TEXAS INSTRUMENTS MAX232E Technical data

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1 2 3 4 5 6 7 8

16 15 14 13 12 11 10

9

C1+

V

S+

C1− C2+ C2−

V

S−

DOUT2

RIN2

V

CC

GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2

D, DW, N, NS, OR PW PACKAGE

(TOP VIEW)

FEATURES

• Meets or Exceeds TIA/RS-232-F and ITU

Recommendation V.28

• Operates From a Single 5-V Power Supply With 1.0- µ F Charge-Pump Capacitors

• Operates up to 120 kbit/s

• Two Drivers and Two Receivers

• ± 30-V Input Levels

• Low Supply Current . . . 8 mA Typical

• ESD Protection for RS-232 Bus Pins

– ± 15-kV Human-Body Model (HBM) – ± 8-kV IEC61000-4-2, Contact Discharge – ± 15-kV IEC61000-4-2, Air-Gap Discharge

APPLICATIONS

• TIA/RS-232-F

• Battery-Powered Systems

• Terminals

• Modems

• Computers

MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

DESCRIPTION/ORDERING INFORMATION

The MAX232E is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/RS-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/RS-232-F inputs to 5-V TTL/CMOS levels. This receiver has a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ± 30-V inputs. Each driver converts TTL/CMOS input levels into TIA/RS-232-F levels. The driver, receiver, and voltage-generator functions are available as cells in the Texas Instruments LinASIC™ library.

LinASIC is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

ORDERING INFORMATION

T

A

PDIP – N Tube of 25 MAX232ECN MAX232ECN

SOIC – D MAX232EC

0 ° C to 70 ° C SOIC – DW MAX232EC

SOP – NS Reel of 2000 MAX232ECNSR Preview

TSSOP – PW MAX232EC

PDIP – N Tube of 25 MAX232EIN MAX232EIN

SOIC – D MAX232EI

–40 ° C to 85 ° C SOIC – DW MAX232EI

SOP – NS Reel of 2000 MAX232EINSR Preview

TSSOP – PW MB232EI

PACKAGE

(1)

Tube of 40 MAX232ECD Reel of 2500 MAX232ECDR Tube of 40 MAX232ECDW Reel of 2000 MAX232ECDWR

Tube of 25 MAX232ECPW Reel of 2000 MAX232ECPWR

Tube of 40 MAX232EID Reel of 2500 MAX232EIDR Tube of 40 MAX232EIDW Reel of 2000 MAX232EIDWR

Tube of 25 MAX232EIPW Reel of 2000 MAX232EIPWR

ORDERABLE PART NUMBER TOP-SIDE MARKING

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

2

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DIN1

DOUT1

RIN1ROUT1

DIN2

DOUT2

RIN2ROUT2

11

10

12

9

14

7

13

8

FUNCTION TABLES

ABC

Each Driver

INPUT OUTPUT

DIN DOUT

L H

H L

(1) H = high level, L = low level

MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

(1)

Each Receiver

INPUT OUTPUT

RIN ROUT

L H

H L

(1) H = high level, L = low level

LOGIC DIAGRAM (POSITIVE LOGIC)

(1)

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3

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MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

V

CC

V

S+

V

S–

V

I

V

O

DOUT Short-circuit duration Unlimited

θ

JA

T

J

T

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD= (TJ(max) – TA)/ θJA. Operating at the absolute maximum TJof 150 ° C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7.

Input supply voltage range Positive output supply voltage range V Negative output supply voltage range –0.3 –15 V

Input voltage range V

Output voltage range V

Package thermal impedance

Operating virtual junction temperature 150 ° C Storage temperature range –65 150 ° C

(1)

MIN MAX UNIT

(2)

Driver –0.3 V

–0.3 6 V

– 0.3 15 V

CC

Receiver ± 30 DOUT V ROUT –0.3 V

– 0.3 V

S–

S+

CC

D package 73 DW package 57

(3) (4)

N package 67 ° C/W NS package 64 PW package 108

+ 0.3

+ 0.3 + 0.3

Recommended Operating Conditions

MIN NOM MAX UNIT

V

CC

V

IH

V

IL

RIN1, RIN2 Receiver input voltage ± 30 V

T

A

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )

I

CC

(1) Test conditions are C1–C4 = 1 µ F at V (2) All typical values are at V

Supply voltage 4.5 5 5.5 V High-level input voltage (DIN1, DIN2) 2 V Low-level input voltage (DIN1, DIN2) 0.8 V

Operating free-air temperature ° C

(1)

MAX232EC 0 70 MAX232EI –40 85

PARAMETER TEST CONDITIONS MIN TYP

Supply current V

= 5 V ± 0.5 V.

= 5 V and TA= 25 ° C.

CC

= 5.5 V, All outputs open, TA= 25 ° C 8 10 mA

CC

(2)

MAX UNIT

4

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MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

DRIVER SECTION

abc

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature range

PARAMETER TEST CONDITIONS MIN TYP

V

High-level output voltage DOUT RL= 3 k Ω to GND 5 7 V

OH

V

Low-level output voltage

OL

r

Output resistance DOUT V

o

(4)

I

Short-circuit output current DOUT V

OS

I

Short-circuit input current DIN VI= 0 200 µ A

IS

(1) Test conditions are C1–C4 = 1 µ F at V (2) All typical values are at V (3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic

voltage levels only.

(4) Not more than one output should be shorted at a time.

(1)

(3)

DOUT RL= 3 k Ω to GND –7 –5 V

= 5 V and TA= 25 ° C.

CC

= 5 V ± 0.5 V.

CC

(2)

= V

S+ CC

= 0, VO= ± 2 V 300 Ω

S–

= 5.5 V, VO= 0 ± 10 mA

MAX UNIT

Switching Characteristics

V

= 5 V, TA= 25 ° C (see Note 4)

CC

(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SR Driver slew rate RL= 3 k Ω to 7 k Ω , See Figure 2 30 V/ µ s SR(t) Driver transition region slew rate See Figure 3 3 V/ µ s

Data rate One DOUT switching 120 kbit/s

(1) Test conditions are C1–C4 = 1 µ F at V

= 5 V ± 0.5 V.

CC

ESD protection

PARAMETER TEST CONDITIONS TYP UNIT

HBM ± 15 kV

DOUT, RIN IEC61000-4-2, Air-Gap Discharge ± 15 kV

IEC61000-4-2, Contact Discharge ± 8 kV

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MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

RECEIVER SECTION

abc

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature range

PARAMETER TEST CONDITIONS MIN TYP

V

High-level output voltage ROUT IOH= –1 mA 3.5 V

OH

V

Low-level output voltage

OL

V

Receiver positive-going input threshold voltage RIN V

IT+

VI

Receiver negative-going input threshold voltage RIN V

T–

V

Input hysteresis voltage RIN V

hys

r

Receiver input resistance RIN V

i

(1) Test conditions are C1–C4 = 1 µ F at V (2) All typical values are at V (3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic

voltage levels only.

(1)

(3)

= 5 V and TA= 25 ° C.

CC

= 5 V ± 0.5 V.

CC

(2)

MAX UNIT

ROUT IOL= 3.2 mA 0.4 V

= 5 V, TA= 25 ° C 1.7 2.4 V

CC

= 5 V, TA= 25 ° C 0.8 1.2 V

CC

= 5 V 0.2 0.5 1 V

CC

= 5 V, TA= 25 ° C 3 5 7 k Ω

CC

Switching Characteristics

V

= 5 V, TA= 25 ° C (see Figure 1 )

CC

t

PLH(R)

t

PHL(R)

Receiver propagation delay time, low- to high-level output 500 ns Receiver propagation delay time, high- to low-level output 500 ns

(1)

(1) Test conditions are C1–C4 = 1 µ F at V

= 5 V ± 0.5 V.

CC

PARAMETER TYP UNIT

6

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PARAMETER MEASUREMENT INFORMATION

≤10 ns

V

CC

RIN

ROUT

RL = 1.3 kΩ

See Note C

CL = 50 pF (see Note B)

TEST CIRCUIT

≤10 ns

Input

Output

t

PHL

t

PLH

1.5 V V

OL

V

OH

0 V

3 V

10%

90%

50%

500 ns

WAVEFORMS

1.5 V

90%

50%

10%

Pulse

Generator

(see Note A)

MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

A. The pulse generator has the following characteristics: ZO= 50 Ω , duty cycle ≤ 50%. B. CLincludes probe and jig capacitance. C. All diodes are 1N3064 or equivalent.

Figure 1. Receiver Test Circuit and Waveforms for t

and t

PHL

Measurements

PLH

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7

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DIN DOUT

C

L

= 10 pF

(see Note B)

TEST CIRCUIT

≤10 ns≤10 ns

Input

Output

t

PHL

t

PLH

V

OL

V

OH

0 V

3 V

10%

90%

50%

5 µs

WAVEFORMS

90%

50%

10%

R

L

90%

10%

90%

10%

t

TLH

t

THL

SR 

0.8 (VOH– VOL) t

TLH

or

0.8 (VOL– VOH) t

THL

Pulse

Generator

(see Note A)

RS-232 Output

−3 V

3 V

−3 V

3 V

3 kΩ

10%

1.5 V

90%

WAVEFORMS

20 µs

1.5 V

90%

10%

V

OH

V

OL

t

TLH

t

THL

≤10 ns ≤10 ns

TEST CIRCUIT

CL = 2.5 nF

Pulse

Generator

(see Note A)

Input

Output

SR 

6 V

t

THL

or t

TLH

DIN DOUT

MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

PARAMETER MEASUREMENT INFORMATION (continued)

8

A. The pulse generator has the following characteristics: ZO= 50 Ω , duty cycle ≤ 50%. B. CLincludes probe and jig capacitance.

Figure 2. Driver Test Circuit and Waveforms for t

THL

A. The pulse generator has the following characteristics: ZO= 50 Ω , duty cycle ≤ 50%.

Figure 3. Test Circuit and Waveforms for t

Submit Documentation Feedback

and t

PHL

and t

Measurements (5- µ s Input)

PLH

Measurements (20- µ s Input)

TLH

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1 µF

V

S+

V

S−

2

6

14

7

13

8

C1+ C1− C2+ C2−

1 3 4 5

11

10

12

9

GND

15

0 V

V

CC

16

5 V

RS-232 Output

RS-232 Input

1 µF

8.5 V

−8.5 V

1 µF

From CMOS or TTL

To CMOS or TTL

C

BYPASS

= 1 µF

C1

C2

C3

†

C4

†

C3 can be connected to VCC or GND.

+

−

MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

APPLICATION INFORMATION

A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should

be connected as shown. In addition to the 1- µ F capacitors shown, the MAX232E can operate with 0.1- µ F capacitors.

Figure 4. Typical Operating Circuit

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PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

MAX232ECD ACTIVE SOIC D 16 40 Green (RoHS &

MAX232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS &

MAX232ECDR ACTIVE SOIC D 16 2500 Green (RoHS &

MAX232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &

MAX232ECDW ACTIVE SOIC DW 16 40 Green (RoHS &

MAX232ECDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &

MAX232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS &

MAX232ECDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &

MAX232ECN ACTIVE PDIP N 16 25 Pb-Free

MAX232ECNE4 ACTIVE PDIP N 16 25 Pb-Free

MAX232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS &

MAX232ECPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &

MAX232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &

MAX232ECPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

MAX232EID ACTIVE SOIC D 16 40 Green (RoHS &

MAX232EIDG4 ACTIVE SOIC D 16 40 Green (RoHS &

MAX232EIDR ACTIVE SOIC D 16 2500 Green (RoHS &

MAX232EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &

MAX232EIDW ACTIVE SOIC DW 16 40 Green (RoHS &

MAX232EIDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &

MAX232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS &

MAX232EIDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &

MAX232EIN ACTIVE PDIP N 16 25 Pb-Free

MAX232EINE4 ACTIVE PDIP N 16 25 Pb-Free

MAX232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS &

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(RoHS)

no Sb/Br)

(RoHS)

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

6-Dec-2006

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

MAX232EIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

6-Dec-2006

(3)

no Sb/Br)

MAX232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX232EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

14

0,30 0,19

8

4,50 4,30

PINS **

7

Seating Plane

0,15

0,05

8

1

A

DIM

6,60 6,20

14

0,10

M

0,15 NOM

Gage Plane

0,25

0°–8°

2016

24

28

0,75 0,50

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty . Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

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TEXAS INSTRUMENTS MAX232E Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual