Yamaha EMX-660 Service manual

POWERED MIXER

SERVICE MANUAL

EMX660

This document is printed on chlorine free (ECF) paper with soy ink.

011519

20000608-74800

SPECIFICATIONS ................................................ 3/5

DIMENSIONS ............................................................ 6

PANEL LAYOUT .................................... 7

BLOCK & LEVEL DIAGRAM

......................................... 10

CIRCUIT BOARD LAYOUT ............... 11

DISASSEMBLY PROCEDURE ............................ 12

LSI PIN DESCRIPTION .............................. 15

IC BLOCK DIAGRAM ................................. 17

INSPECTIONS ....................................................... 18/23

TROUBLE SHOOTING ............... 28

PARTS LIST OVERALL CIRCUIT DIAGRAM CIRCUIT BOARDS

HAMAMATSU, JAPAN

1.45K-479 Printed in Japan 2000.06

EMX660

IMPOR TANT NOTICE

This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by the users, and have therefore not been restated.

WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in per-

IMPORTANT : This presentation or sale of this manual to any individual or firm does not constitute authorization certifi-

The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, please contact the distributor’s Service Division.

WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may have

IMPORTANT : Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power

sonal injury, destruction of expensive components and failure of the product to perform as specified. For these reasons, we advise all Yamaha product owners that all service required should be performed by an authorized Yamaha Retailer or the appointed service representative.

cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship of any form.

accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to this bus.)

to the unit.

WARNING: CHEMICAL CONTENT NOTICE!

The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Where applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly other entities) to cause cancer and/or birth defects or other reproductive harm.

DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT SO EVER!

Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes to solder/flux vapor!

If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling food.

WARNING

Components having special characteristics are marked and must be replaced with parts having specification equal to those originally installed.

SPECIFICATIONS

General speciﬁcations

300 W + 300 W/4ohms @0.5% THD at 1 kHz (POWER AMP OUT 1, 2)

Maximum output power

Frequency response

Total harmonic distortion

Hum & noise (Average, Rs=150Ω) (with 20 Hz~20 kHz BPF)

Maximum voltage gain (PAD: OFF)

Crosstalk at 1 kHz 65 dB adjacent input, 65 dB input to output

Input channel equalization

Meters 5 POINTS LED METER (–10, –5, 0, +3, +6 dB) (MAIN OUT, MONITOR OUT)

215 W + 215 W/8ohms @0.5% THD at 1 kHz (POWER AMP OUT 1, 2) 600 W/8ohms @0.5% THD at 1 kHz (BRIDGE)

20 Hz~20 kHz +1 dB, –3 dB @1 W output into 8ohms (POWER AMP OUT) 20 Hz~20 kHz +1 dB, –3 dB @+4 dB output into 10 kohms (MAIN OUT, MONITOR OUT, EFFECT SEND)

Less than 0.5% @20 Hz~20 kHz, 150 W output into 4ohms (POWER AMP OUT 1, 2) Less than 0.3% @20 Hz~20 kHz, +14 dB output into 10 kohms (MAIN OUT, MONITOR OUT, EFFECT OUT)

–124 dB equivalent input noise, –65 dB residual output noise (POWER AMP OUT) –88 dB residual output noise (MAIN OUT, MONITOR OUT, EFFECT SEND) –79 dB (83 dB S/N)

MAIN OUT, MONITOR OUT –69 dB (73 dB S/N)

MAIN OUT, MONITOR OUT –75 dB (79 dB S/N)

EFFECT SEND –69 dB (73 dB S/N)

EFFECT SEND 88 dB CH IN (Lo-Z) to POWER AMP OUT (CH1~4)

66 dB CH IN (Lo-Z) to MAIN OUT, MONITOR OUT (CH1~4) 72 dB CH IN (Lo-Z) to EFFECT OUT (CH1~4) 48 dB CH IN (Lo-Z) to REC OUT (CH1~4) 56 dB CH IN (Hi-Z) to MAIN OUT, MONITOR OUT (CH1~4) 26 dB AUX IN to MAIN OUT 24 dB TAPE IN to MAIN OUT 66 dB MIC IN to MAIN OUT, MONITOR OUT (CH5•6) 26 dB LINE IN to MAIN OUT, MONITOR OUT (CH5) 46 dB INST IN to MAIN OUT, MONITOR OUT (CH6)

±15 dB Maximum

HIGH 12 kHz shelving* MID 2.5 kHz peaking LOW 80 Hz shelving*

* Turn over/roll-off frequency of shelving: 3 dB below maximum variable level.

Master level control at nominal level and all channel level controls at minimum.

Master level control at nominal level and 1 channel level control at nominal level.

Master level control at nominal level and all channel level controls at minimum.

Master level control at nominal level and 1 channel level control at nominal level.

EMX660

Graphic equalizer 7 bands (125, 250, 500, 1 k, 2 k, 4 k, 8 kHz), ±12 dB Maximum (MAIN OUT, MONITOR OUT) Internal digital effect 8 types (VO.ECHO 1, VO.ECHO 2, VO.REV. 1, VO.REV. 2, HALL 1, HALL 2, ROOM, PLATE)

Phantom power

Limiter Comp. : THD≥0.5% (POWER AMP OUT) LIMIT indicators Turns on. : THD≥0.5% (POWER AMP OUT) Protection Circuit (Power Amp.) POWER Switch on/off Mute, DC Detection, Temp (Heatsink Temp≥90˚C) Foot switch (FC-5) DIGITAL EFFECT MUTE : on/off

Power requirement

Power consumption 250 W Dimensions (WxHxD) 497×275×275 mm Weight 17 kg

• 0 dB=0.775 Vrms

+15 V is supplied to electrically balanced inputs for powering condenser microphones via 2.4 kohms current limiting/isolation resisters.

USA and Canada 120 V AC 60 Hz Europe 230 V AC 50 Hz Other 240 V AC 50 Hz

EMX660

Input speciﬁcations

Input connectors PAD

Actual load impedance

Nominal

impedance

Sensitivity

Input level

Nominal level

Max. before

cliping

Connector

type

CH INPUT (Lo-Z) (CH1~4)

CH INPUT (Hi-Z) (CH1~4)

MIC INPUT (CH5•6) 3 kohms

LINE INPUT (CH5) (1, 2) 10 kohms INST INPUT (CH6) (1, 2) 470 kohms AUX IN 10 kohms

TAPE IN (1, 2) 10 kohms

1. Sensitivity is the lowest level that can produce an output of +4 dB (1.23 V) or the nominal output lev el when the unit is set at maximum gain. (All level controls are at maximum position.)

2. Balanced (T=Hot, R=Cold, S=Gnd)

3. Unbalanced

• 0 dB=0.775 Vrms, 0 dBV=1 Vrms.

OFF

3 kohms

OFF

10 kohms

50~600ohms

Mics

600ohms Lines

50~600ohms

Mics

600ohms Lines

50~600ohms

Mics

600ohms Lines

1 kohms

600ohms Lines

–62 dB (0.616 mV) –50 dB (2.45 mV) –20 dB (77.5 mV)

–32 dB (19.5 mV) –20 dB (77.5 mV) +10 dB (2.45 V)

–52 dB (1.95 mV) –40 dB (7.75 mV) –10 dB (245 mV)

–22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V)

–62 dB (0.616 mV) –50 dB (2.45 mV) –20 dB (77.5 mV)

–22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) –42 dB (6.16 mV) –30 dB (24.5 mV) 0 dB (0.775 V) –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V)

–22 dBV (79.4 mV) –10 dBV (316 mV) +17.8 dBV (7.76 V)

XLR-3-31 type

Phone jack (TRS)

XLR-3-31 type

Phone jack Phone jack Phone jack

RCA phono jack

Output speciﬁcations

Output connectors

POWER AMP OUT (1•2) (A, B) 0.1ohms 4/8ohms Speaker 60 W/4ohms (300 W/4ohms) Phone jack BRIDGE OUT 0.1ohms 8ohms Speaker 120 W/8ohms (600 W/8ohms) Phone jack MAIN OUT 600ohms 10 kohms Lines +4 dB (1.23 V) +20 dB (7.75 V) Phone jack

MONITOR OUT 600ohms 10 kohms Lines +4 dB (1.23 V) +20 dB (7.75 V) EFFECT OUT 600ohms 10 kohms Lines +4 dB (1.23 V) +20 dB (7.75 V)

REC OUT (1, 2) 600ohms 10 kohms Lines –10 dBV (316 mV) +10 dBV (3.16 V) RCA phono jack

• All output jacks are unbalanced.

• 0 dB=0.775 Vrms, 0 dBV=1 Vrms.

Actual source

impedance

Nominal

impedance

Nominal

Output level

Connector type

Max. before cliping

Phone jack Phone jack

For European Model Purchaser/User Information speciﬁed in EN55103-1 and EN55103-2. Inrush Current: 56A Conformed Environment: E1, E2, E3 and E4

EMX660

DIMENSIONS

W:497

(45.5)

259

168

H:275

(45.5)

45.5 380 45.5 16 487

15057.5 D:275

(67.5)

Units: mm

PANEL LAYOUT

Control panel

Channel section

HIGH

–15 +15

MID

–15 +15

LOW

–15 +15

MONI

010

EFFECT

010

LEVEL

010

PAD

Equalizer controls (HIGH, MID, LOW)

Monitor controls (MONI)

Effect control (EFFECT)

Level control (LEVEL)

Pad switch (PAD) (Channel 1-4 only)

EMX660

DIGITAL EFFECT section MONITOR section

+12

–12

•

125

250 500 1k 2k 4k 8k

VO. ECHO 1

VO. ECHO 2

VO. REV. 1

VO. REV. 2

HALL. 1

9 10

HALL. 2

ROOM

PLATE

010

EFFECT RTN

9 10 11 12

DIGITAL

EFFECT

Effect select switch and indicator

DIGITAL EFFECT ON switch and indicator

010

TAPE IN

MONITOR

Graphic equalizer EFFECT RTN control TAPE IN control MASTER control Peak level indicator

+12

• 6

• 0

• 6

•

–12

–10

010

MASTER

+6 +3

–5

EMX660

MAIN section

+12

• 6

• 0

• 6

•

–12

010010010

125

250 500 1k 2k 4k 8k

AUX INEFFECT RTN

MAIN

TAPE IN

+12

• 6

• 0

• 6

•

–12

–10

010

MASTER

Graphic equalizer

+6 +3

–5

EFFECT RTN control

AUX IN control

TAPE IN

MASTER control

Peak level indicator

POWER AMP section

MPs

300W 300W

MAIN MAIN

LIMITER

BRIDGE

MAIN

MAIN MONITOR

POWER AMP

POWER indicator & PHANTOM section

LIMITER indicator

Power amp select switch

POWER indicator

PHANTOM switch

OFF

POWER

PHANTOM

Input/Output panel

EMX660

Hi-Z

Lo-Z

Hi-Z, Lo-Z input jacks

MIC, LINE, INST input jacks

Effect output jack (EFFECT OUT)

Foot switch jack (FOOT SW)

External input jacks (AUX IN/TAPE IN)

External output jacks

(REC OUT/MONI-TOR/MAIN)

Rear panel

Hi-Z

Lo-Z

Hi-Z

Lo-Z

1 2

LINEHi-Z INST

MIC MICLo-Z

EFFECT OUT

FOOT SW

SEE REAR PANEL CAUTION

EEEngine

TAPE

AUX IN

INPUT OUTPUT

MONITOR

REC OUT

MAIN

POWER

OFF

ON /

Speaker output jacks (POWER AMP 1 A/B,

POWER AMP 2 A/B,BRIDGE) Power switch

POWER AMP 2

SPEAKERS

BRIDGE

BABA

POWER AMP 1

EMX660

213

IC703

IC601

IC603

431

231

22431

IC902

IC706

IC601

IC501

243

IC501

IC301

(

CH3

)

IC101

(

CH1

)

IC901

6 7

IC704

5 7

IC705

243

IC801

243

CN901

CN301

IC704

3 1

IC705

3 1

IC701

CN301

IC706

CN901

243

KEC-92542

CN101

IC201

CN101

IC101

MIX

SUB

PWR

BLOCK & LEVEL DIAGRAM

CIRCUIT BOARD LAYOUT

EMX660

PWR 1/3

Power

transformer

MIX

SUB

PWR 1/3

PWR 2/3

MIX

EMX660

DISASSEMBLY PROCEDURE

1 MIX circuit board

1-1 Remove the six (6) screws marked [30]. The panel

assembly can then be removed. (Fig. 1)

1-2 Remove the four (4) screws marked [P130]. The

shield case can then be removed. (Fig. 1)

1-3 Remove the f orty-three (43) knobs, the thirteen (13)

special hexagonal nuts and the thirteen (13) screws marked [P90]. (Fig. 1)

1-4 Remove the twelve (12) screws marked [P40]. The

MIX circuit board can then be removed. (Fig. 1)

2 SUB circuit board

2-1 Remove the panel assembly. (See Procedure 1.) 2-2 Remove the shield case. (See Procedure 1.) 2-3 Remove the SUB circuit board from the seven(7)

spacer supports marked [P110]. (Fig. 1)

Right side view

PowerPower

Power

transformertransformer

transformer

Front panel

[50] [P130] [P130]

[30]

[P130]

Rear panel

[70]

[P40]

[30]

MIX

[P90][P90] Hexagonal nut[P90]

[R180]

[70]

Left side view

[P110]

[P130]

SUB

[R180]

[30]: Bind Head Screw 4.0X8 MFZN2BL (EG340360)

[50]: Bind Head Screw SP 5.0X10 MFZN2BL (VU688100)

[70]: Bind Head Screw 4.0X8 MFZN2BL (EG340360)

[P40]: Hexagonal Button Screw-P 3X25 MFZNBL (V3289800)

[P90]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)

[P130]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)

[R180]: Bind Head Tapping Screw-B 4.0X8 MFZN2BL (EG340190)

Fig.1

3 PWR 1/3 circuit board

3-1 Remove the panel assembly. (See Procedure 1.) 3-2 Remove the two (2) connectors from the power

transformer and the six (6) screws marked [70]. The rear assembly can then be removed. (Fig. 1)

3-3 Remove the six (6) screws marked [R180]. The

power unit can then be removed. (Fig. 1)

3-4 Remove the sixteen (16) screws marked [R90]. TR

support angle A/B can then be removed. (Fig. 2)

3-5 Remove the six (6) screws marked [R40]. The PWR

circuit board 1/3 can then be removed. (Fig. 2)

EMX660

Power unit

[R90] [R90]

[R40]

[R40]: Bind Head Screw SP 3.0X8 MFZN2Y (EG330290)

[R90]: Bind Head Tapping Screw-B 3.0X12 MFZN2BL (VQ074600)

PWR 1/3

[R90]

Fig.2

[R40]

4 PWR 2/3 circuit board

4-1 Remove the panel assembly. (See Procedure 1.) 4-2 Remove the rear assembly. (See Procedure 3.) 4-3 Remove the screw marked [R210] and the five (5)

“special screws b”. The PWR 2/3 circuit board can then be removed. (Fig. 3)

5 PWR 3/3 circuit board

5-1 Remove the panel assembly. (See Procedure 1.) 5-2 Remove the rear assembly. (See Procedure 3.) 5-3 Remove the two (2) screws marked [R150] and then

remove the PWR 3/3 circuit board with the switch bracket. (Fig. 3)

5-4 Remove the tw o (2) screws marked [R140] and the

screw marked [R150a] from the switch brac k et. The PWR 3/3 circuit board can then be removed. (Fig. 3)

EMX660

6 Motor fan

6-1 Remove the panel assembly. (See Procedure 1.) 6-2 Remove the rear assembly. (See Procedure 3.) 6-3 Remove the power unit. (See Procedure 3.) 6-4 Remove the two (2) screws marked [R120]. The

motor fan can then be removed. (Fig. 3)

7 Power transformer

7-1 Remove the panel assembly. (See Procedure 1.) 7-2 Remove the rear assembly. (See Procedure 3.) 7-3 Remove the f our (4) screws mark ed [50]. The pow er

transformer can then be removed. (Fig. 1)

Front panel

[R120]

Power unit

MotorMotor fanfan

Motor fan

PWR 3/3 PWR 2/3

[R150]

[R140][R150a][R150]

[R120]: Bind Head Screw 3.0X30 ZMC2BL (VT520200)

[R140]: Bind Head Screw 3.0X8 MFZN2BL (VB659000)

[R150a]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)

[R150]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)

[R210]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)

Fig.3

[R210]

Hexagonal nut

LSI PIN DESCRIPTION

EMX660

ZFX-2 (XY297A00) DSP

NO.

NAME I/O FUNCTION

1 ED2 I/O 51 HX/SDA I/O/Z 2 ED3 I/O 3 ED4 I/O 53 AXLR2 I 4 ED5 I/O 54 AR1 I 5 ED6 I/O 55 AR2 I 6 ED7 I/O 56 HRBCK/SA0 I

   

External Memory and I/O Data Bus

       

7 VSS - Ground 57 HR/SA1 I 8 VDD - Power Supply 58 HRS/SA2 I 9 CLKM0 I Clock Mode 59 VSS - Ground

10 CLKM1 I 61 HXBCK/SCL I 11 TMS I

     

1 min. 3fold 5fold CLKM0 0 1 0 1 CLKM1 0 0 1 1

PLL BYPASS

TAP(Test Access Port) Mode Select 12 TDI I TAP Data Input 63 /CS/SA4 I 13 TCK I TAP Clock 64 HBCKS/SA5 I

NO.

NAME I/O FUNCTION

Host Interface Data Output/I2C Bus Data

52 /EMPTY O/Z

CMEM Update Buffer and HR Resistor Empty Flag Output Audio Data Transmitt Unit 2/3 Left and Right Channel Frame Frequency Signal Audio Data Receive Unit 1 Data Input Audio Data Receive Unit 2 Data Input Host Interface Receive Clock / I2C Bus Address 0 Host Interface Data Input/ I2C Bus Address 1 Host Interface Receive Data Frame Frequency Signal/ I2C Bus Address 2

60 VDD - Power Supply

Host Interface Transmitt Clock/ I2C Bus Clock

62 HXS/SA3 I

Host Interface Transmitt Data Frame Frequency Signal/ I2C Bus Address 3 Host Interface Chip Select/ I2C Bus Address 4 HRBCK/HXBCK Active Edge Select/ I2C Bus Address 5

SUB: IC306

14 CLKIN I Master Clock 65 I2CSEL I Host Interface Mode Select 15 VSS - Ground 66 VSS - Ground 16 VDD - Power Supply 67 VDD - Power Supply 17 CLKO O Machine Clock Output 68 AXBC1 I 18 EA12/ED8 I/O 69 AXBC2 I 19 EA13/ED9 I/O 20 EA14/ED10 I/O 71 DIV8 O 21 EA15/ED11 I/O 72 /LAV O Ruch ALU Overflow Frag Output

  

External SRAM and ROM Address Bus/ External DRAM and I/O Data Bus

   

70 AXLR1 I

22 VSS - Ground 73 /LMV O 23 VDD - Power Supply 74 /DRDY O/Z 24 EA16/ED12 I/O 75 EMU0 I/O/Z Emurator Interrupt 0 25 EA17/ED13 I/O 26 EA18/ED14 I/O 77 TDO O/Z 27 EA19/ED15 I/O 78 DIV512 O Machine Clock then512 min. 28 EA4/ED16 I/O 79 ARLR1 I 29 EA5/ED17 I/O 30 EA6/ED18 I/O 81 HDIR/SA6 I 31 EA7/ED19 I/O 82 SEL5V3V I Input Level Control

  

External SRAM and ROM Address Bus/ External DRAM and I/O Data Bus

   

  

External Memory Address Bus/ External I/O Data Bus

   

76 EMU1 I/O/Z Emurator Interrupt 1

80 ARLR2 I

Audio Data Transmitt Unit 1 bit Clock Audio Data Transmitt Unit 2/3 bit Click Audio Data Transmitt Unit 1 Left and Right Channel Frame Frequency Signal Machine Clock Output then 8 min.

Ruch MAC Overflow Frag Output Host Interface Transmitt Data Ready Frag Output

TAP(Test Access Port) Data Output Audio Data Receive Unit 1 Left and Right Channel Frame Frequency Signal

Audio Data Receive Unit 2 Left and Right Channel Frame Frequency Signal Host Interface Data Format Select/ I2C Bus Address 6

32 VSS - Ground 83 /MUTE I Mute Control 33 VDD - Power Supply 84 /TRST I TAP(Test Access Port) Reset 34 EA8/ED20 I/O 85 /RS I Hardware Reset 35 EA9/ED21 I/O 36 EA10/ED22 I/O 87 VDD - Power Supply 37 EA11/ED23 I/O 88 /IOE O External I/O Enable 38 TEST0 I 89 /RAS/SRCS O 39 TEST1 I Test Mode Control 90 /CAS/SROE O 40 TEST2 I 91 /ROME O External ROM Enable 41 TEST3 I 92 /WE O 42 /BIO I Separate Control Input 93 EA0 O 43 /INT1 I Interrupt 1 94 EA1 O 44 ARBC1 I 45 ARBC2 I 46 AX1 O 47 AX2 O 48 AX3 O

  

External Memory Address Bus/ External I/O Data Bus

   

      

Audio Data Receive Unit 1 bit Clock

Audio Data Receive Unit 2 bit Clock

Audio Data Transmitt Unit 1 Data Output

Audio Data Transmitt Unit 2 Data Output

Audio Data Transmitt Unit 3 Data Output

86 VSS - Ground

95 EA2 O 96 EA3 O 97 VSS - Ground 98 VDD - Power Supply 99 ED0 I/O

External DRAM Low Address Strove/External SRAM Chip Select External DRAM Culumn Address Strove/External SRAM Output Enable

External Memory and I/O Wright Enable

  

External Memory and I/O Address Bus

    

External Memory and I/O Data Bus 49 VSS - Ground 100 ED1 I/O 50 VDD - Power Supply

Z: High inpedance

EMX660

PCM3001E (XY282A00) ADA

NO.

10 CINPL 11 VCOM 12 VOUTR O DAC Analog Output, R ch 26 FMT1 I Audio Data Format 1 (1) 13 AGND2 DAC Analog Ground 27 FMT0 I Audio Data Format 0 (1) 14 VCC2 - DAC Analog Power Supply 28 RSTB I Reset Input, Active ”L”

NAME I/O FUNCTION

1 VINL I ADC Analog input, L ch 15 VOUTL O DAC Analog Output, L ch 2 Vcc1 - ADC Analog Power Supply 16 LRCIN I Sampling Clock Input (fs) 3 AGND1 - ADC Analog Ground 17 BCKIN I Bit Clock Input 4 VREFL - ADC Reference decuple, L ch 18 DIN I Audio Data Input 5 VREFR - ADC Reference Decuple, R ch 19 DOUT O Audio Data Output 6 VINR I ADC Analog input, R ch 20 XTI I 7 CINPR 8 CINNR 9 CINNL -

ADC Unch areasing Filter Capacitor (+), R ch ADC Unch areasing Filter Capacitor (-), R ch ADC Unch areasing Filter Capacitor (-), L ch ADC Unch areasing Filter Capacitor (+), L ch DAC Center Power Supply Decuple

PIN NO.

NAME I/O FUNCTION

21 XTO O Crystal Oscillator Output 22 CLKIO I/O 23 VDD - Digital Power Supply 24 DGND - Digital Ground 25 FMT2 I Audio Data Format 2 (1)

Crystal Oscillator Input, External System Clock Input Crystal Oscillator Buffer Output, Externak System Clock Input

SUB: IC305

+ 36 hidden pages

Yamaha EMX-660 Service manual

CONTENTS

SPECIFICATIONS

DIMENSIONS

PANEL LAYOUT

BLOCK & LEVEL DIAGRAM

CIRCUIT BOARD LAYOUT

DISASSEMBLY PROCEDURE

LSI PIN DESCRIPTION