Check for Samples: TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067
1
FEATURES
2
•70-mΩ High-Side MOSFET
•1-A Continuous Current
APPLICATIONS
•Heavy Capacitive Loads
•Short-Circuit Protections
•Thermal and Short-Circuit Protection
•Accurate Current Limit
(1.1 A min, 1.9 A max)
•Operating Range: 2.7 V to 5.5 V
•0.6-ms Typical Rise Time
•Undervoltage Lockout
•Deglitched Fault Report (OC)
•No OC Glitch During Power Up
•1-μA Maximum Standby Supply Current
•Bidirectional Switch
•Ambient Temperature Range: -40°C to 85°C
•Built-in Soft-Start
•UL Listed - File No. E169910
DESCRIPTION
The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device incorporates 70-mΩ N-channel MOSFET power switches
for power-distribution systems that require multiple power switches in a single package. Each switch is controlled
by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch
rise times and fall times to minimize current surges during switching. The charge pump requires no external
components and allows operation from supplies as low as 2.7 V.
1
2PowerPAD is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION (CONTINUED)
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1.5 A
typically.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDTYPICALPACKAGED
EDSHORT-DEVICES
T
A
-40°C to 85°C1 A1.5 A
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2062DR).
(2) The printed circuit board layout is important for control of temperature rise when operated at high ambient temperatures.
ENABLE
Active lowTPS2061DGNTPS2061D-
Active highTPS2065DGNTPS2065D-
Active lowTPS2062DGNTPS2062D-
Active highTPS2066DGNTPS2066D-
Active low-TPS2063D-
Active high-TPS2067D-
Active low--TPS2061DBV
Active high--TPS2065DBV
MAXIMUMCIRCUITNUMBER OF
CONTINUOUSCURRENTSWITCHES
LOADLIMIT
CURRENTAT 25°C
Single
Dual
Triple
Single
MSOP (DGN)SOIC (D)SOT23 (DBV)
spacer
ORDERING INFORMATION
T
A
-40°C to 85°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) The printed circuit board layout is important for control of temperature rise when operated at high ambient temperatures.
over operating free-air temperature range unless otherwise noted
, V
I(IN)
O(OUT)
I(EN)
I(OCx)
(2)
, V
(2)
I(EN)
O(OUT)
, V
, V
, I
O(OUTx)
I(ENx)
O(OUTx)
, V
I(ENx)
J
Human body model2 kV
Charge device model (CDM)500 V
Input voltage range, V
Output voltage range, V
Input voltage range, V
Voltage range, V
I(OC)
Continuous output current, I
Continuous total power dissipationSee Dissipation Rating Table
Operating virtual junction temperature range, T
Electrostatic discharge (ESD) protection
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND.
(1)
UNIT
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
Internally limited
-40°C to 150°C
DISSIPATING RATING TABLE
PACKAGE
(1)
D-8
(2)
DGN-8
(1)
D-16
(3)
DBV-5
(1) Power ratings are based on the low-k board (1 signal, 1 layer).
(2) Power ratings are based on the high-k board (2 signal, 2 plane) with PowerPAD™ vias to the internal ground plane.
(3) Lower ratings are for low-k printed circuit board layout (single -sided). Higher ratings are for enhanced high-k layout, (2 signal, 2 plane)
with a 1mm2copper pad on pin 2 and 2 vias to the ground plane.
TA≤ 25°CDERATING FACTORTA= 70°CTA= 85°C
POWER RATINGABOVE TA= 25°CPOWER RATINGPOWER RATING
EN4-4-IEnable input, logic low turns on power switch
EN-4-4IEnable input, logic high turns on power switch
GND1122Ground
IN2, 32,355IInput voltage
OC5533OOvercurrent, open-drain output, active-low
OUT6, 7, 86, 7, 811OPower-switch output
PowerPAD™----to the circuit board traces. Should be connected to GND
Functional Block Diagram
SLVS490I –DECEMBER 2003–REVISED OCTOBER 2009
Internally connected to GND; used to heat-sink the part
pin.
EN13-IEnable input, logic low turns on power switch IN-OUT1
EN24-IEnable input, logic low turns on power switch IN-OUT2
EN1-3IEnable input, logic high turns on power switch IN-OUT1
EN2-4IEnable input, logic high turns on power switch IN-OUT2
GND11Ground
IN22IInput voltage
OC188OOvercurrent, open-drain output, active low, IN-OUT1
OC255OOvercurrent, open-drain output, active low, IN-OUT2
OUT177OPower-switch output, IN-OUT1
OUT266OPower-switch output, IN-OUT2
PowerPAD™--
I/ODESCRIPTION
Internally connected to GND; used to heat-sink the part to the circuit board traces.
Should be connected to GND pin.
EN13–IEnable input, logic low turns on power switch IN1-OUT1
EN24–IEnable input, logic low turns on power switch IN1-OUT2
EN37–IEnable input, logic low turns on power switch IN2-OUT3
EN1–3IEnable input, logic high turns on power switch IN1-OUT1
EN2–4IEnable input, logic high turns on power switch IN1-OUT2
EN3–7IEnable input, logic high turns on power switch IN2-OUT3
GND1, 51, 5Ground
IN122IInput voltage for OUT1 and OUT2
IN266IInput voltage for OUT3
NC8, 9, 108, 9, 10No connection
OC11616OOvercurrent, open-drain output, active low, IN1-OUT1
OC21313OOvercurrent, open-drain output, active low, IN1-OUT2
OC31212OOvercurrent, open-drain output, active low, IN2-OUT3
OUT11515OPower-switch output, IN1-OUT1
OUT21414OPower-switch output, IN1-OUT2
OUT31111OPower-switch output, IN2-OUT3