Wide Range of Supply Voltages Over
Specified Temperature Range:
T
= –40°C to 85°C...2 V to 8 V
A
D
Fully Characterized at 3 V and 5 V
D
Single-Supply Operation
D
Common-Mode Input-Voltage Range
Extends Below the Negative Rail and up to
V
–1 V at TA = 25°C
DD
D
Output Voltage Range Includes Negative
Rail
12
D
High Input Impedance...10
D
ESD-Protection Circuitry
D
Designed-In Latch-Up Immunity
Ω Typ
description
The TL V233x operational amplifiers are in a family
of devices that has been specifically designed for
use in low-voltage single-supply applications.
Unlike the TLV2322 which is optimized for
ultra-low power, the TLV233x is designed to
provide a combination of low power and good ac
performance. Each amplifier is fully functional
down to a minimum supply voltage of 2 V, is fully
characterized, tested, and specified at both 3-V
and 5-V power supplies. The common-mode
input-voltage range includes the negative rail and
extends to within 1 V of the positive rail.
Having a maximum supply current of only 310 µA
per amplifier over full temperature range, the
TLV233x devices offer a combination of good ac
performance and microampere supply currents.
From a 3-V power supply, the amplifier’s typical
slew rate is 0.38 V/µs and its bandwidth is
300 kHz.
V
DD –
V
DD–
1OUT
/GND
1OUT
/GND
1IN–
1IN+
1OUT
1IN–
1IN+
V
DD+
2IN+
2IN–
2OUT
TLV2332
D OR P PACKAGE
(TOP VIEW)
1
1IN–
1IN+
1OUT
1IN–
1IN+
V
2IN+
2OUT
2
3
4
TLV2332
PW PACKAGE
(TOP VIEW)
1
2
3
4
TLV2334
D OR N PACKAGE
(TOP VIEW)
1
2
3
4
DD+
5
2N–
6
7
TLV2334
PW PACKAGE
(TOP VIEW)
1
78
8
7
6
5
8
7
6
5
14
13
12
11
10
9
8
14
V
DD
2OUT
2IN–
2IN+
V
DD+
2OUT
2IN–
2IN+
4OUT
4IN–
4IN+
V
DD–/GND
3IN+
3IN–
3OUT
4OUT
4IN–
4IN+
V
DD–/GND
3IN+
3IN–
3OUT
T
A
°
–
†
The D package is available taped and reeled. Add R suffix to the device type (e.g., TL V2332IDR).
‡
The PW package is only available left-end taped and reeled (e.g., TLV2332IPWLE).
§
Chip forms are tested at 25°C only.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinCMOS is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
These amplifiers offer a level of ac performance greater than that of many other devices operating at
comparable power levels. The TL V233x operational amplifiers are especially well suited for use in low-current
or battery-powered applications.
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate
LinCMOS technology . The LinCMOS process also features extremely high input impedance and ultra-low bias
currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter
applications.
T o facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package
options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has
significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only
1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The
TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to
2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these
devices as exposure to ESD may result in the degradation of the device parametric performance.
TLV2332Y chip information
This chip, when properly assembled, display characteristics similar to the TLV2332. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
59
(7)
(5)
(6)
(4)
(8)
72
(3)
(2)
(1)
V
DD
(3)
1IN+
(2)
1IN–
2OUT
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(7)
(8)
+
–
V
DD–
(4)
+
–
/GND
(1)
(5)
(6)
1OUT
2IN+
2IN–
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2332, TLV2332Y, TLV2334, TLV2334Y
LinCMOS LOW-VOLTAGE MEDIUM-POWER
OPERATIONAL AMPLIFIERS
SLOS189 – FEBRUARY 1997
TLV2334Y chip information
This chip, when properly assembled, displays characteristics similar to the TL V2334. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
68
BONDING PAD ASSIGNMENTS
(8)(9)(10)(11)(12)(13)(14)
(1)(2)(3)(4) (5)(6)(7)
108
V
DD
V
+
–
+
–
+
–
+
–
DD–
(4)
(11)
/GND
(1)
(7)
(8)
(14)
1OUT
2OUT
3OUT
4OUT
(3)
1IN+
(2)
1IN–
(5)
2IN+
(6)
2IN–
(10)
3IN+
(9)
3IN–
(12)
4IN+
(13)
4IN–
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
Includes both amplifiers and all ESD, bias, and trim
circuitry.
†
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2332, TLV2332Y, TLV2334, TLV2334Y
PACKAGE
A
A
Common-mode input voltage, V
V
LinCMOS LOW-VOLTAGE MEDIUM-POWER
OPERATIONAL AMPLIFIERS
SLOS189 – FEBRUARY 1997
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
Differential input voltage, V
Input voltage range, V
Input current, I
Output current, I
Duration of short-circuit current at (or below) T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at the noninverting input with respect to the inverting input.
3. The output may be shorted to either supply. Temperature and /or supply voltages must be limited to ensure that the maximum
dissipation rating is not exceeded (see application section).