block. All components and devices on the board are designed for extended temperature and low drift operation.

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Detector Circuit Board main function is to convert detector photocurrent into voltage and send it

to be sampled. LEDs are incorporated to provide simple diagnostic of available power. The board has a temperature sensing chip/circuit that monitors the ambient temperature inside the

detect electronics enclosure. The sensor is located on the top edge of the detect board to ensure the maximum temperature reading is monitored.

The board is medium size (approx. 4” H x 6” W) printed circuit board that mounts inside the enclosure. The field terminations are located along the lower edge of the board via pluggable terminal block. All components and devices on the board are designed for extended temperature and low drift operation.

2.3.7 Process Interface

An appropriate Process Interface is selected to suit the process/stack installation. The analyzer is detachable from the process interface to facilitate Off-Line calibration and service.

Process Interface Options

There are several systems available as well as custom designs for specific applications.

 Flanged O-Ring Alignment comprises typical 2” or 3”

process flange with a large diameter O-Ring seal, typically used for stack or inert applications that are non-corrosive.

 Flanged Metal Bellows Seal comprises typical 2” or

3” process flange with a metal bellows seal and external mechanical alignment system, typically used when gas containment is important.

 Flow Cell may be used when the process gas has

been extracted or is used in a by-pass flow loop. This allows for heat tracing (if necessary) and easy introduction of both Zero and Span gases.

 Isolation Flanges are supplied with process windows

mounted in the flanges themselves typically for very corrosive and/or high pressure applications.

 By-Pass Piping may be used when the process gas

line is of small diameter (typically <10”) and when no suitable section of pipe work exists on this which the analyzer can be mounted. By pass piping systems may be provided or supplied at site. Heat tracing may also be supplied or provided at site.

 Off Line Calibration Cell is used for off line

verification of the system. This cell is used to flow Zero and Span gases when the analyzer is not connected to the process.

4.6 Process Interface

An appropriate Process Interface is selected to suit the process/stack installation. The analyzer is detachable from the process interface to facilitate Off-Line calibration and service.

Process Interface Options

There are several systems available as well as custom designs for specic applications.

Flanged with Metal Alignment

• Flanged O-Ring Alignment comprises typical 2” or 3”process ange with a large diameter O-Ring seal, typically used for stack or inert applications that are non-corrosive.

• Flanged Metal Bellows Seal comprises typical 2” or 3” process ange with a metal bellows seal and external

mechanical alignment system, typically used when gas containment is important.

• LAO-Large Aperature Optics, for long path combustion

application.

extracted or is used in a by-pass ow loop. This allows for heat tracing (if necessary) and easy introduction of both Zero and Span gases.

mounted in the anges themselves typically for very corrosive and/or high pressure applications.

small diameter (typically <10”) and when no suitable section of pipe work exists on this which the analyzer can be mounted. By pass piping systems may be provided or supplied at site. Heat tracing may also be supplied or provided at site.

Typical Cross Pipe/Stack

Typical Flow Cell / By-Pass

• Flow Cell may be used when the process gas has been

• Isolation Flanges are supplied with process windows

• By-Pass Piping may be used when the process gas line is of

• Off Line Calibration Cell is used for off line verication of the

system. This cell is used to ow Zero and Span gases when the analyzer is not connected to the process.

Figure 13 - Process Interface Examples

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4.7 Analyzer Connections

Launch – Detect Interconnect

The two units are connected to each other via a four, twisted pair cable suitable for tray installation outdoors. Pluggable terminals strips are provided at both units to enable eld termination of the cable. The cable pairs are

individually shielded as well as an overall shield.

The cable specications are as below.

Item Specication

Number fo Pairs 4, individually shielded

Total Number of Conductors 9 (includes 1 comm.)

