Texas Instruments SLOU061A User Manual

Universal Operational Amplifier Single, Dual, Quad (SOIC) Evaluation Module With Shutdown
User’s Guide
April 2001 Mixed-Signal Products
SLOU061A
IMPORTANT NOTICE
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with TI’s standard warranty . T esting and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction of this information with alteration voids all warranties provided for an associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters that product or service voids all express and any implied warranties for the associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products.
Mailing Address:
Texas Instruments Post Office Box 655303 Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated
www.ti.com/sc/docs/stdterms.htm
stated by TI for
Related Documentation From Texas Instruments
J
Amplifiers and Comparators Data Book (literature number SLOD002). This data book contains data sheets and other information on the TI operational amplifiers that can be used with this evaluation module.
J
Power Supply Circuits Data Book (literature number SLVD002). This data book contains data sheets and other information on the TI shunt regulators that can be used with this evaluation module.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.
Preface
Trademarks
PowerPAD is a trademark of Texas Instruments.
Chapter TitleAttribute Reference
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Running TitleAttribute Reference
Contents
1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Design Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Power Requirements 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Evaluation Module Layout 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Physical Considerations 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Area 100—Single Device SOIC 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Area 200—Dual Device SOIC 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Area 300—Quad Device SOIC 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 General Power Dissipation Considerations 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.6 EVM Component Placement 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7 EVM Board Layout 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 Example Circuits 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Schematic Conventions 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Inverting Amplifier 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 Noninverting Amplifier 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 Differential Amplifier 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 Sallen-Key Low-Pass Filter 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6 Sallen-Key High-Pass Filter 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7 Two Operational Amplifier Instrumentation Amplifier 3-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8 Quad Operational Amplifier Instrumentation Amplifier 3-10. . . . . . . . . . . . . . . . . . . . . . . . . . .
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Running TitleAttribute Reference
Figures
2–1 Area 100 SchematicSingle Device, SOIC (8-pin) 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Area 200 SchematicDual Device, SOIC (14-pin) 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 Area 300 SchematicQuad Device, SOIC (16-pin) 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 Maximum Power Dissipation vs Free-Air Temperature 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–5 EVM Component Placement 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–6 EVM Board LayoutTop 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–7 EVM Board LayoutBottom 2-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–1 Inverting Amplifier with Dual Supply Using Area 100 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–2 Noninverting Amplifier with Single Supply Using Area 100 3-3. . . . . . . . . . . . . . . . . . . . . . . . . .
3–3 Single Operational Amplifier Differential Amplifier With Single Supply Using Area 100 3-4. .
3–4 Sallen-Key Low-Pass Filter With Dual Supply Using Area 200 3-5. . . . . . . . . . . . . . . . . . . . . . .
3–5 Sallen-Key High-Pass Filter With Single Supply Using Area 200 3-7. . . . . . . . . . . . . . . . . . . . .
3–6 Two Operational Amplifier Instrumentation Amplifier With Single Supply Using Area 200 3-9 3–7 Quad Operational Amplifier Instrumentation Amplifier With Dual Supply Using Area 300 3-11
Table
2–1 Dissipation Rating Table 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Chapter 1
Introduction
This user’s guide describes the universal operational amplifier single, dual, quad (SOIC) evaluation module (EVM) with shutdown (SLOP248). The EVM simplifies evaluation of Texas Instruments surface-mount op amps with or without shutdown feature.
Topic Page
1.1 Design Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Power Requirements 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction
1-1
Design Features
1.1 Design Features
The EVM board design allows many circuits to be constructed easily and quickly. There are three circuit development areas on the board, and each uses IC amplifiers in the SOIC package. Area 100 is for a single operational amplifier (op amp), with or without shutdown. It also features offset nulling pin pads. Area 200 is for a dual op amp, with or without shutdown. Area 300 is for a quad op amp, with or without shutdown. A few possible circuits include:
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The EVM PCB is of two-layer construction, with a ground plane on the solder side. Circuit performance should be comparable to final production designs.
Voltage follower Noninverting amplifier Inverting amplifier Simple or algebraic summing amplifier Difference amplifier Current to voltage converter Voltage to current converter Integrator/low-pass filter Differentiator/high-pass filter Instrumentation amplifier Sallen-Key filter
1.2 Power Requirements
The devices and designs that are used dictate the input power requirements. Three input terminals are provided for each area of the board:
Vx+ Positive input power for area x00 i.e., V1+ area 100 GNDx Ground reference for area x00 i.e., GND2 area 200 Vx– Negative input power for area x00 i.e., V3– area 300
Each area has four bypass capacitors – two for the positive supply, and two for the negative supply . Each supply should have a 1-µF to 10-µF capacitor for low-frequency bypassing and a 0.01-µF to 0.1-µF capacitor for high-frequency bypassing.
When using single-supply circuits, the negative supply is shorted to ground by bridging C104 or C105 in area 100, C209 or C210 in area 200, or C31 1 or C312 in area 300. Power input is between Vx+ and GNDx. The voltage reference circuitry is provided for single-supply applications that require a reference voltage to be generated.
1-2
Introduction
Chapter 2
Evaluation Module Layout
This chapter shows the universal operational amplifier single, dual, quad (SOIC) evaluation module (EVM) with shutdown board layout, schematics of each area, and describes the relationships between the three areas.
Topic Page
2.1 Physical Considerations 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Area 100—Single Device SOIC 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Area 200—Dual Device SOIC 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Area 300Quad Device SOIC 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 General Power Dissipation Considerations 2–7. . . . . . . . . . . . . . . . . . . . . .
2.6 Component Placement 2–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7 Board Layout 2–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Evaluation Module Layout
2-1
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