Small-Outline (DW) Packages, Plastic (FN)
and Ceramic (FK) Chip Carriers, and
Standard Plastic (NT) and Ceramic (JT)
300-mil DIPs
description
These dual 4-bit D-type edge-triggered flip-flops
feature 3-state outputs designed specifically as
bus drivers. They are particularly suitable for
implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
The edge-triggered flip-flops enter data on the
low-to-high transition of the clock (CLK) input.
The SN54ALS874B, SN74ALS874B, and
SN74AS874 have clear (CLR
noninverting Q outputs. The SN74ALS876A and
SN74AS876 have preset (PRE
inverting Q
four Q or Q
outputs; taking PRE low causes the
outputs to go low independently of the
clock.
The SN54ALS874B is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74ALS874B, SN74ALS876A,
SN74AS874, and SN74AS876 devices are
characterized for operation from 0°C to 70°C.
) inputs and
) inputs and
SN74ALS874B, SN74AS874 . . . DW OR NT PACKAGE
SN74ALS876A, SN74AS876 . . . DW OR NT PACKAGE
SN54ALS874B ...JT PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
1CLR
NC
28 27 26
15 16 17 18
NC
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
CC
V
2CLR
24
23
22
21
20
19
18
17
16
15
14
13
1CLR
1OE
1D1
1D2
1D3
1D4
2D1
2D2
2D3
2D4
2OE
GND
SN54ALS874B . . . FK PACKAGE
1D2
5
1D3
6
1D4
7
NC
8
2D1
9
2D2
10
2D3
11
NC – No internal connection
4
12
1D1
13 14
2D4
(TOP VIEW)
1OE
321
2OE
(TOP VIEW)
1PRE
1OE
1D1
1D2
1D3
1D4
2D1
2D2
2D3
2D4
2OE
GND
V
CC
1CLK
1Q1
1Q2
1Q3
1Q4
2Q1
2Q2
2Q3
2Q4
2CLK
2CLR
1CLK
1Q1
2Q4
2CLK
V
CC
1CLK
1Q
1Q
1Q3
1Q
2Q
2Q
2Q3
2Q
2CLK
2PRE
25
24
23
22
21
20
19
1
2
4
1
2
4
1Q2
1Q3
1Q4
NC
2Q1
2Q2
2Q3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
84010013AACTIVELCCCFK281TBDPOST-PLATE N / A for Pkg Type
8401001KAOBSOLETECFPW24TBDCall TICall TI
8401001LAACTIVECDIPJT241TBDA42 SNPBN / A for Pkg Type
SN54ALS874BJTACTIVECDIPJT241TBDA42 SNPBN / A for Pkg Type
SN74ALS874BDWACTIVESOICDW2425Green (RoHS &
SN74ALS874BDWE4ACTIVESOICDW2425Green (RoHS &
SN74ALS874BDWG4ACTIVESOICDW2425Green (RoHS &
SN74ALS874BDWRACTIVESOICDW242000 Green (RoHS &
SN74ALS874BDWRE4ACTIVESOICDW242000 Green (RoHS &
SN74ALS874BDWRG4ACTIVESOICDW242000 Green (RoHS &
SN74ALS874BNSRACTIVESONS242000 Green (RoHS &
SN74ALS874BNSRE4ACTIVESONS242000 Green (RoHS &
SN74ALS874BNSRG4ACTIVESONS242000 Green (RoHS &
SN74ALS874BNTACTIVEPDIPNT2415Pb-Free
SN74ALS874BNTE4ACTIVEPDIPNT2415Pb-Free
SN74ALS876ADWACTIVESOICDW2425Green (RoHS &
SN74ALS876ADWE4ACTIVESOICDW2425Green (RoHS &
SN74ALS876ADWG4ACTIVESOICDW2425Green (RoHS &
SN74ALS876ADWRACTIVESOICDW242000 Green (RoHS &
SN74ALS876ADWRE4ACTIVESOICDW242000 Green (RoHS &
SN74ALS876ADWRG4ACTIVESOICDW242000 Green (RoHS &
SN74ALS876ANTACTIVEPDIPNT2415Pb-Free
SN74ALS876ANTE4ACTIVEPDIPNT2415Pb-Free
SN74AS874DWACTIVESOICDW2425Green (RoHS &
SN74AS874DWE4ACTIVESOICDW2425Green (RoHS &
SN74AS874DWG4ACTIVESOICDW2425Green (RoHS &
SN74AS874DWRACTIVESOICDW242000 Green (RoHS &CU NIPDAULevel-1-260C-UNLIM
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAUN / A for Pkg Type
CU NIPDAUN / A for Pkg Type
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAUN / A for Pkg Type
CU NIPDAUN / A for Pkg Type
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
9-Oct-2007
(3)
no Sb/Br)
SN74AS874DWRE4ACTIVESOICDW242000 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS874DWRG4ACTIVESOICDW242000 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS874NTACTIVEPDIPNT2415Pb-Free
CU NIPDAUN / A for Pkg Type
(RoHS)
SN74AS874NTE4ACTIVEPDIPNT2415Pb-Free
CU NIPDAUN / A for Pkg Type
(RoHS)
SN74AS876DWACTIVESOICDW2425Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS876DWE4ACTIVESOICDW2425Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS876DWG4ACTIVESOICDW2425Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS876DWRACTIVESOICDW242000 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS876DWRE4ACTIVESOICDW242000 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS876DWRG4ACTIVESOICDW242000 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
SN74AS876NTACTIVEPDIPNT2415Pb-Free
CU NIPDAUN / A for Pkg Type
(RoHS)
SN74AS876NTE4ACTIVEPDIPNT2415Pb-Free
CU NIPDAUN / A for Pkg Type
(RoHS)
SNJ54ALS874BFKACTIVELCCCFK281TBDPOST-PLATE N / A for Pkg Type
SNJ54ALS874BJTACTIVECDIPJT241TBDA42 SNPBN / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
24
DIM
A MAX
A MIN
B MAX
B MIN
PINS **
24
1.260
(32,04)
1.230
(31,24)
0.310
(7,87)
0.290
(7,37)
0°–15°
28
1.425
(36,20)
1.385
(35,18)
0.315
(8,00)
0.295
(7,49)
B
A
13
0.280 (7,11)
0.250 (6,35)
1
0.070 (1,78) MAX
0.020 (0,51) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
M
12
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.010 (0,25) NOM
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
4040050/B 04/95
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24) CERAMIC DUAL FLATPACK
0.090 (2,29)
0.045 (1,14)
0.640 (16,26)
0.490 (12,45)
Base and Seating Plane
0.360 (9,14)
0.240 (6,10)
0.375 (9,53)
0.340 (8,64)
0.006 (0,15)
0.004 (0,10)
0.395 (10,03)
0.360 (9,14)
124
0.360 (9,14)
0.240 (6,10)
0.045 (1,14)
0.026 (0,66)
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
30° TYP
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
0.030 (0,76)
0.015 (0,38)
1312
1.115 (28,32)
0.840 (21,34)
4040180-5/B 03/95
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
24
1
0.100 (2,54) MAX
0.070 (1,78)
0.030 (0,76)
0.023 (0,58)
0.015 (0,38)
A
13
B
12
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
DIM
A MAX
A MIN
B MAX
B MIN
PINS **
24
1.280
(32,51)
1.240
(31,50)
0.300
(7,62)
0.245
(6,22)
0.320 (8,13)
0.290 (7,37)
0°–15°
28
1.460
(37,08)
1.440
(36,58)
0.291
(7,39)
0.285
(7,24)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB