• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 30%, NIH = 30% of V
IL
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
≤ 1µA at VOL, V
l
CC
= 5V,
o
C to 125oC
OH
Description
The ’HC11and ’HCT11 logic gates utilize silicon gate CMOS
technology to achieve operating speeds similar to LSTTL
gates with the low power consumption of standard CMOS
integrated circuits. All devices have the ability to drive 10
LSTTL loads. The HCT logic family is functionally pin
compatible with the standard LS logic family.
Ordering Information
TEMP. RANGE
CC
PART NUMBER
CD54HC11F-55 to 12514 Ld CERDIP
CD54HC11F3A-55 to 12514 Ld CERDIP
CD74HC11E-55 to 12514 Ld PDIP
CD74HC11M-55 to 12514 Ld SOIC
CD54HCT11F-55 to 12514 Ld CERDIP
CD54HCT11F3A-55 to 12514 Ld CERDIP
CD74HCT11E-55 to 12514 Ld PDIP
CD74HCT11M-55 to 12514 Ld SOIC
NOTES:
1. When ordering, use the entire partnumber. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Die for this part number is available which meets all electrical
specifications. Please contact your local TI sales office or customer service for ordering information.
(oC)PACKAGE
Pinout
CD54HC11, CD54HCT11
(CERDIP)
CD54HCT11, CD74HC11, CD74HCT11
(PDIP, SOIC)
TOP VIEW
1A
1
2
1B
2A
3
4
2B
5
2C
6
2Y
7
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
Maximum Junction Temperature (Hermetic P ac kage or Die) . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETERSYMBOL
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
V
IH
V
IL
V
OH
V
OL
I
I
TEST
CONDITIONS
25oC-40oC TO 85oC-55oC TO 125oC
VCC (V)
--21.5--1.5-1.5-V
4.53.15--3.15 -3.15-V
64.2--4.2-4.2-V
--2--0.5-0.5-0.5V
4.5--1.35-1.35-1.35V
6--1.8-1.8-1.8V
VIH or
V
-0.0221.9--1.9-1.9-V
IL
-0.024.54.4--4.4 -4.4-V
-0.0265.9--5.9-5.9-V
---------V
-44.53.98--3.84-3.7-V
-5.265.48--5.34-5.2-V
VIH or
V
0.022--0.1-0.1-0.1V
IL
0.024.5--0.1-0.1-0.1V
0.026--0.1-0.1-0.1V
---------V
44.5--0.26-0.33-0.4V
5.26--0.26-0.33-0.4V
VCC or
-6--±0.1-±1-±1µA
GND
UNITSVI(V)IO(mA)MINTYPMAXMINMAXMINMAX
3
CD54/74HC11, CD54/74HCT11
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETERSYMBOL
Quiescent Device
Current
I
CC
VCC or
GND
VCC (V)
06--2-20-40µA
HCT TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage CMOS Loads
High Level Output
V
IH
--4.5 to
5.5
V
IL
--4.5 to
5.5
V
OH
VIH or
V
IL
-0.024.54.4--4.4-4.4-V
-44.53.98--3.84-3.7-V
Voltage
TTL Loads
Low Level Output
Voltage
V
OL
VIH or
V
IL
0.024.5--0.1-0.1-0.1V
CMOS Loads
Low Level Output
44.5--0.26-0.33-0.4V
Voltage
TTL Loads
Input Leakage
Current
I
I
V
CC
-5.5-±0.1-±1-±1µA
and
GND
Quiescent Device
Current
Additional Quiescent
Device Current Per
I
CC
VCC or
-5.5--2-20-40µA
GND
∆I
CC
V
CC
- 2.1
-4.5 to
5.5
Input Pin: 1 Unit Load
(Note 4)
NOTE:
4. For dual-supply systems theorectical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
25oC-40oC TO 85oC-55oC TO 125oC
2-- 2 - 2 - V
--0.8-0.8-0.8V
-100360-450-490µA
UNITSVI(V)IO(mA)MINTYPMAXMINMAXMINMAX
HCT Input Loading Table
INPUTUNIT LOADS
All0.5
NOTE: Unit Load is ∆ICClimit specified in DC Electrical
Specifications table, e.g. 360µA max at 25oC.
Switching Specifications Input t
PARAMETERSYMBOL
HC TYPES
Propagation Delay,
Input to Output (Figure 1)
PropagationDelay,DataInputto
Output Y
t
PLH
t
PLH
, tf = 6ns
r
, t
PHLCL
, t
PHLCL
TEST
CONDITIONS
= 50pF2--100-125-150ns
= 15pF5-8-----ns
V
CC
(V)
25oC-40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAXMINMAXMINMAX
4.5--20-25-30ns
6--17-21-26ns
4
CD54/74HC11, CD54/74HCT11
Switching Specifications Input t
PARAMETERSYMBOL
Transition Times (Figure 1)t
, tf = 6ns (Continued)
r
CONDITIONS
TLH
, t
THLCL
= 50pF2--75-95-110ns
TEST
V
CC
(V)
4.5--15-19-22ns
6--13-16-19ns
Input CapacitanceC
Power Dissipation Capacitance
C
CL= 50pF---10-10-10pF
I
CL= 15pF5-26-----pF
PD
(Notes 5, 6)
HCT TYPES
Propagation Delay, Input to
t
PLH
, t
PHLCL
= 50pF4.5--28-35-42ns
Output (Figure 2)
PropagationDelay,DataInputto
t
PLH
, t
PHLCL
= 15pF5-11-----ns
Output Y
Transition Times (Figure 2)t
Input CapacitanceC
Power Dissipation Capacitance
TLH
, t
I
C
PD
THLCL
= 50pF4.5--15-19-22ns
CL= 50pF---10-10-10pF
-5-28-----pF
(Notes 5, 6)
NOTES:
5. CPD is used to determine the dynamic power consumption, per gate.
6. PD = V
2
fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
CC
25oC-40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAXMINMAXMINMAX
Test Circuits and Waveforms
tr = 6nstf = 6ns
V
t
CC
GND
TLH
t
PHL
90%
50%
10%
t
PLH
90%
50%
10%
INPUT
t
INVERTING
OUTPUT
THL
FIGURE 1. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
= 6ns
t
PLH
t
f
1.3V
10%
90%
t
3V
GND
TLH
tr = 6ns
INPUT
t
INVERTING
OUTPUT
THL
t
2.7V
1.3V
0.3V
PHL
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
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pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
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Customers are responsible for their applications using TI components.
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Copyright 2000, Texas Instruments Incorporated
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