Yokogawa TDLS200 User Manual

User’s
Manual

TDLS200

Tunable Diode Laser Spectroscopy Analyzer

IM 11Y01B01-01E-A

Yokogawa Corporation of America

Yokogawa Corporation of America
2 Dart Road, Newnan, Georgia U.S.A. 30265
Tel: [phone] Fax: [phone]

IM 11Y01B01-01E-A

6th Edition

Introduction

Thank you for purchase the TDLS200 Tunable Diode Laser Analyzer. Please read the following respective
documents before installing and using the TDLS200.

Notes on Handling User’s Manuals

• This manual should be passed on to the end user.

• The contents of this manual are subject to change without prior notice.

• The contents of this manual shall not be reproduced or copied, in part or in whole, without permission.

• This manual explains the functions contained in this product, but does not warrant that they are suitable

for the particular purpose of the user.

• Every effort has been made to ensure accuracy in the preparation of this manual. However, when you
realize mistaken expressions or omissions, please contact the nearest Yokogawa Electric representative
or sales ofce.

• This manual does not cover the special specications. This manual may be left unchanged on any
change of specication, construction or parts when the change does not affect the functions or

performance of the product.

• If the product is not used in a manner specied in this manual, the safety of this product may be
impaired.

i

Yokogawa is not responsible for damage to the instrument, poor performance of the instrument or losses
|resulting from such, if the problems are caused by:

• Improper operation by the user.

• Use of the instrument in improper applications

• Use of the instrument in an improper environment or improper utility program

• Repair or modication of the related instrument by an engineer not authorized by Yokogawa.

Drawing Conventions

Some drawings may be partially emphasized, simplied, or omitted, for the convenience of description.
Some screen images depicted in the user’s manual may have different display positions or character types

(e.g., the upper / lower case). Also note that some of the images contained in this user’s manual are display
examples.

Media No. IM 11Y01B02-01E-A 6th Edition :Feb 2013 (YCA)
All Rights Reserved Copyright © 2012, Yokogawa Corporation of America

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

Safety Precautions

Safety Precautions



 Safety, Protection, and Modification of the Product

• In order to protect the system controlled by the product and the product itself and ensure safe operation,
observe the safety precautions described in this user’s manual. We assume no liability for safety if users fail
to observe these instructions when operating the product.

• If this instrument is used in a manner not specified in this user’s manual, the protection provided by this
instrument may be impaired.

• If any protection or safety circuit is required for the system controlled by the product or for the product itself
prepare it separately.

• Be sure to use the spare parts approved by Yokogawa Electric Corporation (hereafter simply referred to as
YOKOGAWA) when replacing parts or consumables.

• Modification of the product is strictly prohibited.

• The following safety symbols are used on the product as well as in this manual.

Safety, Protection, and Modication of the Product

• In order to protect the system controlled by the product and the product itself and ensure safe operation,

observe the safety precautions described in this user’s manual. We assume no liability for safety if users
fail to observe these instructions when operating the product.

• If this instrument is used in a manner not specied in this user’s manual, the protection provided by this
instrument may be impaired.

• If any protection or safety circuit is required for the system controlled by the product or for the product
itself, prepare it separately.

• Be sure to use the spare parts approved by Yokogawa Electric Corporation (hereafter simply referred to
as YOKOGAWA) when replacing parts or consumables.

• Modication of the product is strictly prohibited.

• The following safety symbols are used on the product as well as in this manual.

This symbol indicates that an operator must follow the instructions laid out in this manual in
order to avoid the risks, for the human body, of injury, electric shock, or fatalities. The
manual describes what special care the operator must take to avoid such risks.

DANGER

WARNING

This symbol indicates that the operator must refer to the instructions in this manual in order
to prevent the instrument (hardware) or software from being damaged, or a system failure
from occurring.

ii

CAUTION

This symbol gives information essential for understanding the operations and functions.

Note!

This symbol indicates information that complements the present topic.

This symbol indicates Protective Ground Terminal

ThissymbolindicatesFunctionGroundTerminal(Donotusethisterminalastheprotectiveground
terminal.)

 Warning and Disclaimer

The product is provided on an “as is” basis. YOKOGAWA shall have neither liability nor responsibility to any
person or entity with respect to any direct or indirect loss or damage arising from using the product or any
defect of the product that YOKOGAWA cannot predict in advance.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

TDLS200

CAUTION

SAFETY should be considered rst and foremost importance when working on the equipment described in this
manual. All persons using this manual in conjunction with the equipment must evaluate all aspects of the task
for potential risks, hazards and dangerous situations that may exist or potentially exist. Please take appropriate
action to prevent ALL POTENTIAL ACCIDENTS.

AVOID SHOCK AND IMPACT TO THE ANALYZER THE LASERS CAN BE PERMANENTLY DAMAGED

Laser Safety & Classication according to FDA Regulations. The TDLS200 is Registered with the United States
FDA as a Laser Product.

WARNING

THIS ANALYZER CONTAINS A LASER PRODUCT THAT IS GENERALLY IN ACCORDANCE WITH THE REGULA­TIONS FOR THE ADMINISTRATION AND ENFORCEMENT OF THE RADIATION CONTROL FOR HEALTH AND
SAFETY ACT OF 1968 (TITLE 21, CODE OF FEDERAL REGULATIONS, SUBCHAPTER J). REFER SECTION

1002.10 OF THE REGULATIONS REFERENCED ABOVE.

CAUTION INVISIBLE LASER RADIATION AVOID DIRECT EXPOSURE

MAXIMUM OUTPUT POWER < 1 MW (Oxygen)

MAXIMUM OUTPUT POWER < 20 mW (other Gases) DURING NORMAL OPERATION THIS ANALYZER IS:

CLASS I LASER PRODUCT (according to IEC 60825-1)

CAUTION

iii

The Instrument is packed carefully with shock absorbing materials, nevertheless, the instrument may be
damaged or broken if subjected to strong shock, such as if the instrument is dropped. Handle with care.

Warranty and service

Yokogawa products and parts are guaranteed free from defects in workmanship and material under normal use
and service for a period of (typically) 12 months from the date of shipment from the manufacturer. Individual
sales organizations can deviate from the typical warranty period, and the conditions of sale relating to the origi­nal purchase order should be consulted. Damage caused by wear and tear, inadequate maintenance, corrosion,
or by the effects of chemical processes are excluded from this warranty coverage.

In the event of warranty claim, the defective goods should be sent (freight paid) to the service department of the
relevant sales organization for repair or replacement (at Yokogawa discretion). The following information must be
included in the letter accompanying the returned goods:

• Part number, model code and serial

• Number

• Original purchase order and date

• Length of time in service and a description of the process

• Description of the fault, and the circumstances of failure

• Process/environmental conditions that may be related to the failure of the device.

• A statement whether warranty or nonwarranty service is requested

• Complete shipping and billing instructions for return of material, plus the name and phone number of a

contact person who can be reached for further information.

Returned goods that have been in contact with process uids must be decontaminated/ disinfected before
shipment. Goods should carry a certicate to this effect, for the health and safety of our employees. Material
safety data sheets should also be included for all components of the processes to which the equipment has
been exposed.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

iv

DANGER

WARNING

DANGER

Dont install “general purpose type” instruments in the hazardous area.

