Supermicro X11DSF-E User Manual

X11DSF-E

USER’S MANUAL

Revision 1.0a

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes no

!

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the information in this manual, or to notify any person or organization of the updates. Please Note: For the most up-to-date

version of this manual, please see our website at www.supermicro.com.

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to www.P65Warnings.ca.gov.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment, nuclear
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Manual Revision 1.0a

Release Date: Sep 3, 2018

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document.

Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks

or registered trademarks of their respective companies or mark holders.

Copyright © 2018 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11DSF-E motherboard.

About This Motherboard

The X11DSF-E motherboard supports dual Intel® Xeon 81xx/61xx/51xx/41xx/31xx series
processors (Socket P) with a TDP (Thermal Design Power) of up to 205W, and three UltraPath
Interconnect (UPI) of up to 10.4 GT/s (Note below). With the Intel C627 PCH built-in, this
motherboard supports up to 3TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM/NV-DIMM
DDR4 ECC 2666/2400/2133 MHz memory in 24 memory slots, and comes equipped with
six SATA 3.0 ports, thirty-two possible NVMe slots (32x NVMe from PCI-E switch + 4x M.2
from PCH), and M.3 support. The cutting-edge X11DSF-E offers highly versatile SATA and

NVMe options, with an array of exible PCI-E solutions. This motherboard is optimized for

storage-intensive systems, high-perfomance platforms, and demanding workloads. Please
note that this motherboard is intended to be installed and serviced by professional technicians
only. For processor/memory updates, please refer to our website at http://www.supermicro.
com/products/.

Note: UPI/memory speeds are dependent on the processors installed in your system.

Manual Organization

Chapter 1 describes the features, specications and performance of the motherboard, and

provides detailed information on the Intel C627 chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when installing the
processor, memory modules, and other hardware components into the system.

If you encounter any problems, see Chapter 3, which describes troubleshooting procedures
for video, memory, and system setup stored in the CMOS.

Chapter 4 includes an introduction to the BIOS, and provides detailed information on running
the CMOS Setup utility.

Appendix A provides BIOS Error Beep Codes.

Appendix B lists software program installation instructions.

Appendix C lists standardized warning statements in various languages.

Appendix D provides UEFI BIOS Recovery instructions.

3

Super X11DSF User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.2 Processor and Chipset Overview .......................................................................................17

1.3 Special Features ................................................................................................................17

1.4 System Health Monitoring ..................................................................................................18

1.5 ACPI Features ....................................................................................................................19

1.6 Power Supply .....................................................................................................................19

1.7 Super I/O ............................................................................................................................19

1.8 Advanced Power Management ..........................................................................................20

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................21

2.2 Motherboard Installation .....................................................................................................22

2.3 Processor and Heatsink Installation ...................................................................................24

2.4 Memory Support and Installation .......................................................................................32

2.5 Rear I/O Ports ....................................................................................................................37

2.6 Front Control Panel ............................................................................................................42

2.7 Connectors .........................................................................................................................47

2.8 Jumper Settings .................................................................................................................54

2.9 LED Indicators ....................................................................................................................60

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................63

3.2 Technical Support Procedures ...........................................................................................67

3.3 Frequently Asked Questions ..............................................................................................68

3.4 Battery Removal and Installation .......................................................................................69

3.5 Returning Merchandise for Service ....................................................................................70

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................71

4.2 Main Setup .........................................................................................................................72

4.3 Advanced Setup Congurations .........................................................................................74

4.4 Event Logs ........................................................................................................................107

4.5 IPMI ...................................................................................................................................109

4.7 Boot .................................................................................................................................115

4.8 Save & Exit .......................................................................................................................117

5

Super X11DSF User's Manual

Appendix A BIOS Codes

A.1 BIOS Error POST (Beep) Codes .....................................................................................119

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................121

B.2 SuperDoctor® 5 .................................................................................................................122

Appendix C Standardized Warning Statements

Appendix D UEFI BIOS Recovery

D.1 Overview ...........................................................................................................................126

D.2 Recovering the UEFI BIOS Image ...................................................................................126

D.3 Recovering the Main BIOS Block with a USB Device .....................................................127

6

Chapter 1: Introduction

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.

1.1 Checklist

This motherboard was designed to be used in an SMCI-proprietary chassis only as a part of
an integrated, complete system solution. It is not to be sold as an independent, stand-alone
product; therefore, no shipping package will be included in the shipment.

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: http://www.supermicro.com/wftp

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

7

Super X11DSF-E User's Manual

Figure 1-1. X11DSF-E Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision avail-

able at the time of publication of the manual. The components in the motherboard you
received may or may not look exactly the same as the graphics shown in this manual.

8

Figure 1-2. X11DSF-E Motherboard Layout

SAN MAC

MAC CODE

X11DSF-E
REV:1.00

DESIGNED IN USA

BAR CODE

BIOS LICENSE

IPMI CODE

B37 B1

CPU2 PCI-E 3.0 X32

USB7(3.0)

CN4

CN5

CN6

CN2

U1

CPU1

U1

CPU2

JPWR1

JPWR2

FAN8FAN7

FAN5 FAN4FAN3

FAN2FAN1

FAN6

JUIDB2

JBT1

LED1

LEDM1

CN1

CN3

JUSB3

JSDCARD1

JTPM1

JL1

SXB1A

PSU1

PSU2

JF1

JPL1

JPG1

JPB1

JPME2

JWD1

JPQAT

JSD1

JSD2

JUSBA1

JGPW4

JGPW3

JGPW2

JGPW1

JIPMILAN

JLAN1JLAN2

JRK1

JUSB1

JVGA1

JCOM1

JSW0

JSW1

LED6

BT1

JS1

JP5

LED3

LED2

CPU1 PCI-E 3.0 X32

(3.0)

CPU2 SXB1C

CPU1 SXB1B

PCI-E 3.0 X4PCH SLOT2

P1-DIMMF1 P1-DIMMF2 P1-DIMME2P1-DIMME1 P1-DIMMD1 P1-DIMMD2

P1-DIMMA2 P1-DIMMA1 P1-DIMMB1P1-DIMMB2 P1-DIMMC2 P1-DIMMC1

P2-DIMMF1 P2-DIMME1P2-DIMMF2 P2-DIMME2 P2-DIMMD1 P2-DIMMD2

P2-DIMMA2 P2-DIMMB2P2-DIMMA1 P2-DIMMB1

PCH SLOT3 PCI-E 3.0 X4

USB2/3

USB4/5

USB0/1(2.0)

S-SATA0

S-SATA1

I-SATA 0~7

P2-DIMMC2 P2-DIMMC1

PCI-E 3.0 X16

PCI-E 3.0 X16

(not drawn to scale)

Chapter 1: Introduction

Note: Components not documented are for internal testing only.

9

Super X11DSF-E User's Manual

SAN MAC

MAC CODE

X11DSF-E
REV:1.00

DESIGNED IN USA

BAR CODE

BIOS LICENSE

IPMI CODE

B37 B1

CPU2 PCI-E 3.0 X32

USB7(3.0)

CN4

CN5

CN6

CN2

U1

CPU1

U1

CPU2

JPWR1

JPWR2

FAN8FAN7

FAN5 FAN4FAN3

FAN2FAN1

FAN6

JUIDB2

JBT1

LED1

LEDM1

CN1

CN3

JUSB3

JSDCARD1

JTPM1

JL1

SXB1A

PSU1

PSU2

JF1

JPL1

JPG1

JPB1

JPME2

JWD1

JPQAT

JSD1

JSD2

JUSBA1

JGPW4

JGPW3

JGPW2

JGPW1

JIPMILAN

JLAN1JLAN2

JRK1

JUSB1

JVGA1

JCOM1

JSW0

JSW1

LED6

BT1

JS1

JP5

LED3

LED2

CPU1 PCI-E 3.0 X32

(3.0)

CPU2 SXB1C

CPU1 SXB1B

PCI-E 3.0 X4PCH SLOT2

P1-DIMMF1 P1-DIMMF2 P1-DIMME2P1-DIMME1 P1-DIMMD1 P1-DIMMD2

P1-DIMMA2 P1-DIMMA1 P1-DIMMB1P1-DIMMB2 P1-DIMMC2 P1-DIMMC1

P2-DIMMF1 P2-DIMME1P2-DIMMF2 P2-DIMME2 P2-DIMMD1 P2-DIMMD2

P2-DIMMA2 P2-DIMMB2P2-DIMMA1 P2-DIMMB1

PCH SLOT3 PCI-E 3.0 X4

USB2/3

USB4/5

USB0/1(2.0)

S-SATA0

S-SATA1

I-SATA 0~7

P2-DIMMC2 P2-DIMMC1

PCI-E 3.0 X16

PCI-E 3.0 X16

Quick Reference

PCI-E 3.0 x32

SXB1C

SXB1A

LEDM1

JSDCARD1

SXB1B

JPQAT

JPWR1

JBT1

LED3

LED2

SP1

JPB1

JCOM1

VGA

JUSB1

LAN2 LAN1

IPMI_LAN

JUIDB2

LED1

JPG1

JPL1

JP5

JWD1

JPME2

JS1

USB5/6

S-SATA4

S-SATA5

JSW0

PCI-E 3.0 x32

JRK1

LED6

JTPM1

JUSBA1

JSD2

BT1

JSD1

PSU2

PSU1

JPWR2

JGPW1

JUSB3

JF1

FAN6

FAN5

JGPW3

FAN4

FAN3

JL1

JGPW2

FAN1

FAN2

Notes:

JGPW4

FAN7

FAN8

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connections.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do not install the onboard

battery upside down to avoid possible explosion.

• For your system to work properly, please use add-on cards or devices that are compatible with the PCI-standard

on the PCI-E slots.

10

Chapter 1: Introduction

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPB1 BMC Enable/Disable Pins 1-2 (Enabled)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JPQAT1 QAT Enable/Disable Pins 2-3 (Disabled)

when JPQAT1 is Enabled:

JPQAT2 QAT Enable/Disable

JPL1 GLAN Enable/Disable Pins 1-2 (Enabled)

JP5 Hold power button before BMC ready

JPME2 Manufacturing Mode Pins 1-2 (Normal)

JWD1 Watch Dog Timer Enable Pins 1-2 (Reset)

LED Description Status

LED1 UID LED Solid Blue: Unit Identied

LED6 CPLD Heartbeat LED Blinking Green: Normal

LEDM1 BMC Heartbeat LED Blinking Green: Normal

Pins 1-2 x16 Uplink

Pins 2-3 x8 Uplink (Disabled)

Pins 1-2 (Enabled)

Pins 2-3 (Disabled)

Connector Description

BT1 Onboard CMOS battery

FAN1 ~ FAN8 System/CPU fan headers (FAN1: CPU Fan)

JCOM1 COM port

JIPMILAN IPMI-Dedicated LAN port

JS1 (I-SATA0 ~I-SATA7) SATA 3.0 ports supported by Intel PCH

JF1 Front Control Panel header

JGPW1 - JGPW4 Power connectors used for GPU and VGA devices

JIPMB1 System Management Bus header for IPMI 2.0

JL1 Chassis intrusion header

JRK1 Intel RAID key header for NVMe Solid State Devices (SSD)

JSDCARD1 SD card socket

JSD1 - JSD2 SATA Disk-on-module (DOM) power connectors

JSW0/JSW1 Switch 1/2 I²C

JTPM1 TPM/PORT80 Trusted Platform Module/Port 80 connector

JUIDB2 Unit Identier (UID) switch

JUSB3 USB4/5 (3.0) Internal USB header for two USB 3.0 connections (USB4/5)

JUSB1 USB2/3 (3.0) USB 3.0 rear port (USB2/3)

USB0/1 USB 2.0 header

JUSBA1 Type A USB 3.0 header

PSU1 Power Supply Unit 1

11

Super X11DSF-E User's Manual

Connector Description

PSU2 Power Supply Unit 2

S-SATA0/S-SATA1 (Powered) SATA connectors with power-pins built-in with support of SuperDOMs

SXB1A WIO Left Riser slot (see note below)

SXB1B WIO Right Riser slot (see note below)

SXB1C Ultra Riser slot (see note below)

CN1-CN6

JLAN1/JLAN2 10G LAN ports 1 and 2

JVGA1 VGA port

PCI-E x32 Tray Cable connector interface (GPU, NVMe, M.3, or Ruler down device) (see note

below)

Note: To avoid interference with other components, please be sure to use an add-on
card that is fully compliant with the PCI Standards on a PCI slot.

12

Chapter 1: Introduction

Motherboard Features

Motherboard Features

CPU

• Dual Intel 81xx/61xx/51xx/41xx/31xx series processors (Socket P); each processor supports Socket P and 3 Intel UltraPath

Interconnect (UPI) of up to 10.4 G/s

Note: Both CPUs need to be installed for full access to the PCI-E slots, DIMM slots, and onboard controllers. Refer

to the block diagram on page 18 to determine which slots or devices may be affected.

