Texas Instruments Tiva TM4C1294 User Manual

Tiva™ C Series TM4C1294 Connected LaunchPad Evaluation Kit

EK-TM4C1294XL

User's Guide

Literature Number: SPMU365A

March 2014–Revised March 2014

Contents

1 Board Overview ................................................................................................................... 4

1.1 Kit Contents................................................................................................................... 5

1.2 Using the Connected LaunchPad ......................................................................................... 5

1.3 Features....................................................................................................................... 5

1.4 BoosterPacks................................................................................................................. 6

1.5 Energīa........................................................................................................................ 6

1.6 Specifications................................................................................................................. 6

2 Hardware Description ........................................................................................................... 7

2.1 Functional Description ...................................................................................................... 7

2.1.1 Microcontroller....................................................................................................... 7

2.1.2 Ethernet Connectivity............................................................................................... 8

2.1.3 USB Connectivity ................................................................................................... 8

2.1.4 Motion Control....................................................................................................... 8

2.1.5 User Switches and LED's.......................................................................................... 8

2.1.6 BoosterPacks and Headers ....................................................................................... 9

2.2 Power Management........................................................................................................ 17

2.2.1 Power Supplies.................................................................................................... 17

2.2.2 Low Power Modes ................................................................................................ 18

2.2.3 Clocking ............................................................................................................ 18

2.2.4 Reset................................................................................................................ 18

2.3 Debug Interface............................................................................................................. 18

2.3.1 In-Circuit Debug Interface (ICDI)................................................................................ 18

2.3.2 External Debugger ................................................................................................ 19

2.3.3 Virtual COM Port .................................................................................................. 19

3 Software Development ........................................................................................................ 20

3.1 Software Description....................................................................................................... 20

3.2 Source Code................................................................................................................ 20

3.3 Tool Options ................................................................................................................ 20

3.4 Programming the Connected LaunchPad............................................................................... 21

4 References, PCB Layout, and Bill of Materials ....................................................................... 22

4.1 References.................................................................................................................. 22

4.2 Component Locations ..................................................................................................... 23

4.3 Bill of Materials ............................................................................................................. 24

5 Schematic ......................................................................................................................... 26

6 Revision History................................................................................................................. 27

Contents SPMU365A–March 2014–Revised March 2014

Submit Documentation Feedback

www.ti.com

1-1. Tiva C Series Connected LaunchPad Evaluation Board ............................................................... 4

2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram........................................................ 7

2-2. Default Jumper Locations ................................................................................................. 17

4-1. Connected LaunchPad Dimensions and Component Locations ..................................................... 23

1-1. EK-TM4C1294XL Specifications........................................................................................... 6

2-1. BoosterPack 1 GPIO and Signal Muxing ................................................................................. 9

2-2. BoosterPack 2 GPIO and Signal Muxing ............................................................................... 11

2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing .......................................... 13

2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing ......................................... 15

4-1. Connected LaunchPad Bill of Materials ................................................................................. 24

6-1. Revision History ............................................................................................................ 27

List of Figures

List of Tables

SPMU365A–March 2014–Revised March 2014 List of Figures

Submit Documentation Feedback

Chapter 1

SPMU365A–March 2014–Revised March 2014

Board Overview

The Tiva™ C Series TM4C1294 Connected LaunchPad Evaluation Board (EK-TM4C1294XL) is a low-cost evaluation platform for ARM® Cortex™-M4F-based microcontrollers. The Connected LaunchPad design highlights the TM4C1294NCPDT microcontroller with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation and a multitude of simultaneous serial connectivity. The Connected LaunchPad also features two user switches, four user LEDs, dedicated reset and wake switches, a breadboard expansion option and two independent BoosterPack XL expansion connectors. The pre-programmed quickstart application on the Connected LaunchPad also enables remote monitoring and control of the evaluation board from an internet browser anywhere in the world. The web interface is provided by 3rd party, Exosite. Each Connected LaunchPad is enabled on the Exosite platform allowing users to create and customize their own Internet-of-Things applications.

Figure 1-1 shows a photo of the Connected LaunchPad with key features highlighted.