CAUTION

The intrument is packed carefully with shock absorbing materials, nevertheless, the instrument may be damaged
or broken if subjected to strong shock, such as if the instrument is dropped. Handle with care.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

TOC-1

TABLE OF CONTENTS

Introduction .......................................................................................................................................................... i

Safety Precutions ............................................................................................................................................... ii

1 Quick Start .................................................................................................................................................1-2

2 Introduction and General Description ....................................................................................................2-1

2.1 Functional Description ........................................................................................................................2-1

2.1.1 Measurement .................................................................................................................................. 2-2

2.2 Instrument Check ................................................................................................................................2-2

3 General Specications .............................................................................................................................3-1

3.1 Model & Sufx Code ............................................................................................................................3-4

4 Analyzer Components ..............................................................................................................................4-1

4.1 Launch Unit .........................................................................................................................................4-2

4.2 Main Electronics Housing ....................................................................................................................4-3

4.3 Laser Assembly ...................................................................................................................................4-6

4.4 Check Gas Flow Cell (for On-Line) ......................................................................................................4-7

4.5 Detect Unit ..........................................................................................................................................4-8

4.6 Process Interface .................................................................................................................................4-9

4.7 Analyzer Connections ........................................................................................................................4-10

4.8 Communications ...............................................................................................................................4-11

4.9 Purge .................................................................................................................................................4-13

5 Installation and Wiring .............................................................................................................................5-1

5.1 Process Measurement Point Considerations .....................................................................................5-1

5.2 Position of Process Flanges for Launch and Detect Units .................................................................5-2

5.3 Process Flange Welding Alignment and Line-Up ............................................................................... 5-4

5.4 Process Flange Clear Aperture ...........................................................................................................5-5

5.5 Mounting the Launch and Detect Units to the Process Flange .........................................................5-5

5.5.1 Process Window Purge Gas Connection .....................................................................................5-6

5.6 Mounting the Process Interface .........................................................................................................5-6

5.7 Typical Purge Gas Conguration, In-Situ ...........................................................................................5-7

5.8 Typical Purge Gas Conguration, Extractive trace ppm H2O system.................................................5-7

5.9 Dimensional Drawings ........................................................................................................................5-8

5.10 Wiring Drawings ...............................................................................................................................5-14

5.11 Hazardous Area Systems .................................................................................................................5-19

5.11.1 Purging Analyzer for Hazardous Areas (with On-Line Validation) ..............................................5-20

5.11.2 Purging Analyzer for Hazardous Areas (without On-Line Validation) ..........................................5-20

5.11.3 Purging Analyzer and Universal Power Supply and/or URD for Hazardous Areas

(with On-Line Validation) .............................................................................................................5-21

5.11.4 Purging Analyzer and Universal Power Supply and/or URD (not using On-Line Validation) ......5-21

5.12 Cyclops Division 2/ zone 2 Purge Indicator, with Switch .................................................................5-22

6 Basic Operations .......................................................................................................................................6-1

6.1 Menu Structure Map...........................................................................................................................6-1

6.2 Software Guide ...................................................................................................................................6-5

6.3 Non-Process Parameters .................................................................................................................6-18

6.4 Reference Peak Lock with 2nd Absorption gas ...............................................................................6-22

6.5 Large Aperture Optics ......................................................................................................................6-26

6.5.1 LAO Installation, Alignment & Dector Gain .................................................................................6-27

6.5.2 Adjustment of Dector Gain for LAO ...........................................................................................6-28

6.5.3 Dector Gain Adjustment Service Tips ........................................................................................6-30

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

6.6 Valve Control Logic ...........................................................................................................................6-30

6.7 Introduction for H2Oppm measurements in Methane Gas ...............................................................6-32

6.8 Introduction to Gas Temperature Predictions with High Temperature Oxygen Measurements .......6-38

6.9 Controlling the Analyzer Remotely or Locally via external PC/Laptop2 ...........................................6-34

6.9.1 Instructions for Connecting an External Computer to the Analyzer ...........................................6-35

6.9.2 Using Ultra-VNC Software ..........................................................................................................6-36

6.9.3 Remote Interface Unit (RIU) ........................................................................................................6-37

6.9.4 Virtual Analyzer Controller (VAC) Operating Software Map ........................................................ 6-37

6.9.5 Remote Interface Unit ................................................................................................................6-38

6.9.6 Virtual Analyzer Controller (VAC) Operating Software Guide......................................................6-38

7 Routine Maintenance ................................................................................................................................7-1

7.1 Maintaining Good Transmission .......................................................................................................... 7-1

7.2 Alignment .............................................................................................................................................7-4

8 Validation and Calibration ............................................................................................................ 8-1

8.1 Off-Line manual/Automatic Checking and Off-Line Calibration..........................................................8-2

8.2 Off-Line Calibration for Reference Peak Lacking Application ...........................................................8-13

8.3 On-Line Validation .............................................................................................................................8-14

8.4 On-Line Validation Overview .............................................................................................................8-14

8.5 Performing manual On-Line Validation ..............................................................................................8-18

8.6 Performing Automated On-Line Validation ........................................................................................8-21

9 Troubleshootin ...........................................................................................................................................9-1

9.1 Common Troubleshooting Steps .........................................................................................................9-2

9.2 Field Up-Gradable Files and Software from Factory ...........................................................................9-9

9.3 Analyzer Warnings ...............................................................................................................................9-9

9.4 Analyzer Faults ..................................................................................................................................9-10

10. Data Files And Format ............................................................................................................................10-1

10.1 Conguring Data Capture .................................................................................................................. 10-5

10.2 Downloading (Transfering/Exporting) the Data ..................................................................................10-8

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<1 QUICK START>

1-1

1 QUICK START

Step Title Description

1.0

1.1 Ensure the process connections match the supplied process interface.

1.2 Ensure the appropriate utilities are available and ready for connection. These may include electrical

1.3 Ensure you comply with any local and/or site specic safety requirements.

1.4 Read the appropriate sections of the Instruction Manual BEFORE starting any installation work –

2.0

2.1 Attach the process interface (alignment anges) to the site installed anges (or isolation valves as

2.2 Carefully mount the Launch and Detect Units to their alignment anges using the quick connect

2.3 Mount optional equipment such as Universal Power Supply (UPS), Universal Remote Display (URD),

2.4

Preparation

Installation

Ambient
Temperature

3.0

3.1 Connect the appropriate electrical power supply.

3.2 Connect the Launch to Detect interconnect cable (supplied with analyzer) according to the supplied

3.3 Connect any analog I/O signals to the analog I/O Board. Outputs land on TB8 and Inputs land on TB9.

3.4 Connect any other equipment such as URD, Ethernet, solenoid valves, digital I/O, etc.

3.5

Wiring

Carefully un-pack and check equipment for any obvious damage. This includes anges, Cables, Power
Supplies, manuals and any other supplied options.

NOTES: There are 14 ferrules in the accessory bag for tubing-piping. The number of ferrule that are
required for actual tubing-piping are different by application. Please see tubing-piping gure
specic to project for exact detail.

power, nitrogen purge gas, instrument air, validation gas, etc.

Contact Yokogawa Laser Analysis Division or Local Agent if any doubts!

If separate process isolation anges have been provided for corrosive service, then install to the
process/stack ange/isolation valves.

appropriate).

If installing Large Aperture Optics, ensure the detect system is correctly mounted and purged to

prevent damage to the large optical element.

coupling.

Remote Interface Unit (RIU), etc.

The analyzer and some accessories (such as LAO, RIU, UPS, URD, alignment anges, etc.) are
suitable for -20 to +50oC ambient operating temperature. Accessories and Options are available to
increase these the operating conditions – please consult Yokogawa for further details.

Ensure that all wiring will enable the analyzer launch and detect units to be freely moved from their
process location to an adjacent off-line calibration cell. This will entail the use of tray rated cables and/
or exible conduit and/or other suitable armored cable. Rigid conduit systems are not recommended.

• 24 VDC to TB1 on the analyzer (launch Unit) backplane. Check that the actual voltage
is >23.5VDC otherwise the SBC and other devices will not function!

• 110/240 50/60 Hz to UPS or URD, then take 24 VDC to analyzer

wiring detail (TB7 on the Launch and TB 13 on the Detect Unit).

Check terminations and ensure all cable shields are landed per supplied wiring details.

4.0

Utilities

4.1 Connect the appropriate process window purge gas (nitrogen for oxygen analyzers) and make site

4.2 Connect the appropriate analyzer on-line check gas ow cell gas (nitrogen for oxygen analyzers) and

4.3 Connect and check any other required utility connections (such as steam trace for heated isolation

NOTE! – All purge, Validation Gas and other gas utility lines should be thoroughly cleaned, dried
and purged prior to connecting to the analyzer
– Failure to do so can result in serious damage to the TDLS200 or contamination to the

internal optical elements.

Connect the appropriate analyzer purge gas (nitrogen for oxygen analyzers) and make site connections
per the supplied purge gas sequence details (including any Hazardous area purge system). Start the
purge gas ow accordingly.