Memory

• The X11DSF supports up to 3TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM/NV-DIMM DDR4 ECC 2666/2400/2133

MHz memory in 24 memory slots.

DIMM Size

• Up to 128GB at 1.2V

Note 1: Memory speed support depends on the processors used in the system.

Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel® C627

Expansion Slots

• 2 PCI-E x32 Tray cable connector interface (GPU, NVMe, M.3 or Ruler down device support)

• 1 PCI-E 3.0 (x16 + x16 or x16 + QAT) left riser card support

• 1 PCI-E 3.0 x4 and 1 PCI-E x4 from PCH

Network

• Dual 10GBase-T Ethernet ports with Intel X550

BaseBoard Management Controller (BMC)

• ASpeed AST 2500 Baseboard Management Controller (BMC) supports IPMI 2.0

• One (1) dedicated IPMI LAN located on the rear IO backpanel

Graphics

• Graphics controller via ASpeed AST2500

I/O Devices

• Serial (COM) Port • One (1) serial-port header

• Total of 10 SATA 3 ports:

• SATA 3.0

• Eight (8) SATA 3.0 (JS1)

• Two (2) SATA 3.0 SuperDOM connectors (S-SATA0, S-SATA1)

Note: The table above is continued on the next page.

13

Super X11DSF-E User's Manual

Motherboard Features

Peripheral Devices

• Two (2) USB 3.0 ports on the rear I/O panel (USB 3/4)

• One (1) internal USB 2.0 header with (2) USB connections for front access (USB0/1)

• One (1) internal USB header supports two USB 3.0 connections (USB5/USB6)

BIOS

• 256 Mb SPI AMI BIOS

• ACPI 3.0 or later, PCI F/W 3.0, SMBIOS 2.7 or later

Power Management

• ACPI power management (S4, S5)

• Power-on mode for AC power recovery

• Power button override mechanism

System Health Monitoring

• Onboard voltage monitoring for +1.8V, +3.3V, +5V, +/-12V, +3.3V Stdby, +12V Stdby, VBAT, HT, Memory, PCH Temp,

System Temp, Memory Temp

• 5 CPU (# of switching-phase voltage regulator)

• CPU/system overheat LED and control

• CPU Thermal Trip support

• PECI / TSI

• CPU Thermal Design Power (TDP) support of up to 205W

®

SM Flash UEFI BIOS

Fan Control

• Eight 4-pin fan headers

• Fan speed control

System Management

• Trusted Platform Module (TPM) support

• Watch Dog / Non-maskable interrupt

• RoHS

• BMC SD Card Slot

• Chassis intrusion header and detection (JL1)

14

Motherboard Features

LED Indicators

• CPU/Overheating

• Power/Suspend-state indicator

• Fan Failure

• UID/Remote UID

• HDD Activity

• LAN Activity

Dimensions

• 15.59" (L) x 16.73" (W) (395.98 mm x 424.94 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Chapter 1: Introduction

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con­guration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon initial
system power-on. The manufacture default username is ADMIN and the password is

ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/
products/info/les/IPMI/Best_Practices_BMC_Security.pdf

15

Super X11DSF-E User's Manual

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

DDR4 DIM

Figure 1-3.

System Block Diagram

LAN1

LAN2

NCSI

MUX

M

VGA LAN

SPI

MUX

SPI

PE[5]

UPLINK

#1

#2

H

M

VGA

32MB
BMC

SPI
FLASH

64MB

SPI

BIOS

FLASH

WIO

Intel X550

x16 x16

x16

PCI-E

X32

x16

CABLE

X4

PE1 PE2 UPI0PE3 UPI1

DMI

UPI2

CPU 1

SocketID 01

#1

#2

M

M

#2

#2

M

K

L

M

#1

#1

TPM
Header

Upper Lower

PCI-E

x16

UPI

#1

#2

G

PCH

J

BMC

AST2500

HWM

USB2.0
[5-10, 12-13]
USB3.0
[1-4,6]

#1

#2

DDR4

UART

LPC/eSPIPE

USBSPI

USB2.0 [7]

LPC/eSPI

PE[0..3]

PE[6..9]

Uplink X8
/iSATA[0-7]

sSATA [4, 5]

