Rev 1.4
UTRON
FEATURES
40 / 44 pin 400mil TSOP-Ⅱ
access time: 35, 40, 50, 60
RAS
2
CAS
RAS
Early write or output enable controlled write
Extended Data Out operation
Package : 40 pin 400mil SOJ
Single +5V+
TTL compatible inputs and outputs
512 refresh cycles /8ms
Byte/Word Read/Write operation
CAS
- before –
only and Hidden refresh capability
10% power supply
refresh capability
RAS
256K X 16 BIT EDO DRAM
Speed -35 -40 -50 -60
t
t
t
t
t
RAC
CAA
PC
CAC
RC
35ns 40ns 50ns 60ns
18ns 20ns 24ns 30ns
14ns 15ns 19ns 27ns
11ns 12ns 14ns 15ns
70ns 75ns 90ns 110ns
UT51C164
GENERAL DESCRIPTION
The UT51C164 is high speed 5V EDO DRAMs organized as 256K bit X 16 I/O and fabricated with
the CMOS process. The UT51C164 offers a combination of unique features including : EDO Page
Mode operation for higher bandwidth with Page Mode cycle time as short as 14ns. All inputs are
TTL compatible. Input and output capacitance is significantly lowered to increase performance and
minimize loading. These features make the UT51C164 suited for wide variety of high performance
computer systems and peripheral applications
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
1
Rev 1.4
UTRON
PIN DESCRIPTION
SYMBOL DESCRIPTION
A0-A8 Address Inputs
RAS
UCAS
LCAS
WE
OE
Row Address Strobe
Column Address Strobe / Upper Byte Control
Column Address Strobe / Lower Byte Control
Write enable
Output enable
DQ0-DQ15 Data Inputs, Data Outputs
VDD +5V Supply
Vss 0V Supply
NC No Connect
PIN CONFIGURATIONS
UT51C164
40- pin SOJ
256K X 16 BIT EDO DRAM
UT51C164
40- pin TSOP -
Ⅱ
UT51C164
V
DQ0
DQ1
DQ2
DQ3
V
DQ4
DQ5
DQ6
DQ7
NC
NC
WE
RAS
NC
A0
A1
A2
A3
V
DD
DD
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
Vss
39
DQ15
38
DQ14
37
DQ13
36
DQ12
35
Vss
34
DQ11
33
DQ10
32
DQ9
31
DQ8
30
NC
29
LCAS
28
UCAS
27
OE
26
A8
25
A7
24
A6
23
A5
22
A4
21
Vss
V
DQ0
DQ1
DQ2
DQ3
DD
V
DQ4
DQ5
DQ6
DQ7
NC
NC
WE
RAS
NC
A0
A1
A2
A3
DD
V
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
1
DD
40
Vss
39
DQ15
38
DQ14
37
DQ13
36
DQ12
35
Vss
34
DQ11
33
DQ10
32
DQ9
31
DQ8
30
NC
29
LCAS
28
UCAS
27
OE
26
A8
25
A7
24
A6
23
A5
22
A4
21
Vss
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
2
Rev 1.4
UTRON
FUNCTION BLOCK DIAGRAM
A0
A1
.
.
.
9
Y0
–Y8
A8
A7
.
Address Buffers
&
Predecoders
256K X 16 BIT EDO DRAM
UCAS
WE
OE
Counter
Refresh
Control Circuit
X0 – X8
Row Control Circuit
LCAS
RAS
UT51C164
V
V
DD
SS
GENERATOR
V
BB
V
BB
Column Decoder
X512 CS
Row Decoder
512 x 512 x 16
Sense Amp
Cell Array
x16 x16
FSA & Write in Circuit
Input & Output Buffer
x16
DQ[0,15]
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
3
Rev 1.4
UTRON
256K X 16 BIT EDO DRAM
UT51C164
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNIT
Voltage on any pin relative to Vss V
Supply voltage relative to VSS V
Short circuit output current I
Power dissipation PD 1.0 W
Operating temperature TA 0 to + 70 ºC
Storage temperature T
Notes: Permanent device damage may occur if absolute maximum ratings are exceed.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER SYMBOL
Supply voltage
Input high voltage VIH 2.4 VDD +1V V 1
Input low voltage VIL -0.3 0.8 V 1
Notes: 1. All Voltage referred to Vss
CAPACITANCE
PARAMETER SYMBOL TYP MAX UNIT
Input capacitance (A0-A8) CIN1 3 4 pF
Input Capacitance
(
RAS ,UCAS,LCAS
Output capacitance(DQ0-DQ15) CDQ 5 7 pF
(TA = 25ºC, VDD= 5V±0.5V ,f=1MHz)
,
,
OE
WE
VDD 4.5 5.5 V 1
Vss 0 0 V -
)
-1.0 to +7 V
T
-1.0 to +7 V
DD
50 mA
OUT
-55 to +125 ºC
STG
(TA = 0℃ to 70ºC)
5.0V
MIN MAX
C
2 4 5 pF
IN
UNIT NOTES
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
4
Rev 1.4
UTRON
256K X 16 BIT EDO DRAM
UT51C164
DC CHARACTERISTICS
(TA = 0℃ to 70ºC, VDD = 5.0 V ± 0.5 V, Vss = 0 V)
SYMBOL PARAMETER
SPEED
)
(t
RAC
UT51C164
Min Max
UNIT TEST CONDITION
-35 - 190
I
DD1
Operating Current,
V
DD
Supply
-40 - 180
-50 - 170
mA t
RC
-60 - 160
I
DD2
Standby Current
(TTL Input)
- - 3 mA
RAS=UCAS=LCAS
=V
-35 - 190
I
DD3
Only Refresh
RAS
Current
-40 - 180
-50 - 170
mA t
RC
-60 - 160
-35 - 220
I
DD4
EDO Page Mode
Current
-40 - 200
-50 - 190
mA t
PC
-60 - 180
-35 - 190
I
CBR Refresh Current
DD5
-40 - 180
-50 - 170
mA t
RC
-60 - 160
RAS
CAS
I
DD6
Standby Current
(CMOS Input)
- - 2 mA
All other inputs≧ V
VDD Power Supply - 4.5 5.5 V
ILI Input Leakage Current - -10 10 uA
ILO
Output Leakage
Current
- -10 10 uA
V
SS
V
SS
RAS=CAS
VIL Input Low Voltage - -1 0.8 V
VIH Input High Voltage - 2.4
VOL Output Low Voltage - - 0.4 V I
VDD +1
V
OI
= 2mA
VOH Output High Voltage - 2.4 - V IOH = 2mA
Notes: I
open. I
RAS
, I
, I
, I
DD1
DD3
is specified as an average current. In I
DD
=V
In I
IL.
DD4
are dependent on output loading and cycle rates. Specified values are obtained with the output
DD4
DD5
, address can be changed maximum once within one EDO page cycle time, tPC.
DD1
, I
DD3
, and I
address can be changed maximum once while
DD5
= tRC (min.)
IH
= tRC (min.)
= tPC (min.)
= tRC (min.)
≧
V
-0.2V
DD
≧
V
-0.2V
DD
≦
V
≦VDD
IN
≦
V
≦VDD
OUT
= V
SS
IH
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
5
Rev 1.4
UTRON
AC CHARACTERISTICS
Test condition: V
SYMBOL PARAMETER
1
t
RAS
2
tRC
3
tRP
4
t
CSH
5
t
CAS
6
t
RCD
7
t
RCS
8
t
ASR
9
t
RAH
10
t
ASC
11
t
CAH
12
t
RSH
13
t
CRP
14
t
RCH
15
t
RRH
16
t
ROH
17
t
Access Time from
OAC
18
t
Access Time from
CAC
19
t
Access Time from
RAC
20
t
CAA
21
tLZ
22
tHZ
23
tAR
24
t
RAD
25
26
27
28
29
tT
t
CWL
t
WCS
t
WCH
tWP
= 5.0V±0.5V, V
DD
Pulse Width
RAS
Read or Write Cycle Time 70 75 90 110 ns
Precharge Time
RAS
Hold Time
CAS
Pulse Width
CAS
to
RAS
Read Command Setup Time 0 0 0 0 ns
Row Address Setup Time 0 0 0 0 ns
Row Address Hold Time 6 7 9 10 ns
Column Address Setup Time 0 0 0 0 ns
Column Address Hold Time 6 7 9 10 ns
to
RAS
to
CAS
Time
Read Command Hold Time
Reference
Read Command Hold Time
Reference
Hold Time Referenced
RAS
to
OE
Access Time From Column
Address
or
OE
or
OE
Output
Column Address Hold Time
from
RAS
to Column Address
RAS
Delay Time
Transition Time 1.5 50 1.5 50 1.5 50 1.5 50 ns
Write Command to
Lead Time
Write Command Setup Time 0 0 0 0 ns
Write Command Hold time 5 6 7 10 ns
Write Pulse Width 5 6 7 10 ns
Delay
CAS
Hold Time
CAS
Precharge
RAS
CAS
RAS
to Low-Z Output
CAS
to High-Z
CAS
(TA = 0℃ to 70°C)
/ VIL=3V / 0V, V
IH
35 40 50 60
Min. Max. Min. Max. Min. Max. Min. Max.
35 75K 40 75K 50 75K 60 75K ns
25 25 30 40 ns
35 40 50 60 ns
8 8 10 10 ns
13 24 17 28 19 36 20 45 ns
10 12 14 15 ns
5 5 5 5 ns
0 0 0 0 ns
0 0 0 0 ns
7 8 10 10 ns
OE
CAS
RAS
CAS
11 12 14 15 ns
11 12 14 15 ns
35 40 50 60 ns
18 20 24 30 ns
0 0 0 0 ns
0 5 0 6 0 8 0 10 ns
25 30 40 50 ns
10 17 12 20 14 26 15 30 ns
8 10 10 10 ns
256K X 16 BIT EDO DRAM
/ VOL=2.0 / 0.8)
OH
UT51C164
NOTE
UNIT
*1
*2
*2
*9
*3,4,11
*3,5,6
*3,4,7
*13
*13
*8
*12
*9,10
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
6
Rev 1.4
UTRON
AC CHARACTERISTICS (
SYMBOL PARAMETER
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Write Command Hold Time
WCR
from
Write Command to
RWL
Lead Time
Data in Setup Time 0 0 0 0 ns
tDS
Data in Hold Time 5 6 7 10 ns
tDH
Write to
WOH
OE
OED
Read-Modify-Write Cycle Time 105 110 130 170 ns
RWC
Read-Modify-Write Cycle Time
RRW
RAS
CAS
CWD
Modify-Write Cycle
RAS
RWD
Modify-Write Cycle
CAS
CRW
Column Address to
AWD
Time
EDO Page Mode Read or
tPC
Write Cycle Time
tCP
CAS
Column Address to
t
CAR
RAS
Access Time from Column
t
CAP
Precharge
Data in Hold Time Referenced
DHR
to
RAS
t
t
t
t
t
CAS
CSR
Refresh
RAS
RPC
Time
CAS
CHR
Refresh
EDO Page Mode Cycle Time
PCM
in RMW
Output Hold After
COH
OE
OES
Time
OE
OEH
RMW Cycle
OE
OEP
Refresh Interval (512 Cycles) 8 8 8 8 ms
REF
RAS
RAS
Hold time
OE
to Data Delay Time
Pulse Width
to
to
pulse Width in RMW
Precharge Time
Setup Time
Setup Time in CBR
to
Hold Time in CBR
Delay in Read-
WE
Delay in Read-
WE
Precharge
CAS
CAS
Low to
Hold Time from
Pulse Width
CAS
High Setup
continued )
Delay
WE
Low
in
WE
UT51C164
256K X 16 BIT EDO DRAM
35 40 50 60
Min. Max. Min. Max. Min. Max. Min. Max.
25 30 40 50 ns
11 12 14 15 ns
5 6 8 10 ns
5 6 8 10 ns
70 75 85 105 ns
28 30 34 40 ns
54 58 68 85 ns
46 48 52 65 ns
35 38 42 58 ns
14 15 19 27 ns
4 5 7 10 ns
18 20 24 30 ns
20 23 27 34 ns *4
25 30 40 50 ns
8 10 10 10 ns
0 0 0 0 ns
8 9 12 15 ns
55 60 70 85 ns
3 3 3 3 ns
3 4 6 8 ns
5 6 8 10 ns
8 10 14 18 ns
UNIT
NOTE
*11
*11
*11
*11
*9
*9
*9
*14
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
7
Rev 1.4
UTRON
256K X 16 BIT EDO DRAM
UT51C164
Notes:
t
(Max.) is specified for reference only. Operation within
1.
RCD
(Max.) and
t
CAA
time is controlled by
t
2. Either
RRH
or
t
(Max.) can be met. If
t
CAA
must be satisfied for Read Cycle to occur.
RCH
and
t
CAC.
t
is greater than the specified
RCD
t
(Max.) limits insures that
RCD
t
(Max.), the access
RCD
t
RAC
3. Measured with a load equivalent to one TTL input and 50pF.
4. Access time is determined by the longest of
≦
t
RCD
t
RAD
t
t
t
RAD
5. Assumes that
amount that
6. Assumes that
amount that
7. Assumes that
8. Operation within the
reference point only. If
t
by
CAA
t
9.
,
WCS
t
10.
WCS
t
11.
and
DS
t
12.
is measured between
T
t
and
CAC.
t
t
,
RWD
AWD
(min.) must be satisfied in an Early Write Cycle.
t
are referenced to the latter occurrence of
DH
t
RAD
exceeds
≦
t
RCD
exceeds
≧
t
RAD
t
RAD
t
t
and
CWD
(Max.). If
RAD
t
RCD
(Max.). If
RCD
t
RAD
(Max.)
(Max.)
t
t
RCD
RCD
(Max.).
(Max.) limits ensures that
is greater than the specified
RAD
are not restrictive operating parameters.
V
(min.) and
IH
V
IL
t
,
CAA
CAC
is greater than
is greater than
(max.). AC-measurements assume
t
and
CAP
t
t
t
can be met.
RA
t
RAD
or
CAS
.
(Max.),
RCD
(Max.),
RCD
t
will increase by the
RAC
t
will increase by the
RAC
t
(Max.) is specified as a
RAD
(Max.), the access time is controlled
.
WE
t
= 3ns.
T
t
13. Assumes a tri-state test load (5pF and a 500Ohm Thevenin equivalent).
14.An initial pause of 200us is required after power-up followed by any 8 CBR or ROR cycles
before device operation is achieved.
UTRON TECHNOLOGY INC. P90005
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
8