MSP-EXP430FR5739 FRAM Experimenter Board
User's Guide
Literature Number: SLAU343B
May 2011–Revised February 2012
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SLAU343B–May 2011–Revised February 2012
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Contents
1 Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board ................................. 5
1.1 Introduction ............................................................................................................... 5
1.2 Kit Contents .............................................................................................................. 6
1.3 MSP-EXP430FR5739 Board Overview ............................................................................... 6
1.4 Connecting the Hardware .............................................................................................. 6
1.5 Starting the PC GUI ..................................................................................................... 6
2 MSP-EXP430FR5739 User Experience Demo .......................................................................... 7
2.1 Associated Zip Folder Contents ....................................................................................... 7
2.2 The User Experience Demo ........................................................................................... 7
2.3 View, Edit, or Recompile the User Experience Code Using an IDE ............................................ 13
3 MSP-EXP430FR5739 Hardware ............................................................................................ 14
3.1 MSP430FR5739IRHA Device Pin Designation .................................................................... 14
3.2 Schematics ............................................................................................................. 15
3.3 PCB Layout ............................................................................................................. 18
3.4 Bill of Materials (BOM) ................................................................................................ 21
4 Suggested Reading ........................................................................................................... 22
5 References ....................................................................................................................... 22
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List of Figures
1 MSP-EXP430FR5739 Overview.......................................................................................... 5
2 Comparing Write Speeds When Writing to Nonvolatile Memory (MSP430FR5739 FRAM vs
MSP430F2274 Flash) ...................................................................................................... 8
3 Comparing Average Power When Writing to Nonvolatile Memory at 13 kBps (MSP430FR5739 FRAM vs
MSP430F2274 Flash)..................................................................................................... 10
4 On-Board Accelerometer................................................................................................. 11
5 On-Board NTC Thermistor ............................................................................................... 12
6 MSP430FR5739 Pin Designation ....................................................................................... 14
7 Schematics (1 of 3)........................................................................................................ 15
8 Schematics (2 of 3)........................................................................................................ 16
9 Schematics (3 of 3)........................................................................................................ 17
10 MSP-EXP430FR5739 Top Layer........................................................................................ 18
11 MSP-EXP430FR5739 Bottom Layer.................................................................................... 19
12 MSP-EXP430FR5739 Silkscreen ....................................................................................... 20
List of Tables
1 User Experience Source Files ........................................................................................... 13
2 Bill of Materials (BOM).................................................................................................... 21
4
List of Figures SLAU343B–May 2011–Revised February 2012
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USB Connection
Debugging and
Programming Interface
Accelerometer
NTC Thermistor
LED0 to LED8
MSP430FR5739 device
User Input Switches S1,S2
Reset Switch
Connection to EXP-MSP430F5438
Connection to CCxxxx
Daughter Cards
SBW and MSP430
Application UART
SLAU343B–May 2011–Revised February 2012
MSP-EXP430FR5739 FRAM Experimenter Board
1 Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board
1.1 Introduction
The MSP-EXP430FR5739 Experimenter Board introduces TI's first embedded ferro-electric random
access memory (FRAM) based MCU, the MSP430FR5739. The experimenter board is an ideal platform
for evaluating the latest in embedded memory technology while allowing the user to easily develop,
debug, and implement prototypes in an efficient manner.
The MSP430FR5739 device is supported by both IAR Embedded Workbench and Code Compose Studio.
It is recommended to download the latest version of the IDE from www.msp430.com.
The Quick Start Guide (SLAU341) is recommended for users who cannot wait to get started developing
with the MSP430FR5739. For all others, this MSP-EXP430FR5739 FRAM Experimenter Board User's
Guide provides detailed information on the hardware, the user experience firmware, and the
MSP430FR5739 device.
The MSP-EXP430FR5739 Experimenter Board is available for purchase from the TI eStore at
https://estore.ti.com/MSP-EXP430FR5739-MSP-EXP430FR5739-Experimenter-Board-P2430C42.aspx.
User's Guide
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Figure 1. MSP-EXP430FR5739 Overview
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Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board
1.2 Kit Contents
The MSP-EXP430FR5739 FRAM Experimenter Board kit includes the following:
• The MSP-EXP430FR5739 board
• Mini USB-B cable, 0.5 m
• 12-pin PCB connectors (two male and two female)
• 32.768-kHz clock crystal from Microcrystal (www.microcrystal.com)
The 32.768-kHz crystal can be used as the low-frequency XT oscillator. It is not required for the User
Experience code and can be populated as needed.
• Quick start guide
See Section 2.1 for details on the associated software and source code.
1.3 MSP-EXP430FR5739 Board Overview
The experimenter board (see Figure 1) comes equipped with the following features:
• USB debugging and programming interface that uses a driverless installation and provides an
application UART to communicate back to the PC
• On-board ADXL335 accelerometer
• NTC thermistor for temperature sensing
• Two user input switches and a reset switch
• Eight LEDs for output display
• Connectivity to the MSP-EXP430F5438 Experimenter Board
• Connectivity to CCxxx radio daughter cards
• Easily accessible device pins for debugging purposes or as socket for adding customized extension
• Separate power jumpers to measure power to the MSP430 and the RF daughter card.
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1.4 Connecting the Hardware
Connect the MSP-EXP430FR5739 to the PC using the enclosed USB cable. If the PC has an MSP430
Integrated Development Environment (IDE) such as Code Composer Studio™ or IAR Embedded
Workbench™ already installed, the driver files are automatically located and installed.
If there are no IDEs installed in the PC, unzip the folder associated with this user's guide (see Section 2.1)
and point the installation to the [Install Path]\MSP-EXP430FR5739\Drivers folder.
After the drivers are installed, go to My Computer → Properties → Hardware → Device Manager to verify
that the board is enumerated under Ports COM & LPT as MSP430 Application UART.
1.5 Starting the PC GUI
The Graphical User Interface (GUI) for the PC is located in the associated zip file (see Section 2.1) under
[Install Path]\MSP-EXP430FR5739\Graphical User Interface.
Double click on FRAM_GUI.exe to load the PC application. More information on how to use this
application is provided in Section 2.
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2 MSP-EXP430FR5739 User Experience Demo
2.1 Associated Zip Folder Contents
The zip file that contains the software and source code for the MSP-EXP430FR5739 can be downloaded
from www.ti.com/lit/zip/slac492. The contents of the zip include:
• User Experience source code and project files
• Drivers that support the board installation
• PC GUI
The design files for the experimenter board are can be downloaded from www.ti.com/lit/zip/slac502.
2.2 The User Experience Demo
The User Experience demo is pre-loaded in the MSP-EXP430FR5739 board.
The user input to the demo is given using the switches S1 and S2. These switched allow the user to
select the mode of operation and other options.
The output from the demo is displayed using the LEDs (LED1 to LED8) and is also sent via the
back-channel UART that transmits information to the PC.
There are four modes of operation for the User Experience demo:
1. High-speed FRAM writes
2. Emulating the speed of flash writes
3. Sampling accelerometer data and writing to FRAM
4. Sampling thermistor data and writing to FRAM
MSP-EXP430FR5739 User Experience Demo
2.2.1 Entering and Exiting the Demo Modes
Follow these steps to enter and exit the demo modes:
1. Press switch S1 for mode selection. After you press S1, LED8 through LED5 light up to show the
corresponding mode.
2. Press switch S2 to enter the mode.
3. Press switch S2 when inside a mode to turn off the display (LED and UART output). This is useful
when measuring power.
4. Press S1 to exit a mode and return to mode selection.
NOTE: Pressing S2 without selecting a mode causes LED8 to toggle rapidly, indicating an invalid
sequence. To exit from this mode, press S1 to return to mode selection.
The MSP-EXP430FR5739 board is equipped with a reset switch. On reset, the device displays a short
LED lighting sequence.
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Write Speed (kB/s)
1400
13
1
10
100
1000
10000
FRAM Flash
MSP-EXP430FR5739 User Experience Demo
2.2.2 Using Mode 1 – FRAM High Speed Writes
Mode 1 is entered by pressing S1 once, followed by S2. On entry, LED8 through LED1 light up
sequentially to display the speed of FRAM writes.
Every time the LED1 through LED8 sequence is completed, 800KB are written to FRAM. In this mode,
FRAM is bring written to at about 1.8MB per second. In comparison, a full-speed write to flash can
achieve speeds of approximately 13kB per second.
Figure 2. Comparing Write Speeds When Writing to Nonvolatile Memory
(MSP430FR5739 FRAM vs MSP430F2274 Flash)
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Note that the code is optimized for power and not speed. FRAM memory blocks can be written at speeds
greater than 8MB per second depending on how the code is optimized. See the application report
Achieving High-Speed FRAM Writes Using the MSP430FR5739 for more details.