Figure 1-1. Tiva C Series Connected LaunchPad Evaluation Board

Tiva is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

Board Overview SPMU365A–March 2014–Revised March 2014

Submit Documentation Feedback

www.ti.com

1.1 Kit Contents

The Connected LaunchPad Evaluation Kit contains the following items:

• Tiva™ C Series TM4C1294 Evaluation Board (EK-TM4C1294XL)

• Retractable Ethernet cable

• USB Micro-B plug to USB-A plug cable

• README First document

1.2 Using the Connected LaunchPad

The recommended steps for using the Connected LaunchPad Evaluation Kit are:

1. Follow the README First document included in the kit. The README First helps you get the Connected LaunchPad up and running in minutes. Within just a few minutes you can be controlling and monitoring the Connected LaunchPad through the internet using Exosite and the pre-programmed quickstart application.

2. Experiment with BoosterPacks. This evaluation kit conforms to the latest revision of the BoosterPack pinout standard. It has two independent BoosterPack connections to enable a multitude of expansion opportunities.

3. Take the first step towards developing your own applications. The Connected LaunchPad is supported by TivaWare for C Series. After installing TivaWare, look in the installation directory for examples\boards\ek-tm4c1294xl. You can find pre-configured example applications for this board as well as for this board with selected BoosterPacks. Alternately, use Energīa for a wiring frameworkbased cross-platform, fast-prototyping environment that works with this and other TI LaunchPads. See

Chapter 3 of this document for more details about software development. TivaWare can be

downloaded from the TI website at http://www.ti.com/tool/sw-tm4c. Energīa can be found at

http://energia.nu.

4. Customize and integrate the hardware to suit your end application. This evaluation kit can be used as a reference for building your own custom circuits based on Tiva C microcontrollers or as a foundation for expansion with your custom BoosterPack or other circuit. This manual can serve as a starting point for this endeavor.

5. Get Trained. You can also download hours of written and video training materials on this and related LaunchPads. Visit the Tiva C Series LaunchPad Workshop Wiki for more information.

6. More Resources. See the TI MCU LaunchPad web page for more information and available BoosterPacks. (http://www.ti.com/tiva-c-launchpad)

Kit Contents

1.3 Features

Your Connected LaunchPad includes the following features:

• Tiva TM4C1294NCPDTI microcontroller

• Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY Motion Control PWM

• USB 2.0 Micro A/B connector

• 4 user LEDs

• 2 user buttons

• 1 independent hibernate wake switch

• 1 independent microcontroller reset switch

• Jumper for selecting power source: – ICDI USB – USB Device – BoosterPack

• Preloaded Internet-of-Things Exosite quickstart application

• I/O brought to board edge for breadboard expansion

• Two independent BoosterPack XL standard connectors featuring stackable headers to maximize expansion through BoosterPack ecosystem

SPMU365A–March 2014–Revised March 2014 Board Overview

Submit Documentation Feedback

BoosterPacks

– For a complete list of BoosterPacks, see the TI MCU LaunchPad web page:

http://www.ti.com/launchpad

1.4 BoosterPacks

The Connected LaunchPad provides an easy and inexpensive way to develop applications with the TM4C1294NCPDTI microcontroller. BoosterPacks are add-on boards that follow a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the peripherals and potential applications that you can easily explore with the Connected LaunchPad.

You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas Instruments even helps you promote your BoosterPack to other members of the community. TI offers a variety of avenues for you to reach potential customers with your solutions.

1.5 Energīa

Energīa is an open-source electronics prototyping platform started in January of 2012 with the goal of bringing the Wiring and Arduino framework to the TI LaunchPad community. Energīa includes an integrated development environment (IDE) that is based on Processing.

Together with Energīa, LaunchPads can be used to develop interactive objects, taking inputs from a variety of switches or sensors, and controlling a variety of lights, motors, and other physical outputs. LaunchPad projects can be stand-alone (only run on the target board, i.e. your LaunchPad), or they can communicate with software running on your computer (Host PC). Energīa projects are highly portable between supported LaunchPad platforms. Projects written for your Connected LaunchPad can be run on other LaunchPads with little or no modifications.

More information is available at http://energia.nu.

www.ti.com

1.6 Specifications

Table 1-1 summarizes the specifications for the Connected LaunchPad.

Parameter Value

Board Supply Voltage

Dimensions 4.9 in x 2.2 in x .425 in (12.45 cm x 5.59 cm x 10.8 mm) (L x W x H)

Break-out Power Output

RoHS Status Compliant

Table 1-1. EK-TM4C1294XL Specifications

4.75 VDCto 5.25 VDCfrom one of the following sources:

• Debug USB U22 (ICDI) USB Micro-B cable connected to PC or other compatible power source.

