TSB12LV21B
(PCILynx-2) IEEE 1394 LINK LAYER CONTROLLER
SLLS306– JUL Y 1998
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D IEEE Standard for a 1394-1995 Compliant
D IEEE Standard for a 1212-1991 Compliant
D Supports IEEE 1394-1995 Link Layer
Control
D PCI Local Bus Specification Rev. 2.1
Compliant
D Supports IEEE 1394 Transfer Rates of 100,
200, and 400 Mb per second
D 3.3-V Core Logic while Maintaining 5-V
Tolerant Inputs
D Performs the Function of 1394 Cycle
Master
D Provides 4K Bytes of Configurable FIFO
RAM
D Provides 5 Scatter-Gather DMA Channels
D Provides Software Control of Interrupt
Events
D Provides 4 General-Purpose Input/Outputs
D Supports Plug-and-Play (PnP) Specification
D Generates 32-bit CRC for Transmission of
1394 Packets
D Performs 32-bit CRC Checking on
Reception of 1394 Packets
D Provides PCI Bus Master Function for
Supporting DMA Operations
D Provides PCI Slave Function for Read/Write
Access of Internal Registers
D Supports Distributed DMA Transfers
Between 1394 and Local Bus RAM, ROM,
AUX, or Zoomed Video
D Advanced Submicron, Low-Power CMOS
T echnology
D Packaged in a 176-Pin PQFP (PGF)
Description 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terminal Assignment 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Name/Terminal Number Sort Tables 4. . . . . . . . . . . . . . . . .
Terminal Functions 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Block Diagram 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Block Diagram 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operating Conditions 11. . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCI Interface Switching Characteristics 13. . . . . . . . . . . . . . . . . . . . . .
Parameter Measurement Information 15. . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Sequencing 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mechanical Data 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table of Contents
Copyright 1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.