ATEX purge requires dual regulators at the inlet purge gas supply to prevent overpressure damage in
the event of a single regulator failure!

connections per the supplied purge gas sequence details. Start the window purge gas ow
accordingly – ensuring that any isolation valves are open.

make site connections per the supplied purge gas sequence details. Start the purge gas ow

accordingly.

anges or ow cells) or secondary window purges for lethal service gases. Start other utilities
accordingly.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<1 QUICK START>

4.4

5.0

5.1 Use the internal On-Off switch to power-up the analyzer.

5.2 Observe the various LED clusters on the backplane and FPGA boards. All blue LEDs located on the

5.3 Observe the Green power indicator on the SBC.

5.4

6.0

6.1 If there is an installed optional Mini Display (4x20 VFD) – Observe the status line message.

6.2 If there is no installed User Interface, then connect a laptop PC via Ethernet to the SBC mounted

6.3

Power-Up

Checking

Alignment

Leak-check all connections and ensure pressure ratings are not exceeded!

Apply power to the analyzer and using a multi-meter, check for 24VDC power at TB1 on the launch

unit back plane.

lower right side of the back-plane should be on.

Observe the LEDs on the analog I/O board.

If there is an installed optional 6.5” Display and Keypad – Observe the Main Menu messages and

status information.

on the backplane. Initiate the supplied VNC software from the laptop to initiate a VNC session with

the ‘blind’ analyzer and observe the analyzer Main Menu via the laptop.

At this time there may be one or more alarm message due to low transmission, out of range
parameters or other – nal system conguration is still required!

Please also note that the analyzer laser temperature control is disabled for the initializing
period (5 minutes) – this means that even manual control of the laser temperature is disabled
during this period.

Initially, observe the Transmission value through the appropriate user interface. The objective is to
adjust alignment until the maximum transmission value is obtained. Perfect alignment in a clear
process gas will yield close to 100% transmission.

If the analyzer displays a Warning “Validation Required”, this indicates there is no target gas ab­sorption peak found at start-up.

7.0

7.1 Start by adjusting the Launch unit alignment ange nuts up-down and left right. Look for increases

7.2 When it has been maximized at the launch side, adjust the detect unit accordingly.

7.3 Further adjustment can be made by maximizing the raw detector voltage signal (available at test

7.4

8.0

Alignment – check

Detector Gain

Congure

BASIC

8.1 Enter the Basic Menu and go to Congure.

8.2

8.3

8.4

8.5 If any other parameters are required to be set (such as analog I/O ranges, alarms levels, Auto

Optical Path

Gas Pressure

Gas Temperature

Introduce some measured gas into the optical path and re-start or perform a validation with target

gas. This will ensure that the analyzer is correctly tuned to the measurement gas absorption peak.

If this Warning cannot be cleared by either method, please contact Yokogawa Laser Analysis

Division or your local agent for further assistance.

If you have 100% certainty that the analyzer is already measuring the process gas and validation is
not currently possible then, this alarm can be cleared via the Advanced Calibrate & Validate menu.

Initially, observe the Transmission value through the appropriate user interface. The objective is
to adjust alignment until the maximum transmission value is obtained. Perfect alignment a clear
process gas will yield close to 100% transmission.

and decreases in transmission strength to aid in the alignment.

points on both launch and detect). The signal should be maximized and will not exceed 5.3V DC for
low temperature (<600C process) or 9.9V DC for high temperature (>600C process).

For Large Aperture Optics (LAO) systems, please refer to the Detector Gain Adjustment section of
this User Guide to ensure correct functionality and adjustment.

By way of the appropriate user interface, the correct process parameters and other parameters can

now be entered.

Enter in the correct optical path length.

Enter in the correct process gas pressure (if Active, see Advanced Congure).

Enter in the correct process gas temperature (if Active, see Advanced Congure).

Validation sequences) then the Advanced Menu needs to be accessed.

Advanced Menu access is Password protected and should only be used by skilled and

trained persons - Contact Yokogawa Laser Analysis Division or Local Agent if any doubts!

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<1 QUICK START> 1-3

2-3

9.0

Congure

Using the correct password (Default 1234), enter in to the Advanced Menu, then the Congure.

ADVANCED

9.1 Select the desired measurement units (English or Metric selected on an individual parameter basis).

9.2

9.3

9.4

9.5 Congure the system I/O by entering in to the System I/O sub menu in Congure.

9.6 If the Analog I/O board is installed, then select Analog Output and set the appropriate 4mA and

9.7 Select what mode (Block, Track or Hold) the 4-20mA outputs are to be when the analyzer is in

9.8 Congure Digital outputs – Warnings and Faults. Many of these will be factory preset so if unsure

9.9 Go to the Data screen and set the appropriate parameters for and ‘Spectrum Capture’. These will

9.10 Go to the Trends screen and review/plot several of the listed parameters to check analyzer

9.11

Optical Path

Gas Pressure

Gas Temperature

Non- Process
Parameters

10.0

10.1 To Export Data, simply insert an empty USB memory stick in to a USB port on the launch unit back

10.2 Close out the VNC software and disconnect the service PC – if connected.

10.3 Ensure the doors/lids are closed and tightly sealed.

10.4 The system is now in normal operation mode.

10.5

Normal Operation

Enter in the correct optical path length.

Select Fixed or Active.
If Fixed, enter in the correct process gas pressure.
If Active, enter in the 4-20mA input signal range proportional to the pressure range.

“Control” mode is not applicable to TDLS200

Select Fixed or Active.
If Fixed, enter in the correct process gas temperature.
If Active, enter in the 4-20mA input signal range proportional to the temperature range.
Active ambient and Active Peaks may also be used, refer to project specic and application
specic details.

“Control” mode is not applicable to TDLS200

20mA values for Ch1 Concentration and Ch2 Transmission.

Warning, Fault and Calibration Modes.

about any settings then leave as Factory Default. Select and set level for Alarm Limit to either the
Measured Gas orTransmission.

ensure the analyzer stores important information during operation that may be used to verify

operation/status/diagnostics and other trouble shooting.

performance over a period of time.

If the application use gas containing the target gas (e.g. Oxygen measurement with
Instrument Air Purge) then the Non-Process parameters should be congured as detailed later in
this manual under the Software Section. Non-Process Parameters should also be congured if
using a linelocking gas in the validation cell (e.g. CO for combustion).

When the site/eld conguration is complete and the analyzer has operated for at least two hours
without any functional alarms, then perform an export data routine.

plane. The data transfer may take several minutes.

DO NOT REMOVE THE MEMORY STICK DURING THIS TIME!

We RECOMMEND sending all the Exported Data les to Yokogawa Laser Analysis Division
along with any notes and comments. We will then be able to store these les on a master
record for future reference.

Please carefully read the appropriate Sections of this Instruction Manual. The TDLS200 Tunable Diode
Laser (TDL) Analyzer is a technologically advanced instrument that requires the appropriate care when
handling, installing and operating.

Failure to do so may result in damage and can void any warranties!

If there is any doubt about any aspect of the Instrument or its use, please contact Yokogawa Laser
Analysis Division and/or your authorized Representative/Distributor.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<2. INTRODUCTION AND GENERAL DESCRIPTION>2-3 2-1

2 INTRODUCTION AND GENERAL DESCRIPTION

The TDLS200 TDLS analyzer is designed to measure
selected target gases in gas phase samples directly

at the process point (across stack, across pipe,
etc.), close coupled/by-pass leg or in full extractive
systems (ow cell).

The analyzer measures free molecules on a path

averaged basis. Unless there is an extractive
sampling system up-stream that removes water (or
other condensables) then the measurements are
considered to be on a ‘Wet Basis’.

Measurements are possible (with correct analyzer

conguration) at the following conditions:

• Gas temperatures up to 1500˚C (2730˚F)

• Gas pressures up to 10 BarG (145 psig)

• High Particulate loading (as a function of mea
surement path length)

Each application may differ in maximum

limitations depending upon the combination of

gas temperature, gas pressure, optical path length

and concentration of the gas being measured. The
standard analyzer is designed for operation in a Safe

Area (General Purpose). The addition of a Purge

System facilitates operation in Hazardous Areas in

accordance with the relevant UL, CSA and ATEX

standards for gaseous releases.

The basic TDLS200 analyzer comprises two units,

the Launch Control Unit and Detect Unit.

Various Process Interface congurations are

available for connecting the analyzer to the
measurement point. Several options may be added

to the standard analyzer such as:

2.1 Functional Description

Tunable Diode Laser Spectroscopy (or TDLS)

measurements are based on absorption
spectroscopy. The TDLS200 Analyzer is a TDLS
system and operates by measuring the amount of

laser light that is absorbed (lost) as it travels through
the gas being measured. In the simplest form a

TDLS analyzer consists of a laser that produces

infrared light, optical lenses to focus the laser light

through the gas to be measured and then on to a

detector, the detector, and electronics that control

the laser and translate the detector signal into a

signal representing the gas concentration. Gas
molecules absorb light at specic colors, called
absorption lines. This absorption follows Beer’s Law.

Using a Tunable Diode Laser as a light source for

spectroscopy has the following benets:

• Sensitivity. As low as 10-6 by volume, lower

with path length enhancement.

• Selectivity. The narrow line width of the laser is
able to resolve single absorption lines. This
provides more choices of a particular peak
to use for measurement, usually allowing one
isolated peak to be used.

• Power. Diode lasers have power ranging from

0.5 mW to 20 mW. Also, being highly coherent

this allows measurement in optically thick

environments (high particulate loading).

• Monochromatic, no dispersive element (lter,
etc.) required. Light source itself is selective.

• Mini Display

• 6.5” screen and keypad

• Display sun shield

• Optional Universal Power Supply (with or
without a Mini Display)

• Remote Interface Unit (not required for normal
operation)

• Hazardous Area purge systems

• Other options may also be added.

• Tunable Wavelength can be swept across the
entire absorption feature, this allows resonant
(peak) and non resonant (baseline)
measurement during every scan. By

measuring the baseline and peak power at the
detector, transmission can uctuate rapidly by
large amounts without affecting the
measurement. This is useful for high particulate
applications.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<2. INTRODUCTION AND GENERAL DESCRIPTION> 2-2

Currentramptolaser

SignalatDetector

Currentramptolaser

SignalatDetector

ProcessedDetectorSignal

2.1.1 Measurement

• During measurement the laser is held at a xed temperature.
This is the coarse wavelength adjustment.

• A current ramp is fed to the laser. This is the ne
wavelength adjustment. Figure 1.

• The current is ramped to scan across the wavelength region desired.

Figure 1.

• The collimated light passes through the gas to be

measured. The amount of light absorbed by the peak is
proportional to the analyte concentration.

• The light is then focused on a detector. Figure 2.

• This signal is used to quantify the light absorbed by the analyte.

Figure 3.

Figure 2.

Currentramptolaser

Figure 3.

2.2 Instrument Check

Upon delivery, unpack the instrument carefully and inspect it to ensure that it was not damaged during
shipment. If damage is found, retain the original packing materials (including the outer box) and then
immediately notify the carrier and the relevant Yokogawa sales ofce.

TDLS Analyzer

MODEL

TDLS200

SUFFIX

STYLE
SUPPLY --- 24.0 VDC

MAX 120W

AMB TEMP -20 TO 50
NO.

THIS PRODUCT COMPLIES WITH
21 CFR PART 1040.10

Made in USA

KCC-REM­YCA-EEN999

Make sure the model number on the
nameplate of the instrument agrees with your
order.

The nameplate will also contain the serial

number and any relevant certication marks.
Be sure to apply correct power to the unit, as

detailed on the nameplate.

For products used within the European
Community or other countries requiring the CE
mark and/or ATEX classication, the following
labels are attached (as appropriate):

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<2. INTRODUCTION AND GENERAL DESCRIPTION>2-2 2-3

TDLS200 Instruction Manual V2.1

For Zone 2 (CAT 3) ATEX use the following labels will be attached as appropriate:

For YR-200 (Remote Interface Unit, RIU) Zone 2 (CAT 3) ATEX use the following labels will be attached
as appropriate:

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<2. INTRODUCTION AND GENERAL DESCRIPTION> 2-4

CAUTION - For Cleaning of the labels and LCD window, please use wet cloth to avoid electrostatic

condition.

NOTE - ATEX Hazardous Area Operation:

Product MUST NOT be used in Zone 0 (CAT 1) locations

Product MUST NOT be used in Group I (Dust/Grain) locations

Product MUST NOT be used in Group III (Fibers) locations

Conditions of Certication

On loss off purge an alarm shell be made to inform the user, action shall then be taken by the user to

ensure continued use is safe.

A functional test shall be carried out in accordance with clause 17.1 of EN 60079-2:2007 to verify the
parameters of the Purge Control Unit when tted.

A leakage test shall be carried out in accordance with clause 17.2 of EN 60079-2:2007. The

manufacturer shall record and retain these results.

Only Lithium batteries specied in manual are to be used in this enclosure.

Special Conditions of Certication:

A suitability certied Purge Control Unit must be sued with the TDLS Analyzer that is capable providing
the requirements listed on label/certicate and that either provides a suitable exhaust through a particle

barrier of to a safe area.

When installed there shall be a minimum of two pressure regulators in the air/nitrogen supply line.

Materials of Construction

The analyzer incorporates a variety of materials in its construction and they should therefore be

used in an appropriate manner. Any chemicals (liquid or gas) that may have a detrimental effect on

the product’s structural integrity should not be allowed come in contact.

The electronic enclosures are constructed from Aluminum Alloy AL Si 12 (ASTM A413) and have a
protective epoxy powder coated surface nish.
The welded bodies are constructed of stainless steel grade 316
The fasteners are constructed of stainless steel grade 18-8
The windows (when tted) are constructed of laminated safety glass

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<2. INTRODUCTION AND GENERAL DESCRIPTION>2-4 2-5

Maintenance Work by Qualied Personnel

Unqualied work on the product may result in severe personal injury and/or extensive damage to
property. If the Warnings contained herein are not adhered to the result may also be severe
personal injury and/or extensive damage to property.

This product is designed such that maintenance work must be carried out by trained personnel.

Trained personnel are considered as below:

- Engineers familiar with the safety approaches of process analytical instrumentation (and/or
general automation technology) and who have read and understood the content of this
User Guide.

- Trained start-up/commissioning analyzer technicians who have read and understood the
content of this Instruction Manual.

WARNING – Battery replacement

Replacement Battery Installation (Type CR2032 located on CPU).

The battery MUST be factory installed and cannot be installed by others at site (soldered connections,
required) – Contact factory for further assistance

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

3 GENERAL SPECIFICATIONS

0.5A@125 VAC

<3. GENERAL SPECIFICATIONS>

3G with purge system EEx pz II T5

Class 1 Div.2 Group BCD with integral purge
kit

KC mark: KCC-REM-YCA-EEN999

3-1

USB1 and USB2 connection for data
transfer using memory stick, data storage

in CF card (result les, spectra capture,
conguration data, etc.) Capture rate is
congurable typical capacity for results and

spectra is 14 days.

2”, 3” or 4” 150# ANSI RF or adaptors for
DN50 PN16, and DN80 PN16

2” 150# Alignment ange 4.5kg (10lbs),
3” 150# Alignment ange 9.5kg (15lbs),
4” 150# Alignment ange 9.1kg (20lbs)

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<3. GENERAL SPECIFICATIONS>

Performance Specification

Repeatability: Application Dependent

Linearity: +/- 1% of FS

Response time: 2-20 seconds, plus transport time for

extractive systems when applicable

Drift: Application Dependant

Installation Specifications

Hazardous Area: Zone 1: Contact Yokogawa
Zone 2: ATEX group II Cat. 3G with purge

system EEx pz II T5 (-20< Ta <50C)

By Design: Non-Hazardous Area; Purge required for
ATEX zone 1&2 and NEC Class 1
Division 1&2

Maximum Distance between Launch and Detect:

30 m (±90ft)

Maximum interconnecting cable 50m

Wetted Parts: Analyzer & standard Alignment Flange - 316

SS, BK-7 Glass, Teflon encapsulated Viton
and Silicone RTV sealant.