On entering Mode 1, the address of the FRAM scratchpad location is calculated. For the User Experience
demo, the scratchpad location starts at 0xD400 and ends at 0xF000. This location can be modified in the
header file FR_EXP.h. Note that when changing this location, it is important to first check the code space
requirements in the map file to ensure that the FRAM scratchpad area does not overlap with the
application code. Different compilers and optimization settings may impact the placement of the
application code. If any overlap occurs, the application code may be overwritten in Mode 1, which can
cause the demo to fail.
In Mode 1, the system main clock is configured to use the DCO set to 8 MHz. A function that performs
long-word writes to FRAM is called continuously inside a while loop. Each time the FRAM_Write() function
in FR_EXP.c is called, 512 bytes are written. This number was chosen arbitrarily to mimic flash segments,
and there are no restrictions on the number of FRAM bytes that can be written at once. While in Mode 1,
the LED sequence changes every time 100kB are written. For example, after the first 100KB are written,
LED8 is turned on; after the next 100kB are written, LED8 and LED7 are turned on; and so on. The
sequence completes when all eight LEDs are turned on, after which the process rolls over and starts
again from LED8.
Also, after every 100kB, a UART data transmission occurs. This data is sent to the PC via a back-channel
UART and is used to calculate the FRAM write speed and endurance information that is displayed in the
PC GUI. The raw data can also be viewed directly using a PC application such as HyperTerminal.
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2.2.2.1 Measuring Current on the MSP-EXP430FR5739
While measuring the active power in a mode, the LEDs should be turned off and the UART transmissions
should be halted. This is done by pressing switch S2 while inside the mode. Switch S2 toggles the display
settings, turning them on or off as needed. Turning the display off allows the user to isolate and measure
the current consumption of the MSP430 device when executing instructions at a clock speed of 8 MHz
and writing to FRAM. In bench tests, the MSP430 I
DVCC
Note that, because of the nature of the FRAM cache, the number of accesses to FRAM memory can
greatly impact the active power consumption. Unoptimized code that performs a higher number of
accesses to FRAM can cause an increase in the measured current. It is advisable to review the compiler
settings when setting up a project using IDEs such as CCS or IAR to ensure the most efficient code and,
hence, the least active power.
The project that accompanies this document (see Section 2.1) uses a level 1 optimization setting in both
IAR and CCS that is one step higher than the default optimization levels.
As mentioned previously, when measuring the ICCon the board, it is important to isolate the current
consumption by the MSP430FR5739 only. The measurement can be done when the board is powered via
USB or externally via a battery. When powering via the USB, it is recommended to disconnect the
emulation portion from the MSP430FR5739 device. This can be done by removing jumpers TXD, RXD,
Reset, and Test on J3. A multimeter can be used to measure the current into the MSP430FR5739 VCCby
removing the VCCjumper and placing the multimeter leads in series.
An alternate approach requires powering the board externally via the VCCand GND connection and
disconnecting the USB cable from the board. In this case, the multimeter can be placed in series to VCCby
removing the MSP_PWR jumper.
These recommendations hold true when measuring I
MSP-EXP430FR5739 User Experience Demo
was measured at approximately 800 µA.
in all four modes.
DVCC
2.2.2.2 Displaying Results on the PC GUI
The GUI associated with this document provides details on the time elapsed in the mode, number of bytes
written, speed of FRAM, and the endurance of FRAM emulated over a 512 byte FRAM block.
The endurance is calculated based on the 1014program/erase cycles for the MSP430FR5739. Because
the GUI updates every one minute, the scale of reduction of FRAM endurance is very small. A more
obvious decline in endurance can be observed in Mode 2 when the endurance reduction when using flash
is emulated.
2.2.3 Using Mode 2 – Emulating the Speed of Flash Writes
Mode 2 is entered by pressing S1 twice, followed by S2. In this mode, the maximum speed at which flash
can be written to (at a 100% active duty cycle) is emulated on FRAM.
Similar to Mode 1, on entry into Mode 2, LED8 through LED1 light up sequentially to display the speed of
emulated flash writes. Every time the LED1 through LED8 sequence is completed, an 800KB write to flash
is emulated. In this mode, FRAM is written to at approximately 12 kBps. The entire sequence requires
approximately 80 seconds, so the demo should be observed for more than one minute to see the LED
sequence roll over.
NOTE: The time to run this sequence varies depending on the frequency source to the interval timer
(that is, the VLO).
The test uses the same scratchpad FRAM memory as Mode 1 and the same system setup. In this mode,
after every 2KB of memory is written, a UART packet is transmitted to the PC GUI to allow it to calculate
speed and endurance information.
When measuring the average power the methodology described in Section 2.2.2.1 needs to be followed.
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Power Consumption at 13 kB/s (µA)
1
10
100
1000
10000
FRAM Flash
Average power (µA)
MSP-EXP430FR5739 User Experience Demo
2.2.3.1 The Math Behind Mode 2
The MSP430F2274 device was used as a benchmark device to calculate the maximum flash write speed.
For a 512-byte block of flash, the following parameters were obtained from the MSP430F2274 data sheet:
Segment erase time = 4819 × t
Where, t
FTG
= 1 / f
FTG
FTG
≈ 1 / 300 kHz
512 bytes write time ≈ 51.2 ms
Total time to write to 512 bytes ≈ 67.2 ms
Time to write to 100KB = 6.72 seconds, which calculates to 14.8 kBps
When measuring the speed of continuous flash writes on the bench, the observed speed is approximately
12 kBps, because the code execution overhead is added to the time calculated above.
This write speed is emulated with the FRAM device by maintaining a low active duty cycle and performing
one 512 byte block write every 40 ms.
Number of writes per second = 1 / 40 ms = 25
Number of bytes written per second = 512 × 25 = 12.800 kBps
The timing of the FRAM write is controlled by the VLO clock.
From these bench tests, it can be seen that writing 12 kBps to flash requires nearly 100% duty cycle,
while writing the same speed to FRAM requires less than 1% duty cycle. The rest of the time, the FRAM
device is in shutdown mode (LPM4), which results in an average current of less than 10 µA. In
comparison, for a similar write speed, flash-based MCUs can require average current up to 2.2 mA.
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= 16 ms
Figure 3. Comparing Average Power When Writing to Nonvolatile Memory at 13 kBps
(MSP430FR5739 FRAM vs MSP430F2274 Flash)
2.2.3.2 Displaying Results on the PC GUI
When in Mode 2, the GUI provides details on the time elapsed in the mode, number of bytes written,
speed of emulated flash writes, and the endurance emulated over a 512 byte flash block.
The endurance is calculated based on the 104program/erase cycles (minimum) for the MSP430F2274. If
a 512-byte block on a flash device were written to at a speed of 12.5 kBps (that is, 25 times per second),
the endurance would exceed the minimum limit in 10000/25 or 6.6 minutes.
Note that the MSP-EXP430FR5739 board only emulates this test to demonstrate a comparison in speed
and endurance between FRAM and flash; it does not perform the test on an actual flash device.
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3 Axis Accelerometer
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2.2.4 Using Mode 3 – Accelerometer Demo
Mode 3 is entered by pressing switch S1 three times, followed by switch S2.
Upon entering this mode, the on-board accelerometer (see Figure 4) is calibrated. To aid this calibration
process, it is recommended to place the board on a level surface before entering the mode.
MSP-EXP430FR5739 User Experience Demo
Figure 4. On-Board Accelerometer
After the calibration sequence is completed, LED4 and LED5 are turned on. When tilting the board in an
upward or downward direction, the LEDs follow the direction of the tilt. S2 toggles the display on and off,
similar to other modes.
Mode 3 also writes the sampled data from the ADC to the FRAM in real time with no wait states or extra
cycles spent on setting up the FRAM. This can be observed in the ADC interrupt service routine. The
sampling takes place at more than 15k samples per second. At this speed, flash devices require that the
data be buffered in RAM before writing to flash. In FRAM devices, the only bottleneck is the speed at
which the ADC can sample, not the writes to nonvolatile memory.
2.2.4.1 Displaying Results on the PC GUI
When in the accelerometer mode, the GUI mimics the LEDs that are lit up on the Experimenter Board and
are a reflection of the tilt of the board.
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NTC Thermistor
MSP-EXP430FR5739 User Experience Demo
2.2.5 Using Mode 4 – Temperature Sensor Demo
Mode 4 is entered by pressing switch S1 four times, followed by switch S2.
Upon entering this mode, the on-board thermistor (see Figure 5) is calibrated.
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Figure 5. On-Board NTC Thermistor
After the calibration sequence is completed, LED4 and LED5 are turned on. When the NTC resistor is
heated (for example, by placing a finger on it), LED3 through LED1 are turned on sequentially. When the
NTC is cooled (for example, by using a freeze spay or a keyboard dust remover that uses compressed air)
LED5 through LED8 are turned on sequentially.
Similar to Mode 3, Mode 4 also writes the sampled data from the ADC to the FRAM in real time with no
wait states or extra cycles spent on setting up the FRAM. This can be observed in the ADC interrupt
service routine. The sampling takes place at more than 15k samples per second. At this speed, flash
devices require that the data be buffered in RAM before writing to flash. In FRAM devices, the only
bottleneck is the speed at which the ADC can sample, not the writes to nonvolatile memory.
