This manual contains information for servicing YOKOGAWA’s DL1720 and DL1740
Digital Oscilloscopes.
Note
This is the fourth edition of the manual, dated July 2002.
WARNING
This service manual is to be used by properly trained personnel only.
To avoid personal injury, do not perform any servicing unless you are
qualified to do so. Refer to the safety precautions prior to performing
any servicing. Even if servicing is carried out according to this service
manual, or by qualified personnel, YOKOGAWA assumes no
responsibility for any result occurring from that servicing.
The following general safety precautions must be taken during all phases of operation,
service, and repair of this instrument. Failure to comply with these precautions or with
specific warnings given elsewhere in this manual violates safety standards of design,
manufacture, and intended use of the instrument.
Yokogawa Electric Corporation assumes no liability for the customer’s failure to comply
with these requirements.
WARNING
Use the Correct Power Supply
Ensure the source voltage matches the voltage of the power supply
before turning ON the power.
Use the Correct Power Cord and Plug
To prevent an electric shock or fire, be sure to use the power supply
cord supplied by YOKOGAWA. The main power plug must be plugged
in an outlet with a protective grounding terminal. Do not invalidate
protection by using an extension cord without protective grounding.
Connect the Protective Grounding Terminal
The protective grounding terminal must be connected to ground to
prevent an electric shock before turning ON the power.
Do Not Impair the Protective Grounding
Never cut off the internal or external protective grounding wire or
disconnect the wiring of the protective grounding terminal. Doing so
creates a potential shock hazard.
Do Not Operate with Defective Protective Grounding or Fuse
Do not operate the instrument if you suspect the protective grounding
or fuse might be defective.
2
SM 701710-01E
Page 4
Use the Correct Fuse
To prevent fire, make sure to use a fuse of the specified rating for
current, voltage, and type. Before replacing the fuses, turn OFF the
power and disconnect the power source. Do not use a different fuse or
short-circuit the fuse holder.
Do Not Operate Near Flammable Materials
Do not operate the instrument in the presence of flammable liquids or
vapors. Operation of any electrical instrument in such an environment
constitutes a safety hazard.
Do Not Remove Any Covers
There are some components inside the instrument containing high
voltage. Do not remove any cover, if the power supply is connected.
The cover should be removed by qualified personnel only.
Ground the Instrument before Making External Connections
Connect the protective grounding before connecting the instrument to a
measurement or control unit.
Safety Symbols Used on Equipment and in Manuals
WARNING
CAUTION
To avoid injury, death of personnel or damage to the
instrument, the operator must refer to an explanation in the
user’s manual.
This symbol represents a functional grounding terminal.
Such terminals should not be used as a protective
grounding terminal.
A WARNING sign calls attention to a procedure, practice, or
condition, that could result in the injury or death of personnel
if not correctly performed or adhered to.
A CAUTION sign calls attention to a procedure, practice, or
condition, that could result in damage to or the destruction
of part of the instrument if not correctly performed or
adhered to.
SM 701710-01E
3
Page 5
Overview of This Manual
This manual is meant to be used by qualified personnel only. Make sure to read the
safety precautions at the beginning of this manual as well as the warnings and cautions
contained in the chapters relevant to any servicing you may be carrying out.
This manual contains the following chapters.
1 General Information
Provides an introduction and safety considerations.
2 Performance Testing
Explains the tests for checking the performance of the instrument.
3 Adjustments
Explains the adjustments which can be performed by users.
4 Principles of Operation
Provides function block diagrams and explains the principles of operation.
5 Troubleshooting
Presents procedures for troubleshooting and how to proceed in case parts need to be
replaced.
6 Schematic Diagram
Provides a system configuration diagram.
7 Customer Maintenance Parts List
Contains exploded views and a list of replaceable parts.
8 Procedures for Disassembly
Lists the steps required to remove parts from the instrument.
Specifications are not included in this manual. For specifications, refer to IM 701710-01E.
4
SM 701710-01E
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Contents
1
Important Notice to the User .......................................................................................................... 1
The top cover, printer cover, printer case, front bezel, and shield cover must be removed
before adjusting the DL1720/DL1740. Read the warning and cautions below before
doing so.
Circuit patterns of the printed circuit board are exposed. Be careful
when handling so that hands or fingers are not injured by the protruding
pins.
• Circuit patterns of the printed circuit board are exposed. If these
patterns touch other metallic materials, electrical shorting will occur,
causing the circuit to be damaged or burnt.
• It is sometimes necessary to turn the DL1720/DL1740 upside down for
adjustment. Do not drop the instrument, or allow it to fall over.
• When feeding power with the DL1740’s cover open, apply a flow of air
to the AD4 board (or the AD2 board for the DL1720) and Power Supply
(B9989YA).
3
Adjustments
WARNING
CAUTION
3.2 Test Environment
Operating Conditions
Warm Up Time
• Ambient temperature:23 ±2˚C
• Humidity:55 ±10 % RH
• Voltage of power supply:Specified voltage ±1 %
• Frequency of power supply: Specified frequency ±1 %
• More than 30 minutes after tuning ON the instrument.
• Confirm that self calibration is correctly executed after a 30 minute warm up.
(Be sure to pay attention to the warm up time of all equipment that will be used in
the test.)
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3-1
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3.3 Equipment Required/3.4 DC Gain Adjustment on the AD Board
The setting range here is for the 1:1 probe setting.
4-1
Page 28
4.2 Function of Each Assembly
AD4 Board (or AD2 Board for the DL1720) Assembly
The AD4 board (or AD2 board for the DL1720) assembly has the time base, trigger, A/D
converter, and analog control circuits onboard.
The time base is of a PLL configuration. 1 GHz and 800 MHz can be switched. On the
DL1720/DL1740, the frequency of the clock is converted to 500 MHz or 400 MHz using
high-speed ECL logic and distributed to each channel. When in interleave mode, the
clock for CH2 and CH4 is delayed by 1 ns with respect to the clock for CH1 and CH3,
respectively (the DL1720 is not equipped with CH3 and CH4). For making minute time
measurements of phase difference between the trigger and sampling clock (needed
during repetitive sampling mode, for example), the T-V converter (TVC) is used.
The trigger section consists of a comparator, fast trigger logic (FTL), and pulse width
detector (PWD). It also has a TV trigger circuit used only on CH1. The comparator has
a window comparator function that allows window triggering. The window width is
controlled by an external DC voltage input. The frequency bandwidth of the comparator
IC is approximately 1 GHz.
The A/D converter operates at 500 MHz only when the sampling rate is 500 MS/s or
when in 1 GS/s interleave mode. In all other cases, the A/D converter operates at 400
MHz. Sampling rates of 200 MS/s or lower are attained by extracting a portion of the
data sampled at 400 MHz using the RBC on the ACQ4 board (or the ACQ2 board for the
DL1720) assembly.
The analog control circuit consists of an analog front-end controller (AFC), a PWM D/A
converter, and a serial/parallel converter. This circuit controls the analog section of the
analog board assembly and the AD board assembly. There are also EXT CLOCK IN,
EXT TRG IN, and TRG GATE IN functions, as well as an active probe power supply (/P4
or /P2 for the DL1720) circuit.
ACQ4 Board (or ACQ2 Board for the DL1720) Assembly
The ACQ4 board (or the ACQ2 board for the DL1720) assembly has a primary data
processing section, a secondary data processing section, and a display section (for
displaying waveforms and other information).
The primary data processing section consists of the ring buffer memory (PBSRAM) and
controller (RBC). The RBC receives the data that is transferred from the A/D converter
on the ACQ4 board (or the ACQ2 board for the DL1720) assembly and performs the
primary data processing such as the above-mentioned data extraction of sampled data,
envelope, and box averaging, then stores the data in the ring buffer memory. The
written data are transferred to the acquisition memory interface (AMI) in the secondary
data processing section according to the trigger address.
The secondary data processing section consists of the AMI, work memory (PBSRAM),
and the acquisition memory (synchronous DRAM). The AMI processes the data
(averaging, for example) that is transferred from the RBC and stores the result in the
acquisition memory. Then, the AMI converts the stored data to display data by
performing additional processing such as compression and interpolation. The resultant
data are transferred to the graphic control process (GCP) according to the display
update interval. The AMI also has computation functions (addition, subtraction,
multiplication, division, differentiation, integration, etc.) and auxiliary functions such as
automated measurement of waveform parameters.
4-2
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4.2 Function of Each Assembly
The display section consists of a GCP, graphic memory (synchronous GRAM), character
memory (fast SRAM), and VGA VIDEO OUT circuits. The GCP writes the waveform
data that are transferred from the AMI to the graphic memory. It synthesizes the
contents of the graphic memory and the character memory and displays them on the
TFT color LCD. The GCP also controls the built-in printer.
CPU Board Assembly
The CPU board consists of each circuit block’s control circuit, an I/O circuit, and other
peripheral circuits.
A Hitachi HD6417709A is used for the CPU. The actions of each circuit block connected
to the CPU bus are controlled by the CPU.
The main memory (synchronous DRAM) and Flash memory are included in the CPU’s
peripheral circuits.
In the I/O circuit, the following circuits carry out control through the CIO (CPU I/O
interface IC). They are the backup memory, keyboard, floppy disk drive controller (Zip
drive circuit), GP-IB controller, USB I/F circuit, and SCSI controller (option:/C7). On the
CPU bus, they are the Ethernet I/F (option:/C10)circuit, and the serial I/F circuit.
Key Board Assembly
Key switches, LEDs, the rotary encoder, and the jog shuttle are installed on the key
board assembly.
ADP Board Assembly
The ADP board assembly distributes the power supply output from the ACQ4 board (or
the ACQ2 board for the DL1720) to the AD4 board assembly.
BUS Board Assembly
Controls the exchange of signals between the CPU, KEY, ACQ4 (or the ACQ2 for the
DL1720), and AD board assemblies and a printer assembly. Supplies output from the
power supply unit to the CPU, KEY, ADP and ACQ4 board (or the ACQ2 board for the
DL1720) assemblies and a printer assembly. +12 V generation takes place on this
board.
4
Principles of Operation
SM 701710-01E
LCD Board Assembly
The LCD board assembly converts the connector of the LCD signal cable.
LCD Assembly
6.4-inch color TFT LC display
Full display resolution: 640 x 480
Waveform display resolution: 500 x 384
Printer Assembly (Optional)
The printer is of a thermal sensitivity type that prints 8 dots per mm and 832 dots per
line. A hardcopy of the display is printed in approximately 12 seconds.
FDD Assembly (-J1)
The FDD assembly supports 3.5-inch floppy disks (720 KB and 1.44 MB formats).
Zip Assembly (-J2)
The Zip assembly supports both 100 MB and 250 MB capacity media.
4-3
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4.2 Function of Each Assembly/4.3 Function of Each ASIC
Zip Board Assembly (-J2)
The Zip board assembly is an adapter which connects the Zip drive to the CPU board.
I/F Board Assembly (Optional)
The I/F board assembly supports both SCSI I/F and serial I/F, and is controlled by the
CPU and CPU I/O interface (CIO) on the CPU board.
Ethernet Board Assembly (Optional)
Option /C10 consists of an Ethernet interface section. The Ethernet interface section
has an Ethernet connector and a LAN (local area network) controller. These interfaces
are controlled by the CPU and CPU I/O interface (CIO) that are on the CPU board
assembly.
OPT TRIG Board Assembly (Optional)
Option /F5 consists of I2C BUS trigger section. The OPT TRIG board assembly provide
I2C BUS trigger signal.
4.3 Function of Each ASIC
The following items describe the IC and the gate array function used in each assembly.
Analog Front-End Controller (AFC)
The AFC is a Bi-CMOS gate array. Its main functions are controlling the analog front-
end circuit and assisting the trigger circuit. It includes a PWM signal output circuit used
for D/A conversion, a parallel port, a serial port, a trigger hold-off circuit, an auto trigger
circuit, a TV trigger generator, a fast counter, and a slow counter.
Fast Trigger Logic (FTL)
The FTL is an ECL gate array. Its main functions include generation of trigger signals
according to the trigger functions, trigger hold-off function, and control of the time-to-
voltage converter (TVC).
Pulse Width Detector (PWD)
The PWD is an analog IC. Using an internally-startable oscillator and an external
counter (AFC), it detects the pulse width for width triggering.
Time-to-Voltage Converter (TVC)
This is the analog IC that measures the internal sampling clock and trigger time, and
converts time to voltage.
Ring Buffer Memory Controller (RBC)
The RBC is a Bi-CMOS gate array. It performs primary processing of the data such as
the extraction of the sampled data, envelope, and box averaging. It also provides
functions for controlling the ring buffer memory and the interface to the acquisition
memory interface (AMI).
4-4
Acquisition Memory Interface (AMI)
The AMI is a CMOS gate array. Its functions include interfacing to the ring buffer
memory controller (RBC), interfaceing to the graphic control processor (GCP),
averaging, history control, waveform computation, and auxiliary functions for the
automated measurement of waveform parameters.
SM 701710-01E
Page 31
4.3 Function of Each ASIC
Graphic Control Processor (GCP)
The GCP is a CMOS gate array. Its functions include interfacing to the acquisition
memory interface (AMI), graphic memory and character memory control, a waveform
drawing function (accumulated display, for example), built-in printer control, and display
data generation for the LCD.
CPU I/O Interface (CIO)
The CIO is a CMOS gate array. Its functions include interfacing to the CPU
(HD6417709A) and the peripheral ICs, keyboard control, LED control, interrupt control,
and DMA selection.
I2C BUS Trigger Logic 2 (ITL2)
The ITL2 is field programmable gate array. Its function is generation of I2C BUS trigger
signal.
4
Principles of Operation
SM 701710-01E
4-5
Page 32
4.3 Function of Each ASIC
CH1/CH2
SRAM
AD2 Board Assembly
SRAM
Control Signal
PROBE POWER X2 (/P2)
PWD
TRIG OUT
TVC
RBC
ACQ2 Board Assembly
Level
Converter
Time Base
AFC
TV
Tr igger
A/D Converter
FTL
Comparator
Multiplexer
one chip Amplifire
AT T
Analog Board Assembly
Coupling
(GND/MES)
Coupling
(1MΩ/50MΩ)
(AC/DC)
Coupling
CH1
CH2
Filter
(20MHz,
DC/AC/
Gain
1/1 1/10
GND/MES
1MΩ/50Ω
AC/DC
100MHz
HFrej
1/100 1/200
To ACQ Board
Assembly
Assembly
∗
DC
Tr igger Level
Offset
Line Trigger
To CPU Board
∗
DC
Bus Board Assembly
DC
Unit
Power
1/1
1/10
AC
ET2 Board Assembly
EXT.
4-6
Figure 4.1 Block Diagram (Analog Section) of the DL1720
SM 701710-01E
Page 33
Printer(/B5)
4.3 Function of Each ASIC
BUS Board Assembly
Graphic
Memory
Memory
Character
LCD
GCP
VGA Video OUT
GPIB
USB
GO/NOGO
Interface Board Assembly (/C7)
SCSI, Serial (/C7)
Ethernet (/C10)
Zip Drive (-J2)
FD Drive (-J1)
Key Board Assembly
4
Principles of Operation
CIO
GPIB IF
FD Controller
Zip Controller
CPU Board Assembly
CPU
Backup RAM
USB IF
DRAM
PIO
Flash ROM
SCSI + Serial IF
ETHERNET IF
Ethernet Board Assembly (/C10)
ACQ2 Board Assembly
SM 701710-01E
AMI
Work Memory
CH1/CH2
Figure 4.2 Block Diagram (Digital Section) of the DL1720
ACQ Memory
Control Signal
4-7
Page 34
4.3 Function of Each ASIC
CH1/CH2
CH3/CH4
Signal
Control
ACQ4 Board Assembly
AD4 Board Assembly
PROBE POWER X4 (/P4)
SRAM
SRAM
RBC
Converter
Level
RBC
SRAM
SRAM
PWD
AFC
Time Base
EXT TRIG IN
TRIG OUT
EXT CLOCK IN
TRIG GATE IN
TVC
FTL
OPT TRIG Board assembly (/F5)
ITL2
TV Trigger
A/D Converter
Multiplexer
Tr igger
Level
Line Trigger
Comparator
