•TPS2121 Supports external voltage reference
(CP2) with an accuracy of <1%
•Output current limit (ILM):
– TPS2120: 1 A – 3 A
– TPS2121: 1 A – 4.5 A
•Channel status indication (ST)
•Adjustable input settling time (SS)
•Adjustable output soft start time (SS)
•TPS2121 Fast output switchover (tSW): 5 µs
(typical)
•Low Iq from enabled input: 200 µA (typical)
•Low Iq from disabled input: 10 µA (Typical)
•Manual input source selection (OVx)
•Over temperature protection (OTP)
2 Applications
•Backup and standby power
•Input source selection
•Multiple battery management
•EPOS and barcode scanners
•Building automation and surveillance
•Tracking and telematics
3 Description
The TPS212x devices are Dual-Input, Single-Output
(DISO) Power Multiplexer (MUX) that are well suited
for a variety of systems having multiple power
sources. The devices will Automatically Detect,
Select, and Seamlessly Transition between available
inputs.
Priority can be automatically given to the highest
input voltage or manually assigned to a lower voltage
input to support both ORing and Source Selection
operations. A priority voltage supervisor is used to
select an input source.
An Ideal Diode operation is used to seamlessly
transition between input sources. During switchover,
the voltage drop is controlled to block reverse current
before it happens and provide uninterrupted power to
the load with minimal hold-up capacitance.
Current limiting is used during startup and switchover
to protect against overcurrent events, and also
protects the device during normal operation. The
output current limit can be adjusted with a single
external resistor.
The TPS212x devices are available in WCSP and
small VQFN-HR package options characterized for
operation for a temperature range of –40°C to 125°C.
Device Information
PART NUMBERPACKAGE
TPS2120WCSP (20)1.5 mm x 2.0 mm
TPS2121VQFN-HR (12)2.0 mm x 2.5 mm
(1)For all available packages, see the orderable addendum at
the end of the data sheet.
(1)
BODY SIZE (NOM)
Typical Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
over operating free-air temperature range (unless otherwise noted)
V
, V
,
, V
,
IN2
Maximum Power Pin Voltage
Maximum Overvoltage Pin VoltageOV1, OV2-0.36V
Maximum Control Pin VoltagePRI, SEL-0.36V
SEL
Maximum Control Pin VoltageST-0.36V
Maximum Output CurrentOUTInternally Limited
Maximum Junction TemperatureInternally Limited
Storage temperature-65150°C
IN1
V
OUT
V
OV1
V
OV2
V
PRI
V
ST
I
OUT
T
J, MAX
T
STG
(1)Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/
V
ESD
Electrostatic discharge
JEDEC JS-001,
Charged device model (CDM), per JEDEC
specification JESD22-C101,
(1)
(1)
PinsMINMAXUNIT
IN1, IN2,
OUT
-0.324V
PinsVALUEUNIT
All±2000
(2)
All±500
V
(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PinsMINMAXUNIT
V
, V
IN1
V
OUT
V
OV1
V
OV2
V
, V
PRI
V
ST
R
ST
R
ILM
V
SS
I
, I
IN1
I
, I
IN1
T
J
Input Voltage Range
IN2
Output Voltage RangeOUT022V
,
Overvoltage Pin VoltageOV1, OV205.5V
Control Pin VoltagePRI, SEL05.5V
SEL
Control Pin VoltageST05.5V
Status Pin Pull Up ResistanceST620kΩ
Current Limit ResistanceILM18100kΩ
SS Pin Output VoltageSS4V
TPS2120 Continuous Input CurrentIN1, IN23A
IN2
TPS2121 Continuous Input CurrentIN1, IN24.5A
IN2
Junction temperature--40125°C
(1)See Power Supply Recommendations Section for more Details
over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONST
R
= 31.6kΩ-40°C to 125°C33.54A
ILM
R
= 46.4kΩ-40°C to 125°C22.53A
Output Current Limit (TPS2120)
(2)
I
LM
Output Current Limit (TPS2121)
(3)
t
LM
Current Limit Response TimeOutput Steady State-40°C to 125°C250µs
CONTROL PINS (PRI, SEL, OV1, OV2)
V
V
I
LK, x
Internal Voltage Reference
REF, x
Comparator Offset Voltage
OFST
(TPS2121 only)
Pin Leakage Current
STATUS INDICATION PIN (ST)
I
LK, ST
t
ST
Pin LeakageVST = 0 V to 5.5 V-40°C to 125°C-0.10.1µA
Status DelayL to H-40°C to 125°C1µs
FAST REVERSE CURRENT BLOCKING (RCB)
I
RCB
V
t
RCB
Fast Reverse Current Detection
Threshold
RCB Release VoltageV
RCB
Fast Reverse Current Blocking
Response Time
THERMAL SHUTDOWN (TSD)
T
Thermal Shutdown
SD
ILM
R
= 85kΩ-40°C to 125°C11.52A
ILM
R
< 1kΩ-40°C to 125°C1.52.53.5A
ILM
R
= 18.7kΩ-40°C to 125°C4.65.25.8A
ILM
R
= 22.1kΩ-40°C to 125°C44.55A
ILM
R
= 29.8kΩ-40°C to 125°C33.54A
ILM
R
= 44.2kΩ-40°C to 125°C22.53A
ILM
R
= 80kΩ-40°C to 125°C11.52A
ILM
R
< 1kΩ-40°C to 125°C1.52.53.5A
ILM
V
, V
PR1
CP2, VOV1
V
, V
PR1
CP2, VOV1
V
> V
PR1
V
> V
CP2
V
, V
PR1
CP2, VOV1
REF
REF
, V
Rising-40°C to 125°C1.011.061.1V
OV2
, V
Falling-40°C to 125°C0.991.041.09V
OV2
, V
= 0 V to 5.5
OV2
V
V
> V
OUT
INx
> V
OUT
INx
ShutdownRising160°C
RecoveryFalling150°C
www.ti.com
J
MINTYPMAX UNIT
-40°C to 125°C52040mV
-40°C to 125°C-0.10.1µA
-40°C to 125°C0.212A
-40°C to 125°C02550mV
-40°C to 125°C10µs
(1)When PR1 < V
not to exceed I
, CP2 < V
REF
Q,INx
, and |V
.
REF
| < 1V, Quiescent current can be drawn from both IN1 and IN2 with combined current
IN1-VIN2
(2)The current limit can be measured by forcing a voltage differential from VIN to VOUT. This value must be at least 200mV greater than
the voltage drop across the device at the current limit threshold (ILM x R
voltage drop of (1.5A x 100mΩ + 200mV) = 350mV from VIN to VOUT for a current limit setting of 1.5A (typical).
). For example, the TPS2121 would need a minimum
ON(MAX)
(3)For more information on device behavior during short circuit conditions, see Section 9.3.3.
The TPS212x devices are Dual-Input, Single-Output (DISO) Power Multiplexer (MUX) that are well suited for a
variety of systems having multiple power sources. The devices will automatically detect, select, and seamlessly
transition between available inputs. Priority can be automatically given to the highest input voltage or manually
assigned to a lower voltage input to support both ORing and Source Selection operations. A priority voltage
supervisor is used to select an input source.
An Ideal Diode operation is used to seamlessly transition between input sources. During switchover, the voltage
drop is controlled to block reverse current before it happens and provide uninterrupted power to the load with
minimal hold-up capacitance. Active current limiting is used during startup and switchover to protect against
overcurrent, and also protects the device during normal operation. The output current limit can be adjusted with
a single external resistor.
9.2 Functional Block Diagram
The below figures show the block diagrams for the TPS2120 and TPS2121. The TPS2120 has the SEL pin,
while the TPS2121 has the CP2 pin and supports fast switchover.
This section describes the different features of the TPS212x power mux device.
9.3.1 Input Settling Time and Output Soft Start Control (SS)
The TPS212x will automatically select the first source to become valid (INx >UV and INx <OV). The external
capacitor (CSS) will then be used as a timer to wait for the input to finish setting (tSETx). When the settling timer
has expired, CSS will continue to charge and set the output slew rate (SRON) for a soft start. After the total turn
on time (tONx), soft start will not be used again for INx until it ceases to be valid (INx <UV or INx >OV).
When the second source becomes valid (INy >UV and INy <OV), the external capacitor (Css) will be used again
for a second settling time (tSETy). After tSETy, the TPS212x will decide whether to continue sourcing the first
source, or switchover to the second source. If the second source is selected at the end of tSETy, then CSS will
be reused to set the output slew rate (SRON) for a second soft start. After the total turn on time (tONy), soft start
will not be used again for INy until it ceases to be valid (INy <UV or INy >OV).
If INy becomes valid before the end of tONx, tSETy will be delayed and start after tONx has ended.
If INy is not selected during tSETy, a second soft start will not take place, skipping tONy, and CSS will be retired
until one of the inputs ceases to be valid.
9.3.1.1 Slew Rate vs. CSS Capacitor
Table 9-1 shows the estimated slew rate across CSS capacitance and VIN.
Table 9-1. Slew Rate vs. CSS Capacitor
TPS2120, TPS2121
CSS CAPACITORVIN = 5 VVIN = 12 VVIN = 20 VUNITS
100 nF780800880V/s
1 uF889292V/s
10 uF8.89.610.4V/s
9.3.2 Active Current Limiting (ILM)
The load current is monitored at all times. When the load current exceed the current limit trip point ILM
programmed by RILM resistor, the device regulates the current within t
. The following equations can be used
ILM
to find the RILM value for a desired current limit, where RILM is in kΩ and between 18 kΩ to 100 kΩ.
TPS2120:
TPS2121:
(1)
(2)
During current regulation, the output voltage will drop resulting in increased device power dissipation. If the
device junction temperature (TJ) reaches the thermal shutdown threshold (TSD) the internal FETs are turned off.
After cooling down, the device will automatically restart.
During a transient short circuit event, the current through the device increases very rapidly. As the current-limit
amplifier cannot respond quickly to this event due to its limited bandwidth, the device incorporates a fast-trip
overcurrent protection (OCP) comparator, with a threshold I
within 1 µs, when the current through internal FET IOUT exceeds I
about 2.4x of the programmed current limit I
= 2.4 × ILM. The OCP circuit holds the internal FET off for about
OCP
. This comparator shuts down the pass device
OCP
(I
> I
OCP
OUT
). The trip threshold is set to
OCP
25 ms, after which the device turns back on. If the short is still present then the current-limit loop will regulate the
output current to ILM and behave in a manner similar to a power up into a short.
9.3.4 Thermal Protection (TSD)
The TPS212x devices have built-in absolute thermal shutdown and relative thermal shutdown to ensure
maximum reliability of the power mux. The absolute thermal shutdown is designed to disable the power FETs, if
the junction temperature exceeds 160°C (typical). The device auto recovers about 25 ms after TJ < [T (TSD) –
10°C]. The relative thermal shutdown protects the device by turning off when the temperature of the power FETs
increases sharply such that the FET temperature rises about 60°C above the rest of the die. The device auto
recovers about 25 ms after the FETs cools down by 20°C. The relative thermal shutdown is critical for protecting
the device against faults such as a power up into a short which causes the FET temperature to increase sharply.
9.3.5 Overvoltage Protection (OVx)
Output Overvoltage Protection is available for both IN1 and IN2 in case either applied voltage is greater than the
maximum supported load voltage. The VREF comparator on the OVx pins allow for the Overvoltage Protection
threshold to be adjusted independently for each input. When overvoltage is engaged, the corresponding channel
will turn off immediately. Fast switchover to the other input is supported if it is a valid voltage.