2.2.5.1 Displaying Results on the PC GUI
When in the temperature sense mode, the GUI mimics the LEDs that are lit up on the Experimenter Board
and are a reflection of the thermistor's ambient temperature measurement.
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MSP-EXP430FR5739 User Experience Demo
2.3 View, Edit, or Recompile the User Experience Code Using an IDE
There are different development software tools available for the MSP-EXP430FR5739 board. IAR
Embedded Workbench™ KickStart™ and Code Composer Studio™ (CCS) IDEs are both available in a
free limited version. IAR Embedded Workbench allows 4KB of C-code compilation. CCS is limited to a
code size of 16KB. The software is available at www.ti.com/msp430.
To view, modify, or edit the User Experience code provided with the MSP-EXP430FR5739, an IDE
installation is required. The associated software package (see Section 2.1) supports both IAR and CCS
projects.
The User Experience source files and project folders are provided in the folder [Install
Path]\MSP-EXP430FR5739\MSP-EXP430FR5739 User Experience.
2.3.1 Setting up the IAR Workspace for the User Experience Code
To set up the IAR workspace for the User Experience demo source code:
1. Double-click and open MSP-EXP430FR5739_Workspace.eww in IAR.
2. The Project is automatically included in the workspace.
3. Click Project → Download & Debug to download the code to the MSP-EXP430FR5739 Experimenter
Board.
4. If multiple emulation tools are connected to your PC, click Project → Options → FET Debugger →
Connection to explicitly select the experimenter board.
2.3.2 Importing the CCS Project for the User Experience Code
To import the CCS project for the User Experience demo source code:
1. Create a workspace folder.
2. Open CCS and point to the newly created workspace folder.
3. Click Project → Import Existing CCS/CCE Eclipse Project.
4. Browse to the folder [Install Path]\MSP-EXP430FR5739\MSP-EXP430FR5739 User Experience that
was extracted from the associated zip file (see Section 2.1).
5. The project MSP-EXP430FR5739_UserExperience is automatically selected.
6. Click Finish to include the project in the current workspace.
7. Click the Debug icon to download the project
2.3.3 Source Files
Table 1 describes the source files for the User Experience demo.
Name Description
Main.c This file contains the user experience demo
Main.h This file contains the definitions that are required for main.c
FR_EXP.c This file contains the definitions of all C functions used by main.c
FR_EXP.h This file contains all the function declarations needed by main.c and FR_EXP.c
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Table 1. User Experience Source Files
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21
22
23
24
25
26
27
28
29
P2.2/TB2.2/UCB0CLK/TB1.0
P2.0/TB2.0/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
TEST/SBWTCK
P2.1/TB2.1/UCA0RXD/UCA0SOMI/TB0.0
P3.4/TB1.1/TB2CLK/SMCLK
P3.5/TB1.2/CDOUT
P3.6/TB2.1/TB1CLK
RST/NMI/SBWTDIO
PJ.0/TDO/TB0OUTH/SMCLK/CD6
31
32
33
34
35
36
37
38
39
P2.3/TA0.0/UCA1STE/A6*/CD10
P2.4/TA1.0/UCA1CLK/A7*/CD11
AVCC
PJ.5/XOUT
PJ.4/XIN
AVSS
P2.7
P1.0/TA0.1/DMAE0/RTCCLK/A0*/CD0/VeREF-*
1
9
8
7
6
5
4
3
2
P1.3/TA1.2/UCB0STE/A3*/CD3
P3.3/A15*/CD15
P3.2/A14*/CD14
P3.1/A13*/CD13
P3.0/A12*/CD12
P1.2/TA1.1/TA0CLK/CDOUT/A2*/CD2
P1.1/TA0.2/TA1CLK/CDOUT/A1*/CD1/VeREF+*
VCORE
11
19
18
17
16
15
14
13
12
P1.7/TB1.2/UCB0SOMI/UCB0SCL/TA1.0
P1.6/TB1.1/UCB0SIMO/UCB0SDA/TA0.0
P2.6/TB1.0/UCA1RXD/UCA1SOMI
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P4.1P4.0/TB2.0
DVCC
DVSS
40
30
10
20
RHA PACKAGE
(TOP VIEW)
P1.4/TB0.1/UCA0STE/A4*/CD4
P1.5/TB0.2/UCA0CLK/A5*/CD5
MSP430FR5721
MSP430FR5723
MSP430FR5725
MSP430FR5727
MSP430FR5729
MSP430FR5731
MSP430FR5733
MSP430FR5735
MSP430FR5737
MSP430FR5739
PJ.3/TCK/CD9
PJ.1/TDI/TCLK/TB1OUTH/MCLK/CD7
PJ.2/TMS/TB2OUTH/ACLK/CD8
P3.7/TB2.2
AVSS
* Not available on MSP430FR5737, MSP430FR5733, MSP430FR5727, MSP430FR5723
Note: Power Pad connection to V recommended.
