Outstanding Combination of DC Precision
and AC Performance:
Unity-Gain Bandwidth . . . 15 MHz Typ
V
. . . 3.3 nV/√Hz at f = 10 Hz Typ,
n
2.5 nV/√Hz
V
. . . 100 µV Typ
IO
A
. . . 45 V/µV Typ With RL = 2 kΩ
VD
38 V/µV Typ With R
D
Available in 16-Pin Small-Outline
at f = 1 kHz Typ
L
Wide-Body Package
D
Macromodels and Statistical Information
Included
D
Output Features Saturation Recovery
Circuitry
description
The TLE22x7C combines innovative circuit
design expertise and high-quality process control
techniques to produce a level of ac performance
and dc precision previously unavailable in dual
operational amplifiers. This device allows
upgrades to systems that use lower-precision
devices and is manufactured using Texas
Instruments state-of-the-art Excalibur process.
= 1 kΩ
P PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
V
CC–
1OUT
1IN–
1IN+
V
NC – No internal connection
DW PACKAGE
(TOP VIEW)
NC
NC
CC–
NC
NC
1
2
3
4
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
8
7
6
5
9
V
2OUT
2IN–
2IN+
NC
NC
V
2OUT
2IN–
2IN+
NC
NC
CC+
CC+
In the area of dc precision, the TLE22x7C offers a typical offset voltage of 100 µV, a common-mode rejection
ratio of 115 dB (typ), a supply voltage rejection ratio of 120 dB (typ), and a dc gain of 45 V/µV (typ).
The ac performance is highlighted by a typical unity-gain bandwidth specification of 15 MHz, 55° of phase
margin, and noise voltage specifications of 3.3 nV/√Hz
and 2.5 nV/√Hz at frequencies of 10 Hz and 1 kHz,
respectively.
The TLE22x7C is available in a wide variety of packages, including the industry standard 16-pin small-outline
wide-body version for high-density system applications. This device is characterized for operation from 0°C to
70°C.
AVAILABLE OPTIONS
T
A
°
°
†
The DW package is available taped and reeled. Add R suffix to device type (e.g., TLE2227CDWR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This chip, properly assembled, displays characteristics similar to the TLE2227C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips my be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(8)
116
(6)
(5)
(4)
1IN+
1IN–
2OUT
(3)
(2)
(7)
V
CC+
(8)
+
–
V
CC–
(4)
(1)
(5)
+
(6)
–
1OUT
2IN+
2IN–
(1)
(2)(3)
104
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLE2227, TLE2227Y, TLE2237, TLE2237Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS184 – FEBRUARY 1997
TLE2237Y chip information
ThIs chip, when properly assembled, displays characteristics similar to TLE2237. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
116
(8)
(1)
(7)
(6)
(2)(3)
104
(5)
(4)
V
CC+
1IN+
1IN–
2OUT
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between V
2. Differential voltages are at IN+ with respect to IN–. Excessive current flows if a differential input voltage in excess of approximately
±1.2 V is applied between the inputs unless some limiting resistance is used.
3. The output can be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum
dissipation rating is not exceeded.