• Target USB (U7) USB Micro-B cable connected to PC or other compatible power source.

• BoosterPack 1 (X8-4)

• BoosterPack 2 (X6-4)

• Breadboard expansion header (X11-2 or X11-97).

See schematic symbol JP1 for power input selection.

• 5 VDCto BoosterPacks, current limited by TPS2052B. Nominal rating 1 Amp. Board input power supply limitations may also apply.

• 3.3 VDCto BoosterPacks, limited by output of TPS73733 LDO. This 3.3-V plane is shared with on-board components. Total output power limit of TPS73733 is 1 Amp.

Board Overview SPMU365A–March 2014–Revised March 2014

Submit Documentation Feedback

Chapter 2

SPMU365A–March 2014–Revised March 2014

Hardware Description

The Connected LaunchPad includes a TM4C1294NCPDTI microcontroller with an integrated 10/100 Ethernet MAC and PHY. This advanced ARM® Cortex™ M4F MCU has a wide range of peripherals that are made available to users via the on-board accessories and the BoosterPack connectors. This chapter explains how those peripherals operate and interface to the microcontroller.

Figure 2-1 provides a high-level block diagram of the Connected LaunchPad.

Figure 2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram

2.1 Functional Description

2.1.1 Microcontroller

The TM4C1294NCPDTI is a 32-bit ARM Cortex-M4F based microcontroller with 1024-kB Flash memory, 256-kB SRAM, 6-kB EEPROM, and 120 MHz operation; integrated 10/100 Ethernet MAC and PHY; integrated USB 2.0 connectivity with external high-speed USB 3.0 PHY capability; a hibernation module, a multitude of serial connectivity and motion control PWM; as well as a wide range of other peripherals. See the TM4C1294NCPDTI microcontroller data sheet for more complete details.

Most of the microcontroller’s signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder pads. An internal multiplexor allows different peripheral functions to be assigned to each of these GPIO pads. When adding external circuitry, consider the additional load on the evaluation board power rails.

The TM4C1294NCPDTI microcontroller is factory-programmed with a quickstart demo program. The quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the quickstart application has been replaced with a user program. The quickstart application automatically connects to http://ti.exosite.com when an internet connection is provided through the RJ45 Ethernet jack on the evaluation board.

SPMU365A–March 2014–Revised March 2014 Hardware Description

Submit Documentation Feedback

Functional Description

2.1.2 Ethernet Connectivity

The Connected LaunchPad is designed to connect directly to an Ethernet network using RJ45 style connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for both the uIP and LwIP TCP/IP protocol stacks. The embedded Ethernet on this device can be programmed to act as an HTTP server, client or both. The design and integration of the circuit and microcontroller also enable users to synchronize events over the network using the IEEE1588 precision time protocol.

When configured for Ethernet operation, it is recommended that the user configure LED D3 and D4 to be controlled by the Ethernet MAC to indicate connection and transmit/receive status.

2.1.3 USB Connectivity

The Connected LaunchPad is designed to be USB 2.0 ready. A TPS2052B load switch is connected to and controlled by the microcontroller USB peripheral, which manages power to the USB micro A/B connector when functioning in a USB host. When functioning as a USB device, the entire Connected LaunchPad can be powered directly from the USB micro A/B connector. Use JP1 to select the desired power source.

USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB external PHY control and data signals are provided on the breadboard expansion header X11.

2.1.4 Motion Control

The Connected LaunchPad includes the Tiva C Series Motion Control PWM technology, featuring a PWM module capable of generating eight PWM outputs. The PWM module provides a great deal of flexibility and can generate simple PWM signals – for example, those required by a simple charge pump – as well as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter bridge.

A quadrature encoder interface (QEI) is also available to provide motion control feedback. See the BoosterPacks and Headers section of this document for details about the availability of these

signals on the BoosterPack interfaces.

www.ti.com

2.1.5 User Switches and LED's

Two user switches are provided for input and control of the TM4C1294NCPDTI software. The switches are connected to GPIO pins PJ0 and PJ1.

A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset signal to the BoosterPack and Breadboard headers. The wake switch is one way to bring the device out of hibernate mode.

Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller.

A power LED is also provided to indicate that 3.3 volt power is present on the board.

Hardware Description SPMU365A–March 2014–Revised March 2014

Submit Documentation Feedback

www.ti.com

Functional Description

2.1.6 BoosterPacks and Headers

2.1.6.1 BoosterPack 1

The Connected LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack 1, located around the ICDI portion of the board, is fully compliant with the BoosterPack standard with the single exception of GPIO pin PA6 (X8-16), which does not provide analog capability. PA6 is located near the bottom of the inner left BoosterPack XL header.

I2C is provided in both the original BoosterPack standard configuration as well as the updated standard location. Use of I2C on the bottom left of the BoosterPack connections per the updated standard is highly encouraged whenever possible.

Motion control advanced PWM connections are provided on the inner right connector for motion control applications.

Table 2-1 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available on each pin. The TM4C1294NCPDTI

GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’ and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins.

Table 2-1. BoosterPack 1 GPIO and Signal Muxing

Digital Function (GPIOPCTL Bit Encoding)

Standard MCU

Header Pin GPIO Analog

Function Pin

1 2 3 5 6 7 8 11 13 14 15

A1 1 +3.3 volts 3.3V A1 2 Analog PE4 123 AIN9 U1RI - - - - - - - - - SSI1XDAT0 A1 3 UART RX PC4 25 C1- U7Rx - - - - - - - - - EPI0S7 A1 4 UART TX PC5 24 C1+ U7Tx - - - - RTCCLK - - - - EPI0S6 A1 5 GPIO PC6 23 C0+ U5Rx - - - - - - - - - EPI0S5 A1 6 Analog PE5 124 AIN8 - - - - - - - - - - SSIXDAT1 A1 7 SPI CLK PD3 4 AIN12 - I2C8SDA T1CCP1 - - - - - - - SSI2CLk A1 8 GPIO PC7 22 C0- U5Tx - - - - - - - - - EPI0S4 A1 9 I2C SCL PB2 91 - - I2C0SCL T5CCP0 - - - - - - USB0STP EPI0S27 A1 10 I2C SDA PB3 92 - - I2C0SDA T5CCP1 - - - - - - USB0CLK EPI0S28 B1 1 +5 volts 5V B1 2 ground GND B1 3 Analog PE0 15 AIN3 U1RTS - - - - - - - - - B1 4 Analog PE1 14 AIN2 U1DSR - - - - - - - - - B1 5 Analog PE2 13 AIN1 U1DCD - - - - - - - - - B1 6 Analog PE3 12 AIN0 U1DTR - - - - - - - - - B1 7 Analog PD7 128 AIN4 U2CTS - T4CCP1 USB0PFLT - - NMI - - - SSI2XDAT2 B1 8 Analog PA6 40 - U2Rx I2C6SCL T3CCP0 USB0EPEN - - - - SSI0XDAT2 - EPI0S8 B1 9 A out PM4 74 TMPR3 U0CTS - T4CCP0 - - - - - - - B1 10 A out PM5 73 TMPR2 U0DCD - T4CCP1 - - - - - - - -

SPMU365A– March 2014 –Revised March 2014 Hardware Description

Submit Documentation Feedback

Functional Description

www.ti.com

Table 2-1. BoosterPack 1 GPIO and Signal Muxing (continued)

Digital Function (GPIOPCTL Bit Encoding)

Standard MCU

Header Pin GPIO Analog

Function Pin

1 2 3 5 6 7 8 11 13 14 15

C1 1 PWM PF1 43 - - - - EN0LED2 M0PWM1 - - - - SSI3XDAT0 TRD1 C1 2 PWM PF2 44 - - - - - M0PWM2 - - - - SSI3Fss TRD0 C1 3 PWM PF3 45 - - - - - M0PWM3 - - - - SSI3Clk TRCLK C1 4 PWM PG0 49 - - I2C1SCL - EN0PPS M0PWM4 - - - - - EPI0S11 C1 5 Capture PL4 85 - - - T0CCP0 - - - - - - USB0D4 EPI0S26 C1 6 Capture PL5 86 - - - T0CCP1 - - - - - - USB0D5 EPI0S33 C1 7 GPIO PL0 81 - - I2C2SDA - - M0FAULT3 - - - - USB0D0 EPI0S16 C1 8 GPIO PL1 82 - - I2C2SCL - - PhA0 - - - - USB0D1 EPI0S17 C1 9 GPIO PL2 83 - - - - C0o PhB0 - - - - USB0D2 EPI0S18 C1 10 GPIO PL3 84 - - - - C1o IDX0 - - - - USB0D3 EPI0S19 D1 1 ground GND D1 2 PWM PM3 75 - - - T3CCP1 - - - - - - - EPI0S12 D1 3 GPIO PH2 31 - U0DCD - - - - - - - - - EPI0S2 D1 4 GPIO PH3 32 - U0DSR - - - - - - - - - EPI0S3 D1 5 reset RESET D1 6 SPI MOSI PD1 2 AIN14 - I2C7SDA T0CCP1 C1o - - - - - - SSI2XDAT0 D1 7 SPI MISO PD0 1 AIN15 - I2C7SCL T0CCP0 C0o - - - - - - SSI2XDAT1 D1 8 GPIO PN2 109 - U1DCD U2RTS - - - - - - - - EPI0S29 D1 9 GPIO PN3 110 - U1DSR U2CTS - - - - - - - - EPI0S30 D1 10 GPIO PP2 103 - U0DTR - - - - - - - - USB0NXT EPI0S29

