Texas Instruments CD74HCT112E, CD74HC112M96, CD74HC112E, CD54HCT112F3A, CD54HC112F3A Datasheet

Data sheet acquired from Harris Semiconductor
/ j
SCHS141
March 1998
CD74HC112,
CD74HCT112
Dual J-K Flip-Flop with Set and Reset
Negative-Edge Trigger
[ /Title (CD74 HC112 , CD74 HCT11
2) Sub­ect
(Dual J-K Flip­Flop with Setand Reset Nega-
Features
• Hysteresis on Clock Inputs for Improved Noise Immunity and Increased Input Rise and Fall Times
• Asynchronous Set and Reset
• Complementary Outputs
• Typical f T
= 25oC
A
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
= 60MHz at VCC = 5V, CL = 15pF,
MAX
= 30%, NIH = 30% of V
IL
o
C to 125oC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
1µA at VOL, V
l
Description
The Harris CD74HC112 and CD74HCT112 utilize silicon­gate CMOS technology to achieve operating speeds equivalent to LSTTL parts. They exhibit the low power consumption of standard CMOS integrated circuits, together with the ability to drive 10 LSTTL loads.
These flip-flops have independent J, K, Set, Reset, and Clock inputs and Q and negative-going transition of the clock pulse. Set and Reset are accomplished asynchronously by low-level inputs.
The 74HCT logic family is functionally as well as pin­compatible with the standard 74LS logic family.
.
Q outputs. They change state on the
Ordering Information
TEMP. RANGE
CC
PART NUMBER
CD74HC112E -55 to 125 16 Ld PDIP E16.3
(oC) PACKAGE
OH
PKG.
NO.
Pinout
CD74HC112, CD74HCT112
(PDIP)
TOP VIEW
16
1
1CP
2
1K
3
1J
4
1S
5
1Q
6
1Q
7
2Q
8
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1998
1
V
CC
15
1R
14
2R
13
2CP 2K
12
2J
11 10
2S
9
2Q
File Number 1843.1
Functional Diagram
CD74HC112, CD74HCT112
4
1S
1K
1CP
1R
2S
2K
2CP
2R
3
1J
2
1
15
10
11
2J
12
13
14
F/F 1
F/F 2
5
1Q
6
1Q
9
2Q
7
2Q
GND = 8 VCC = 16
TRUTH TABLE
INPUTS OUTPUTS
S R CP J K Q Q
LHXXXHL H L H H HH HH
L
L H H
XXXLH X X X H (Note 3) H (Note 3)
L L No Change HL
↓ ↓
LH H H Toggle
H H H X X No Change
NOTE: H = High Level (Steady State) L = Low Level (Steady State) X = Don’t Care
= High-to-Low Transition
3. Output states unpredictable if both S and R go High simultaneously after both being low at the same time.
2
CD74HC112, CD74HCT112
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time, tr, t
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
f
Thermal Resistance (Typical, Note 4) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Maximum Junction Temperature (Hermetic P ac kage or Die) . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
V
IH
V
IL
V
OH
V
OL
I
I
TEST
CONDITIONS
25oC -40oC TO 85oC -55oC TO 125oC
VCC (V)
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
VIH or
V
-0.02 2 1.9 - - 1.9 - 1.9 - V
IL
4.5 4.4 - - 4.4 - 4.4 - V 6 5.9 - - 5.9 - 5.9 - V
---------V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
VIH or
V
0.02 2 - - 0.1 - 0.1 - 0.1 V
IL
4.5 - - 0.1 - 0.1 - 0.1 V 6 - - 0.1 - 0.1 - 0.1 V
---------V
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
VCC or
-6--±0.1 - ±1-±1 µA
GND
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
3
CD74HC112, CD74HCT112
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
Quiescent Device Current
HCT TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
Quiescent Device Current
Additional Quiescent Device Current Per Input Pin: 1 Unit Load
NOTE:
5. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
I
CC
V
V
V
V
I
CC
I
IH
IL
OH
OL
I
I
CC
VCC or
GND
- - 4.5 to
- - 4.5 to
VIH or
V
IL
-0.02 4.5 3.98 - - 3.84 - 3.7 - V
VIH or
V
IL
V
CC
and
GND
VCC or
GND
V
CC
- 2.1
VCC (V)
0 6 - - 4 - 40 - 80 µA
5.5
5.5
- 4.5 4.4 - - 4.4 - 4.4 - V
-4 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.26 - 0.33 - 0.4 V
4 5.5 - ±0.1 - ±1-±1 µA
0 5.5 - - 4 - 40 - 80 µA
- 4.5 to
5.5
25oC -40oC TO 85oC -55oC TO 125oC
2-- 2 - 2 - V
- - 0.8 - 0.8 - 0.8 V
- 100 360 - 450 - 490 µA
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HCT Input Loading Table
INPUT UNIT LOADS
1S, 2S 0.5 1K, 2K 0.6 1R, 2R 0.65
1J, 2J, 1CP, 2CP 1
NOTE: Unit Load is ICClimit specified in DC Electrical Specifica­tions table, e.g., 360µA max at 25oC.
Prerequisite For Switching Specifications
TEST
PARAMETER SYMBOL
HC TYPES
Pulse Width CP t
W
CONDITIONS
- 2 80 - - 100 - 120 - ns
V
CC
(V)
4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
4
CD74HC112, CD74HCT112
Prerequisite For Switching Specifications (Continued)
TEST
PARAMETER SYMBOL
Pulse Width R, St
Setup Time J, K, to CP t
SU
Hold Time J, K, to CP t
Removal Time R to CP, S to CP t
CP Frequency f
REM
MAX
W
H
CONDITIONS
- 2 80 - - 100 - 120 - ns
- 2 80 - - 100 - 120 - ns
-20--0-0-ns
- 2 80 - - 100 - 120 - ns
- 2 6 - - 5 - 4 - MHz
HCT TYPES
Pulse Width CP t Pulse Width R, St Setup Time J, K, to CP t Hold Time J, K, to CP t Removal Time R to CP, S to CP t CP Frequency f
SU
W
H
REM
W
MAX
- 4.5 16 - - 20 - 24 - ns
- 4.5 18 - - 23 - 27 - ns
- 4.5 16 - - 20 - 24 - ns
- 4.5 3 - - 3 - 3 - ns
- 4.5 20 - - 25 - 30 - ns
- 4.5 30 - - 25 - 20 - MHz
V
CC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns
4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns
4.5 0 - - 0 - 0 - ns 60--0-0-ns
4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns
4.5 30 - - 25 - 20 - MHz 6 35 - - 29 - 23 - MHz
Switching Specifications Input t
PARAMETER SYMBOL
HC TYPES
Propagation Delay, CP to Q, Q
Propagation Delay, S to Q, Q
Propagation Delay, R to Q, Q
t
PLH
t
PLH
t
PLH
, tf = 6ns
r
25oC -40oC TO 85oC -55oC TO 125oC
, t
PHLCL
TEST
CONDITIONS
V
CC
(V)
= 50pF 2 - - 175 - 220 - 265 ns CL= 50pF 4.5 - - 35 - 44 - 53 ns CL= 15pF 5 - 14 - ----ns CL= 50pF 6 - - 30 - 37 - 45 ns
, t
PHLCL
= 50pF 2 - - 155 - 195 - 235 ns CL= 50pF 4.5 - - 31 - 39 - 47 ns CL= 15pF 5 - 13 - ----ns CL= 50pF 6 - - 26 - 33 - 40 ns
, t
PHLCL
= 50pF 2 - - 180 - 225 - 270 ns CL= 50pF 4.5 - - 36 - 45 - 54 ns CL= 15pF 5 - 15 - ----ns CL= 50pF 6 - - 31 - 38 - 46 ns
UNITSMIN TYP MAX MIN MAX MIN MAX
5
CD74HC112, CD74HCT112
Switching Specifications Input t
PARAMETER SYMBOL
Output Transition Time t
, tf = 6ns (Continued)
r
CONDITIONS
TLH
, t
THLCL
= 50pF 2 - - 75 - 95 - 110 ns
TEST
V
CC
(V)
CL= 50pF 4.5 - - 15 - 19 - 22 ns CL= 50pF 6 - - 13 - 16 - 19 ns
Input Capacitance C CP Frequency f Power Dissipation Capacitance
MAX
C
I
PD
- - - - 10 - 10 - 10 pF
CL = 15pF 5 - 60 - ----MHz
- 5-12-----pF
(Notes 6, 7)
HCT TYPES
Propagation Delay, CP to Q, Q
Propagation Delay, S to Q, Q
Propagation Delay, R to Q, Q
Output Transition Time t Input Capacitance C CP Frequency f Power Dissipation Capacitance
t
PLH
t
PLH
t
PLH
TLH
, t
, t
, t
, t
MAX
C
PD
I
PHLCL
= 50pF 4.5 - - 35 - 44 - 53 ns CL = 15pF 5 - 14 - ----ns
PHLCL
= 50pF 4.5 - - 32 - 40 - 48 ns CL = 15pF 5 - 13 - ----ns
PHLCL
= 50pF 4.5 - - 37 - 46 - 56 ns CL = 15pF 5 - 14 - ----ns
THLCL
= 50pF 4.5 - - 15 - 19 - 22 ns
- - - - 10 - 10 - 10 pF
CL = 15pF 5 - 60 - ----MHz
- 5-20-----pF
(Notes 6, 7)
NOTES:
6. CPD is used to determine the dynamic power consumption, per flip-flop.
7. PD = CPD V
2
fi + Σ CLfowhere fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage.
CC
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
Test Circuits and Waveforms
trC
L
CLOCK
10%
90%
50% 10%
tfC
t
L
WL
tWL+ tWH=
50%
t
WH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For f
, input duty cycle = 50%.
MAX
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
f
CL
50%
I
V
CC
GND
1.3V
I
fC
L
3V
GND
trCL= 6ns
CLOCK
0.3V
2.7V
1.3V
0.3V
t
t
fCL
WL
= 6ns
1.3V
t
WH
t
WL
+ tWH=
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For f
, input duty cycle = 50%.
MAX
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
6
CD74HC112, CD74HCT112
Test Circuits and Waveforms
(Continued)
tr = 6ns tf = 6ns
V
t
CC
GND
TLH
INPUT
t
90% 50% 10%
THL
90%
t
50%
10%
PLH
INVERTING
OUTPUT
t
PHL
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
tfC
L
V
50%
GND
t
H(L)
V 50%
t
SU(L)
GND
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
trC
L
90%
10%
t
H(H)
CC
CC
= 6ns
tr = 6ns
INPUT
t
2.7V
1.3V
0.3V
THL
t
f
3V
GND
t
TLH
90%
t
PLH
1.3V
10%
INVERTING
OUTPUT
t
PHL
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
trC
L
2.7V
0.3V
t
H(H)
1.3V
1.3V
tfC
L
1.3V
t
H(L)
1.3V
t
SU(L)
3V
GND
3V
GND
OUTPUT
t
REM
V
CC
SET, RESET OR PRESET
50%
90%
t
PLH
IC
t
TLH
t
THL
90%
50%
10% t
PHL
GND
C
L
50pF
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
OUTPUT
t
REM
3V SET, RESET OR PRESET
1.3V
90%
1.3V t
IC
t
PLH
TLH
t
THL
90%
1.3V 10%
t
PHL
GND
C
L
50pF
FIGURE 6. HCT SETUP TIMES,HOLD TIMES, REMOVALTIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
7
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
Loading...