Basic System Configuration

The TruePeak can be installed in a number of ways depending on

process requirements. The most typical installation types are shown
below, however other installation methods are possible, please contact
Yokogawa with your application details.

Cross Stack/Pipe Configuration

• Measures directly across process pipe or vessel

• Typically has nitrogen or other purge gas protecting

process windows

• Span Validation via serial flow cell (see Operation Specifications).

• Full calibration requires removal from process

• May require pressure and temperature inputs
(Application Dependant)

• Multiple methods to increase Optical Path Length (OPL) if needed

• 5 meter interconnection cable standard

Close Coupled Extractive / Bypass Configuration*

Optional: Isolation Flanges and Flow Cells - 316 SS,

Sapphire, Kalrez ­Also available in Monel A400, Hastelloy
C-276, Carpenter 20, Titanium Grade 2 and
others on request.

Utilities:

Instrument Air may be used as a purge gas in principle for all of the
below applications, but this will depend on the application type and the
required precision of the measurement.

Oxygen Analyzer N
CO Analyzer N2 or Instrument Air
CO

Analyzer N2 or other non-CO2 containing inert gas

2

H

O ppm Analyzer N2 with <20ppm levels H2O for feed to

2

H

O % Analyzer N

2

2

optional Dryer Package

2

Flow Rate: • 5-30 L/min for window purge

• 2 L/min for validation, calibration and optical

purge

SIL Assessment:

The TDLS200 has a FMEDA assessment by exida and is
classified as a Type B1 device in compliance with the following
standards; IEC 61508 or EN 954-1. Functional Safety of Electrical/
electronic/programmable electronic related systems; SIL 1

capability for single device.

* The TDLS200 is not SIL certified as standard; to be certified the unit
must be specified and designed from the beginning to meet all SIL

specifications.

Cal
inlet

PROCESS

• Measures across a section of pipe where process flow
is directed

• The measurement section can be isolated from process flow for full
calibration/validation, zero and span

• Process pressure and temperature can be controlled
or the analyzer may require pressure and temperature inputs
(Application Dependant)

• Length of measurement section dependant on accuracy requirements

and process conditions

Extractive Configuration*

process
sample
inlet

Zero check gas,
at grade

Span check gas.
at grade

Flow-Cell-Outlet

• Sample is fully extracted from process
(and may be conditioned before measurement).

• Flow cells are available with ability to purge in front of windows
(balanced flow cell) if required.

• Process pressure and temperature can be controlled
or the analyzer may require pressure and temperature inputs
(Application Dependant)

• Length of flow cell dependant on accuracy requirements

and process conditions

* Contact Yokogawa for further details

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<3. GENERAL SPECIFICATIONS>

3-3

Standard Accessories

Calibration Cell: - Used for off-line calibrations and

validations

- Stainless steel 316 with free standing

frame

- Connects Launch and Detect with

72.6cm (28.6") OPL

Flow Cells: - Used for extracted sample streams at any

location

- 316SS low volume fixed alignment; 50ºC,

5.5 bar (80psig) max

- Enhanced for 200ºC, 20 Bar (290psig),
Sapphire window, Kalrez o-rings and can
be constructed from 316SS, Monel A400,
Hastelloy C-276, Carpenter 20 and other
materials on request to suit the process

Isolation Flanges: - Used for additional protection for in-situ

or by-pass installations

- 2” or 3” 150# or 300# ANSI RF, 4”150#,
DN80 PN16 welded 5/8” or M16” bolt
studs included sapphire 20 Bar (290 psig)
or BK-7 5.5bar (80 psig) isolation window

- Kalrez window seal o-ring rated max
200ºC

- 316SS, Monel A400, Hastelloy C-276,
Carpenter 20, other on request

Note: Must use in conjunction with alignment flanges

Utility Panel: - Used for convenient field installation of

utilities, configurations for

- Single, dual or four analyzers

- Manual or automatic on-line validation
(controlled by analyzer)

- Safe area (GP), Div 2 purged or non­purged, ATEX CAT 2G components

- Purge flowmeters with integral needle
valve, glass tube variable area

- Swagelok double ferrule stainless steel tube

fittings and tubing standard

- Panel mounted or fiberglass (NEMA 4X/
IP65), with viewing window

- 5A 24VDC power supply, output to
analyzer – requires VAC input power

Display and Software Functions

TruePeak Software has multiple levels, the default (or start page) is
the Main Menu:

Main Menu Displays: - Concentration & Units (% or ppm)

- Transmission %

- Status (warm-up, OK, Warning, Fault,
etc.)

- Temperature (Fixed, Active Ambient or
Active)

- Pressure (Fixed or Active)

Main Menu:

Basic Menu - Configure, 3 functions

- View Spectra, 2 functions

- Data, 3 sub-menus

- Trends

Advanced Menu - Configure, 9 sub-menus
(User Password) - Calibrate & Validate, 3 sub-menus

- Data, 4 sub-menus

- Trends,

Active Alarms - List of active alarms
Shut Down Analyzer - Instructions to close TruePeak local or

VAC

Calibration Functions:

Off-line Calibrations: - Zero calibration

- Zero off-set

- Span calibration

- Transmission

- Dark current

- peak search

Off-line Validations: - Check gas #1

- Check gas #2

- Check gas #3

On-Line Validations: - Manual

- Automatic

Setup Functions:

Configuration: - Process Path Length

- Pressure

- Temperature

- Units

- System I/O

- System

- Valve Control

- Laser Spectra & Control

Note: Custom configuration available to suit customer requirements

Integration: - Used for convenient analyzer & extractive

system/flow cell integration

- Free standing frame, galvanized steel with
304SS roof

- Fiberglass enclosure with powder coated

steel frame

- Heat tracing and insulation for flow cells

and sample handling

- 316SS and/or Monel A400 wetted parts –
other on request

- Sample handling and conditioning

systems to suit applications

- Stream switching manual or automatic
(controlled by analyzer)

Note: Custom configuration available to suit customer requirements

Diagnostics:

Warnings include: - Detector signal low

- Transmission low

- Spectrum noise high

- Process pressure out of range

- Process temperature out of range

- Concentration out of range

- Board temperature out of range

- Validation failure
Faults include: - Laser temperature out of range

- Detector signal high

- Detector signal lost

- Peak center out of range

Output Settings:

Analog Output: - Channel 1

- Channel 2

- Channel 3

- Warning Mode

- Fault Mode

- Field Loop Check

- AO CH calibration

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<3. GENERAL SPECIFICATIONS>

3.1 Model and Sufx Codes

Model Sufx Code Option Code Description

TDLS200 -------------------------------------------- ---------------------------- Tunable Diode Laser

Type -N ---------------------------- General Purpose (None CE)

-G ---------------------------- General Purpose (CE/KC)

-D ---------------------------- Class I Div 2 BCD Purged

-S ---------------------------- ATEX CAT 3/ zone 2 Purged, KC

-J ---------------------------- TIIS Hazardous Area

Gas Parameter -X1 ---------------------------- Oxygen (O

-X2 ---------------------------- Oxygen (O

-X3 ---------------------------- Oxygen (O

-C1 ---------------------------- Carbon Monoxide (CO) % <500°C

-C2 ---------------------------- Carbon Monoxide ppm (CO) <500°C

-C3 ---------------------------- Carbon Monoxide ppm (CO) <1500°C

-C4 ---------------------------- Carbon Monoxide (CO) ppm <1500°C + CH4 0-5%

-A1 ---------------------------- Ammonia (NH

-A2 ---------------------------- Ammonia (NH

-S1 ---------------------------- Hydrogen Sulde (H

-D1 ---------------------------- Carbon dioxide (CO

-D5 ---------------------------- Carbon dioxide (CO

-H1 ---------------------------- Water moisture (H

-H2 ---------------------------- Water moisture (H

-H3 ---------------------------- Water moisture (H

-H4 ---------------------------- High moisture (H

-K1 ---------------------------- Special Applications

Laser Interface -N ---------------------------- None- Blind Controller

-1 ---------------------------- Integral Mini Display

-2 ---------------------------- Integral Color LCD Backlit

Interface -N ---------------------------- No Process Interface Included

-A ---------------------------- Large Aperture Optics with 3" 150# alignment bellows

