TEXAS INSTRUMENTS TLC5923 Technical data

RHBDAP

www.ti.com

On/Off

Input
Shift

Register

DC Input

Shift

Register

7−bit DC Register

Delay

x0

Constant Current

Driver

LOD

MODE

0 1

MODE

0 1

0

15

111

0

On/Off Register

0
6

0

0

01

Temperature

Error Flag

(TEF)

LED Open
Detection

(LOD)

7−bit DC Register

Delay

x1

Constant Current

Driver

LOD

On/Off Register

7

13

1

1

7−bit DC Register

Delay

x15

Constant Current

Driver

LOD

On/Off Register

105
111

15

15

BLANK

0

Max. OUTn

Current

GNDVCC SINSCLK

SOUT

IREF

XERR

XLATMODE

OUT0

OUT1

OUT15

PGND BLANK

BLANK

BLANK

16

16

112

1

16-CHANNEL LED DRIVER WITH DOT CORRECTION

FEATURES APPLICATIONS

• 16 Channels

• Drive Capability

– 0 to 80 mA (Constant-Current Sink)

• Constant Current Accuracy: ±1% (typical)

• Serial Data Interface

• Fast Switching Output: Tr/ Tf= 10ns (typical)

• CMOS Level Input/Output

• 30 MHz Data Transfer Rate

• V

• Operating Temperature = –40 ° C to 85 ° C

• LED Supply Voltage up to 17 V

• 32-pin HTSSOP( PowerPAD™) and QFN

• Dot Correction

• Controlled In-Rush Current

• Error Information

= 3.0 V to 5.5 V

CC

Packages

– 7 bit (128 Steps)
– individual adjustable for each channel

– LOD: LED Open Detection
– TEF: Thermal Error Flag

TLC5923

SLVS550A – DECEMBER 2004 – REVISED NOVEMBER 2005

• Monocolor, Multicolor, Fullcolor LED Display

• Monocolor, Multicolor LED Signboard

• Display Backlighting

• Multicolor LED lighting applications

DESCRIPTION

The TLC5923 is a 16 channel constant-current sink
driver. Each channel has a On/Off state and a
128-step adjustable constant current sink (dot
correction). The dot correction adjusts the brightness
variations between LED, LED channels and other
LED drivers. Both dot correction and On/Off state are
accessible via a serial data interface. A single
external resistor sets the maximum current of all 16
channels.

The TLC5923 features two error information circuits.
The LED open detection (LOD) indicates a broken or
disconnected LED at an output terminal. The thermal
error flag (TEF) indicates an overtemperature
condition.

FUNCTIONAL BLOCK DIAGRAM

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2004–2005, Texas Instruments Incorporated

www.ti.com

TLC5923

SLVS550A – DECEMBER 2004 – REVISED NOVEMBER 2005

These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

(1)

(1)

T

A

–40 ° C to 85 ° C

ORDERING INFORMATION

Package Part Number

32-pin, HTSSOP, PowerPAD™ TLC5923DAP

32-pin, 5 mm x 5 mm QFN TLC4923RHB

(1) For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI website at www.ti.com .

ABSOLUTE MAXIMUM RATINGS

(1) (2)

TLC5923 UNIT

V

Supply voltage

CC

I

Output current (dc) I

O

V

Input voltage range

I

V

Output voltage range

O

ESD rating

T

Storage temperature range –40 to 150 °C

stg

(2)

(2)

(2)

L(LC)

V

, V

, V

, V

(BLANK)

V

(SOUT)

V

(OUT0)

(XLAT)

(SCLK)

, V

(XDOWN)

– V

(OUT15)

, V

(SIN)

(MODE)

–0.3 to 6 V

90 mA
–0.3 to V
–0.3 to V

+ 0.3 V

CC

+ 0.3 V

CC

-0.3 to 18 V
HBM (JEDEC JESD22-A114, Human Body Model) 2 kV
CDM (JEDEC JESD22-C101, Charged Device Model) 500 V

Continuous total power dissipation at (or below) TA= 25 ° C 3.9 W
Power dissipation rating at (or

above) TA= 25 ° C

(3)

HTSSOP (DAP) 42.54 mW/ ° C
QFN (RHB) 27.86 mW/ ° C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) See SLMA002 for more information about PowerPAD™

RECOMMENDED OPERATING CONDITIONS—DC Characteristics

MIN NOM MAX UNIT

V

Supply voltage 3 5.5 V

CC

V

Voltage applied to output, (Out0 - Out15) 17 V

O

V

High-level input voltage 0.8 VCC VCC V

IH

V

Low-level input voltage GND 0.2 VCC V

IL

I

High-level output current V

OH

I

Low-level output current V

OL

I

Constant output current OUT0 to OUT15 80 mA

OLC

T

Operating free-air temperature range -40 85 ° C

A

2

= 5 V at SOUT –1 mA

CC

= 5 V at SOUT, XDOWN 1 mA

CC

www.ti.com

SLVS550A – DECEMBER 2004 – REVISED NOVEMBER 2005

RECOMMENDED OPERATING CONDITIONS—AC Characteristics

V

= 3 V to 5.5 V, TA= -40°C to 85°C (unless otherwise noted)

CC

MIN TYP MAX UNIT

f

SCLK

t

wh0

t

wh1

t

su0

t

su1

t

su2

t

su3

t

h0

t

h1

t

h2

t

h3

Clock frequency SCLK 30 MHz

/t

CLK pulse duration SCLK=H/L 16 ns

wl0

XLAT pulse duration XLAT=H 20 ns

SIN - SCLK ↑ 10 ns

Setup time

SCLK ↑ -XLAT ↓ 10 ns
MODE ↑ ↓ -SCLK ↑ 10 ns
MODE ↑ ↓ -XLAT ↑ 10 ns
SCLK ↑ -SIN 10 ns

Hold time

XLAT ↓-SCLK ↑ 10 ns
SCLK ↑-MODE ↑ ↓ 10 ns
XLAT ↓-MODE ↑ ↓ 10 ns

ELECTRICAL CHARACTERISTICS

V

= 3 V to 5.5 V, TA= –40 ° C to 85 ° C (unless otherwise noted)

CC

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

V
V
I

I

I
I
I

∆ I
∆ I
∆ I
∆ I

T
V
V

(1) Measured at device start-up temperature. Once the IC is operating (self heating), lower ICCvalues will be seen. See Figure 15 .
(2) Not tested. Specified by design.

High-level output voltage IOH= –1 mA, SOUT VCC– 0.5 V

OH

Low-level output voltage IOL= 1 mA, SOUT 0.5 V

OL

Input current VI= V

I

No data transfer, All output OFF, VO= 1 V, R
No data transfer, All output OFF, VO= 1 V, R

k Ω

Supply current mA

CC

Data transfer 30 MHz, All output ON, VO= 1 V,
R

or GND, BLANK, XLAT, SCLK, SIN, MODE –1 1 µ A

CC

= 10 k Ω 6

(IREF)

= 1.3

(IREF)

= 1.3 k Ω

(IREF)

Data transfer 30 MHz, All output ON, VO= 1 V,
R

= 600 Ω

(IREF)

Constant output current All output ON, VO= 1 V, R

OLC

LO0

Leakage output current

LO1

Constant current error All output ON, VO= 1 V, R

OLC0

Constant current error ± 4% ± 8.5%

OLC1

Power supply rejection ratio All output ON, VO= 1 V, R

OLC2

Load regulation ± 2 ± 6 %/V

OLC3

Thermal error flag threshold Junction temperature, rising temperature

(TEF)

LED open detection threshold 0.3 0.4 V

(LOD)

Reference voltage output R

(IREF)

All output OFF, VO= 15 V, R
OUT15

V

= 5.5 V, No TEF and LOD 10 µ A

XERR

device to device, averaged current from OUT0 to OUT15,
R

= 600 Ω

(IREF)

All output ON, VO= 1 V to 3 V, R
OUT0 to OUT15

= 600 Ω 1.20 1.24 1.28 V

(IREF)

= 600 Ω 70 80 90 mA

(IREF)

= 600 Ω , OUT0 to

(IREF)

= 600 Ω , OUT0 to OUT15 ± 1% ± 4%

(IREF)

= 600 Ω , OUT0 to OUT15 ± 1 ± 4 %/V

(IREF)

= 600 Ω ,

(IREF)

(2)

150 160 180 ° C

36 65

0.1 µ A

TLC5923

15

32

(1)

3

www.ti.com

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

GND

BLANK

XLAT

SCLK

SIN

PGND

OUT0
OUT1

PGND

OUT2
OUT3
OUT4
OUT5

PGND

OUT6
OUT7

VCC
IREF
MODE
XERR
SOUT
PGND
OUT15
OUT14
PGND
OUT13
OUT12
OUT11
OUT10
PGND
OUT9
OUT8

THERMAL

PAD

SOUT24

PGND23

OUT1522

OUT1421

PGND20

OUT1319

OUT1218

OUT1117

OUT1016
PGND15
OUT914
OUT813
OUT712
OUT611
PGND10
OUT59

OUT4

8

OUT3

7

OUT2

6

PGND

5

OUT1

4

OUT0

3

PGND

2

SIN

1

XERR 25

MODE 26

IREF 27

VCC 28

GND 29

BLANK 30

XLAT 31

SCLK 32

RHB PACKAGE

(TOP VIEW)

(QFN)

DAP PACKAGE

(TOP VIEW)

TLC5923

SLVS550A – DECEMBER 2004 – REVISED NOVEMBER 2005

DISSIPATION RATINGS

PACKAGE

32-pin HTSSOP with PowerPAD

32-pin HTSSOP with PowerPAD

(1) The PowerPAD is soldered to the PCB with a 2 oz. copper trace. See SLMA002 for further information.

soldered

unsoldered

32-pin QFN 3482 mW 27.86 mW/ ° C 2228 mW 1811 mW

SWITCHING CHARACTERISTICS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

t

r0

Rise time ns

t

r1

t

f0

Fall time ns

t

f1

t

pd0

t

pd1

t

pd2

Propagation delay time ns

t

pd3

t

pd4

t

pd5

t

Output delay time OUTn ↑ ↓ -OUT(n+1) ↑ ↓ (see

d

POWER RATING DERATING FACTOR POWER RATING POWER RATING

TA< 25 ° C ABOVE TA = 25 ° C TA= 70 ° C TA= 85 ° C

(1)

(1)

SOUT(see
OUTx, V
SOUT (see
OUTx, V
SCLK ↑ - SOUT ↑ ↓ (see
MODE ↑↓ - SOUT ↑ ↓ (see
BLANK ↓ - OUT0 ↑ ↓ (see
XLAT ↑ - OUT0 ↑ ↓ (see
OUTx ↑ ↓ -XERR ↑ ↓ (see
XLAT ↑ -I

5318 mW 42.54 mW/ ° C 3403 mW 2765 mW

2820 mW 22.56 mW/ ° C 1805 mW 1466 mW

(1)

= 5 V, TA= 60 ° C, DCx = 7F (see

CC

(1)

= 5 V, TA= 60 ° C, DCx = 7F (see

CC

(dot-correction) (see

OUT

) 16

) 16

(3)

) 30

(3)

) 30

(4)

) 60

(4)

) 60

(5)

) 1000

(6)

) 1000

(4)

) 14 22 30 ns

(2)

) 10 30

(2)

) 10 30

(1) See Figure 4 . Defined as from 10% to 90%
(2) See Figure 5 . Defined as from 10% to 90%
(3) See Figure 4 , Figure 11
(4) See Figure 5 and Figure 11
(5) See Figure 5 , Figure 6 , and Figure 11
(6) See Figure 5

4

www.ti.com

VCC

INPUT

GND

400 

Terminal Functions

TERMINAL

NAME

BLANK 2 30 I
GND 1 29 Ground

IREF 31 27 I/O Reference current terminal
MODE 30 26 I
OUT0 7 3 O Constant current output

OUT1 8 4 O Constant current output
OUT2 10 6 O Constant current output
OUT3 11 7 O Constant current output
OUT4 12 8 O Constant current output
OUT5 13 9 O Constant current output
OUT6 15 11 O Constant current output
OUT7 16 12 O Constant current output
OUT8 17 13 O Constant current output
OUT9 18 14 O Constant current output
OUT10 20 16 O Constant current output
OUT11 21 17 O Constant current output
OUT12 22 18 O Constant current output
OUT13 23 19 O Constant current output
OUT14 25 21 O Constant current output
OUT15 26 22 O Constant current output

PGND Power ground

SCLK 4 32 I
SIN 5 1 I Data input of serial I/F

SOUT 28 24 O Data output of serial I/F
VCC 32 28 Power supply voltage

XERR 29 25 O

XLAT 3 31 I

TSSOP QFN

6, 9, 14, 2, 5, 10,

19, 24, 27 15, 20, 23

NO. I/O DESCRIPTION

Blank (Light OFF). When BLANK=H, All OUTx outputs are forced OFF. When BLANK=L,
ON/OFF of OUTx outputs are controlled by input data.

Mode select. When MODE=L, SIN, SOUT, SCLK, XLAT are connected to ON/OFF control
logic. When MODE=H, SIN, SOUT, SCLK, XLAT are connected to dot-correction logic.

Data shift clock. Note that the internal connections are switched by MODE (pin #30). At
SCLK ↑ , the shift-registers selected by MODE shift the data.

Error output. XERR is open drain terminal. XERR transistions from H to L when LOD or TEF
detected.

Data latch. Note that the internal connections are switched by MODE (pin #30). At XLAT ↑ ,
the latches selected by MODE get new data.

TLC5923

SLVS550A – DECEMBER 2004 – REVISED NOVEMBER 2005

PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS

(Note: Resistor values are equivalent resistance and not tested).

Figure 1. Input Equivalent Circuit (BLANK, XLAT, SCLK, SIN, MODE)

5

www.ti.com

SOUT

GND

10 

XERR

GND

20 

SOUT

15 pF

OUTn

51 Ω

15 pF

XDOWN

470 kΩ

TLC5923

SLVS550A – DECEMBER 2004 – REVISED NOVEMBER 2005

PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS (continued)

Figure 3. Output Equivalent Circuit (XERR)

PARAMETER MEASUREMENT INFORMATION

Figure 2. Output Equivalent Circuit

Figure 4. Test Circuit for tr0, tf0, td0, t

Figure 5. Test Circuit for tr1, tf1, t

Figure 6. Test Circuit for t

d1

, t

, t

pd2

pd3

pd4

, t

pd5

pd6

6