Texas Instruments LM3671LC, LM3671LC-1.2, LM3671LC-1.3, LM3671LC-1.6, LM3671LC-1.8 User Manual

...

Download

GND

L1: 2.2 PH

OUT

10 PF

4.7 PF

LM3671

2.7V to 5.5V

www.ti.com

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

LM3671, LM3671Q 2MHz, 600mA Step-Down DC-DC Converter

Check for Samples: LM3671, LM3671Q

FEATURES

• 16 µA Typical Quiescent Current

• 600 mA Maximum Load Capability • PDAs

• 2 MHz PWM Fixed Switching Frequency (typ.) • MP3 Players

• Automatic PFM/PWM Mode Switching • W-LAN

• Internal Synchronous Rectification for High • Portable Instruments Efficiency

• Internal Soft start

• 0.01 µA Typical Shutdown Current

• Operates from a Single Li-Ion Cell Battery

• Only Three Tiny Surface-Mount External Components Required (One Inductor, Two Ceramic Capacitors)

• Current Overload and Thermal Shutdown Protection

• Available in Fixed Output Voltages and Adjustable Version

• LM3671Q is an Automotive Grade Product that is AEC-Q100 Grade 1 Qualified

• SOT-23, 5-Bump DSBGA and 6-Pin USON Packages

APPLICATIONS

• Mobile Phones

• Digital Still Cameras

• Portable Hard Disk Drives

• Automotive

DESCRIPTION

The LM3671 step-down DC-DC converter is optimized for powering low voltage circuits from a single Li-Ion cell battery and input voltage rails from

2.7V to 5.5V. It provides up to 600 mA load current, over the entire input voltage range. There are several different fixed voltage output options available as well as an adjustable output voltage version range from

1.1V to 3.3V. The device offers superior features and performance

for mobile phones and similar portable systems. Automatic intelligent switching between PWM lownoise and PFM low-current mode offers improved system control. During PWM mode, the device operates at a fixed-frequency of 2 MHz (typ.). Hysteretic PFM mode extends the battery life by reducing the quiescent current to 16 µA (typ.) during light load and standby operation. Internal synchronous rectification provides high efficiency during PWM mode operation. In shutdown mode, the device turns off and reduces battery consumption to

0.01 µA (typ.).

LM3671

LM3671Q

TYPICAL APPLICATION CIRCUITS

Figure 1. Typical Application Circuit

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Top View Bottom View

GND

GND2EN

GND

L1: 2.2 PH

OUT

10 PF

4.7 PF

LM3671-

ADJ

2.7V to 5.5V

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

DESCRIPTION (CONTINUED)

The LM3671 is available in SOT-23, tiny 5-bump DSBGA and a 6-pin USON packages in leaded (PB) and leadfree (NO PB) versions. A high-switching frequency of 2 MHz (typ.) allows use of tiny surface-mount components. Only three external surface-mount components, an inductor and two ceramic capacitors, are required.

Figure 2. Typical Application Circuit for ADJ version

Connection Diagrams

www.ti.com

Figure 3. Top View

SOT-23 Package

See Package Number DBV (2.92 mm x 2.84 mm x 1.2 mm)

Figure 4. 5-Bump DSBGA Package

See Package Number YZR0005 (1.05 mm x 1.38 mm x 0.6 mm)

Product Folder Links: LM3671 LM3671Q

3 4

Pgnd

Vin

Sgnd

TOP VIEW

www.ti.com

Pin # Name Description

LM3671

LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

Figure 5. 6-Pin USON Package

See Package Number NKH0006B (2 mm x 2 mm x 0.6 mm)

PIN DESCRIPTIONS (SOT-23)

1 V

2 GND Ground pin. 3 EN Enable pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled

4 FB Feedback analog input. Connect directly to the output filter capacitor for fixed voltage

5 SW Switching node connection to the internal PFET switch and NFET synchronous rectifier.

Power supply input. Connect to the input filter capacitor (Figure 1).

when >1.0V. Do not leave this pin floating.

versions. For adjustable version external resistor dividers are required (Figure 2). The internal resistor dividers are disabled for the adjustable version.

PIN DESCRIPTIONS (5-Bump DSBGA)

Pin # Name Description

A1 V

Power supply input. Connect to the input filter capacitor (Figure 1). A3 GND Ground pin. C1 EN Enable pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled

when >1.0V. Do not leave this pin floating. C3 FB Feedback analog input. Connect directly to the output filter capacitor for fixed voltage

versions. For adjustable version external resistor dividers are required (Figure 2). The

internal resistor dividers are disabled for the adjustable version. B2 SW Switching node connection to the internal PFET switch and NFET synchronous rectifier.

PIN DESCRIPTIONS (6-Pin USON)

Pin # Name Description

1 EN Enable pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled

2 Pgnd Ground pin. 3 V

4 SW Switching node connection to the internal PFET switch and NFET synchronous rectifier. 5 Sgnd Singnal ground (feedback ground). 6 FB Feedback analog input. Connect directly to the output filter capacitor for fixed voltage

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

when >1.0V. Do not leave this pin floating.

Power supply input. Connect to the input filter capacitor (Figure 1).

versions. For adjustable version external resistor dividers are required (Figure 2). The

internal resistor dividers are disabled for the adjustable version.

Product Folder Links: LM3671 LM3671Q

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

Orderable Voltage Option (V)

SOT-23 Package

LM3671MF-1.2

LM3671MFX-1.2

LM3671MF-1.2/NOPB

LM3671MFX-1.2/NOPB

LM3671QMF-1.2

LM3671QMFX-1.2

LM3671QMF-1.2/NOPB

LM3671QMFX-1.2/NOPB

LM3671MF-1.25/NOPB LM3671MFX-1.25/NOPB LM3671MF-1.375/NOPB

LM3671MFX-1.375/NOPB

LM3671MF-1.5/NOPB

LM3671MFX-1.5/NOPB

LM3671MF-1.6/NOPB

LM3671MFX-1.6/NOPB

LM3671MF-1.8/NOPB

LM3671MFX-1.8/NOPB LM3671MF-1.875/NOPB

LM3671MFX-1.875/NOPB

LM3671MF-2.5/NOPB

LM3671MFX-2.5/NOPB

LM3671MF-2.8/NOPB

LM3671MFX-2.8/NOPB

LM3671MF-3.3/NOPB

LM3671MFX-3.3/NOPB

LM3671MF-ADJ/NOPB

LM3671MFX-ADJ/NOPB

(1) For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

ORDERING INFORMATION

www.ti.com

(1)(2)

1.2

1.25

1.375

1.5

1.6

1.8

1.875

2.5

2.8

3.3

Adjustable

Product Folder Links: LM3671 LM3671Q

www.ti.com

DSBGA Package

LM3671TL-1.2/NOPB LM3671TLX-1.2/NOPB LM3671TL-1.25/NOPB

LM3671TLX-1.25/NOPB

LM3671TL-1.5/NOPB LM3671TLX-1.5/NOPB

LM3671TL-1.8/NOPB LM3671TLX-1.8/NOPB

LM3671TL-1.875/NOPB

LM3671TLX-1.875/NOPB

LM3671TL-2.5/NOPB LM3671TLX-2.5/NOPB

LM3671TL-2.8/NOPB LM3671TLX-2.8/NOPB

LM3671TL-3.3/NOPB LM3671TLX-3.3/NOPB LM3671TL-ADJ/NOPB

LM3671TLX-ADJ/NOPB

USON Package

LM3671LC-1.2/NOPB

LM3671LCX-1.2/NOPB

LM3671LC-1.3/NOPB

LM3671LCX-1.3/NOPB

LM3671LC-1.6/NOPB

LM3671LCX-1.6/NOPB

LM3671LC-1.8/NOPB

LM3671LCX-1.8/NOPB

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

ORDERING INFORMATION

Orderable Voltage Option (V)

(1)(2)

(continued)

1.2

1.25

1.5

1.8

1.875

2.5

2.8

3.3

Adjustable

1.2

1.3

1.6

1.8

LM3671

LM3671Q

Product Folder Links: LM3671 LM3671Q

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

ABSOLUTE MAXIMUM RATINGS

(1)(2)

VINPin: Voltage to GND −0.2V to 6.0V FB, SW, EN Pin: (GND−0.2V) to

Continuous Power Dissipation Junction Temperature (T

(3)

) +125°C

J-MAX

Storage Temperature Range −65°C to +150°C Maximum Lead Temperature 260°C

(Soldering, 10 sec.)

ESD Rating

(4)

Human Body Model 2 kV Machine Model 200V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics tables.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for

availability and specifications.

(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typ.) and

disengages at TJ= 130°C (typ.).

(4) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

www.ti.com

(VIN+ 0.2V)

Internally Limited

OPERATING RATINGS

Input Voltage Range

(3)

(1) (2)

2.7V to 5.5V Recommended Load Current 0mA to 600 mA Junction Temperature (TJ) Range −40°C to +125°C Ambient Temperature (TA) Range

(4)

−40°C to +85°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) The input voltage range recommended for ideal applications performance for the specified output voltages are given below:VIN= 2.7V to

4.5V for 1.1V ≤ V

DROPOUT

(4) In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have

= I

to be derated. Maximum ambient temperature (T

maximum power dissipation of the device in the application (P

in the application, as given by the following equation:T

different ambient temperatures.

< 1.5VVIN= 2.7V to 5.5V for 1.5V ≤ V

OUT

LOAD

*( R

DSON, PFET

+ R

INDUCTOR

< 1.8VVIN= (V

)

A-MAX

OUT

) is dependent on the maximum operating junction temperature (T

) and the junction to ambient thermal resistance of the package (θJA)

D-MAX

= T

A-MAX

J-MAX

− (θJAx P

+ V

OUT

). Refer to Dissipation rating table for P

D-MAX

DROPOUT

) to 5.5V for 1.8V ≤ V

≤ 3.3Vwhere

OUT

J-MAX

D-MAX

), the

values at

THERMAL PROPERTIES

Junction-to-Ambient Thermal Resistance (θJA) (SOT-23) for 4-layer board Junction-to-Ambient Thermal Resistance (θJA) (DSBGA) for 4-layer board Junction-to-Ambient Thermal Resistance (θJA) (USON) for 4-layer board

(1) Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation

exists, special care must be given to thermal dissipation issues in board design. Specified value of 130 °C/W for SOT-23 is based on a 4

layer, 4" x 3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.

(1) (1)

(1)

130°C/W

85°C/W

165°C/W

Product Folder Links: LM3671 LM3671Q

LM3671

LM3671Q

www.ti.com

ELECTRICAL CHARACTERISTICS

(1)(2)(3)

Limits in standard typeface are for TJ= 25°C. Limits in boldface type apply over the entire junction temperature range for operation, −40°C to +125°C. Unless otherwise noted, specifications apply to the LM3671MF/TL/LC with VIN= EN = 3.6V

Symbol Parameter Condition Min Typ Max Units

Input Voltage Feedback Voltage (Fixed) MF −4 +4 Feedback Voltage (Fixed) TL PWM mode Feedback Voltage (Fixed) LC −4 +4 Feedback Voltage (ADJ) MF

(6)

Feedback Voltage (ADJ) TL −2.5 +2.5 Line Regulation 0.031 %/V

Load Regulation 0.0013 %/mA

REF

SHDN

DSON (P)

DSON (N)

LIM

OSC

Internal Reference Voltage 0.5 V Shutdown Supply Current EN = 0V 0.01 1 µA

DC Bias Current into V

Pin-Pin Resistance for PFET VIN= VGS= 3.6V 380 500 mΩ Pin-Pin Resistance for NFET VIN= VGS= 3.6V 250 400 mΩ Switch Peak Current Limit Open Loop Logic High Input 1.0 V Logic Low Input 0.4 V Enable (EN) Input Current 0.01 1 µA Internal Oscillator Frequency PWM Mode

(1) All voltages are with respect to the potential at the GND pin. (2) Min and Max limits are specified by design, test or statistical analysis. Typical numbers are not specified, but do represent the most

likely norm. (3) The parameters in the electrical characteristic table are tested at VIN= 3.6V unless otherwise specified. For performance over the input

voltage range refer to datasheet curves. (4) The input voltage range recommended for ideal applications performance for the specified output voltages are given below:VIN= 2.7V to

4.5V for 1.1V ≤ V

DROPOUT

(5) Test condition: for V

= I

(6) ADJ version is configured to 1.5V output. For ADJ output version: VIN= 2.7V to 4.5V for 0.90V ≤ V

≤ V

< 3.3V

OUT

(7) Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic

< 1.5VVIN= 2.7V to 5.5V for 1.5V ≤ V

OUT

LOAD

*( R

DSON, PFET

less than 2.5V, VIN= 3.6V; for V

OUT

+ R

INDUCTOR

)

table reflects open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed

loop current limit is the peak inductor current measured in the application circuit by increasing output current until output voltage drops

by 10%.

(4)

(5)

PWM mode

(5)

2.7V ≤ VIN≤ 5.5V IO= 10 mA

100 mA ≤ IO≤ 600 mA VIN= 3.6V

No load, device is not switching (FB forced higher than programmed 16 35 µA output voltage)

(7)

(5)

< 1.8VVIN= (V

OUT

greater than or equal to 2.5V, VIN= V

OUT

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

2.7 5.5 V

−2.5 +2.5 %

−4 +4

830 1020 1150 mA

1.6 2 2.6 MHz

+ V

DROPOUT

) to 5.5V for 1.8V ≤ V

+ 1V.

OUT

< 1.1VVIN= 2.7V to 5.5V for 1.1V

OUT

≤ 3.3Vwhere

OUT

DISSIPATION RATING TABLE

130°C/W (4 layer board) SOT-23 770 mW 500 mW 310 mW

85°C/W (4 layer board) 5-bump 1179 mW 765 mW 470 mW

DSBGA

165°C/W (4 layer board) 6-pin 606 mW 394 mW 242 mW

USON

TA≤ 25°C TA= 60°C TA= 85°C

Power Rating Power Rating Power Rating

Product Folder Links: LM3671 LM3671Q

2 MHz

Oscillator

Soft

Start

Ramp

Generator

Thermal

Shutdown

Undervoltage

Lockout

Frequency

Compensation

Error

Amp

Control Logic Driver

Current Limit

Comparator

Ref1

PFM Current

Comparator

Ref2

Zero Crossing

Comparator

PWM Comparator

pfm_low

pfm_hi

GND

Bandgap

Vcomp

1.0V

Fixed Ver

Adj Ver

0.5V

REF

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

BLOCK DIAGRAM

www.ti.com

Figure 6. Simplified Functional Diagram

Product Folder Links: LM3671 LM3671Q

-10 10 30 50 70 90 110 TEMPERATURE (oC)

100

150

200

250

300

350

400

450

500

550

600

DS(ON)

(m:)

-30

NFET

VIN = 4.5V

PFET

VIN = 2.7V

VIN = 4.5V

VIN = 3.6V

VIN = 2.7V

3.0 3.5 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V)

QUIESCENT CURRENT (P

)

2.5

TA = 85°C

EN = V

OUT

= 0 mA

TA = 25°C

TA = -30°C

-10 10 30 50 70 90 TEMPERATURE (°C)

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

SHUTDOWN CURRENT (PA)

-30

EN = GND

VIN = 3.6V

VIN = 2.7V

VIN = 5.5V

www.ti.com

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS

LM3671MF/TL/LC, Circuit of Figure 1, VIN= 3.6V, V

Quiescent Supply Current vs. Supply Voltage Shutdown Current vs. Temp

Figure 7. Figure 8.

Feedback Bias Current vs. Temp Switching Frequency vs. Temperature

= 1.5V, TA= 25°C, unless otherwise noted.

OUT

LM3671

LM3671Q

Figure 9. Figure 10.

vs. Temperature Open/Closed Loop Current Limit vs. Temperature

DS(ON)

Figure 11. Figure 12.

Product Folder Links: LM3671 LM3671Q

0 100 200 300 400 500 600

OUTPUT CURRENT (mA)

1.48

1.5

1.52

1.54

OUTPUT VOLTAGE (V)

VIN = 3.6V V

OUT

= 1.5V

PFM Mode

PWM Mode

-10 10 30 50 70 90 TEMPERATURE (oC)

1.4800

1.4850

1.4900

1.4950

1.5000

1.5050

1.5100

1.5150

1.5200

1.5250

1.5300

OUTPUT VOLTAGE (V)

-30

PFM Mode

PWM Mode

OUT

= 300 mA

VIN = 3.6V V

OUT

= 1.5V

OUT

= 600 mA

OUT

= 10 mA

2.5 3 3.5 4 4.5 5 5.5 SUPPLY VOLTAGE(V)

1.4800

1.4900

1.5000

1.5100

1.5200

1.5300

= 10 mAI

OUT

= 1.5 V

OUT

= 300 mA

OUT

= 500 mA

OUT

= 600 mA

OUT

OUTPUT VOLTAGE (V)

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LM3671MF/TL/LC, Circuit of Figure 1, VIN= 3.6V, V

Output Voltage vs. Supply Voltage Output Voltage vs. Supply Voltage

= 1.5V) (V

OUT

Figure 13. Figure 14.

= 1.5V, TA= 25°C, unless otherwise noted.

OUT

www.ti.com

= 2.5V)

Output Voltage vs. Temperature Output Voltage vs. Temperature

= 1.5V) (V

OUT

= 2.5V)

Figure 15. Figure 16.

Output Voltage vs. Output Current Output Voltage vs. Output Current

= 1.5V) (V

OUT

= 2.5V)

Figure 17. Figure 18.

Product Folder Links: LM3671 LM3671Q

OUT

40 Ps/DIV

3.6V

3.0V

20 mV/DIV AC Coupled

OUT

= 1.5V

OUT

= 400 mA

0.10 1.00 10.00 100.00 1000.00 OUTPUT CURRENT (mA)

100

EFFICIENCY (%)

0.01

VIN = 2.7V

VIN = 4.5V

VIN = 3.6V

OUT

= 1.5V

0.10 1.00 10.00 100.00 1000.00 OUTPUT CURRENT (mA)

100

EFFICIENCY (%)

0.01

VIN = 3.0V

VIN = 4.5V

VIN = 3.6V

OUT

= 1.8V

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LM3671MF/TL/LC, Circuit of Figure 1, VIN= 3.6V, V

Efficiency vs. Output Current Efficiency vs. Output Current

= 1.5V, L= 2.2 µH) (V

OUT

Figure 19. Figure 20.

Efficiency vs. Output Current Efficiency vs. Output Current

= 2.5V, L= 2.2 µH) (V

OUT

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

= 1.5V, TA= 25°C, unless otherwise noted.

OUT

LM3671

LM3671Q

= 1.8V, L= 2.2 µH)

= 3.3V, L= 2.2 µH)

Figure 21. Figure 22.

Line Transient Response Line Transient Response V

= 1.5V (PWM Mode) V

OUT

Figure 23. Figure 24.

Product Folder Links: LM3671 LM3671Q

= 2.5V (PWM Mode)

OUT

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LM3671MF/TL/LC, Circuit of Figure 1, VIN= 3.6V, V

Load Transient Response Load Transient Response

= 1.5V (PWM Mode) V

OUT

Figure 25. Figure 26.

= 1.5V, TA= 25°C, unless otherwise noted.

OUT

www.ti.com

= 2.5V (PWM Mode)

Load Transient Response (V

(PFM Mode 0.5 mA to 50 mA) (PFM Mode 50 mA to 0.5 mA)

Figure 27. Figure 28.

Load Transient Response (V

(PFM Mode 0.5 mA to 50 mA) (PFM Mode 50 mA to 0.5 mA)

= 1.5V) Load Transient Response (V

OUT

= 2.5V) Load Transient Response (V

OUT

= 1.5V)

= 2.5V)

Figure 29. Figure 30.

Product Folder Links: LM3671 LM3671Q

OUT

TIME (100 Ps/DIV)

2V/DIV

500 mA/DIV

VIN = 3.6V V

OUT

= 1.5V

2V/DIV

OUT

= 300 mA

1V/DIV

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LM3671MF/TL/LC, Circuit of Figure 1, VIN= 3.6V, V

Mode Change by Load Transients Mode Change by Load Transients

= 1.5V (PFM to PWM) V

OUT

Figure 31. Figure 32.

Mode Change by Load Transients Mode Change by Load Transients

= 2.5V (PFM to PWM) V

OUT

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

= 1.5V, TA= 25°C, unless otherwise noted.

OUT

LM3671

LM3671Q

= 1.5V (PWM to PFM)

= 2.5V (PWM to PFM)

Figure 33. Figure 34.