-B ---------------------------- Large Aperture Optics, with 4" 150# alignment bellows

-2 ---------------------------- 2" 150# Alignment Bellows

-3 ---------------------------- 3" 150# Alignment Bellows

-4 ---------------------------- 4" 150# Alignment Bellows

-5 ---------------------------- DN50 Alignment Bellows

-8 ---------------------------- DN80 Alignment Bellows

) < 600°C, 0-25%

2

) < 1500°C, 0-25%

2

) <1500°C, 0-25%/ Temp

2

) up to 0-5,000ppm

3

) 0-5,000ppm & 0-50% H2O

3

S) up to 0-50%

2

) High Range 0-1; 0-5%

2

) Extend. Range 0=5; 0-50%

2

O) min 0-30ppm Cl2 background

2

O) ppm non-hydrocarbon background

2

O) ppm Hydrocarbon background

2

O) level min 0-5%

2

Options /U ----------------------- Ext.USB Port IP66 (NOT ATEX)

/P ----------------------- Pressure Comp Curve

/D ----------------------- Diverging Beam No Large Aperture Optics

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

TDLS200 TDL Analyzer Instruction Manual V2.1

Launch to Detect Interconnect (cable)

Launch Unit:

• Main Electronics Housing

• User Interface (optional)

• Laser Assembly

• Check Gas Flow Cell (for

On-Line Validation)

Detect Unit:

• Detect Electronics

Housing

• Detector

Assembly

Process Interface:

• Analyzer detachable from process interface for Off-Line

calibration / service.

• Flanged O-Ring Alignment

• Flanged Metal Bellows Seal Alignment

• Flow Cell

• Isolation Flanges

• By-Pass Piping

• Custom designs for specific applications.

Hazardous Area Purge (optional)

•

NEC/CSA Class 1, Div. 2, Gr. A-D

• ATEX Zone 2 Cat 3

4 ANALYZER COMPONENTS

<4. ANALYZER COMPONENTS>

4-1

Launch Unit:

• Main Electronics Housing

• User Interface (optional)

• Laser Assembly

• Check Gas Flow Cell (for
On-Line Validation)

Hazardous Area Purge (optional)

• NEC/CSA Class 1, Div. 2, Gr. A-D

• ATEX Zone 2 Cat 3

Launch Unit:

• Analyzer detachable from process
interface for Off-Line calibration / service.

• Flanged O-Ring Alignment

• Flanged Metal Bellows Seal Alignment

• Flow Cell

• Isolation Flanges

• By-Pass Piping

• Custom designs for specic applications.

Detect Unit:

• Detect Electronics

Housing

• Detector Assembly

Launch to Detect Interconnect (cable)

Figure 4 - System Overview

• The Launch Unit and Detect Unit are connected to each other via a Tray Rated 4-pair shielded twisted

pair cable.

• The Launch Unit requires a single 24VDC power supply (by customer or via optional Power Supply
Unit).

• Nitrogen purge gas is required to prevent ambient oxygen ingress however, for other target gases it
may be possible to use Instrument Air for purging.

• The Process Interfaces are available in various formats, sizes and materials to suit the desired
measurement/installation.

• The available Remote Interface Unit (RIU) can be located typically up to 100m (330ft) away from the
Launch Unit. The RIU also requires a 24VDC power supply. The RIU connects to the Launch Unit on
Ethernet (10-base-T 10/100) via CAT5e eld rated cable.

• The available Universal Remote Display (URD) can be located typically up to 40m (120ft) away from the
Launch Unit. The URD requires an AC power input that is connected to a universal power supply with
24VDC output power supply (for the analyzer). The URD connects to the Launch Unit via multipair

sheilded twisted pair cable.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

4.1 Launch Unit

Main Electronics Housing

• Back Plane circuit board

• Single Board Computer (SBC)

• FPGA signal Processing board

• Analog I/O circuit board

• Field electrical terminals are located on Back Plane
(and optional Analog I/O board).

• Optional Mini Display (4x20 VFD) shown

<4. ANALYZER COMPONENTS>

Check Gas Flow Cell

Short cell (gas tight chamber)

allows Zero Gas or Span gas to
flow through the measuring path for

on-line validation)

4-2

Figure 5 - Launch Unit - Optional Keypad and Display

Laser Housing and Laser Module

• Laser diode and collimating lens assembly

• Laser module designed to be field

replaceable and purged to prevent
ambient air ingress.

• Housed in a stainless steel body with
O-rings seals, attached to the main

electronics housing.

Laser Assembly

Check Gas

Flow Cell

Main

Electronic

Housing

Process

Interface

Figure 7 - Launch Unit OverviewFigure 6 - Launch Unit-Optional Keypad & display

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<4. ANALYZER COMPONENTS>

4.2 Main Electronics Housing

Enclosure

Die cast copper free aluminum grade AL Si 12 alloy (A413.0) with a powder coat exterior nish. The copper free
aluminum alloy is particularly resistant to salt atmospheres, sulfur gases and galvanic corrosion.

An externally hinged door opening to the left incorporates a weather tight gasket seal and four captive fastening
screws (stainless steel). The external dimensions are approx 16” W x 12” H x 7”
D (400mm x 300mm x 180mm).

The environmental protection rating is considered IP65 (EN 60529) or NEMA 4X.

Cable entries are located on the bottom face of the enclosure. They are typically ¾” Myers hubs that have ¾”

NPT female threads. Each has a ground lug to facilitate the grounding of cable shields to the analyzer chassis.

When an analyzer has been supplied with the optional Mini Display (4x20 VFD), the normally blank
(blind) door has a different conguration. The center of the door has a cut-out measuring approx 3”
W x 1” H (75mm x 25mm). A clear laminated safety glass window is mounted to the inside of the door with stain­less steel fasteners and a weather tight gasket. This allows for external viewing of the actual VFD display without

opening the door.

When an analyzer has been supplied with the optional integral 6.5” display and keypad, then the normally blank
(blind) door has a different conguration. The left hand side of the door has a cutout measuring
approx 5” W x 4” H (130mm x 100mm). A clear laminated safety glass window is mounted to the inside of the
door with stainless steel fasteners and a weather tight gasket. This allows for external viewing of the actual
display without opening the door. The right hand side of the door accommodates a keypad (30 keys, stainless
steel) which is also operated externally without opening the door.

Backplane Circuit Board

Large (approx. 10” H x 15” W) printed circuit board that mounts inside the enclosure. The board has
several integral circuits and several connectors to accommodate various plug-in boards. The board is
designed such that any eld terminations are located along the lower edge of the board via pluggable
terminal blocks for customer or eld cable interface.

All components and devices on the board are designed for extended temperature (-20 to +80ºC) and low drift

operation.

The Backplane Circuit Board contains the following integrated circuits:

• DC Power Input

• DC Power Distribution

• Watchdog Circuit

• Display Backlight Power Interrupt

• Alarm Relays

• Remote Calibration Initiation

• Calibration Valve Driver Relays

• Laser Temperature and Current Control

• Board temperature

DC Power Input

There are four pluggable screw terminals located on the lower right hand side of the Back Plane. These are used
for connecting the 24VDC power input supply.

There is an adjacent On/Off miniature toggle switch and re-settable thermal fuse.

The single 24DVC power supply is distributed to various output power channels. Each output power channel
has the appropriate DC-DC converter, regulator(s), ltering capacitors and status LEDs, etc.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<4. ANALYZER COMPONENTS>

Relay Coil

24VDC

TB3

DGND

wired outputs to prevent

4-4

Watchdog Power Interrupts

The power output channels for microprocessors have control logic lines (TTL activated). These allow for
watchdog interrupt/reset functionality.

Alarm Relays

There are three alarm relay circuits on the board. These are capable of actuating Form C Single Pole Double
Throw (SPDT) relays. The three connections of each relay (Common, Normally Open and Normally Closed) are
routed through the board to eld terminals.

The contacts are rated for a maximum of 1A @ 24VDC.

The pluggable eld terminals are mounted on the lower edge of the board, just to the left side of
the DC power input terminals. The appropriate relay(s) is actuated when there is an analyzer
Warning, Fault and/or Level Alarm.

Remote Validation/ Remote Calibration Initiation

A validation/calibration routine can be initiated from a remote location (up to 300m away) using contact
closures. The Back Plane has circuitry such that it can monitor for a return voltage. The return voltage comes
from remote Volt Free Contacts (VFCs) at the customer DCS (or other control system).

The circuits include suitable protection against inadvertent shorting/grounding of the supply 24VDC or the
application of excess power to the monitoring circuit. There are three sets of remote contact monitoring circuits
on the Back Plane.

Valve Relays

There are three calibration valve relay circuits on the board. These are capable of actuating Form C SPDT
relays. The common pole is connected to 24VDC power and the normally open pole is routed to the eld
terminal block. Digital ground is also routed to the terminal block TB3 as shown below.

FPGA
TTL out

Relay Coil
Drive Circuit

Relay Coil

Relay

Relay

Contacts

Contacts

24VDC to

24VDC to C

C and to NO

C to NO

NOTE; Use ferrite coil or
direction diode on TB6

24VDC to external

switching spikes

Figure 8 - Calibration Valve Relay Diagram

24VDC 12W max to

solenoid valve when

external solenoid valve

relay is engergized

when relay is energized

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<4. ANALYZER COMPONENTS>

Connections of each relay (Common and Normally Open) are routed through the board to eld terminals.

The contacts are rated for a maximum of 1A @ 24VDC (or 0.5A @ 125VAC).

The pluggable eld terminals are mounted on the lower edge of the board, just to the left side of the DC power

input terminals.

The appropriate relay(s) is actuated when a calibration gas check valve is to be initiated.

Laser Temperature & Current Control

The board has two main laser control function circuits, temperature control and laser current control.

Board Temperature

The board has a temperature sensing chip/circuit that monitors temperature of the board inside the main
electronics enclosure. The sensor is located on the top edge of the Back Plane.

Backplane Circuit Board Power & Signal Routing

The Back Plane carries out several routing functions for both power and signals: I/O for Detect Unit is routed
through the Back Plane from one set of pluggable eld terminals (located lower left hand of Back Plane) to the
appropriate destination. Terminals are provided for:

• Analog DC power (x3)

• Raw Detector Signal (differential voltage) (x2)

• Detect Unit Temperature (differential voltage) (x2)

Analog I/O Board outputs the analyzer results and reads input process gas compensation values (pressure and

temperature). The board has power status LEDs as well as voltage test points for the input and
output channels.

• Output channels (three) are ranged 0-20mA. They can be assigned to measured values Oxygen,
Transmission or compensation signal re-transmission.

• Input Channels (two) are used by the analyzer to read active values for process gas temperature
and/or process gas pressure. These are application dependant and may or may not be required
inputs. There are two channels, one for temperature and one for pressure. Each may be used to
read 4-20mA signals that are isolated or to read and loop power (with integral 24VDC) signals.

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00

<4. ANALYZER COMPONENTS>

4-6

Optional Mini Display (4x20 VFD) mounts on the analyzer enclosure door. The display itself is an indus-

trial grade 4 line 20 character vacuum uorescence display (VFD) that is self illuminating (i.e. no back light
required).

Optional 6.5” Display is an industrial grade 6.5” VGA color TFT LCD Module that has a built-in CCFL
backlight. Both the display and interface board are mounted to a cover plate that attaches to the inside of

the enclosure door.

Optional Keypad is an industrial rated 30 key unit that has a PS/2 (6-pos miniDIN) interface direct to the
SBC. It has an Ingress Protection Rating of IP65 equivalent to NEMA 4X and is of low prole design.

Backplane Field Terminal Blocks:

• TB1 - 24VDC Power input 80 w (and optional purge power)

• TB2 – Remote Initiate Validate, calibrate and/or streamswitch

• TB3 – Solenoid Valve(s) Drivers (max 11 w each @24 VDC)

• TB4 – Alarm Contacts (Warning & Fault) Form-C

• TB5 – Alarm Contacts (user & optional Purge) Form-C, Purge is closed on pressure

• TB6 – Ethernet TCP/IP 10/100

• TB7 – Launch Control to Detect Interconnect

• TB14 – Remote Mini Display

Analog I/O Board

• TB8 – Analog Outputs, three 4-20mA isolated

• TB9 – Analog Inputs, two 4-20mA powered or loop powered

Optional Feed-through Board (URD only)

• TB10 – Ethernet to remote Analyzer via Interconnect Cable

• TB11 – to remote Analyzer via Interconnect Cable

• TB12 – Local Connections for RIU or URD + Field I/O

4.3 Laser Assembly

The laser assembly contains: Laser Diode, Collimating Lens, Module,
Body, Window

Laser Assembly Body

Laser Assembly Body is a stainless steel mechanical pipe

housing that accommodates the module and protects it from the
environment. The body has two Swagelok style tube fittings welded
on that serve as inlet and outlet ports for the nitrogen purge gas. The

body attaches to the Main Electronics Housing with an O-Ring seal

and several stainless steel fasteners. At the other end of the body
there is a standard adaptor piece welded in place. This adaptor

can fit several different Process interface systems as well as an off-

line calibration cell. The adaptor also accommodates the standard
Process isolation window holder.

Laser Module

Laser Module is a mechanical component that holds both the

laser diode and the lens holder. The assembly is factory set­up, permanently configured and can be replaced in the field if

necessary.

Body

Laser
Module

Figure 9 - Laser Assembly

Window

Figure 10 - Laser Module

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Laser Diode is either a Vertical Cavity Surface-Emitting Laser (VCSEL) or Distributed Feedback (DFB) that
outputs at wavelengths in the 750nm to 2400nm range (invisible)

depending on the target gas being measured. The primary
output wavelength of the laser is controlled by a thermoelectric

cooling module (Peltier Element). The laser diode is permanently

attached to the module. Collimating Lens is an optical
component that collimates the diverging light source.

4.4 Check Gas Flow Cell (for On-Line Validation and/or

Laser
Module

Check Gas

Body

Line Locking

Flow Cell

The Check or Check Gas Flow Cell is a short chamber that exists
between the laser collimating lens and the standard Process

isolation window. The cell is sealed with double O-rings and is

in series with the measurement optical path. The body has two

Figure 11 - Check Gas Flow Cell

Swagelok style tube fittings welded on that serve as inlet and
outlet ports for the nitrogen purge gas or calibration check gas as
appropriate.

The Check gas flow cell is used for performing on-line validations (or Dynamic Spiking) while the analyzer is mounted

on the Process. This feature allows for the analyzer to be validated without removing it from the Process location.

By introducing a gas of known target gas concentration, at a given temperature and pressure, the analyzer can

determine if the Validation routine has been PASSED or FAILED.

Window

This cell can also be used for Line Locking applications, such as %CO for combustion applications. Refer to
Non-Process Parameters for details of how to configure the software when implementing a line-locking application.

Please also refer to project specific drawings for detail of how to configure the tubing/valving when implementing line

locking.

The various parameters that enable the validation are all configurable within the TDLS200 software. Refer to the

Validation and Calibration section of this User Guide for further details.

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4.5 Detect Unit

<4. ANALYZER COMPONENTS>

4-8

Detect Electronics Housing

• Detector Circuit Board

Process Interface

Detect unit

Detect

Electronic

Housing

Detect

Assembly

Detector Housing and Detector Module

• Detector and focusing lens assembly

• Detector module designed to be field replaceable

and purged to prevent ambient air ingress.

• Housed in a stainless steel body with O-rings

seals, attached to the detect electronics housing.

Figure 12 - Detect Unit

Detect or Electronics Housing

The Enclosure is die cast copper free aluminum grade AL Si 12 alloy (A413.0) with a powder coat exterior finish.

The copper free aluminum alloy is particularly resistant to salt atmospheres, sulfur gases and galvanic corrosion. A

removable cover (lid) incorporates a weather tight gasket seal and four captive fastening screws (stainless steel). The
external dimensions are approx 7” W x 7” H x 4” D (180mm x 180mm x 100mm).

The environmental protection rating is considered IP65 (EN 60529) or NEMA 4X.

The cable entry located on the bottom face of the enclosure. It is typically a ¾” Myers hub that has a ¾” NPT
female thread. It has a ground lug to facilitate the grounding of cable shields to the analyzer chassis.

Detector Circuit Board

Detector Circuit Board main function is to convert detector photocurrent into voltage and send it to be digitized.

LEDs are incorporated to provide simple diagnostic of available power. The board has a temperature sensing chip/

circuit that monitors the ambient temperature inside the detect electronics enclosure. The sensor is located on the
top edge of the detect board to ensure the maximum temperature reading is monitored.

The board is medium size (approx. 4” H x 6” W) printed circuit board that mounts inside the enclosure. The field

terminations are located along the lower edge of the board via pluggable terminal block. All components and
devices on the board are designed for extended temperature and low drift operation.

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<4. ANALYZER COMPONENTS>

TDLS200 TDL Analyzer Instruction Manual V2.1

The cable entry located on the bottom face of the enclosure. It is typically a ¾” Myers hub that has
a ¾” NPT female thread. It has a ground lug to facilitate the grounding of cable shields to the
analyzer chassis.

Detector Circuit Board main function is to convert detector photocurrent into voltage and send it

to be sampled.
LEDs are incorporated to provide simple diagnostic of available power.
The board has a temperature sensing chip/circuit that monitors the ambient temperature inside the

detect electronics enclosure. The sensor is located on the top edge of the detect board to ensure
the maximum temperature reading is monitored.

The board is medium size (approx. 4” H x 6” W) printed circuit board that mounts inside the
enclosure. The field terminations are located along the lower edge of the board via pluggable
terminal block. All components and devices on the board are designed for extended temperature
and low drift operation.

2.3.7 Process Interface

An appropriate Process Interface is selected to suit the process/stack installation. The analyzer is
detachable from the process interface to facilitate Off-Line calibration and service.

Process Interface Options

There are several systems available as well as custom designs for specific applications.

 Flanged O-Ring Alignment comprises typical 2” or 3”

process flange with a large diameter O-Ring seal,
typically used for stack or inert applications that are
non-corrosive.

 Flanged Metal Bellows Seal comprises typical 2” or

3” process flange with a metal bellows seal and
external mechanical alignment system, typically used
when gas containment is important.

 Flow Cell may be used when the process gas has

been extracted or is used in a by-pass flow loop.
This allows for heat tracing (if necessary) and easy
introduction of both Zero and Span gases.

 Isolation Flanges are supplied with process windows

mounted in the flanges themselves typically for very
corrosive and/or high pressure applications.

 By-Pass Piping may be used when the process gas

line is of small diameter (typically <10”) and when no
suitable section of pipe work exists on this which the
analyzer can be mounted. By pass piping systems
may be provided or supplied at site. Heat tracing
may also be supplied or provided at site.

 Off Line Calibration Cell is used for off line

verification of the system. This cell is used to flow
Zero and Span gases when the analyzer is not
connected to the process.

4.6 Process Interface

An appropriate Process Interface is selected to suit the process/stack installation. The analyzer is
detachable from the process interface to facilitate Off-Line calibration and service.

Process Interface Options

There are several systems available as well as custom designs for specic applications.

Flanged with Metal Alignment

• Flanged O-Ring Alignment comprises typical 2” or 3”process
ange with a large diameter O-Ring seal, typically used for
stack or inert applications that are non-corrosive.

• Flanged Metal Bellows Seal comprises typical 2” or 3”
process ange with a metal bellows seal and external

mechanical alignment system, typically used when gas
containment is important.

• LAO-Large Aperature Optics, for long path combustion

application.

extracted or is used in a by-pass ow loop. This allows for
heat tracing (if necessary) and easy introduction of both Zero
and Span gases.

mounted in the anges themselves typically for very
corrosive and/or high pressure applications.

small diameter (typically <10”) and when no suitable section
of pipe work exists on this which the analyzer can be
mounted. By pass piping systems may be provided or
supplied at site. Heat tracing may also be supplied or
provided at site.

Typical Cross Pipe/Stack

Typical Flow Cell / By-Pass

• Flow Cell may be used when the process gas has been

• Isolation Flanges are supplied with process windows

• By-Pass Piping may be used when the process gas line is of

• Off Line Calibration Cell is used for off line verication of the

system. This cell is used to ow Zero and Span gases when
the analyzer is not connected to the process.

Figure 13 - Process Interface Examples

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<4. ANALYZER COMPONENTS>

4.7 Analyzer Connections

Launch – Detect Interconnect

The two units are connected to each other via a four, twisted pair cable suitable for tray installation outdoors.
Pluggable terminals strips are provided at both units to enable eld termination of the cable. The cable pairs are

individually shielded as well as an overall shield.

The cable specications are as below.

Item Specication

Number fo Pairs 4, individually shielded

Total Number of Conductors 9 (includes 1 comm.)

2

AWG 18 (0.75 mm

Conductors 7 x 26 stranding, Bare Copper

Inner Shield Aluminum Foil-Polyester tape, 100% coverage with 20

AWG tinned copper wire drain

Insulation F-R PVC – Flame Retarding Polyvinyl Chloride

Outer Shield Aluminum Foil-Polyester tape, 100% coverage with 18

AWG tinned copper wire drain

)

4-10

Outer Jacket F-R PVC – Flame Retarding Polyvinyl Chloride Wall

thickness 0.053” (1.35 mm) Typical 0.47” (12 mm)

outside diameter

Operating temperature -22 to 221ºF (-30 to +105ºC)

Min. Bend Radius 5” (127 mm)

Applicable Standards NEC/(UL) PLTC, ITC, CMG

Flame Test UL1581, FT4, IEEE 1202 & ICEA T-29-520

Suitability Indoor, Outdoor, Burial and Sunlight Resistant

Power Limited Tray Rated Cable

Nom. Conductor DC resistance @ 20˚C 5.86 Ohms/1000 ft (305 m)

Nom. Outer Shield DC resistance @ 20˚C 4.75 Ohms/1000 ft (305 m)

Max. Operating Voltage - UL 300 V RMS

Conductor Identication Numbered pairs, black & white conductors

Typical Manufacturer & Part No. Belden Type 1475 A

The maximum cable length should not exceed 150 ft (46 m).

Please ensure that the Launch to Detect cable is properly terminated and that all grounding and shielding
details are correct per installation drawings-Espically important for CE/A TEX

installations.

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4.8 Communications

Stand Alone Options

The analyzer is capable of fully independent operation with no external computer or interface required. A number
of options are available for a built in user interface (mounted on Launch Unit):

• Blind with no display or keypad. Access to the analyzer through; Ethernet connection (local or remote
computer), Remote Interface Unit (RIU), Universal Remote Display (remote display only - no keypad) with
menu access via external computer.

• Mini display which is an Integral display 4X20 smart VFD (cycles information). No keypad,
menu access via local or remote external computer (Ethernet connected).

• Keypad with 6.5” display.

• Regardless of the user interface selected the analyzer will continuously record results,
diagnostics and spectra. Data can be transferred from the analyzer via USB or Compact
Flash.

Remote Interface Options

A number of options are available for remote access to the analyzer

Remote Interface Unit (RIU) model YR200 shown below, allows remote analyzer control and data
transfer from analyzer to RIU (data can be transferred from RIU via USB memory stick or
Compact Flash card.

• Allows multi-unit eld communication via

central user interface

• Not required for individual analyzer

operation, interface and data transfer only

• Connects with 1-8 analyzers via Ethernet

switch

• Integral Keypad and 6.5” display

External Computer via Ethernet. A
separate computer can be connected to the

analyzers locally or through an Ethernet

network to allow analyzer control and data
transfer

Figure 14 - Networked Analyzers

The Remote Interface Unit (RIU) consists of:

• Back Plane circuit board

• SBC

• Display and Keypad

• Optional Analyzer Feed-through circuit board and/or Ethernet switch

• All eld electrical terminals are located on the Back Plane.

A single RIU can be used in conjunction with up to 8 analyzers via Ethernet (more with additional/custom
Ethernet switches).

IM 11Y01B01-01E-A 6th Edition :Feb 13, 2013-00