Transcend TS2GLH64V2B2 User Manual

Embedded Solutions

DRAM Modules

DDR4

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Transcend's DDR4 DRAM modules operate at a nominal voltage of just 1.2V, oering higher energy eciency and

exceptional clock speeds to cater to the demands of the embedded industry. The modules are available in multiple

form factors and technologies, such as ECC and wide-temperature support. All components are of the highest

quality, having been sourced directly from the world's rst-tier supplier of DRAM chips and stringently tested for

unparalleled compatibility, reliability, and performance.

Features

JEDEC standard 1.2V ± 0.06V power supply

•

High energy eciency

•

8 bit pre-fetch

•

Burst Length: 4, 8

•

16 Banks (4 Bank Groups)

•

Support DBI mode

•

Advanced Technologies

SO

2

Anti-Sulfur

Technology

Corner Bond &

Underll

30μ”

Conformal

Coating

Support Command/Address parity detection

•

Support Data Cyclic Redundancy Check (CRC) for improved data

•

reliability

On-die termination with ODT pin

•

Serial presence detect with EEPROM

•

100% tested for stability, compatibility and performance

•

Wide

Temperature

30 µ”

Gold Finger

DDR4 Unbuered DIMMs

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Module Type

Product Image

Standard JEDEC

Speed 3200/2666/2400/2133 Mbps

Capacity 2GB~32GB

Voltage 1.2V

Pin Count Long-DIMM: 288 pin SO-DIMM: 260 pin

PCB Height

Operating Temperature

Very Low Proﬁ le: 0.74 inches

Long-DIMM SO-DIMM

Standard: 1.23 inches

Standard Temperature: 0°C~ 85°C

Wide Temperature: -40°C~ 85°C

DDR4

1.18 inches

Ordering Information

DDR4-3200 Long-DIMM

Capacity

8GB

16GB

32GB

Component

Composition

(1Gx8)x8

(1Gx8)x16

(2Gx8)x8

(2Gx8)x16

Rank x Org.

1Rx8

2Rx8

1Rx8

2Rx8

Standard

(1.2V)

TS1GLH64V2B

TS1GLH64V2B2

TS1GLH64V2B-G

TS1GLH64V2B3

TS2GLH64V2B

TS2GLH64V2B2

TS2GLH64V2B-G

TS2GLH64V2B3

TS2GLH64V2E

TS4GLH64V2E

TS4GLH64V2E-G

TS4GLH64V2E3

Wide Temp.

(-40°C~ 85°C)

TS1GLH64V2B-I

-

TS2GLH64V2B-I

-

TS4GLH64V2E-I

-

Very Low Pro le

(VLP)

-

DDR4-3200 SO-DIMM

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Capacity

8GB

16GB

32GB

Component

Composition

(1Gx8)x8

(1Gx8)x16

(2Gx8)x8

(1Gx8)x16

(2Gx8)x16

Rank x Org.

1Rx8

2Rx8

1Rx8

2Rx8

Standard

(1.2V)

-

TS1GSH64V2B2

TS1GSH64V2B-G

TS1GSH64V2B3

TS2GGSH64V2B

TS2GSH64V2B2

TS2GSH64V2B-G

TS2GSH64V2B3

TS2GSH64V2E

TS4GSH64V2E

TS4GSH64V2E-G

TS4GSH64V2E3

Wide Temp.

(-40°C~ 85°C)

TS1GSH64V2B2-I

-

TS2GGSH64V2B-I

-

TS4GSH64V2E-I

-

Very Low Pro le

(VLP)

DDR4-2666 Long-DIMM

Capacity

2GB (256Mx16)x4 1Rx16 TS256MLH64V6X 4GB (512Mx16)x4 1Rx16 TS512MLH64V6D 4GB (512Mx8)x8 1Rx8TS512MLH64V6H - TS512MLH64V6HL

8GB (1Gx8)x8 1Rx8TS1GLH64V6B TS1GLH64V6B-I TS1GLH64V6BL

8GB (1Gx8)x8 1Rx8TS1GLH64V6B2 - 16GB (1Gx8)x16 2Rx S2GLH64V6B TS2GLH64V6B-I TS2GLH64V6BL 16GB (1Gx8)x16 2Rx8 TS2GLH64V6B2

32GB 32GB

Component

Composition

(2Gx8)x16 (2Gx8)x16

Rank x Org.

8T

2Rx8 2Rx8

Standard

(1.2V)

TS4GLH64V6E TS4GLH64V6E2

Wide Temp.

(-40°C~ 85°C)

-

TS4GLH64V6E-I

-

Very Low Pro le

(VLP)

TS256MLH64V6XL

- TS4GLH64V6EL

-

DDR4-2666 SO-DIMM

Capacity

2GB (256Mx16)x4 1Rx16 TS256MSH64V6X 4GB (512Mx16)x4 1Rx16 TS512MSH64V6D 4GB (512Mx8)x8 1Rx8TS512MSH64V6H TS512MSH64V6H-I 8GB (512Mx8)x16 2Rx8TS1GSH64V6H 8GB (1Gx8)x8 1Rx8TS1GSH64V6B TS1GSH64V6B-I

8GB (1Gx8)x8 1Rx8TS1GSH64V6B2 16GB (1Gx8)x16 2Rx8TS2GSH64V6B TS2GSH64V6B-I 16GB (1Gx8)x16 2Rx8TS2GSH64V6B2

32GB (2Gx8)x16 2Rx8TS4GSH64V6E TS4GSH64V6E-I

32GB (2Gx8)x16 2Rx8

Component

Composition

Rank x Org.

Standard

(1.2V)

TS4GSH64V6E2

Wide Temp.

(-40°C~ 85°C)

-

DDR4-2400 Long-DIMM

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Capacity

4GB (512Mx8)x8 1Rx8 TS512MLH64V4H - TS512MLH64V4HL 8GB (512Mx8)x16 2Rx8 TS1GLH64V4H - 8GB (1Gx8)x8 1Rx8 TS1GLH64V4B TS1GLH64V4B-I -

16GB (1Gx8)x16 2Rx8 TS2GLH64V4B - TS2GLH64V4BL

Component

Composition

Rank x Org.

Standard

(1.2V)

Wide Temp.

(-40°C~ 85°C)

Very Low Pro le

(VLP)

DDR4-2400 SO-DIMM

Capacity

2GB (256Mx16)x4 1Rx16 TS256MSH64V4X 4GB (512Mx16)x4 1Rx16 TS512MSH64V4D 4GB (512Mx8)x8 1Rx8 TS512MSH64V4H TS512MSH64V4H-I 8GB (512Mx8)x16 2Rx8 TS1GSH64V4H 8GB (1Gx8)x8 1Rx8 TS1GSH64V4B TS1GSH64V4B-I

16GB (1Gx8)x16 2Rx8 TS2GSH64V4B TS2GSH64V4B-I

Component

Composition

Rank x Org.

Standard

(1.2V)

Wide Temp.

(-40°C~ 85°C)

DDR4-2133 Long-DIMM

Capacity

4GB (512Mx8)x8 1Rx8TS512MLH64V1H - 8GB (512Mx8)x16 2Rx8TS1GLH64V1H - TS1GLH64V1HL

16GB (1Gx8)x16 2Rx8TS2GLH64V1B - -

Component

Composition

Rank x Org.

Standard

(1.2V)

Wide Temp.

(-40°C~ 85°C)

Very Low Pro le

DDR4-2133 SO-DIMM

Capacity

4GB (512Mx8)x8 1Rx8TS512MSH64V1H TS512MSH64V1H-I 8GB (512Mx8)x16 2Rx8TS1GSH64V1H TS1GSH64V1H-I

16GB (1Gx8)x16 2Rx8TS2GSH64V1B TS2GSH64V1B-I

Component

Composition

Rank x Org.

Standard

(1.2V)

Wide Temp.

(-40°C~ 85°C)

(VLP)

DDR4 ECC DIMMs

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Module Type

Product Image

Standard JEDEC

Speed 3200/2666/2400/2133 Mbps

Capacity 4GB~32GB

Voltage 1.2V

Pin Count ECC Long-DIMM: 288 pin ECC SO-DIMM: 260 pin

PCB Height

PCB Gold Finger Thickness 30μ”

Anti-Sulfuration Default

Operating Temperature

ECC Long-DIMM ECC SO-DIMM

Standard: 1.23 inches

Very Low Proﬁ le: 0.74 inches

Standard Temperature: 0°C~ 85°C

Wide Temperature: -40°C~ 85°C

DDR4

1.18 inches

Ordering Information

DDR4-3200 ECC Long-DIMM

Capacity

8GB 16GB 32GB

DDR4-3200 ECC SO-DIMM

Capacity

8GB 16GB 32GB

Component

Composition

(1Gx8)x9 (1Gx8)x18 (2Gx8)x18

Component

Composition

(1Gx8)x9 (1Gx8)x18 (2Gx8)x18

Rank x Org.

1Rx8 2Rx8 2Rx8

Rank x Org.

1Rx8 2Rx8 2Rx8

Standard

(1.2V)

TS1GLH72V2B TS2GLH72V2B TS4GLH72V2E

Standard

(1.2V)

TS1GSH72V2B TS2GSH72V2B TS4GSH72V2E

Wide Temp.

(-40°C~ 85°C)

TS1GLH72V2B-I TS2GLH72V2B-I TS4GLH72V2E-I

Wide Temp.

(-40°C~ 85°C)

TS1GSH72V2B-I TS2GSH72V2B-I TS4GSH72V2E-I

Very Low Pro le

(VLP)

-

Very Low Pro le

(VLP)

-

DDR4-2666 ECC Long-DIMM

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Capacity

4GB (512Mx8)x9 1Rx8TS512MLH72V6H TS512MLH72V6H-I TS512MLH72V6HL

8GB (1Gx8)x9 1Rx8TS1GLH72V6B TS1GLH72V6B-I TS1GLH72V6BL 16GB (1Gx8)x18 2Rx8TS2GLH72V6B TS2GLH72V6B-I TS2GLH72V6BL 32GB

32GB

Component

Composition

(2Gx8)x18

Rank x Org.

2Rx8

Standard

(1.2V)

TS4GLH72V6E

TS4GLH72V6E2

Wide Temp.

(-40°C~ 85°C)

TS4GLH72V6E-I

-

Very Low Pro le

(VLP)

TS4GLH72V6EL

-

DDR4-2666 ECC SO-DIMM

Capacity

4GB 8GB

16GB

32GB

Component

Composition

(512Mx8)x9 1Rx8TS512MSH72V6H TS512MSH72V6H-I (1Gx8)x9 1Rx8TS1GSH72V6B TS1GSH72V6B-I (1Gx8)x18 2Rx8TS2GSH72V6B TS2GSH72V6B-I (2Gx8)x18 2Rx8TS4GSH72V6E TS4GSH72V6E-I

(2Gx8)x18

Rank x Org.

2Rx8

Standard

(1.2V)

TS4GSH72V6E2

Wide Temp.

(-40°C~ 85°C)

DDR4-2400 ECC Long-DIMM

Capacity

4GB

8GB

16GB (1Gx8)x18 2Rx8 TS2GLH72V4B 32GB (2Gx8)x18 2Rx8 TS4GLH72V4E

Component

Composition

(512Mx8)x9 1Rx8 TS512MLH72V4H (1Gx8)x9 1Rx8 TS1GLH72V4B

Rank x Org.

Standard

(1.2V)

Wide Temp.

(-40°C~ 85°C)

-

Very Low Pro le

(VLP)

-

DDR4-2400 ECC SO-DIMM

Capacity

4GB 8GB 8GB

16GB

Component

Composition

(512Mx8)x9 1Rx8 TS512MSH72V4H (512Mx8)x18 2Rx8 TS1GSH72V4H-I (1Gx8)x9 1Rx8 TS1GSH72V4B TS1GSH72V4B-I (1Gx8)x18 2Rx8 TS2GSH72V4B TS2GSH72V4B-I

Rank x Org.

Standard

(1.2V)

-

Wide Temp.

