Yamaha EMX-860-ST Service Manual

SERVICE MANUAL

011457

PA

19990220-99800

CONTENTS

SPECIFICATIONS ................................................ 3/4

PANEL LAYOUT .................................... 5

CIRCUIT BOARD LAYOUT ................. 7

BLOCK DIAGRAM

DISASSEMBLY PROCEDURE .............................. 9

LSI PIN DESCRIPTION .............................. 11

IC BLOCK DIAGRAM ................................. 11

CIRCUIT BOARDS ...................................... 12

INSPECTION .............................................................. 15

MIDI INPLEMENTATION CHART.......................................... 25

PARTS LIST

1.96K-296 Printed in Japan ’99.03

............................ 8

HAMAMATSU, JAPAN

EMX860ST

This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and under­stood by the users, and have therefore not been restated.

WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in per-

IMPORTANT : This presentation or sale of this manual to any individual or firm does not constitute authorization certifi-

The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable
and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to
exist, please contact the distributor’s Service Division.

WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may

IMPORTANT : Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power

IMPOR TANT NOTICE

sonal injury, destruction of expensive components and failure of the product to perform as specified. For
these reasons, we advise all Yamaha product owners that all service required should be performed by an
authorized Yamaha Retailer or the appointed service representative.

cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship of
any form.

have accumulated by grounding yourself to the ground buss in the unit (heavy gauge black wires connect
to this buss.)

to the unit.

LITHIUM BA TTERY HANDLING

This product uses a lithium battery for memory back-up.

WARNING : Lithium batteries are dangerous because they can be exploded by improper handling. Observe the following pre-

Leave lithium battery replacement to qualified service personnel.
Always replace with batteries of the same type.
When installing on the PC board by soldering, solder using the connection terminals provided on the battery cells.
Never solder directly to the cells. Perform the soldering as quickly as possible.
Never reverse the battery polarities when installing.
Do not short the batteries.
Do not attempt to recharge these batteries.
Do not disasemble the batteries.
Never heat batteries or throw them into fire.

ADVARSEL!

Lithiumbatteri-Eksplosionsfare ved fejlagtig handtering. Udskiftning ma kun ske med batteri af samme fabrikat og type. lever det brugte
batteri tilbage til leverandren.

VARNING

Explosionsfara vid felaktigt batteribyte.
Anvand samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren.
Kassera anvant batteri enligt fabrikantens instruktion.

VAROITUS

Paristo voi rajahtaa, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiiin.
Havita kaytetty paristo valmistajan ohjeiden mukaisesti.
The following information complies with Dutch official Gazette 1995. 45; ESSENTIALS OF ORDER ON THE COLLECTION OF BATTERIES.

• Please refer to the diassembly procedure for the removal of Back-up Battery.

• Leest u voor het verwijderen van de backup batterij deze beschrijving.

cautions when handling or replacing lithium batteries.

WARNING: CHEMICAL CONTENT NOTICE!

The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and/or birth defects or other reproductive harm.

DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT
SO EVER!

Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!

If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling
food.

WARNING

Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.

2

2

SPECIFICATIONS

EMX860ST

General specifications

MAIN STEREO: 135 W+135 W/8Ω @0.5% THD at‹° kHz, 200 W+200 W/4Ω @0.5% THD at 1 kHz

Maximum output power

Frequency response

Total harmonic distortion

Hum & noise
(Average, Rs=150Ω)
(with 20 Hz–20 kHz BPF)

Maximum voltage gain
(PAD: OFF)

