CY74FCT2245T
2
Maximum Ratings
[2,3]
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–65°C to +135°C
Supply Voltage to Ground Potential...............–0.5V to +7.0V
DC Input Voltage............................................–0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
DC Output Current (Maximum Sink Current/Pin) ......120 mA
Power Dissipation..........................................................0.5W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Operating Range
Range Range
Ambient
Temperature V
CC
Commercial T, AT, CT –40°C to +85°C 5V ± 5%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.
[5]
Max. Unit
V
OH
Output HIGH Voltage VCC=Min., IOH=–15 mA Com’l 2.4 3.3 V
V
OL
Output LOW Voltage VCC=Min., IOL=12 mA Com’l 0.3 0.55 V
R
OUT
Output Resistance VCC=Min., IOL=12 mA Com’l 20 25 40 Ω
V
IH
Input HIGH Voltage 2.0 V
V
IL
Input LOW Voltage 0.8 V
V
H
Hysteresis
[6]
All inputs 0.2 V
V
IK
Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 –1.2 V
I
I
Input HIGH Current VCC=Max., VIN=V
CC
5 µA
I
IH
Input HIGH Current VCC=Max., VIN=2.7V ±1 µA
I
IL
Input LOW Current VCC=Max., VIN=0.5V ±1 µA
I
OS
Output Short Circuit Current
[7]
VCC=Max., V
OUT
=0.0V –60 –120 –225 mA
I
OFF
Power-Off Disable VCC=0V, V
OUT
=4.5V ±1 µA
Capacitance
[6]
Parameter Description Test Conditions Typ.
[5]
Max. Unit
C
IN
Input Capacitance 5 10 pF
C
OUT
Output Capacitance 9 12 pF
Notes:
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
4. T
A
is the “instant on” case temperature.
5. Typical values are at V
CC
=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, I
OS
tests should be performed last.