TOSHIBA TMPN3150B1AFG Technical data

TMPN3150B1AFG
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TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TMPN3150B1AFG
Neuron For Distributed Intelligent Control Networks (LONW
The TMPN3150B1AFG is a Neuron Chip which configures L
ONWORKS
Neuron Chips have all the built-in communications and control functions required to implement L may then be easily integrated into highly-reliable distributed intelligent control networks. The typical functions for this chip are explained below.
®
Chip
nodes in combination with external memory.
ONWORKS
nodes. These nodes
®
ORKS
)

FEATURES

I / O Functions
Eleven programmable I / O pins.
Two programmable 16-bit timers and counters built in.
34 different types of I / O functions to handle a wide range of input and output.
ROM firmware image containing pre-programmed I / O drivers, greatly simplifying application programs. ( Stored in external ROM )
Network functions
Two CPUs for communication protocol processing built in. The communications and application CPUs execute in parallel.
Equipped with a built-in LonTalk protocol which supports all seven levels of the OSI reference model with ISO.
Highly reliable communication protocol is supplied as firmware.
Built-in twisted-pair wire transceiver
Equipped with communications modes and communication speeds which support various types of external transceivers. Supports twisted-pair wire, power line, radio ( RF ), infrared, coaxial cables and fiber optics.
Communication port transceiver modes and logical addresses stored within the EEPROM. Can be amended via the network.
Weight : 1.0g (Typ.)
QFP64-P-1414-0.80C
000707EBA1
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury o damage to p In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction o failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energ control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
• • The products described in this document are subject to the foreign exchange and foreign trade laws.
The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed b TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION o others.
The information contained herein is subject to change without notice.
roperty.
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TMPN3150B1AFG
Other functions
Application programs are also stored within the EEPROM.
Can be updated by downloading over the network. EEPROM can be externally added.
Built-in watch-dog timer.
Each chip has a unique ID number. Effective during the logical installation of networks.
Low electrical consumption mode supported with a sleep mode.
Built-in low-voltage detection circuit. Prevents incorrect operations and writing errors in the EEPROM during drops in power voltage.
The package is QFP64-P-1414-0.80C (Lead-Free Type (Pd PrePlated Frame)).
.
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BLOCK DIAGRAM
TMPN3150B1AFG
ITEM
CPU 8-bit CPU×3
RAM 2,048 bytes
ROM
EEPROM 512 bytes
16-bit Timer / Counter 2 channels
External Memory Interface Available
Package 64-pin SOP
TMPN3150B1AFG
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PIN ASSIGNMENT

TMPN3150B1AFG
TMPN3150B1AFG
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TMPN3150B1AFG

PIN FUNCTION

PIN No. PIN NAME I / O PIN FUNCTION
24 CLK1 Input Oscillator connection, or external clock input.
23 CLK2 Output
6 ~RESET
17 ~SERVICE
2~5 IO0~IO
10~13 IO4~IO
14~16 IO8~IO
43, 42, 38~33
45 R / ~W Output
46 ~E Output Output port for controlling memory expansion
47, 50~64
7, 20, 22, 26, 40, 41, 44 V
8, 9, 19, 21, 25, 39 V
1, 18, 27, 48, 49 NC Do not connect anything. Leave pins open.
28~32 CP0~CP
D0, D1,
D
2~D7
A15,
A
14~A0
DD
SS
3
7
10
4
I / O
(built-in pull-up)
I / O
(built-in configurable
pull-up)
I / O
I / O
(built-in configurable
pull-up)
I / O
I / O Data bus for memory expansion
Output Address output port for memory expansion
Input Power input ( 5.0V Typ. )
Input Power input (0V GND )
I / O
Oscillator connection. Leave open when external clock is input to CLK1.
Reset pin. ( Active low )
Service pin. Indicator output during operation.
Large current sink capacity ( 20mA ). General I / O port.
General I / O port. One of IO No.1 timer / counter input. Output signal can be output to IO
.
0
IO
can be used as the No.2 timer / counter input with
4
IO
as output.
1
General I / O port. Can be used for serial communication with other device.
Output port for controlling read / write for memory expansion
Bidirectional port for communications. Supports several communications protocols by specifying mode.
to IO7 can be specified as
4
* : The ~SERVICE and IO4 ~ IO7 terminals are programmable pull-ups.
All V
All V
terminals must be externally connected.
DD
terminals must be externally connected.
SS
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TMPN3150B1AFG
MAXIMUM RATINGS
CHARACTERISTICS SYMBOL RATING UNIT
Power Supply Voltage VDD 0.3~7.0 V
Input Voltage VIN 0.3~VDD+0.3 V
Power Dissipation PD 800 mW
Storage Temperature T
( VSS = 0V, VSS typ.)
65~150 °C
stg

OPERATING CONDITIONS

ITEM SYMBOL MIN TYP. MAX UNIT
Operating Voltage V
Input Voltage ( TTL )
Input Voltage ( CMOS )
Operating Frequency f
Operating Temperature T
4.5 5.0 5.5 V
DD
V
IH(1)
V
IL(1)
V
IH(2)
V
IL(2)
0.625 ― 10 MHz
osc
40 85 °C
opr
2.0 V
V
DD
VSS 0.8 V
V
0.8 V
DD
V
DD
VSS 0.8 V
ELECTRICAL CHARACTERISTICS DC characteristic
( Above operating conditions apply unless otherwise states. )
( V
= 5.0 V ± 10%, V
DD
= 0 V, Ta = −40~85°C )
SS
CHARACTERISTICS SYMBOL PINS TEST CONDITION MIN MAX UNIT
LOW Output Voltage (1) VOL (1) IO0~IO3
LOW Output Voltage (2) VOL (2) ~SERVICE
LOW Output Voltage (3) VOL (3) CP2, CP3 I
LOW Output Voltage (4) VOL (4) Others (Note 1) IOL=1.4mA 0 0.4 V
HIGH Output Voltage (1) VOH (1) IO0~IO
HIGH Output Voltage (2) VOH (2) ~SERVICE IOH=1.4mA
HIGH Output Voltage (3) VOH (3) CP2, CP
HIGH Output Voltage (4) VOH (4) Others (Note 1) IOH=1.4mA
Input Current I
Pull-up Current I
Low-voltage Detection Level
IN
PU
~SERVICE, ~RESET (Note 3)
V
LVD
3
3
(Note 2) VIN=VSS~VDD 10 +10 µA
IO4~IO
7
V
DD
IOL=20mA 0 0.8 V
IOL=10mA 0 0.4 V
Duty cycle=50%
=40mA 0 1.0 V
OL
I
=1.4mA
OH
I
=40mA
OH
V
=0V 30 300 µA
IN
IOL=20mA 0 0.8 V
=10mA 0 0.4 V
I
OL
VDD
0.4
VDD
0.4
VDD
1.0
V
0.4
3.8 4.5 V
DD
V
DD
V
DD
V
DD
V
DD
V
V
V
V
Note1 : Output voltage characteristics exclude the ~RESET pin and CLK2 pin. Note2 : Excludes pull-up input pins. Note3 : The IO
to IO7 and ~SERVICE pins have programmable pull-ups. ~RESET has a fixed pull-up.
4
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ITEM SYMBOL TYP. MAX UNIT
10 MHz Clock 18 30
Operating Mode Current Consumption
Sleep Mode Current Consumption
5 MHz Clock 10 15
2.5 MHz Clock 5 8
1.25 MHz Clock 2.5 5
0.625 MHz Clock
Note: Test conditions for current dissipation
V
=5V, all output=with no load, all input=0.2V or below or VDD−0.2V, programmable pull-up=off, crystal
DD
oscillator clock input, differential receiver disabled. The current value ( typ. ) is a typical value when Ta=25°C. The current value ( max ) applies to the rated temperature range at V 200µA ( typ. ) to 600µA ( max ) is added to the current of the differential receiver when the receiver is enabled. The differential receiver is enabled by either of the following conditions :
When the Neuron chip is in Run mode and the communication ports are in Differential mode.
When the Neuron chip is in Sleep mode, the communication ports are in Differential mode, and the
Comm Port Wakeup is not masked.
I
DD (OP)
I
DD (SLP)
1.5 3
18 100 µA
mA
DD
TMPN3150B1AFG
=5.5V.
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TMPN3150B1AFG
Echelon, Neuron, LON, LonTalk, LonBuilder, NodeBuilder, LONW
registered trade marks of America’s Echelon Inc.
The Neuron Chip is manufactured by Toshiba under license from Echelon Corporation, USA. A licensing
agreement between the customer and Echelon Corporation must be concluded before purchasing any of the neuron chip products.
The Neuron chip itself does not include the I
Echelon. The Neuron chip and the I Electronics N.V. ( “Philips” ) to make, use or sell any product employing such patent rights. Please refer all questions with respect to I
2
C Library do not convey nor imply a right under any I2C patent rights of Philips
2
C patents and licenses to Philips at:
Mr. Gert-Jan Hessenlmann Corporate Intellectual Property Philips International B.V. Prof. Holstlaan 6 Building WAH 1-100 P.O. Box 220 5600 AE, Eindhoven, The Netherlands Phone : +31 40 274 32 61 Fax : +31 40 274 34 89 E-mail : Gert.Jan.Hesselmann@philips.com.
2
C object function. You need the “I2C Library” deliveried by
, 3150, 3120 and LonManager are the
ORKS
2003-05-26 8/10

PACKAGE DIMENSONS

TMPN3150B1AFG
QFP64-P-1414-0.80C
UNIT: mm
2003-05-26 9/10
TMPN3150B1AFG
Lead-Free Type (Pd PrePlated Frame)
UNIT: mm
2003-05-26 10/10
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