The TPPM0303 is a low-dropout regulator with auxiliary power management that provides a constant 3.3-V
supply at the output capable of driving a 250-mA load.
The TPPM0303 provides a regulated power output for systems that have multiple input sources and require a
constant voltage source with a low-dropout voltage. This is a single output, multiple input, intelligent power
source selection device with a low-dropout regulator for either 5VCC or 5VAUX inputs, and a low-resistance
bypass switch for the 3.3VAUX input.
Transitions may occur from one input supply to another without generating a glitch outside of the specification
range on the 3.3-V output. The device has an incorporated reverse-blocking scheme to prevent excess leakage
from the input terminals in the event that the output voltage is greater than the input voltage.
The input voltage is prioritized in the following order: 5VCC, 5VAUX, and 3.3VAUX.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2001, Texas Instruments Incorporated
1
TPPM0303
I/O
DESCRIPTION
250-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS364 – FEBRUARY 2001
functional block diagram
Linear Regulator
5VCC
5-V
Detection
With LDO
3.3VOUT
5VAUX
3.3VAUX
3VAUX
Detection
5VAUX
Detection
Gate Drive
and Control
Linear Regulator
With LDO
Gate Drive
and Control
Low ON
Resistance
Switch
Current
Sensor
Current
Sensor
Over
Temperature
GND
5-V Detection
and Control
Gate Drive
Terminal Functions
TERMINAL
NAMENO.
3.3VAUX4I3.3-V auxiliary input
3.3VOUT3O3.3-V output with a typical capacitance load of 4.7 µF
5VAUX1I5-V auxiliary input
5VCC2I5-V main input
GND7IGround
NC5,6,8No internal connection
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. Absolute negative voltage on these terminal should not be below –0.5 V.
3. The device derates with increase in ambient temperature, TA. See Thermal Information section.
Minimal ESR to insure stability of regulated
output
Tested for input that is grounded.
3.3VAUX, 5VAUX or 5VCC = GND,
3.3VOUT = 3.3 V
150180
2.55mA
15
4.7µF
°
50µA
5-V detect
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V
(TO_LO)
V
(TO_HI)
Threshold voltage, low5VAUX or 5VCC ↓3.854.054.25V
Threshold voltage, high5VAUX or 5VCC ↑4.14.34.5V
auxiliary switch
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
R
(SWITCH)
∆V
O(∆VI)
∆V
O(∆IO)
VI – V
O
Auxiliary switch resistance
Line regulation voltage5VAUX or 5VCC = 4.5 V to 5.5 V2mV
Load regulation voltage20 mA < IL < 250 mA40mV
Dropout voltageIL < 250 mA1V
5VAUX = 5VCC = 0 V,
3.3VAUX = 3.3 V, IL = 150 mA
thermal characteristics
PARAMETERMINTYPMAXUNIT
R
Thermal impedance, junction-to-case39°C/W
θJC
p
NOTE 4: See JEDEC PCB specifications for low-K and high-K.
Low-K (see Note 4)176
High-K (see Note 4)98
0.4Ω
°
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPPM0303
250-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS364 – FEBRUARY 2001
TYPICAL CHARACTERISTICS
5VCC
3.3VAUX
3.3VOUT
3.3VOUT
Figure 1. 5VCC Cold Start
3.3VOUT (Offset = 3.3 V)
(250-mA Load)
5VCC (Offset = 4.5 V)
5VAUX (Offset = 4.8 V)
(250-mA Load)
Figure 2. 3.3V AUX Cold Start
3.3VAUX (Offset = 3.3 V)
5VCC (Offset = 4.5 V)
3.3VOUT (Offset = 3.3 V)
(250-mA Load)
Figure 3. 5VCC Power Up (5VAUX = 5 V)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
(250-mA Load)
Figure 4. 5VCC Power Up (3.3VAUX = 3.3 V)
5
TPPM0303
250-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS364 – FEBRUARY 2001
TYPICAL CHARACTERISTICS
3.3VAUX (Offset = 3.3 V)
5VAUX (Offset = 4.5 V)
(250-mA Load)
Figure 5. 5V AUX Power Up (3.3VAUX = 3.3 V)
(250-mA Load)
5VCC (Offset = 4.3 V)
3.3VOUT (Offset = 3.3 V)
(250-mA Load)
Figure 6. 5VCC Power Down (3.3VAUX = 3.3 V)
Sample
3.3VOUT (Offset = 3.3 V)
Trig?
5VAUX (Offset = 5 V)
3.3VOUT (Offset = 3.3 V)
5VCC (Offset = 4.5 V)
Figure 7. 5VCC Power Down (5VAUX = 5 V)
250-mA to 20-mA
Step Load
Figure 8. 5VCC Load Transient Response Falling
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPPM0303
250-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS364 – FEBRUARY 2001
TYPICAL CHARACTERISTICS
Sample
Trig?
3.3VOUT (Offset = 3.3 V)
20-mA to 250-mA
Step Load
Figure 9. 5VCC Load Transient Response Rising
THERMAL INFORMATION
T o ensure reliable operation of the device, the junction temperature of the output device must be within the safe
operating area (SOA). This is achieved by having a means to dissipate the heat generated from the junction
of the output structure. There are two components that contribute to thermal resistance. They consist of two
paths in series. The first is the junction to case thermal resistance, R
thermal resistance, R
R
θJA
= R
θJC
+ R
. The overall junction to ambient thermal resistance, R
θCA
θCA
The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout
incorporated in the application. The operating junction temperature is determined by the operating ambient
temperature, TA, and the junction power dissipation, PJ.
; the second is the case to ambient
θJC
, is determined by:
θJA
The junction temperature, TJ, is equal to the following thermal equation:
= TA + PJ (R
T
J
TJ = TA + PJ (R
θJC
θJA
) + PJ (R
)
θCA
)
This particular application uses the 8-pin SO package with standard lead frame with a dedicated ground
terminal. Hence, the maximum power dissipation allowable for an operating ambient temperature of 70°C, and
a maximum junction temperature of 150°C is determined as:
PJ = (TJ – TA)/R
θJA
PJ = (150 – 70)/176 = 0.45 W when using a low-K PCB.
PJ = (150 – 70)/98 = 0.81 W when using a high-K PCB.
Worst case maximum power dissipation is determined by:
PD = (5.5 – 3) × 0.25 = 0.625 W
Normal operating maximum power dissipation is (see Figure 10):
PD = (5 – 3.3) × 0.25 = 0.425 W
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
TPPM0303
250-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS364 – FEBRUARY 2001
THERMAL INFORMATION
Power Dissipation Derate Curve Using
1.275
0.71
0.625
Power – W
0.425
NOTE: These curves are to be used for guideline purposes only . For a particular application, a more specific thermal characterization is required.
High-K PCB
Power Dissipation Derate Curve Using
Low-K PCB
253975 89108150
Ambient Temperature – °C
Figure 10. Power Dissipation Derating Curves
APPLICATION INFORMATION
1
5VAUXNC
4.7 µF
4.7 µF
0.1 µF
0.1 µF4.7 µF
4.7 µF
0.1 µF
5VCCGND
TPPM0303
3
3.3VOUTNC
3.3VAUXNC
Figure 11. Typical Application Schematic
8
72
6
54
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPPM0303
250-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS364 – FEBRUARY 2001
MECHANICAL DATA
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0.050 (1,27)
14
1
0.069 (1,75) MAX
0.020 (0,51)
0.014 (0,35)
8
7
A
0.010 (0,25)
0.004 (0,10)
DIM
0.157 (4,00)
0.150 (3,81)
PINS **
0.010 (0,25)
0.244 (6,20)
0.228 (5,80)
8
M
Seating Plane
0.004 (0,10)
14
0.008 (0,20) NOM
0°–8°
16
Gage Plane
0.010 (0,25)
0.044 (1,12)
0.016 (0,40)
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.197
(5,00)
0.189
(4,80)
0.344
(8,75)
0.337
(8,55)
0.394
(10,00)
0.386
(9,80)
4040047/D 10/96
9
IMPORTANT NOTICE
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pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with
TI’s standard warranty . T esting and other quality control techniques are utilized to the extent TI deems necessary
to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except
those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
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Resale of TI’s products or services with
that product or service voids all express and any implied warranties for the associated TI product or service,
is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard T erms and Conditions of Sale for Semiconductor Products.
Copyright 2001, Texas Instruments Incorporated
statements different from or beyond the parameters
www.ti.com/sc/docs/stdterms.htm
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
stated by TI for
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