Start Up into PWM Mode Start Up into PWM Mode

= 1.5V (Output Current= 300 mA) V

OUT

Figure 35. Figure 36.

Product Folder Links: LM3671 LM3671Q

= 2.5V (Output Current= 300 mA)

OUT

TIME (100 Ps/DIV)

2V/DIV

500 mV/DIV VIN = 3.6V V

OUT

= 1.5V

OUT

= 1 mA

2V/DIV

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LM3671MF/TL/LC, Circuit of Figure 1, VIN= 3.6V, V

Start Up into PFM Mode Start Up into PFM Mode

= 1.5V (Output Current= 1mA) V

OUT

Figure 37. Figure 38.

= 1.5V, TA= 25°C, unless otherwise noted.

OUT

= 2.5V (Output Current= 1mA)

OUT

www.ti.com

Product Folder Links: LM3671 LM3671Q

LM3671

LM3671Q

www.ti.com

OPERATION DESCRIPTION

DEVICE INFORMATION

The LM3671, a high-efficiency step-down DC-DC switching buck converter, delivers a constant voltage from a single Li-Ion battery and input voltage rails from 2.7V to 5.5V to portable devices such as cell phones and PDAs. Using a voltage mode architecture with synchronous rectification, the LM3671 has the ability to deliver up to 600 mA depending on the input voltage, output voltage, ambient temperature and the inductor chosen.

There are three modes of operation depending on the current required - PWM (Pulse Width Modulation), PFM (Pulse Frequency Modulation), and shutdown. The device operates in PWM mode at load current of approximately 80 mA or higher. Lighter load current cause the device to automatically switch into PFM for reduced current consumption (IQ= 16 µA typ) and a longer battery life. Shutdown mode turns off the device, offering the lowest current consumption (I

SHUTDOWN

= 0.01 µA typ).

Additional features include soft-start, under-voltage protection, current overload protection, and thermal shutdown protection. As shown in Figure 1, only three external power components are required for implementation.

The part uses an internal reference voltage of 0.5V. It is recommended to keep the part in shutdown until the input voltage is 2.7V or higher.

CIRCUIT OPERATION

During the first portion of each switching cycle, the control block in the LM3671 turns on the internal PFET switch. This allows current to flow from the input through the inductor to the output filter capacitor and load. The inductor limits the current to a ramp with a slope of (VIN–V

During the second portion of each cycle, the controller turns the PFET switch off, blocking current flow from the input, and then turns the NFET synchronous rectifier on. The inductor draws current from ground through the NFET to the output filter capacitor and load, which ramps the inductor current down with a slope of - V

The output filter stores charge when the inductor current is high, and releases it when inductor current is low, smoothing the voltage across the load.

The output voltage is regulated by modulating the PFET switch on time to control the average current sent to the load. The effect is identical to sending a duty-cycle modulated rectangular wave formed by the switch and synchronous rectifier at the SW pin to a low-pass filter formed by the inductor and output filter capacitor. The output voltage is equal to the average voltage at the SW pin.

)/L, by storing energy in a magnetic field.

OUT

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

/L.

OUT

PWM OPERATION

During PWM operation the converter operates as a voltage-mode controller with input voltage feed forward. This allows the converter to achieve good load and line regulation. The DC gain of the power stage is proportional to the input voltage. To eliminate this dependence, feed forward inversely proportional to the input voltage is introduced.

While in PWM mode, the output voltage is regulated by switching at a constant frequency and then modulating the energy per cycle to control power to the load. At the beginning of each clock cycle the PFET switch is turned on and the inductor current ramps up until the comparator trips and the control logic turns off the switch. The current limit comparator can also turn off the switch in case the current limit of the PFET is exceeded. Then the NFET switch is turned on and the inductor current ramps down. The next cycle is initiated by the clock turning off the NFET and turning on the PFET.

Product Folder Links: LM3671 LM3671Q

OUT

TIME (4 Ps/DIV)

200 mA/DIV

2V/DIV

20 mV/DIV AC Coupled

VIN = 3.6V V

OUT

= 1.5V

OUT

= 20 mA

OUT

TIME (200 ns/DIV)

200 mA/DIV

2V/DIV

10 mV/DIV AC Coupled

VIN = 3.6V V

OUT

= 1.5V

OUT

= 400 mA

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

Figure 39. Typical PWM Operation

Internal Synchronous Rectification

While in PWM mode, the LM3671 uses an internal NFET as a synchronous rectifier to reduce rectifier forward voltage drop and associated power loss. Synchronous rectification provides a significant improvement in efficiency whenever the output voltage is relatively low compared to the voltage drop across an ordinary rectifier diode.

www.ti.com

Current Limiting

A current limit feature allows the LM3671 to protect itself and external components during overload conditions. PWM mode implements current limiting using an internal comparator that trips at 1020 mA (typ.). If the output is shorted to ground the device enters a timed current limit mode where the NFET is turned on for a longer duration until the inductor current falls below a low threshold. This allows the inductor current more time to decay, thereby preventing runaway.

PFM OPERATION

At very light load, the converter enters PFM mode and operates with reduced switching frequency and supply current to maintain high efficiency.

The part automatically transitions into PFM mode when either of two conditions occurs for a duration of 32 or more clock cycles:

A. The NFET current reaches zero. B. The peak PMOS switch current drops below the I

level, (Typically I

MODE

< 30 mA + VIN/42Ω ).

MODE

Figure 40. Typical PFM Operation

Product Folder Links: LM3671 LM3671Q

High PFM Threshold

~1.017*Vout

Low1 PFM Threshold

~1.006*Vout

PFM Mode at Light Load

PWM Mode at

Moderate to Heavy

Loads

Pfet on

until

Ipfm limit

reached

Nfet on

drains

inductor

current

until

I inductor = 0

High PFM

Voltage

Threshold

reached,

go into

sleep mode

Low PFM

Threshold,

turn on

PFET

Current load

increases,

draws Vout

towards

Low2 PFM

Threshold

Low2 PFM Threshold,

switch back to PWMmode

Load current increases

Low2 PFM Threshold

Vout

Z-

Axis

LM3671

LM3671Q

www.ti.com

During PFM operation, the converter positions the output voltage slightly higher than the nominal output voltage during PWM operation, allowing additional headroom for voltage drop during a load transient from light to heavy load. The PFM comparators sense the output voltage via the feedback pin and control the switching of the output FETs such that the output voltage ramps between ~0.6% and ~1.7% above the nominal PWM output voltage. If the output voltage is below the ‘high’ PFM comparator threshold, the PMOS power switch is turned on. It remains on until the output voltage reaches the ‘high’ PFM threshold or the peak current exceeds the I PFM mode. The typical peak current in PFM mode is: I

= 112 mA + VIN/27Ω .

PFM

Once the PMOS power switch is turned off, the NMOS power switch is turned on until the inductor current ramps to zero. When the NMOS zero-current condition is detected, the NMOS power switch is turned off. If the output voltage is below the ‘high’ PFM comparator threshold (see Figure 41), the PMOS switch is again turned on and the cycle is repeated until the output reaches the desired level. Once the output reaches the ‘high’ PFM threshold, the NMOS switch is turned on briefly to ramp the inductor current to zero and then both output switches are turned off and the part enters an extremely low power mode. Quiescent supply current during this ‘sleep’ mode is 16 µA (typ.), which allows the part to achieve high efficiency under extremely light load conditions.

If the load current should increase during PFM mode (see Figure 41) causing the output voltage to fall below the ‘low2’ PFM threshold, the part will automatically transition into fixed-frequency PWM mode. When VIN=2.7V the part transitions from PWM to PFM mode at ~35 mA output current and from PFM to PWM mode at ~85 mA , when VIN=3.6V, PWM to PFM transition happens at ~50 mA and PFM to PWM transition happens at ~100 mA, when VIN=4.5V, PWM to PFM transition happens at ~65 mA and PFM to PWM transition happens at ~115 mA.

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

level set for

PFM

Figure 41. Operation in PFM Mode and Transfer to PWM Mode

SHUTDOWN MODE

Setting the EN input pin low (<0.4V) places the LM3671 in shutdown mode. During shutdown the PFET switch, NFET switch, reference, control and bias circuitry of the LM3671 are turned off. Setting EN high (>1.0V) enables normal operation. It is recommended to set EN pin low to turn off the LM3671 during system power up and undervoltage conditions when the supply is less than 2.7V. Do not leave the EN pin floating.

SOFT START

The LM3671 has a soft-start circuit that limits in-rush current during startup. During startup the switch current limit is increased in steps. Soft start is activated only if EN goes from logic low to logic high after Vin reaches 2.7V. Soft start is implemented by increasing switch current limit in steps of 70 mA, 140 mA, 280 mA and 1020 mA (typical switch current limit). The startup time thereby depends on the output capacitor and load current demanded at startup. Typical startup times with a 10 µF output capacitor and 300 mA load is 400 µs and with 1mA load is 275 µs.

Product Folder Links: LM3671 LM3671Q

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

LDO - LOW DROPOUT OPERATION

The LM3671-ADJ can operate at 100% duty cycle (no switching; PMOS switch completely on) for low dropout support of the output voltage. In this way the output voltage will be controlled down to the lowest possible input voltage. When the device operates near 100% duty cycle, output voltage ripple is approximately 25 mV.

The minimum input voltage needed to support the output voltage is

= I

IN, MIN

where

* (R

LOAD

• I

LOAD: Load current

• R

DSON, PFET: Drain to source resistance of PFET switch in the triode region

• R

INDUCTOR: Inductor resistance

DSON, PFET

+ R

INDUCTOR

) + V

OUT

www.ti.com

(1)

Product Folder Links: LM3671 LM3671Q

Fp =

2 * S * (R1 R2) * (C1+C2)

Fz =

(2 * S * R1 * C1)

C2 =

(2 * S * R2 * 45 kHz)

C1 =

(2 * S * R1 * 45 kHz)

OUT

= V

1 +

R1 R2



LM3671

LM3671Q

www.ti.com

APPLICATION INFORMATION

OUTPUT VOLTAGE SELECTION FOR LM3671-ADJ

The output voltage of the adjustable parts can be programmed through the resistor network connected from V to FB, then to GND. V should be 200 kΩ to keep the current drawn through this network well below the 16 µA quiescent current level (PFM mode) but large enough that it is not susceptible to noise. If R2 is 200 kΩ, and VFBis 0.5V, the current through the resistor feedback network will be 2.5 µA. The output voltage of the adjustable parts ranges from 1.1V to 3.3V.

The formula for output voltage selection is:

where

• V

• VFB: feedback voltage = 0.5V

• R1: feedback resistor from V

• R2: feedback resistor from FB to GND (2)

: output voltage (volts)

OUT

For any output voltage greater than or equal to 1.1V, a zero must be added around 45 kHz for stability. The formula for calculation of C1 is:

is adjusted to make the voltage at FB equal to 0.5V. The resistor from FB to GND (R2)

OUT

to FB

OUT

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

OUT

(3)

For output voltages higher than 2.5V, a pole must be placed at 45 kHz as well. If the pole and zero are at the same frequency the formula for calculation of C2 is:

(4)

The formula for location of zero and pole frequency created by adding C1 and C2 is given below. By adding C1, a zero as well as a higher frequency pole is introduced.

(5)

(6)

See the "LM3671-ADJ configurations for various V

Table 1. LM3671-ADJ Configurations For Various V

OUT

" table.

(Circuit of Figure 2)

OUT

(Refer to Note 11 for VIN requirements)

(V) R1(kΩ) R2 (kΩ) C1 (pF) C2 (pF) L (µH) CIN(µF) C

OUT

0.90 160 200 22 none 2.2 4.7 10

1.1 240 200 15 none 2.2 4.7 10

1.2 280 200 12 none 2.2 4.7 10

1.3 320 200 12 none 2.2 4.7 10

1.5 357 178 10 none 2.2 4.7 10

1.6 442 200 8.2 none 2.2 4.7 10

1.7 432 178 8.2 none 2.2 4.7 10

1.8 464 178 8.2 none 2.2 4.7 10

1.875 523 191 6.8 none 2.2 4.7 10

2.5 402 100 8.2 none 2.2 4.7 10

2.8 464 100 8.2 33 2.2 4.7 10

3.3 562 100 6.8 33 2.2 4.7 10

OUT

(µF)

Product Folder Links: LM3671 LM3671Q

RMS

= I

OUTMAX



The worst case is when VIN = 2 V

OUT



(VIN - V

OUT

) V

OUT

L f I

OUTMAX



  

r =

OUT

1 -

OUT

¸ ¹

¨ ©



¸ ¹

· ¨ ©





SAT

OUTMAX

+ I

RIPPLE

where I

RIPPLE

OUT

¸ ¹

· ¨ ©

¸ ¹

· ¨ ©

VIN - V

OUT

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

INDUCTOR SELECTION

There are two main considerations when choosing an inductor; the inductor should not saturate, and the inductor current ripple should be small enough to achieve the desired output voltage ripple. Different saturation current rating specifications are followed by different manufacturers so attention must be given to details. Saturation current ratings are typically specified at 25°C. However, ratings at the maximum ambient temperature of application should be requested from the manufacturer. The minimum value of inductance to specify good

performance is 1.76 µH at I

radiate less noise and should be preferred. There are two methods to choose the inductor saturation current rating.

Method 1:

The saturation current should be greater than the sum of the maximum load current and the worst case average to peak inductor current. This can be written as

where

• I

• VIN: maximum input voltage in application

• L : min inductor value including worst case tolerances (30% drop can be considered for method 1)

• f : minimum switching frequency (1.6 Mhz)

• V

: average to peak inductor current

RIPPLE

: maximum load current (600 mA)

OUTMAX

: output voltage (7)

OUT

Method 2:

A more conservative and recommended approach is to choose an inductor that has a saturation current rating greater than the maximum current limit of 1150mA.

A 2.2 µH inductor with a saturation current rating of at least 1150 mA is recommended for most applications. The inductor’s resistance should be less than 0.3Ω for good efficiency. Table 2 lists suggested inductors and suppliers. For low-cost applications, an unshielded bobbin inductor could be considered. For noise critical applications, a toroidal or shielded-bobbin inductor should be used. A good practice is to lay out the board with overlapping footprints of both types for design flexibility. This allows substitution of a low-noise shielded inductor, in the event that noise from low-cost bobbin models is unacceptable.

(typ.) dc current over the ambient temperature range. Shielded inductors

LIM

www.ti.com

INPUT CAPACITOR SELECTION

A ceramic input capacitor of 4.7 µF, 6.3V is sufficient for most applications. Place the input capacitor as close as possible to the VINpin of the device. A larger value may be used for improved input voltage filtering. Use X7R or X5R types; do not use Y5V. DC bias characteristics of ceramic capacitors must be considered when selecting case sizes like 0805 and 0603. The minimum input capacitance to specify good performance is 2.2µF at 3V dc bias; 1.5µF at 5V dc bias including tolerances and over ambient temperature range. The input filter capacitor supplies current to the PFET switch of the LM3671 in the first half of each cycle and reduces voltage ripple imposed on the input power source. A ceramic capacitor’s low ESR provides the best noise filtering of the input voltage spikes due to this rapidly changing current. Select a capacitor with sufficient ripple current rating. The input current ripple can be calculated as:

Product Folder Links: LM3671 LM3671Q

(8)

PP-RMS

= V

PP-C

+ V

PP-ESR

PP-C

4*f*C

RIPPLE

LM3671

LM3671Q

www.ti.com

Table 2. Suggested Inductors and Their Suppliers

Model Vendor Dimensions LxWxH(mm) D.C.R (max)

DO3314-222MX Coilcraft 3.3 x 3.3 x 1.4 200 mΩ

LPO3310-222MX Coilcraft 3.3 x 3.3 x 1.0 150 mΩ

ELL5GM2R2N Panasonic 5.2 x 5.2 x 1.5 53 mΩ

CDRH2D14NP-2R2NC Sumida 3.2 x 3.2 x 1.55 94 mΩ

OUTPUT CAPACITOR SELECTION

A ceramic output capacitor of 10 µF, 6.3V is sufficient for most applications. Use X7R or X5R types; do not use Y5V. DC bias characteristics of ceramic capacitors must be considered when selecting case sizes like 0805 and

0603. DC bias characteristics vary from manufacturer to manufacturer and dc bias curves should be requested from them as part of the capacitor selection process.

The minimum output capacitance to specify good performance is 5.75 µF at 1.8V dc bias including tolerances and over ambient temperature range. The output filter capacitor smoothes out current flow from

the inductor to the load, helps maintain a steady output voltage during transient load changes and reduces output voltage ripple. These capacitors must be selected with sufficient capacitance and sufficiently low ESR to perform these functions.

The output voltage ripple is caused by the charging and discharging of the output capacitor and by the R can be calculated as:

Voltage peak-to-peak ripple due to capacitance can be expressed as follow:

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

and

ESR

(9)

Voltage peak-to-peak ripple due to ESR can be expressed as follow: V

PP-ESR

= (2 * I

RIPPLE

) * R

ESR

Because these two components are out of phase the rms (root mean squared) value can be used to get an approximate value of peak-to-peak ripple.

The peak-to-peak ripple voltage, rms value can be expressed as follow:

(10)

Note that the output voltage ripple is dependent on the inductor current ripple and the equivalent series resistance of the output capacitor (R

The R

is frequency dependent (as well as temperature dependent); make sure the value used for calculations

ESR

is at the switching frequency of the part.

Table 3. Suggested Capacitors and Their Suppliers

Model Type Vendor Voltage Rating

4.7 µF for C

10 µF for C

C2012X5R0J475K Ceramic, X5R TDK 6.3V 0805 (2012)

JMK212BJ475K Ceramic, X5R Taiyo-Yuden 6.3V 0805 (2012)

GRM21BR60J475K Ceramic, X5R Murata 6.3V 0805 (2012)

C1608X5R0J475K Ceramic, X5R TDK 6.3V 0603 (1608)

OUT

GRM21BR60J106K Ceramic, X5R Murata 6.3V 0805 (2012)

JMK212BJ106K Ceramic, X5R Taiyo-Yuden 6.3V 0805 (2012) C2012X5R0J106K Ceramic, X5R TDK 6.3V 0805 (2012) C1608X5R0J106K Ceramic, X5R TDK 6.3V 0603 (1608)

Case Size

Inch (mm)

Product Folder Links: LM3671 LM3671Q

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

DSBGA PACKAGE ASSEMBLY AND USE

Use of the DSBGA package requires specialized board layout, precision mounting and careful re-flow techniques, as detailed in Texas Instruments Application Note AN-1112 (Literature Number SNVA009). Refer to the section "Surface Mount Technology (DSBGA) Assembly Considerations". For best results in assembly, alignment ordinals on the PC board should be used to facilitate placement of the device. The pad style used with DSBGA package must be the NSMD (non-solder mask defined) type. This means that the solder-mask opening is larger than the pad size. This prevents a lip that otherwise forms if the solder-mask and pad overlap, from holding the device off the surface of the board and interfering with mounting. See Application Note AN-1112 (Literature Number SNVA009) for specific instructions how to do this. The 5-bump package used for LM3671 has 300 micron solder balls and requires 10.82 mils pads for mounting on the circuit board. The trace to each pad should enter the pad with a 90° entry angle to prevent debris from being caught in deep corners. Initially, the trace to each pad should be 7 mil wide, for a section approximately 7 mil long or longer, as a thermal relief. Then each trace should neck up or down to its optimal width. The important criteria is symmetry. This ensures the solder bumps on the LM3671 re-flow evenly and that the device solders level to the board. In particular, special attention must be paid to the pads for bumps A1 and A3, because VINand GND are typically connected to large copper planes, inadequate thermal relief can result in late or inadequate re-flow of these bumps.

The DSBGA package is optimized for the smallest possible size in applications with red or infrared opaque cases. Because the DSBGA package lacks the plastic encapsulation characteristic of larger devices, it is vulnerable to light. Backside metallization and/or epoxy coating, along with front-side shading by the printed circuit board, reduce this sensitivity. However, the package has exposed die edges. In particular, DSBGA devices are sensitive to light, in the red and infrared range, shining on the package’s exposed die edges.

www.ti.com

BOARD LAYOUT CONSIDERATIONS

PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance of a DC-DC converter and surrounding circuitry by contributing to EMI, ground bounce, and resistive voltage loss in the traces. These can send erroneous signals to the DC-DC converter IC, resulting in poor regulation or instability.

Good layout for the LM3671 can be implemented by following a few simple design rules below. Refer to

Figure 42 for top layer board layout.

1. Place the LM3671, inductor and filter capacitors close together and make the traces short. The traces between these components carry relatively high switching currents and act as antennas. Following this rule reduces radiated noise. Special care must be given to place the input filter capacitor very close to the V and GND pin.

2. Arrange the components so that the switching current loops curl in the same direction. During the first half of each cycle, current flows from the input filter capacitor through the LM3671 and inductor to the output filter capacitor and back through ground, forming a current loop. In the second half of each cycle, current is pulled up from ground through the LM3671 by the inductor to the output filter capacitor and then back through ground forming a second current loop. Routing these loops so the current curls in the same direction prevents magnetic field reversal between the two half-cycles and reduces radiated noise.

3. Connect the ground pins of the LM3671 and filter capacitors together using generous component-side

copper fill as a pseudo-ground plane. Then, connect this to the ground-plane (if one is used) with several vias. This reduces ground-plane noise by preventing the switching currents from circulating through the

ground plane. It also reduces ground bounce at the LM3671 by giving it a low-impedance ground connection.

4. Use wide traces between the power components and for power connections to the DC-DC converter circuit. This reduces voltage errors caused by resistive losses across the traces.

5. Route noise sensitive traces, such as the voltage feedback path, away from noisy traces between the power components. The voltage feedback trace must remain close to the LM3671 circuit and should be direct but should be routed opposite to noisy components. This reduces EMI radiated onto the DC-DC converter’s own voltage feedback trace. A good approach is to route the feedback trace on another layer and to have a ground plane between the top layer and layer on which the feedback trace is routed. In the same manner for the adjustable part it is desired to have the feedback dividers on the bottom layer.

6. Place noise sensitive circuitry, such as radio IF blocks, away from the DC-DC converter, CMOS digital blocks and other noisy circuitry. Interference with noise-sensitive circuitry in the system can be reduced through distance.

Product Folder Links: LM3671 LM3671Q

LM3671

LM3671Q

www.ti.com

In mobile phones, for example, a common practice is to place the DC-DC converter on one corner of the board, arrange the CMOS digital circuitry around it (since this also generates noise), and then place sensitive preamplifiers and IF stages on the diagonally opposing corner. Often, the sensitive circuitry is shielded with a metal pan and power to it is post-regulated to reduce conducted noise, using low-dropout linear regulators.

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

Figure 42. Top Layer Board Layout For SOT-23

Product Folder Links: LM3671 LM3671Q

LM3671 LM3671Q

SNVS294P –NOVEMBER 2004–REVISED MAY 2013

REVISION HISTORY

Changes from Revision O (April 2013) to Revision P Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 23

www.ti.com

Product Folder Links: LM3671 LM3671Q

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

LM3671LC-1.2/NOPB ACTIVE USON NKH 6 1000 Green (RoHS

LM3671LC-1.3/NOPB ACTIVE USON NKH 6 1000 Green (RoHS

LM3671LC-1.6/NOPB ACTIVE USON NKH 6 1000 Green (RoHS

LM3671LC-1.8/NOPB ACTIVE USON NKH 6 1000 Green (RoHS

LM3671LCX-1.2/NOPB ACTIVE USON NKH 6 4500 Green (RoHS

LM3671LCX-1.3/NOPB ACTIVE USON NKH 6 4500 Green (RoHS

LM3671LCX-1.6/NOPB ACTIVE USON NKH 6 4500 Green (RoHS

LM3671LCX-1.8/NOPB ACTIVE USON NKH 6 4500 Green (RoHS

LM3671MF-1.2 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SBPB

LM3671MF-1.2/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

LM3671MF-1.25 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SDRB

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

CU NIPDAU Level-1-260C-UNLIM S39

CU NIPDAU Level-1-260C-UNLIM S40

CU NIPDAU Level-1-260C-UNLIM S41

CU NIPDAU Level-1-260C-UNLIM S42

CU NIPDAU Level-1-260C-UNLIM S39

CU NIPDAU Level-1-260C-UNLIM S40

CU NIPDAU Level-1-260C-UNLIM S41

CU NIPDAU Level-1-260C-UNLIM S42

CU SN Level-1-260C-UNLIM -30 to 85 SBPB

Op Temp (°C) Top-Side Markings

2-May-2013

Samples

(4)

LM3671MF-1.25/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br)

LM3671MF-1.375 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SEDB

LM3671MF-1.375/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br)

LM3671MF-1.5 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SBRB

LM3671MF-1.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br)

LM3671MF-1.6 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SDUB

LM3671MF-1.6/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br)

Addendum-Page 1

CU SN Level-1-260C-UNLIM -30 to 85 SDRB

CU SN Level-1-260C-UNLIM -30 to 85 SEDB

CU SN Level-1-260C-UNLIM -30 to 85 SBRB

CU SN Level-1-260C-UNLIM -30 to 85 SDUB

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

LM3671MF-1.8 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SBSB

LM3671MF-1.8/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SBSB

& no Sb/Br)

LM3671MF-1.875 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SDVB

LM3671MF-1.875/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SDVB

& no Sb/Br)

LM3671MF-2.5 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SJRB

LM3671MF-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SJRB

& no Sb/Br)

LM3671MF-2.8 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SJSB

LM3671MF-2.8/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SJSB

& no Sb/Br)

LM3671MF-3.3 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SJEB

LM3671MF-3.3/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SJEB

& no Sb/Br)

LM3671MF-ADJ ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -30 to 85 SBTB

2-May-2013

Samples

(4)

LM3671MF-ADJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SBTB

& no Sb/Br)

LM3671MFX-1.2 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SBPB

LM3671MFX-1.2/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SBPB

& no Sb/Br)

LM3671MFX-1.25 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SDRB

LM3671MFX-1.25/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SDRB

& no Sb/Br)

LM3671MFX-1.375 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SEDB

LM3671MFX-1.375/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SEDB

& no Sb/Br)

LM3671MFX-1.5 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SBRB

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

LM3671MFX-1.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

CU SN Level-1-260C-UNLIM -30 to 85 SBRB

& no Sb/Br)

LM3671MFX-1.6 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SDUB

LM3671MFX-1.6/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SDUB

& no Sb/Br)

LM3671MFX-1.8 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SBSB

LM3671MFX-1.8/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SBSB

& no Sb/Br)

LM3671MFX-1.875 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SDVB

LM3671MFX-1.875/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SDVB

& no Sb/Br)

LM3671MFX-2.5 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SJRB

LM3671MFX-2.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SJRB

& no Sb/Br)

LM3671MFX-2.8 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SJSB

LM3671MFX-2.8/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SJSB

& no Sb/Br)

LM3671MFX-3.3 ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SJEB

2-May-2013

Samples

(4)

LM3671MFX-3.3/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SJEB

& no Sb/Br)

LM3671MFX-ADJ ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -30 to 85 SBTB

LM3671MFX-ADJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -30 to 85 SBTB

& no Sb/Br)

LM3671QMF-1.2/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

CU SN Level-1-260C-UNLIM -40 to 125 SH4B

& no Sb/Br)

LM3671QMFX-1.2/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

CU SN Level-1-260C-UNLIM -40 to 125 SH4B

& no Sb/Br)

LM3671TL-1.2/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 C

& no Sb/Br)

LM3671TL-1.5/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 D

& no Sb/Br)

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

LM3671TL-1.8/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

SNAGCU Level-1-260C-UNLIM -30 to 85 B

& no Sb/Br)

LM3671TL-1.875/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 S

& no Sb/Br)

LM3671TL-2.5/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 L

& no Sb/Br)

LM3671TL-2.8/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 K

& no Sb/Br)

LM3671TL-3.3/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 J

& no Sb/Br)

LM3671TL-ADJ/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 E

& no Sb/Br)

LM3671TLX-1.2/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 C

& no Sb/Br)

LM3671TLX-1.5/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 D

& no Sb/Br)

LM3671TLX-1.8/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 B

& no Sb/Br)

LM3671TLX-1.875/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 S

& no Sb/Br)

LM3671TLX-2.5/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 L

& no Sb/Br)

LM3671TLX-2.8/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 K

& no Sb/Br)

LM3671TLX-3.3/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 J

& no Sb/Br)

LM3671TLX-ADJ/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

SNAGCU Level-1-260C-UNLIM -30 to 85 E

& no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

2-May-2013

Samples

(4)

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM3671, LM3671-Q1 :

Catalog: LM3671

•

2-May-2013

Automotive: LM3671-Q1

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

Addendum-Page 5

PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

LM3671LC-1.2/NOPB USON NKH 6 1000 178.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1 LM3671LC-1.3/NOPB USON NKH 6 1000 178.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1 LM3671LC-1.6/NOPB USON NKH 6 1000 178.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1 LM3671LC-1.8/NOPB USON NKH 6 1000 178.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1

LM3671LCX-1.2/NOPB USON NKH 6 4500 330.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1 LM3671LCX-1.3/NOPB USON NKH 6 4500 330.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1 LM3671LCX-1.6/NOPB USON NKH 6 4500 330.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1 LM3671LCX-1.8/NOPB USON NKH 6 4500 330.0 12.4 2.2 2.2 1.0 8.0 12.0 Q1

LM3671MF-1.2 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.2/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.25 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.25/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.375 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.375/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.5 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.6 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.6/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Quadrant

Pin1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2013

Device Package

LM3671MF-1.8 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.8/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.875 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-1.875/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-2.5 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-2.5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-2.8 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-2.8/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-3.3 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-3.3/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-ADJ SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MF-ADJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.2 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.2/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.25 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.25/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.375 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.375/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.5 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.5/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.6 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.6/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.8 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.8/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.875 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-1.875/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-2.5 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-2.5/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-2.8 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-2.8/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-3.3 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-3.3/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-ADJ SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671MFX-ADJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671QMF-1.2/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671QMFX-1.2/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM3671TL-1.2/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TL-1.5/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TL-1.8/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1

LM3671TL-1.875/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1

LM3671TL-2.5/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TL-2.8/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TL-3.3/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2013

Device Package

LM3671TL-ADJ/NOPB DSBGA YZR 5 250 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TLX-1.2/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TLX-1.5/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TLX-1.8/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1

LM3671TLX-1.875/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1

LM3671TLX-2.5/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TLX-2.8/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1 LM3671TLX-3.3/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1

LM3671TLX-ADJ/NOPB DSBGA YZR 5 3000 178.0 8.4 1.14 1.47 0.76 4.0 8.0 Q1

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM3671LC-1.2/NOPB USON NKH 6 1000 203.0 190.0 41.0 LM3671LC-1.3/NOPB USON NKH 6 1000 210.0 185.0 35.0 LM3671LC-1.6/NOPB USON NKH 6 1000 210.0 185.0 35.0

LM3671LC-1.8/NOPB USON NKH 6 1000 210.0 185.0 35.0 LM3671LCX-1.2/NOPB USON NKH 6 4500 367.0 367.0 35.0 LM3671LCX-1.3/NOPB USON NKH 6 4500 367.0 367.0 35.0 LM3671LCX-1.6/NOPB USON NKH 6 4500 367.0 367.0 35.0 LM3671LCX-1.8/NOPB USON NKH 6 4500 367.0 367.0 35.0

Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2013

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM3671MF-1.2 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.2/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.25 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.25/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.375 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.375/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.5 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.6 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.6/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.8 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.8/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.875 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-1.875/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-2.5 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-2.8 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-2.8/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-3.3 SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-3.3/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-ADJ SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MF-ADJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671MFX-1.2 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.2/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.25 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.25/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.375 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.375/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.5 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.6 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.6/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.8 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.8/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.875 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-1.875/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-2.5 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-2.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-2.8 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-2.8/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-3.3 SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-3.3/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-ADJ SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671MFX-ADJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

Pack Materials-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2013

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM3671QMF-1.2/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM3671QMFX-1.2/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM3671TL-1.2/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LM3671TL-1.5/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LM3671TL-1.8/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LM3671TL-1.875/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LM3671TL-2.5/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LM3671TL-2.8/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LM3671TL-3.3/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LM3671TL-ADJ/NOPB DSBGA YZR 5 250 210.0 185.0 35.0 LM3671TLX-1.2/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0 LM3671TLX-1.5/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0 LM3671TLX-1.8/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

LM3671TLX-1.875/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

LM3671TLX-2.5/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0 LM3671TLX-2.8/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0 LM3671TLX-3.3/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

LM3671TLX-ADJ/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

Pack Materials-Page 5

NKH0006B

MECHANICAL DATA

www.ti.com

LCA06B (Rev A)

YZR0005xxx

MECHANICAL DATA

0.600±0.075

NOTES:

D: Max = E: Max =

. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

1.413 mm, Min =

1.083 mm, Min =

4215043/A 12/12

TLA05XXX (Rev C)

1.352 mm

1.022 mm

www.ti.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Texas Instruments LM3671LC, LM3671LC-1.2, LM3671LC-1.3, LM3671LC-1.6, LM3671LC-1.8 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

DESCRIPTION

TYPICAL APPLICATION CIRCUITS

DESCRIPTION (CONTINUED)

Connection Diagrams

ABSOLUTE MAXIMUM RATINGS

OPERATING RATINGS

THERMAL PROPERTIES

ELECTRICAL CHARACTERISTICS

DISSIPATION RATING TABLE

BLOCK DIAGRAM

TYPICAL PERFORMANCE CHARACTERISTICS

OPERATION DESCRIPTION

DEVICE INFORMATION

CIRCUIT OPERATION

PWM OPERATION

Internal Synchronous Rectification

Current Limiting

PFM OPERATION

SHUTDOWN MODE

SOFT START

LDO - LOW DROPOUT OPERATION

APPLICATION INFORMATION

OUTPUT VOLTAGE SELECTION FOR LM3671-ADJ

INDUCTOR SELECTION

INPUT CAPACITOR SELECTION

OUTPUT CAPACITOR SELECTION

DSBGA PACKAGE ASSEMBLY AND USE

BOARD LAYOUT CONSIDERATIONS

REVISION HISTORY