AWG 18 (0.75 mm

Conductors 7 x 26 stranding, Bare Copper

Inner Shield Aluminum Foil-Polyester tape, 100% coverage with 20

AWG tinned copper wire drain

Insulation F-R PVC – Flame Retarding Polyvinyl Chloride

Outer Shield Aluminum Foil-Polyester tape, 100% coverage with 18

AWG tinned copper wire drain

)

4-10

Outer Jacket F-R PVC – Flame Retarding Polyvinyl Chloride Wall

thickness 0.053” (1.35 mm) Typical 0.47” (12 mm)

outside diameter

Operating temperature -22 to 221ºF (-30 to +105ºC)

Min. Bend Radius 5” (127 mm)

Applicable Standards NEC/(UL) PLTC, ITC, CMG

Flame Test UL1581, FT4, IEEE 1202 & ICEA T-29-520

Suitability Indoor, Outdoor, Burial and Sunlight Resistant

Power Limited Tray Rated Cable

Nom. Conductor DC resistance @ 20˚C 5.86 Ohms/1000 ft (305 m)

Nom. Outer Shield DC resistance @ 20˚C 4.75 Ohms/1000 ft (305 m)

Max. Operating Voltage - UL 300 V RMS

Conductor Identication Numbered pairs, black & white conductors

Typical Manufacturer & Part No. Belden Type 1475 A

The maximum cable length should not exceed 150 ft (46 m).

Please ensure that the Launch to Detect cable is properly terminated and that all grounding and shielding details are correct per installation drawings-Espically important for CE/A TEX

installations.

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4.8 Communications

Stand Alone Options

The analyzer is capable of fully independent operation with no external computer or interface required. A number of options are available for a built in user interface (mounted on Launch Unit):

• Blind with no display or keypad. Access to the analyzer through; Ethernet connection (local or remote computer), Remote Interface Unit (RIU), Universal Remote Display (remote display only - no keypad) with menu access via external computer.

• Mini display which is an Integral display 4X20 smart VFD (cycles information). No keypad, menu access via local or remote external computer (Ethernet connected).

• Keypad with 6.5” display.

• Regardless of the user interface selected the analyzer will continuously record results, diagnostics and spectra. Data can be transferred from the analyzer via USB or Compact Flash.

Remote Interface Options

A number of options are available for remote access to the analyzer

Remote Interface Unit (RIU) model YR200 shown below, allows remote analyzer control and data transfer from analyzer to RIU (data can be transferred from RIU via USB memory stick or Compact Flash card.

• Allows multi-unit eld communication via

central user interface

• Not required for individual analyzer

operation, interface and data transfer only

• Connects with 1-8 analyzers via Ethernet

switch

• Integral Keypad and 6.5” display

External Computer via Ethernet. A separate computer can be connected to the

analyzers locally or through an Ethernet

network to allow analyzer control and data transfer

Figure 14 - Networked Analyzers

The Remote Interface Unit (RIU) consists of:

• Back Plane circuit board

• SBC

• Display and Keypad

• Optional Analyzer Feed-through circuit board and/or Ethernet switch

• All eld electrical terminals are located on the Back Plane.

A single RIU can be used in conjunction with up to 8 analyzers via Ethernet (more with additional/custom Ethernet switches).

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TDLS200 TDL Analyzer Instruction Manual V2.1

The unit acts as a remote interface for the analyzer. Should the physical location of the actual analyzer(s) be inconvenient for easy access, then the RIU can be used.

It can be mounted up to 100m (330ft) away from the analyzer(s) using the standard 10-BaseT twisted pair wiring method. It communicates to the analyzer(s) through a Virtual Network Connection (VNC). If there is more than one analyzer connected to the RIU, then they are routed via an industrial Ethernet switch. Up to four analyzers can be routed through one RIU switch.

The RIU Enclosure is die cast copper free aluminum grade AL Si 12 alloy (A413.0) with a powder coat exterior nish. The copper free aluminum alloy is particularly resistant to salt atmospheres, sulfur gases and galvanic corrosion. An externally hinged door opening to the left incorporates a weather tight gasket seal and four captive fastening screws (stainless steel). The external dimensions are approx 16” W x 12” H x 7” D (400mm x 300mm x 180mm). Wall mounting brackets are included with the RIU.

4-12

The environmental protection rating is considered IP65 (EN 60529) or NEMA 4X. Cable entries are located on the bottom face of the enclosure. They are typically ¾” Myers hubs that have ¾” NPT female threads. Each has a

ground lug to facilitate the grounding of cable shields to the chassis.

The RIU is supplied with standard integral display and keypad.

RIU Interconnect to Launch Control Unit(s)

When connecting just one analyzer to the RIU there are two twisted pair wires to consider , there are only four wires to be terminated to make the 10/100 Ethernet connection.

Analyzer SBC

Analyzer TB6

Tx Tx Rc Rc

RIU SBC

RIU

Tx Tx Rc Rc

Figure 15 – Connecting RUI to Analyzer(s)

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TDLS200 TDL Analyzer Instruction Manual V2.1

RIU Optional Ethernet Switch

If there is more than one analyzer connected to the RIU, then they are routed via an industrial Ethernet switch. Up to four analyzers can be routed through one RIU switch. The switch is powered by 24VDC from the back-plane and includes several status LEDs.

RIU Optional Ethernet Switch

RIU

SBC

Analyzer 1

SBC

Analyzer TB6

Figure 16 – RIU Ethernet Switch

Analyzer 2

SBC

Analyzer TB6

FeedThrough

Board

Ethernet

Switch

Feed-through

Board

RIU Optional Feed-through Board

To facilitate the connection of more than one analyzer to the RIU, an optional Feed-through board can be used. The board has pluggable screw terminals that allow for the landing of eld cables from the analyzers at the RIU.

RIU Hazardous Area Purging

The standard RIU is designed for operation in Safe Areas (General Purpose). An optional Z-Type purge control system can be tted to the RIU and it includes a local indicator and pressure switch alarm contacts. When applied, the purge system allows for operation in:-

• NEC/CSA Class 1, Division 2, Groups A-D

• ATEX Zone 2 CAT 3 (dual regulators at the inlet MUST be used)

The purge gas may be either Instrument Air or Nitrogen.

4.9 Purge Systems

The TDLS200 Analyzer requires a continuous nitrogen gas purge to prevent ambient oxygen ingress to the optical path, when oxygen is the measured gas. The ow rate can be minimized as long as it prevents any ambient oxygen ingress to the measurement optical path. Other purge gases may be used as long as they do not contain any of the measured gas and they are clean, dry, etc.

For hazardous area operation, the same nitrogen purge gas is used to purge the entire analyzer (including non-optical path sections such as the electronics). The process interface may also require purging to maintain clear windows, refer to Process Window Purge details separately.

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TDLS200 TDL Analyzer Instruction Manual V2.1

Purging Analyzer for Safe Area

The block diagram below shows the sections of the analyzer that require nitrogen purging. The purging should be carried in sequence typically as shown below.

TDLS200 TDL Analyzer Instruction Manual V2.1

Purging Analyzer for Safe Area

The block diagram below shows the sections of the analyzer that require nitrogen purging. The purging should be carried in sequence typically as shown below.

Figure 12 - Purging for Safe Areas

Purging Analyzer for Hazardous Areas

 Z-Purged designed in accordance with NEC/CSA Class 1, Division 2, Groups A-D  ATEX Zone 2 CAT 3 (Certified)

The block diagram below shows the sections of the analyzer that require nitrogen purging. A Z- Type purge control system is fitted the Main Electronics Housing and it includes a local indicator and pressure switch alarm contacts. The purging should be carried in sequence typically as shown below.

Main Electronic Housing

Laser Module

Check Gas Flow Cell

Process

Interface

Process

Interface

Detect Module

Detect Electronic Housing

Nitrogen or I/A Purge Gas

4-14

Purging Analyzer for Safe Area.

The block diagram below shows the sections of the analyzer that require nitrogen purging. The purging should be carried in sequence typically as shown below.

Nitrogen or I/A Purge Gas

Main Electronic Housing

Laser

Module

Nitrogen or I/A Purge

Nitrogen or I/A Purge Gas

Gas

Check Gas Flow Cell

Process

Interface

Process

Interface

Detect

Module

Detect Electronic Housing

Figure 17 – Purging for Safe Areas

Purging Analyzer for Hazardous Areas

• NEC/CSA Class 1, Division 2, Groups A-D

• ATEX Zone 2 CAT 3 The block diagram below shows the sections of the analyzer that require nitrogen purging. A Z-Type purge control system is tted the Main Electronics Housing and it includes a local indicator and pressure switch alarm contacts. The purging should be carried in sequence typically as shown below.

Nitrogen or I/A Purge

Gas

Main Electronic Housing & Purge System

Laser

Module

Nitrogen or I/A Purge Gas

Check Gas Flow Cell

Process

Interface

Detect

Module

Detect Electronic Housing

Process

Interface

Figure 18 – Purging for Hazardous Areas

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5 INSTALLATION AND WIRING

Detailed Installation, Wiring, Utility Drawings are included on a Project Basis. Please contact

Yokogawa for any project specic documentation to ensure correct installation. Drawings provided herein

are considered for standard installation use only

5.1 Process Measurement Point Considerations

The following criteria should be considered when selecting the installation point in respect to the process

conditions:

• Process Gas Flow Conditions – Laminar, homogenous gas concentration distribution conditions

across the measurement point are recommended.

For circular ducts/stacks this condition is generally at least three unimpaired diameters (D) before and after a process bend. For rectangular cross sections, the hydraulic ductdiameter (D) is derived from:

D = (4 x duct cross sectional area) / duct circumference

If neither situation exists or is possible, then distribution of the unimpaired section of duct should be 66% on the inlet side and 34% on the outlet side. Proling of the proposed measurement point may be required to ensure that a correct installation point is selected.

• Process Gas Temperature – It is recommended that the analyzer be installed at a location where temperature uctuations are minimized. Generally as a guide, if the temperature of the gas at the point where the analyzer is to be installed is to vary by more than +/-10˚C (+/-18˚F) then an “Active” input

signal should be used for compensation.

Ensure the analyzer has been selected and congured to suit the maximum operating gas temperature.

Lower gas temperatures generally lead to better measurements.

• Process Gas Pressure – It is recommended that the analyzer be installed at a location where pressure uctuations are minimized. Generally as a guide, if the pressure of the gas at the point where the analyzer is to be installed is to vary by more than +/- 0.05 Bar (+/- 0.725 psi) then an “Active” input

signal should be used for compensation.

Ensure the analyzer has been selected and congured to suit the maximum operating gas pressure.

Ensure the process isolation windows have been selected and congured to suite the maximum design

gas pressure.

Lower gas pressures generally lead to better measurements.

• Process Dust/Particulate Matter – It is recommended that the analyzer be installed at a location where dust loadings are minimized. Dust and other particulate matter will reduce the optical transmission of the measuring laser beam. Within limits, the loss of optical transmission does not effect the measurement however a Warning alarm will be initiated when the transmission falls below allowable limits. The amount of dust loading is also dependant upon the optical path length – Consult Factory for further details.

Lower dust loads generally lead to better measurements.

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TDLS200 TDL Analyzer Instruction Manual V2.1

3.2 Position of Process Flanges for Launch and Detect Units:

Process flanges should be located on the process such that the Launch and Detect Units can be installed, accessed removed in a safe and convenient manner.

The following criteria/Check List should be met at a minimum:

• Good, Safe Engineering practices

• Local codes and regulations for such equipment installation

• Appropriate hazardous area (if applicable) precautions

• Owner Company best practice and engineering standards

• Access for personnel to stand in front of launch and Detect Units

• Clearance for installation and removal of Launch and Detect (see below)

• Clearance for installation and removal of purge insertion tubes (if applicable)

• Access to process isolation valves

• Safe routing for interconnecting cables

•

Ambient conditions in accordance with analyzer limits

• Access to appropriate utilities

• Adjacent space for mounting to C

alibration Cell when off-line

5.2 Position of Process Flanges for Launch and Detect Units:

Process anges should be located on the process such that the Launch and Detect Units can be installed, accessed and removed in a safe and convenient manner.

The following criteria/Check List should be met at a minimum:

• Good, Safe Engineering practices

• Local codes and regulations for such equipment installation

• Appropriate hazardous area (if applicable) precautions

• Owner Company best practice and engineering standards

• Access for personnel to stand in front of launch and Detect Units

• Clearance for installation and removal of Launch and Detect (see below)

• Clearance for installation and removal of purge insertion tubes (if applicable)

• Access to process isolation valves

• Safe routing for interconnecting cables

• Ambient conditions in accordance with analyzer limits

• Access to appropriate utilities

• Adjacent space for mounting to Calibration Cell when off-line

Figure 23 - Launch and Detect Unit-In -Situ Installation Overview

Figure 22 - and Detect Unit – In-Situ Installation Overview

Figure 24 - Launch and Detect Unit-In-Situ with Insertion Purge Tube Installation Overview

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TDLS200 TDL Analyzer Instruction Manual V2.1

Operating and Maintenance Manual

1. Introduction ................................................................................................... 4

1.1 Features ................................................................................................ 4

2. General Specications ................................................................................. 5

3. Theory of Operation......................................................................................6

3.1 Brief History of Reux Samplers ...................................................... 6

3.2 Filter Section .....................................................................................6

3.3 Steam Supplement ........................................................................... 6

3.3 Inlet Temperature Section ................................................................ 6

3.4 Heat Exchanger Section ...............................................................6-7

3.5 Outlet Temperature Section .............................................................7

3.6 Self Acting Temperature Controller .................................................. 7

3.7 Instrument Air for the Vortex Tube ................................................... 7

3.8 Vortex Theory of Operation ..............................................................7

4. Utility Requirements ..................................................................................... 8

4.1 Instrument Air ...................................................................................8

4.2 Low Pressure Steam ........................................................................ 8

5. Installation ..................................................................................................... 9

5.1 Mechanical Considerations .............................................................. 9

5.2 Fast Loop Line Size and Response Times ..................................... 9

The following safety symbols are used on the product as well as in this manual.

DANGER

This symbol indicates that an operator must follow the instructions laid out in this manual in order to avoid the risks, for the human body, of injury, electric shock or fatalities. The manual describes what special care the operator must take to avoid such risks.

WARNING

This symbol indicates that an operator must refer to the instructions in this manual in order to prevent the instrument (hardware) or software from being damaged, or a system failure from occurring.

CAUTION

This symbol gives information essential for understanding the operations and

functions.

Note!

Figure 25 - Launch or Detect Unit Installation Dimensions

The standard ange sizes are either 2” or 3” 150# R.F. ANSI as well as DN50 and DN80. Please check the exact ange size specied and provided for the particular installation. Other ange sizes and a variety of materials (to suit the process) are available so please check these details prior to installing the anges on the process.

Note: The process isolation valves should have at least a 1½” (38mm) diameter clear bore size (aperture) to ensure there is sufcient tolerance to align the laser beam after installation. Ducts and Stacks that have thin and exible walls should be reinforced to ensure that the laser beam alignment is maintained at all times. Rigid mounting for the process anges is highly recommended to ensure a

lignment is maintained.

In situations where the process anges are mounted to these thin and exible duct/stack walls, a larger reinforcing plate should be welded around the mounting ange area to increase the attaching region. The gure below depicts a typical suggestion however; it is the installer’s responsibility to ensure appropriately rigid

installation is provided for the analyzer.

Figure 26 - Suggested Reinforcing Plate for Launch or Detect Unit Flanges- reduce exing with mechnical reinforcement to duck/stack walls

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TDLS200 TDL Analyzer Instruction Manual V2.1

Figure 21 - Reinforcing Plate for Launch or Detect Unit Flanges

3.3 Process Flange Welding Alignment and Line-Up

The Launch and Detect units are provided with alignment mechanisms that allow for some manual adjustment of the laser beam direction in both planes. It is however recommended that the following angular tolerances be adhered to as closely as possible.

5.3 Process Flange Welding Alignment and Line-Up

adhered to as closely as possible.

PROCESS FLANGE ANGULAR TOLERANCE

Angular tolerance

PROCESS FLANGE BOLT ALIGNMENT

NOZZLE FLANGE BOLT PATTERN MUST BE AS INDICATED TO ASSURE PROPER MOUNTING OF ANALYZER LAUNCH AND DETECT UNITS

COMBINED ANGULAR OFFSET OF BOTH NOZZLES MUST NOT EXCEED 2” IN ANY DIRECTION. BEST INSTALLATION WILL HAVE NO ANGULAR OFFSET

Figure 27 - Angular Alignment Tolerances for Launch or Detect Unit Flanges

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