Texas Instruments TPS3831A09DQNR, TPS3831E16DQNR, TPS3831G12DQNR, TPS3831G18DQNR, TPS3831G33DQNR Schematic [ru]

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100

110

120

130

140

150

160

170

180

190

200

−40 −15 10 35 60 85 Temperature (°C)

Supply Current (nA)

VDD = 1.2 V VDD = 3.3 V VDD = 5.0 V VDD = 6.5 V

G001

VDD

RESET

GND

TPS383xK33

RST

Microprocessor

3.3 V

0.1 F1m

TPS3831

Only

Product Folder

Sample & Buy

Technical Documents

Tools & Software

Support & Community

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

TPS383x 150-nA, Ultralow Power, Supply Voltage Monitor

1 Features 3 Description

• Ultralow Supply Current: 150 nA (Typical)

• Operating Supply Voltage: 0.9 V to 6.5 V

• Valid Reset for VDD> 0.6 V

• Push-Pull RESET Output

• Factory-Trimmed Reset Threshold Voltages

• Temperature Range: –40°C to 85°C

• Packages: 1-mm × 1-mm X2SON or 3-Pin SOT23

2 Applications

• Portable and Battery-Powered Equipment

• Metering

• Industrial Equipment

• Cell Phones specified to have the correct output logic state for

• Glucose Monitors

• Tablets

• Wearables

The TPS3831 and TPS3839 devices (both referred to as TPS383x) are ultralow current (150 nA, typical), voltage supervisory circuits that monitor a single voltage. Both devices initiate an active-low reset signal whenever the VDDsupply voltage drops below the factory-trimmed reset threshold voltage. The reset output remains low for 200 ms (typical) after the V

voltage rises above the threshold voltage and hysteresis. These devices are designed to ignore fast transients on the VDD pin. The TPS3831 device includes a manual reset input that forces RESET low when MR is low.

The ultralow current consumption of 150 nA makes these voltage supervisors ideal for use in low-power and portable applications. The TPS383x devices are

supply voltages down to 0.6 V. The TPS383x devices feature precision factory-

trimmed threshold voltages and extremely low-power operation. The TPS3831 device is available in a 4pin, 1-mm × 1-mm (DQN) X2SON package. The TPS3839 device is available in a 3-pin SOT23 (DBZ) package or a 4-pin, 1-mm × 1-mm (DQN) X2SON package.

Device Information

PART NUMBER PACKAGE

TPS3831 X2SON (4) 1.00 mm x 1.00 mm

TPS3839

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

SOT-23 (3) 2.92 mm x 2.37 mm X2SON (4) 1.00 mm x 1.00 mm

(1)

PACKAGE SIZE

Typical Application Circuit Supply Current vs Temperature

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

(NOM)

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

www.ti.com

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Device Options....................................................... 4

6 Pin Configuration and Functions......................... 5

7 Specifications......................................................... 6

7.1 Absolute Maximum Ratings...................................... 6

7.2 ESD Ratings.............................................................. 6

7.3 Recommended Operating Conditions....................... 6

7.4 Thermal Information.................................................. 6

7.5 Electrical Characteristics........................................... 7

7.6 Timing Requirements................................................ 8

7.7 Typical Characteristics.............................................. 9

8 Detailed Description............................................ 11

8.1 Overview ................................................................. 11

8.2 Functional Block Diagram....................................... 11

8.3 Feature Description................................................. 11

8.4 Device Functional Modes........................................ 12

9 Applications and Implementation ...................... 13

9.1 Application Information............................................ 13

9.2 Typical Application .................................................. 13

10 Power Supply Recommendations ..................... 15

11 Layout................................................................... 15

11.1 Layout Guidelines ................................................. 15

11.2 Layout Example .................................................... 15

12 Device and Documentation Support ................. 16

12.1 Device Support...................................................... 16

12.2 Documentation Support ........................................ 16

12.3 Related Links ........................................................ 16

12.4 Community Resources.......................................... 16

12.5 Trademarks ........................................................... 16

12.6 Electrostatic Discharge Caution............................ 16

12.7 Glossary ................................................................ 17

13 Mechanical, Packaging, and Orderable

Information........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (February 2015) to Revision D Page

• Changed µA to nA in document title....................................................................................................................................... 1

• Added TPS3839G25 to document ......................................................................................................................................... 1

• Changed Applications section: moved Metering bullet to second in list, changed Tablets bullet, added Wearables bullet .. 1

• Changed first paragraph of Description section .................................................................................................................... 1

• Changed Device Information table: changed Package Size column heading and value of SOT-23 row ............................. 1

• Added TPS3839G25 row to Device Options table ................................................................................................................ 4

• Changed Thermal Information table ...................................................................................................................................... 6

• Changed V

IT–

and V

parameters in Electrical Characteristics table: changed test conditions, added TPS3839G25 rows 7

hys

Changes from Revision B (April 2013) to Revision C Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

• Changed title of data sheet ................................................................................................................................................... 1

• Changed Operating Supply Voltage bullet from 0.6 V to 0.9 V.............................................................................................. 1

• Changed last sentence of Description section ...................................................................................................................... 1

• Changed front page figure ..................................................................................................................................................... 1

• Added MR parameter to Absolute Maximum Ratings ........................................................................................................... 6

• Changed condition statement for Electrical Characteristics .................................................................................................. 7

• Changed V

parameter symbol to V

(VO)

............................................................................................................................. 7

POR

• Changed Figure 1................................................................................................................................................................... 8

• Changed Functional Block Diagram; added hysteresis symbol to op amp.......................................................................... 11

• Deleted Typical Application Circuit figure............................................................................................................................. 13

TPS3831, TPS3839

www.ti.com

Changes from Revision A (September 2012) to Revision B Page

• Changed VDDtest conditions for high-level output voltage parameter................................................................................... 7

Changes from Original (June 2012) to Revision A Page

• Changed data sheet status from product preview to production data.................................................................................... 1

SBVS193D –JUNE 2012–REVISED JULY 2015

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

5 Device Options

www.ti.com

PRODUCT PACKAGE-LEAD

TPS3831A09 0.9 X2SON-4 DQN TPS3831G12 1.1 X2SON-4 DQN TPS3831E16 1.52 X2SON-4 DQN TPS3831G18 1.67 X2SON-4 DQN TPS3831L30 2.63 X2SON-4 DQN TPS3831K33 2.93 X2SON-4 DQN TPS3831G33 3.08 X2SON-4 DQN TPS3831K50 4.38 X2SON-4 DQN

TPS3839A09 0.9

TPS3839G12 1.1

TPS3839E16 1.52

TPS3839G18 1.67

TPS3839G25 2.325 SOT23-3 DBZ

TPS3839L30 2.63

TPS3839K33 2.93

TPS3839G33 3.08

TPS3839K50 4.38

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

THRESHOLD PACKAGE VOLTAGE (V) DESIGNATOR

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

(1)

GND

RESET

VDD

GND

RESET

Thermal

Pad

VDD

GND

RESET

Thermal

Pad

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6 Pin Configuration and Functions

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

TPS3831 DQN Package

1-mm × 1-mm X2SON

Top View

TPS3839 DQN Package

1-mm × 1-mm X2SON

Top View

TPS3839 DBZ Package

SOT23-3

Top View

Pin Functions

NO.

NAME

TPS3839 TPS3839 TPS3831

(SOT23-3) (X2SON) (X2SON)

GND 1 3 3 — Ground

MR N/A N/A 2 I After the MR pin is deasserted, the RESET output deasserts after the

NC N/A 2 N/A — No internal connection.

RESET 2 1 1 O

Thermal pad N/A Available Available — VDD 3 4 4 I Supply voltage

I/O DESCRIPTION

Manual reset. Pull this pin to a logic low to assert the RESET output. reset delay (td) elapses.

Active-low reset output. RESET has a push-pull output drive and is capable of directly driving input pins. RESET is low as long as V remains below the factory threshold voltage, and until the delay time (td) elapses after VDDrises above the threshold voltage.

Connect to ground or to a floating copper plane for mechanical stability.

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted

Voltage

Current RESET pin –10 10 mA

Temperature

(2)

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature.

VDD, RESET –0.3 7 V MR –0.3 VDD+ 0.3 V

Operating ambient, T Storage, T

stg

7.2 ESD Ratings

(ESD)

Electrostatic discharge V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 Charged device model (CDM), per JEDEC specification JESD22-C101

(1)

MIN MAX UNIT

–40 85 –65 150

°C

VALUE UNIT

(1)

(2)

±2000

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

RESET

Input supply voltage 0.9 6.5 V Manual reset pin voltage 0 V

V RESET pin voltage 0 6.5 V RESET pin current 0 8 mA

7.4 Thermal Information

TPS3839

THERMAL METRIC

(1)

DBZ (SOT23-3) DQN (X2SON)

3 PINS 4 PINS

θJA

θJC(top)

θJB

θJC(bot)

Junction-to-ambient thermal resistance 346.6 216.1 °C/W Junction-to-case (top) thermal resistance 124.4 161.7 °C/W Junction-to-board thermal resistance 78.9 162.1 °C/W Junction-to-top characterization parameter 11.5 5.1 °C/W Junction-to-board characterization parameter 77.3 161.7 °C/W Junction-to-case (bottom) thermal resistance N/A 123.0 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TPS3831,

TPS3839

UNIT

TPS3831, TPS3839

www.ti.com

SBVS193D –JUNE 2012–REVISED JULY 2015

7.5 Electrical Characteristics

At TA= –40°C to 85°C, 0.9 V < VDD< 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

V V I

V V R

Input supply voltage 0.9 6.5 V

Minimum VDDvoltage for valid output IOL= 1 µA 0.6 V

(POR)

Supply current (into VDD pin) Output not connected 150 500 nA

VDD= 0.9 V to 1.2 V, IOL= 120 µA 0.4

Low-level output voltage (RESET pin) VDD= 1.2 V to 2.8 V, IOL= 0.5 mA 0.4 V

VDD= 2.8 V to 6.5 V, IOL= 2 mA 0.4 VDD= 0.9 V to 1.2 V, IOH= –50 µA VDD– 0.4

High-level output voltage (RESET pin) VDD= 1.2 V to 3.3 V, IOH= –0.5 mA VDD– 0.4 V

VDD= 3.3 V to 6.5 V, IOH= –2 mA VDD– 0.4

Low-level input voltage (MR pin) 0.3V

High-level input voltage (MR pin) 0.7V

MR pin pullup resistance 10 20 30 kΩ

Negative-going input threshold accuracy TA= 25°C ±1%

TPS383xA09 0.874 0.9 0.914 TPS383xG12 1.073 1.1 1.117 TPS383xE16 1.482 1.52 1.543 TPS383xG18 1.628 1.67 1.695

Negative-going threshold voltage TPS3839G25 2.267 2.325 2.360 V

IT–

TPS383xL30 2.564 2.63 2.669 TPS383xK33 2.857 2.93 2.974 TPS383xG33 3.003 3.08 3.126 TPS383xK50 4.271 4.38 4.446 TPS383xA09 54 TPS383xG12 11 TPS383xE16 15 TPS383xG18 17

Hysteresis voltage TPS383xL30 26 mV

hys

TPS3839G25 23 TPS383xK33 29 TPS383xG33 31 TPS383xK50 44

V V

Time

IT-

+ V

HYS

IT-

0.7V

0.3V

VDD

0.6 V

RESET

td= Reset Delay

= Undefined State

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

7.6 Timing Requirements

At TA= –40°C to 85°C, 0.9 V < VDD< 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.

MIN TYP MAX UNIT

PD_VDD

PD_MR

RESET delay time (power-up delay) 120 200 350 ms Propagation delay, VDDfalling (power-down delay) 20 µs Propagation delay from MR low to RESET low 46 ns

www.ti.com

Figure 1. MR and VDD Reset Timing

0.5

1.5

2.5

3.5

0 2 4 6 8 10

IOH (mA)

(V)

TA = −40°C TA = 0°C TA = +25°C TA = +85°C

VDD = 3.3 V

G005

2.5

3.5

0 2 4 6 8 10 12

IOH (mA)

(V)

TA = −40°C TA = 0°C TA = +25°C TA = +85°C

VDD =4.0 V

G006

−1

−0.8

−0.6

−0.4

−0.2

0.2

−40 −15 10 35 60 85 Temperature (°C)

Change in V

IT–

(%)

TPS3839A09 TPS3839K50

G003

0.8

1.2

1.4

1.6

1.8

0 0.5 1 1.5 2 2.5 3 3.5

IOH (mA)

(V)

TA = −40°C TA = 0°C TA = +25°C TA = +85°C

VDD = 1.8 V

G004

100

110

120

130

140

150

160

170

180

190

200

−40 −15 10 35 60 85 Temperature (°C)

Supply Current (nA)

VDD = 1.2 V VDD = 3.3 V VDD = 5.0 V VDD = 6.5 V

G001

180

190

200

210

220

−40 −15 10 35 60 85 Temperature (°C)

Reset Delay Time (ms)

TPS3839K33

G002

www.ti.com

7.7 Typical Characteristics

At TA= 25°C and C1= 0.1 µF, unless otherwise noted.

Figure 2. Supply Current vs Temperature Figure 3. Reset Delay vs Temperature

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

Figure 4. Threshold Voltage vs Temperature Figure 5. VOHvs IOHand Temperature for VDD= 1.8 V

Figure 6. VOHvs IOHand Temperature for VDD= 3.3 V Figure 7. VOHvs IOHand Temperature for VDD= 4.0 V

0.2

0.4

0.6

0.8

1.2

1.4

0 2 4 6 8 10

IOL (mA)

(V)

TA = −40°C TA = 0°C TA = +25°C TA = +85°C

VDD = 4.0 V

G009

0 5 10 15 20 25 30 35

VDD voltage drop below V

IT−

(%)

Minimum Pulse Duration Trigger Reset (µs)

Reset Occurs Above Line

G010

0.2

0.4

0.6

0.8

1.2

1.4

1.6

0 1 2 3 4 5

IOL (mA)

(V)

TA = −40°C TA = 0°C TA = +25°C TA = +25°C

VDD = 1.8 V

G007

0.2

0.4

0.6

0.8

1.2

1.4

1.6

0 2 4 6 8 10

IOL (mA)

(V)

TA = −40°C TA = 0°C TA = +25°C TA = +85°C

VDD = 3.3 V

G008

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

Typical Characteristics (continued)

At TA= 25°C and C1= 0.1 µF, unless otherwise noted.

Figure 8. VOLvs IOLand Temperature for VDD= 1.8 V Figure 9. VOLvs IOLand Temperature for VDD= 3.3 V

www.ti.com

Figure 10. VOLvs IOLand Temperature for VDD= 4.0 V Figure 11. Maximum Pulse Duration vs Percent of

Threshold Overdrive

Transient

Duration

(t )

Transient Amplitude

IT-

Delay

REF

VDD

GND

RESET

( Only)TPS3831

VDD

TPS3831, TPS3839

www.ti.com

SBVS193D –JUNE 2012–REVISED JULY 2015

8 Detailed Description

8.1 Overview

The TPS3831 and TPS3839 are ultralow current voltage supervisory circuits that monitor the input supply voltage of these devices. Both devices assert an active-low reset whenever the VDDsupply voltage drops below the negative-going threshold voltage (V 200 ms after the VDDvoltage rises above the positive-going threshold voltage (V designed to ignore fast transients on the VDD pin.

The TPS3831 device includes a manual reset input (MR) that can be used to force the RESET signal low, even if the supply voltage is above V

IT–

8.2 Functional Block Diagram

). The output, RESET, remains asserted for approximately

IT–

+ V

). These devices are

hys

8.3 Feature Description

8.3.1 VDD Transient Rejection

The TPS383x (TPS3831 and TPS3839) devices have built-in rejection of fast transients on the VDD pin. Transient rejection depends on both the duration and amplitude of the transient. Transient amplitude is measured from the bottom of the transient to the negative threshold voltage (V

Figure 12. Voltage Transient Measurement

) of the device, as shown in Figure 12.

IT–

VDD

GND

TPS3831

20 kW

0 5 10 15 20 25 30 35

VDD voltage drop below V

IT−

(%)

Minimum Pulse Duration Trigger Reset (µs)

Reset Occurs Above Line

G010

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

www.ti.com

Feature Description (continued)

Figure 13 shows the relationship between the transient amplitude and duration required to trigger a reset. Any

combination of duration and amplitude greater than that shown in Figure 13 generates a reset signal.

