This document is the user guide for the TPS65988 Evaluation Module (TPS65988EVM). The
TPS65988EVM allows for evaluation of the TPS65988 IC as part of a stand-alone testing kit and for
development and testing of USB Type-C and Power Delivery (PD) end products. Out of the box, the
TPS65988EVM is configured to emulate a dual-port laptop computer. Both ports can be used to source or
sink power, and both are dual-role ports (DRP) but only support data as a downstream-facing port (DFP)
host. When different configurations are required to test your system, use the TPS65988 ApplicationConfiguration software tool to create a configuration or load a different configuration template (see
Figure 1). The TPS65988EVM uses a control MUX (HD3SS3412) to route DisplayPort™ (DP) and a USB
HUB (TUSB8020) to route USB signals to the appropriate port A or port A (port A/B). The control MUX
and USB HUB are connected to a SuperSpeed (SS) MUX (TUSB546) which routes the appropriate DP
lanes and USB 3.0 signals according to cable orientation and Alternate Mode selection. Figure 2 highlights
these features.
7DisplayPort™ and USB Test Setup...................................................................................... 33
8TPS65988EVM Bill of Materials .......................................................................................... 57
Trademarks
BoosterPack is a trademark of Texas Instruments.
Dell is a registered trademark of Dell Incorporated.
FTDI, Future Technology Devices International are registered trademarks of Future Technology Devices
International Limited.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
Aardvark is a trademark of Total Phase, Incorporated.
Total Phase is a registered trademark of Total Phase, Incorporated.
USB Type-C is a trademark of USB Implementers Forum.
DisplayPort is a trademark of Video Electronics Standards Association.
All other trademarks are the property of their respective owners.
2
C Address Setting ........................................................................................................ 29
This user's guide describes the TPS65988EVM. The guide consists of an introduction, setup instructions,
the EVM schematic, board layouts, component views, internal power (PWR) and ground (GND) plane
layouts, and a bill of materials (BOM).
2Information About Cautions and Warnings
This EVM contains components that can potentially be damaged by
electrostatic discharge. Always transport and store the EVM in the supplied
ESD bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, see
Electrostatic Discharge (ESD).
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CAUTION
3Items Required for Operation
The following items are required to use the TPS65988EVM:
•TPS65988 data sheet
•TPS65988EVM
•TPS65988 Application Customization Tool
•20-V barrel jack adapter or DC power supply (model # 492-BBGP)
•Passive USB Type-C™ cables
•USB Type-A to USB Micro-B cable
•USB Type-A to USB Type-B cable
•Mini-DisplayPort to DisplayPort cables
•Notebook with USB 2.0, USB 3.0, and DP capabilities
4Introduction
The TPS65988 is a stand-alone USB Type-C and Power Delivery (PD) controller providing cable plug and
orientation detection at the USB Type-C connector. Upon cable plug and orientation detection, the
TPS65988 communicates on the CC line using the USB PD protocol. When cable detection and USB PD
negotiation are complete, the TPS65988 enables the appropriate power path and configures external
multiplexers and alternate mode settings.
This user guide describes how the TPS65988EVM can be used to test DisplayPort alternate mode as well
as USB Data. This guide also contains testing procedures of DP alternate mode as well as various PD
power configurations. The EVM is customizable through the TPS65988 Configuration Tool. Additionally,
the EVM is equipped with a Future Technology Devices International®(FTDI®) board and Aardvark
connector to SPI or I2C interfaces for debugging and development.
This section describes the various EVM features and how to test these features. Schematic screen shots,
pictures, and block diagrams are provided as necessary.
5.1Switch, Push Button, Connector, and Test Point Descriptions
Components described in this section are listed with respect to the EVM from left to right and top to
bottom. Related components are listed simultaneously.
5.1.1Power Path Jumper Configuration
The TPS65988EVM allows for analysis of TPS65987D and TPS65987S platforms through the adjustment
of jumpers on J11 and J12.
Out of the box, the TPS65988EVM has jumper configuration for a TPS65988 device. With this
configuration, the two internal power paths are configured as Source paths for their respective Type-C
ports. The two external power paths are configured as Sink paths for their respective Type-C ports. When
using the TPS65988EVM, use a TPS65988 template in the TPS6598x Application Customization Tool.
Refer to Figure 3 and Figure 4 for the TPS65988 Jumper Configuration.
To use the TPS65988EVM to perform as a TPS65987D, the jumpers on J11 and J12 needs to be
adjusted. Place a jumper on J12 to short the two VBUS nodes together. In this use case, one of the
internal power paths is used as a source path and the other internal power path is used as a sink path.
The TPS65987D supports one Type-C port and contains 2 internal power paths. The TPS65988 can be
configured to act as a TPS65987D through the use of a TPS65987D Configuration Template in the
TPS6598x Application Customization Tool. In this configuration, PPHV2 is used as the Source path for the
Type-C port, it is connected to the net B-Var which is the Variable DC/DC used for Port B in the
TPS65988 configuration. PPHV1 is used for the Sink path on the TPS65987D. PPHV1 connects to the net
SYSPWR in this configuration. Refer to Figure 5 and Figure 6 for the TPS65987D Jumper Configuration.
When the TPS65988EVM is configured as a TPS65987D, only Port A is functional.
Setup
Figure 5. TPS65987D Jumper Configuration
Figure 6. TPS65987D Jumper Configuration Net Names
To emulate a TPS65987S with the TPS65988EVM, the jumpers on J11 need to be adjusted. The
TPS65987S supports one Type-C port and contains one internal power path. When using the
TPS65988EVM to emulate a TPS65987S, the internal power path (PPHV1) is used as the Source Path
and one of the external power paths is used as the sink path. The TPS65988 can be configured to act as
a TPS65987S through the use of a TPS65987S Configuration Template in the TPS6598x Application
Customization Tool. Refer to Figure 7 and Figure 8 for the TPS65987D Jumper Configuration. When the
TPS65988EVM is configured as a TPS65987S, only Port A is functional.
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10
Figure 8. TPS65987S Jumper Configuration Net Names
The DP source receptacle routes DP lanes for port A/B, AUX for port A/B, HPD for port A/B, as well as DP
port A/B select. The HD3SS3412 is used to MUX the DP source from the full-size DP receptacle to the
USB Type-C alternate mode MUX (TUSB546) for port A/B. Only one of the ports can support DP at a
time. The DP source MUX is controlled by GPIO0 that allocates the DP source signals to the appropriate
port. Figure 9 shows the DP source MUX Configuration
NOTE: Only one DP source can be used on either port A or port B at the same time.
S1 is located on the top-left corner of the EVM. This switch is a push-button that pulls the HRESET pin
(39) of the TPS65988 high when pressed. Releasing the push-button pulls HRESET low again, and the
TPS65988 goes through a soft reset, which consists of reloading firmware (FW) from RAM. If a valid
configuration is present in the RAM, the TPS65988 does not reload the configuration from the external
flash. Figure 12 highlights these features.
S6 is located on the top right corner of the EVM. This push button switch holds the SPI Miso line to GND.
This button is to be used when booting the device. If this button is pressed when the device is booting, the
TPS65988 does not load its configuration from the SPI Flash, but instead boots into a default ROM
configuration.
Setup
5.1.5S3: FTDI®Enable and Disable
The dip switch, S3, has 4 switches. The switches labeled 3.3V (switch 3) and 5V (switch 4) pass the
supply from the FTDI board micro-B receptacle from the BoosterPack header (J6) and vice versa. The
Force Enable (switch 1 and switch 2) switch controls the reset on the FTDI device. When switch 1 is
closed, the FTDI is held in reset until the TPS65988 has successfully loaded the firmware. When switch 2
is closed, the FTDI can be reset externally by pin 8 on the FTDI board header J7. By default, all switches
are opened and in the upward position. Figure 15 highlights these features.