Hardware Description SPMU365A–March 2014–Revised March 2014

Submit Documentation Feedback

www.ti.com

Functional Description

2.1.6.2 BoosterPack 2

The second BoosterPack XL interface is located near the middle of the board. This interface is fully compliant with the BoosterPack standard, and adds features not covered by the BoosterPack standard that enable operation with additional BoosterPacks.

An additional analog signal is provided on the outer left header (X6-9). This signal can be used to monitor the touch panel on the popular Kentec EB-LM4F120-L35 BoosterPack.

Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can be optionally routed to the BoosterPack 2 interface. The location of these signals is consistent with the CAN interface on the Tiva C Series TM4C123G LaunchPad and the Stellaris LM4F120 LaunchPad. In the default configuration, UART0 is used for the ICDI virtual UART and CAN is not present on the BoosterPack headers. In this configuration, the ROM serial bootloader can be used over the ICDI virtual UART. When the jumpers are configured for CAN on the BoosterPack, then UART4 must be used for the ICDI virtual UART.

To comply with both the original and the new BoosterPack standard, I2C is provided on both sides of the BoosterPack connection. Use of I2C on the bottom left of the BoosterPack connection is highly encouraged where possible, to be in compliance with the new BoosterPack standard. To provide I2C capability on the right side of the connector, per the original standard, two zero-ohm resistors (R19 and R20) are used to combine the SPI and I2C signals. These signals are not shared with any other pins on the LaunchPad and therefore removal of these zero-ohm resistors should not be required. Software should be certain that unused GPIO signals are configured as inputs.

Table 2-2 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available at each pin. The TM4C1294NCPDT

Table 2-2. BoosterPack 2 GPIO and Signal Muxing

Digital Function (FPIOPCTL Bit Encoding)

Standard MCU

Header Pin GPIO Analog

Function Pin

1 2 3 5 6 7 8 11 13 14 15

A2 1 3.3V A2 2 Analog PD2 3 AIN13 - I2C8SCL T1CCP0 C2o - - - - - - SSI2Fss A2 3 UART RX PP0 118 C2+ U6Rx - - - - - - - - - SSI3XDAT2 A2 4 UART TX PP1 119 C2- U6Tx - - - - - - - - - SSI3XDAT3

PD4 125 AIN7 U2Rx - T3CCP0 - - - - - - - SSI1XDAT2

GPIO

A2 5

(See JP4)

PA0 33 - U0Rx I2C9SCL T0CCP0 - - CANORx - - - - PD5 126 AIN6 U2Tx - T3CCP1 - - - - - - - SSI1XDAT3

Analog

A2 6

(See JP5)

PA1 34 - U0Tx I2C9SDA T0CCP1 - - CAN0Tx - - - - A2 7 SPI CLK PQ0 5 - - - - - - - - - - SSI3Clk EPI0S20 A2 8 GPIO PP4 105 - U3RTS U0DSR - - - - - - - USB0D7 A2 9 I2C SCL PN5 112 - U1RI U3CTS I2C2SCL - - - - - - - EPIO0S35 A2 10 I2C SDA PN4 111 - U1DTR U3RTS I2C2SDA - - - - - - - EPIO0S34 B2 1 5V B2 2 GND B2 3 Analog PB4 121 AIN10 U0CTS I2C5SCL - - - - - - - - SSI1Fss

SPMU365A– March 2014 –Revised March 2014 Hardware Description

Submit Documentation Feedback

+ 23 hidden pages

Texas Instruments Tiva TM4C1294 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual