The MC33063A and MC34063A devices are easy-touse ICs containing all the primary circuitry needed for
building simple DC-DC converters. These devices
primarilyconsistofaninternaltemperaturecompensated reference, a comparator, an oscillator,
a PWM controller with active current limiting, a driver,
and a high-current output switch. Thus, the devices
requireminimalexternalcomponentstobuild
convertersintheboost,buck,andinverting
topologies.
The MC33063A device is characterized for operation
from –40°C to 85°C, while the MC34063A device is
characterized for operation from 0°C to 70°C.
Device Information
PART NUMBERPACKAGE (PIN)BODY SIZE
MC3x063ASON (8)4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
MC33063A,MC34063A
(1)
SOIC (8)4.90 mm × 3.91 mm
PDIP (8)9.81 mm × 6.35 mm
4Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Changes from Revision M (January 2011) to Revision NPage
•Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section. ..................................................................................................................... 1
•Deleted Ordering Information table. ....................................................................................................................................... 1
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V
(ESD)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Electrostatic dischargeV
Charged device model (CDM), per JEDEC specification JESD22-C101,
(2)
all pins
(1)
MINMAXUNIT
= 40 V40V
PIN1
VALUEUNIT
(1)
2500
1500
7.3Recommended Operating Conditions
MINMAXUNIT
V
Supply voltage340V
CC
T
Operating free-air temperature°C
A
MC33063A–4085
MC34063A070
7.4Thermal Information
MC33063A
THERMAL METRIC
(1)
DDRJPUNIT
8 PINS
R
θJA
Junction-to-ambient thermal resistance974185°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
7.5Electrical Characteristics—Oscillator
VCC= 5 V, TA= full operating range (unless otherwise noted) (see block diagram)
f
osc
I
chg
I
dischg
I
dischg/Ichg
V
Ipk
PARAMETERTEST CONDITIONST
Oscillator frequencyV
= 0 V, CT= 1 nF25°C243342kHz
PIN5
A
Charge currentVCC= 5 V to 40 V25°C243542μA
Discharge currentVCC= 5 V to 40 V25°C140220260μA
Discharge-to-charge current ratioV
Current-limit sense voltageI
VCC= 5 V, TA= full operating range (unless otherwise noted) (see block diagram)
PARAMETERTEST CONDITIONST
V
CE(sat)
V
CE(sat)
h
FE
I
C(off)
(1) Low duty-cycle pulse testing is used to maintain junction temperature as close to ambient temperature as possible.
(2) In the non-Darlington configuration, if the output switch is driven into hard saturation at low switch currents (≤300 mA) and high driver
Saturation voltage –
Darlington connection
Saturation voltage –ISW= 1 A, R
non-Darlington connection
ISW= 1 A, pins 1 and 8 connectedFull range11.3V
= 82 Ω to VCC,
(2)
forced β ∼ 20
PIN8
DC current gainISW= 1 A, VCE= 5 V25°C5075—
Collector off-state currentVCE= 40 VFull range0.01100μA
currents (≥30 mA), it may take up to 2 μs for the switch to come out of saturation. This condition effectively shortens the off time at
frequencies ≥30 kHz, becoming magnified as temperature increases. The following output drive condition is recommended in the nonDarlington configuration:
Forced β of output switch = I
forward bias the Vbeof the switch.
C,SW
/ (I
– 7 mA) ≥ 10, where ∼7 mA is required by the 100-Ω resistor in the emitter of the driver to
C,driver
(1)
A
MINTYPMAXUNIT
Full range0.450.7V
7.7Electrical Characteristics—Comparator
VCC= 5 V, TA= full operating range (unless otherwise noted) (see block diagram)
V
ΔV
I
IB
PARAMETERTEST CONDITIONST
th
th
Threshold voltageV
Threshold-voltage line regulationVCC= 5 V to 40 VFull range1.45mV
A
25°C1.2251.251.275
Full range1.211.29
Input bias currentVIN= 0 VFull range–20–400nA
MINTYPMAXUNIT
7.8Electrical Characteristics—Total Device
VCC= 5 V, TA= full operating range (unless otherwise noted) (see block diagram)
The MC33063A and MC34063A devices are easy-to-use ICs containing all the primary circuitry needed for
building simple DC-DC converters. These devices primarily consist of an internal temperature-compensated
reference, a comparator, an oscillator, a PWM controller with active current limiting, a driver, and a high-current
output switch. Thus, the devices require minimal external components to build converters in the boost, buck, and
inverting topologies.
The MC33063A device is characterized for operation from –40°C to 85°C, while the MC34063A device is
characterized for operation from 0°C to 70°C.
8.2Functional Block Diagram
8.3Feature Description
•Wide Input Voltage Range: 3 V to 40 V
•High Output Switch Current: Up to 1.5 A
•Adjustable Output Voltage
•Oscillator Frequency Up to 100 kHz
•Precision Internal Reference: 2%
•Short-Circuit Current Limiting
•Low Standby Current
8.4Device Functional Modes
8.4.1 Standard operation
Based on the application, the device can be configured in multiple different topologies. See the Application and
Implementation section for how to configure the device in several different operating modes.
a) EXTERNAL npn SWITCHb) EXTERNAL npn SATURATED SWITCH (see Note A)
7
→
MC33063A,MC34063A
SLLS636N –DECEMBER 2004–REVISED JANUARY 2015
9Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 External Switch Configurations for Higher Peak Current
www.ti.com
A.If the output switch is driven into hard saturation (non-Darlington configuration) at low switch currents (≤300 mA) and
high driver currents (≥30 mA), it may take up to 2 μs to come out of saturation. This condition will shorten the off time
at frequencies ≥30 kHz and is magnified at high temperatures. This condition does not occur with a Darlington
configuration because the output switch cannot saturate. If a non-Darlington configuration is used, the output drive
configuration in Figure 7b is recommended.
Figure 5. Boost Regulator Connections for ICPeak Greater Than 1.5 A
The user must determine the following desired parameters:
V
= Saturation voltage of the output switch
sat
VF= Forward voltage drop of the chosen output rectifier
The following power-supply parameters are set by the user:
Vin= Nominal input voltage
V
= Desired output voltage
out
I
= Desired output current
out
f
= Minimum desired output switching frequency at the selected values of Vinand I
min
V
= Desired peak-to-peak output ripple voltage. The ripple voltage directly affects the line and load
ripple
regulation and, thus, must be considered. In practice, the actual capacitor value should be larger than the
calculated value, to account for the capacitor's equivalent series resistance and board layout.
The user must determine the following desired parameters:
V
= Saturation voltage of the output switch
sat
VF= Forward voltage drop of the chosen output rectifier
The following power-supply parameters are set by the user:
Vin= Nominal input voltage
V
= Desired output voltage
out
I
= Desired output current
out
f
= Minimum desired output switching frequency at the selected values of Vinand I
min
V
= Desired peak-to-peak output ripple voltage. The ripple voltage directly affects the line and load
ripple
regulation and, thus, must be considered. In practice, the actual capacitor value should be larger than the
calculated value, to account for the capacitor's equivalent series resistance and board layout.
This device accepts 3 V to 40 V on the input. It is recommended to have a 1000-µF decoupling capacitor on the
input.
11Layout
11.1 Layout Guidelines
Keep feedback loop layout trace lengths to a minimum to avoid unnecessary IR drop. In addition, the loop for the
decoupling capacitor at the input should be as small as possible. The trace from VINto pin 1 of the device should
be thicker to handle the higher current.
11.2 Layout Example
Figure 12. Layout Example for a Step-Down Converter
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTSPRODUCT FOLDERSAMPLE & BUY
MC33063AClick hereClick hereClick hereClick hereClick here
MC34063AClick hereClick hereClick hereClick hereClick here
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
TECHNICALTOOLS &SUPPORT &
DOCUMENTSSOFTWARECOMMUNITY
13Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
MC33063ADACTIVESOICD875RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 85M33063A
MC33063ADE4ACTIVESOICD875RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 85M33063A
MC33063ADG4ACTIVESOICD875RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 85M33063A
MC33063ADRACTIVESOICD82500RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 85M33063A
MC33063ADRE4ACTIVESOICD82500RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 85M33063A
MC33063ADRG4ACTIVESOICD82500RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 85M33063A
MC33063ADRJRACTIVESONDRJ81000RoHS & GreenNIPDAULevel-3-260C-168 HR-40 to 85ZYF
MC33063APACTIVEPDIPP850RoHS & GreenNIPDAUN / A for Pkg Type-40 to 85MC33063AP
MC33063APE4ACTIVEPDIPP850RoHS & GreenNIPDAUN / A for Pkg Type-40 to 85MC33063AP
MC34063ADACTIVESOICD875RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70M34063A
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
14-Aug-2021
Samples
(4/5)
MC34063ADE4ACTIVESOICD875RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70M34063A
MC34063ADG4ACTIVESOICD875RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70M34063A
MC34063ADRACTIVESOICD82500RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70M34063A
MC34063ADRJRACTIVESONDRJ81000RoHS & GreenNIPDAULevel-3-260C-168 HR0 to 70ZYF
MC34063ADRJRG4ACTIVESONDRJ81000RoHS & GreenNIPDAULevel-3-260C-168 HR0 to 70ZYF
MC34063APACTIVEPDIPP850RoHS & GreenNIPDAUN / A for Pkg Type0 to 70MC34063AP
MC34063APE4ACTIVEPDIPP850RoHS & GreenNIPDAUN / A for Pkg Type0 to 70MC34063AP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
OBSOLETE: TI has discontinued the production of the device.
14-Aug-2021
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MC33063A :
Automotive : MC33063A-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL UNDER
SOLDER MASK
4214825/C 02/2019
www.ti.com
8X (.061 )
8X (.024)
[0.6]
6X (.050 )
[1.27]
[1.55]
EXAMPLE STENCIL DESIGN
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
SYMM
1
8
SYMM
(R.002 ) TYP
4
(.213)
[5.4]
5
[0.05]
BASED ON .005 INCH [0.125 MM] THICK STENCIL
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SCALE:8X
4214825/C 02/2019
SOLDER PASTE EXAMPLE
www.ti.com
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