Toshiba SD-P7000 Schematic

SERVICE MANUAL

DOCUMENT CREATED IN JAPAN, Nov., 2004

LCD TELEVISION AND DVD

FILE NO. 810-200450

COMBINATION

VIDEO PLAYER

SD-P7000

RMT CODE

POWER

1 2

SET UP SLEEP DIMMER E.A.M

MEMORY REPEAT REPEAT A-B CLEAR

MONO/

DISPLAY CAP/TEXT

STEREO/SAP

RANDOM

AUDIO

1 2 3 4 5 6 7 8 9

+10

100 0 T

TOP MENU MENU

ENTER

SKIP

VOLUME CHANNEL

MUTE

PLAY

REW PAUSE FWD

SLOW REW

STOP SLOW FWD

ZOOM ANGLE SUB TITLE RETURN

INPUT SELECT

PICTURE

SKIP

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION........................................................................................6

TIMING CHART........................................................................................11

REMOTE CONTROL ...............................................................................12

DISASSEMBLY........................................................................................13

TROUBLE SHOOTING............................................................................15

BLOCK DIAGRAM...................................................................................21

WIRING DIAGRAM..................................................................................23

EXPLODED VIEW .................................................................................. 24

EXPLODED VIEW PARTS LIST..............................................................25

REPLACEMENT PARTS LIST ............................................................... 26

SCHEMATIC DIAGRAMS .......................................................................40

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

X-RAY Radiation

Warning:

To determine the presence of high voltage, use an accurate high impedance HV meter.

Adjust brightness, color, contrast controls to minimum. Measure the high voltage. The meter reading should indicate

23.5 ¡ 1.5KV: 14-19 inch, 26 ¡ 1.5KV: 19-21 inch,

29.0 ¡ 1.5KV: 25-29 inch, 30.0 ¡ 1.5KV: 32 inch If the meter indication is out of tolerance, immediate service and correction is required to prevent the possibility of premature component failure.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the LCD PANEL. For continued X-RAY RADIATION protection, the replacement panel must be the same type panel as specified in the Replacement Parts List.

IMPORTANT SAFETY NOTICE

0.15uF

To Instrument's exposed METALLIC PARTS

AC Volt-meter

1.5 Kohm/10W

Good Earth Ground such as WATER PIPE, CONDUIT etc.

- 4 -

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500¡£F to 600¡£F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500¡£F to 600¡£F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500¡£F to 600¡£F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

- 6 -

1. Application range

This specification is applied to ML-041C chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition.

(1) Temperature: 25°C ± 2°C (2) Power: Standard input voltage (AC 90~132V, 50/60Hz) (3) Measurement must be performed after heat-run more than

30min.

(4) Adjusting standard for this chassis is followed a special

standard.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

3.General Specification

Maker Type ActiveDisplay Area Pixel Pitch [mm] Electrical Interface Color Depth Size [mm] Surface Treatment Operating Mode Back light Unit R/T Typ.

LPL TFT Color LCD Module

17.0 inches(434.38mm) diagonal(Aspect 15:9)

0.291mm(H)x0.291mm(V)xRGB LVDS 8BIT, 16,777,216 colors 400(H)x258(V)x22(D) Anti Glare Hard Coating(3H) Normally Black 6 lamps R.T.:12ms + F.T.:13ms

Item Specification Remark

No.

LPL

- 7 -

4. Function

5.Optical Character

No Item Specification Remark

1 REMOCON TOSHIBA Code NTSC 2 AV Input 1 Side 3 S-Vedio Input 1 Side 4 Component input 1 Rear (NTSC) 5 RGB(VGA)Input 1 D-sub 15 pin 6 Ear-phone output 1 Side 7 PC Sound input 1 8 Film Mode x 9 Progressive Scan 0

10 ARC 0

No Item

Specification Remark

Module kind LPL

1 Viewing Angle R/L 85/88

<CR≥10> U/D 85/88

2 Luminance Luminance (cd/m

) 450 Typical

Variation 1.3 MAX 3 Contrast Ratio 400 All white / All black 4 CIE Color Coordinates White W

X Typ. 0.283 Min = Typ. - 0.03

Y Typ. 0.294 Max = Typ. + 0.03

RED X

r Typ. 0.631

r Typ. 0.341

Green X

g Typ. 0.287

g Typ. 0.609

Blue X

b Typ. 0.146

b Typ. 0.064

- 8 -

6-1.General Specification(TV)

6-2. Power

6. Engineering Specification

Item Specification Remark

Power Supply H/V Sync Video Power Consumption LED Color Normal On/On Active ≤65W GREEN Stand By, Off/On ≤2W AMBER Suspend Mode On/Off Off ≤5W

GREEN

DPM Off Mode Off/Off ≤5W Cut-off Switch off - - 0W OFF

PBP SWAP ON/OFF 1 ITEM Specification remark 2 D-SUB 1 : RED 2 : Green

Pin configuration 3 : Blue 4 : ID2 (GND)

5 : S.T (GND) 6 : RED GND 7 : Green GND 8 : Blue GND 10: Digital GND 9 : N.C 10: D-GND 11: ID0(GND) 12:SDA 13: H-Sync 14: V-Sync 15: SCL Shell: GND

3 Control Function 1) Contrast/Brightness

2) H-Position / V-Position

3) Tracking : Clock / Phase

4) Auto ConfigureRESET

4 Comoponent Jack 1 : Y

3 : Pb 5 : Pr

No Item Min Typ Max Unit Remark

1 AC Power Shut Down Voltage 90 264 V 2 DC Voltage, Inverter 22.8 24 25.2 V 3 DC Voltage, LCD Panel 11.4 12 12.6 V 4 DC Voltage, Audio 14.0 15 16.0 V 5 DC Voltage, Tuner(5) 4.5 5 5.5 V 6 DC Voltage, Tuning(31) 31 33 35 V 7 DC Voltage, VCTi(5) 4.5 5 5.5 V

DC Voltage, VCTi(8) 7.5 8 8.5 V

8. DC Voltage, VCTi(3.3) 3.1 3.3 3.5 V DC Voltage, VCTi(1.8) 1.6 1.8 2.0 V

9 DC Voltage, GM2221 (3.3) 3.1 3.3 3.5 V

DC Voltage, GM2221 (1.8) 1.6 1.8 2.0 V

10 DC Voltage, Digital (3.3) 2.8 3.3 3.8 V 11 DC Voltage, Digital (5) 4.5 5 5.5 V

- 9 -

6-3. External Interface

No Item Min Typ Max Unit Remark

1. Audio Input Level 0.3 0.4 0.5 V

2. Audio Input Frequency Response 0.1 7 KHz

3. Audio Input S/N 40 DB

4. Audio Input Distortion 2 %

5. Audio Input Dynamic Range 2 V

6. Video Output Level 0.85 1 1.15 Vpp

7. Video Output Frequency Response 3.8 MHz

8. Video Output S/N 40 DB

9. Audio Output Level 0.4 0.5 0.6 V

10. Audio Output Frequency Response 0.1 7 KHz

11. Audio Output S/N 40 DB

12. Audio Output Distortion 2 %

13. Video Input Level, R/G/B 0.6 0.7 0.8 Vpp 75 ohm

14. Video Input Level, Component(Y, PB, PR) 0.6 0.7 0.8 Vpp 75 ohm

15. RGB Input Resolution, Vertical 768 Pixel

16. RGB Input Resolution, Horizontal 1280 Pixel

17. RGB Input Horizontal Frequency KHz See table 5-5

18. RGB Input Frame Rate Hz See table 5-5

6-4. The Others

No Item Min Typ Max Unit Remark

1. Search Sensitivity -85 dBm

2. Soft Ware Functionality Test LGE Specification

3. REMOCON Working Sensitivity, Straight 0.1 10 m

4. REMOCON Working Sensitivity, T/B/L/R 0.1 9 m 30 degree

5. Closed Caption Sensitivity -70 dBm

6. Teletext Sensitivity -70 dBm

- 10 -

7. Signal Timing(Resolution) 7-1. PC Mode

[Table 7] Timming chart of Receivable Mode * H [dot] / V [line]

Mode VGA-60 VGA-67 VGA-75 SVGA-56 SVGA-60 SVGA-72 SVGA-75 MAC-75 XGA-60 XGA-70 XGA-75

H_display 640 640 640 800 800 800 800 832 1024 1024 1024 V_display 480 480 480 600 600 600 600 624 768 768 768 V frequency 60 67 75 56 60 72 75 75 60 70 75 H_total 800 864 840 1024 1056 1040 1056 1152 1344 1328 1312 H_blanking 160 224 200 224 256 240 256 320 320 304 288 H_sync 96 64 64 72 128 120 80 64 136 136 96 H Polarity NEG. NEG. NEG POS POS POS POS NEG NEG NEG POS H_bp 48 96 120 128 88 64 160 224 136 144 176 H_fp 16 64 16 24 40 56 16 32 160 24 16 H-freq[kHz] 31.469 35.0 37.5 35.156 37.879 48.077 46.875 49.725 48.363 56.476 60.023 /Clk[MHz] 25.175 30.24 31.5 36.0 40.0 50.0 49.5 57.283 65.0 75.0 78.75 V_total 525 525 500 625 628 666 625 667 806 806 800 V_blanking 45 45 20 25 28 66 25 43 38 38 32 V_sync 2 3 3 2 4 633663 V Polarity NEG NEG NEG POS POS POS POS NEG NEG NEG POS V_bp 33 39 16 22 23 23 21 39 29 29 28 V_fp 10 3 1 1 1 37 11331

TIMING CHART

- 11 -

VIDEO

SYNC

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

Mode

H/V

Sort

Sync

Porarity

DOT

Clock

Frequency

Total

Period

(E)

Video

Active Time

(A)

Front

Porch

(C)

Sync

Duration

(D)

Back

Porch

(F)

Resolution

H(Pixels)

25.175

31.468 800 640 16 96 48 640 x 350

V(Lines)

- 70.090 449 350 37 2 60

H(Pixels)

28.324

31.469 900 720 18 108 54

720 X 400

V(Lines)

+ 70.082 449 400 13 2 34

H(Pixels)

25.175

31.469 800 640 16 96 48 640 x 480

V(Lines)

- 59.94 525 480 10 2 33

H(Pixels)

31.5

37.5 840 640 16 64 120 640 x 480

V(Lines)

- 75 500 480 1 3 16

H(Pixels)

40.0

37.879 1056 800 40 128 88 800 x 600

V(Lines)

+ 60.317 628 600 1 4 23

H(Pixels)

49.5

46.875 1056 800 16 80 160 800 x 600

V(Lines)

+ 75.0 625 600 1 3 21

H(Pixels)

+/-

57.283

49.725 1152 832 32 64 224 832 x 624

V(Lines)

+/- 74.55 667 624 1 3 39

H(Pixels)

65.0

48.363 1344 1024 24 136 160

1024 x 768

V(Lines)

- 60.004 806 768 3 6 29

H(Pixels)

78.75

60.023 1312 1024 16 96 176

1024 x 768

V(Lines)

+ 75.029 800 768 1 3 28

H(Pixels)

65.125

39.518 1648 1280 56 128 184

1280 x 768

V(Lines)

+ 49.959 791 768 1 7 15

H(Pixels)

80.125

47.693 1680 1280 64 136 200

1280 x768

V(Lines)

+ 59.992 795 768 1 7 19

REMOTE CONTROL

- 12 -

SKIP buttons

ZOOM button

PAUSE button

SUB TITLE button

PLAY button REV button

FWD button

MUTE button

SLOW FWD button

STOP button

SLOW REV buttons

Direction buttons ( / / / )

CHANNEL / button

ANGLE button

VOLUME +/- button

RETURN button

Numbered buttons (0

POWER button

RMT CODE(1/2)

SET UP button

SLEEP button

REPEAT button

CAP/TEXT button RANDOM button

+10 button

MEMORY button

DISPLAY button

TOP MENU button

100

INPUT SELECT button

Selects: TV, Video, S-Video, DVD, Component, or PC mode.

[1]: For controlling SD-P7000 model and other Toshiba brand TV. [2]: For controlling SD-P7000 model only.

Switches the TV between ON and STANDBY.

T button

MENU button

DIMMER button REPEAT A-B button

MONO/STEREO/SAP button AUDIO button

E.A.M. button

CLEAR button

PICTURE button

Direct channel selection buttons (0

INPUT

SELECT

SET UP SLEEP DIMMER E.A.M.

MEMORY REPEAT REPEAT A-B CLEAR

DISPLAY CAP/TEXT

MONO/

STEREO/SAP

PICTURE

RANDOM

+10

TOP MENU MENU

SKIP

MUTE

SKIP

AUDIO

RMT CODE

1 2

POWER

VOLUME CHANNEL

1 2 3 4 5 6

7 8 9

100 0 T

PLAY

REV PAUSE FWD

SLOW REV

ZOOM ANGLE SUB TITLE RETURN

STOP SLOW FWD

ENTER

Use to turn the sound on or off temporarily.

Allows you to go back to the last scene you were watching.

- 13 -

DISASSEMBLY

1-1. Remove 8 screws of the Back cover. 1-2. Using the Jig, disassemble points which was

latched under left and right sides .

2-1. Using the jig, disassemble points which was

latched at center of left and right sides.

3-1. Disclose the lower side of the Back cover.

4-1. At first, remove two screws from the small power

control PCB Ass'y.

4-2. Using the jig, disassemble point which was

latched and then remove the small Power jack control PCB Ass'y from the cabinet.

+ 29 hidden pages