Modulation and Upconversion from I/Q
Baseband to RF on Single Chip
D
Designed for GSM Portable Cellular
Telephones
D
Internal VCO and SSB Mixer for Transmit
Carrier Generation
D
Internal RF Filter for Minimal External Parts
description
The TRF3520 radio frequency (RF) modulator/amplifier is a single-chip RF integrated circuit (IC) suitable for
900-MHz wireless global system for mobile communications (GSM) applications. It combines a direct
conversion RF in-phase/quadrature-phase (I/Q) modulator, a single-sideband suppressed carried (SSB) mixer ,
an RF filter, a power amplifier (PA) driver, a buffered voltage-controlled oscillator (VCO), and a serial interface
into one small package. Very few external components are required. During idle operation, the individual
functional elements may be selectively placed in standby mode for minimum power consumption.
PFB PACKAGE
(TOP VIEW)
D
Power Amplifier Driver
D
Independent Power-Up/-Down Functions
D
3.75-V Operation
D
Low Current Consumption
D
Serial Data Interface
D
48-Pin Plastic Quad Flatpack (PFB)
TRF3520
CC
V
TXO_
47 46 45 44 434842
TXO_TNK2
TXO_TNK1
TXO_GND
PSUB
DRV_GND
DRV_OUT–
DRV_OUT+
DRV_GND
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15
DRV_GND
NC – No internal connection
TXO_GND
TXO_SYNNCDB2_GND
17 18 19 20
16
NC
CC
V
VBG_IN
DRV_
DRV_GND
CC
CC
V
V
DIG_
DB2_OUT
DB2_
40 39 3841
21
I+
NC
VBG_OUT
DIG_CLK
DIG_STR
DIG_DAT
37
22 23 24
I–
Q+
MOD_GND
DIG_GND
TXM_V
36
TXM_GND
35
TXM_LO+
34
33
TXM_LO–
32
TXM_GND
TXM_GND
31
NC
30
PH2
29
PH1
28
MOD_GND
27
MOD_V
26
MOD_GND
25
Q–
CC
CC
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
1
TRF3520
GSM RF MODULATOR/DRIVER AMPLIFIER
SLWS060A – MAY 1998
functional block diagram
I +
I –
Q +
Q –
TXM_LO+
TXM_LO–
20
21
23
24
External
Tank
34
33
TXO_TNK2
1
Transmit
2
TXO_TNK1
90°
IF VCO
0°
I/Q Modulator
Buffer
Limiter
÷ 2
∑
Band-Pass
Filter (BPF)
Buffer
Low-Pass
Filter (LPF)
Power
Amplifier
Driver
46
To SYNTH
(TXO_SYN)
43
+
–
Divide
(DB2_OUT)
DRV_OUT+ 11
DRV_OUT– 10
Single-Sideband
Transmit Mixer
Buffer
-by-Two
Output
To External
Band
-Pass Filter,
Power Amplifier,
and Duplexer
Serial Interface
4140393837
CC
DIG_V
DIG_CLK
DIG_DAT
DIG_STR
DIG_GND
transmit IF VCO
The transmit intermediate frequency (IF) VCO generates a CW signal in the 200-MHz range. The IF VCO
frequency is controlled by applying voltage to the required external tank varactors. Through on-chip buffers, the
transmit IF VCO output is sent to the SSB transmit mixer and divide-by-two functional blocks, as well as to an
external synthesizer where the transmit IF VCO frequency is controlled and phase locked. The error signal
generated by the synthesizer is sent to the transmit IF VCO varactors’ tuning port, completing the phase-locked
loop (PLL) function. The VCO is characterized for operation in the 74-MHz to 494-MHz range.
divide-by-two
This functional block halves the IF VCO frequency and provides a buffered amplitude-limited and low-pass
filtered signal, which can become the LO signal for the TRF1020 GSM Receiver IC second down-conversion
stage.
single-sideband transmit mixer (SSB Tx)
The SSB Tx mixer combines an external LO signal with the on-chip transmit IF VCO and performs a
down-conversion function. The SSB Tx mixer suppresses the undesired upper sideband signal that is typically
generated under the normal mixing process. An internal band-pass filter at the SSB Tx mixer output further
reduces the undesired sideband and any spurious signals. This function eliminates the use of any external
filtering. The LO is characterized for operation in the 990-MHz to 1400-MHz range.
I/Q modulator
The modulator provides direct I/Q modulation from baseband to RF . The differential baseband I/Q input signals
also provide DC bias to the modulator. A nominal DC voltage of 1.35 V at the I and Q ports is required. Other
types of complex I/Q modulations are possible with the TRF3520, but the device is optimized to meet GSM
requirements.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
GSM RF MODULATOR/DRIVER AMPLIFIER
SLWS060A – MAY 1998
power amplifier driver output
The I/Q modulator output is fed to the power amplifier driver, which is a high-gain, low-distortion, fixed gain
amplifier. Its dif ferential output can be converted to single-ended by a simple LC impedance-matching network
and a 4:1 balun.
serial control interface
The serial control interface provides power-up and power-down capabilities for each of the functional blocks
described in the previous paragraphs.
The TRF3520 device register is manipulated using a synchronous serial data port. The timing relationships are
defined in Figure 1. One 17-bit word is clocked into a temporary holding register with the least significant bit
clocked first. The operation register is loaded with the new data residing in the temporary registers using the
rising edge of the strobe input.
The format of the control word is described in Table 1. Bits zero through two are reserved for future use. Bits
three through seven are power conservation bits. Bits eight through 16 are reserved.
Table 1. Control Word Bit Assignments
BITFUNCTIONFUNCTIONAL IF
0Reserved–
1Reserved–
2Reserved–
3Transmit oscillator and buffer amplifiers1
4Transmit mixer, LO buffer amplifier1
5Modulator1
6PA driver amplifier1
7Divide-by-two and limiter1
8Reserved–
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
transmit IF VCO VCC = 3.75 V, TA = 25°C, ZO = 100 Ω (unless otherwise noted)
PARAMETER
Frequency range141194247MHz
Output power (See Note 1)Z
Phase noise200-kHz offset–110dBc/Hz
Power-up time (See Note 2)10µs
Power-down time10µs
NOTES: 1. Measured at buffer output pin labeled TXO_SYN
2. Includes oscillator starting time. This time is measured starting at strobe transition to high; there is additional time after a reset, i.e.,
applying VCC to the circuit.
TEST
CONDITIONS
= 100 Ω–20–15dBm
load
Active mode8mA
Standby mode10µA
MINTYPMAXUNIT
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TRF3520
dBc
GSM RF MODULATOR/DRIVER AMPLIFIER
SLWS060A – MAY 1998
transmit mixer, I/Q modulator and PA driver PLO = –10 dBm, VCC = 3.75 V , TA = 25°C, ZO = 50 Ω (unless
otherwise specified)
PARAMETER
LO input frequency range10701110MHz
LO input power level–12–10–8dBm
PA driver RF output880915MHz
PA driver RF output power levelSee Note 76dBm
Unwanted TX mixer sideband suppression at 1462 to 1497 MHzLO = 1074 to 1109 MHz3545dBc
DSB IM suppressionThird orderSee Note 320dBc
Carrier suppressionSee Note 43035dBc
Sideband suppressionSee Note 43545dBc
100 kHz to 500 MHzSee Note 535
500 to 850 MHzSee Note 53032
880 to 915 MHzOffset w600 kHz (see Note 5)69
925 to 935 MHzSee Note 585
935 to 960 MHzSee Note 582
Modulator and P A driver spurious outputs
I/Q input voltage range (differential)Each differential line0.01.80V
I/Q offset5mV
I/Q common mode voltageSee Note 61.251.351.45V
I/Q input impedance (differential)See Note 810kΩ
I/Q input impedance (single–ended)See Note 810kΩ
I/Q input frequency range02MHz
Power-up time10µs
Power-down time10µs
PA driver output broadband noise
NOTES: 3. F
= 880 to 915 MHz, V
out
sideband level
4. F
= 880 to 915 MHz, V
out
with respect to desired sideband level
5. V
= 1.40 Vpp, 67.7 kHz sinewave. I & Q in quadrature-phase.
I/Q
6. The TCM4400 provides for a common-mode voltage of 1.35 ± 0.1 V or VCC/2 (software selectable)
7. Includes 1-dB loss associated with external balun
8. Specified by design.
I/Q
960 to 1000 MHzSee Note 549
1000 to 1350 MHzSee Note 53039
1350 to 1500 MHzSee Note 538
1500 to 1805 MHzSee Note 523
1805 to 1880 MHzSee Note 554
1880 to 12000 MHzSee Note 536
= 1.40 VPP, 67.7 kHz sine wave. I & Q in-phase. Intermodulation suppression with respect to desired
I/Q
= 1.40 VPP, 67.7 kHz sine wave. I & Q in quadrature-phase. Carrier and undesired sideband suppression
TEST CONDITIONSMINTYPMAXUNIT
± 10 MHz,
PA driver output =+ 6 dBm
–131dBc/Hz
PP
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
TRF3520
t
t
GSM RF MODULATOR/DRIVER AMPLIFIER
SLWS060A – MAY 1998
transmit mixer, I/Q modulator and PA driver PLO = –10 dBm, VCC = 3.75 V , TA = 25°C, ZO = 50 Ω (unless
otherwise specified) (continued)
divide-by-two V
Input frequency range141194247MHz
Output frequencyF
Output power (see Note 8)Z
DC currentActive mode10mA
DC currentStandby mode10µA
NOTE 9: Measured at buf fer output pin labeled DB2_OUT
serial interface timing requirements with VCC = 3.75 V, TA = 25°C, Z
CLOCK, DATA and STROBE input resistance10kΩ
CLOCK frequency020MHz
CLOCK input rise and fall time8ns
Data setup time before CLOCK high20ns
Strobe setup time before CLOCK high20ns
Data hold time after CLOCK high20ns
Strobe hold time after CLOCK high20ns
Strobe pulse width duration
2
REF_IN
ns
DATA
CLOCK
STROBE
PARAMETER MEASUREMENT INFORMATION
Data
Valid
D0D1D22D23
Data
Change
t
su
t
h
t
w(Low)
Clock Enabled
Shift in Data
t
w(High)
Figure 1. TRF3520 Timing Relationships
t
su
Clock Disabled
t
w(pulse)
Store Data
– V
IH
– V
IL
– V
IH
– V
– V
– V
IL
IH
IL
t
h
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TRF3520
GSM RF MODULATOR/DRIVER AMPLIFIER
SLWS060A – MAY 1998
TYPICAL CHARACTERISTICS
Typical GSM RF modulator characteristics were evaluated using a VCO frequency of 194 MHz and LO
frequency of 1094 MHz. The range of operation is specified in the document and is therefore customer specific.
The TRF3520 combines RF, IF , and digital signals. In order to obtain maximum performance, follow correct RFpwb
layout procedures.
J11
TRF3520 DEMO BOARD, EVM REV: A
TXM_LO
COPYRIGHT: TEXAS INS. 1998
P3
C31
+
P2
C13
+
C14C32
R9
J10
R11
R10
Q–
J1
J3
J5
VCO_TUNE
J2
DB2_OUT
TXO_SYN
C11
C28
C38
C10
C33
U1
C16L1C15
R13
C38
C37
C19
C36
L2
R14
C18
C17
C20R15
CR2
C21
L3
C22
CR1
C23
R16
P1
R22
C8
C34
T1
C25
C24
L5
C26
C27
C28
C39
DRV_OUT
L4
C38
J6
Figure 18. TRF3520 Application Board Layout
R17
Q+
R19
I–
R21
I+
J9
R12
J8
R18
J7
R20
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
15
TRF3520
GSM RF MODULATOR/DRIVER AMPLIFIER
SLWS060A – MAY 1998
MECHANICAL DATA
PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK
37
48
1,05
0,95
0,50
36
0,27
0,17
25
24
13
1
5,50 TYP
7,20
SQ
6,80
9,20
SQ
8,80
12
M
0,08
0,05 MIN
Seating Plane
0,13 NOM
Gage Plane
0,25
0°–7°
0,75
0,45
1,20 MAX
NOTES: A. All linear dimensions are in millimeters.
16
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0,08
4073176/B 10/96
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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