DMI

10.4G/11.2G T/s

Polarity Inversion

M

DDR4

SLOT2

SLOT3

JS1

I-SATA0~7

S-SATA5

S-SATA4

#1

M

TYPE-A

E

IPMI LAN
RJ45

port 1-2, 5-6port 7

FRONT

#1

#2

M

FRONT

D

PE1 PE2 PE3

HSSIHSSI

DMI

CPU 0

SocketID 00

x16

PCI-E

X32

x16

CABLE

UPI2

UPI1

UPI

UPI0

#1

#2

A

B

M

#1

#1

#2

#2#2

M

M

C

PHY
RTL8211F

COM1

port 3-4

REAR

#1

#2

M

F

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

16

Chapter 1: Introduction

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel Xeon 81xx/61xx/51xx/41xx/31xx series
processors (Socket P) and the Intel C627 chipset, the X11DSF-E motherboard provides
superb system performance, scalable storage solutions, and a rich feature set based on
cutting edge technology to address the needs of next-generation computer users. With the
support of three Intel® UltraPath Interconnect (UPI) of up to 10.4 G/s, new Intel® AVX-512
instructions, and Intel® QuickAssist Technology, this motherboard offers an innovative solution
with maximum system performance to meet the ongoing demands of High Performance
Computing (HPC) platforms. This motherboard is optimized for HFT servers, big data
environments, and CPU encoding/decoding servers and rendering servers. The Intel Xeon
81xx/61xx/51xx/41xx/31xx series processor and the Intel C627 chipset support the following
features:

• Intel® AVX-512 support with memory bandwidth increase to 6 channels

• High availability interconnect between multiple nodes

• Rich set of available IOs, full exibility in usage model, and software stack

• Dedicated subsystems for customer innovation

• Integrated solution for real-time compression, streaming write & read performance in-

creases from gen-to-gen

• Hot plug and enclosure management with Intel Volume Management Device (Intel VMD)

• Single standard server development (Accelerate NFV transition) consolidating application,

control, and data plane workloads, reducing total platform investment needs

1.3 Special Features

This section describes the health monitoring features of the X11DSF-E motherboard. The
motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

17

Super X11DSF-E User's Manual

1.4 System Health Monitoring

This section describes the health monitoring features of the X11DSF-E motherboard. The
motherboard has an onboard ASpeed AST2500 Baseboard Management Controller (BMC)
that supports system health monitoring. Once a voltage becomes unstable, a warning is
given or an error message is sent to the screen. The user can adjust the voltage thresholds

to dene the sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can

adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings

of these voltage levels are all displayed in IPMI.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature of

the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will be

turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

18

Chapter 1: Introduction

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows 2012/2012R2 and 2016 operating systems.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation, especially for processors that have high CPU clock rates.

1.7 Super I/O

The Super I/O (ASpeed AST2500 chip) provides a high-speed, 16550 compatible serial
communication port (UART), which supports serial infrared communication. The UART
includes send/receive FIFO, a programmable baud rate generator, complete modem control
capability, and a processor interrupt system. The UART provides legacy speed with baud
rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or
1 Mb/s, supporting higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

19

Super X11DSF-E User's Manual

1.8 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Intel® Intelligent Power Node Manager (IPNM)

Intel's Intelligent Power Node Manager (IPNM) provides your system with real-time thermal

control and power management for maximum energy efciency. Although IPNM Specication

Version 2.0/3.0 is supported by the BMC (Baseboard Management Controller), your system

must also have IPNM-compatible Management Engine (ME) rmware installed to use this

feature.

Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in
the system.

Management Engine (ME)

The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are different
from those provided by the ME on client platforms.

Intel® QuickAssist Technology

Built upon the architecture of Intel 81xx/61xx/51xx/41xx/31xx processors and the Intel C627
chipset, the X11DSF-E supports Intel® QuickAssist Technology (Intel QAT), which offers

high-prole security and compression acceleration to standard server platforms in a software­dened infrastructure.

By eliminating unneeded roadblocks, Intel QAT accelerates computation-intensive operations;
provides a software-enabled foundation for security, authentication and compression; and

signicantly increases performance and efciency across applications and platforms, including

cryptography, symmetric encryption and authentication, asymmetric encryption, digital
signature, pattern matching, and lossless data compression.

With Intel QuickAssist Technology built in, the X11DSF is optimized for the use and deployment

of integrated accelerators in networking and security applications, and efciently meets the

complex demands of High-Performance Computing (HPC), Virtualization, storage, and big
data platforms.

20

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your
motherboard and your system, it is important to handle them very carefully. The following

measures are generally sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules, or gold contacts.

• When handling chips or modules avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners, and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down as it may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

21

Super X11DSF-E User's Manual

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Phillips Screwdriver (1)

Tools Needed

CN1

JPWR1

CPU1 PCI-E 3.0 X32

CN3

CN2

P1-DIMMF1 P1-DIMMF2 P1-DIMME2P1-DIMME1 P1-DIMMD1P1-DIMMD2

CPU1 SXB1B

CPU2 SXB1C

SXB1A

PCI-E 3.0 X16

PCI-E 3.0 X16

IPMI CODE

MAC CODE

SAN MAC

JCOM1

PCI-E 3.0 X4PCH SLOT2

BAR CODE

Phillips Screws (14)

JVGA1

JPB1

JPG1

JUSB1

LEDM1

USB2/3

JSDCARD1

JBT1

LED3

LED2

X11DSF-E
REV:1.00

DESIGNED IN USA

P1-DIMMA2 P1-DIMMA1 P1-DIMMB1P1-DIMMB2 P1-DIMMC2 P1-DIMMC1

LED6

JPQAT

BIOS LICENSE

JSW1

P2-DIMMF1 P2-DIMME1P2-DIMMF2 P2-DIMME2 P2-DIMMD1 P2-DIMMD2

JLAN1JLAN2

BT1

USB4/5

(3.0)

I-SATA 0~7

JS1

CN4

B37 B1

CN6

CN5

JIPMILAN

PCH SLOT3 PCI-E 3.0 X4

JPL1

JP5

JWD1

JRK1

JPME2

JTPM1

S-SATA1

JUSBA1
USB7(3.0)

JPWR2

CPU2 PCI-E 3.0 X32

Standoffs (14)

Only if Needed

JUIDB2

LED1

S-SATA0

JSD1

JSD2

JSW0

P2-DIMMA2 P2-DIMMB2P2-DIMMA1 P2-DIMMB1

PSU1

P2-DIMMC2 P2-DIMMC1

JGPW1

USB0/1(2.0)

JUSB3

JF1

PSU2

U1

FAN5 FAN4FAN3

FAN6

JGPW3

CPU2

U1

JL1

FAN2FAN1

JGPW2

JGPW4

CPU1

FAN8FAN7

Location of Mounting Holes

Notes: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

22

Chapter 2: Installation

Installing the Motherboard

1. Install the I/O shield into the back of the chassis if needed.

2. Locate the mounting holes on the motherboard. See the previous page for the location.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed in this manual are for illustration only. Your chassis or com­ponents might look different from those shown in this manual.

23

Super X11DSF-E User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

• Always connect the power cord last and always remove it before adding, removing, or

changing any hardware components. Please note that the processor and heatsink should

be assembled together rst to form the Processor Heatsink Module (PHM), and then install

the entire PHM into the CPU socket.

• When you receive a motherboard without a processor pre-installed, make sure that the

plastic CPU socket cap is in place and that none of the socket pins are bent. Otherwise,
please contact your retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

• Please follow the instructions given in the ESD Warning section on the rst page of this

chapter before handling, installing, or removing system components.

The 81xx/61xx/51xx/41xx/31xx Series Processor

Note: The Intel 81xx/61xx/51xx/41xx/31xx processors contain two models-the F model

processors and the Non-F model processors. This motherboard support Non-F pro­cessors only.

81xx/61xx/51xx/41xx/31xx Processor

Note: All graphics, drawings, and pictures shown in this manual are for illustration only.

The components that came with your machine may or may not look exactly the same
as those shown in this manual.

24

Chapter 2: Installation

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) the Intel 81xx/61xx/51xx/41xx/31xx Processor,

2) the narrow processor clip, 3) the dust cover, and 4) the CPU socket.

1. The 81xx/61xx/51xx/41xx/31xx Processor

81xx/61xx/51xx/41xx/31xx Processor

2. Narrow processor clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-

stalled.

25

Super X11DSF-E User's Manual

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a narrow processor clip,
and 3) 81xx/61xx/51xx/41xx/31xx processor.

1. Heatsink

2. Narrow processor clip

3. The 81xx/61xx/51xx/41xx/31xx Processor

Processor Heatsink Module (PHM)

(Bottom View)

26

Chapter 2: Installation

A

Allow Notch C to

Attaching the Processor to the Narrow Processor Clip to Create
the Processor Package Assembly

To properly install the CPU into the narrow processor clip, please follow the steps below.

1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of
the narrow processor clip. Once they are aligned, carefully insert the CPU into the
processor clip by sliding notch B of the CPU into notch B of the processor clip, and
sliding notch C of the CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the
CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD
gloves when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch B of the CPU
and Notch B of the Processor Clip

Align CPU Pin 1

C

Align Notch C of the CPU
and Notch C of the Processor Clip

B

A

Pin 1

C

B

CPU/Heatsink Package
(Upside Down)

latch on to CPU

C

A

B

Allow Notch B to
latch on to CPU

Processor Package Carrier (w/CPU mounted

on the Processor Clip)

27

Super X11DSF-E User's Manual

Attaching the Processor Package Assembly to the Heatsink to
Form the Processor Heatsink Module (PHM)

After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).

1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.

With your index nger pressing against the screw at this triangular corner, carefully hold

and turn the heatsink upside down with the thermal-grease side facing up. Remove the

protective thermal lm if present, and apply the proper amount of thermal grease as

needed. (Skip this step if you have a new heatsink because the thermal grease is pre­applied in the factory.)

2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of
the processor carrier assembly ("a" in the graphic). Note the larger hole and plastic
mounting clicks located next to the hollow triangle. Locate another set of mounting clicks
and a larger hole at the diagonal
corner of the same (reverse) side of
the processor carrier assembly ("b"
in the graphic).

3. With the back of the heatsink and
the reverse side of the processor
package assembly facing up, align
the triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
package assembly.

4. Align the triangular corner ("B") at
the diagonal side of the heatsink
with the corresponding clips on the
processor package assembly ("b").

Triangle on the CPU

Triangle on the
Processor Clip

Non-Fabric CPU and Processor Clip

(Upside Down)

b

d

B

a

D

Heatsink

(Upside Down)

A

On Locations of (C, D), the notches

snap onto the heat sink’s

B

c

C

mounting holes

5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of the heatsink, securely attach the
heatsink to the processor package
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the Processor /
Heatsink Module (PHM).

28

D

A

On Locations (A, B), the notches
snap onto the heatsink’s sides

C

Make sure Mounting

Notches snap into place

Chapter 2: Installation

Preparing the CPU Socket for Installation

This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket
contains 1) a dust cover, 2) a socket bracket, 3) the CPU (P0) socket, and 4) a back plate.
These components are pre-installed on the motherboard before shipping.

CPU Socket w/Dust Cover On

Removing the Dust Cover from the CPU Socket

Remove the dust cover from the CPU socket, exposing the CPU socket and socket pins as
shown on the illustration below.

Note: Do not touch the socket pins to avoid damaging them, causing the CPU to
malfunction.

Dusk Cover

Remove the dust cover from

the CPU socket. Do not

touch the socket pins!

Socket Pins

CPU Socket

29

Super X11DSF-E User's Manual

Installing the Processor Heatsink Module (PHM)

1. Once you have assembled the Processor Heatsink Module (PHM) by following the
instructions listed on page 29, you are ready to install the module into the CPU socket
on the motherboard. To install the PHM into the CPU socket, follow the instructions
below.

2. Locate the triangle (pin 1) on the CPU socket, and locate the triangle (pin 1) at the

corner of the PHM that is closest to "1." (If you have difculty locating pin 1 of the PHM,

turn the PHM upside down. With the LGA-lands side facing up, you will note the hollow
triangle located next to a screw at the corner. Turn the PHM right side up, and you will
see a triangle marked on the processor clip at the same corner of hollow triangle.)

3. Carefully align pin 1 (the triangle) on the the PHM against pin 1 (the triangle) on the
CPU socket.

4. Once they are properly aligned, insert the two diagonal oval holes on the heatsink into
the guiding posts.

5. Using a T30 Torx-bit screwdriver, install four screws into the mounting holes on the
socket to securely attach the PHM onto the motherboard starting with the screw marked

"1" (in the sequence of 1, 2, 3, and 4).

Note: To avoid damaging the LGA-lands and the processor, do not use excessive
force when tightening the screws.

Oval C

Use a torque

Oval D

Large Guiding Post

T30 Torx Driver

of 12 lbf

#4

#1

#2

Small Guiding Post

Printed Triangle

Mounting the Processor Heatsink Module

into the CPU socket (on the motherboard)

#3

Tighten the screws in the

sequence of 1, 2, 3, 4 (top 3 quarter view)

30