(-40°C~ 85°C)

DDR4-2133 ECC Long-DIMM

Capacity

4GB (512Mx8)x9 1Rx8TS512MLH72V1H 8GB (512Mx8)x18 2Rx8TS1GLH72V1H

16GB (1Gx8)x18 2Rx8TS2GLH72V1B

Component

Composition

Rank x Org.

Standard

(1.2V)

Wide Temp.

(-40°C~ 85°C)

DDR4-2133 ECC SO-DIMM

Capacity

4GB (512Mx8)x9 1Rx8TS512MSH72V1H 8GB (512Mx8)x18 2Rx8TS1GSH72V1H TS1GSH72V1H-I

16GB (1Gx8)x18 2Rx8TS2GSH72V1B TS2GSH72V1B-I

Component

Composition

Rank x Org.

Standard

(1.2V)

Wide Temp.

(-40°C~ 85°C)

-

Very Low Pro le

(VLP)

-

DDR4 Registered DIMMs

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Module Type

Product Image

Standard JEDEC

Speed 3200/2666/2400/2133 Mbps

Capacity 4GB~32GB

Voltage 1.2V

Pin Count R-DIMM: 288 pin

PCB Height

Very Low Proﬁ le: 0.74 inches

DDR4

Registered DIMM

Standard: 1.23 inches

PCB Gold Finger Thickness 30μ”

Anti-Sulfuration Default

Operating Temperature Standard Temperature: 0°C~ 85°C

Ordering Information

DDR4-3200 Registered DIMM

Capacity

8GB 16GB 32GB

Component

Composition

(1Gx8)x9 (1Gx8)x18 (2Gx8)x18

Rank x Org.

1Rx8 2Rx8 2Rx8

Standard

(1.2V)

TS1GHR72V2B TS2GHR72V2B TS4GHR72V2E

Very Low Pro le

(VLP)

TS2GHR72V2BL TS4GHR72V2EL

DDR4-2666 Registered DIMM

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Capacity

Component

Composition

Rank x Org.

Standard

(1.2V)

Very Low Pro le

4GB (512Mx8)x9 1Rx8 TS512MHR72V6H 8GB (512Mx8)x18 2Rx8 TS1GHR72V6H

TS1GHR72V6HL

8GB (1Gx8)x9 1Rx8 TS1GHR72V6B -

16GB (1Gx8)x18 2Rx8 TS2GHR72V6B TS2GHR72V6BL

32GB (2Gx4)x36 2Rx4 TS4GHR72V6C 32GB (2Gx8)x18 2Rx8 TS4GHR72V6E TS4GHR72V6EL

32GB (2Gx8)x18 2Rx8 TS4GHR72V6E2

DDR4-2400 Registered DIMM

Capacity

Component

Composition

Rank x Org.

4GB (512Mx8)x9 1Rx8 TS512MHR72V4H 8GB (512Mx8)x18 2Rx8 TS1GHR72V4H TS1GHR72V4HL

8GB (1Gx8)x9 1Rx8 TS1GHR72V4B 16GB (1Gx8)x18 2Rx8 TS2GHR72V4B TS2GHR72V4BL 32GB (2Gx4)x36 2Rx4 TS4GHR72V4C -

Standard

(1.2V)

Very Low Pro le

(VLP)

-

(VLP)

DDR4-2133 Registered DIMM

Capacity

Component

Composition

Rank x Org.

4GB (512Mx8)x9 1Rx8 TS512MHR72V1H -

8GB (512Mx8)x18 2Rx8 TS1GHR72V1H TS1GHR72V1HL 16GB (1Gx8)x18 2Rx8 TS2GHR72V1B TS2GHR72V1BL 32GB (2Gx4)x36 2Rx4 TS4GHR72V1C -

Standard

(1.2V)

Very Low Pro le

(VLP)

Product specications are subject to change without notice. Pictures shown may dier from actual products. Due to the complexity and variety of industrial applications, Transcend cannot

guarantee 100% compatibility with all platforms and under all scenarios. For special applications and environments, it is strongly suggested that you contact Transcend beforehand for clarication.

Please feel free to contact us with any special requests you might have. Tel: +886-2-2792-8000 www.transcend-info.com

Transcend TS2GLH64V2B2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual