TL(BD,EGD)1100B(T11)
TOSHIBA LED Lamps
TLBD1100B(T11), TLEGD1100B(T11)
Panel Circuit Indicator
• Surface-mount devices
• 3.2 (L) × 2.8 (W) × 1.9 (H) mm
• Flat-top type
• InGaN LEDs
• High luminous intensity
• Low drive current, high-intensity light emission
• Colors: Blue λd=470nm(typ)
Green λd=528nm(typ)
• Pb free reflow soldering is possible
• Applications: automotive use, message signboards, backlighting
etc.
• Standard embossed tape packing: T11 (2000/reel)
8-mm tape reel
Color and Material
Product Name Color Material
Unit: mm
JEDEC ―
JEITA ―
TLBD1100B Blue
TLEGD1100B Green
Maximum Ratings
Product Name
TLBD1100B
TLEGD1100B
(Ta = 25°C)
Forward Current
I
F
Please see Note 1
Note 1: Forward current derating
40
(mA)
F
30
20
InGaN
TOSHIBA 4-3R1
Weight: 0.035 g (typ.)
(mA)
30 4 120 −40~100 −40~100
Reverse Voltage
I
– Ta
F
V
(V)
R
Power Dissipation
PD (mW)
Operation
Temperature
T
(°C)
opr
Storage
Temperature
T
(°C)
stg
10
Allowable forward current I
0
0 80 60 20 100
Ambient temperature Ta (°C)
40
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TL(BD,EGD)1100B(T11)
Electrical Characteristics
Product Name
TLBD1100B 2.7 3.3 4.0
TLEGD1100B 2.7 3.3 4.0
Unit V mA µA V
Forward Voltage VF
Min Typ. Max I
(Ta = 25°C)
Reverse Current
I
R
Max VR
F
20 10 4
Optical Characteristics–1
Product Name
Min Typ. Max I
TLBD1100B 40 70 200 20 PA / QA / RA
TLEGD1100B 100 200 500 20 RA / SA / TA
Unit mcd mA
(Ta = 25°C)
Luminous Intensity IV
Available Iv rank (Note 2)
F
Note 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Iv rank
Rank symbol Min Max
PA 40 80
QA 63 125
RA 100 200
SA 160 320
TA 250 500
Unit mcd mcd
Optical Characteristics–2
(Ta = 25°C)
Emission Spectrum
Product Name
TLBD1100B ⎯ 468 ⎯ 22 463 470 477
TLEGD1100B ⎯ 523 ⎯ 35 518 528 538
Unit nm nm nm mA
Peak Emission
Wavelength λ
Min Typ. Max Typ. Min Typ. Max
p
∆λ Dominant Wavelength λ
d
I
F
20
Note 3: Caution
ESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000V
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
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2006-06-01
TLBD1100B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(BD,EGD)1100B(T11)
100
Ta = 25°C
I
F
– VF
30
(mA)
F
10
I
– IF
300
Ta = 25°C
100
(mcd)
V
50
30
V
3
Forward current I
1
2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0
Forward voltage VF
10
Luminous intensity I
5
3
1 50
3 5 10 30 100
Forward current IF (mA)
10
5
V
3
I
V
– Tc
Relative luminosity I
1
0.5
0.3
1.0
Relative luminosity - λ
0.8
0.6
IF = 20 mA
Ta = 25°C
0.4
Relative luminosity
0.2
0.1
−20 0 40
Case temperature Tc (°C)
20
100
80 60
0
400 600
360 560 520 440
480
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
80°
70°
60°
50°
40°
30°
20°
10°
0°
10°
20°
30°
40°
50°
60°
50
80°
90° 90°
1.00.80.6 0.4 0.2 0
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2006-06-01
TLEGD1 1 00B
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(BD,EGD)1100B(T11)
100
Ta = 25°C
I
F
– VF
30
(mA)
F
10
I
– IF
300
Ta = 25°C
100
(mcd)
V
50
30
V
3
Forward current I
1
2.2 2.6 3.0 3.4 3.8 4.2 5.0
4.6
Forward voltage VF (V)
10
Luminous intensity I
5
3
1 50
3 5 10 30 100
Forward current IF (mA)
10
5
V
3
I
V
– Tc
Relative luminosity I
1
0.5
0.3
1.0
Relative luminosity - λ
0.8
0.6
IF = 20 mA
Ta = 25°C
0.4
Relative luminosity
0.2
0.1
−20 0 40
Case temperature Tc (°C)
20
100
80 60
0
440 640
400 600 560 480
520
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
80°
90°
70°
60°
50°
40°
30°
20°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.00.80.6 0.4 0.2 0
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TL(BD,EGD)1100B(T11)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering (example)
Temperature profile for Pb soldering (example)
240°C max
10 s max
(*)
(*)
Package surface
temperature (°C)
140~160°C
(*)
4°C/s max
max(*)
60~120 s
4°C/s max
max(*)
(*)
Time (s)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under th e above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time : within 3 s
• If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
1.65 1.15
1.65
Temperature profile for Pb-free soldering (example)
(*)
5 s max
4°C/s max
230°C
(*)
60~120 s
Time (s)
(*)
(*)
max(*)
30~50s max(*)
150~180°C
4°C/s max
Package surface
temperature (°C)
Unit: mm
260°C max
max(*)
2.41
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2006-06-01
TL(BD,EGD)1100B(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)
KAO CLEAN TROUGH 750H : (made by KAO)
PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL)
TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES)
(FRW-17, FRW-1, FRV-100)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T14 (4-mm pitch)
(2) Example
TLBD1100B (T11)
2. Tape dimensions
Unit: mm
Symbol Dimension Tolerance Symbol Dimension Tolerance
D 1.5 +0.1/−0 P2 2.0 ±0.05
E 1.75 ±0.1 W 8.0 ±0.3
P0 4.0 ±0.1 P 4.0 ±0.1
t 0.3 ±0.05 A0 2.9 ±0.1
F 3.5 ±0.05 B0 3.7 ±0.1
D1 1.5 ±0.1 K0 2.3 ±0.1
Tape type
Toshiba product No.
D
P0
K
0
P
2
E
t
F
W
B
0
Polarity
A0
P D
1
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2006-06-01
3. Reel dimensions
φ44
4. Leader and trailer sections of tape
2 ± 0.5
TL(BD,EGD)1100B(T11)
Unit: mm
9 ± 0.3
11.4 ± 1.0
+0
−4
φ60
180
φ13
40 mm or more
(Note 1)
40 mm or more
(Note 2)
Leading part: 190 mm (min)
Note1: Empty trailer section
Note2: Empty leader section
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2006-06-01
5. Packing display
•
(1) Packing quantity
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLBD1100B (T11)
TL(BD,EGD)1100B(T11)
Reel 2,000 pcs
Carton 10,000 pcs
P/N: TO SH IB A
TYPE TLBD1100B
ADDC (T11) Q’TY 2,000 pcs
Lot Number Key code for TSB 32C 2000
(RANK SYMBOL)
Use under 5-30degC/6-%RH within 168h
SEAL DATE:
[[G]]/RoHS COMPATIBLE DIFFUSED IN *****
*Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN *****
(2) Label location
• Reel
Tape feel direction
Label position
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
Carton
Label position
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2006-06-01
TL(BD,EGD)1100B(T11)
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
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2006-06-01
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