TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
TOSHIBA PHOTOCOUPLER
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
ATTACHMENT
Types : TLP721, TLP721F, TLP733, TLP733F, TLP734, TLP734F, TLP747G, TLP747GF, TLP747J,
This data sheet refers to black mold-resin devices, TLPxxx (D4xxx, M) that previously has a white-resin mold
and have been changed. When designing new products please use black mold-resin devices.
Type designations for 'Option: (D4)
VDE0884 ISOLATION CHARACTERISTICS
: SPECIFICATIONS FOR VDE0884 OPTION: (D4)
TLP747JF
', which are tested under VDE0884 requirements.
Ex. : TLP734F (D4-GR-LF4, M) D4 : VDE0884 option
GR : CTR rank name
LF4 : standard lead bend name
M : black mold-resin devices
Note : Use Toshiba standard type number for safety standard application.
Ex. TLP734(FD4-GR-LF4, M) → TLP734F
DESCRIPTION SYMBOL RATING UNIT
Application Classification (DIN VDE0110 Teil 2 / 01.89, Table 1)
for rated mains voltage ≤ 300 V
for rated mains voltage ≤ 600 V
Climatic Classification (DIN IEC68 Teil 1 / 09.80) 40 / 100 / 21 ―
Pollution Degree (DIN VDE0110 Teil 2 / 01.89) 2 ―
Maximum Operating Insulation Voltage
Input to output Test Voltage, Method A
Vpr = 1.5 × V
tp = 60s, Partial Discharge < 5pC
Input to output Test Voltage, Method B
Vpr = 1.875 × V
tp = 1s, Partial Discharge < 5pC
Highest Permissible Overvoltage (Transient Overvoltage, tpr = 10s) VTR 8000 Vpk
Safety Limiting Values (Max. permissible ratings in case of fault, also refer to
thermal derating curve)
Current (Input current I
Power (Output or Total Powr Dissipation)
Temperature
Insulation Resistance, VIO = 500V, Ta = 25°C
, Type and Sample Test
IORM
, 100% Production Test
IORM
F
V
IO
RMS
RMS
, Psi = 0)
= 500V, Ta = Tsi
TLPxxx type 890
TLPxxxF type
TLPxxx type 1335
TLPxxxF type
TLPxxx type 1670
TLPxxxF type
V
IORM
Vpr
Vpr
Isi
Psi
Tsi
Rsi
I- IV
I- III
1130
1695
2120
400
700
150
≥10
≥109
12
―
Vpk
Vpk
Vpk
mA
mW
°C
Ω
1
2001-05-14
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
INSULATION RELATED SPECIFICATIONS
7.62mm pitch
TLPxxx type
Minimum Creepage Distance (*) Cr 7.0 mm 8.0 mm
Minimun Clearance (*) Cl 7.0 mm 8.0 mm
Minimum Insulation Thickness ti 0.5 mm
Comperative Tracking Index
(DIN IEC112 / VDE0303, Part 1)
*: in accordance with DIN VDE0110 Teil 1 / 01.89, Table 2, & 4
1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value
(e. g. at a standard distance between soldering eye centres of 7.5mm). If this is not permissible, the user
shall take suitable measures.
2. This photocoupler is suitable for 'safe electrical isolation' only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
CTI
TLP721 SERIES
10.16mm pitch
TLPxxxF type
(VDE0110 Teil 2 / 01.89 Group IIIa)
175
TLP733 SERIES
TLP747 SERIES
2
2001-05-14