TEXAS INSTRUMENTS MAX232E Technical data

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1 2 3 4 5 6 7 8

16 15 14 13 12 11 10

C1+

S+

C1− C2+ C2−

S−

DOUT2

RIN2

GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2

D, DW, N, NS, OR PW PACKAGE

(TOP VIEW)

FEATURES

• Meets or Exceeds TIA/RS-232-F and ITU

Recommendation V.28

• Operates From a Single 5-V Power Supply With 1.0- µ F Charge-Pump Capacitors

• Operates up to 120 kbit/s

• Two Drivers and Two Receivers

• ± 30-V Input Levels

• Low Supply Current . . . 8 mA Typical

• ESD Protection for RS-232 Bus Pins

– ± 15-kV Human-Body Model (HBM) – ± 8-kV IEC61000-4-2, Contact Discharge – ± 15-kV IEC61000-4-2, Air-Gap Discharge

APPLICATIONS

• TIA/RS-232-F

• Battery-Powered Systems

• Terminals

• Modems

• Computers

MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

DESCRIPTION/ORDERING INFORMATION

The MAX232E is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/RS-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/RS-232-F inputs to 5-V TTL/CMOS levels. This receiver has a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ± 30-V inputs. Each driver converts TTL/CMOS input levels into TIA/RS-232-F levels. The driver, receiver, and voltage-generator functions are available as cells in the Texas Instruments LinASIC™ library.

LinASIC is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

ORDERING INFORMATION

PDIP – N Tube of 25 MAX232ECN MAX232ECN

SOIC – D MAX232EC

0 ° C to 70 ° C SOIC – DW MAX232EC

SOP – NS Reel of 2000 MAX232ECNSR Preview

TSSOP – PW MAX232EC

PDIP – N Tube of 25 MAX232EIN MAX232EIN

SOIC – D MAX232EI

–40 ° C to 85 ° C SOIC – DW MAX232EI

SOP – NS Reel of 2000 MAX232EINSR Preview

TSSOP – PW MB232EI

PACKAGE

(1)

Tube of 40 MAX232ECD Reel of 2500 MAX232ECDR Tube of 40 MAX232ECDW Reel of 2000 MAX232ECDWR

Tube of 25 MAX232ECPW Reel of 2000 MAX232ECPWR

Tube of 40 MAX232EID Reel of 2500 MAX232EIDR Tube of 40 MAX232EIDW Reel of 2000 MAX232EIDWR

Tube of 25 MAX232EIPW Reel of 2000 MAX232EIPWR

ORDERABLE PART NUMBER TOP-SIDE MARKING

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

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DIN1

DOUT1

RIN1ROUT1

DIN2

DOUT2

RIN2ROUT2

FUNCTION TABLES

ABC

Each Driver

INPUT OUTPUT

DIN DOUT

L H

H L

(1) H = high level, L = low level

MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

(1)

Each Receiver

INPUT OUTPUT

RIN ROUT

L H

H L

(1) H = high level, L = low level

LOGIC DIAGRAM (POSITIVE LOGIC)

(1)

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MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

S+

S–

DOUT Short-circuit duration Unlimited

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD= (TJ(max) – TA)/ θJA. Operating at the absolute maximum TJof 150 ° C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7.

Input supply voltage range Positive output supply voltage range V Negative output supply voltage range –0.3 –15 V

Input voltage range V

Output voltage range V

Package thermal impedance

Operating virtual junction temperature 150 ° C Storage temperature range –65 150 ° C

(1)

MIN MAX UNIT

(2)

Driver –0.3 V

–0.3 6 V

– 0.3 15 V

Receiver ± 30 DOUT V ROUT –0.3 V

– 0.3 V

S–

S+

D package 73 DW package 57

(3) (4)

N package 67 ° C/W NS package 64 PW package 108

+ 0.3

+ 0.3 + 0.3

Recommended Operating Conditions

MIN NOM MAX UNIT

RIN1, RIN2 Receiver input voltage ± 30 V

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )

(1) Test conditions are C1–C4 = 1 µ F at V (2) All typical values are at V

Supply voltage 4.5 5 5.5 V High-level input voltage (DIN1, DIN2) 2 V Low-level input voltage (DIN1, DIN2) 0.8 V

Operating free-air temperature ° C

(1)

MAX232EC 0 70 MAX232EI –40 85

PARAMETER TEST CONDITIONS MIN TYP

Supply current V

= 5 V ± 0.5 V.

= 5 V and TA= 25 ° C.

= 5.5 V, All outputs open, TA= 25 ° C 8 10 mA

(2)

MAX UNIT

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MAX232E DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION

SLLS723 – APRIL 2006

DRIVER SECTION

abc

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature range

PARAMETER TEST CONDITIONS MIN TYP

High-level output voltage DOUT RL= 3 k Ω to GND 5 7 V

Low-level output voltage

Output resistance DOUT V

(4)

Short-circuit output current DOUT V

Short-circuit input current DIN VI= 0 200 µ A

(1) Test conditions are C1–C4 = 1 µ F at V (2) All typical values are at V (3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic

voltage levels only.

(4) Not more than one output should be shorted at a time.

(1)

(3)

DOUT RL= 3 k Ω to GND –7 –5 V

= 5 V and TA= 25 ° C.

= 5 V ± 0.5 V.

(2)

= V

S+ CC

= 0, VO= ± 2 V 300 Ω

S–

= 5.5 V, VO= 0 ± 10 mA

MAX UNIT

Switching Characteristics

= 5 V, TA= 25 ° C (see Note 4)

(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SR Driver slew rate RL= 3 k Ω to 7 k Ω , See Figure 2 30 V/ µ s SR(t) Driver transition region slew rate See Figure 3 3 V/ µ s

Data rate One DOUT switching 120 kbit/s

(1) Test conditions are C1–C4 = 1 µ F at V

= 5 V ± 0.5 V.

ESD protection

PARAMETER TEST CONDITIONS TYP UNIT

HBM ± 15 kV

DOUT, RIN IEC61000-4-2, Air-Gap Discharge ± 15 kV

IEC61000-4-2, Contact Discharge ± 8 kV

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