The TPS65988EVM has a dip switch (S2) that can be used to configure the I2C addresses and BusPower
settings of the device. Switch1 through Switch3 are used to set the I2C address of the TPS65988 by
adjusting the voltage divider seen at ADCIN2. Refer to the TPS65988 datasheet to see the different I2C
address configurations. The default switch setting for Switch 1 through switch 3 is open, resulting in a
0x38 I2C address. Switch4 through Switch6 adjusts the BusPowerZ setting by adjusting the voltage divider
on ADCIN1. Refer to the TPS65988 datasheet to see the different BusPowerZ configurations. Figure 17
highlights the default switch setting of S2.
The barrel jack power connector accepts a 19-V to 20-V DC supply. A standard Dell or HP notebook
adapter (or similar adapter) provides the required power. This input provides the PP_HV power rail 19-V to
20-V for high power PD contracts up to 60 W per port or 120 W, total. An appropriate power adapter
greater than 120 W must be used for high-power PD. For example, the Dell®130-W Part Number: 492BBGP. Figure 19 highlights these features.
The TPS65988EVM is capable of requesting a power role swap when the barrel jack is connected on an
EVM that is currently bus-powered. The barrel jack voltage is sensed by a comparator, which drives
GPIO1 (BJ_DETECT) on the TPS65988. By default, the Barrel Jack Detect is not enabled. To enable
Barrel Jack Detect place R109 and refer to the TPS65988 Utilities Tool User Guide and TPS65988
Firmware User Guide. Figure 21 highlights these features.
Figure 21. Barrel Jack Detect Schematic
5.1.9USB Type B Connector (J11)
J11 is the Type-B connection to the PC for testing USB 2.0 or USB 3.0 functionality. A Type-A to Type-B
cable can be used to connect the EVM to the USB port on a computer. This connector provides the USB
data to the USB HUB on the TPS65988EVM. Figure 22 through Figure 24 highlight these features.
The TPS65988EVM has two full feature USB Type-C receptacles (port A/B) and routes VBUS, SSTX and
SSRX pairs, SBU1 and SBU2 pairs, and D+ and D– signals. The TPS65988 device can be used in selfpowered and bus-powered configurations for added flexibility. When self-powered, the EVM can provide
up to 60 W (20 V, at 3 A) of power per port via the internal high voltage power path. The EVM is also
capable of sinking 100 W (20 V, at 5 A) of power via the external power path. The internal power path is
used for sourcing power and the external power path is used for sinking power. Figure 25 and Figure 26
highlight these features.
J9, the micro-B receptacle connects the FTDI to the PC for the TPS65988 Customization GUI. Use a
standard USB micro-B to Type-A cable to make this connection. The Debug Board Enable LED turns on
when VBUS is present on the FTDI board. Figure 27 and Figure 28 highlight these features.
Use the TP13, TP8, and TP12 test points to measure the output voltage of the onboard DC/DC
converters. These DC/DC converters produce the required voltage rails for full functionality of the EVM
including power delivery, powering internal and external circuits, and so forth. These test points allow the
user to verify the system supplies on the TPS65988EVM. LDO_1V8 is internally generated for internal
circuitry. Use P3V3 to supply VIN_3V3 which then supplies LDO_3V3. Also, use LDO_3V3 as a lowpower output for external flash memory. In bus-powered conditions, or self-powered conditions, P3V3 and
LDO_3V3 are active. P3V3 has the ability to operate at 4 V to compensate for IR drop through the USB
Type-C cable. The P5V supply can operate at 4.5 V at 100% duty cycle, but it is intended to supply the 5
V at 3 A when the barrel jack or system power is connected to the EVM. P5V powers PP_CABLE for both
ports as well as the VBUS current sense IC for both ports. Figure 29 highlights these test points.
This connector matches the Total Phase®Aardvark that allows the user to access the I2C and SPI pins on
the TPS65988EVM using the SPI, I2C master, or both capabilities. Figure 30 and Figure 31 highlight
theses features.
NOTE: The FT4232 loads the I2C or SPI pins when powered. TI recommends leaving the FT4232 in
reset by having the Force Enable switches (switch 1 and switch 2) in the disabled (up)
position.
5.1.14TP10, TP11, TP15, TP16, TP17, TP18, TP9: GND Test Points
TP15, TP16, and TP9 GND Test Points are provided for attaching an oscilloscope or multi-meter. Test
Points TP10, TP11, TP17, and TP18 (circled in orange) are used for load testing. These Test Points are
connected to the board GND planes through multiple vias.Figure 32 highlights these features.
5.1.15TP1, TP2, TP3 and TP4 – CC1 and CC2 Test Points
Test points CC1 and CC2 are used to tie a PD protocol analyzer for PD BMC data or to verify the BMC
signal integrity with an oscilloscope (depending on the cable orientation). Use a multimeter or oscilloscope
to measure VCONN when an electronically marked USB Type-C cable is connected. Use these test points
to attach an external load on VCONN. Figure 33 and Figure 34 the highlight these features.
Setup
Figure 33. TP1, TP2, TP3 and TP4 – CC1 and CC2 Test Points
The VBUS test points are used to measure VBUS at each USB Type-C port A/B connector. With PD
power possibly going up to 20 V, use caution when connecting and disconnecting probes on the
TPS65988EVM. The VBUS test point is capable of drawing up to 3 A for an external load. Note that a PD
power contract with the necessary capability must be negotiated in order to draw current from the VBUS
test point. Refer to the TPS65988 Configuration Tool User Guide for configuration instructions. Figure 35
and Figure 36 highlights these features.
5.1.17TP7, TP6, and TP5: A-VAR, B-VAR, and System Power Test Points Respectively
Test point A-VAR (TP7) is the output of the variable DC/DC for port A. Test point B-VAR (TP6) is the
output of the variable DC/DC for port B. These test points are provided for attaching an oscilloscope,
multimeter, or external supply. System power (TP5) can be in the operating range of 5–20 V, any voltage
lower than 20 V decreases the sourcing power capabilities. Figure 37 highlights these features.
Setup
Figure 37. A-Var, B-Var and System Power Test Points: TP7, TP6, and TP5
These headers allow the user to probe many different signals on the TPS65988EVM. Note that some of
the header pins are not connected unless a 0-Ω option resistor is placed. Figure 38 highlights these
features.
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5.2LED Indicators Description
The EVM has multiple LEDs to notify the user what type of connection is present. The LEDs are
separated into two groups: MUX control LEDs (MXCTL0–2) and status LEDs. All LEDs are enabled with
Figure 38. BoosterPack™ Headers (J3 and J4)
general purpose I/O (GPIO); therefore, each must be enabled separately via configuration, if configuring a
26
custom image (see TPS65988 Configuration Tool User Guide). By default MXCTL0 LED is on when the
connected device supports USB3.0, MXCTL1 LED is on when DisplayPort Alternate Mode is entered.
MXCTL2 highlights the orientation of the cable. When MXCTL2 LED is on, CC2 is connected. When
MXCTL2 LED is off, CC1 is connected.
LEDs, D5 and D3, are for the variable DC/DC on port A, and port B, respectively. When powering up the
EVM, these LEDs lights up blue. They also provide a voltage discharge path for high to low PD contracts.
For higher voltage PD contracts, D5 and D3 are brighter. Figure 41 highlights these features and Table 3
summarizes the LED behavior.
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Table 2. Port B SS MUX Control LED Functions
28
LED IndicatorGPIOFunction
D20 - PA_PDO0GPIO_12PDO TT bit 0
D21 - PA_PDO1GPIO_13PDO TT bit 1
D23 - PB_PDO1GPIO_14PDO TT bit 1
The PDO LEDs in Table 4 are high, depending on which PDO is negotiated. By activating these LEDs, the
output voltage of the variable DC/DC can be changed. Table 4 summarizes the PDO LED behavior.
Table 4. PDO LED 0 and PDO LED 1 Truth Table
PDOPDO LED 1PDO LED 0R1R2Output Voltage
PDO 1 (5 V)0060.4 kΩ19.1 kΩ5.15 V
PDO 2 (9 V)0160.4 kΩ9.27 kΩ9.26 V
PDO 3 (15 V)1060.4 kΩ5.2 kΩ15.62 V
PDO 4 (20 V)1160.4 kΩ4.04 kΩ19.78 V
5.2.3S2 Switch Bank Functionality
The I2C address setting must match the configuration generated by the TPS65988 configuration tool.
Table 5 summarizes the I2C address settings. To adjust the dead battery boot behavior, the setting on
ADCIN1 can be adjusted. Table 6 summarizes the ADCIN1 settings. The specific settings for each divider
ratio is discussed in the TPS65988 datasheet.
This section discusses the pre-loaded or recovery firmware, getting started, and debugging the EVM.
6.1Powering the TPS65988EVM
The main power supply for the EVM is the barrel jack (J1), which accepts 19 V to 20 V via a barrel jack
adapter. The EVM can also be powered with an external power supply on SYS_PWR (TP5). The input
voltage can range from 5 V to 20 V, but the appropriate power profile for PP_HV should be configured in
the firmware using the configuration tool.
The EVM can also be bus-powered from the USB Type-C connector and accepts 5 V to 20 V on VBUS,
depending on the sink configuration.
6.2Firmware Configurations
Out of the box, the TPS65988EVM is configured to emulate a dual-port laptop computer. Both ports are
used to source or sink power, and both ports are data DFP. If different configurations are required to test
your system, use the TPS65988 Application Configuration GUI tool to create a configuration or load a
different configuration template.
7Connecting the EVM
7.1Connecting to Various Devices
Various USB Type-C cables can be used to connect the EVM to a legacy Type-A device, legacy Type-A
host, or USB Type-C device or host.
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7.1.1Connecting to a Legacy Type-A Device
Using a USB Type-C to Type-A cable allows for connection to a legacy USB device, such as a flash-drive.
The TPS65988 can act as a host passing the DP or USB connection by using the SS MUX and USB
HUB. Figure 42 shows how the notebook, DP and USB receptacle, TPS65988EVM, cable, and flash drive
are connected.
Using a USB Type-C cable allows for connection to USB and DP devices. When a TPS65988EVM is used
with a TPS6598x-EVM as DP source and sink boards respectively, a complete USB Type-C system can
be verified. The test setup requires a DP and USB source to provide data to the sink board. A DP monitor
and USB device can now be connected to the sink board. Note that USB and DisplayPort video quality
may degrade due to the use of multiple connectors and cables. Figure 43 highlights this feature.
NOTE: The TPS65988 can only be DP and USB 3.0 host or source.
Connecting the EVM
Figure 43. Connecting EVM to USB Type-C™ Device
Figure 44 shows how a source setup can be connected to a DP or USB data-capable device, such as a
USB Type-C or Type-A flash drive, USB Type-C to DP directly plugged in port A/B, Type-A flash drive,
USB Type-C to DP, HDMI dongle or USB Type-C docking system.
7.1.3Testing DisplayPort™ Alternate Mode and USB 2.0 and USB 3.0
The DisplayPort alternate mode can be tested with a non-USB Type-C notebook, allowing the user to
simulate a DisplayPort DFP_D (video source) or UFP_D (video sink).
7.1.3.1Required Hardware
The following hardware is required to test the DP alternate mode and USB 3.0:
•A Microsoft®Windows®PC with a USB Type-A receptacle and DisplayPort video output
– USB 2.0 or USB 3.0 Type-A to Type-B cable
– USB 2.0 or USB 3.0, or USB Type-C flash drive
– USB 2.0 Type-A to micro USB cable
•USB Type-C cable
•Monitor with DisplayPort Input
•Mini DisplayPort to DisplayPort cable or USB Type-C to DisplayPort cable
•FTDI board (used for programming the TPS695988EVM and interfacing with configuration tool)
•Dell laptop power supply (model # 492-BBGP)
Use the TPS65988EVM to test DP alternate mode as well as USB data using the default firmware. To do
so, connect a DP source from a laptop to the TPS65988EVM through the DP receptacle on the EVM.
Next, connect a USB Type-B to USB Type-A cable from the TPS65988EVM to a Windows computer. To
test DP, either connect a USB Type-C to DP cable from one of the USB Type-C ports to a DP monitor or
use a USB Type-C to USB Type-C cable to connect a TPS65988EVM (optionally, a TPS65981EVM), and
DP-EXPANSION-EVM. From the DP-EXPANSION-EVM, connect a mini-DP to DP cable to a monitor. To
test USB functionality, either connect a USB Type-C flash drive to the other USB Type-C port on the
TPS65988EVM or plug in a Type-A flash drive on the DP-EXPANSION-EVM. The monitor displays what is
present from the DP source. The flash drive enumerates on the windows PC. Table 7 explains this test
setup.
DP testing –
Connect the
EVMs as shown
in the figure in the
adjacent cell.
For
TPS65986EVM:
Make sure a DPcompliant FW
configuration is
used (for ex
configuration ID0:
0000). Note:
Barrel jack can be
used on Sink and
UFP, instead.
Refer to the
TPS6598x EVM
user guide for
more information.
Connecting the EVM
DP can optionally
be connected
from port A/B with
a USB Type-C to
DP cable.
Table 7. DisplayPort™ and USB Test Setup (continued)
Test SetupPass Criteria
To test USB Connect the
EVMs like in the
figure to the right.
For
TPS65986EVM If
USB3.0 testing is
required make
sure a DFP_D
compliant FW
configuration is
used (for ex.
configuration ID2:
0100) Note: if the
Barrel Jack is
attached to the
sink then make
sure to use a ‘sink
preferred’ dip
switch
configuration (for
ex. configuration
ID1: 1000) (refer
to TPS6598x
EVM user guide
for more info)
Table 7. DisplayPort™ and USB Test Setup (continued)
Test SetupPass Criteria
To simultaneously
test DP and USB3
connect the Barrel
Jack to the sink
and select dip
switch
configuration ID0:
0000 and confirm
DP video stream.
Then, with video
on, toggle to dip
switch
configuration ID1:
1000 All three
MUX control
LEDs on the
TPS65988EVM
should be ON.
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Connect a type C
cable from DP
and USB can
optionally be
tested with the
TPS65988EVM
setup to the right.
Table 7. DisplayPort™ and USB Test Setup (continued)
Test SetupPass Criteria
Connecting the EVM
Observe
TPS65988EVM
LEDs.
Check for video
on DP monitor
and verify USB
flash drive
enumerates on
the PC.
Verify the
voltages on the
DP source board.
Verify the
voltages on the
DP-EXPANSIONEVM sink board
(optional).
LED NameEvent MappingSource x988 LED
Status
MXCTL0USB3ON
MXCTL1DPON
MXCTL2POLON/OFF
HPDXON
Variable DC/DCXA/B ON
Successfully copy and paste a file to and from the USB flash drive. Extend the PC to
the DP monitor and play video to verify video stream.
Source Test PointTest Point NameVoltage
TP12P1V21.2 V
TP8P3V33.3 V
TP13P5V5 V
TP5SYS_PWR20 V
Sink Test PointTest Point NameVoltage
TP23.3V3.3 V
TP45V_USB5 V
TP35V5 V
TP5PP_HVVBUS
Figure 45 shows how the hardware of the EVM should be configured to test both DP and USB data
simultaneously. If video is displayed on the monitor, it is confirmed that DP alternate mode is entered.
Similarly, if the USB flash drive can be read by the attached PC, it is confirmed that USB data is
functioning properly. USB 3.0 data can be confirmed by observing LED MUX_CTRL0 in the high state.
This section discusses various debugging examples. Testing and debugging approaches on the EVM can
be applied to an actual system to help identify any issues.
7.2.1Connection Not Established
The following checks help resolve issues when connecting the EVM to another EVM or USB Type-C
device and no status LEDs are on:
•Verify that a firmware image is loaded in on the TPS65988 using the TPS65988 Configuration Tool
•Verify the CC lines are toggling for Dual-Role Port functionality (see Figure 46)
•Verify the following system supplies:
– System_3V3 and VIN_3V3: 3.3 V
– System_5V and PP_CABLE: 5 V
– Barrel jack and SYS_PWR: 20 V
– LDO_3V3: 3.3 V
– LDO_1V8: 1.8 V
•Verify that the devices connected are compatible. The following are some of the compatible
connections:
– Dual-Role Port → UFP
– Dual-Role Port → DFP
– DFP → UFP
•Verify that VBUS is reaching 5 V when connected, (see Figure 47)
Improper configurations and shorts can cause a USB Type-C PD system to constantly reset. The following
checks should be used to debug these types of issues:
•Verify that the essential power paths have the correct voltages:
– System_3V3 and System_5V
– System Power: 20 V (or the appropriate configured voltage)
•Probe VBUS, CC1, and CC2 to check for any anomalies. Figure 48 shows a successful power
contract.
•When there is a short on VBUS, the initial 5 V on VBUS is not present
•Check for a small spike on VBUS during a plug event to verify that the PP_HV or PP_EXT switch is
closed and is then opened, once an overcurrent condition is detected.
Connecting the EVM
Figure 48. USB Type-C™ Connection and PD Negotiation
Figure 51 shows the power path block, which contains the power portion of the TPS65988 and the required passives. The external power path
consists of back-to-back PMOS with RCP circuit. The internal power path is used for sourcing power and the external power path is used for
sinking power. The TPS65988 power path can provide power to VBUS or consume power from VBUS.
Figure 52 shows the power supply block, which has all of the onboard supplies generated and the comparator circuit for barrel-jack detection.
There are two variable supplies that generate 5, 9, 15, and 20 V. There are three DC/DC converters that generate 1.2, 3.3, and 5 V. The minimum
voltage for SYS_PWR is 5 V; however, this also decreases VBUS maximum power capabilities. When using a lower voltage, the comparator circuit
may have to be adjusted to trip at a lower voltage for proper barrel jack detection.
Figure 54 shows the SS MUX block for port A which connects the DP and USB signals from the DP and USB receptacle. Operating from the
system 3.3-V rail, the SS MUX is used for configurations C, D, and E from DisplayPort. Achieve configurations through GPIO or I2C. As the host,
the SS MUX is capable of USB 3.1 data rates up to 5 Gbps and DP 1.4 up to 8.1 Gbps with 2 or 4 DP lanes.
Figure 55 shows the SS MUX block for port B which connects the DP and USB signals from the DP and USB receptacle. Operating from the
system 3.3-V rail, the SS MUX is used for configurations C, D, and E from DisplayPort. Achieve configurations through GPIO or I2C. As the host,
the SS MUX is capable of USB 3.1 data rates up to 5 Gbps and DP 1.4 up to 8.1 Gbps with 2 or 4 DP lanes.
FID5, FID6
J11Connector, DC Power Jack, R/A, 3 Pos, THPower connectorJPD1135-509-7FFoxconn
J2_PA, J2_PB2Connector, Receptacle, USB Type C, R/A, SMTConnector, Receptacle, USB
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (June 2017) to A Revision ......................................................................................................... Page
•Overall rework of this user's guide for revision A from Section 4 to Section 8. ................................................... 1
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).