Toshiba TLP733, TLP721, TLP721F Datasheet

TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
TOSHIBA PHOTOCOUPLER
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
ATTACHMENT
This data sheet refers to black mold-resin devices, TLPxxx (D4xxx, M) that previously has a white-resin mold and have been changed. When designing new products please use black mold-resin devices.
Type designations for 'Option: (D4)
VDE0884 ISOLATION CHARACTERISTICS
: SPECIFICATIONS FOR VDE0884 OPTION: (D4)
TLP747JF
', which are tested under VDE0884 requirements. Ex. : TLP734F (D4-GR-LF4, M) D4 : VDE0884 option GR : CTR rank name LF4 : standard lead bend name M : black mold-resin devices
Note : Use Toshiba standard type number for safety standard application.
Ex. TLP734(FD4-GR-LF4, M) TLP734F
DESCRIPTION SYMBOL RATING UNIT
Application Classification (DIN VDE0110 Teil 2 / 01.89, Table 1)
for rated mains voltage 300 V for rated mains voltage 600 V
Climatic Classification (DIN IEC68 Teil 1 / 09.80) 40 / 100 / 21
Pollution Degree (DIN VDE0110 Teil 2 / 01.89) 2
Maximum Operating Insulation Voltage
Input to output Test Voltage, Method A
Vpr = 1.5 × V tp = 60s, Partial Discharge < 5pC
Input to output Test Voltage, Method B
Vpr = 1.875 × V tp = 1s, Partial Discharge < 5pC
Highest Permissible Overvoltage (Transient Overvoltage, tpr = 10s) VTR 8000 Vpk
Safety Limiting Values (Max. permissible ratings in case of fault, also refer to thermal derating curve)
Current (Input current I Power (Output or Total Powr Dissipation) Temperature
Insulation Resistance, VIO = 500V, Ta = 25°C
, Type and Sample Test
IORM
, 100% Production Test
IORM
F
V
IO
RMS RMS
, Psi = 0)
= 500V, Ta = Tsi
TLPxxx type 890
TLPxxxF type
TLPxxx type 1335
TLPxxxF type
TLPxxx type 1670
TLPxxxF type
V
IORM
Vpr
Vpr
Isi Psi Tsi
Rsi
I- IV I- III
1130
1695
2120
400 700 150
10
109
12
Vpk
Vpk
Vpk
mA
mW
°C
1
2001-05-14
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
INSULATION RELATED SPECIFICATIONS
7.62mm pitch TLPxxx type
Minimum Creepage Distance (*) Cr 7.0 mm 8.0 mm
Minimun Clearance (*) Cl 7.0 mm 8.0 mm
Minimum Insulation Thickness ti 0.5 mm
Comperative Tracking Index (DIN IEC112 / VDE0303, Part 1)
*: in accordance with DIN VDE0110 Teil 1 / 01.89, Table 2, & 4
1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value (e. g. at a standard distance between soldering eye centres of 7.5mm). If this is not permissible, the user shall take suitable measures.
2. This photocoupler is suitable for 'safe electrical isolation' only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits.
CTI
TLP721 SERIES
10.16mm pitch TLPxxxF type
(VDE0110 Teil 2 / 01.89 Group IIIa)
175
TLP733 SERIES TLP747 SERIES
2
2001-05-14
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