SS
MSP-EXP430FR5739 Hardware
3 MSP-EXP430FR5739 Hardware
3.1 MSP430FR5739IRHA Device Pin Designation
See the MSP430FR5739 data sheet (SLAS639) for the latest information.
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Figure 6. MSP430FR5739 Pin Designation
14
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GND
GND
47k
100n
47k 47k
10n
16p
16p
1u/6.3V
100R
100R
100R
100R
12MHz
270
green
GND
SL127L6TH
MSP-EXP430G2 EMULAT OR 1/2
1.4
R1
C5
R2 R3
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
1
2
3
4
5
6
7
8
9
11
12
13
14
15
10
C1
C3
C2
C4
R5
R4
TP1
TP2
TP3
TP4
TP5
TP6
TP7
R6
R7
Q1
R26
LED0
1
2
3
4
5
6
789
10
J3
J4
2
1
4
3
5
6
HTCK
HTMS
HTDI
HTDO
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
GND
GND
GND
RESET
RESET
URXD
UTXD
SCL
SDA
SBWTCK
SBWTCK
SBWTDIO
SBWTDIO
CLK3410
RST3410
BTXD
BRXDI
BTXDI
BRXD
EZ_VBUS
TEST/SBWTCK
RST/SBWTDIO
URTS
UDTR
UDSR
UCTS
VCC
P2.0
P2.0
P2.1
P2.1
Removed U2: SN75240PW from SBW connections
SBW & UART I/F to Argon
SBW & UART I/F to external Target
www.ti.com
3.2 Schematics
The schematics and PCB layouts for the MSP-EXP430FR5739 are shown in the following pages.
MSP-EXP430FR5739 Hardware
SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter Board
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Figure 7. Schematics (1 of 3)
Copyright © 2011–2012, Texas Instruments Incorporated
15
Connector
Mini USB
GND
GND
GND
TUSB3410VF
GND GND
GND
CAT24FC32UI
33k
33R
33R
22p
22p
100n
100n
100k/1%
100k/1%
1k5
100n
1k5
1k5
100R
33k
10k
15k
1u/6.3V
GND
GND
TPS77301DGK
GND
GND
100n
61k5
33k
3k3
1u/6.3V
1N4148
GND
3k3
GND
47k
47k
USB_MINI_B5
GND
MSP-EXP430G2 EMULAT OR 2/2
1.4
DNP
CLKOUT
22
SIN
17
TEST0
23
SDA
10
TEST1
24
RTS
20
VCC1
25
VDD18
4
PUR
5
DM
7
DTR
21
SCL
11
DSR
14
P3.4
29
X2
26X127
SUSPEND
2
SOUT
19
DCD
15
CTS
13
DP
6
RI/CP
16
VCC
3
GND1
18
GND
8
VREGEN1RESET
9
WAKEUP
12
P3.3
30
P3.131P3.0
32
GND2
28
U3
E0
1
SDA
5
VSS
4
E1
2
WC
7
SCL
6
VCC
8
E2
3
U5
R21
R15
R14
C10
C9
C12
C11
R20
R18
R13
C13
R25
R24
R23
R12
R10
R11
C8
IN1
5
OUT1
8
EN
4
IN2
6
RES
2
OUT2
7
FB
1
GND
3
U2
C7
R8
R9
R19
C6
D1
R22
R17
R16
IO1
3
VCC
1
IO2
5
GND
4
NC
2
VBUS
1
ID
4
D-
2
U$2
D+
3
GND
5
SHIELD1
S1
SHIELD2
S2
SHIELD3
S3
SHIELD4
S4
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
SDA
SCL
UTXD
URXD
RESET
CLK3410
RST3410
BRXDI
BTXDI
EZ_D+
EZ_D-
EZ_VBUS
EZ_VBUS
UCTS
UDSR
URTS
UDTR
VCC = +3.6V
DNP
MSP-EXP430FR5739 Hardware
www.ti.com
16
MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012
Figure 8. Schematics (2 of 3)
Copyright © 2011–2012, Texas Instruments Incorporated
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GND
10uF/10V
GND
GND
12pF
12pF
100nF
QUARZ5
FR57XX--RHA40RHAPA CKAGE
470n
GND
eZ-RF
GND
GND GND
GND
GND
0R
470k100k
GND
.1u
RF_PWR
GND
4.7u
GND
GND
GND
.1u
.1u .1u
GND GND
4.7u
ADXL322/330
.1u
GND
0.1u
10u
GND GND
GND
GND
330
330
GND
GND
330
330
330
330
330
