All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.
TYAN, Taro and Thunder K8WE are trademarks of TYAN Computer
Corporation.
AMD, Opteron, and combinations thereof are trademarks of AMD Corporation.
Microsoft, Windows are trademarks of Microsoft Corporation.
SuSE,is a trademark of SuSE AG.
Linux is a trademark of Linus Torvalds
IBM, PC, AT, and PS/2 are trademarks of IBM Corporation.
Winbond is a trademark of Winbond Electronics Corporation.
Notice
Information contained in this document is furnished by TYAN Computer
Corporation and has been reviewed for accuracy and reliability prior to printing.
TYAN assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN products including liability or
warranties relating to fitness for a particular purpose or merchantability. TYAN
retains the right to make changes to product descriptions and/or specifications
at any time, without notice. In no event will TYAN be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
2.9 Tips on Installing Motherboard in Chassis Page 24
2.10 Installing the Memory Page 25
2.11 Attaching Drive Cables Page 28
2.12 Installing Add-In Cards Page 30
2.13 Connecting External Devices Page 31
2.14 Installing the Power Supply Page 32
2.15 Finishing Up Page 33
Chapter 3: BIOS
3.1 BIOS Setup Utility Page 35
3.2 BIOS Menu Bar Page 36
3.3 BIOS Legend Bar Page 36
3.4 Getting Help Page 36
3.5 BIOS Main Menu Page 37
3.6 BIOS Advanced Menu Page 38
3.7 BIOS Memory Menu Page 52
3.8 BIOS Boot Menu Page 54
3.9 BIOS Exit Menu Page 56
Chapter 4: Diagnostics
4.1 Beep Codes Page 57
4.2 Flash Utility Page 57
4.3 BIOS Post Code Page 58
Glossary
Technical Support
Page 61
Page 67
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3
Chapter 1: Introduction
1.1 - Congratulations
You have purchased one of the most powerful workstation mainboard solutions.
The Thunder K8WE (S2895) is a high-end workstation mainboard, based on
Nvidia nForce Professional 2200 Media and Communications Processor (MCP),
Nvidia nForce Professional 2050, and AMD 8131 PCI-X HyperTransport™
Tunnel.
Designed to support up to two AMD Opteron™ (Opteron 2xx) processors and
16GB of DDR333 or DDR400 memory, the S2895 is ideal for CPU, memory,
and video intensive applications such as CAD, Graphics Design, High
Bandwidth Video Editing, etc.
Remember to visit TYAN’s Website at http://www.TYAN.com
find information on all of TYAN’s products with FAQs, online manuals and BIOS
upgrades.
1.2 - Hardware Specifications
Processor
•Supports one or two AMD
Opteron™ 2xx processors
•Two onboard 4-phase VRMS
•Three HyperTransportTM links per
CPU, support up to 6.4GB/s data
transfer rate each link
•144-bit DDR interface (128-bit
data + 16 bit ECC)
•Scalable 32bit and 64bit
computing
•Secure computing with Nx register
support
Chipset
•Nvidia nForce Professional 2200
(CK8-04)-connected to CPU1
•Nvidia nForce Professional 2050#
(I/O-4)-connected to CPU2
Microsoft Windows XP (32-bit/64-bit)
Microsoft Windows Server 2003 (32-bit/64-bit)
SUSE Professional 9.x and SLES 9 SP2
RHEL3 Update 4
RHEL4 Update 1
TYAN reserves the right to add support or discontinue support for any OS with
or without notice.
http://www.tyan.com
6
NOTES:
http://www.tyan.com
7
Chapter 2: Board Installation
You are now ready to install your motherboard. The mounting hole pattern of
the Thunder K8WE matches the SSI EEB 3.51 specification. Before continuing
with installation, confirm that your chassis supports an SSI EEB v3.51
motherboard.
How to install our products right… the first time
The first thing you should do is read this user’s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:
(1) Ground yourself properly before removing your motherboard from the
antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, TYAN recommends wearing a
static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the
board, or flex the board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors,
memory modules, and leads.
(4) Place the motherboard on a grounded antistatic surface or on the
antistatic bag that the board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.
NOTE
DO NOT APPLY POWER TO THE BOARD IF IT HAS BEEN
DAMAGED
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8
2.1- Board Image
This picture is representative of the latest board revision available at
the time of publishing. The board you receive may or may not look
exactly like the above picture.
The following page includes details on the vital components of this
motherboard.
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2.2 - Block Diagram
S2895 Thunder K8WE Block Diagram
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2.3 - Board Parts, Jumpers and Connectors
This diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram.
Devices) to operate at up to 100MHz
Closed- Force PCI Bridge B (Slots 4, 5 & Devices) to
operate at a maximum 66MHz
NOTE: This jumper affects integrated SCSI on the
same bus.
Signal Pin Pin Signal
NC1
TPA +
GND
TPB +
+12V
GND
NC2
1 2
3 4
5 6
7 8
9 10
11 12
13 14
Use these pin definitions to connect a port to
COM2*
Pin1 COM2 Receive
Pin2 COM2 Ground
Pin3 COM2 Transfer
*TYAN does NOT provide cable for this header. It is
designed for OEM use only.
http://www.tyan.com
VCC
Data Data +
GND
GND
Key
TPA -
GND
TPB -
+12V
GND
Key
14
P23 J69 J14 P29
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4
1
4
1
4
1
P23: Front Audio Header
Signal Pin Pin Signal
1 2
3 4
5 6
7 8
9 10
GND
VCCLINE_OUT_R
KEY
LINE_OUT_L
MIC_L
MIC_R
LINE_FPOUT_R
LINE_FPOUT_L
The front panel Audio comes preinstalled with jumpers on pins 5-6 and 9-10.
Remove these jumpers to place a front panel audio cable
WARNING:Do not place jumper covers on this header in any other
configuration. Doing so could result in damage to the motherboard
Close Pin-3 and 4 (Default)-Onboard buzzer enabled.
Open Pin-3 and 4-Disable onboard buzzer or connect
to chassis speaker
P29: External SCSI LED Header
Use to connect external SCSI LED
Pin 1: NC, Pin 2: LED, Pin 3: LED, Pin 4: NC
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FAN4
FAN3
FAN2
CPU1 Fan
CPU2 Fan
FAN1
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Fan Connectors
The S2895 uses the standard 4-wire cooling fan connector pin-out. The
connector is keyed to prevent damage to the mainboard and fan due to
misalignment during insertion. Fans are 12V nominally rated with fan speed
modulated by the control signal. The Sense signal is a fan tachometer output
signal with two pulses per revolution. The Control signal is a 25KHz Pulse Width
Modulated (PWM) signal from the baseboard control circuitry.
The 4-wire fan is forward and backward compatible to the 3-wire fan. This
means an older 3-wire fan will plug into a 4-wire fan header. However, there is
no speed control for a wire fan. It will always run at full RPM
Use these headers to connect the processor or
chassis cooling fan to your motherboard to keep the
system stable and reliable.
* For 3-pin fans connect to pin 1-3.
Your brand new Thunder K8WE supports the latest 64-bit processor technology
from AMD. Only AMD Opteron
supported with this motherboard.
Check our website for latest processor support. http://www.tyan.com
If using a single processor, it MUST be installed in socket
NOTE
TYAN is not liable for damage as a result of operating an unsupported
configuration.
CPU1. When using a single processor only CPU1 memory
banks are addressable.
™
processor 200 series are certified and
The diagram is provided as a visual guide to help you install socket processors
and may not be an exact representation of the processors you have.
Step 1: Lift the lever on the socket until it is approximately 90o or as far back as
possible to the socket.
Step 2: Align the processor with the socket. There are keyed pins underneath
the processor to ensure that the processor’s installed correctly.
Step 3: Seat the processor firmly into the socket by gently pressing down until
the processor sits flush with the socket.
Step 4: Place the socket lever back down until it locks into place. The
installation is finished.
Repeat these steps for the second processor if you are using two processors.
Take care when installing processors as they have very fragile connector pins
below the processor and can bend and break if inserted improperly.
In order to access PCI Express x16 slot 3 and second Nvidia
NOTE
MAC, TWO CPUs must be installed.
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2.5 - Heatsink Retention Frame Installation
After you are done installing the processor(s), you should proceed to installing
the retention frame and heatsink. The CPU heatsink will ensure that the
processors do not overheat and continue to operate at maximum performance
for as long as you own them. Overheated processors are also dangerous to the
motherboard.
The backplate assembly prevents excessive motherboard flexing in the area
near the processor and provides a base for the installation of the heatsink
retention bracket and heatsink.
Because there are many different types of heatsinks available from many
different manufacturers, a lot of them have their own method of installation. For
the safest method of installation and information on choosing the appropriate
heatsink, use heatsinks validated by AMD. Please refer to AMD’s website at
www.amd.com
The following diagram will illustrate how to install the most common CPU back
plates:
.
1. Mounting screws
2. Heatsink retention frame
3. CPU socket
4. Motherboard PCB
5. Adhesive insulator
material
6. Backplate assembly
NOTE: Please see next
section for specific
instructions on how to install
mounting bracket.
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2.6 - Thermal Interface Material
Always check with the manufacturer of the heatsink &
NOTE
processor to ensure the Thermal Interface material is
compatible with the processor & meets the manufacturer’s
warranty requirements
http://www.tyan.com
There are two types of
thermal interface materials
designed for use with the
AMD Opteron processor.
The most common material
comes as a small pad
attached to the heatsink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heatsink
on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
21
2.7 - Heatsink Installation Procedures
Type A: CAM LEVER (TYPE) INSTALLATION
1. After placing backplate and
interface material under motherboard
place heatsink retention frame on top
of motherboard. Align plastic retention
bracket screw holes with CPU backplate standoffs.
Tighten screws to secure plastic
retention bracket. Repeat for the other
side. DO NOT OVER TIGHTEN.
2. After tightening screws secure
metal clip to plastic retention bracket
center tab. Repeat for the other side
of heatsink.
3. After securing metal clip to plastic
retention bracket center tab, push
down on plastic clip to lock plastic clip
to side tab.
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2. Insert screw through metal clip.
other side.
Type B: SCREW RETENTION TYPE HEATSINK
1. After placing CPU back-plate and
adhesive interface material under
motherboard, place heatsink
retention frame on top of
motherboard. Align heatsink retention
frame screw hole with backplate
assembly standoffs. Place heatsink
inside plastic retention bracket. Place
metal clip over retention frame tab.
Repeat for other side.
BE SURE METAL CLIP IS LOCKED
ONTO RETENTION FRAME TAB.
3. Tighten screw through metal clip.
Repeat on the
DO NOT OVER TIGHTEN.
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2.8 - Finishing Installing the Heatsink
After you have finished installing the heatsink onto the processor and socket,
attach the end wire of the fan (which should already be attached to the
heatsink) to the motherboard. The following diagram illustrates how to
connect fans onto the motherboard.
Once you have finished installing all the fans you can connect your drives
(hard drives, CD-ROM drives, etc.) to your motherboard.
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2.9 - Tips on Installing Motherboard in Chassis
Before installing your motherboard, make sure your chassis has the
necessary motherboard support studs installed. These studs are usually
metal and are gold in color. Usually, the chassis manufacturer will pre-install
the support studs. If you are unsure of stud placement, simply lay the
motherboard inside the chassis and align the screw holes of the
motherboard to the studs inside the case. If there are any studs missing,
you will know right away since the motherboard will not be able to be
securely installed.
Pay attention when installing board in chassis. Some components are
near the mounting holes and can be damaged.
Some chassis’ include plastic studs instead of metal. Although the plastic
studs are usable, TYAN recommends using metal studs with screws that will
fasten the motherboard more securely in place.
Below is a chart detailing what the most common motherboard studs look
like and how they should be installed.
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2.10 - Installing the Memory
Before attempting to install any memory, make sure that the memory you
have is compatible with the motherboard as well as the processor.
The following diagram shows common types of DDR SDRAM modules:
Here are a few key points to note before installing memory into your
Thunder K8WE:
•Always install memory beginning with CPU1 DIMM-A1.
•In order to access memory on CPU2, both processors must be
installed.
•Single, pairs, or four modules are supported on each CPU.
•Configure memory symmetrically on each CPU for best performance.
•AMD OpteronTM processors support 64bit (non-interleaved) or 128bit
(interleaved) memory configurations
•At least ONE Registered DDR SDRAM module must be installed for
the system to turn on and POST (power on self test)
•128MB, 256MB, 512MB, 1GB, and 2GB* Registered
PC3200/PC2700/PC2100 DDR SDRAM memory modules are supported
•All installed memory will be automatically detected
•The Thunder K8WE supports up to 16GB* with two CPU’s installed.
* Not validated at the time of print; subject to change.
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Memory Installation Procedure
When you install the memory modules, make sure the module aligns
properly with the memory slot. The modules are keyed to ensure that it is
inserted only one way. The method of installing memory modules are
detailed by the following diagrams.
Once the memory modules are firmly seated in the slot, two latches on
either side will close and secure the module into the slot. Sometimes you
may need to close the latches yourself.
To remove the memory module, simply push the latches outwards until the
memory module pops up. Then remove the module.
YOU MUST ALWAYS unplug the power connector from the
NOTE
motherboard before performing system hardware changes.
Otherwise you may damage the board and/or expansion
device.
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2.11 - Attaching Drive Cables
Attaching IDE Drive Cable
Attaching the IDE drive cable is simple. The cable is “keyed” to only allow it
to be connected in the correct manner.
Attaching IDE cable to the IDE connector is illustrated below:
Simply plug in the BLUE END of the IDE cable into the motherboard IDE
connector, and the other end into the drive. Each standard IDE cable has
three connectors, two of which are closer together. The BLUE connector
that is furthest away from the other two is the end that connects to the
motherboard. The other two connectors are used to connect to drives.
Note: Always remember to properly set the drive jumpers. If only using one
device on a channel, it must be set as Master for the BIOS to detect it.
TIP: Pin 1 on the IDE cable (usually designated by a colored wire)
faces the drive’s power connector.
Attaching Serial ATA Cables
The Thunder K8WE is also equipped with 4 Serial ATA (SATA) channels.
Connections for these drives are also very simple.
There is no need to set Master/Slave jumpers on SATA drives.
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29
The following pictures illustrate how to connect an SATA drive
1.SATA drive cable
connection
2. SATA drive power
connection
3. SATA cable motherboard
connector
4. SATA drive power adapter
Attaching Floppy Drive Cables
Attaching floppy diskette drives are done in a similar manner to hard drives.
See the picture below for an example of a floppy cable. Most of the current
floppy drives on the market require that the cable be installed with the
colored stripe positioned next to the power connector. In most cases, there
will be a key pin on the cable which will force a proper connection of the
cable.
Attach first floppy drive
(drive A:) to the end of
the cable with the twist
in it. Drive B: is usually
connected to the next
possible connector on
the cable (the second or
third connector after you
install Drive A:).
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2.12 - Installing Add-In Cards
Before installing add-in cards, it’s helpful to know if they are fully compatible
with your motherboard. For this reason, we’ve provided the diagrams below,
showing the most common slots that may appear on your motherboard. Not
all of the slots shown will necessarily appear on your motherboard.
PCI-Express x16 Slot
Simply find the appropriate slot for your add-in card and insert the card
firmly. Do not force any add-in cards into any slots if they do not seat in
place. It is better to try another slot or return the faulty card rather than
damaging both the motherboard and the add-in card.
If the board has a single CPU installed, you can only use PCI
NOTE
Express Slot 1 and one Nvidia MAC Ethernet is enabled. If
both CPUs are installed, you can use both PCI Express slots
and both MAC Ethernets are enabled.
YOU MUST ALWAYS unplug the power connector from the
NOTE
motherboard before performing system hardware changes.
Otherwise you may damage the board and/or expansion
device.
2.13 - Connecting External Devices
The following diagrams will detail the rear port stack for this S2895 motherboard:
PS/2
Mouse/Keyboard
USBx2 +
LAN Stacked
USBx2 +
Firewire
LAN Stacked
Serial Port
Left Side
Right Side
LAN Link/Activity LED Scheme
Speed Link LED (left side)
10Mbps
100Mbps
1000Mbps
Off Blink
Green Blink
Orange Blink
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Audio (Line in,
MIC, Line out)
Activity LED (right
side)
32
13
1
2.14 - Installing the Power Supply
There are three power connectors on your Thunder K8WE.
The Thunder K8WE requires an EPS12V/SSI EEB 3.51 (24 pin + 8 pin) power
supply to boot. TYAN recommends using a split plane power supply because of
the amount of power the S2895 requires.
You also have an option of using an SSI v3.51 workstation power supply. This
is recommended when running both PCI Express slots.
NEVER plug the 8-pin power connector into the 6-pin
WARNING
Please be aware that ATX 2.x and ATXGES power supplies are not compatible
with the board and can damage the motherboard and/or CPU(s).
This chart represents SSI EEB 3.51 split plane power supply.
EPS12V Main Power 24-Pin
(Chipsets & Components)
connector. Doing so will damage the motherboard and/or
1. Connect the SSI Workstation 6-pin power connector (if needed).
2. Connect the 8-pin CPU Power connector.
3. Connect the 24-pin Main Power connector.
4. Connect power cable to power supply and power outlet
NOTE
YOU MUST unplug the power supply before plugging the
power cables to motherboard connectors.
2.15 – Finishing Up
Congratulations on making it this far! You’re finished setting up the
hardware aspect of your computer. Before closing up your chassis, make
sure that all cables and wires are connected properly, especially IDE cables
and most importantly, jumpers. You may have difficulty powering on your
system if the motherboard jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, you can find
help by asking your vendor for assistance. If they are not available for
assistance, please find setup information and documentation online at our
website or by calling your vendor’s support line.
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NOTES:
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35
Chapter 3: BIOS Setup
3.1 - BIOS Setup Utility
With the BIOS setup utility, you can modify BIOS settings and control the
special features of your computer. The setup utility uses a number of
menus for making changes and turning the special features on or off.
All menus are based on a typical system. The actual menus
NOTE
To start the BIOS setup utility:
To select an item
Use the left/right (ßà) arrow keys to make a selection
To display a sub-menu (A pointer “4” marks all sub menus)
Use the arrow keys to move the cursor to the sub menu you want. Then press
<Enter>.
displayed on your screen may be different and depend on the
hardware and features installed in your computer.
a. Turn on or reboot your system
b. Press <F2> during POST (F4 on remote console) to start BIOS
setup utility
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3.2 - BIOS Menu Bar
The menu bar at the top of the windows lists these selections:
Main To configure basic system setups
Advanced To configure the advanced chipset features
Memory To configure system memory features
Boot To configure system boot order
Exit To exit setup utility
NOTE Options written in bold type represent the BIOS setup default
3.3 - BIOS Legend Bar
The chart describes the legend keys and their alternates:
Key Function
<F1> or <Alt-H> General help window
<ESC> Exit current menu
ßà arrow keys Select a different menu
↑ or ↓ arrow keys
<+> or <-> Change values
<F9> Load the Optimal default configuration values of
<F10> Select the previous value/setting of the field
<Enter> Execute command or select submenu
Select different item
the menu
3.4 - Getting Help
Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
window, press [ESC] or [F1] key again.
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System Memory
3.5 - BIOS Main Menu
The Main BIOS Menu is the first screen that you can navigate. The Main
BIOS setup menu screen has two main frames. The left frame displays all the
options that can be configured. "Grayed-out" options cannot be configured,
options in blue can be changed.
The right frame displays the key legend. Above the key legend is an area
reserved for a text message. When an option is selected in the left frame, it is
highlighted in white. Often, a text message will accompany it.
You can select any of the items in the left frame of the screen, such as
Hammer Configuration, to go to the sub menu for that item. You can display an
Advanced BIOS Setup option by highlighting it using the <Arrow> keys. All
Advanced BIOS Setup options are described in this section. The Advanced
BIOS Setup screen is shown below. The sub menus are described on the
following pages.
Configure PCI devices.
IDE Configuration
Floppy Configuration
I/O Device Configuration
Menu Item
Menu Item
Menu Item
Configure IDE interface.
Configure floppy interface.
Peripheral configuration
3.6.1 - Integrated Devices Sub-Menu
You can use this screen to select options for the Integrated Devices settings.
Use the up and down <Arrow> keys to select an item. Use the <Plus> and
<Minus> keys to change the value of the selected option.
You can use this screen to select options for the Slave Devices
Configuration settings. Use the up and down <Arrow> keys to select an item.
Use the <Plus> and <Minus> keys to change the value of the selected option.
You can use this screen to select options for the NV Configuration settings.
Use the up and down <Arrow> keys to select an item. Use the <Plus> and
<Minus> keys to change the value of the selected option.
Set Nvidia RAID control.
Enable the drive as RAID.
Enable the drive as RAID.
Enable the drive as RAID.
42
FirstWare Language:
3.6.2 - FirstWare Configuration Sub-Menu
You can use this screen to select options for the FirstWare Configuration
settings. Use the up and down <Arrow> keys to select an item. Use the <Plus>
and <Minus> keys to change the value of the selected option.
Set the current FirstWare
language to the selected
language.
German
Italian
FirstWare Authentication
Level
High
Medium
Low
Select the FirstWare
Authentication level.
800x600
FirstWare Video Mode
640x480
1024x768
Select the FirstWare Video
Mode.
1280x1024
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3.6.3 - PCI Configuration Sub-Menu
You can use this screen to select options for the PCI Configuration settings.
Use the up and down <Arrow> keys to select an item. Use the <Plus> and
<Minus> keys to change the value of the selected option.
Select PCI slot
configuration.
Reserve specific upper
memory blocks for use by
legacy ISA devices.
Reserve the specific IRQs
for use by legacy ISA
devices.
Item Specific Help
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44
able Master:
PCI Device, Slot #1~6
You can use this screen to select options for the PCI Device, Slot #1~6
settings. Use the up and down <Arrow> keys to select an item. Use the <Plus>
and <Minus> keys to change the value of the selected option.
Minimum guaranteed time
slice allotted for bus master
in units of PCI bus clocks.
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PCI/PNP ISA UHB Region Exclusion
You can use this screen to select options for the PCI/PNP ISA UHB Region
Exclusion settings. Use the up and down <Arrow> keys to select an item. Use
the <Plus> and <Minus> keys to change the value of the selected option.
Reserves the specified
block of upper memory for
use by legacy ISA devices.
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PCI/PNP ISA IRQ Resource Exclusion
You can use this screen to select options for the PCI/PNP IRQ Resource
Exclusion settings. Use the up and down <Arrow> keys to select an item. Use
the <Plus> and <Minus> keys to change the value of the selected option.
Reserves the specified IRQ
for use by legacy ISA
devices.
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3.6.4 - IDE Configuration Sub-Menu
You can use this screen to select options for the IDE Configuration settings.
Use the up and down <Arrow> keys to select an item. Use the <Plus> and
<Minus> keys to change the value of the selected option.
Configure the IDE channel.
Configure the IDE channel.
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IDE Channel 1/0 Master/Slave
The following screen shows the information of IDE channel 1/0 Master/Slave.
PhoenixBIOS Setup Utility
Advanced
Type:
CHS Format
Cylinders:
Cylinders:
Heads:
Heads:
Sectors:
Sectors:
Maximum Capacity:
Maximum Capacity:
LBA Format’
Total Sectors:
Maximum Capacity:
Multi-Sector Transfers:
LBA Mode Control:
32 Bit I/O:
Transfer Mode:
Ultra DMA Mode:
Specify the number of
sectors per block for
multiple sector transfer.
Enabling LBA causes
Logical Block Addressing
to be used in place of
Cylinders, Heads_Sectors.
This setting enables or
disables 32 bit IDE data
transfers.
Select the method for
moving data to/from the
drive.
Multi-Sector Transfers
LBA Mode Control
32 Bit I/O
Transfer Mode
Disabled
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
Enabled
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Ultra DMA Mode
Disabled
Enabled
Select the Ultra DMA mode
used for moving data
to/from the drive.
IDE Channel 2/3 Master
The following screen shows the information of IDE Channel 2/3 Master.
PhoenixBIOS Setup Utility
Advanced
Type:
LBA Format’
Total Sectors:
Maximum Capacity:
Multi-Sector Transfers:
LBA Mode Control:
32 Bit I/O:
Transfer Mode:
Ultra DMA Mode:
You can use this screen to select options for the Floppy Configuration
settings. Use the up and down <Arrow> keys to select an item. Use the <Plus>
and <Minus> keys to change the value of the selected option.
Set the base I/O address
for the floppy disk
controller.
Base I/O address
Primary
NULL
Auto
Legacy Diskette A
Disabled
Enabled
Select floppy type
Enabled
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3.6.6 - I/O Device Configuration Sub-Menu
You can use this screen to select options for the I/O Device Configuration
settings. Use the up and down <Arrow> keys to select an item. Use the <Plus>
and <Minus> keys to change the value of the selected option.
This menu has options for memory speed & latency. Use the up and down
<Arrow> keys to select an item. Use the <Plus> and <Minus> keys to change
the value of the selected option.
Control caching of system
memory above one
megabyte.
Control caching of the
memory blocks.
Control caching of the
memory blocks.
Control caching of the
memory blocks.
Control caching of the
memory blocks.
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3.8 - BIOS Boot Menu
This menu has options for the Boot Device Priority. Use the up and down
<Arrow> keys to select an item. Use the <Plus> and <Minus> keys to change
the value of the selected option.
Allow the system to skip
certain tests while booting.
Display the diagnostic
screen during boot.
Display system
configuration on boot.
Select the search order for
the types of boot devices.
Item Specific Help
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3.8.1 - Boot Device Priority
You can use this screen to select options for the Boot Device Priority
settings. Use the up and down <Arrow> keys to select an item. Use the <Plus>
and <Minus> keys to change the value of the selected option.
<Enter> expands or
collapse devices with a
‘+’ or ‘-‘
<Ctrl+Enter> expands all
modes.
<+> and <-> moves the
device up and down.
The boot menu will list all bootable devices. Use <Enter> to expand or collapses
devices with a ‘+’ or ‘-‘. Use <+> or <-> to arrange the priorities of all bootable
devices.
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3.9 - BIOS Exit Menu
This menu has options for the Exit Priority. Use the up and down <Arrow>
keys to select an item. Use the <Plus> and <Minus> keys to change the value
of the selected option.
Use this option to exit setup utility and re-boot. All new selections you have
made are stored into CMOS. System will use the new settings to boot up.
Exit Discarding Changes
Use this option to exit setup utility and re-boot. All new selections you have
made are not stored into CMOS. System will use the old settings to boot up.
Load Setup Defaults
Use this option to load default setup values.
Discard Changes
Use this option to restore all new setup values that you have made but not
saved in CMOS.
Save Changes
Use this option to restore all new setup values that you have made and saved in
CMOS.
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Chapter 4: Diagnostics
Note: if you experience problems with setting up your system, always check the
following things in the following order:
Memory, Video, CPU
By checking these items, you will most likely find out what the problem might
have been when setting up your system. For more information on
troubleshooting, check the TYAN website at: http://www.tyan.com
4.1 Beep Codes
Fatal errors, which halt the boot process, are communicated through a series of
audible beeps. For example, if the BIOS POST can initialize the video but an
error occurs, an error message will be displayed. If it cannot display the
message, it will report the error as a series of beeps.
The most common type of error is a memory error.
Before contacting your vendor or TYAN Technical Support, be sure that you
note as much as you can about the beep code length and order that you
experience. Also, be ready with information regarding add-in cards, drives and
O/S to speed the support process and come to a quicker solution.
4.2 Flash Utility
Every BIOS file is unique for the motherboard it was designed for. For Flash
Utilities, BIOS downloads, and information on how to properly use the Flash
Utility with your motherboard, please check the TYAN web site:
http://www.tyan.com/
Note: Please be aware that by flashing your BIOS, you agree that in the event
of a BIOS flash failure, you must contact your dealer for a replacement BIOS.
There are no exceptions. TYAN does not have a policy for replacing BIOS chips
directly with end users. In no event will TYAN be held responsible for damages
done by the end user.
.
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4.3 BIOS Post Code
Code
02h Verify Real Mode 32h Test CPU bus-clock
03h Disable Non-Maskable
04h Get CPU type 36h Warm start shut down
06h Initialize system hardware 38h Shadow system BIOS ROM
08h Initialize chipset with initial
09h Set IN POST flag 3Ch Advanced configuration of
0Ah Initialize CPU registers 3Dh Load alternate registers with
0Bh Enable CPU cache 42h Initialize interrupt vectors
0Ch Initialize caches to initial
0Eh Initialize I/O component 46h 2-1-2-3. Check ROM
0Fh Initialize the local bus IDE 48h Check video configuration
10h Initialize Power
11h Load alternate registers with
12h Restore CPU control word
13h Initialize PCI Bus Mastering
14h Initialize keyboard controller 4Eh Display BIOS copyright
16h 1-2-2-3. BIOS ROM
17h Initialize cache before
18h 8254 timer initialization 52h Test keyboard
1Ah 8237 DMA controller
1Ch Reset Programmable
20h 1-3-1-1. Test DRAM refresh 59h Initialize POST display
22h 1-3-1-3. Test 8742 KBD
24h Set ES segment register to
26h Enable A20 line 5Ch Test RAM between 512 and
28h Autosize DRAM 60h Test extended memory
29h Initialize POST Memory
2Ah Clear 512 KB base RAM 64h Jump to UserPatch1
2Ch 1-3-4-1. RAM failure on
Beeps / Description Code
Interrupt (NMI)
POST values
POST values
Management
initial POST values
during warm boot
devices
checksum
memory autosize
initialization
Interrupt Controller
Controller
4 GB
Manager
address
http://www.tyan.com
Beeps / Description
33h Initialize Phoenix Dispatch
3Ah Autosize cache
45h POST device initialization
49h Initialize PCI bus and
4Ah Initialize all video adapters
4Bh QuietBoot start (optional)
4Ch Shadow video BIOS ROM
50h Display CPU type and
51h Initialize EISA board
54h Set key click if enabled
58h 2-2-3-1. Test for
5Ah Display prompt "Press F2 to
5Bh Disable CPU cache
62h Test extended memory
66h Configure advanced cache
frequency
Manager
chipset registers
CMOS values
copyright notice
against CMOS
devices
in system
notice
speed
unexpected interrupts
service
enter SETUP"
640 KB
address lines
registers
59
2Eh 1-3-4-3. RAM failure on
2Fh Enable cache before
30h 1-4-1-1. RAM failure on
Code
6Ah Display external L2 cache
6Bh Load custom defaults
6Ch Display shadow-area
6Eh Display possible high
70h Display error messages ACh Enter SETUP
72h Check for configuration
76h Check for keyboard errors B0h Check for errors
7Ch Set up hardware interrupt
7Eh Initialize coprocessor if
80h Disable onboard Super I/O
81h Late POST device
82h Detect and install external
83h Configure non-MCD IDE
84h Detect and install external
85h Initialize PC-compatible
86h. Re-initialize onboard I/O
87h Configure Motherboard
88h Initialize BIOS Data Area BFh Check virus and backup
89h Enable Non-Maskable
8Ah Initialize Extended BIOS
8Bh Test and initialize PS/2
8Ch Initialize floppy controller C3h Initialize error display
8Fh Determine number of ATA
90h Initialize hard-disk
91h Initialize local-bus hard-disk
data bits of low byte of
memory bus
system BIOS shadow
data bits of high byte of
memory bus
Beeps / Description Code
size
(optional)
message
address for UMB recovery
errors
vectors
present
ports and IRQs
initialization
RS232 ports
controllers
parallel ports
PnP ISA devices
ports.
Devices
Interrupts (NMIs)
Data Area
mouse
drives (optional)
controllers
controllers
67h Initialize Multi Processor
68h Enable external and CPU
69h Setup System Management
92h Jump to UserPatch2 C7h Initialize notebook docking
93h Build MPTABLE for multi95h Install CD ROM for boot C9h Extended checksum
96h Clear huge ES segment
97h Fixup Multi Processor table E0h BIOS Boot Block
98h 1-2. Search for option
99h Check for SMART Drive
9Ah Shadow option ROMs E3h Initialize system timer
9Ch Set up Power Management E4h Initialize system I/O
9Dh Initialize security engine
9Eh Enable hardware interrupts E6h Checksum BIOS ROM
9Fh Determine number of ATA
A0h Set time of day E8h Set Huge Segment
Code
E9h Initialize Multi Processor F1h Initialize Run Time Clock
EAh Initialize OEM special code F2h Initialize video
EBh Initialize PIC and DMA F3h Initialize System
ECh Initialize Memory type F4h Output one beep before
EDh Initialize Memory size F5h Boot to Mini DOS
EEh Shadow Boot Block F6h Clear Huge Segment
EFh System memory test F7h Boot to Full DOS
F0h Initialize interrupt vectors
processor boards
register
ROMs.
(optional)
(optional)
and SCSI drives
Beeps / Description Code
C8h Force check (optional)
D2h BIOS Boot Block
E1h BIOS Boot Block
E2h Initialize the CPU
E5h Check force recovery boot
E7h Go to BIOS
late
(optional)
Beeps / Description
Management Mode
boot
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Glossary
ACPI (Advanced Configuration and Power Interface): a power management
specification that allows the operating system to control the amount of power
distributed to the computer’s devices. Devices not in use can be turned off,
reducing unnecessary power expenditure.
AGP (Accelerated Graphics Port): a PCI-based interface which was designed
specifically for demands of 3D graphics applications. The 32-bit AGP channel
directly links the graphics controller to the main memory. While the channel runs
only at 66 MHz, it supports data transmission during both the rising and falling
ends of the clock cycle, yielding an effective speed of 133 MHz.
ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive
implementation that includes the disk controller on the device itself. It allows
CD-ROMs and tape drives to be configured as master or slave devices, just like
HDDs.
ATX: the form factor designed to replace the AT form factor. It improves on the
AT design by rotating the board 90 degrees, so that the IDE connectors are
closer to the drive bays, and the CPU is closer to the power supply and cooling
fan. The keyboard, mouse, USB, serial, and parallel ports are built-in.
Bandwidth: refers to carrying capacity. The greater the bandwidth, the more
data the bus, phone line, or other electrical path can carry. Greater bandwidth
results in greater speed.
BBS (BIOS Boot Specification): a feature within the BIOS that creates,
prioritizes, and maintains a list of all Initial Program Load (IPL) devices, and
then stores that list in NVRAM. IPL devices have the ability to load and execute
an OS, as well as provide the ability to return to the BIOS if the OS load process
fails. At that point, the next IPL device is called upon to attempt loading of the
OS.
BIOS (Basic Input/Output System): the program that resides in the ROM chip,
which provides the basic instructions for controlling your computer’s hardware.
Both the operating system and application software use BIOS routines to
ensure compatibility.
Buffer: a portion of RAM which is used to temporarily store data; usually from
an application though it is also used when printing and in most keyboard drivers.
The CPU can manipulate data in a buffer before copying it to a disk drive. While
this improves system performance (reading to or writing from a disk drive a
single time is much faster than doing so repeatedly) there is the possibility of
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losing your data should the system crash. Information in a buffer is temporarily
stored, not permanently saved.
Bus: a data pathway. The term is used especially to refer to the connection
between the processor and system memory, and between the processor and
PCI or ISA local buses.
Bus mastering: allows peripheral devices and IDEs to access the system
memory without going through the CPU (similar to DMA channels).
Cache: a temporary storage area for data that will be needed often by an
application. Using a cache lowers data access times since the information is
stored in SRAM instead of slower DRAM. Note that the cache is also much
smaller than your regular memory: a typical cache size is 512KB, while you may
have as much as 4GB of regular memory.
Closed and open jumpers: jumpers and jumper pins are active when they are
“on” or “closed”, and inactive when they are “off” or “open”.
CMOS (Complementary Metal-Oxide Semiconductors): chips that hold the
basic startup information for the BIOS.
COM port: another name for the serial port, which is called as such because it
transmits the eight bits of a byte of data along one wire, and receives data on
another single wire (that is, the data is transmitted in serial form, one bit after
another). Parallel ports transmit the bits of a byte on eight different wires at the
same time (that is, in parallel form, eight bits at the same time).
DDR (Double Data Rate): a technology designed to double the clock speed of
the memory. It activates output on both the rising and falling edge of the system
clock rather than on just the rising edge, potentially doubling output.
DIMM (Dual In-line Memory Module): faster and more capacious form of RAM
than SIMMs, and do not need to be installed in pairs.
DIMM bank: sometimes called DIMM socket because the physical slot and the
logical unit are the same. That is, one DIMM module fits into one DIMM socket,
which is capable of acting as a memory bank.
DMA (Direct Memory Access): channels that are similar to IRQs. DMA
channels allow hardware devices (like soundcards or keyboards) to access the
main memory without involving the CPU. This frees up CPU resources for other
tasks. As with IRQs, it is vital that you do not double up devices on a single line.
Plug-n-Play devices will take care of this for you.
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DRAM (Dynamic RAM): widely available, very affordable form of RAM which
looses data if it is not recharged regularly (every few milliseconds). This refresh
requirement makes DRAM three to ten times slower than non-recharged RAM
such as SRAM.
ECC (Error Correction Code or Error Checking and Correcting): allows data
to be checked for errors during run-time. Errors can subsequently be corrected
at the same time that they’re found.
EEPROM (Electrically Erasable Programmable ROM): also called Flash
BIOS, it is a ROM chip which can, unlike normal ROM, be updated. This allows
you to keep up with changes in the BIOS programs without having to buy a new
chip. TYAN’s BIOS updates can be found at http://www.tyan.com
ESCD (Extended System Configuration Data): a format for storing
information about Plug-n-Play devices in the system BIOS. This information
helps properly configure the system each time it boots.
Firmware: low-level software that controls the system hardware.
Form factor: an industry term for the size, shape, power supply type, and
external connector type of the Personal Computer Board (PCB) or motherboard.
The standard form factors are the AT and ATX.
Global timer: onboard hardware timer, such as the Real-Time Clock (RTC).
HDD: stands for Hard Disk Drive, a type of fixed drive.
H-SYNC: controls the horizontal synchronization/properties of the monitor.
HyperTransportTM: a high speed, low latency, scalable point-to-point link for
interconnecting ICs on boards. It can be significantly faster than a PCI bus for
an equivalent number of pins. It provides the bandwidth and flexibility critical for
today's networking and computing platforms while retaining the fundamental
programming model of PCI.
IC (Integrated Circuit): the formal name for the computer chip.
IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD
interface. It can handle drives up to 8.4 GB in size. Almost all IDEs sold now are
in fact Enhanced IDEs (EIDEs), with maximum capacity determined by the
hardware controller.
IDE INT (IDE Interrupt): a hardware interrupt signal that goes to the IDE.
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I/O (Input/Output): the connection between your computer and another piece
of hardware (mouse, keyboard, etc.)
IRQ (Interrupt Request): an electronic request that runs from a hardware
device to the CPU. The interrupt controller assigns priorities to incoming
requests and delivers them to the CPU. It is important that there is only one
device hooked up to each IRQ line; doubling up devices on IRQ lines can lock
up your system. Plug-n-Play operating systems can take care of these details
for you.
Latency: the amount of time that one part of a system spends waiting for
another part to catch up. This occurs most commonly when the system sends
data out to a peripheral device and has to wait for the peripheral to spread
(peripherals tend to be slower than onboard system components).
NVRAM: ROM and EEPROM are both examples of Non-Volatile RAM, memory
that holds its data without power. DRAM, in contrast, is volatile.
Parallel port: transmits the bits of a byte on eight different wires at the same
time.
PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data
pathway) which is faster than the ISA bus. Local buses are those which operate
within a single system (as opposed to a network bus, which connects multiple
systems).
PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes
used by IDE drives. These modes use the CPU for data transfer (in contrast,
DMA channels do not). PCI refers to the type of bus used by these modes to
communicate with the CPU.
PCI-to-PCI bridge: allows you to connect multiple PCI devices onto one PCI
slot.
Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache
because SRAM is slower than SDRAM, but usually larger. Data is cached first
to the faster primary cache, and then, when the primary cache is full, to the
slower secondary cache.
PnP (Plug-n-Play): a design standard that has become ascendant in the
industry. Plug-n-Play devices require little set-up to use. Devices and operating
systems that are not Plug-n-Play require you to reconfigure your system each
time you add or change any part of your hardware.
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PXE (Preboot Execution Environment): one of four components that together
make up the Wired for Management 2.0 baseline specification. PXE was
designed to define a standard set of preboot protocol services within a client
with the goal of allowing networked-based booting to boot using industry
standard protocols.
RAID (Redundant Array of Independent Disks): a way for the same data to
be stored in different places on many hard drives. By using this method, the
data is stored redundantly and multiple hard drives will appear as a single drive
to the operating system. RAID level 0 is known as striping, where data is striped
(or overlapped) across multiple hard drives, but offers no fault-tolerance. RAID
level 1 is known as mirroring, which stores the data within at least two hard
drives, but does not stripe. RAID level 1 also allows for faster access time and
fault-tolerance, since either hard drive can be read at the same time. RAID level
0+1 is both striping and mirroring, providing fault-tolerance, striping, and faster
access all at the same time.
RAIDIOS: RAID I/O Steering (Intel)
RAM (Random Access Memory): technically refers to a type of memory where
any byte can be accessed without touching the adjacent data and is often
referred to the system’s main memory. This memory is available to any program
running on the computer.
ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic
instructions required to boot the computer and start up the operating system.
SDRAM (Synchronous Dynamic RAM): called as such because it can keep
two sets of memory addresses open simultaneously. By transferring data
alternately from one set of addresses and then the other, SDRAM cuts down on
the delays associated with non-synchronous RAM, which must close one
address bank before opening the next.
Serial port: called as such because it transmits the eight bits of a byte of data
along one wire, and receives data on another single wire (that is, the data is
transmitted in serial form, one bit after another).
SCSI Interrupt Steering Logic (SISL): Architecture that allows a RAID
controller, such as AcceleRAID 150, 200 or 250, to implement RAID on a
system board-embedded SCSI bus or a set of SCSI busses. SISL: SCSI
Interrupt Steering Logic ( LSI ) (only on LSI SCSI boards)
Sleep/Suspend mode: in this mode, all devices except the CPU shut down.
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SDRAM (Static RAM): unlike DRAM, this type of RAM does not need to be
refreshed in order to prevent data loss. Thus, it is faster and more expensive.
Standby mode: in this mode, the video and hard drives shut down; all other
devices continue to operate normally.
UltraDMA-33/66/100: a fast version of the old DMA channel. UltraDMA is also
called UltraATA. Without a proper UltraDMA controller, your system cannot take
advantage of higher data transfer rates of the new UltraDMA/UltraATA hard
drives.
USB (Universal Serial Bus): a versatile port. This one port type can function
as a serial, parallel, mouse, keyboard or joystick port. It is fast enough to
support video transfer, and is capable of supporting up to 127 daisy-chained
peripheral devices.
VGA (Video Graphics Array): the PC video display standard
V-SYNC: controls the vertical scanning properties of the monitor.
ZCR (Zero Channel RAID): PCI card that allows a RAID card to use the
onboard SCSI chip, thus lowering cost of RAID solution
ZIF Socket (Zero Insertion Force socket): these sockets make it possible to
insert CPUs without damaging the sensitive CPU pins. The CPU is lightly
placed in an open ZIF socket, and a lever is pulled down. This shifts the
processor over and down, guiding it into the board and locking it into place.
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Technical Support
If a problem arises with your system, you should turn to your dealer for help first.
Your system has most likely been configured by them, and they should have the
best idea of what hardware and software your system contains. Furthermore, if
you purchased your system from a dealer near you, you can bring your system
to them to have it serviced instead of attempting to do so yourself (which can
have expensive consequences).
Help Resources:
1. See the beep codes section of this manual.
2. See the TYAN website for FAQ’s, bulletins, driver updates,
and other information: http://www.tyan.com
3. Contact your dealer for help BEFORE calling TYAN.
4. Check the TYAN user group:
alt.comp.periphs.mainboard.TYAN
Returning Merchandise for Service
During the warranty period, contact your distributor or system vendor FIRST for
any product problems. This warranty only covers normal customer use and
does not cover damages incurred during shipping or failure due to the alteration,
misuse, abuse, or improper maintenance of products.
NOTE: A receipt or copy of your invoice marked with the date of purchase
is required before any warranty service can be rendered. You may obtain
service by calling the manufacturer for a Return Merchandise
Authorization (RMA) number. The RMA number should be prominently
displayed on the outside of the shipping carton and the package should
be mailed prepaid. TYAN will pay to have the board shipped back to you.
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Notice for the USA
Compliance Information Statement (Declaration of
Conformity Procedure) DoC
FCC Part 15: This device complies with part 15 of the FCC
Rules
Operation is subject to the following conditions:
This device may not cause harmful interference, and
This device must accept any interference received including interference that
may cause undesired operation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try one or more of the
following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Plug the equipment into an outlet on a circuit different from that of the receiver.
Consult the dealer on an experienced radio/television technician for help.
Notice for Canada
This apparatus complies with the Class B limits for radio interference as
specified in the Canadian Department of Communications Radio Interference
Regulations. (Cet appareil est conforme aux norms de Classe B d’interference
radio tel que specifie par le Ministere Canadien des Communications dans les
reglements d’ineteference radio.)
Notice for Europe (CE Mark)
This product is in conformity with the Council Directive
CAUTION: Lithium battery included with this board. Do not puncture, mutilate,
or dispose of battery in fire. Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in
accordance with your local regulations.
89/336/EEC, 92/31/EEC (EMC).
Document #: D1629-100
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