To CPU Board
Assembly
∗
DC
To ACQ Board
DC
Assembly
∗
one chip Amplifire
ATT
Analog Board Assembly
Coupling
(GND/MES)
Coupling
(1MΩ/50MΩ)
(AC/DC)
Coupling
CH1
Offset
CH2
CH3
CH4
Figure 4.3 Block Diagram (Analog Section) of the DL1740
AC/DC
Filter
(20MHz
100MHz
HFrej
DC/AC/
Gain
1/1 1/10
1/100 1/200
GND/MES
1MΩ/50Ω
AC
Bus Board Assembly
DC
Unit
Powe r
4-8
SM 701710-01E
Page 35
Printer(/B5)
(-J1)
4.3 Function of Each ASIC
(-J2)
BUS Board Assembly
Memory
Graphic
Memory
Character
LCD
GCP
VGA Video OUT
CPU Board Assembly
GPIB
USB
GO/NOGO
SCSI, Serial (/C7)
Interface Board
Assembly (/C7)
Ethernet (/C10)
Zip Drive
Key Board Assembly
FD Drive
4
Principles of Operation
CIO
GPIB IF
FD Controller
Zip Controller
CPU
Backup RAM
USB IF
DRAM
PIO
Flash ROM
SCSI + Serial IF
ETHERNET IF
Ethernet Board Assembly (/C10)
ACQ4 Board Assembly
SM 701710-01E
AMI
ACQ Memory
Work Memory
CH1/CH2
Figure 4.3 Block Diagram (Digital Section) of the DL1740
ACQ Memory
AMI
CH3/CH4
Work Memory
Signal
Control
4-9
Page 36
Chapter 5Troubleshooting
5.1 Introduction
This chapter describes possible solutions for rectifying errors. In such cases, assembly
removal may be required.
Please heed the following warning.
Assembly replacement is to be performed only by qualified service
technicians who have experience working with the hazards involved
(such as fire and electrical shock).
Note
If an error message is displayed, the error may have been caused by incorrectly operating the
unit. Refer to the user’s manual, and perform the correct operation.
5.2 Flowchart
Figure 5.1, “Troubleshooting Flowchart” shows an analytical method for handling
malfunctions.
WARNING
5
Troubleshooting
SM 701710-01E
5-1
Page 37
5.2 Flowchart
Power ON
START
LCD OK?
Check the
fuse.
Fuse OK?
Check secondary
voltage of power supply.
Vol tag e OK?
INITIALIZE
LCD OK?
†
*
Check secondary
voltage of power
supply unconnected
to bus board.
Voltage OK?
(1)
Check each
board for shorts.
Check display.
Connect RGB VIDEO
OUT to monitor.
Replace
the fuse.
*
Replace power
supply unit.
‡
No error
messages?
Execute self test.
Self test
successful?
Execute performance
test.
Performance
test successful?
END
Maintenance Service is Required
Contact your nearest YOKOGAWA representative as listed on the back cover of this manual.
(2)
Check error
contents.
(3)
Check self test
results.
(4)
Check
performance
test results.
* See section 5.3 for detailed instructions.
† To initialize the settings, reboot the
DL1720/DL1740 while pressing the RESET
key.
‡ The monitor to be connected must be VGA
supported.
Figure 5.1 Troubleshooting Flowchart
Monitor
display OK?
Check LCD
backlight.
Backlight
lights up?
Replace CPU
board ass’y.
Replace lamp
unit or
inverter unit.
Replace LCD
ass’y.
5-2
SM 701710-01E
Page 38
SM 701710-01E
5.2 Flowchart
(1)
A short may occur in an assembly other than the power supply unit. To check in which
voltage line a short has occurred, investigate each assembly to which voltage is
supplied, using a circuit tester. Table 5.1 “Correspondence of Assembly to Voltage”
shows the relationship between assemblies and voltages supplied to them.
Table 5.1 Correspondence of Assembly to Voltage
Voltage SeriesAssembly No.Assembly
+24 VB9989MJACQ2 Board Assembly (MODEL: 701705)
+12 VB9989MGET2 Board Assembly (MODEL: 701705)
+5 VB9989MGET2 Board Assembly (MODEL: 701705)
+3.3 VB9989MHAD2 Board Assembly (MODEL: 701705)
–2 VB9989ML
–5.2 VB9989MGET2 Board Assembly (MODEL: 701705)
–12 VB9989MGET2 Board Assembly (MODEL: 701705)
* The assembly number differs depending on the date of manufacture as follows:
During or before December, 2001: B9989MA
After December, 2001 : B9989ML
Power Supply Cord (VDE Standard)
Power Supply Cord (BS Standard)
Power Supply Cord (AS Standard)
Soft Case
DL1720/DL1740 Digital Oscilloscope User’s Manual
DL1720/DL1740 Digital Oscilloscope Operation Guide
DL1740 Digital Oscilloscope I2C Bus Analysis Function
(Includes the SPI Bus Analysis Function)
Regarding the DL1720/DL1740 Digital Oscilloscope
Communications Interface User’s Manual CD-ROM
Front Cover
Probe (/E2)
CD for Manual for DL1720/DL1740
||
†
‡
§
(select)
#
Note:
701705/701710 - -D
*
701705/701710 - -F
†
701705/701710 - -Q
‡
701705/701710 - -R
§
A roll chart will be
||
supplied only when
the instrument is
equipped with a
built-in printer
701705 /F5
#
CMPL parts
12
7-5
Page 52
Chapter 8Procedures for Disassembly
WARNING
This service manual is to be used by properly trained personnel only.
To avoid personal injury, do not perform any servicing unless you are
qualified to do so. Refer to the safety precautions prior to performing
any servicing. Even if servicing is carried out according to this service
manual, or by qualified personnel, YOKOGAWA assumes no
responsibility for any result occurring from that servicing.
8.1 Removing the Top Cover
1.Remove the 2 screws from the rear panel.
2.Remove the 4 screws from the bottom of the instrument.
8
Procedures for Disassembly
SM 701710-01E
8-1
Page 53
8.1 Removing the Top Cover
3.The top cover fits into the back of the front bezel. Remove the top cover by slowly
pulling it away from the front bezel in the direction of the arrows as shown in the
figure below.
The DL with the top cover removed
8-2
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Page 54
8.2 Removing the Printer Case
1.Remove the top cover. See section 8.1, “Removing the Top Cover.”
2.Remove the printer cover by raising it in the direction of the arrow as shown below,
then forcing it back until it pops out.
3.Remove the screw from the printer case located toward the rear of the instrument.
8.2 Removing the Printer Case
4.Raise the handle, then slide the printer case away from the bezel by pulling it back
slightly in the direction of the arrow.
8
Procedures for Disassembly
SM 701710-01E
8-3
Page 55
8.2 Removing the Printer Case
5.Lift the printer case to remove it, allowing the handle to slide through the opening in
the case.
DL with the printer case removed
8-4
SM 701710-01E
Page 56
8.3 Removing the Front Bezel
Removing the Knobs
1.Remove the knobs by pulling them outward in the direction of arrows.
Note
When the TIME/DIV and V/DIV knobs are removed, the “rib“ holding the knob to its shaft
becomes worn down causing the knob to become loose. Therefore, you should replace the
removed knobs with new ones.
8.3 Removing the Front Bezel
DL with the knobs removed
8
Procedures for Disassembly
SM 701710-01E
8-5
Page 57
8.3 Removing the Front Bezel
Removing the Front Bezel
2.Remove the top cover. See section 8.1, “Removing the Top Cover.”
3.Remove the printer case. See section 8.2, “Removing the Printer Case.”
4.The front bezel is fastened to the frame by eight tabs. Identify the location of all
tabs, then pry each tab away from the metal frame one-by-one until the bezel
comes free of the frame.
5.Remove the bezel, taking care not to damage the BNC connectors.
DL with the front bezel removed
8-6
SM 701710-01E
Page 58
8.4 Removing the AD Board Assembly and the Analog Assembly
8.4 Removing the AD Board Assembly and the Analog Assembly
Removing the Bottom Brackets
1.Remove the top cover. See section 8.1, “Removing the Top Cover.”
2.Remove the front bezel. See section 8.3, “Removing the Front Bezel.”
3.Remove the screws from the left, right, and rear sides (3 screws total), then
remove the bottom brackets.
DL with the bottom brackets removed
8
Procedures for Disassembly
SM 701710-01E
8-7
Page 59
8.4 Removing the AD Board Assembly and the Analog Assembly
Removing the Fan Assembly
4.Holding the fan assembly cable by its connector (not the cable itself), disconnect
the fan assembly cable. Unhook the cable from the plastic restraining tab.
5.Remove the 2 screws as shown, then lift the fan assembly upwards and remove it.
Be careful not to pull out the wires as you do so.
DL fan assembly removal
8-8
Removing the ADP Board Assembly and SUMI-Card
6.Remove the screw from the ADP board assembly cover, then remove the cover.
7.Remove the remaing screw from the ADP board assembly.
8.The ADP board assembly is fastened to the AD board assembly and the ACQ
board assembly from the inside by a connector. Pull out the ADP board assembly.
9.Remove the 3 screws from the SUMI-Card bracket as shown in the figure below,
then remove the bracket.
ADP bord assembly cover
Bracket
SM 701710-01E
Page 60
8.4 Removing the AD Board Assembly and the Analog Assembly
10. Grasp the SUMI-card near the connector with both hands, then slowly pull it out.
Be careful not to bend the card as you do so.
DL with the ADP board assembly and the SUMI-card removed
Removing the AD Board Assembly and the Analog Assembly
11Remove the 5 screws from the left side of the instrument as shown in the figure
below.
8
Procedures for Disassembly
SM 701710-01E
8-9
Page 61
8.4 Removing the AD Board Assembly and the Analog Assembly
12. Remove the 4 screws from the right side of the instrument as shown in the figure
below.
13. Turn the unit upside down.
14. Remove the cables from the left and right sides as shown in the figure below.
8-10
15. Remove the 2 screws from the front panel as shown.
SM 701710-01E
Page 62
8.4 Removing the AD Board Assembly and the Analog Assembly
16. The ACQ board assembly is fastened to the bus board assembly underneath by
several connectors. The AD board assembly and the analog assembly cannot be
removed until you disconnect these connectors. Pull the front side (the side with
the BNC connectors) of the AD board assembly upwards to disconnect it from the
bus board assembly.
17. Pull the AD board assembly out towards the rear of the instrument. The analog
assembly pulls out with it.
DL with the AD board and analog assemblies removed
8
Procedures for Disassembly
SM 701710-01E
8-11
Page 63
8.5 Removing the Power Supply
8.5 Removing the Power Supply
1.Perform the steps in sections 8.3 and 8.4.
2.Remove the 2 screws as shown.
3.Remove the 2 screws as shown.
8-12
4.Pull out the power supply in the direction of the arrow as shown below.
SM 701710-01E
Page 64
DL with the power supply removed.
8.5 Removing the Power Supply
8
Procedures for Disassembly
SM 701710-01E
8-13
Page 65
8.6 Removing the CPU Board Assembly, SCSI Board Assembly, and the Ether Assembly
8.6 Removing the CPU Board Assembly, SCSI Board Assembly, and the Ether
Assembly
1.Remove the SUMI-card connected to either the floppy drive or the ZIP drive.
Unhook the connector then remove the SUMI-Card. The SUMI-card is thin and
fragile, so take care not to bend it when removing it.
2.In the same manner, unhook the connector on the board side, then remove the
SUMI-Card.
Note
When reinstalling the SUMI-Card, be sure to insert the cable all the way into the connector,
then hook the sliders to fasten the card in place.
3.Remove the screw as shown in the figure below.
8-14
SM 701710-01E
Page 66
8.6 Removing the CPU Board Assembly, SCSI Board Assembly, and the Ether Assembly
4.Remove the screw as shown in the figure below.
5.Pull out the CPU board assembly.
The SCSI board assembly and Ether assembly are attached to the CPU board
assembly, so they come out all together.
DL with the CPU Board Assembly, SCSI Board Assembly, and Ether Assembly
removed
8
Procedures for Disassembly
SM 701710-01E
8-15
Page 67
8.7 Removing the Front Frame
8.7 Removing the Front Frame
1.Peform the steps in section 8.1 to 8.6.
2.Remove the 2 screws that fasten the front frame to the rear panel.
3.Remove the SUMI-Card on the right side of the frame.
4.Remove the 5 screws that fasten the front frame to the front panel. Remove the
front frame.
8-16
DL with the front frame removed
SM 701710-01E
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