330
47k
GND
2.2n
FR57xx Fraunchpad
Ext_PWR
DNP
DNP
DNP
1.0
C23
1
2
3
J6
1 2
S1
1 2
S2
C22
C21
C20
Q2
37_PJ.4
37
24_P3.4
24
25_P3.5
25
33_P2.7
33
5_P3.1
5
38_PJ.5
38
1_P1.0
1
22_P2.1
22
26_P3.6
26
13_PJ.2_TMS
13
14_PJ.3_TCK
14
9_P1.4
9
10_P1.5
10
11_P J.0_TDO
11
12_PJ.1_TDI_TCLK
12
15_P4.0
15
16_P4.1
16
17_P2.5
17
23_P2.2
23
40_AV CC
40
28_P1.6
28
27_P3.7
27
8_P1.3
8
7_P3.3
7
6_P3.2
6
34_P2.3
34
35_P2.4
35
36_AV SS
36
2_P1.1
2
3_P1.2
3
21_P2.0
21
20__RST_SBWTDIO
20
19_TEST_SBWTCK
19
18_P2.6
18
29_P1.7
29
30_VCORE
30
31_DVSS
31
32_DVCC
32
FR57XX
39_AV SS
39
4_P3.0
4
41_TP
TP
C14
1
3
5
2
4
6
7
9
8
10
11
13
15
12
14
16
17
RF3
18
1
3
5
2
4
6
7
9
8
10
11
13
15
12
14
16
17
19
RF1
18
20
1
3
5
2
4
6
7
9
8
10
11
13
15
12
14
16
17
19
RF2
18
20
1
MSP_PWR
2
TP8 TP9
TP10
TP11
TP12
TP13
TP15
TP14
R34
R35NTC
C31
1
2
RF_PWR
C32
1
2
3
4
5
6
7
8
9
10
11
12
SV1
1
2
3
4
5
6
7
8
9
101112
SV2
C15
C16 C17
C53
NC
1
ST
2
COM
3
NC
4
COM
5
COM
6
COM
7
ZOUT
8
NC
9
YOUT
10
NC
11
XOUT
12
NC
13
VS
14
VS
15
NC
16
ACC
C58
C18
C19
LED2
LED1
R28
R29
LED4
LED3
R36
R37
R27
R30
R31
R32
LED5
LED6
LED7
LED8
TP16
TP17
LDR
1 2
RST
R33
C24
GND
GND
GND
GND
GND
GND
GND
GND
VCC
VCC
VCC
VCC
XINR
XINR
XOUTR
XOUTR
VCORE
P2.6
P2.6
P1.7
P1.7
P1.7
P1.6
P1.6
P1.6
P3.7
P3.7
P3.7
P3.6
P3.6
P3.5
P3.5
P3.4
P3.4
P2.2
P2.2
P2.2
P2.1
P2.0
P2.0
P2.0
P2.5
P2.5
RST/SBWTDIO
RST/SBWTDIO
TEST/SBWTCK
P4.1
P4.1
P4.1
P4.1
P1.0P1
P1.0
P1.0
P1.0
P1.1
P1.1
P1.1
P1.1
P1.2
P1.2
P1.2
P1.2
P3.0
P3.0
P3.1
P3.1
P3.2
P3.2
P3.3
P3.3
P1.3
P1.3
P1.3
P1.4
P1.4
P1.5
P4.0
P4.0
P4.0
P4.0
VCC_MSP
VCC_MSP
VCC_MSP
VCC_MSP
P2.4
P2.4
P2.4
P2.3
P2.3
P2.3
P2.7
P2.7
P2.7
P2.7
P2.7
RFPWR
RFPWR
RFPWR
PJ.0
PJ.0
PJ.1
PJ.1
PJ.2
PJ.2
PJ.3
PJ.3
XT1_GND
2 or 3-Axis
Accelerometer
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MSP-EXP430FR5739 Hardware
SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter Board
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Figure 9. Schematics (3 of 3)
Copyright © 2011–2012, Texas Instruments Incorporated
17
MSP-EXP430FR5739 Hardware
3.3 PCB Layout
www.ti.com
Figure 10. MSP-EXP430FR5739 Top Layer
18
MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012
Copyright © 2011–2012, Texas Instruments Incorporated
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www.ti.com
MSP-EXP430FR5739 Hardware
Figure 11. MSP-EXP430FR5739 Bottom Layer
SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter Board
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19
Copyright © 2011–2012, Texas Instruments Incorporated
MSP-EXP430FR5739 Hardware
www.ti.com
Figure 12. MSP-EXP430FR5739 Silkscreen
20
MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012
Copyright © 2011–2012, Texas Instruments Incorporated
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www.ti.com
3.4 Bill of Materials (BOM)
Table 2 shows the bill of materials for the MSP-EXP430FR5739 board.
MSP-EXP430FR5739 Hardware
Table 2. Bill of Materials (BOM)
Pos. Ref Des r per Description
1 C1 1 10n
2 C2,C3 2 16p
3 C4, C6, C8 3 1u/6.3V
4 5 100n
5 C18, C20, C31, 7 100n
6 C9, C10 2 22p
7 C14 1 470n
8 C19 1 10u
9 C21, C22 0 12pF
10 C23 1 10uF/10V
11 C24 1 2.2nF
12 C32, C53 2 4.7u
13 D1 1 1N4148
14 FR5739 1 FR5739-RHA40
15 J3 1 2x05 Pin Header Male
16 J4 [1] SL127L6TH
17 J6 1 3-pin header, male, TH
18 LDR 0 Do not populate
19 LED0 1 LED GREEN 0603
20 LED1 - LED8 8 LED BLUE 470NM 0603 SMD
21 MSP_PWR 1 2-pin header, male, TH
22 NTC 1 100k
23 Q1 1 12MHz
24 Q2 1 Crystal
25 4 47k
26 4 100R
27 R8 1 61k5
28 R12 1 33k
29 R9 1 30K
30 R10 1 10k
31 R11 1 15k
32 R13, R24, R25 3 1k5
33 R14, R15 2 33R
34
35 R18, R20 2 100k/1%
36 R19, R22 2 3k3
37 R21 1 33k
39 R26 1 270
C5, C7, C11,
C12,C13
C15, C16, C17,
C58
R1, R2, R3, R16,
R17, R33
R4, R5, R6, R7,
R23
Numbe
Board
SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter Board
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21
Copyright © 2011–2012, Texas Instruments Incorporated
Suggested Reading
Pos. Ref Des r per Description
www.ti.com
Table 2. Bill of Materials (BOM) (continued)
Numbe
Board
R27, R28, R29,
40 R30, R31, R32, 8 330
R36, R37
41 R34 0 0R
42 R35 1 470k
43 RF1, RF2 2
44 RF3 0 eZ-RF connector for EXP-F5438 board
45 RF_PWR 1 RF_PWR
46 S1, S2 2
47 RST 1
48 SV1, SV2 2+[2] 12-pin header, TH
49 U$2 1 USB_MINI_B5
50 U1 1 F1612-PM64
51 U2 1 TPS77301DGK
52 U3 1 TUSB3410VF
53 U4 1 TPD2E001
54 U5 1 CAT24FC32UI
55 U6 1 ADXL335 accelerometer
4 Suggested Reading
The primary sources of MSP430 information are the device-specific data sheets and user's guides. The
most up-to-date versions of those documents can be found at the Texas Instruments MSP430 page
www.ti.com/msp430.
Visit www.ti.com/fram to find the latest information on TI's FRAM family.
To get an inside view of the CCS and IAR IDEs, download the latest version from the MSP430 page and
read the included user's guides and documentation in the installation folder.
Documents describing the IAR tools (Workbench/C-SPY, the assembler, the C compiler, the linker, and
the library) are located in common\doc and 430\doc. All necessary CCS documents can be found in
msp430\doc inside the CCS installation path. The Code Composer Studio v4.2 for MSP430™ User’s
Guide (SLAU157) and IAR Embedded Workbench Version 3+ for MSP430™ User's Guide (SLAU138)
include detailed information on how to set up a project for the MSP430 using CCS or IAR. They are
included in most of the IDE releases and on the MSP430 page.
5 References
1. MSP430FR5739 data sheet (SLAS639)
2. MSP430F2274 data sheet (SLAS504)
3. MSP430FR57xx Family User's Guide (SLAU272)
22
MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012
Copyright © 2011–2012, Texas Instruments Incorporated
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