Crosstalk at 1 kHz

Input channel equalization

Meters

Graphic equalizer

Internal digital effect

Phantom power

Limiter
LIMIT indicators
Foot switch
Optional accessories

Power requirement

Power consumption
Dimensions (WxHxD)
Weight

MAIN BRIDGE: 400 W/8Ω @0.5% THD at 1 kHz
MONITOR: 135 W/8Ω @0.5% THD at 1 kHz, 200 W/4Ω @0.5% THD at 1 kHz
20 Hz–20 kHz +1 dB, –3 dB @1 W output into 8Ω (POWER AMP OUT)
20 Hz–20 kHz +1 dB, –3 dB @+4 dB output into 10 kΩ (MAIN OUT, MONITOR OUT, EFFECT OUT)
Less than 0.5% @20 Hz–20 kHz, 100 W output into 4Ω (POWER AMP OUT)
Less than 0.3% @20 Hz–20 kHz, +14 dB output into 10 kΩ (MAIN OUT, MONITOR OUT, EFFECT OUT)
–125 dB equivalent input noise, –68 dB residual output noise (POWER AMP OUT)
–95 dB residual output noise (MAIN OUT, MONITOR OUT, EFFECT OUT)
–80 dB (MAIN OUT) Master level control: nominal level, All channel level controls: minimum
–75 dB (MONITOR OUT) Master level control: nominal level, All channel level controls: minimum
–71 dB (MAIN OUT) Master level control: nominal level, 1 channel level control: nominal level
–84 dB (EFFECT OUT) Master level control: nominal level, All channel level controls: minimum
–64 dB (EFFECT OUT) Master level control: nominal level, 1 channel level control: nominal level
86 dB CH IN (Lo-Z) to POWER AMP OUT (CH1–6)
66 dB CH IN (Lo-Z) to MAIN OUT, MONITOR OUT (CH1–6)
72 dB CH IN (Lo-Z) to EFFECT OUT (CH1–6)
48 dB CH IN (Lo-Z) to REC OUT (CH1–6)
56 dB CH IN (Hi-Z) to MAIN OUT, MONITOR OUT (CH1–6)
26 dB AUX IN to MAIN OUT
24 dB TAPE IN to MAIN OUT
66 dB MIC IN to MAIN OUT (CH7–8)
26 dB LINE IN to MAIN OUT (CH7–8)
–65 dB adjacent input, –65 dB input to output
±15 dB Maximum

* Turn over/roll-off frequency of shelving: 3 dB below maximum variable level.
5 POINTS LED METER (MAIN OUT L/R, MONITOR OUT)
7 bands (125, 250, 500, 1k, 2k, 4k, 8k Hz)
±12 dB Maximum (MAIN OUT, MONITOR OUT)
3 types (Vocal, L Hall, S Hall)
+48 V is supplied to electrically balanced inputs for powering condenser microphones via 6.8 kΩ current
limiting/isolation resisters.
Comp. : THD 0.5% (MAIN, MONITOR)
Turns on. : THD 0.5% (MAIN, MONITOR)
DIGITAL EFFECT MUTE : on/off
FC5 Foot switch
USA and Canada 120 V AC 60 Hz
Europe 230 V AC 50 Hz
Other 240 V AC 50 Hz
300 W
497x324x275 mm
17 kg

HIGH 10 kHz shelving
MID 2.5 kHz peaking
LOW 100 Hz shelving

Input specifications

Input level

Input connectors

CH INPUT (Lo-Z) OFF 3 kΩ 50–600Ω Mics –62 dB (616 µV) –50 dB (2.45 mV) –20 dB (77.5 mV) XLR-3-31
(CH1–6) ON 600Ω Lines –32 dB (19.5 mV) –20 dB (77.5 mV) +10 dB (2.45 V) type
CH INPUT (Hi-Z) OFF 10 kΩ 50–600Ω Mics –52 dB (1.95 mV) –40 dB (7.75 mV) –10 dB (245 mV) Phone jack
(CH1–6) ON 600Ω Lines –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) (TRS)*2
MIC INPUT (CH7, 8) 3 kΩ 50–600Ω Mics –62 dB (616 µV) –50 dB (2.45 mV) –20 dB (77.5 mV) XLR-3-31 type*2
LINE INPUT (CH7, 8) (L, R)
TAPE IN (L, R) 10 kΩ 600Ω Line
AUX IN (L, R) 10 kΩ 600Ω Line –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) Phone jack*3

*1. Sensitivity is the lowest level that can produce an output of +4 db (1.23 V) or the nominal output level when the unit is set at maximum gain.
*2. Balanced.
*3. Unbalanced.

• 0 dB=0.775 Vrms, 0 dBV=1 Vrms.

PAD

Actual load
impedance

10 kΩ 600Ω Line –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) Phone jack

Nominal

impedance

Sensitivity*

–22 dBV (79.4 mV)

1

Nominal level

–10 dBV (316 mV) +17.8 dBV (7 V) Phono jack

Max. before

cliping

Connector

type

Output specifications

Output connectors

MAIN AMP OUT (L, R) (A, B) 0.1Ω 4/8Ω Speaker 37.7 W/4Ω (200 W/4Ω) Phone jack
MAIN BTL OUT 0.1Ω 8Ω Speaker 75.4 W/8Ω (400 W/8Ω) Phone jack
MONITOR AMP OUT (A, B) 0.1Ω 8Ω Speaker 37.7 W/4Ω (200 W/4Ω) Phone jack
MAIN OUT (L, R) 600Ω 10 kΩ Lines +4 dB (1.23 V) +20 dB (7.75 V) Phone jack
MONITOR OUT 600Ω 10 kΩ Lines +4 dB (1.23 V) +20 dB (7.75 V) Phone jack
EFFECT OUT 600Ω 10 kΩ Lines +4 dB (1.23 V) +20 dB (7.75 V) Phone jack
REC OUT (1, 2) 600Ω 10 kΩ Lines –10 dBV (316 mV) +10 dBV (3.16 V) Phono jack

• All output jacks are unbalanced.

• 0 dB=0.775 Vrms, 0 dBV=1 Vrms.

Actual source

impedance

Nominal

impedance

Nominal Max. before cliping

Specifications are subject to change without prior notice.

Output level

Connector type

3

EMX860ST

4

PANEL LAYOUT

Channel section

1

HIGH

–15 +15

MID

1

–15 +15

LOW

–15 +15

MONI

2

3

4

5

010

EFFECT

010

PAN

LR

LEVEL

010

Equalizer controls (HIGH, MID, LOW)

1

Monitor controls (MONI)

2

Effect control (EFFECT)

3

PAN control (BAL/PAN control for CH7/8)

4

Level control (LEVEL)

5

Pad switch (PAD) (1-6 only)

6

EMX860ST

PAD

6

1

DIGITAL EFFECT section

VOCAL

L HALL

S HALL

ON

DIGITAL
EFFECT

EFFECT section

7

8

Effect select switch

7

DIGITAL EFFECT ON switch

8

010

EFFECT OUT

EFFECT

EFFECT OUT control

9

9

5

EMX860ST

MONITOR section

10

–12

•
6

•
0

•
6

•

+12

125 250 500 1k 2k 4k 8k

11

010

EFFECT RTN

MONITOR

MAIN section

14

–12

•
6

•
0

•
6

•

+12

125 250 500 1k 2k 4k 8k

–12

+12

•
6

•
0

•
6

•

–12

•
6

•
0

•
6

•

+12

010

MASTER

+6
+3

0

–5

–10

LR

+6
+3

–5

–10

Graphic equalizer

10

EFFECT RTN control

11

MASTER control

12

Peak level indicator

0

13

13

12

Graphic equalizer

14

EFFECT RTN control

15

AUX IN control

16

TAPE IN

19

17

MASTER control

18

Peak level indicator

19

010010

EFFECT RTN AUX IN TAPE IN

MAIN STEREO

15

POWER AMP section

LIMITER

MONI

MAIN

LR

LIMITER

L+R

BRIDGE

16

20

21

STEREO

010

010

MASTER

17

LIMITER indicator

20

Stereo/Bridge select switch

21

18

POWER indicator & PHANTOM switch

22

POWER

PHANTOM

+48V

ON
OFF

23

POWER indicator

22

PHANTOM +48 V switch

23

POWER

AMP

6

30816

H:324

16

W:497 D:275

Unit: mm

MIX

POWER 1/3

POWER 2/3

POWER 3/3

Input/output panel

Hi-Z

Lo-Z

Hi-Z

Lo-Z

Hi-Z

Lo-Z

Hi-Z

Lo-Z

Hi-Z

Lo-Z

1 2

Channel input jacks (Hi-Z, Lo-Z) 1-6

1

Channel input jacks (MIC/LINE) 7-8

2

Effect output jack (EFFECT OUT)

3

Foot switch jack (FOOT SW)

4

AUX IN/TAPE IN jacks

5

REC OUT/MONITOR/MAIN (STEREO) jacks

6

Hi-Z

LR

LINE

(MONO)

MICLo-Z

LINELR

(MONO)

MIC

EFFECT

FOOT SW

3

OUT

EMX860ST

CIRCUIT BOARD LAYOUT

POWERED MIXER

LL

(MONO)

R

RR

INPUT TO MAIN

4

TAPE

IN

5

REC
OUT

MAIN(STEREO) MONITORAUX IN

L

RL

OUTPUT

Power

6

transformer

SUB

MIX

Rear panel

SPEAKERS

MONITOR

A

RL

BRIDGE

1

POWER

3

ON/ OFF

SPEAKERS MONITOR jacks

1

SPEAKERS L/R/L+R BRIDGE jacks

2

Power switch

3

L+R

BABAB

2

DIMENSIONS

（単位）

7

EMX860ST

BLOCK & LEVEL DIAGRAM

KEC-92359

8

DISASSEMBLY PROCEDURE

1. MIX Circuit Board

1-1 Remove the six (6) screws marked [30]. The panel

assembly can then be removed. (Fig. 1)

1-2 Remove the sixty-three (63) knobs, the seventeen

(17) hexagonal nuts marked [A] and the seventeen
(17) screws marked [P120]. (Fig. 1)

1-3 Remove the fourteen (14) screws marked [P40]. The

MIX circuit board can then be removed. (Fig. 1)

2. SUB Circuit Board

2-1 Remove the panel assembly. (See Procedure 1.)
2-2 Remove the SUB circuit board from the spacer port

marked [P110]. (Fig. 2)

EMX860ST

[P40]

[30]

[P40]

[30]

[P120] [A]

[30]: Bonding B-Tyte Screw 4.0X8 MFZN2BL (VR779900)
[P40]: Hexagonal Socket Screw-P 3X25 MFZNBL (V3289800)
[P120]: Bonding Tapping Screw-P 3.0X8 MFZN2BL (VN413300)

17

Fig.1

[P120]

[P110]

[30]

[P40]

[70]

[30]

[70]: Bind Head Screw SP 5.0X10 MFZN2BL (VU688100)

Fig.2

[P110]

[70]

9

EMX860ST

3. PWR 1/3, 2/3, 3/3 Circuit Boards

3-1 Remove the panel assembly. (See Procedure 1.)
3-2 Remove the two (2) connectors from the power

transformer and the six (6) screws marked [50].
The rear assembly can then be removed. (Fig. 3)

3-3 Remove the six (6) screws marked [R150]. The

radiating plate with the PWR 1/3 circuit board can
then be removed. (Fig. 3)
Remove the fourteen (14) screws marked [R80], the
six (6) screws marked [R40] and the TR holder
marked [R60]. The PWR 1/3 circuit board can then
be removed. (Fig. 4)

3-4 Remove the seven (7) hexagonal nuts marked [B]

and the screw marked [R210A].
The PWR 2/3 circuit board can then be removed.

3-5 Remove two (2) screws marked [R210B]. The PWR

3/3 circuit board can then be removed. (Fig. 3)

4. Motor fan

4-1 Remove the panel assembly. (See Procedure 1-1.)
4-2 Remove the rear assembly. (See Procedure 3-2.)
4-3 Remove the PWS 1/3 circuit board. (See Procedure

3-3.)

4-4 Remove the two (2) screws marked [R100]. The

motor fan can then be removed.

5. Power transformer

5-1 Remove the panel assembly. (See Procedure 1-1.)
5-2 Remove the rear assembly. (See Procedure 3-2.)
5-3 Remove the four (4) screws marked [70]. The power

transformer can then be removed. (Fig. 2)

[R150]

[50]

[R150]

[R100]

[50]

[B]

[R100]

[50]

7

[R210A]

[R60]

[50]

[R40]

[R80]

[R80]

[R40]

[R40]

[R80]

[R80]

[R210B]

[50]: Bonding B-Tyte Screw 4.0X8 MFZN2BL (VR779900)
[R100]: Bind Head Screw 3.0X30 ZMC2BL (VT520200)
[R150]: Bind Head Tapping Screw-B 4.0X8 MFZN2BL (EG340190)
[R210]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)

Fig.3

10

[R40]: Bind Head Screw SP 3.0X8 MFZN2Y (EG330290)
[R80]: Bind Head Tapping Screw-B 3.0X12 MFZN2BL (VQ074600)

Fig.4

EMX860ST

NJM2068L-D (XM356A00)
NJM4558L (XM922A00)

Dual Operational Amplifier

BA6137 (XA534A00)
LED Driver

M5229P (XG203A00)
7 SEGMENTS GRAPHIC EQUALIZER

TC74HC14AP (IR001400)
Hex Inverter

TC74HC74AP (IR007400)
Dual D-Type Flip-Flop

D1

+ + + + +

+

Constant

Current

Circuit

1D22D33D44

GND5D56Amp

Output

7IN8

VCC

9

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

IN1

IN2

IN3

IN4

IN5

NF1

NF2

NF3

NF4

NF5

-Vcc

GND

+Vcc

OUTPUT

INVERTED
INPUT

NON-INVERTED
INPUT

NF7

NF6

IN7

IN6

-

+

-

+

-

+

-

+

-

+

-

+

-

+

-

+

47k

560

47k

560

47k

560

47k

560

47k

47k

47k

47k

560

10k

10k

11A

2

3

4

5

6

7

1Y

2A

2Y

3A

3Y

GND

8

9

10

11

12

13

14

V

DD

6A

6Y

5A

5Y

4A

4Y

PR CLR

INPUTS OUTPUTS

CK D Q Q
LH H L
HL L H
LL H H
HH t H H L
HH t L H L
HH L Q Q

D

CK

PR

Q

Q

D

CK

PR

Q

Q

CLR

CLR

OO

2PR

11CLR

2

3

4

5

6

7

1D

1CK

1PR

1Q

1Q

GND

8

9

10

11

12

13

14

VCC

2CLR

2D

2CK

2Q

2Q

LSI PIN DISCRIPTION

YSS234 (XN299A00) Digital Sound Processor

PIN
NO.

10 ER1 I Eary refrection preset select 42 MA0 O
11 ER2 I 43 MA1 O
12 REV0 I 44 MA2 O
13 REV1 I Effect select 45 MA3 O
14 REV2 I 46 MA4 O
15 MUTEN I DC D+5V 47 MA5 O External RAM interface address
16 ICN I Initial clear 48 MA6 O
17 PRG I DC D+5V 49 MA7 O
18 MODE I Preset mode (H=DC +5V) 50 MA12 O
19 VSS - Ground 51 MA14 O
20 AVSS - Ground 52 VSS - Ground
21 CVA - N.C. 53 MA10 O
22 AORL O N.C. 54 MA011 O
23 AORR O N.C. 55 MA09 O External RAM interface address
24 CHL I Sample hold capacitor connection 56 MA8 O
25 AIL I Lch ADC input 57 MA13 O
26 VDD - DC D+5V 58 VDD - DC D+5V
27 AIR I Rch ADC input 59 WEN I Write enable
28 CHR I Sample hold capacitor connection 60 OEN I Output enable
29 AOFL O Lch DAC output 61 CEN I Chip select
30 AOFR O Rch DAC output 62 MD7 I/O
31 AVDD - DC A+5V 63 MD6 I/O External RAM interface data
32 CVB I Rch midpoint voltage 64 MD5 I/O

NAME I/O FUNCTION

1 MD4 I/O 33 AVDD - DC A+5Vs bus
2 MD3 I/O 34 VDD - DC D+5V
3 MD0 I/O External RAM interface data 35 TST0 - DC D+5V
4 MD1 I/O 36 TST1 - DC D+5V
5 MD2 I/O 37 DOEN - DC D+5V
6 MCKO O Master clock output 38 SDO1 O N.C.
7 XO O Crystal oscillator connection 39 SDO0 O N.C.
8 XI I Crystal oscillator connection 40 WC O N.C.
9 ER0 I 41 BCO O N.C























PIN

NO.

NAME I/O FUNCTION

IC BLOCK DIAGRAM




































11

EMX860ST

LED
LED Spacer
Circuit Board

CIRCUIT BOARDS

MIX Circuit Board

CN803: to SUB-CN101

LED installation

12

Component side

Note : See parts list for details of circuit board component parts.

CN101:
to MIX

-CN803

SUB Circuit Board

EMX860ST

CN301:
to PWR

-CN101

3NA-V295250

CN202:
to MIX

-CN802

CN201:
to MIX

-CN801

Component side

13

EMX860ST

PWR 1/3 Circuit Board

CN101:
to SUB-CN301

PWR 2/3 Circuit Board

Component side

PWR 3/3 Circuit Board

CN105:
to AC
Cable

CN102:
to Transformer

CN106:
to Transformer

14

CN104 : to PWR 1/3 -W101RE-1

-W101BL-2

-W101BE-3

-W101WH-4

-W101OR-5

-W101BR-6

Component side

Component side

KEC-72360

INSPECTIONS

1. Measuring Instruments

Low Frequency Oscillator: Balance Output, Output Impedance = 150 ohms
Oscilloscope: Input Impedance >= 100 kohms
Level Meter: Input Impedance >= 100 kohms

Note: Use a balance input measuring instrument

2. Mixer Part

2-1 Setting Conditions

Setting conditions are as follows unless otherwise specified.

2-2 Input and Output Load

Input Signal: 1 kHz, sine wave (Rs = 150 ohms)
Load: All output terminals have a 10 k ohms load

2-3 Control Panel Setting

Channel Input (CH1-CH6) Section

EQ (HIGH, MID, LOW) level controls: Center
MONITOR level control: Maximum
EFFECT level control: Maximum
PAN: Center
LEVEL: Maximum
PAD: OFF

Stereo Channel Input (CH7-CH8) Section

EQ (HIGH, MID, LOW) level controls: Center
MONITOR level control: Maximum
EFFECT level control: Maximum
PAN: Center
LEVEL: Maximum

EFFECT Section

DIGITAL EFFECT ON switch OFF
EFFECT OUT level control Maximum

MAIN Section

GRAPHIC EQUALIZER (7 band) Fader: Center
EFFECT RTN level control: Maximum
AUX IN: Maximum
TAPE IN: Maximum
MASTER (MAIN): Maximum

MONITOR Section

GRAPHIC EQUALIZER (7 band) Fader: Center
EFFECT RTN level control: Maximum
MASTER (MAIN) level control: Maximum

Others

PHANTOM +48V switch OFF
POWER AMP switch STEREO

EMX860ST

15

EMX860ST

2-4 Gain

Each output gain should be as shown in the table below.

Table 1: INPUT CH 1-CH 6 [Units: dBs]

Input Terminal Input Level M AIN OUT (L, R) MONITOR OUT EFFECT OUT REC OUT (L, R)

Lo-Z -62

-32

+2.5

+1 +4 +10 -16.8

2.0

± 2

+2.5

2.0

(PAD ON)

Hi-Z -52 +1 - - -

+2.5

2.0

Note: When the POWER AMP MODE switch is set to the BRIDGE side, confirm the gain

Table 2: INPUT CH7-CH8 [Units: dBs]

Input Terminal Input Level MAIN OUT MONITOR OUT EFFECT OUT

MIC -62 +1 +7 ± 2+13
LINE L -22 +1 +7 ± 2+13
LINE R -22 +1 +1 ± 2+7

+2.5

2.0
+2.5

2.0
+2.5

2.0

Table 3: AUX IN and TAPE IN [Units: dBs]

Inp u t T e r minal In p ut Level MAIN OUTPUT

AUX IN -22 +4 ± 2

TAPE IN -22 +1.8 ± 2

+2.5

2.0
+2.5

2.0
+2.5

2.0

+2.5

2.0

2-5 Frequency Response

When the input signal frequency is set to 20 Hz and 20 kHz for the systems shown in Tables 1, 2 and 3, the each
output terminal should fall within the range of +1 and -3 dB at 20 Hz and 20 kHz, using 1 kHz as the r eference.

2-6 Equalizer Characteristics

When the input signals shown below are applied to the channel input in the states of 2-3 and the channel EQ (HIGH,MID,
LOW) level controls are changed from center position (flat), the boost/cut range at the MAIN OUT should be as follows:

Table 4 [Units: dB]

EQ Controls GAIN Frequency Response

LOW Maximum 100 Hz +12 ± 2

Minimum +12 ± 2

MID Maximum 2.5 kHz +12 ± 2

Minimum +12 ± 2

HIGH Maximum 10 kHz +12 ± 2

Minimum +12 ± 2

If the result of the equalizer is out of the specified range, change the input signal frequency so that the output
signal is at the set level. Its frequency should then be within the range of 80 - 120% of the standard frequency.

2-7 Graphic Equalizer Characteristics

When the input signals shown below are applied to the channel input in the states of 2-3 and graphic equalizer level controls are
changed from center position (flat), the boost/cut range at the MAIN OUT and the MONITOR OUT should be as follows:

Table 5 [Units: dB]

Input signal frequency and Fader name

125 Hz 250 Hz 500 Hz 1 kHz 2 kHz 4 kHz 8 kHz

Response Maximum

Minimum

+12

±

-12 2

±

2

If the result of the graphic equalizer is out of the specified range, change the input signal frequency so that the
output signal is at the set level. Its frequency should then be within the range of 80 - 120% of the standard
frequency.

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