Texas Instruments MSP430 User Manual 2

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MSP430 Hardware Tools

User's Guide

Literature Number: SLAU278F

May 2009–Revised December 2010

SLAU278F–May 2009–Revised December 2010

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Contents

Preface ....................................................................................................................................... 9

1 Get Started Now! ............................................................................................................... 13

1.1 Flash Emulation Tool (FET) Overview .................................................................................. 14

1.2 Kit Contents, MSP-FET430PIF .......................................................................................... 14

1.3 Kit Contents, eZ430-F2013 .............................................................................................. 14

1.4 Kit Contents, eZ430-T2012 .............................................................................................. 14

1.5 Kit Contents, eZ430-RF2500 ............................................................................................ 15

1.6 Kit Contents, eZ430-RF2500T ........................................................................................... 15

1.7 Kit Contents, eZ430-RF2500-SEH ...................................................................................... 15

1.8 Kit Contents, eZ430-Chronos-xxx ....................................................................................... 15

1.9 Kit Contents, MSP-FET430UIF .......................................................................................... 15

1.10 Kit Contents, MSP-FET430xx ............................................................................................ 16

1.11 Kit Contents, FET430Fx137RF900 ..................................................................................... 17

1.12 Kit Contents, MSP-TS430xx ............................................................................................. 17

1.13 Kit Contents, EM430Fx137RF900 ....................................................................................... 19

1.14 Hardware Installation, MSP-FET430PIF ............................................................................... 19

1.15 Hardware Installation, MSP-FET430UIF ............................................................................... 20

1.16 Hardware Installation, eZ430-F2013, eZ430-RF2500, eZ430-Chronos ............................................ 20

1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900, EM430Fx137RF900 ...... 20

1.18 Important MSP430 Documents on the CD-ROM and Web .......................................................... 21

2 Design Considerations for In-Circuit Programming ............................................................... 23

2.1 Signal Connections for In-System Programming and Debugging ................................................... 24

2.2 External Power ............................................................................................................. 27

2.3 Bootstrap Loader (BSL) .................................................................................................. 27

A Frequently Asked Questions and Known Issues ................................................................... 29

A.1 Hardware FAQs ............................................................................................................ 30

A.2 Known Issues .............................................................................................................. 32

B Hardware .......................................................................................................................... 33

B.1 MSP-TS430PW14 ......................................................................................................... 34

B.2 MSP-TS430L092 .......................................................................................................... 37

B.3 MSP-TS430L092 Active Cable .......................................................................................... 40

B.4 MSP-TS430PW24 ......................................................................................................... 43

B.5 MSP-TS430DW28 ......................................................................................................... 46

B.6 MSP-TS430PW28 ......................................................................................................... 49

B.7 MSP-TS430PW28A ....................................................................................................... 52

B.8 MSP-TS430DA38 .......................................................................................................... 55

B.9 MSP-TS430QFN23x0 ..................................................................................................... 58

B.10 MSP-TS430RSB40 ........................................................................................................ 61

B.11 MSP-TS430RHA40A ...................................................................................................... 64

B.12 MSP-TS430DL48 .......................................................................................................... 67

B.13 MSP-TS430RGZ48B ...................................................................................................... 70

B.14 MSP-TS430PM64 ......................................................................................................... 73

B.15 MSP-TS430PM64A ....................................................................................................... 76

B.16 MSP-TS430RGC64B ..................................................................................................... 79

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B.17 MSP-TS430RGC64USB .................................................................................................. 82

B.18 MSP-TS430PN80 .......................................................................................................... 86

B.19 MSP-TS430PN80A ........................................................................................................ 89

B.20 MSP-TS430PN80USB .................................................................................................... 91

B.21 MSP-TS430PZ100 ........................................................................................................ 96

B.22 MSP-TS430PZ100A ....................................................................................................... 99

B.23 MSP-TS430PZ100B ..................................................................................................... 102

B.24 MSP-TS430PZ5x100 .................................................................................................... 105

B.25 MSP-TS430PZ100USB ................................................................................................. 107

B.26 EM430F5137RF900 ..................................................................................................... 112

B.27 EM430F6137RF900 ..................................................................................................... 116

B.28 MSP-FET430PIF ......................................................................................................... 120

B.29 MSP-FET430UIF ......................................................................................................... 122

B.29.1 MSP-FET430UIF Revision History .......................................................................... 127

C Hardware Installation Guide .............................................................................................. 129

C.1 Hardware Installation .................................................................................................... 130

Document Revision History ........................................................................................................ 136

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2-1. Signal Connections for 4-Wire JTAG Communication................................................................ 25

2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire)............................................... 26

B-1. MSP-TS430PW14 Target Socket Module, Schematic ............................................................... 34

B-2. MSP-TS430PW14 Target Socket Module, PCB ...................................................................... 35

B-3. MSP-TS430L092 Target Socket Module, Schematic................................................................. 37

B-4. MSP-TS430L092 Target Socket Module, PCB........................................................................ 38

B-5. MSP-TS430L092 Active Cable Target Socket Module, Schematic................................................. 40

B-6. MSP-TS430L092 Active Cable Target Socket Module, PCB........................................................ 41

B-7. MSP-TS430PW24 Target Socket Module, Schematic ............................................................... 43

B-8. MSP-TS430PW24 Target Socket Module, PCB ...................................................................... 44

B-9. MSP-TS430DW28 Target Socket Module, Schematic ............................................................... 46

B-10. MSP-TS430DW28 Target Socket Module, PCB ...................................................................... 47

B-11. MSP-TS430PW28 Target Socket Module, Schematic ............................................................... 49

B-12. MSP-TS430PW28 Target Socket Module, PCB ...................................................................... 50

B-13. MSP-TS430PW28A Target Socket Module, Schematic.............................................................. 52

B-14. MSP-TS430PW28A Target Socket Module, PCB (Red) ............................................................. 53

B-15. MSP-TS430DA38 Target Socket Module, Schematic................................................................ 55

B-16. MSP-TS430DA38 Target Socket Module, PCB....................................................................... 56

B-17. MSP-TS430QFN23x0 Target Socket Module, Schematic ........................................................... 58

B-18. MSP-TS430QFN23x0 Target Socket Module, PCB .................................................................. 59

B-19. MSP-TS430RSB40 Target Socket Module, Schematic .............................................................. 61

B-20. MSP-TS430RSB40 Target Socket Module, PCB ..................................................................... 62

B-21. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................ 64

B-22. MSP-TS430RHA40A Target Socket Module, PCB ................................................................... 65

B-23. MSP-TS430DL48 Target Socket Module, Schematic ................................................................ 67

B-24. MSP-TS430DL48 Target Socket Module, PCB ....................................................................... 68

B-25. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................ 70

B-26. MSP-TS430RGZ48B Target Socket Module, PCB ................................................................... 71

B-27. MSP-TS430PM64 Target Socket Module, Schematic................................................................ 73

B-28. MSP-TS430PM64 Target Socket Module, PCB....................................................................... 74

B-29. MSP-TS430PM64A Target Socket Module, Schematic.............................................................. 76

B-30. MSP-TS430PM64A Target Socket Module, PCB..................................................................... 77

B-31. MSP-TS430RGC64B Target Socket Module, Schematic............................................................ 79

B-32. MSP-TS430RGC64B Target Socket Module, PCB................................................................... 80

B-33. MSP-TS430RGC64USB Target Socket Module, Schematic ........................................................ 82

B-34. MSP-TS430RGC64USB Target Socket Module, PCB ............................................................... 83

B-35. MSP-TS430PN80 Target Socket Module, Schematic................................................................ 86

B-36. MSP-TS430PN80 Target Socket Module, PCB....................................................................... 87

B-37. MSP-TS430PN80A Target Socket Module, Schematic .............................................................. 89

B-38. MSP-TS430PN80A Target Socket Module, PCB ..................................................................... 90

B-39. MSP-TS430PN80USB Target Socket Module, Schematic .......................................................... 92

B-40. MSP-TS430PN80USB Target Socket Module, PCB.................................................................. 93

B-41. MSP-TS430PZ100 Target Socket Module, Schematic............................................................... 96

B-42. MSP-TS430PZ100 Target Socket Module, PCB...................................................................... 97

B-43. MSP-TS430PZ100A Target Socket Module, Schematic............................................................. 99

B-44. MSP-TS430PZ100A Target Socket Module, PCB................................................................... 100

B-45. MSP-TS430PZ100B Target Socket Module, Schematic............................................................ 102

List of Figures

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B-46. MSP-TS430PZ100B Target Socket Module, PCB................................................................... 103

B-47. MSP-TS430PZ5x100 Target Socket Module, Schematic .......................................................... 105

B-48. MSP-TS430PZ5x100 Target Socket Module, PCB.................................................................. 106

B-49. MSP-TS430PZ100USB Target Socket Module, Schematic........................................................ 108

B-50. MSP-TS430PZ100USB Target Socket Module, PCB............................................................... 109

B-51. EM430F5137RF900 Target Socket Module, Schematic............................................................ 112

B-52. EM430F5137RF900 Target Socket Module, PCB................................................................... 113

B-53. EM430F6137RF900 Target Socket Module, Schematic............................................................ 116

B-54. EM430F6137RF900 Target Socket Module, PCB................................................................... 117

B-55. MSP-FET430PIF FET Interface Module, Schematic................................................................ 120

B-56. MSP-FET430PIF FET Interface Module, PCB....................................................................... 121

B-57. MSP-FET430UIF USB Interface, Schematic (1 of 4) ............................................................... 122

B-58. MSP-FET430UIF USB Interface, Schematic (2 of 4) ............................................................... 123

B-59. MSP-FET430UIF USB Interface, Schematic (3 of 4) ............................................................... 124

B-60. MSP-FET430UIF USB Interface, Schematic (4 of 4) ............................................................... 125

B-61. MSP-FET430UIF USB Interface, PCB................................................................................ 126

C-1. Windows XP Hardware Recognition................................................................................... 130

C-2. Windows XP Hardware Wizard ........................................................................................ 130

C-3. Windows XP Driver Location Selection Folder....................................................................... 131

C-4. Windows XP Driver Installation ........................................................................................ 132

C-5. Device Manager Using MSP-FET430UIF or eZ430-F2013 (CCE and CCS Only).............................. 133

C-6. Device Manager Using MSP-FET430UIF or eZ430-F2013 (IAR Only)........................................... 134

C-7. Device Manager Using eZ430-RF2500 (CCE/CCS and IAR)...................................................... 135

List of Figures SLAU278F–May 2009–Revised December 2010

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1-1. Flash Emulation Tool (FET) Features .................................................................................. 14

1-2. Individual Kit Contents, MSP-TS430xx................................................................................. 18

B-1. MSP-TS430PW14 Bill of Materials...................................................................................... 36

B-2. MSP-TS430L092 Bill of Materials....................................................................................... 39

B-3. MSP-TS430L092 JP1 Settings .......................................................................................... 41

B-4. MSP-TS430L092 Active Cable Bill of Materials ....................................................................... 42

B-5. MSP-TS430PW24 Bill of Materials...................................................................................... 45

B-6. MSP-TS430DW28 Bill of Materials...................................................................................... 48

B-7. MSP-TS430PW28 Bill of Materials ..................................................................................... 51

B-8. MSP-TS430PW28A Bill of Materials.................................................................................... 54

B-9. MSP-TS430DA38 Bill of Materials ...................................................................................... 57

B-10. MSP-TS430QFN23x0 Bill of Materials.................................................................................. 60

B-11. MSP-TS430RSB40 Bill of Materials .................................................................................... 63

B-12. MSP-TS430RHA40A Bill of Materials................................................................................... 66

B-13. MSP-TS430DL48 Bill of Materials....................................................................................... 69

B-14. MSP-TS430RGZ48B Bill of Materials................................................................................... 72

B-15. MSP-TS430PM64 Bill of Materials...................................................................................... 75

B-16. MSP-TS430PM64A Bill of Materials .................................................................................... 78

B-17. MSP-TS430RGC64B Bill of Materials .................................................................................. 81

B-18. MSP-TS430RGC64USB Bill of Materials............................................................................... 84

B-19. MSP-TS430PN80 Bill of Materials ...................................................................................... 88

B-20. MSP-TS430PN80A Bill of Materials .................................................................................... 91

B-21. MSP-TS430PN80USB Bill of Materials................................................................................. 94

B-22. MSP-TS430PZ100 Bill of Materials..................................................................................... 98

B-23. MSP-TS430PZ100A Bill of Materials.................................................................................. 101

B-24. MSP-TS430PZ100B Bill of Materials.................................................................................. 104

B-25. MSP-TS430PZ5x100 Bill of Materials................................................................................. 107

B-26. MSP-TS430PZ100USB Bill of Materials.............................................................................. 110

B-27. EM430F5137RF900 Bill of Materials.................................................................................. 114

B-28. EM430F6137RF900 Bill of Materials.................................................................................. 118

List of Tables

SLAU278F–May 2009–Revised December 2010 List of Tables

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List of Tables SLAU278F–May 2009–Revised December 2010

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About This Manual

This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described.

How to Use This Manual

Read and follow the instructions in Chapter 1. This chapter lists the contents of the FET, provides instructions on installing the hardware and according software drivers. After you see how quick and easy it is to use the development tools, TI recommends that you read all of this manual.

This manual describes the setup and operation of the FET but does not fully describe the MSP430™ microcontrollers or the development software systems. For details of these items, see the appropriate TI documents listed in Section 1.18.

This manual applies to the following tools (and devices):

• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)

• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)

• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices)

• eZ430-T2012 (three MSP430F2012 based target boards)

• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274/CC2500 target, for all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices)

• eZ430-RF2500T (one MSP430F2274/CC2500 target board including battery pack)

• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274/CC2500 target and solar energy harvesting module)

• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system contained in a watch. Includes <1 GHz RF USB access point)

Preface

SLAU278F–May 2009–Revised December 2010

Read This First

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How to Use This Manual

The following tools contain the USB debug interface (MSP-FET430UIF) and the respective target socket module:

• MSP-FET430U14 (for MSP430F20xx, MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices in 14-pin PW packages)

• MSP-FET430U092 (for MSP430FL092 devices in 14-pin PW packages)

• MSP-FET430U24 (for MSP430AFE2xx devices in 24-pin PW packages)

• MSP-FET430U28 (for MSP430F11xx(A) devices in 20- and 28-pin DW or PW packages)

• MSP-FET430U28A (for MSP430F20xx and MSP430G2xxx devices in 14-, 20-, and 28-pin PW)

• MSP-FET430U38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages)

• MSP-FET430U23x0 (for MSP430F23x0 devices in 40-pin RHA packages)

• MSP-FET430U40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages)

• MSP-FET430U40A (for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages)

• MSP-FET430U48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages)

• MSP-FET430U48B (for MSP430F534x devices in 48-pin RGZ packages)

• MSP-FET430U64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1), MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A), MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages)

• MSP-FET430U64A (for MSP430F41x2 devices in 64-pin PM packages)

• MSP-FET430U64B (for MSP430F530x devices in 64-pin RGC packages)

• MSP-FET430U64USB (for MSP430F550x, MSP430F551x, MSP430552x, devices in 64-pin RGC packages

• MSP-FET430U80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x, MSP430F47x, and MSP430FG47x devices in 80-pin PN packages)

• MSP-FET430U80A (for MSP430F532x devices in 80-pin PN packages)

• MSP-FET430U80USB (for MSP430F552x devices with USB peripheral in 80-pin PN packages)

• MSP-FET430U100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and MSP430F47xx devices in 100-pin PZ packages)

• MSP-FET430U100A (for MSP430F471xx devices in 100-pin PZ packages - red PCB)

• MSP-FET430U5x100 (for MSP430F54xx(A) devices and the MSP430BT5190 in 100-pin PZ packages)

• MSP-FET430U100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages)

• FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages)

• FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages)

Stand-alone target-socket modules (without debug interface):

• MSP-TS430PW14 (for MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices in 14-pin PW packages)

• MSP-TS430L092 (for MSP430FL092 devices in 14-pin PW packages)

• MSP-TS430PW24 (for MSP430AFE2xx devices in 24-pin PW packages)

• MSP-TS430DW28 (for MSP430F11xx(A) devices in 28-in DW packages)

• MSP-TS430PW28 (for MSP430F11xx(A) devices in 28-in PW packages)

• MSP-TS430PW28A (for MSP430F20xx and MSP430G2xxx devices in 14, 20 and 28-pin PW)

• MSP-TS430DA38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages)

• MSP-TS430QFN23x0 (for MSP430F23x0 devices in 40-pin RHA packages)

• MSP-TS430RSB40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages)

• MSP-TS430RHA40A ((for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages)

• MSP-TS430DL48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages)

• MSP-TS430RGZ48B (for MSP430F534x devices in 48-pin RGZ packages)

• MSP-TS430PM64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1), MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A), MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages)

• MSP-TS430PM64A (for MSP430F41x2 devices in 64-pin PM packages)

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• MSP-TS430RGC64B (for MSP430F530x devices in 64-pin RGC packages)

• MSP-TS430RGC64USB (for MSP430F550x, MSP430F551x, MSP430552x, devices in 64-pin RGC packages)

• MSP-TS430PN80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x, MSP430F47x, and MSP430FG47x devices in 80-pin PN packages)

• MSP-TS430PN80A (for MSP430F532x devices in 80-pin PN packages)

• MSP-TS430PN80USB (for MSP430F552x devices with USB peripheral in 80-pin PN packages)

• MSP-TS430PZ100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and MSP430F47xx devices in 100-pin PZ packages)

• MSP-TS430PZ100A (for MSP430F471xx devices in 100-pin PZ packages — red PCB)

• MSP-TS430PZ5x100 (for MSP430F54xx(A) and the MSP430BT5190 devices in 100-pin PZ packages)

• MSP-TS430PZ100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages)

• EM430F5137RF900 (with integrated CC430F5137 IC in a 48-pin RGZ package)

• EM430F6137RF900 (with integrated CC430F6137 IC in a 64-pin RGC package)

These tools contain the most up-to-date materials available at the time of packaging. For the latest materials (data sheets, user's guides, software, application information, etc.), visit the TI MSP430 web site at www.ti.com/msp430 or contact your local TI sales office.

Information About Cautions and Warnings

This document may contain cautions and warnings.

Information About Cautions and Warnings

CAUTION

This is an example of a caution statement. A caution statement describes a situation that could potentially damage your

software or equipment.

WARNING

This is an example of a warning statement. A warning statement describes a situation that could potentially

cause harm to you.

The information in a caution or a warning is provided for your protection. Read each caution and warning carefully.

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Related Documentation From Texas Instruments

MSP430 development tools documentation:

CCS for MSP430 User's Guide, literature number SLAU157 Code Composer Studio v4.x Core Edition, CCS Mediawiki IAR for MSP430 User's Guide, literature number SLAU138 IAR Embedded Workbench KickStart, SLAC050 eZ430-F2013 Development Tool User's Guide, literature number SLAU176 eZ430-RF2480 User's Guide, literature number SWRA176 eZ430-RF2500 Development Tool User's Guide, literature number SLAU227 eZ430-RF2500-SEH Development Tool User's Guide, literature number SLAU273 eZ430-Chronos Development Tool User's Guide, literature number SLAU292

MSP430xxxx device user's guides:

MSP430x1xx Family User's Guide, literature number SLAU049 MSP430x2xx Family User's Guide, literature number SLAU144 MSP430x3xx Family User's Guide, literature number SLAU012 MSP430x4xx Family User's Guide, literature number SLAU056 MSP430x5xx Family User's Guide, literature number SLAU208 CC430 Family User's Guide, literature number SLAU259

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If You Need Assistance

Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments Product Information Center (PIC). Contact information for the PIC can be found on the TI web site at

www.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provide

open interaction with peer engineers, TI engineers, and other experts. Additional device-specific information can be found on the MSP430 web site.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio-frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case, the user is required to take whatever measures may be required to correct this interference at his own expense.

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Chapter 1

SLAU278F–May 2009–Revised December 2010

Get Started Now!

This chapter lists the contents of the FET and provides instruction on installing the hardware.

Topic ........................................................................................................................... Page

1.1 Flash Emulation Tool (FET) Overview .................................................................. 14

1.2 Kit Contents, MSP-FET430PIF ............................................................................. 14

1.3 Kit Contents, eZ430-F2013 .................................................................................. 14

1.4 Kit Contents, eZ430-T2012 .................................................................................. 14

1.5 Kit Contents, eZ430-RF2500 ................................................................................ 15

1.6 Kit Contents, eZ430-RF2500T .............................................................................. 15

1.7 Kit Contents, eZ430-RF2500-SEH ........................................................................ 15

1.8 Kit Contents, eZ430-Chronos-xxx ........................................................................ 15

1.9 Kit Contents, MSP-FET430UIF ............................................................................. 15

1.10 Kit Contents, MSP-FET430xx .............................................................................. 16

1.11 Kit Contents, FET430Fx137RF900 ........................................................................ 17

1.12 Kit Contents, MSP-TS430xx ................................................................................ 17

1.13 Kit Contents, EM430Fx137RF900 ......................................................................... 19

1.14 Hardware Installation, MSP-FET430PIF ................................................................ 19

1.15 Hardware Installation, MSP-FET430UIF ................................................................ 20

1.16 Hardware Installation, eZ430-F2013, eZ430-RF2500, eZ430-Chronos ........................ 20

1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900,

EM430Fx137RF900 ............................................................................................ 20

1.18 Important MSP430 Documents on the CD-ROM and Web ....................................... 21

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Flash Emulation Tool (FET) Overview

1.1 Flash Emulation Tool (FET) Overview

TI offers several flash emulation tools according to different requirements.

Table 1-1. Flash Emulation Tool (FET) Features

eZ430-F2013 eZ430-RF2500 eZ430-Chronos MSP-FET430PIF

Supports all MSP430 and CC430 flash-based devices ('F1xx, 'F2xx, X X 'F4xx, 'F5xx, 'F6xx, 'G2xx, 'L092)

Supports only 'F20xx, 'G2x01, 'G2x11, 'G2x21, 'G2x31

Supports only MSP430F20xx, 'F21x2, 'F22xx, 'G2x01, 'G2x11, X 'G2x21, 'G2x31

Supports only CC430F51xx, 'F61xx, MSP430F20xx, 'F21x2, 'F22xx, 'F41x2, 'F54xx, 'F54xxA, 'F55xx

Allows fuse blow X Adjustable target supply voltage X Fixed 2.8-V target supply voltage X Fixed 3.6-V target supply voltage X X X 4-wire JTAG X X 2-wire JTAG Application UART X X Supported by CCE X X X X Supported by CCS X X X X X Supported by IAR X X X X X

(1)

The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface.

(2)

Not supported by default. Driver installation needs to be selected manually during the CCS installation process.

(1)

X X X X

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MSP-

FET430UIF

(2)

1.2 Kit Contents, MSP-FET430PIF

• One READ ME FIRST document

• One MSP430 CD-ROM

• One MSP-FET430PIF interface module

• One 25-conductor cable

• One 14-conductor cable

1.3 Kit Contents, eZ430-F2013

• One QUICK START GUIDE document

• One eZ430-F2013 CD-ROM

• One eZ430-F2013 development tool including one MSP430F2013 target board

1.4 Kit Contents, eZ430-T2012

• Three MSP430F2012-based target boards

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1.5 Kit Contents, eZ430-RF2500

• One QUICK START GUIDE document

• One eZ430-RF2500 CD-ROM

• One eZ430-RF2500 development tool including one MSP430F2274/CC2500 target board

• One eZ430-RF2500T target board

• One AAA battery pack with expansion board (batteries included)

1.6 Kit Contents, eZ430-RF2500T

• One eZ430-RF2500T target board

• One AAA battery pack with expansion board (batteries included)

1.7 Kit Contents, eZ430-RF2500-SEH

• One MSP430 development tool CD containing documentation and development software

• One eZ430-RF USB debugging interface

• Two eZ430-RF2500T wireless target boards

• One SEH-01 solar energy harvester board

• One AAA battery pack with expansion board (batteries included)

1.8 Kit Contents, eZ430-Chronos-xxx

'433, '868, '915

• One QUICK START GUIDE document

• One eZ430-Chronos CD-ROM

• One ez430-Chronos emulator

• One screwdriver

• Two spare screws

eZ430-Chronos-433:

– One 433-MHz eZ430-Chronos watch (battery included) – One 433-MHz eZ430-Chronos access point

eZ430-Chronos-868:

– One 868-MHz eZ430-Chronos watch (battery included) – One 868-MHz eZ430-Chronos access point

eZ430-Chronos-915:

– One 915-MHz eZ430-Chronos watch (battery included) – One 915-MHz eZ430-Chronos access point

Kit Contents, eZ430-RF2500

1.9 Kit Contents, MSP-FET430UIF

• One READ ME FIRST document

• One MSP430 CD-ROM

• One MSP-FET430UIF interface module

• One USB cable

• One 14-conductor cable

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Kit Contents, MSP-FET430xx

1.10 Kit Contents, MSP-FET430xx

'U14, 'U092, 'U24, 'U28, 'U28A, 'U38, 'U23x0, 'U40, 'U40A, 'U48, 'U48B, 'U64, 'U64A, 'U64USB, 'U80, 'U80USB, 'U100, 'U100A, 'U100B, 'U5x100, 'U100USB

• One READ ME FIRST document

• One MSP430 CD-ROM

• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end of the case, and a 2×7-pin male connector on the other end of the case.

• One USB cable

• One 32.768-kHz crystal from Micro Crystal (except MSP-FET430U24)

• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)

• One 14-Pin JTAG conductor cable

• One small box containing two MSP430 device samples (See table for Sample Type)

• One target socket module. To check the devices used for each board and a summary of the board, see Table 1-2. MSP-TS430xx below is the target socket module for each MSP-FET430Uxx kit.

MSP-FET430U14: One MSP-TS430PW14 target socket module. MSP-FET430U092: One MSP-TS430L092 target socket module with Active Cable. MSP-FET430U24: One MSP-TS430PW24 target socket module. MSP-FET430U28: One MSP-TS430PW28 target socket module. MSP-FET430U28A: One MSP-TS430PW28A target socket module. MSP-FET430U38: One MSP-TS430DA38 target socket module.. MSP-FET430U23x0: One MSP-TS430QFN23x0 (former name MSP-TS430QFN40) target socket

module.

MSP-FET430U40: One MSP-TS430RSB40 target socket module. MSP-FET430U48: One MSP-TS430DL48 target socket module. MSP-FET430U48B: One MSP-TS430RGZ48B target socket module. MSP-FET430U64: One MSP-TS430PM64 target socket module. MSP-FET430U64A: One MSP-TS430PM64A target socket module. MSP-FET430U64B: One MSP-TS430RGC64B target socket module. MSP-FET430U64USB: One MSP-TS430RGC64USB target socket module. MSP-FET430U80: One MSP-TS430PN80 target socket module. MSP-FET430U80A: One MSP-TS430PN80A target socket module. MSP-FET430U80USB: One MSP-TS430PN80USB target socket module. MSP-FET430U100: One MSP-TS430PZ100 target socket module. MSP-FET430U100A: One MSP-TS430PZ100A target socket module MSP-FET430U100B: One MSP-TS430PZ100B target socket module MSP-FET430U5x100: One MSP-TS430PZ5x100 target socket module. MSP-FET430U100USB: One MSP-TS430PZ100USB target socket module.

Consult the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.

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1.11 Kit Contents, FET430Fx137RF900

• One READ ME FIRST document

• One legal notice

• One MSP430 CD-ROM

• One MSP-FET430UIF interface module

• Two target socket module MSP-FET430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which

is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present on the PCB

MSP-FET430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB

• Two CC430EM battery packs

• Four AAA batteries

• Two 868-/915-MHz antennas

• Two 32.768-kHz crystals

• 18 PCB 2x4-pin headers

• One USB cable

• One 14-Pin JTAG conductor cable

1.12 Kit Contents, MSP-TS430xx

Kit Contents, FET430Fx137RF900

'PW14, 'L092, 'PW24, 'DW28, 'PW28, 'PW28A, 'DA38, 'QFN32x0, 'RSB40, 'DL48, 'RGZ48B, 'PM64, 'PM64A, 'RGC64B, 'RGC64USB, 'PN80, 'PN80A, 'PN80USB, 'PZ100, 'PZ100A, 'PZ100B, 'PZ5x100, 'PZ100USB

• One READ ME FIRST document

• One MSP430 CD-ROM

• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)

• One target socket module

• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)

• One small box containing two MSP430 device samples (See table for Sample Type)

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Kit Contents, MSP-TS430xx

Target Socket

Module

MSP-TS430PW14 2 x MSP430F2013IPW

MSP-TS430L092 MSP-TS430L092 2 x MSP430L092IPW

MSP-TS430PW24 MSP430AFE2xx 2 x MSP430AFE253IPW

MSP-TS430DW28 2 x MSP430F123IDW

MSP-TS430PW28 2 x MSP430F2132IPW

MSP-TS430PW28A

MSP-TS430DA38 MSP430F22xx 2 x MSP430F2274IDA

MSP- 40-pin RHA Eight PCB 1×10-pin headers (four

TS430QFN23x0 (QFN ZIF) male and four female

MSP-TS430RSB40 MSP430F51x1, 'F51x2 2 x MSP430F5172IRSB

MSP-TS430RHA40A

MSP-TS430DL48 MSP430F42x0 2 x MSP430F4270IDL

MSP-TS430RGZ48B MSP430F534x 2 x MSP430F5342IRGZ

MSP-TS430PM64 FET Kit: 2 x

MSP-TS430PM64A MSP430F41x2 2 x MSP430F4152IPM

MSP- 64-pin RGC Eight PCB 1×16-pin headers (four

TS430RGC64B (QFN ZIF) male and four female

MSP- 64-pin RGC MSP430F550x, 'F551x, Eight PCB 1×16-pin headers (four

TS430RGC64USB (QFN ZIF) 'F552x male and four female

MSP-TS430PN80 'F43x, 'F43x1, 'FG43x, 2 x MSP430FG439IPN

MSP-TS430PN80A MSP430F532x 2 x MSP430F5329IPN

MSP- 80-pin PN Eight PCB 1×20-pin headers (four

TS430PN80USB (QFP ZIF) male and four female

MSP-TS430PZ100 2 x MSP430FG4619IPZ

MSP-TS430PZ100A MSP430F471xx 2 x MSP430F47197IPZ

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Table 1-2. Individual Kit Contents, MSP-TS430xx

Socket Type Supported Devices Included Devices Headers / Comment

14-pin PW MSP430F20xx, 'G2x01, Four PCB 1×7-pin headers (two

(TSSOP ZIF) 'G2x11, 'G2x21, 'G2x31 male and two female

Four PCB 1×7-pin headers (two male and two female). A

14-pin PW connector is also present on the

(TSSOP ZIF) PCB which connects the kit with an

24-pin PW Four PCB 1×12-pin headers (two

(TSSOP ZIF) male and two female

28-pin DW 'F12x 'F12x2 'F21xx. Four PCB 1×12-pin headers (two

(SSOP ZIF) Supports devices in 20- male and two female

28-pin PW MSP430F11x1, 'F11x2, Four PCB 1×12-pin headers (two

(TSSOP ZIF) 'F12x, 'F12x2, 'F21xx male and two female

28-pin PW MSP430G2xxx in 14-, 2 x Four PCB 1×12-pin headers (two

(TSSOP ZIF) 20-, and 28-pin PW MSP430G2452IPW28 male and two female

38-pin DA Four PCB 1×19-pin headers (two

(TSSOP ZIF) male and two female

40-pin RSB Eight PCB 1×10-pin headers (four

(QFN ZIF) male and four female

40-pin RHA MSP430FR572x, 2 x Eight PCB 1×10-pin headers (four

(QFN ZIF) 'FR573x MSP430FR5739IRHA male and four female

48-pin DL Four PCB 2×12-pin headers (two

(TSSOP ZIF) male and two female

48-pin RGZ Eight PCB 1×12-pin headers (four

(QFN ZIF) male and four female

64-pin PM 'F23x, 'F24x, 'F24xx, Eight PCB 1×16-pin headers (four

(QFP ZIF) 'F261x, 'F41x, 'F42x(A), male and four female

64-pin PM Eight PCB 1×16-pin headers (four

(QFP ZIF) male and four female

80-pin PN Eight PCB 1×20-pin headers (four (QFP ZIF) male and four female

100-pin PZ MSP430F43x, 'F43x1, Eight PCB 1×25-pin headers (four

(QFP ZIF) 'F44x, 'FG461x, 'F47xx male and four female

100-pin PZ Eight PCB 1×25-pin headers (four

(QFP ZIF) male and four female

MSP430F11x1, 'F11x2,

and 28-pin DA packages

MSP430F20xx,

packages

MSP430F23x0 2 x MSP430F2370IRHA

MSP430F13x, 'F14x,

'F14x1, 'F15x, 'F16x(1),

'FE42x(A), 'FE42x2,

'FW42x

MSP430F530x 2 x MSP430F5310IRGC

MSP430F241x, 'F261x,

'F47x, 'FG47x

MSP430F552x, 'F551x 2 x MSP430F5529IPN

TS Kit: 2 x MSP430F2618IPM;

MSP430F417IPM and 2 x MSP430F169IPM

2 x MSP430F5510IRGC and/or 2 x MSP430F5528IRGC

"Micro-MaTch" 10-pin female

'Active Cable' PCB, this 'Active Cable' PCB is connected by 14 Pin JTAG cable with the FET430UIF

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Table 1-2. Individual Kit Contents, MSP-TS430xx (continued)

Target Socket

Module

MSP-TS430PZ100B MSP430F67xx 2 x MSP430F6733IPZ

MSP- 100-pin PZ MSP430F543x,MSP430 Eight PCB 1×25-pin headers (four

TS430PZ5x100 (QFP ZIF) BT5190IPZ male and four female

MSP- 100-pin PZ Eight PCB 1×25-pin headers (four

TS430PZ100USB (QFP ZIF) male and four female

Socket Type Supported Devices Included Devices Headers / Comment

100-pin PZ Eight PCB 1×25-pin headers (four

(QFP ZIF) male and four female

MSP430F663x, 'F563x 2 x MSP430F6638IPZ

See the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.

1.13 Kit Contents, EM430Fx137RF900

• One READ ME FIRST document

• One legal notice

• One MSP430 CD-ROM

• Two target socket module MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which

is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present on the PCB

MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB

• Two CC430EM battery packs

• Four AAA batteries

• Two 868-/915-MHz antennas

• Two 32.768-kHz crystals

• 18 PCB 2×4-pin headers

Kit Contents, EM430Fx137RF900

2 x MSP430F5438IPZ

1.14 Hardware Installation, MSP-FET430PIF

Follow these steps to install the hardware for the MSP-FET430PIF tools:

1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The necessary driver for accessing the PC parallel port is installed automatically during CCE/CCS or IAR Embedded Workbench installation. Note that a restart is required after the CCE/CCS or IAR Embedded Workbench installation for the driver to become active.

2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, such as an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.

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Hardware Installation, MSP-FET430UIF

1.15 Hardware Installation, MSP-FET430UIF

Follow these steps to install the hardware for the MSP-FET430UIF tool:

1. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET should be recognized, as the USB device driver should have been installed with the IDE (Code Composer Essentials/Studio or IAR Embedded Workbench).. If the install wizard starts, follow the prompts and point the wizard to the driver files. The default location for CCE is C:\Program Files\Texas Instruments\MSP430_USB_DRIVERS_v3\. The default location for CCS is C:\Program Files\Texas Instruments\ccs4\emulation\drivers\msp430\. The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\ 430\bin\WinXP. Detailed driver installation instructions can be found in Appendix C.

2. After connecting to a PC, the USB FET performs a self-test during which the red LED flashes for approximately two seconds. If the self-test passes successfully, the green LED stays on.

3. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as an MSP-TS430xxx target socket module.

4. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB.

5. Compared to the parallel-port debug interface, the USB FET has additional features including JTAG security fuse blow and adjustable target VCC(1.8 V to 3.6 V). Supply the module with up to 100 mA.

1.16 Hardware Installation, eZ430-F2013, eZ430-RF2500, eZ430-Chronos

Follow these steps to install the hardware for the eZ430-F2013 and eZ430-RF2500 tools:

1. Connect the eZ430-F2013, eZ430-RF2500 and eZ430-Chronos to a USB port of the PC.

2. The USB FET should be recognized by the PC. The USB device driver should have been installed with the IDE (Code Composer Studio or IAR Embedded Workbench - Code Composer Essentials only supports eZ430-F2013 and eZ430-RF2500). If the install wizard starts, follow the prompts and point the wizard to the driver files. The default location for CCE is C:\Program Files\Texas Instruments\MSP430_USB_DRIVERS_v3\. The default location for CCS is C:\Program Files\Texas Instruments\ccs4\emulation\drivers\msp430\. The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\ 430\bin\WinXP. Detailed driver installation instructions can be found in Appendix C.

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1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900, EM430Fx137RF900

MSP-FET430Uxx – 'U14, 'U092, ,U24, 'U28, 'U28A, 'U38, 'U23x0, 'U40, 'U40A, 'U48, 'U48B, 'U64, 'U64A, 'U64USB, 'U80, 'U80USB, 'U100, 'U100A, 'U100B, 'U5x100, 'U100USB

TS430xxx – 'PW14, 'L092, 'PW24, 'DW28, 'PW28, 'PW28A, 'DA38, 'QFN32x0, 'RSB40, 'DL48, 'RGZ48B, 'PM64, 'PM64A, 'RGC64B, 'RGC64USB, 'PN80, 'PN80A, 'PN80USB, 'PZ100, 'PZ100A, 'PZ100B, 'PZ5x100, 'PZ100USB

Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:

1. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.

Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.

2. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a

circular indentation on the top surface) aligns with the "1" mark on the PCB.

3. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations

of the target socket modules and their parts are found in Appendix B.

NOTE: Regarding 'U38, see FAQ Hardware #2 in Appendix A.

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Important MSP430 Documents on the CD-ROM and Web

1.18 Important MSP430 Documents on the CD-ROM and Web

The primary sources of MSP430 information are the device-specific data sheet and user's guide. The most up-to-date versions of these documents that are available at the time of production are provided on the CD-ROM included with this tool. The MSP430 web site (www.ti.com/msp430) contains the most recent version of these documents.

PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is available, and the Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v4 provide additional help besides the product help and Welcome page.

PDF documents describing the IAR tools (Workbench/C-SPY, the assembler, the C compiler, the linker, and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (i.e., the latest information) are available in HTML format in the same directories. 430\doc\readme_start.htm provides a convenient starting point for navigating the IAR documentation.

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Chapter 2

SLAU278F–May 2009–Revised December 2010

Design Considerations for In-Circuit Programming

This chapter presents signal requirements for in-circuit programming of the MSP430.

Topic ........................................................................................................................... Page

2.1 Signal Connections for In-System Programming and Debugging ............................ 24

2.2 External Power .................................................................................................. 27

2.3 Bootstrap Loader (BSL) ..................................................................................... 27

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Signal Connections for In-System Programming and Debugging

2.1 Signal Connections for In-System Programming and Debugging

MSP-FET430PIF, MSP-FET430UIF, MSP-GANG430, MSP-PRGS430

With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers, thus providing an easy way to program prototype boards, if desired.

Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target

device required to support in-system programming and debugging for 4-wire JTAG communication.

Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). While 4-wire JTAG mode is

supported on all MSP430 devices, 2-wire JTAG mode is available on selected devices only. See the CCS User's Guide for MSP430 (SLAU157) or IAR for MSP430 User's Guide (SLAU138) for information on which interface method can be used on which device.

The connections for the FET interface module and the MSP-GANG430 or MSP-PRGS430 are identical. Both the FET interface module and MSP-GANG430 can supply VCCto the target board (via pin 2). In addition, the FET interface module and MSP-GANG430 have a VCC-sense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCCpresent on the target board (i.e., a battery or other local power supply) and adjusts the output signals accordingly. If the target board is to be powered by a local VCC, then the connection to pin 4 on the JTAG should be made, and not the connection to pin 2. This utilizes the VCC-sense feature and prevents any contention that might occur if the local on-board VCCwere connected to the VCCsupplied from the FET interface module or the MSP-GANG430. If the VCC-sense feature is not necessary (i.e., the target board is to be powered from the FET interface module or the GANG430) the VCCconnection is made to pin 2 on the JTAG header and no connection is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplying VCCto the target board. If this flexibility is not required, the desired VCCconnections may be hard-wired eliminating the jumper block. Pins 2 and 4 must not be connected simultaneously.

Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signal to the JTAG connector is optional when using devices that support only 4-wire JTAG communication mode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAG mode, the RST connection must be made. The MSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signal of the JTAG connector may be used by the development tool or device programmer as an additional way to assert a device reset.

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TDO/TDI

TDI/VPP

TMS

TCK

GND

TEST/VPP

JTAG

VCC TOOL

VCC TARGET

J1 (see Note A)

J2 (see Note A)

47 k

(see Note B)

10 µF

0.1 µF

V /AV /DV

CCCC CC

RST/NMI

TDO/TDI

TDI/VPP

TMS

TCK

TEST/VPP (see Note C)

V /AV /DV

SS SS SS

MSP430Fxxx

10 nF/2.2 nF

(see Notes B and E)

RST (see Note D)

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Signal Connections for In-System Programming and Debugging

A Make either connection J1 in case a local target power supply is used or connection J2 to power target from the

debug/programming adapter.

B The RST/NMI pin R1/C1 configuration is device family dependent. See the respective MSP430 family user's guide for

the recommended configuration.

C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data

sheet to determine if this pin is available.

D The connection to the JTAG connector RST pin is optional when using 4-wire JTAG communication mode

capable-only devices and not required for device programming or debugging. However, this connection is required when using 2-wire JTAG communication mode capable devices in 4-wire JTAG mode.

E When using 2-wire JTAG communication capable devices in 4-wire JTAG mode, the upper limit for C1 should not

exceed 2.2 nF. This applies to both TI FET interface modules (LPT/USB FET).

Figure 2-1. Signal Connections for 4-Wire JTAG Communication

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TCK

GND

TEST/VPP

VCC TOOL

VCC TARGET

J2 (see Note A)

47 k

(see Note B)

10 µF

0.1 µF

V /AV /DV

CCCC CC

RST/NMI/SBWTDIO

MSP430Fxxx

2.2 nF

(see Note B)

TEST/SBWTCK

V /AV /DV

SS SS SS

J1 (see Note A)

JTAG

TDO/TDI

R2 330 (see Note C)

Signal Connections for In-System Programming and Debugging

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A Make either connection J1 in case a local target power supply is used or connection J2 to power target from the

debug/programming adapter.

B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during

JTAG access and that any capacitance attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF when using current TI FET interface modules (USB FET).

C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the

TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 ?), and do not connect TEST/VPP to TEST/SBWTCK.

Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire)

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2.2 External Power

The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirement of the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry is added to the tool, this current limit could be exceeded. In this case, external power can be supplied to the tool via connections provided on the target socket modules. See the schematics and pictorials of the target socket modules in Appendix B to locate the external power connectors.

The MSP-FET430UIF can supply targets with up to 100 mA through pin 2 of the 14-pin connector. VCCfor the target can be selected between 1.8 V and 5 V in steps of 0.1 V. Alternatively, the target can be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pin connector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCCautomatically. Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected; not both at the same time.

When a target socket module is powered from an external supply, the external supply powers the device on the target socket module and any user circuitry connected to the target socket module, and the FET interface module continues to be powered from the PC via the parallel port. If the externally supplied voltage differs from that of the FET interface module, the target socket module must be modified so that the externally supplied voltage is routed to the FET interface module (so that it may adjust its output voltage levels accordingly). See the target socket module schematics in Appendix B.

2.3 Bootstrap Loader (BSL)

The JTAG pins provide access to the flash memory of the MSP430Fxxx devices. On some devices, these pins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program (a "bootstrap loader") that permits the flash memory to be erased and programmed using a reduced set of signals. The MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319) describes this interface. TI does not produce a BSL tool. However, customers can easily develop their own BSL tools using the information in the application reports, or BSL tools can be purchased from third parties. See the

MSP430 web site for the application reports and a list of MSP430 third-party tool developers.

TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (i.e., TI suggests providing access to these signals via, for example, a header).

See FAQ Hardware #11 for a second alternative to sharing the JTAG and port pins.

External Power

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Design Considerations for In-Circuit Programming SLAU278F–May 2009–Revised December 2010

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Appendix A

SLAU278F–May 2009–Revised December 2010

Frequently Asked Questions and Known Issues

This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.

Topic ........................................................................................................................... Page

A.1 Hardware FAQs ................................................................................................. 30

A.2 Known Issues ................................................................................................... 32

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Hardware FAQs

A.1 Hardware FAQs

1. The state of the device (CPU registers, RAM memory, etc.) is undefined following a reset.

Exceptions to the above statement are that the PC is loaded with the word at 0xFFFE (i.e., the reset vector), the status register is cleared, and the peripheral registers (SFRs) are initialized as documented in the device family user's guides. The CCE/CCS debugger and C-SPY reset the device after programming it.

2. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information

Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configuration and only to the period while a debug session is active. Workarounds:

• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.

• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down menu (at top of Debug View). This prevents the debugger from accessing the MSP430 while the application is running. Note that, in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature.

• Use an external clock source to drive XIN directly.

3. With current interface hardware and software, there is a weakness when adapting target boards that are powered externally. This leads to an accidental fuse check in the MSP430. This is valid for PIF and UIF but is mainly seen on UIF. A solution is being developed. Workarounds:

• Connect RST/NMI pin to JTAG header (pin 11), LPT/USB tools are able to pull the RST line, which

also resets the device internal fuse logic.

• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down

menu. This prevents the debugger from accessing the MSP430 while the application is running. Note that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature.

• Use an external clock source to drive XIN directly.

4. The 14-conductor cable connecting the FET interface module and the target socket module must not exceed 8 inches (20 centimeters) in length.

5. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the USB FET.

6. To utilize the on-chip ADC voltage references, C6 (10 ?F, 6.3 V, low leakage) must be installed on the target socket module.

7. To utilize the charge pump on the devices with LCD+ Module, C4 (10 ?F, low leakage) must be installed on the target socket module.

8. Crystals/resonators Q1 and Q2 (if applicable) are not provided on the target socket module. For MSP430 devices that contain user-selectable loading capacitors, the effective capacitance is the selected capacitance plus 3 pF (pad capacitance) divided by two.

9. Crystals/resonators have no effect upon the operation of the tool and the CCE/CCS debugger or C-SPY (as any required clocking/timing is derived from the internal DCO/FLL).

10. On 20-pin and 28-pin devices with multiplexed port/JTAG pins (P1.4 to P1.7), to use these pin in their port capacity: For CCE/CCS: "Run Free" (in Run pull-down menu at top of Debug View) must be selected. For C-SPY: "Release JTAG On Go" must be selected.

11. As an alternative to sharing the JTAG and port pins (on 20 and 28 pin devices), consider using an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the MSP430 is that the family members are code and architecturally compatible, so code developed on one device (for example, one without shared JTAG and port pins) ports effortlessly to another (assuming an equivalent set of peripherals).

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12. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.

13. The device current increases by approximately 10 ?A when a device in low-power mode is

14. The following ZIF sockets are used in the FET tools and target socket modules:

Hardware FAQs

Customers should erase the information memory before its first use. Main memory of packaged devices is blank when the device is delivered from TI.

stopped [using Halt (CCE/CCS) or Esc (C-SPY)] and then the low-power mode is restored [using Run (CCE/CCS) or Go (C-SPY)]. This behavior appears to happen on all devices except the MSP430F12x.

• 14-pin device (PW package): Enplas OTS-14-065-01

• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146

• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02

• 28-pin device (DW package): Wells-CTI 652 D028

• 28-pin device (PW package): Enplas OTS-28-0.65-01

• 38-pin device (DA package): Yamaichi IC189-0382-037

• 40-pin device (RHA package): Enplas QFN-40B-0.5-01

• 40-pin device (RSB package): Enplas QFN-40B-0.4

• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001

• 48-pin device (DL package): Yamaichi IC51-0482-1163

• 64-pin device (PM package): Yamaichi IC51-0644-807

• 64-pin device (RGC package): Yamaichi QFN11T064-006

• 80-pin device (PN package): Yamaichi IC201-0804-014

• 100-pin device (PZ package): Yamaichi IC201-1004-008 Enplas: www.enplas.com Wells-CTI: www.wellscti.com Yamaichi: www.yamaichi.us

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Known Issues

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A.2 Known Issues

MSP-FET430PIF Some PCs do not supply 5 V through the parallel port

Problem Description Device identification problems with modern PCs, because the parallel port often does not

deliver 5 V as was common with earlier hardware.

1. When connected to a laptop, the test signal is clamped to 2.5 V.

2. When the external VCCbecomes less than 3 V, up to 10 mA is flowing in the adapter via pin 4 (sense).

Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the

VCCpads of the interface. The jumper on a the target socket must be switched to external power.

MSP-FET430UIF Current detection algorithm of the UIF firmware

Problem Description If high current is detected, the I

Monitor algorithm stays in a loop of frequently

switching on and off the target power supply. This power switching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control.

A side issue is that if the UIF firmware has entered this switch on / switch off loop, it is not possible to turn off the power supply to the target by calling MSP430_VCC(0). A power cycle is required to remove the device from this state.

Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version

2.04.00.003 and higher do not show this problem. Update the software development tool

to this version or higher to update the MSP-FET430UIF firmware.

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Appendix B

SLAU278F–May 2009–Revised December 2010

Hardware

This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and bills of materials. All other tools, such as the eZ430 series, are described in separate product-specific user's guides.

Topic ........................................................................................................................... Page

B.1 MSP-TS430PW14 ............................................................................................... 34

B.2 MSP-TS430L092 ................................................................................................ 37

B.3 MSP-TS430L092 Active Cable ............................................................................. 40

B.4 MSP-TS430PW24 ............................................................................................... 43

B.5 MSP-TS430DW28 ............................................................................................... 46

B.6 MSP-TS430PW28 ............................................................................................... 49

B.7 MSP-TS430PW28A ............................................................................................. 52

B.8 MSP-TS430DA38 ............................................................................................... 55

B.9 MSP-TS430QFN23x0 .......................................................................................... 58

B.10 MSP-TS430RSB40 ............................................................................................. 61

B.11 MSP-TS430RHA40A ........................................................................................... 64

B.12 MSP-TS430DL48 ................................................................................................ 67

B.13 MSP-TS430RGZ48B ........................................................................................... 70

B.14 MSP-TS430PM64 ............................................................................................... 73

B.15 MSP-TS430PM64A ............................................................................................. 76

B.16 MSP-TS430RGC64B ........................................................................................... 79

B.17 MSP-TS430RGC64USB ....................................................................................... 82

B.18 MSP-TS430PN80 ............................................................................................... 86

B.19 MSP-TS430PN80A ............................................................................................. 89

B.20 MSP-TS430PN80USB ......................................................................................... 91

B.21 MSP-TS430PZ100 .............................................................................................. 96

B.22 MSP-TS430PZ100A ............................................................................................ 99

B.23 MSP-TS430PZ100B .......................................................................................... 102

B.24 MSP-TS430PZ5x100 ......................................................................................... 105

B.25 MSP-TS430PZ100USB ...................................................................................... 107

B.26 EM430F5137RF900 ........................................................................................... 112

B.27 EM430F6137RF900 ........................................................................................... 116

B.28 MSP-FET430PIF ............................................................................................... 120

B.29 MSP-FET430UIF ............................................................................................... 122

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MSP-TS430PW14

B.1 MSP-TS430PW14

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Figure B-1. MSP-TS430PW14 Target Socket Module, Schematic

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Jumper J4

Open to disconnect LED

Orient Pin 1 of

MSP430 device

Jumper J6 Open to measure current

Connector J3 External power connector Jumper J5 to 'ext'

LED connected to P1.0

Jumpers J7 to J12 Close 1-2 to debug in Spy-Bi-Wire Mode. Close 2-3 to debug in 4-wire JTAG mode.

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MSP-TS430PW14

Figure B-2. MSP-TS430PW14 Target Socket Module, PCB

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MSP-TS430PW14

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C7 1 10uF/10V, Tantal Size B 511-1463-2-ND 3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C3 4 C8 0 2.2nF, SMD0805 DNP 5 D1 1 green LED, SMD0603 475-1056-2-ND

6 J1, J2 0 7-pin header, TH enclosed with kit. Keep vias free of

7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND

8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2

10 JTAG 1 HRP14H-ND

12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder

13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas 17 PCB 1 56 x 53 mm 2 layers

18 4 Apply to corners at bottom side 19 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI

Table B-1. MSP-TS430PW14 Bill of Materials

No. per

Board

"SAM1029-07NDSAM1213-07-ND"

J3, J5, J7,

J11, J12

14-pin connector, male, TH

Micro Crystal MS1V-T1K

12.5pF

Adhesive about 6mm width, 2mm e.g., 3M Bumpons Part

plastic feet height No. SJ-5302

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DNP: Headers and receptacles solder: Header: Receptacle Place jumpers on headers J5, J7, J8,

J9, J10, J11, J12; Pos 1-2

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B.2 MSP-TS430L092

MSP-TS430L092

Figure B-3. MSP-TS430L092 Target Socket Module, Schematic

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MSP-TS430L092

Settings of the MSP-TS430L092 Target Socket

Figure B-4 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is

recommended:

• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.

• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current consumption. For default operation, they should be closed.

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Figure B-4. MSP-TS430L092 Target Socket Module, PCB

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MSP-TS430L092

Table B-2. MSP-TS430L092 Bill of Materials

Pos. Ref Des No. Description DigiKey Part No. Comment

1 C1, C2 2 330nF, SMD0603 2 C5 1 100n, SMD0603 3 C6 1 10u, SMD0805 4 C10 1 100n, SMD0603 5 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND

7 J1, J2 2 7-pin header, TH

8 J3 1 3-pin header, male, TH SAM1035-03-ND 9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe

11 J13 1 MICRO_STECKV_10 MicroMaTch-Connector: MM

12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557 16 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 1686065 17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC 18 R0, R6, R7 3 2K7, SMD0603 19 R1 1 1k, SMD0603 20 R2 1 47k, SMD0603

R4,R5, R8,

21 6 10k, SMD0603

R10, RC, RD 22 RA 1 3.9k, SMD0603 23 RB 1 6.8k, SMD0603

24 U1 1 Manuf. Yamaichi

22 MSP430 2 MSP430L092PWR

No. Per

Board

DNP: headers and receptacles enclosed with kit.

Keep vias free of solder. SAM1213-07-ND : Header SAM1035-07-ND : Receptacle

DNP; Keep vias free of

solder.

Reichelt:

FL 10G

14 Pin Socket IC189-0142-146

DNP: enclosed with kit. Is supplied by TI

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MSP-TS430L092 Active Cable

B.3 MSP-TS430L092 Active Cable

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Figure B-5. MSP-TS430L092 Active Cable Target Socket Module, Schematic

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Figure B-6 shows the PCB layout for the Active Cable. The following pinning is possible:

• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-3.

• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to

MSP-TS430L092 Active Cable

Table B-3. MSP-TS430L092 JP1 Settings

Jumper 1 Jumper 2 Description

Off Off The active cable has no power and does not function. Off On On Off The active cable receives power from the JTAG connector.

On On this option, the target socket must not have its own power source, as this

The active cable receives power from target socket. For this option, the target socket must have its own power supply.

The JTAG connector powers the active cable and the target socket. For would cause a not defined state.

high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.

Figure B-6. MSP-TS430L092 Active Cable Target Socket Module, PCB

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MSP-TS430L092 Active Cable

Pos. Ref Des Description DigiKey Part No. Comment

C1, C3, C5,

1 4 100nF, SMD0603 2 C2, C4 2 1uF, SMD0805

3 R1, R10 2 10K, SMD0603 4 R2 1 4K7, SMD0603

5 4 100, SMD0603 6 R8 1 680k, SMD0603

7 R11, R15 2 1K, SMD0603 8 R12 0 SMD0603 DNP

9 R13 0 SMD0603 DNP 10 R14 1 0, SMD0603 11 IC1 1 SN74AUC1G04DBVR Manu: TI 12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI

13 J2 1 MICRO_STECKV_10 MicroMaTch-Connector: MM

14 JP1 1 2x2 Header JP2Q 15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header

16 JTAG 1 14-pin connector, male, TH HRP14H-ND 17 Q1 1 18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI

R5, R6, R7,

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Table B-4. MSP-TS430L092 Active Cable Bill of Materials

No. Per

Board

Reichelt: FL 10G

Put jumper on Position 1 and

2. Do not mix direction.

BC817-25LT1SMD, Digi-Key: SOT23-BEC BC817-25LT1GOSCT-ND

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B.4 MSP-TS430PW24

MSP-TS430PW24

Figure B-7. MSP-TS430PW24 Target Socket Module, Schematic

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Jumper JP2 Open to measure current

Orient Pin 1 of MSP430 device

D1 LED connected to P1.0

Jumper JP3 Open to disconnect LED

Connector J5 External power connector Jumper JP1 to "ext"

Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

MSP-TS430PW24

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Figure B-8. MSP-TS430PW24 Target Socket Module, PCB

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MSP-TS430PW24

Table B-5. MSP-TS430PW24 Bill of Materials

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C5 1 2.2nF, SMD0805 3 C3, C7 2 10uF/10V, SMD0805 4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND

6 J1, J2 0 12-pin header, TH enclosed with kit. Keep vias free of

J5, JP1,

7 8 3-pin header, male, TH SAM1035-03-ND

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 9 Jumper 15-38-1024-ND see Pos 7 an 8 10 JTAG 1 HRP14H-ND 11 Q1 0 Crystal DNP: keep vias free of solder

12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND 13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6 14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND 15 U1 1 Manuf.: Enplas 16 PCB 1 68.5 x 61 mm 2 layers 17 4 Apply to corners at bottom side 18 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI

JP4, JP5, Place jumper on 1-2 of JP4-JP9 JP6, JP7, Place on 1-2 on JP1

JP8, JP9

R5, R6, R8, R9,

Adhesive about 6mm width, 2mm e.g., 3M Bumpons Part

plastic feet height No. SJ-5302

No. per

Board

14-pin connector, male, TH

Socket: OTS 24(28)-065-02-00

"SAM1029-07NDSAM1213-07-ND"

DNP: Headers and receptacles solder. (Header & Receptacle)

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MSP-TS430DW28

B.5 MSP-TS430DW28

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Figure B-9. MSP-TS430DW28 Target Socket Module, Schematic

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Jumper J4 Open to disconnect LED

Orient Pin 1 of MSP430 device

Jumper J5 Open to measure current

Connector J3 External power connector Remove R8 and jumper R9

LED connected to P1.0

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MSP-TS430DW28

Figure B-10. MSP-TS430DW28 Target Socket Module, PCB

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MSP-TS430DW28

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805

2 C5 1 100nF, SMD0805

3 C7 1 10uF/10V Tantal Elko B

4 C8 1 10nF SMD0805

5 D1 1 LED3 T1 3mm yellow RS: 228-4991

6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering

7 J1, J2 2 14-pin header, TH male enclosed with kit. Keep vias free of

7.1 2 enclosed with kit. Keep vias free of

8 J3 1 3-Pin Connector, male

9 J4, J5 2 2-Pin Connector, male With jumper 10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering 11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121

12 4 0R, SMD0805 DNP: R1, R2, R9, R10

13 R3 1 560R, SMD0805 14 R5 1 47K, SMD0805

15 U1 1 SOP28DW socket 16 U2 0 TSSOP DNP

R1, R2, R6, R7,

R8,R9,

R10, R11

Table B-6. MSP-TS430DW28 Bill of Materials

No. per

Board

Micro Crystal MS1V-T1K

12.5pF

14-pin header, TH female

Yamaichi: IC189-0282-042

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DNP: C1, C2, Cover holes while soldering

DNP: Headers and receptacles solder.: Header: Receptacle

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B.6 MSP-TS430PW28

MSP-TS430PW28

Figure B-11. MSP-TS430PW28 Target Socket Module, Schematic

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Jumper JP2

Open to measure current

Jumper JP3 Open to disconnect LED

LED D1 connected to P5.1

Jumper JP1

1-2 (int): Power supply via JTAG interface

2-3 (ext): External Power Supply

Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

Orient Pin 1 of Device

MSP-TS430PW28

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Figure B-12. MSP-TS430PW28 Target Socket Module, PCB

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(1)

MSP-TS430PW28

Table B-7. MSP-TS430PW28 Bill of Materials

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF/10V Tantal Elko B

3 C4 1 100nF, SMD0805 4 C5 0 2.2nF, SMD0805 DNP 5 D1 1 LED green SMD0603

6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while

7 J1, J2 2 14-pin header, TH male kit.Keep vias free of

7.1 2 14-pin header, TH female kit.Keep vias free of

8 J5, IP1 1 3-Pin Connector , male

JP1, JP4,

8a 7 3-Pin Connector , male Jumper on Pos 1-2

JP5, JP6, JP7, JP8,

JP9

9 JP2, JP3 2 2-Pin Connector , male with Jumper 10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121

12 R1, R7 2 330R, SMD0805 12 0 0R, SMD0805 DNP

R2, R3, R5,

R6 14 R4 1 47K, SMD0805 15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01

PCB 66 x 79 mm, two layers; Rubber stand off, four pieces

No. per

Board

Micro Crystal MS1V-T1K DNP: Cover holes and

12.5pF soldering

(1)

DNP: C1, C2 , Cover holes while soldering

DNP: Headers and receptacles enclosed with

solder.: Header: Receptacle

DNP: headers and receptacles enclosed with

solder.: Header: Receptacle

DNP: Cover holes while soldering

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MSP-TS430PW28A

B.7 MSP-TS430PW28A

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Figure B-13. MSP-TS430PW28A Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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Jumper JP2 Open to measure current

Orient Pin 1 of MSP430 device

Jumper JP3 Open to disconnect LED

D1 LED connected to P1.0

Connector J5 External power connector Jumper JP1 to "ext"

Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

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MSP-TS430PW28A

Figure B-14. MSP-TS430PW28A Target Socket Module, PCB (Red)

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430PW28A

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C5 1 2.2nF, SMD0805 3 C3 1 10uF/10V, SMD0805 4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND

6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of

7 8 3-pin header, male, TH SAM1035-03-ND

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 9 Jumper 15-38-1024-ND see Pos 7 an 8

10 JTAG 1 HRP14H-ND 11 BOOTST 0 DNP Keep vias free of solder

12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder

13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND 14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas 17 PCB 1 63.5 x 64.8 mm 2 layers

18 4 Apply to corners at bottom side 19 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI

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Table B-8. MSP-TS430PW28A Bill of Materials

No. per

Board

DNP: Headers and receptacles solder: (Header & Receptacle)

J5, JP1, JP4, JP5, Place jumper on 1-2 of JP4-JP9 JP6, JP7, Place on 1-2 on JP1

JP8, JP9

14-pin connector, male, TH

Micro Crystal MS3V

12.5pF

R2, R3,R5,

R6,

Adhesive about 6mm width, 2mm e.g., 3M Bumpons Part

plastic feet height No. SJ-5302

Hardware SLAU278F–May 2009–Revised December 2010

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B.8 MSP-TS430DA38

MSP-TS430DA38

Figure B-15. MSP-TS430DA38 Target Socket Module, Schematic

SLAU278F–May 2009–Revised December 2010 Hardware

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Orient pin 1 of MSP430 device

LED connected to P1.0

Connector J3 External power connector Jumper JP1 to 'ext'

Jumper JP3 Open to disconnect LED

Jumper JP2 Open to measure current

Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire Mode, Close 2-3 to debug in 4-wire JTAG Mode

MSP-TS430DA38

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Figure B-16. MSP-TS430DA38 Target Socket Module, PCB

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430DA38

Table B-9. MSP-TS430DA38 Bill of Materials

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C7 1 10uF/10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 0 2.2nF, SMD0805 DNP 5 D1 1 green LED, SMD0603 475-1056-2-ND

6 J1, J2 0 19-pin header, TH kit.Keep vias free of

"J3, JP1,

7 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7,

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 9 Jumper 15-38-1024-ND 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH

12 Q1 0 Crystal 32.768kHz, C(Load) =

13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND 14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi 17 PCB 1 67 x 66 mm 2 layers

18 4 ~6mm width, 2mm height

19 MSP430 2 MSP430F2274IDA

JP4, JP5, JP6, JP7, JP8, JP9"

Adhesive e.g., 3M Bumpons Part No. Apply to corners at bottom

Plastic feet SJ-5302 side

No. per

Board

"SAM1029-19NDSAM1213-19-ND"

Micro Crystal MS1V-T1K

12.5pF

DNP: headers and receptacles enclosed with

solder.: Header: Receptacle

Place jumpers on headers JP8, JP9; Pos 1-2

Place on: JP1 - JP9; Pos 1-2

DNP: Keep vias free of solder

DNP: enclosed with kit supplied by TI

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430QFN23x0

B.9 MSP-TS430QFN23x0

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Figure B-17. MSP-TS430QFN23x0 Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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LED connected to P1.0

Connector J5 External power connector Jumper JP1 to 'ext'

Jumper JP3 Open to disconnect LED

Jumper JP2 Open to measure current

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MSP-TS430QFN23x0

Figure B-18. MSP-TS430QFN23x0 Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430QFN23x0

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP

2 C3 1 10uF/10V, Tantal Size B 511-1463-2-ND

3 C4 1 100nF, SMD0805 478-3351-2-ND

4 C5 1 10nF, SMD0805 478-1383-2-ND

5 D1 1 green LED, SMD0603 475-1056-2-ND

6 0 10-pin header, TH kit.Keep vias free of

7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3 10 JTAG 1 14-pin connector, male, TH HRP14H-ND

11 BOOTST 0 10-pin connector, male, TH

12 Q1 0 Crystal 32.768kHz, C(Load) =

13 R1 1 330 Ω, SMD0805 541-330ATR-ND 14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas 17 PCB 1 79 x 66 mm 2 layers

18 4 ~6mm width, 2mm height

19 MSP430 2 MSP430F2370IRHA

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Table B-10. MSP-TS430QFN23x0 Bill of Materials

No. per

Board

DNP: headers and

J1, J2, J3, SAM1034-10-NDSAM1212-

J4 10-ND

Micro Crystal MS1V-T1K

12.5pF

Adhesive e.g., 3M Bumpons Part No. Apply to corners at bottom

Plastic feet SJ-5302 side

receptacles enclosed with solder.: Header:

Receptacle Place jumper on header

JP1; Pos 1-2.

DNP: Keep vias free of solder

DNP: enclosed with kit supplied by TI

Hardware SLAU278F–May 2009–Revised December 2010

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B.10 MSP-TS430RSB40

MSP-TS430RSB40

Figure B-19. MSP-TS430RSB40 Target Socket Module, Schematic

SLAU278F–May 2009–Revised December 2010 Hardware

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Jumper JP2 Open to measure current

Orient Pin 1 of MSP430 device

Jumper JP3 Open to disconnect LED

D1 LED connected to P1.0

Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

Connector J5 External power connector Jumper JP1 to "ext"

MSP-TS430RSB40

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Figure B-20. MSP-TS430RSB40 Target Socket Module, PCB

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430RSB40

Table B-11. MSP-TS430RSB40 Bill of Materials

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

C3, C7, C10,

2 3 10uF/10V, SMD 0805 445-1371-1-ND DNP C12

3 3 100nF, SMD0805 311-1245-2-ND DNP C11 4 C5 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND

7 J1, J2, J3, J4 4 10-pin header, TH

7.1 4 10-pin header, TH

8 JP6, JP7, 9 3-pin header, male, TH SAM1035-03-ND

9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH

12 U1 1 Enplas

13 Q1 0 Crystal 32.768kHz, C(Load) =

15 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,

16 R1,R7 2 330R SMD0805

17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6

18 R4 1 47k SMD0805 19 MSP430 2 MSP430F5132

20 4

C12

C4, C6, C8,

C11

JP1,

JP4,JP5,

JP8, JP9, J5,

JP10

R2, R3, R5,

R10

Rubber stand select appropriate; e.g., apply to corners at bottom

off Buerklin: 20H1724 side

No. Per

Board

QFN-40B-0.4_

ENPLAS_SOCKET

Micro Crystal MS3V-T1R

12.5pF

DNP: headers and

receptacles enclosed with kit.

Keep vias free of solder. :

Header : Receptacle

DNP: headers and

receptacles enclosed with kit.

Keep vias free of solder. :

Header : Receptacle

Jumper: 1-2 on JP1, JP10;

2-3 on JP4-JP9

DNP. Keep vias free of

solder

DNP: Q1. Keep vias free of

solder

Place on: JP1, JP2, JP3,

JP9, JP10

DNP: enclosed with kit. Is

supplied by TI

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430RHA40A

B.11 MSP-TS430RHA40A

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Figure B-21. MSP-TS430RHA40A Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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Jumper JP2 Open to measure current

Connector J5 External power connector Jumper JP1 to "ext"

Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

D1 LED connected to P1.0

Jumper JP3 Open to disconnect LED

Orient Pin 1 of MSP430 device

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MSP-TS430RHA40A

Figure B-22. MSP-TS430RHA40A Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430RHA40A

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 2 C5 0 2.2nF, SMD0805 DNP C12 3 C3, C7 2 10uF/10V, SMD0805 5 DNP C11 4 C4, C6 2 100nF, SMD0805 478-3351-2-ND 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND

7 4 10-pin header, TH enclosed with kit. Keep vias free of

7.1 4 10-pin header, TH enclosed with kit. Keep vias free of

8 8 3-pin header, male, TH SAM1035-03-ND

9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

10 9 Jumper 15-38-1024-ND see Pos 8 an 9 11 JTAG 1 HRP14H-ND

12 BOOTST 0 DNP. Keep vias free of solder 13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas

14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder

15 R1,R7 2 330R SMD0805 541-330ATR-ND

16 R5, R6, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6

17 R4 1 47k SMD0805 18 PCB 1 79 x 66 mm 2 layers

19 4 apply to corners at bottom side

20 MSP430 2 MSP430N5736IRHA

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Table B-12. MSP-TS430RHA40A Bill of Materials

No. per

Board

J1, J2, J3,

J5, JP1, JP4, JP5, Place jumper on 1-2 of JP4-JP9; JP6, JP7, Place on 1-2 on JP1

JP8, JP9

14-pin connector, male,

10-pin connector, male,

Micro Crystal MS3V-T1R

12.5pF

R2, R3, R8, R9,

Rubber select appropriate; e.g.,

stand off Buerklin: 20H1724

DNP: headers and receptacles

solder. : Header : Receptacle

DNP: headers and receptacles

solder. : Header : Receptacle

DNP: enclosed with kit. Is supplied by

Hardware SLAU278F–May 2009–Revised December 2010

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B.12 MSP-TS430DL48

MSP-TS430DL48

Figure B-23. MSP-TS430DL48 Target Socket Module, Schematic

SLAU278F–May 2009–Revised December 2010 Hardware

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Jumper J4 Open to disconnect LED

LED connected to P1.0

Orient pin 1 of MSP430 device

Jumper J5 Open to measure current

Connector J3 External power connector Jumper JP1 to ‘ext’

MSP-TS430DL48

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Figure B-24. MSP-TS430DL48 Target Socket Module, PCB

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430DL48

Table B-13. MSP-TS430DL48 Bill of Materials

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C4, C7 2 10uF/10V, Tantal Size B 511-1463-2-ND 3 C3, C5 2 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

6 J1, J2 0 24-pin header, TH kit.Keep vias free of

7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND 8 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5

10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH

12 Q1 0 Crystal 32.768kHz, C(Load) =

13 R3 1 560 Ω, SMD0805 541-560ATR-ND 14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Manuf.: Yamaichi 17 PCB 1 58 x 66 mm 2 layers 18 4 ~6mm width, 2mm height

19 MSP430 2 MSP430F4270IDL

R4, R6, R7,

R12

Adhesive e.g., 3M Bumpons Part No. Apply to corners at bottom

Plastic feet SJ-5302 side

No. per

Board

Socket: IC51-1387 KS-15186

SAM1034-12-NDSAM121212-ND

Micro Crystal MS1V-T1K

12.5pF

DNP: Headers and receptacles enclosed with

solder.: Header: Receptacle

Place jumper on header JP1; Pos 1-2. DNP: JP2

DNP: Keep vias free of solder

DNP: Enclosed with kit supplied by TI

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430RGZ48B

B.13 MSP-TS430RGZ48B

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Figure B-25. MSP-TS430RGZ48B Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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Jumper JP2 Open to disconnect LED

Connector J5 External power connector Jumper JP1 to "ext"

Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

D1 LED connected to P1.0

Jumper JP1 Open to measure current

Orient Pin 1 of MSP430 device

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MSP-TS430RGZ48B

Figure B-26. MSP-TS430RGZ48B Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430RGZ48B

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP

3 3 10uF/6.3V, SMD0805

4 4 100nF, SMD0805 311-1245-2-ND 5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND 7 D1 1 green LED, SMD0805 P516TR-ND

8 0 12-pin header, TH enclosed with kit. Keep vias free of

9 J5 1 3-pin header, male, TH

10 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place

11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11

13 JTAG 1 HRP14H-ND

14 BOOTST 0 "DNP Keep vias free of solder"

15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

16 Q2 0 Crystal DNP: Q2 Keep vias free of solder

17 0 Insulating disk to Q2 t_Detail.cfm?ART_ART

18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

19 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

20 R5 1 47k Ω, SMD0805 541-47000ATR-ND

21 U1 1 QFN11T048- Manuf.: Yamaichi

22 PCB 1 81 x 76 mm 2 layers 23 4 Apply to corners at bottom side 24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI

Table B-14. MSP-TS430RGZ48B Bill of Materials

No. per

Board

C6, C7,

C12

C5, C11, C13, C14

J1, J2, J3, (Header)

J4 SAM1213-12-ND

JP3, JP5, JP6, JP7, JP8, JP9,

JP10

14-pin connector, male, TH

10-pin connector, male, TH

Insulating

disk to Q2

R1, R2, R4, R6,

R9,R10,

R11, R12

Socket: 008_A101121_RGZ48

Adhesive about 6mm width, 2mm e.g., 3M Bumpons Part

plastic feet height No. SJ-5302

SAM1029-12-ND

(Receptacle)

Micro Crystal MS3V-T1R

12.5pF Q2: 4MHz Buerklin:

78D134 http://www.ettinger.de/Ar

NUM=70.08.121

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DNP: Headers and receptacles solder:

place jumpers on pins 2-3 on JP5, jumpers on pins 1-2 on JP3,

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B.14 MSP-TS430PM64

MSP-TS430PM64

NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be

made.

Figure B-27. MSP-TS430PM64 Target Socket Module, Schematic

SLAU278F–May 2009–Revised December 2010 Hardware

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Connector J5 External power connection Remove R8 and jumper R9

LED connected to pin 12

Jumper J6 Open to disconnect LED

Jumper J7 Open to measure current

Orient Pin 1 of MSP430 device

MSP-TS430PM64

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Figure B-28. MSP-TS430PM64 Target Socket Module, PCB

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MSP-TS430PM64

Table B-15. MSP-TS430PM64 Bill of Materials

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP

1.1 C3, C4 0 47pF, SMD0805 recommendation. Check

2 C6, C7 1 10uF/10V, Tantal Size B 511-1463-2-ND DNP: C6 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND

7 0 16-pin header, TH kit.Keep vias free of

8 J5 1 3-pin header, male, TH SAM1035-03-ND

9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 11 2 Jumper 15-38-1024-ND Place on: J6, J7 12 JTAG 1 14-pin connector, male, TH HRP14H-ND

13 BOOTST 0 10-pin connector, male, TH

14 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz,

15 R3 1 330 Ω, SMD0805 541-330ATR-ND

16 R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND

17 R5 1 47k Ω, SMD0805 541-47000ATR-ND 18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 19 PCB 1 78 x 75 mm 2 layers

20 4 select appropriate

21 MSP430 22

J1, J2, J3, SAM1029-16-NDSAM1213-

J4 16-ND

R1, R2, R4, R6, R7, R8,

R11, R12,

R13, R14

Rubber Apply to corners at bottom

standoff side

No. per

Board

DNP: Only your crystal spec.

DNP: Headers and receptacles enclosed with

solder.: Header: Receptacle

DNP: Keep vias free of solder

Q1: Micro Crystal C(Load) = 12.5pF

MSP430F2619IPM DNP: Enclosed with kit MSP430F417IPM supplied by TI

DNP: Keep vias free of solder

DNP: R4, R6, R7, R9, R10, R11, R12, R13, R14

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MSP-TS430PM64A

B.15 MSP-TS430PM64A

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Figure B-29. MSP-TS430PM64A Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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Jumper JP2

Open to measure current

Jumper JP1 Open to disconnect LED

LED D1 connected to P5.1

Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply

Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

Orient Pin 1 of Device

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MSP-TS430PM64A

Figure B-30. MSP-TS430PM64A Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430PM64A

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2, 0 12pF, SMD0805 DNP 2 C3 0 2.2nF, SMD0805 DNP 3 C6, 1 10uF/10V, Tantal Size B 511-1463-2-ND 4 C4, C5 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND

6 0 16-pin header, TH kit. Keep vias free of

7 8 3-pin header, male, TH SAM1035-03-ND

8 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 2 Jumper 15-38-1024-ND Place on: J6, J7

10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH

12 Q1 0 Crystal 32.768kHz, C(Load) =

13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND

14 2 0 Ω, SMD0805 541-000ATR-ND

15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 17 PCB 1 78 x 75 mm 4 layers

18 4 select appropriate

19 MSP430 2 MSP430F4152IPM

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Table B-16. MSP-TS430PM64A Bill of Materials

No. per

Board

DNP: Headers and

J1, J2, J3, SAM1029-16-NDSAM1213-

J4 16-ND

J5, JP3, JP4, JP5, JP6, JP7,

JP8, JP9

Micro Crystal MS1V-T1K

12.5pF

R1, R2, R5,

R7, R9, R10, DNP: R5, R7, R9, R10,

R11, R13, R11, R13, R14

R14

Rubber Apply to corners at bottom

stand off side

receptacles enclosed with solder.: Header:

Receptacle

DNP: Keep vias free of solder

DNP: Enclosed with kit supplied by TI

Hardware SLAU278F–May 2009–Revised December 2010

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B.16 MSP-TS430RGC64B

MSP-TS430RGC64B

Figure B-31. MSP-TS430RGC64B Target Socket Module, Schematic

SLAU278F–May 2009–Revised December 2010 Hardware

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Jumper JP2 Open to disconnect LED

Connector J5 External power connector Jumper JP3 to "ext"

Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

D1 LED connected to P1.0

If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external

Orient Pin 1 of MSP430 device

MSP-TS430RGC64B

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Figure B-32. MSP-TS430RGC64B Target Socket Module, PCB

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430RGC64B

Table B-17. MSP-TS430RGC64B Bill of Materials

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP

3 3 10uF/6.3V, SMD0805

4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 C16 1 4.7uF, SMD0805 8 C17 1 220nF, SMD0805 9 D1 1 green LED, SMD0805 P516TR-ND

10 0 16-pin header, TH enclosed with kit. Keep vias free of

11 J5 , J6 2 3-pin header, male, TH

12 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place

13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13 15 JTAG 1 HRP14H-ND

16 BOOTST 0 "DNP Keep vias free of solder"

17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

18 Q2 0 Crystal DNP: Q2 Keep vias free of solder

19 0 Insulating disk to Q2 t_Detail.cfm?ART_ART

20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

21 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

22 R5 1 47k Ω, SMD0805 541-47000ATR-ND 23 U1 1 Manuf.: Yamaichi 24 PCB 1 85 x 76 mm 2 layers 25 4 Apply to corners at bottom side 26 D3,D4

27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI

C6, C7,

C10

C5, C11,

C15

J1, J2, J3, (Header)

J4 SAM1213-16-ND

JP3, JP5, JP6, JP7, JP8, JP9,

JP10

JP1, JP2,

JP4

Insulating

disk to Q2

R1, R2, R4, R6,

R9,R10,

R11, R12

Adhesive about 6mm width, 2mm e.g., 3M Bumpons Part

plastic feet height No. SJ-5302

No. per

Board

14-pin connector, male, TH

10-pin connector, male, TH

Socket: QFN11T064-006-N-HSP

SAM1029-16-ND

(Receptacle)

Micro Crystal MS3V-T1R

12.5pF Q2: 4MHz Buerklin:

78D134 http://www.ettinger.de/Ar

NUM=70.08.121

DNP: Headers and receptacles solder:

place jumpers on pins 2-3 on JP5, jumpers on pins 1-2 on JP3,

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430RGC64USB

B.17 MSP-TS430RGC64USB

Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately

0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V.

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Figure B-33. MSP-TS430RGC64USB Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430RGC64USB

Figure B-34. MSP-TS430RGC64USB Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430RGC64USB

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND

C5, C11,

3 4 100nF, SMD0805 311-1245-2-ND

C13, C14

3.1 C10, C12 0 10uF, SMD0805 DNP: C10, C12 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND

7 J1, J2, J3, J4 4 16-pin header, TH

8 J5 1 3-pin header, male, TH SAM1035-03-ND

JP5, JP6,

9 JP7, JP8, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3

JP9, JP10

JP1, JP2,

10 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

12 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,

13 JTAG 1 14-pin connector, male, TH HRP14H-ND

14 Q1 0 Crystal 32.768kHz, C(Load) =

15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134 16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500 18 R11 1 1M Ω, SMD0805 18 R5 1 47k Ω, SMD0805 541-47000ATR-ND 19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers

21 4 Buerklin: 20H1724

22 MSP430 2 MSP430F5509 RGC

23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0

27 C33 1 220n SMD0603 Buerklin: 53D2074 28 C35 1 10p SMD0603 Buerklin: 56D102 29 C36 1 10p SMD0603 Buerklin: 56D102 30 C38 1 220n SMD0603 Buerklin: 53D2074 31 C39 1 4u7 SMD0603 Buerklin: 53D2086 32 C40 1 0.1u SMD0603 Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406

JP4

R1, R2, R4,

R12

Rubber stand apply to corners at bottom

off side

Insulating

disk to Q2

Table B-18. MSP-TS430RGC64USB Bill of Materials

No. Per

Board

SAM1029-16-ND : Header SAM1213-16-ND : Receptacle

Q1: Micro Crystal MS1V-T1K

12.5pF

http://www.ettinger.de/Art_De

8.121

www.ti.com

DNP: headers and receptacles enclosed with kit. Keep vias free of solder.

Place on: JP1, JP2, JP3, JP9, JP10

DNP: Q1 Keep vias free of solder"

DNP: enclosed with kit. Is supplied by TI

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430RGC64USB

Table B-18. MSP-TS430RGC64USB Bill of Materials (continued)

Pos. Ref Des Description DigiKey Part No. Comment

34 IC7 1 TPD4E004 Manu: TI 36 LED 0 JP3QE SAM1032-03-ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP

R13, R15,

40 0 470R Buerklin: 07E564 DNP 41 R33 1 1k4 / 1k5 Buerklin: 07E612

42 R34 1 27R Buerklin: 07E444 43 R35 1 27R Buerklin: 07E444 44 R36 1 33k Buerklin: 07E740 45 S1 0 PB P12225STB-ND DNP 46 S2 0 PB P12225STB-ND DNP 46 S3 1 PB P12225STB-ND 47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885

R16

No. Per

Board

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MSP-TS430PN80

B.18 MSP-TS430PN80

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NOTE: For MSP430F(G)47x devices:

Connect pins 7 and 10 (GND) externally to DVSS(see data sheet). Connect load capacitance on V

pin 60 when SD16 is used (see data sheet).

ref

Figure B-35. MSP-TS430PN80 Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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Connector J5 External power connection Remove R8 and jumper R9

LED connected to pin 12

Jumper J6 Open to disconnect LED

Orient Pin 1 of MSP430 device

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MSP-TS430PN80

Figure B-36. MSP-TS430PN80 Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430PN80

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 0 47pF, SMD0805 recommendation. Check

2 C6, C7 1 10uF/10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND

6 0 25-pin header, TH kit.Keep vias free of

7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND 8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 3 Jumper 15-38-1024-ND 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH

12 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz,

13 R3 1 560 Ω, SMD0805 541-560ATR-ND

14 R6, R7, R10, 2 0 Ω, SMD0805 541-000ATR-ND

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi 17 PCB 1 77 x 77 mm 2 layers

18 4 ~6mm width, 2mm height

19 MSP430 2 MSP430FG439IPN

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Table B-19. MSP-TS430PN80 Bill of Materials

No. per

Board

DNP: Only your crystal spec.

DNP: Headers and

J1, J2, J3, SAM1029-20-NDSAM1213-

J4 20-ND

Q1: Micro Crystal C(Load) = 12.5pF

R1, R2, R4,

R11, R12

Adhesive e.g., 3M Bumpons Part No. Apply to corners at bottom

Plastic feet SJ-5302 side

receptacles enclosed with solder.: Header:

Receptacle

Place on: J6, JP2, JP1/Pos1-2

DNP: Keep vias free of solder

DNP: R4, R6, R7, R10, R11, R12

DNP: Enclosed with kit supplied by TI

Hardware SLAU278F–May 2009–Revised December 2010

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B.19 MSP-TS430PN80A

MSP-TS430PN80A

Figure B-37. MSP-TS430PN80A Target Socket Module, Schematic

SLAU278F–May 2009–Revised December 2010 Hardware

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Connector J5 External power connector Jumper JP3 to "ext"

Orient Pin 1 of MSP430 device

Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode

D1 LED connected to P1.0

Jumper JP2 Open to disconnect LED

If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external

MSP-TS430PN80A

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Figure B-38. MSP-TS430PN80A Target Socket Module, PCB

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430PN80USB

Table B-20. MSP-TS430PN80A Bill of Materials

Position Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP

3 3 10uF/6.3V, SMD0805 DNP C10

4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 C16 1 4.7uF, SMD0805 8 C17 1 220nF, SMD0805 9 D1 1 green LED, SMD0805 P516TR-ND

10 0 20-pin header, TH enclosed with kit. Keep vias free of

11 J5 , J6 2 3-pin header, male, TH

12 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place

13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13 15 JTAG 1 HRP14H-ND

16 BOOTST 0 "DNP Keep vias free of solder"

17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

18 Q2 0 Crystal DNP: Q2 Keep vias free of solder

19 0 Insulating disk to Q2 t_Detail.cfm?ART_ART

20 D3,D4 2 LL103A Buerklin: 24S3406 21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

22 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

23 R5 1 47k Ω, SMD0805 541-47000ATR-ND 24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi 25 PCB 1 77 x 91 mm 2 layers

26 4 Apply to corners at bottom side 27 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI

C6, C7,

C10, C12 C5, C11,

C15

J1, J2, J3, (Header)

J4 SAM1213-20-ND

JP3, JP5, JP6, JP7, JP8, JP9,

JP10

JP1, JP2,

JP4

Insulating

disk to Q2

R1, R2, R4, R6,

R9,R10,

R11, R12

Adhesive about 6mm width, 2mm e.g., 3M Bumpons Part

plastic feet height No. SJ-5302

No. per

Board

14-pin connector, male, TH

10-pin connector, male, TH

SAM1029-20-ND

(Receptacle)

Micro Crystal MS3V-T1R

12.5pF Q2: 4MHz Buerklin:

78D134 http://www.ettinger.de/Ar

NUM=70.08.121

DNP: Headers and receptacles solder:

place jumpers on pins 2-3 on JP5, jumpers on pins 1-2 on JP3,

B.20 MSP-TS430PN80USB

Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately

0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V.

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430PN80USB

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NOTE: R11 should be populated.

Figure B-39. MSP-TS430PN80USB Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply

Connector J5 External power connector Jumper JP3 to ‘ext’

USB Connector

BSL invoke button S3

Jumper JP4 Close for USB bus powered device

Jumper JP2 Open to disconnect LED

LED connected to P1.0

Jumper JP1 Open to measure current

Jumper JP5 to JP10 Close 1-2 to debug in Spy-Bi-

Wire mode. Close 2-3 to debug in 4-wire JTAG mode.

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MSP-TS430PN80USB

Figure B-40. MSP-TS430PN80USB Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430PN80USB

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND

3 4 100nF, SMD0805 311-1245-2-ND

3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C12 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND

7 4 20-pin header, TH SAM1029-20-ND kit. Keep vias free of

7.1 4 20-pin header, TH SAM1213-20-ND kit. Keep vias free of

8 J5 1 3-pin header, male, TH SAM1035-03-ND

9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3

10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2

12 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,

13 JTAG 1 14-pin connector, male, TH HRP14H-ND

14 Q1 0 Crystal 32.768kHz, C(Load) =

15 Q2 1 Crystal 16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500 18 R11 0 1M Ω, SMD0805 DNP 18 R5 1 47k Ω, SMD0805 541-47000ATR-ND 19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers

21 4 Buerklin: 20H1724

22 MSP430 2 MSP430F5529

23 1 Insulating disk to Q2 Detail.cfm?ART_ARTNUM

27 C33 1 220n Buerklin: 53D2074 28 C35 1 10p Buerklin: 56D102

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Table B-21. MSP-TS430PN80USB Bill of Materials

No. per

Board

C5, C11,

C13, C14

DNP: headers and

J1, J2, J3,

JP5, JP6,

JP7,

JP8,JP9,

JP10

JP4 1 SAM1035-02-ND

Micro Crystal MS1V-T1K

12.5pF "Q2: 4MHzBuerklin:

78D134"

R1, R2, R4,

R12

Rubber Apply to corners at bottom

standoff side

Insulating

disk to Q2

http://www.ettinger.de/Art_ =70.08.121

receptacles enclosed with solder.: Header:

Receptacle DNP: headers and

receptacles enclosed with solder.: Header:

Receptacle

Place jumper only on one pin

Place on: JP1, JP2, JP3, JP9, JP10

DNP: Q1 Keep vias free of solder

DNP: Enclosed with kit supplied by TI

Hardware SLAU278F–May 2009–Revised December 2010

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MSP-TS430PN80USB

Table B-21. MSP-TS430PN80USB Bill of Materials (continued)

Pos. Ref Des Description DigiKey Part No. Comment

29 C36 1 10p Buerklin: 56D102 30 C38 1 220n Buerklin: 53D2074 31 C39 1 4u7 Buerklin: 53D2086 32 C40 1 0.1u Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406 34 IC7 1 TPD4E004 Manu: TI 36 LED 0 JP3QE SAM1032-03-ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP

40 0 470R Buerklin: 07E564 DNP 41 R33 1 1k4 Buerklin: 07E612

R13, R15,

R16

No. per

Board

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MSP-TS430PZ100

B.21 MSP-TS430PZ100

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NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be

made.

Figure B-41. MSP-TS430PZ100 Target Socket Module, Schematic

Hardware SLAU278F–May 2009–Revised December 2010

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Connector J5 External power connection Remove R8 and jumper R9

LED connected to pin 12

Jumper J6 Open to disconnect LED

Orient Pin 1 of MSP430 device

Jumper J7 Open to measure current

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MSP-TS430PZ100

Figure B-42. MSP-TS430PZ100 Target Socket Module, PCB

SLAU278F–May 2009–Revised December 2010 Hardware

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MSP-TS430PZ100

Pos. Ref Des Description DigiKey Part No. Comment

1 C1, C2, 0 12pF, SMD0805 DNP

1b C3, C4 0 47pF, SMD0805 recommendation. Check

2 C6, C7 1 10uF/10V, Tantal Size B 511-1463-2-ND DNP: C6 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

7 0 25-pin header, TH kit.Keep vias free of

8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

10 2 Jumper 15-38-1024-ND Place on: J6, J7 11 JTAG 1 14-pin connector, male, TH HRP14H-ND

12 BOOTST 0 10-pin connector, male, TH

13 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz,

14 R3 1 330 Ω, SMD0805 541-330ATR-ND

15 R8, R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12

16 R5 1 47k Ω, SMD0805 541-47000ATR-ND 17 U1 1 Manuf.: Yamaichi 18 PCB 1 82 x 90 mm 2 layers 19 4 ~6mm width, 2mm height

20 MSP430 2 MSP430FG4619IPZ

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Table B-22. MSP-TS430PZ100 Bill of Materials

No. per

Board

DNP: Only your crystal spec.

DNP: Headers and

J1, J2, J3, SAM1029-25-NDSAM1213-

J4 25-ND

Q1: Micro Crystal C(Load) = 12.5pF

R1, R2, R4,

R11, R12

"Socket: IC201-1004-008or IC357-1004-53N"

Adhesive e.g., 3M Bumpons Part No. Apply to corners at bottom

Plastic feet SJ-5302 side

receptacles enclosed with solder.: Header:

Receptacle

DNP: Keep vias free of solder

DNP: enclosed with kit supplied by TI

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B.22 MSP-TS430PZ100A

MSP-TS430PZ100A

Figure B-43. MSP-TS430PZ100A Target Socket Module, Schematic

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Jumper JP1 Open to measure current

Jumper JP2 Open to disconnect LED

LED D1 connected to P5.1

Jumper JP3

1-2 (int): Power supply via JTAG interface

2-3 (ext): External Power Supply

Orient Pin 1 of Device

MSP-TS430PZ100A

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Figure B-44. MSP-TS430PZ100A Target Socket Module, PCB

100

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Texas Instruments MSP430 User Manual 2

Specifications and Main Features

Frequently Asked Questions

User Manual

Preface

Get Started Now!

1.1 Flash Emulation Tool (FET) Overview

1.2 Kit Contents, MSP-FET430PIF

1.3 Kit Contents, eZ430-F2013

1.4 Kit Contents, eZ430-T2012

1.5 Kit Contents, eZ430-RF2500

1.6 Kit Contents, eZ430-RF2500T

1.7 Kit Contents, eZ430-RF2500-SEH

1.8 Kit Contents, eZ430-Chronos-xxx

1.9 Kit Contents, MSP-FET430UIF

1.10 Kit Contents, MSP-FET430xx

1.11 Kit Contents, FET430Fx137RF900

1.12 Kit Contents, MSP-TS430xx

1.13 Kit Contents, EM430Fx137RF900

1.14 Hardware Installation, MSP-FET430PIF

1.15 Hardware Installation, MSP-FET430UIF

1.16 Hardware Installation, eZ430-F2013, eZ430-RF2500, eZ430-Chronos

1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900, EM430Fx137RF900

1.18 Important MSP430 Documents on the CD-ROM and Web

Design Considerations for In-Circuit Programming

2.1 Signal Connections for In-System Programming and Debugging

2.2 External Power

2.3 Bootstrap Loader (BSL)

A.1 Hardware FAQs

A.2 Known Issues

B.1 MSP-TS430PW14

B.2 MSP-TS430L092

B.3 MSP-TS430L092 Active Cable

B.4 MSP-TS430PW24

B.5 MSP-TS430DW28

B.6 MSP-TS430PW28

B.7 MSP-TS430PW28A

B.8 MSP-TS430DA38

B.9 MSP-TS430QFN23x0

B.10 MSP-TS430RSB40

B.11 MSP-TS430RHA40A

B.12 MSP-TS430DL48

B.13 MSP-TS430RGZ48B

B.14 MSP-TS430PM64

B.15 MSP-TS430PM64A

B.16 MSP-TS430RGC64B

B.17 MSP-TS430RGC64USB

B.18 MSP-TS430PN80

B.19 MSP-TS430PN80A

B.20 MSP-TS430PN80USB

B.21 MSP-TS430PZ100

B.22 MSP-TS430PZ100A