Figure 13. TPS3839 Transient Rejection

8.3.2 Manual Reset (MR) Input (TPS3831 Only)

The manual reset (MR) input allows a processor, or other logic devices, to initiate a reset (TPS3831 device only). A logic low (0.3 VDD) on MR causes RESET to assert. After MR returns to a logic high and VDDis greater than the threshold voltage, RESET is deasserted after the reset delay time, td, elapses. MR is internally tied to VDD with a 20-kΩ resistor; therefore, this pin can be left unconnected if MR is not used. If a logic signal driving MR does not go fully to VDD, some additional current draws into VDD as a result of the internal pullup resistor on MR. To minimize current draw, a logic-level FET can be used, as shown in Figure 14.

Figure 14. Using a Logic-Level FET to Minimize Current Draw

8.4 Device Functional Modes

8.4.1 Normal Operation (VDD> V

When the voltage on VDD is greater than V relative to V

8.4.2 Below V

When the voltage on VDD is less than V output is asserted.

8.4.3 Below Power-On Reset (VDD< V

When the voltage on VDD is lower than the power-on reset voltage (V not rely on the RESET output for proper device function under this condition.

IT–

DD(min)(V(POR)

DD(min)

< VDD< V

DD(min)

(POR)

)

, the RESET output corresponds to the voltage on the VDD pin

DD(min)

but greater than the power-on reset voltage (V

), the RESET output is undefined. Do

(POR)

), the RESET

(POR)

4.7 PH

10 PF

5 k:

VIN VOUT

GND

One-Cell

Alkaline

VDD

GND

RESET

TPS3839A09

3.3 V at 40 mA

TPS61261

TPS3831, TPS3839

www.ti.com

SBVS193D –JUNE 2012–REVISED JULY 2015

9 Applications and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

Low operating voltage and threshold options make the TPS383x devices well-suited for monitoring single-cell, alkaline-battery applications.

9.2 Typical Application

Figure 15 shows the TPS3839A09 used to disable a boost converter when the cell voltage reaches 0.9 V, which

is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage reaches 0.9 V, the

TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a low-current shutdown

state. The combination of the TPS3839 and TPS61261 devices consumes only 250 nA (typical) from the discharged battery.

Figure 15. Disabled Boost Converter

9.2.1 Design Requirements

Table 1 lists the design requirements for Figure 15.

Table 1. Design Requirements and Results

DESIGN REQUIREMENTS

Input voltage range of 0.9 V to 1.7 V 0.9 V to 6.5 V 0.8 V to 4 V 0.9 V to 4 V Shutdown current < 3 µA 0.5 μA (maximum) 1.5 μA (maximum) 2.0 μA (maximum) Output voltage of 3.3 V N/A 3.3 V 3.3 V Output current of 50 mA N/A 100 mA 100 mA Switching frequency ≥ 1 MHz N/A 2.5 MHz 2.5 MHz

TPS3839A09 TPS61261 COMBINED

DESIGN RESULT

100

110

120

130

140

150

160

170

180

190

200

−40 −15 10 35 60 85 Temperature (°C)

Supply Current (nA)

VDD = 1.2 V VDD = 3.3 V VDD = 5.0 V VDD = 6.5 V

G001

RESET

GND

TPS3839K33

VDD

RST

Microprocessor

3.3 V

47 k:

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

www.ti.com

9.2.2 Detailed Design Procedure

9.2.2.1 Input Capacitor

The TPS383x devices use a unique sampling scheme to maintain an extremely low average quiescent current of 150 nA. The TPS383x devices typically consume only approximately 100 nA of dc current. However, this current rises to approximately 15 µA for about 200 µs when the TPS383x devices sample the input voltage. If the source impedance back to the supply voltage is high, then the additional current during sampling may trigger a false reset as a result of the apparent voltage drop at VDD. For applications with high-impedance input supplies (including trace impedance), TI recommends adding a small 0.1-µF bypass capacitor near the TPS3839 VDD pin. This bypass capacitor effectively keeps the average current at 150 nA and reduces the effects of a highimpedance voltage source.

9.2.2.2 Bidirectional Reset Pins

Some devices have bidirectional reset pins that act both as an input and an output. For applications where the TPS383x devices drive a bidirectional reset pin, place a series resistor between the TPS383x output and the reset pin to protect against excessive current flow when both the TPS383x devices and the reset pin attempt to drive the reset line. Figure 16 shows the connection of the TPS3839K33 to a bidirectional reset pin of a microcontroller using a series resistor.

9.2.3 Application Curve

Figure 16. Connection to a Bidirectional Reset Pin

Figure 17. Supply Current vs Temperature

Input

Supply

RESET

Flag

VDD

TPS3831, TPS3839

www.ti.com

SBVS193D –JUNE 2012–REVISED JULY 2015

10 Power Supply Recommendations

These devices are designed to operate from an input supply with a voltage range between 0.9 V and 6.5 V. Use a low-impedance power supply to eliminate inaccuracies caused by the extra current during the input-voltage sampling discussed in the Input Capacitor section.

11 Layout

11.1 Layout Guidelines

Make sure the connection to the VDD pin is low impedance and able to carry 15 µA without a significant voltage drop. Place a 0.1-µF bypass capacitor near the VDD pin if the 15-µA sampling current causes too much voltage droop.

11.2 Layout Example

Figure 18. Recommended Layout

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

www.ti.com

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

12.1.1.1 Evaluation Modules

Two evaluation modules (EVMs) are available to assist in the initial circuit performance evaluation using the TPS3831 and TPS3839. The TPS3831G33EVM-187 and TPS3839K33EVM-112 evaluation modules (and related user's guides) can be requested at the TI website through the product folders or purchased directly from the TI eStore.

12.1.1.2 Spice Models

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. SPICE models for the TPS3831 and TPS3839 devices are available through each of the product folders under Tools & Software.

12.2 Documentation Support

12.2.1 Related Documentation

• TPS3831G33EVM-187 User's Guide, SLVU774

• TPS3839K33EVM-112 User's Guide, SLVU758.

• TPS61261 Data Sheet, SLVSA99

12.3 Related Links

Table 2 lists quick access links. Categories include technical documents, support and community resources,

tools and software, and quick access to sample or buy.

Table 2. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY

TPS3831 Click here Click here Click here Click here Click here TPS3839 Click here Click here Click here Click here Click here

TECHNICAL TOOLS & SUPPORT &

DOCUMENTS SOFTWARE COMMUNITY

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

TPS3831, TPS3839

www.ti.com

SBVS193D –JUNE 2012–REVISED JULY 2015

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

TPS3831A09DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831A09DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3831E16DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831E16DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3831G12DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831G12DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3831G18DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831G18DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3831G33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831G33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3831K33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831K33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3831K50DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831K50DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3831L30DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3831L30DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3839A09DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

CU NIPDAU Level-1-260C-UNLIM -40 to 85 A3

CU NIPDAU Level-1-260C-UNLIM -40 to 85 A5

CU NIPDAU Level-1-260C-UNLIM -40 to 85 A4

CU NIPDAU Level-1-260C-UNLIM -40 to 85 A6

CU NIPDAU Level-1-260C-UNLIM -40 to 85 A7

CU NIPDAU Level-1-260C-UNLIM -40 to 85 A8

CU NIPDAU Level-1-260C-UNLIM -40 to 85 A9

CU NIPDAU Level-1-260C-UNLIM -40 to 85 BA

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZDI

9-Jul-2015

Samples

(4/5)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

Package Type Package

(1)

Drawing

Pins Package

Qty

TPS3839A09DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

TPS3839A09DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3839A09DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3839E16DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

TPS3839E16DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

TPS3839E16DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3839E16DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3839G12DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

TPS3839G12DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

TPS3839G12DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3839G12DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3839G18DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

TPS3839G18DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

TPS3839G18DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

TPS3839G18DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

TPS3839G25DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

TPS3839G25DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

TPS3839G33DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

Eco Plan

(2)

& no Sb/Br)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZDI

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZJ

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZCI

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZK

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZBI

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZE

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZAI

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZL

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZNI

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYZI

9-Jul-2015

Samples

(4/5)

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

TPS3839G33DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYZI

& no Sb/Br)

TPS3839G33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZG

& no Sb/Br)

TPS3839G33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZG

& no Sb/Br)

TPS3839K33DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYYI

& no Sb/Br)

TPS3839K33DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYYI

& no Sb/Br)

TPS3839K33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZF

& no Sb/Br)

TPS3839K33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZF

& no Sb/Br)

TPS3839K50DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYXI

& no Sb/Br)

TPS3839K50DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYXI

& no Sb/Br)

TPS3839K50DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZH

& no Sb/Br)

TPS3839K50DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZH

& no Sb/Br)

TPS3839L30DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYWI

& no Sb/Br)

TPS3839L30DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYWI

& no Sb/Br)

TPS3839L30DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZI

& no Sb/Br)

TPS3839L30DQNT ACTIVE X2SON DQN 4 250 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZI

& no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

9-Jul-2015

Op Temp (°C) Device Marking

(4/5)

Samples

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

9-Jul-2015

Addendum-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com 9-Jul-2015

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

TPS3831A09DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831A09DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831E16DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3831E16DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831G12DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831G12DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831G18DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831G18DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831G33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831G33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831K33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3831K33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831K50DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3831K50DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3831L30DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3831L30DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839A09DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839A09DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 9-Jul-2015

Device Package

Type

TPS3839A09DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839A09DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839E16DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839E16DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839E16DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839E16DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839G12DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839G12DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TPS3839G12DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3839G12DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839G18DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839G18DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TPS3839G18DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3839G18DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839G25DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839G25DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839G33DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839G33DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TPS3839G33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3839G33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839K33DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839K33DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839K33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839K33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839K50DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839K50DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839K50DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839K50DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

TPS3839L30DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

TPS3839L30DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TPS3839L30DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3839L30DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 9-Jul-2015

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS3831A09DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3831A09DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3831E16DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3831E16DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3831G12DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TPS3831G12DQNT X2SON DQN 4 250 184.0 184.0 19.0 TPS3831G18DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TPS3831G18DQNT X2SON DQN 4 250 184.0 184.0 19.0 TPS3831G33DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TPS3831G33DQNT X2SON DQN 4 250 184.0 184.0 19.0 TPS3831K33DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3831K33DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3831K50DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3831K50DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3831L30DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3831L30DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3839A09DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839A09DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839A09DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3839A09DQNT X2SON DQN 4 250 184.0 184.0 19.0

Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com 9-Jul-2015

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS3839E16DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839E16DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839E16DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3839E16DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3839G12DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839G12DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839G12DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TPS3839G12DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3839G18DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839G18DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839G18DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TPS3839G18DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3839G25DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839G25DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839G33DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839G33DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839G33DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TPS3839G33DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3839K33DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839K33DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839K33DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3839K33DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3839K50DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839K50DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0

TPS3839K50DQNR X2SON DQN 4 3000 184.0 184.0 19.0

TPS3839K50DQNT X2SON DQN 4 250 184.0 184.0 19.0

TPS3839L30DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0

TPS3839L30DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TPS3839L30DQNR X2SON DQN 4 3000 184.0 184.0 19.0 TPS3839L30DQNT X2SON DQN 4 250 184.0 184.0 19.0

Pack Materials-Page 4

IMPORTANT NOTICE

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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

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Texas Instruments TPS3831A09DQNR, TPS3831E16DQNR, TPS3831G12DQNR, TPS3831G18DQNR, TPS3831G33DQNR Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Features 3 Description

2 Applications

Table of Contents

4 Revision History

5 Device Options

6 Pin Configuration and Functions

7 Specifications

7.1 Absolute Maximum Ratings

7.2 ESD Ratings

7.3 Recommended Operating Conditions

7.4 Thermal Information

7.5 Electrical Characteristics

7.6 Timing Requirements

7.7 Typical Characteristics

8 Detailed Description

8.1 Overview

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 VDD Transient Rejection

8.3.2 Manual Reset (MR) Input (TPS3831 Only)

8.4 Device Functional Modes

9 Applications and Implementation

9.1 Application Information

9.2 Typical Application

9.2.1 Design Requirements

9.2.2 Detailed Design Procedure

9.2.2.1 Input Capacitor

9.2.2.2 Bidirectional Reset Pins

9.2.3 Application Curve

10 Power Supply Recommendations

11 Layout

11.1 Layout Guidelines

11.2 Layout Example

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

12.1.1.1 Evaluation Modules

12.1.1.2 Spice Models

12.2 Documentation Support

12.2.1 Related Documentation

12.3 Related Links

12.4 Community Resources

12.5 Trademarks

12.6 Electrostatic Discharge Caution

12.7 Glossary

13 Mechanical, Packaging, and Orderable Information